Power supply circuit and electronic device comprising same

Abstract

In embodiments, an electronic device is provided. The electronic device may comprise: a processor including a processing circuit; a radio frequency (RF) transceiver; a first radio frequency front end (RFFE) circuit including a first power amplifier; a second RFFE circuit including a second power amplifier; a battery for providing a battery voltage; and a power supply circuit including a boost converter circuit, which is connected to the battery and configured to provide a boost voltage on the basis of the battery voltage, a first buck converter circuit, which is connected to the battery and the boost converter circuit, and a second buck converter circuit, which is connected to the battery and the boost converter circuit. The power supply circuit may be configured to output a first supply voltage through the first buck converter circuit on the basis of the battery voltage or the boost voltage, and output a second supply voltage through the second buck converter circuit on the basis of the battery voltage or the boost voltage, under the control of the processor.

Description

Power supply circuit and electronic device including same

[0001] The descriptions below relate to a power supply circuit and an electronic device including the power supply circuit.

[0002] An electronic device may include a radio frequency front end (RFFE) circuit for transmitting or receiving a signal. For example, the RFFE circuit may include a power amplifier (PA) for transmitting power of a signal to be transmitted through an antenna connected to the RFFE module. The electronic device may include a power supply circuit for providing a supply voltage to the PA.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0004] In embodiments of the present disclosure, an electronic device is provided. The electronic device may include a processor including a processing circuit; a radio frequency (RF) transceiver; a first radio frequency front end (RFFE) circuit including a first power amplifier; a second RFFE circuit including a second power amplifier; a battery providing a battery voltage; a boost converter circuit connected to the battery and configured to provide a boost voltage based on the battery voltage, a first buck converter circuit connected to the battery and connected to the boost converter circuit, and a second buck converter circuit connected to the battery and connected to the boost converter circuit. The power supply circuit may be configured to output a first supply voltage based on the battery voltage or the boost voltage through the first buck converter circuit under the control of the processor, and to output a second supply voltage based on the battery voltage or the boost voltage through the second buck converter circuit. The first supply voltage output through the first buck converter circuit can be provided to the first power amplifier while a first signal is transmitted through the first power amplifier. The second supply voltage output through the second buck converter circuit can be provided to the second power amplifier while a second signal is transmitted through the second power amplifier.

[0005] In embodiments of the present disclosure, a power supply circuit is provided. The power supply circuit may include a boost converter circuit; a first buck converter circuit connected to the boost converter circuit; and a second buck converter circuit connected to the boost converter circuit. The boost converter circuit may be configured to provide a boost voltage based on a battery voltage. The first buck converter circuit may be configured to output a first supply voltage for a first power amplifier based on the battery voltage or the boost voltage of the boost converter circuit. The second buck converter circuit may be configured to output a second supply voltage for a second power amplifier based on the battery voltage or the boost voltage of the boost converter circuit.

[0006] Figure 1 is a block diagram of an electronic device within a network environment.

[0007] Figure 2 illustrates an example of an electronic device including a power supply circuit.

[0008] Figure 3 shows an example of a power supply circuit.

[0009] Figure 4 shows an example of power supply using a power supply circuit.

[0010] Figure 5 shows an example of a boost converter circuit, a first buck converter circuit, and a second buck converter circuit in a power supply circuit.

[0011] Figure 6 shows an example of a boost converter circuit, a first buck converter circuit, and a second buck converter circuit in a power supply circuit.

[0012] FIG. 7 illustrates an example of an electronic device including a power supply circuit and a plurality of radio frequency front end (RFFE) modules.

[0013] The terms used in this disclosure are used only to describe specific embodiments and may not be intended to limit the scope of other embodiments. The singular expression may include plural expressions unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by those of ordinary skill in the art described in this disclosure. Terms defined in general dictionaries among the terms used in this disclosure may be interpreted as having the same or similar meaning in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined in this disclosure. In some cases, even if a term is defined in this disclosure, it cannot be interpreted to exclude embodiments of the present disclosure.

[0014] The various embodiments of the present disclosure described below illustrate a hardware-based approach as an example. However, since the various embodiments of the present disclosure include techniques utilizing both hardware and software, the various embodiments of the present disclosure do not exclude a software-based approach.

[0015] Terms referring to parts of electronic devices used in the following description (e.g., communication module, wireless communication module, substrate, PCB (printed circuit board), FPCB (flexible PCB), module, antenna, antenna element, circuit, processor, chip, component, device), terms referring to RF-related parts (FEM (front end module0), PAM (power amplifier module), FEMid (FEM including duplexer), PAMid (power amplifier module including duplexer), LPAMid (low noise amplifier PAM including duplexer), RFFE (radio frequency front end)), RFIC (radio frequency integrated circuit)), terms referring to the shape of parts (e.g., structure, structure, support, contact, or protrusion), terms referring to connections between structures (e.g., connection, contact, support, contact structure, conductive member, or assembly), terms referring to circuits (e.g., PCB, FPCB, signal line, feeding line, data line, RF signal line, antenna line, signal path, RF path, RF modules, RF circuits, splitters, dividers, couplers, or combiners are examples for convenience of explanation. Therefore, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meanings may be used. In addition, terms such as '... part', '... device', '... object', or '... body' used below may mean at least one shape structure or a unit that processes a function.

[0016] In addition, in the present disclosure, expressions such as "more than" or "less than" may be used to determine whether a specific condition is satisfied or fulfilled, but this is merely a description for expressing an example and does not exclude descriptions such as "more than" or "less than." A condition described as "more than" may be replaced with "more than," a condition described as "less than" may be replaced with "less than," and a condition described as "more than and less than" may be replaced with "more than and less than." In addition, hereinafter, "A" to "B" mean at least one of the elements from A (including A) to B (including B). hereinafter, "C" and / or "D" mean at least one of "C" or "D," that is, including {"C", "D", "C" and "D"}. The meaning of "about E" may be replaced with a value within a margin of error of ±5% or ±10% based on E.

[0017] Although the present disclosure describes various embodiments using terms used in some communication standards (e.g., 3rd Generation Partnership Project (3GPP), European Telecommunications Standards Institute (ETSI), extensible radio access network (xRAN), open-radio access network (O-RAN), etc.), these are merely examples for explanation. The various embodiments of the present disclosure can be easily modified and applied to other communication systems.

[0018] Figure 1 is a block diagram of an electronic device within a network environment.

[0019] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0020] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0021] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0022] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0023] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0024] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0025] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0026] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0027] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0028] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0029] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0030] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0031] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0032] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0033] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0034] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0035] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0036] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimizing terminal power and connecting multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0037] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0038] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0039] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0040] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0041] FIG. 2 illustrates an example of an electronic device (e.g., electronic device (101)) including a power supply circuit.

[0042] Referring to FIG. 2, the electronic device (101) may include a processor (210), an RF transceiver (220), radio frequency front end (RFFE) circuits (240) (e.g., a first RFFE circuit (241) or a second RFFE circuit (242)), a power supply circuit (250) (e.g., a modulator), a battery (280), and antennas (290) (e.g., a first antenna (291) or a second antenna (292)). The electronic device (101) may include the processor (210). The processor (210) may include, for example, at least one of an application processor (AP) (e.g., the main processor (121) of FIG. 1)) or a communication processor (CP) (e.g., the auxiliary processor (123) of FIG. 1). For example, the processor (210) may include an AP and a CP. For example, the processor may include an AP. For example, the processor (210) may include a CP. The processor (210) may control the RF transceiver (220) via a control interface (211) (e.g., a mobile industry processor interface (MIPI) or a serial peripheral interface (SPI)). For example, the processor (210) may generate a baseband signal. The processor (210) may control the RF transceiver (220) to process the generated baseband signal. The processor (210) may transmit a signal (213a) (e.g., analog data or digital data). For example, the signal (213a) may be a communication signal to be transmitted to an external electronic device (e.g., a base station, a satellite, a terminal, an electronic device (102), an electronic device (104), or a server (108)). The processor (210) can control the RF transceiver (220) to transmit the signal through an antenna (e.g., a first antenna (291) or a second antenna (292)).The processor (210) can receive a signal (213b) (e.g., analog data or digital data). For example, the signal (213b) may be a signal received from an external electronic device (e.g., a base station, a satellite, a terminal, an electronic device (102), an electronic device (104), or a server (108)) via an antenna (e.g., a first antenna (291) or a second antenna (292)). As another example, the signal (213b) may include a signal for measuring transmission power (e.g., a feedback signal). The processor (210) can control the RF transceiver (220) to receive the signal (213b). For example, the processor (210) can obtain the feedback signal via a port (e.g., a feedback receive port (FBRX)) of the RF transceiver (220). The processor (210) can control a power supply circuit (250) to provide a supply voltage via a control interface (223) (e.g., MIPI or SPI). For example, the processor (210) can control a first supply voltage (271) (V. cc1 ) can be controlled to output a power supply circuit (250). The processor (210) can control a second supply voltage (272) (V cc2 ) can be controlled to output the power supply circuit (250).

[0043] The electronic device (101) may include an RF transceiver (220). For example, the RF transceiver (220) may be implemented as a single chip (e.g., an RFIC chip) or as part of a single package. The RF transceiver (220) may include a digital to analog converter (DAC) for converting a digital signal to an analog signal. The RF transceiver (220) may include a mixer and an oscillator (e.g., a local oscillator (LO) or a voltage controlled oscillator (VCO)) for up-conversion. The RF transceiver (220) may convert a baseband signal generated by the processor (210) into an RF signal. The RF transceiver (220) can provide an RF signal to at least one of the RFFE circuits (240) (e.g., the first RFFE circuit (241) or the second RFFE circuit (242)). The RF transceiver (220) can include an analog to digital converter (ADC) for converting an analog signal into a digital signal. The RF transceiver (220) can include a mixer and an oscillator for down-conversion. The RF transceiver (220) can convert an RF signal received from an antenna (e.g., at least one of the antennas (290)) into a baseband signal so that the RF signal can be processed by the processor (210). The RF transceiver (220) can include one or more transmit ports. The RF transceiver (220) can include one or more receive ports. In one embodiment, the RF transceiver (220) can control at least a portion of the first RFFE circuit (241) via a control interface (221) (e.g., MIPI or SPI). In one embodiment, the RF transceiver (220) can control at least a portion of the second RFFE circuit (242) via a control interface (222) (e.g., MIPI or SPI).In one embodiment, the RF transceiver (220) can control a power supply circuit (250) to provide a supply voltage via a control interface (224) (e.g., MIPI or SPI).

[0044] The electronic device (101) may include one or more RFFE circuits (240) to support various frequency bands. For example, the electronic device (101) may include a first RFFE circuit (241) and / or a second RFFE circuit (242). Each RFFE circuit may include a power amplifier (PA). For example, the first RFFE circuit (241) may include a first power amplifier (261). For example, the second RFFE circuit (242) may include a second power amplifier (262). Each RFFE circuit may be connected to an antenna for transmitting a signal. For example, the first RFFE circuit (241) may be connected to a first antenna (291). The second RFFE circuit (242) may be connected to a second antenna (292). Although FIG. 2 illustrates an RFFE circuit including a power amplifier for a transmission path, embodiments of the present disclosure are not limited thereto. For example, in addition to the PAMid including the transmit path, the RFFE circuit may also be used as an example of the RFFE circuit, such as an LPAMid further including a component for the receive path, for example, a low noise amplifier (LNA). A module including a power amplifier that receives a supply voltage from a power supply circuit (250) may be understood as the RFFE circuit of the electronic device (101) according to an embodiment of the present disclosure. Also, for example, the RFFE circuit may be understood to include not only one module, but also a power amplifier and a FEMid, depending on the implementation example.

[0045] To power components within an RFFE circuit (e.g., a first RFFE circuit (241) or a second RFFE circuit (242)), the electronic device (101) may include a battery (280), a power supply circuit (250), and a power management integrated circuit (PMIC) (not shown) (e.g., a power management module (188)). The battery (280) may be used to drive the RFFE circuit (e.g., the first RFFE circuit (241) or the second RFFE circuit (242)), the power supply circuit (250), and the PMIC. The battery (280) may provide a battery voltage (285). For example, the battery voltage (285) may be provided to the RFFE circuit (e.g., the first RFFE circuit (241) or the second RFFE circuit (242)). For example, the battery voltage (285) may be provided to the power supply circuit (250). For example, a battery voltage (285) may be provided to the PMIC. In the present disclosure, terms indicating the voltage of the battery (280) (e.g., battery voltage (285)) may be used in addition to battery voltage, such as battery power and / or terms having equivalent technical / functional meanings.

[0046] The electronic device (101) may include a power supply circuit (250). The power supply circuit (250) may be controlled via a processor (210) and / or an RF transceiver (220). The power supply circuit (250) supplies a voltage (hereinafter, supply voltage) (V) to an RFFE circuit (e.g., a first RFFE circuit (241) or a second RFFE circuit (242)). cc ) can be configured to provide a battery voltage (285) (V) supplied from a battery (280). The power supply circuit (250) bat) can generate a supply voltage (e.g., a first supply voltage (271) or a second supply voltage (272)). The power supply circuit (250) can provide a plurality of supply voltages for a plurality of RFFE circuits. The power supply circuit (250) can supply a supply voltage to each RFFE circuit of the plurality of RFFE circuits. For example, the power supply circuit (250) can be a form in which a plurality of modulators are implemented as a single module (or IC). The power supply circuit (250) can be a power supply module configured to provide a plurality of supply voltages. Supplying power to the RFFE circuit can indicate that a supply voltage is applied for the PA of the RFFE circuit. The power supply circuit (250) can output a plurality of supply voltages for the plurality of RFFE circuits. For example, the power supply circuit (250) can output a first supply voltage (271) (V CC1 ) and the second supply voltage (272)(V cc2 ) can be output. For example, the first supply voltage (271) can be provided to at least one of the plurality of RFFE circuits of the electronic device (101). For example, the second supply voltage (272) can be provided to at least one of the plurality of RFFE circuits of the electronic device (101).

[0047] For example, the first RFFE circuit (241) can obtain a first transmission signal (231) from the RF transceiver (220). The first RFFE circuit (241) can amplify the first transmission signal (231) through the first power amplifier (261). For the operation of the first power amplifier (261), a first supply voltage (271) can be applied to the first power amplifier (261). The first transmission signal (231) amplified through the first power amplifier (261) can be transmitted through the first antenna (291). For example, the second RFFE circuit (242) can obtain a second transmission signal (232) from the RF transceiver (220). The second RFFE circuit (242) can amplify the second transmission signal (232) through the second power amplifier (262). A second supply voltage (272) may be applied to the second power amplifier (262) for operation of the second power amplifier (262). A second transmission signal (232) amplified by the second power amplifier (262) may be transmitted through a second antenna (292).

[0048] The current consumed by the power amplifier in the electronic device (101) can have a significant impact on the battery life of the user. With the advancement of communication technology, average power tracking (APT) technology can be used to provide a supply voltage of an appropriate magnitude. APT is a technology for providing a DC voltage of a magnitude according to the communication channel status to the power amplifier. For the supply voltage according to APT, the power supply circuit (250) can be configured to provide power of a specified magnitude to the power amplifier through a DC-DC converter. In addition to APT, terms such as APT mode, APT state, APT operation, APT method, variable DC voltage mode, variable DC power mode, and / or terms having equivalent technical / functional meanings can be used for APT. The power supply circuit (250) can generate a supply voltage by boosting and / or lowering the battery voltage (285). To generate the supply voltage, the power supply circuit (250) can include circuits for DC-DC conversion (e.g., a boost converter circuit or a buck converter circuit). The power supply circuit (250) may be configured to output a supply voltage based on the APT. For example, the power supply circuit (250) may be configured to output a first supply voltage (271) based on the APT. The power supply circuit (250) may generate a first supply voltage (271) according to the APT from a battery voltage (285) from the battery (280). For example, the power supply circuit (250) may be configured to output a second supply voltage (272) based on the APT. The second power supply circuit (252) may generate a second supply voltage (272) according to the APT from a battery voltage (285) from the battery (280).

[0049] As communication technology advances, carrier aggregation (CA) or dual connectivity (DC) technologies (e.g., EN-DC) are being utilized. In order to transmit signals in multiple frequency bands, the electronic device (101) may be required to provide supply voltages to power amplifiers of the RFFE circuit. This is because the power required to reach the base station may vary depending on the channel environment in the frequency band, or different antennas may have different gains and directivities. To provide supply voltages according to APT, a boost converter circuit and a buck converter circuit may be required. For example, a battery voltage (e.g., battery voltage (285)) may be boosted through the boost converter circuit, and the boosted voltage may be regulated to a supply voltage through the buck converter circuit. Let us assume that two boost converter circuits and two buck converter circuits are used to provide multiple supply voltages (e.g., a first supply voltage (271) or a second supply voltage (272)). As two boost converter circuits are arranged in the power supply circuit (250), the size of the power supply circuit (250) may increase. The two boost converter circuits in the power supply circuit (250) may cause an increase in cost. In addition, as the size of the power supply circuit (250) increases, spatial constraints may occur in the mounting of other components in the electronic device (101). Such spatial constraints may cause a deterioration in the communication performance of the electronic device (101) as other components (e.g., a capacitor for the purpose of maintaining a constant APT voltage) may not be sufficiently arranged. In order to solve the above-described problems, the electronic device (101) according to embodiments of the present disclosure may include a power supply circuit having a structure in which a plurality of buck converter circuits are connected to one boost converter circuit (e.g., when there is only one path through which the battery voltage (285) is provided, it may be understood as one boost converter circuit).A power supply circuit according to embodiments of the present disclosure may include one boost converter circuit and a plurality of buck converter circuits in the boost converter circuit.

[0050] A boost converter circuit used to describe embodiments in the present disclosure may include a circuit configured to perform voltage boosting in DC-DC converting. In addition to the boost converter circuit, the boost converter circuit may also use terms such as boost circuit, boost block, boost converter block, step-up converter, step-up circuit, step-up block, and / or terms having equivalent technical / functional meanings thereto. A buck converter circuit used to describe embodiments in the present disclosure may include a circuit configured to perform voltage droping in DC-DC converting. In addition to the buck converter circuit, the buck converter circuit may also use terms such as buck circuit, buck block, buck converter block, step-down converter, step-down circuit, step-down block, large buck converter, and / or terms having equivalent technical / functional meanings thereto.

[0051] Figure 3 illustrates an example of a power supply circuit (e.g., power supply circuit (250)). Like reference numerals may indicate like descriptions.

[0052] Referring to FIG. 3, the power supply circuit (250) can output a plurality of supply voltages (e.g., a first supply voltage (271) or a second supply voltage (272)). For example, the power supply circuit (250) can be a power supply module. The power supply module can include a plurality of output ports. For example, the power supply module can include a first output port (391) and a second output port (392). The first supply voltage (271) can be provided to a power amplifier (e.g., a first power amplifier (261)) through a power path connected to the first output port (391). The second supply voltage (272) can be provided to a power amplifier (e.g., a second power amplifier (262)) through a power path connected to the second output port (392).

[0053] According to one embodiment, the power supply circuit (250) may include a boost converter circuit (330), a first buck converter circuit (351), and a second buck converter circuit (352). The boost converter circuit (330) may provide a boost voltage (385) based on a battery voltage (285). The boost voltage (385) may refer to a voltage output from the boost converter circuit (330). For example, the boost converter circuit (330) may output a voltage higher than the battery voltage (285) by boosting the battery voltage (285). For example, the boost converter circuit (330) may output the battery voltage (285) as is. Unlike the structure illustrated in FIG. 3, let us assume a structure in which only the first buck converter circuit (351) is connected to the boost converter circuit (330). For example, if the first supply voltage (271) to be output through the first buck converter circuit (351) is higher than the battery voltage (285), boosting may be required. For the boosting, the boost converter circuit (330) may boost the battery voltage (285). On the other hand, if the first supply voltage (271) is not higher than the battery voltage (285), boosting may not be necessary. Without boosting, the boost converter circuit (330) may output the battery voltage (285) as is. However, since the power supply circuit (250) according to the embodiments of the present disclosure has a structure in which the first buck converter circuit (351) and the second buck converter circuit (352) are connected to the boost converter circuit (330), there may be a situation in which boosting is required even if the battery voltage (285) is higher than the first supply voltage (271). For example, if the battery voltage (285) is higher than the first supply voltage (271) but lower than the second supply voltage (272), boosting is required to output the second supply voltage (272). That is, the boost converter circuit (330) can operate in boost mode for the second supply voltage (272).Therefore, based on the first supply voltage (271) and the second supply voltage (272), it must be determined whether the boost converter circuit (330) will operate in boost mode. The determination can be performed via the processor (210). The processor (210) can control the operation of the boost converter circuit (330) of the power supply circuit (250) via a control signal.

[0054] In one embodiment, the boost converter circuit (330) may not operate in boost mode if the battery voltage (285) and the first supply voltage (271) satisfy a first specified condition and the battery voltage (285) and the second supply voltage (272) satisfy a second specified condition. For example, if the battery voltage (285) is greater than a first value according to the first supply voltage (271) and the battery voltage (285) is greater than a second value according to the second supply voltage (272), the boost converter circuit (330) may not operate in boost mode. As an example, the first value may correspond to a value increased by a certain percentage (e.g., about 10% to 20%) of the first supply voltage (271) from the first supply voltage (271). The second value may correspond to a value that is increased by a predetermined percentage (e.g., about 10% to 20%) of the second supply voltage (271) from the second supply voltage (272). For example, the first value may correspond to a value that is higher by a specified amount (e.g., about 0.5 V) than the first supply voltage (271). The second value may correspond to a value that is higher by a specified amount (e.g., about 0.5 V) than the second supply voltage (272). The boost mode may be used to boost the battery voltage (285). While the boost mode is deactivated, the boost converter circuit (330) may not output the boost voltage (385) or may output the battery voltage (285) as the boost voltage (385). The boost converter circuit (330) may be controlled by the processor (210) not to operate in the boost mode when the first specified condition and the second specified condition are met. The processor (210) can control the operation of the boost converter circuit (330) of the power supply circuit (250) through a control signal.

[0055] According to one embodiment, the boost converter circuit (330) may operate in boost mode if the battery voltage (285) and the first supply voltage (271) do not meet a first specified condition or if the battery voltage (285) and the second supply voltage (272) do not meet a second specified condition. For example, the boost converter circuit (330) may operate in boost mode if the battery voltage (285) is not greater than the first value according to the first supply voltage (271) or if the battery voltage (285) is not greater than the second value according to the second supply voltage (272). The boost converter circuit (330) may be controlled by the processor (210) to operate in boost mode if the battery voltage (285) is not greater than the first value according to the first supply voltage (271) or if the battery voltage (285) is not greater than the second value according to the second supply voltage (272). The boost converter circuit (330) may be configured to boost the battery voltage (285). The boost converter circuit (330) may output a boost voltage (385) greater than the battery voltage (285). The boost voltage (385) may correspond to the first supply voltage (271) or the second supply voltage (272).

[0056] The first buck converter circuit (351) can be electrically connected to the boost converter circuit (330). The first buck converter circuit (351) generates a first supply voltage (271) (V) based on the battery voltage (285) or the boost voltage (385). cc1) can be configured to output. The first buck converter circuit (351) can obtain the battery voltage (285) from the battery (280) through a path between the battery (280) and the first buck converter circuit (351). The first buck converter circuit (351) can obtain the boost voltage (385) through the first connection path (341). Although the first connection path (341) is illustrated as being disposed within the power supply circuit (250) in FIG. 3 , the embodiments of the present disclosure are not limited thereto. As a non-limiting example, at least a portion of the first connection path (341) can be disposed outside the power supply circuit (250). The second buck converter circuit (352) can be electrically connected to the boost converter circuit (330). The second buck converter circuit (352) is based on the battery voltage (285) or boost voltage (385) to provide a second supply voltage (272) (V cc2 ) can be configured to output. The second buck converter circuit (352) can obtain the battery voltage (285) from the battery (280) through a path between the battery (280) and the second buck converter circuit (352). The second buck converter circuit (352) can obtain the boost voltage (385) through the second connection path (342). Although the second connection path (342) is illustrated as being disposed within the power supply circuit (250) in FIG. 3 , embodiments of the present disclosure are not limited thereto. As a non-limiting example, at least a portion of the second connection path (342) can be disposed outside the power supply circuit (250).

[0057] Unlike the structure illustrated in FIG. 3, assume that there is a boost converter circuit connected to the first buck converter circuit (351) and a boost converter circuit connected to the second buck converter circuit (352). If the first buck converter circuit (351) outputs the first supply voltage (271) based on the battery voltage, the boost converter circuit connected to the first buck converter circuit (351) may not need to provide the boost voltage. However, if the first buck converter circuit (351) and the second buck converter circuit (352) share a boost converter circuit (e.g., boost converter circuit (330)), as in the structure illustrated in FIG. 3, even if the first buck converter circuit (351) outputs the first supply voltage (271) based on the battery voltage (285), the boost converter circuit (330) needs to operate in boost mode for the second buck converter circuit (352). For example, the second supply voltage (272) may be higher than the battery voltage (285) and the first supply voltage (271). The boost voltage (385) of the boost converter circuit (330) may correspond to the second supply voltage (272). In this case, the first buck converter circuit (351) must determine whether to generate the first supply voltage (271) based on the boost voltage (385) or based on the battery voltage (285). This determination may be performed through the processor (210). The processor (210) may control the operation of the first buck converter circuit (351) of the power supply circuit (250) through a control signal. The processor (210) may control the operation of the second buck converter circuit (352) of the power supply circuit (250) through a control signal.

[0058] The first buck converter circuit (351) can operate in buck mode. The buck mode can be used for step-down. For example, the first buck converter circuit (351) can operate in buck mode based on a boost voltage (385). The first buck converter circuit (351) can output a first supply voltage (271) based on the buck mode. For example, the first buck converter circuit (351) can operate in buck mode based on a battery voltage (285). The first buck converter circuit (351) can output a first supply voltage (271) based on the buck mode. In one embodiment, the first buck converter circuit (351) can output the first supply voltage (271) based on the boost voltage (385) if the battery voltage (285) and the first supply voltage (271) satisfy a first specified condition. The above first specified condition indicates that it is advantageous to obtain the first supply voltage (271) by stepping down the boost voltage (385) rather than to obtain the first supply voltage (271) by stepping down the battery voltage (285).

[0059] In one embodiment, the condition for determining which voltage is advantageous can be designed with a margin on one side or the currently used voltage rather than a simple comparison. For example, if the first value according to the first supply voltage (271) (e.g., the value obtained by adding the margin to the first supply voltage (271)) is greater than the battery voltage (285), it can be understood that the first specified condition is satisfied. If the battery voltage (285) is greater than or equal to the first value according to the first supply voltage (271) (e.g., the value obtained by adding the margin to the first supply voltage (271), it can be understood that the first specified condition is not satisfied. For another example, assume that the first buck converter circuit (351) is configured to generate the first supply voltage (271) based on the battery voltage (285) according to the current switching state. If the value obtained by adding the hysteresis offset to the battery voltage (285) is less than the first supply voltage (271), it can be understood that the first specified condition is satisfied. If the value obtained by adding the hysteresis offset to the battery voltage (285) is greater than or equal to the first supply voltage (271), it can be understood that the first specified condition is not satisfied.

[0060] As another example, let us assume that the first buck converter circuit (351) is configured to generate the first supply voltage (271) based on the boost voltage (385) according to the current switching state. If the value obtained by adding the hysteresis offset to the first supply voltage (271) is greater than or equal to the battery voltage (285), it can be understood that the first specified condition is satisfied. If the value obtained by adding the hysteresis offset to the first supply voltage (271) is less than the battery voltage (285), it can be understood that the first specified condition is not satisfied.

[0061] The second buck converter circuit (352) can operate in buck mode. The description of the first buck converter circuit (351) can be applied to the second buck converter circuit (352) in substantially the same principle. For example, the second buck converter circuit (352) can operate in buck mode based on the boost voltage (385). The second buck converter circuit (352) can output the second supply voltage (272) based on the buck mode. For example, the second buck converter circuit (352) can operate in buck mode based on the battery voltage (285). The second buck converter circuit (352) can output the second supply voltage (272) based on the buck mode. According to one embodiment, the second buck converter circuit (352) can output the second supply voltage (272) based on the boost voltage (385) if the battery voltage (285) and the second supply voltage (272) satisfy a second specified condition. The second specified condition indicates that obtaining the second supply voltage (272) by stepping down the boost voltage (385) is more advantageous than obtaining the second supply voltage (272) by stepping down the battery voltage (285). For example, if the second value according to the second supply voltage (272) (e.g., a value obtained by adding a margin to the second supply voltage (272)) is greater than the battery voltage (285), it can be understood that the first specified condition is satisfied. If the battery voltage (285) is greater than or equal to the second value (e.g., the second supply voltage (272) plus a margin) according to the second supply voltage (272), it can be understood that the second specified condition is not satisfied. For another example, assume that the second buck converter circuit (352) is configured to generate the second supply voltage (272) based on the battery voltage (285) according to the current switching state. If the value of the battery voltage (285) plus the hysteresis offset is less than the second supply voltage (272), it can be understood that the second specified condition is satisfied.If the value obtained by adding the hysteresis offset to the battery voltage (285) is greater than or equal to the second supply voltage (272), it can be understood that the second specified condition is not met. For another example, assume that the second buck converter circuit (352) is configured to generate the second supply voltage (272) based on the boost voltage (385) according to the current switching state. If the value obtained by adding the hysteresis offset to the second supply voltage (272) is greater than or equal to the battery voltage (285), it can be understood that the second specified condition is met. If the value obtained by adding the hysteresis offset to the second supply voltage (272) is less than the battery voltage (285), it can be understood that the second specified condition is not met.

[0062] The buck converter circuit (e.g., the first buck converter circuit (351) or the second buck converter circuit (352)) may not operate in buck mode. For example, the buck converter circuit may pass the input voltage. For example, if the battery voltage (285) is at a similar level to the first supply voltage (271) (e.g., within a threshold range from the first supply voltage (271)), the first buck converter circuit (351) may output the battery voltage (285) as the first supply voltage (271) instead of separately generating the first supply voltage (271). For example, if the battery voltage (285) is at a similar level to the second supply voltage (272) (e.g., within a threshold range from the second supply voltage (272)), the second buck converter circuit (352) may output the battery voltage (285) as the second supply voltage (272) instead of separately generating the second supply voltage (272).

[0063] Fig. 4 illustrates an example of power supply using a power supply circuit (e.g., a power supply circuit (250)). In Fig. 4, an example is described in which a power supply circuit (250) including a boost converter circuit (330), a first buck converter circuit (351), and a second buck converter circuit (352) of Fig. 3 provides a first supply voltage (271) and a second supply voltage (272) to a first power amplifier (261) and a second power amplifier (262) of an electronic device (101), respectively. The same reference numbers may represent the same description.

[0064] Referring to FIG. 4, the electronic device (101) may include a processor (210), an RF transceiver (220), a first power amplifier (261), a second power amplifier (262), a power supply circuit (250) (e.g., a modulator), and antennas (290) (e.g., a first antenna (291), a second antenna (292)). The processor (210) may control the power supply circuit (250) through a control interface (223) (e.g., MIPI or SPI). For each component, the descriptions of FIG. 2 and FIG. 3 may be referred to.

[0065] According to one embodiment, the power supply circuit (250) may include a boost converter circuit (330), a first buck converter circuit (351) connected to the boost converter circuit (330), and a second buck converter circuit (352) connected to the boost converter circuit (330). Although FIG. 4 illustrates a situation in which two buck converter circuits are connected to the boost converter circuit (330), embodiments of the present disclosure are not limited thereto. For example, a circuit structure in which three or more buck converter circuits share one boost converter circuit may also be understood as an embodiment of the present disclosure.

[0066] The processor (210) can control the power supply circuit (250) to output a first supply voltage (271) and a second supply voltage (272). The output of the first buck converter circuit (351) can correspond to the first supply voltage (271). The first supply voltage (271) can be provided to the first power amplifier (261). The first power amplifier (261) can amplify the first transmission signal (231). The amplified first transmission signal (231) can be transmitted on a wireless channel via the first antenna (291). The output of the second buck converter circuit (352) can correspond to the second supply voltage (272). The second supply voltage (272) can be provided to the second power amplifier (262). The second power amplifier (262) can amplify the second transmission signal (232). The amplified second transmission signal (232) can be transmitted over a wireless channel via the second antenna (292).

[0067] The processor (210) can operate the boost converter circuit (330) in boost mode. The processor (210) can control the power supply circuit (250) so that the boost converter circuit (330) operates in the boost mode. By boosting the battery voltage (285) through the boost converter circuit (330), a voltage higher than the battery voltage (285) can be provided to each buck-boost circuit. The boost converter circuit (330) can generate a boost voltage (385) higher than the battery voltage (285). For example, a first value according to the first supply voltage (271) (e.g., a value corresponding to (1+X) times the first supply voltage (271) for margin design, and 0 <X<1, 또는 마진 설계를 위한 제1 공급 전압(271)에 Y를 더한 값)이 크거나 배터리 전압(285)보다 제2 공급 전압(272)에 따른 제2 값(예: 마진 설계를 위한 제2 공급 전압(272)의 (1+X)배에 대응하는 값이고 0<X<1, 또는 마진 설계를 위한 제2 공급 전압(272)에 Y를 더한 값)이 크다면, 부스트 컨버터 회로(330)는 부스트 모드로 동작하도록 제어될 수 있다. 다른 예를 들어, 배터리 전압(285)이 제1 공급 전압(271)에 따른 제1 값(예: 마진 설계를 위한 제1 공급 전압(271)의 (1+X)배에 대응하는 값이고 0<X<1, 또는 마진 설계를 위한 제1 공급 전압(271)에 Y를 더한 값)보 크고 배터리 전압(285)이 제2 공급 전압(272)에 따른 제2 값(예: 마진 설계를 위한 제2 공급 전압(272)의 (1+X)배에 대응하는 값이고 0<X<1, 또는 마진 설계를 위한 제2 공급 전압(272)에 Y를 더한 값)보다 크다면, 부스트 동작이 필요하지 않을 수 있다. 부스트 컨버터 회로(330)는 부스트 모드로 동작하지 않도록 제어될 수 있다. 예를 들어, 부스트 컨버터 회로(330)는 부스트 컨버터 회로(330)로 입력되는 전압(예: 배터리 전압(285))를 그대로 출력하도록 제어될 수 있다.The boost converter circuit (330) can output the battery voltage (285) as a boost voltage (385). For another example, the boost converter circuit (330) may not output the boost voltage (385).

[0068] The processor (210) can control a buck converter circuit (e.g., a first buck converter circuit (351) or a second buck converter circuit (352)). The processor (210) can control the switching state of each switching circuit in the buck converter circuit. The buck converter circuit can operate in a buck mode or directly output an input voltage depending on the switching state of each switching circuit in the buck converter circuit. A battery voltage (285) and / or a boost voltage (385) can be provided to the first buck converter circuit (351). A battery voltage (285) and / or a boost voltage (385) can be provided to the second buck converter circuit (352).

[0069] According to one embodiment, the processor (210) may determine whether a first specified condition is met. A voltage that serves as a reference for the buck mode may be determined based on whether the first specified condition is met. The first buck converter circuit (351) may be controlled to output the first supply voltage (271) based on the boost voltage (385) if the battery voltage (285) and the first supply voltage (271) meet the first specified condition. The first buck converter circuit (351) may be controlled to output the first supply voltage (271) based on the battery voltage (285) if the battery voltage (285) and the first supply voltage (271) do not meet the first specified condition. For example, the first specified condition may include that the ratio of the first supply voltage (271) to the battery voltage (285) is greater than or equal to a threshold value. For example, if the following mathematical expression is satisfied, it may be understood that the first specified condition is met.

[0070]

[0071]

[0072] For example, the first specified condition may include that the value obtained by subtracting the battery voltage (285) from the first supply voltage (271) (or the excluded value) is greater than or equal to a threshold value. For example, if the following mathematical expression is established, it can be understood that the first specified condition is satisfied.

[0073]

[0074]

[0075] According to one embodiment, the processor (210) may determine whether a second specified condition is met. Depending on whether the second specified condition is met, a voltage that serves as a reference for the buck mode may be determined. The second buck converter circuit (352) may be controlled to output the second supply voltage (272) based on the boost voltage (385) if the battery voltage (285) and the second supply voltage (272) meet the second specified condition. The second buck converter circuit (352) may be controlled to output the second supply voltage (272) based on the battery voltage (285) if the battery voltage (285) and the second supply voltage (272) do not meet the second specified condition. For example, the second specified condition may include that the ratio of the second supply voltage (272) to the battery voltage (285) is greater than or equal to a threshold value. For example, if the following mathematical expression is satisfied, it may be understood that the second specified condition is met.

[0076]

[0077]

[0078] For example, the second specified condition may include that the value obtained by subtracting the battery voltage (285) from the second supply voltage (272) (or the excluded value) is greater than or equal to a threshold value. For example, if the following mathematical expression is established, it may be understood that the second specified condition is satisfied.

[0079]

[0080]

[0081] Since the boost converter circuit (330) of the power supply circuit (250) according to embodiments of the present disclosure is connected to both the first buck converter circuit (351) and the second buck converter circuit (352), the allowable current capacity in the boost converter circuit (330) may be required to be designed by considering both the current capacity in the power amplifier to which the first supply voltage (271) is provided and the current capacity in the power amplifier to which the second supply voltage (272) is provided. For example, both the first power amplifier (261) and the second power amplifier (262) may be used for EN-DC. In one embodiment, the current capacity within the boost converter circuit (330) may be required to be designed to be greater than the sum of the first supply current of the first buck converter circuit (351) required for maximum power in the first power amplifier (261) when operating in EN-DC and the second supply current of the second buck converter circuit (352) required for maximum power in the second power amplifier (262) when operating in EN-DC. As a non-limiting example, the current capacity within the boost converter circuit (330) may be required to be designed to be less than the sum of the first supply current of the first buck converter circuit (351) required for maximum power in the first power amplifier (261) and the second supply current of the second buck converter circuit (352) required for maximum power in the second power amplifier (262) when operating in a single mode (e.g., a mode other than EN-DC).

[0082] FIG. 5 illustrates an example of a boost converter circuit (e.g., a boost converter circuit (330)), a first buck converter circuit (e.g., a first buck converter circuit (351)), or a second buck converter circuit (e.g., a second buck converter circuit (352)) within a power supply circuit (e.g., a power supply circuit (250)). Like reference numerals may represent like descriptions.

[0083] Referring to FIG. 5, a power supply circuit (250) according to one embodiment may include a boost converter circuit (330), a first buck converter circuit (351), and a second buck converter circuit (352). For each of the boost converter circuit (330), the first buck converter circuit (351), and the second buck converter circuit (352), the descriptions of FIGS. 3 and 4 may be referred to. For example, the power supply circuit (250) may include a first port (501), a second port (502), a third port (503), a fourth port (504), a fifth port (505), a sixth port (506), a seventh port (507), an eighth port (508), and / or a ninth port (509).

[0084] A battery voltage (285) from a battery (280) may be provided to a power supply circuit (250). The battery voltage (285) may be provided to a boost converter circuit (330) via a first port (501). For example, the first port (501) may be referred to as an input port. The boost converter circuit (330) may include a connection circuit (531), a boost switching circuit (532), and / or a control circuit (533). The connection circuit (531) may be used to control an output of the boost converter circuit (330). Depending on whether the connection circuit (531) is turned on or off, a boost voltage may or may not be output. The boost switching circuit (532) may be used to control a boost mode of the boost converter circuit (330). Depending on whether the boost switching circuit (532) is turned on or off, it may be determined whether to perform a boost (e.g., a boost using the battery voltage (285)). The control circuit (533) may control the on or off of each of the connection circuit (531) and the boost switching circuit (532) in response to a control signal. For example, each of the connection circuit (531) and the boost switching circuit (532) may correspond to a switch (e.g., a transistor) for controlling connection / disconnection of an electrical path. The power supply circuit (250) may output the boost voltage (385) through the third port (503). For example, the third port (503) may be referred to as an output port. When the boost converter circuit (330) operates in boost mode, the boost voltage (385) may correspond to the first supply voltage (271) or the second supply voltage (272). If the boost converter circuit (330) does not operate in boost mode, the boost voltage (385) may not correspond to the battery voltage (285) or may not be output.

[0085] The battery voltage (285) may be provided to each of the first buck converter circuit (351) and / or the second buck converter circuit (352) via the second port (502). In one embodiment, the first buck converter circuit (351) may include a first connection circuit (541), a first buck switching circuit (542), a first control circuit (543), and / or a first bypass switching circuit (544). A boost voltage (385) may be provided to the first buck converter circuit (351) via the fourth port (504) of the power supply circuit (250). The first connection circuit (541) may be configured to transfer the boost voltage (385) from the boost converter circuit (330). The first buck switching circuit (542) may be utilized to control a buck mode of the first buck converter circuit (351). Depending on whether the first buck switching circuit (542) is turned on or off, it can be determined whether to perform a step-down operation (e.g., step-down operation using the battery voltage (285) or step-down operation using the boost voltage (385)). The first bypass switching circuit (544) can be used to transmit the battery voltage (285) from the battery (280). If the first buck converter circuit (351) wants to output the first supply voltage (271) using the battery voltage (285) from the battery (280) instead of the boost voltage (385), the first bypass switching circuit (544) can be turned on. As the first bypass switching circuit (544) is turned on, the battery voltage (285) can be transmitted. At this time, the first connection circuit (541) can be controlled to block the boost voltage (385) from the boost converter circuit (330). When the first buck converter circuit (351) operates in buck mode, it can output the first supply voltage (271) by stepping down the battery voltage (285). When the first buck converter circuit (351) does not operate in buck mode (e.g., the battery voltage (285) is within the critical range of the first supply voltage (271)), it can output the battery voltage (285) as the first supply voltage (271) as it is.The first control circuit (543) can control on or off of each of the first connection circuit (541), the first buck switching circuit (542), and the first bypass switching circuit (544) in response to a control signal. For example, each of the first connection circuit (541), the first buck switching circuit (542), and the first bypass switching circuit (544) can correspond to a switch (e.g., a transistor) for controlling connection / disconnection of an electrical path. The first buck converter circuit (351) can output a first supply voltage (271) through the sixth port (506). The sixth port (506) can be referred to as a first output port. For example, the sixth port (506) can correspond to the first output port (391) of FIG. 3. The first supply voltage (271) can be provided to the first power amplifier (261).

[0086] In one embodiment, the second buck converter circuit (352) may include a second connection circuit (551), a second buck switching circuit (552), a second control circuit (553), and / or a second bypass switching circuit (554). A boost voltage (385) may be provided to the second buck converter circuit (352) via the seventh port (507) of the power supply circuit (250). The second connection circuit (551) may be configured to transfer the boost voltage (385) from the boost converter circuit (330). The second buck switching circuit (552) may be used to control a buck mode of the second buck converter circuit (352). Whether to perform a step-down operation (e.g., step-down using the battery voltage (285) or step-down using the boost voltage (385)) may be determined depending on whether the second buck switching circuit (552) is turned on or off. The second bypass switching circuit (554) can be used to transmit the battery voltage (285) from the battery (280). If the second buck converter circuit (352) wants to output the second supply voltage (272) using the battery voltage (285) from the battery (280) instead of the boost voltage (385), the second bypass switching circuit (554) can be turned on. As the second bypass switching circuit (554) is turned on, the battery voltage (285) can be transmitted. At this time, the second connection circuit (551) can be controlled to block the boost voltage (385) from the boost converter circuit (330). When the second buck converter circuit (351) operates in buck mode, it can output the second supply voltage (272) by stepping down the battery voltage (285). The second buck converter circuit (352) can output the battery voltage (285) as the second supply voltage (272) when it is not operating in buck mode (e.g., when the battery voltage (285) is within the critical range of the second supply voltage (272)).The second control circuit (553) can control the on or off of each of the second connection circuit (551), the second buck switching circuit (552), and the second bypass switching circuit (554) in response to a control signal. For example, each of the second connection circuit (551), the second buck switching circuit (552), and the second bypass switching circuit (554) can correspond to a switch (e.g., a transistor) for controlling connection / disconnection of an electrical path. The second buck converter circuit (351) can output a second supply voltage (272) through the ninth port (509). The ninth port (509) can be referred to as a second output port. For example, the ninth port (509) can correspond to the second output port (392) of FIG. 3. The second supply voltage (272) can be provided to the second power amplifier (262).

[0087] For stable voltage control, the electronic device (101) may include feedback paths. For example, the power supply circuit (250) may include a first feedback path (521). The first feedback path (521) may connect one node of the first connection path (341) and the boost converter circuit (330). The boost voltage (385) provided to the first buck converter circuit (351) through the first feedback path (521) may be transmitted to the boost converter circuit (330). For example, the power supply circuit (250) may include a second feedback path (522). The second feedback path (522) may connect one node of the second connection path (342) and the boost converter circuit (330). The boost voltage (385) provided to the second buck converter circuit (352) through the second feedback path (522) may be transmitted to the boost converter circuit (330). The boost converter circuit (330) can obtain information about the boost voltage actually provided to each buck converter circuit through each of the first feedback path (521) and the second feedback path (522). The boost converter circuit (330) can be configured to output a higher boost voltage (385) in the direction of a larger voltage drop by comparing the voltage drops fed back. For example, when a capacitor (not shown) connected to each buck converter circuit cannot supply sufficient current to the corresponding buck converter circuit, the boost converter circuit (300) can compensate for the output of the boost voltage (385). Through this, it can be ensured that the voltage supplied to the first buck converter circuit (351) is higher than the first supply voltage (271). It can be ensured that the voltage supplied to the second buck converter circuit (352) is higher than the second supply voltage (272). Additionally, for example, the electronic device (101) may include a first output feedback path (581).A first output feedback path (581) may be connected from a node of a power path through which a first supply voltage (271) is output to a first buck converter circuit (351) via a fifth port (505). A first supply voltage (271) provided to a first power amplifier (261) may be delivered to the first buck converter circuit (351) via the first output feedback path (581). The electronic device (101) may include a second output feedback path (582). The second output feedback path (582) may be connected from a node of a power path through which a second supply voltage (272) is output to a second buck converter circuit (352) via an eighth port (508). A second supply voltage (272) provided to the second power amplifier (262) via the second output feedback path (582) may be delivered to the second buck converter circuit (352).

[0088] Based on the circuit structure described above, the processor (210) can control the on or off of components (e.g., switching circuits) in the power supply circuit (250) to provide the first supply voltage (271) and the second supply voltage (272) in various types of situations. In the following examples, instead of the supply voltage (e.g., the first supply voltage (271) or the second supply voltage (272)), a value considering the margin of the supply voltage can be used to specify the situation. Hereinafter, a value obtained by adding some margin to the first supply voltage (271) can be referred to as a first reference value, and a value obtained by adding some margin to the second supply voltage (272) can be referred to as a second reference value.

[0089] For example, the first reference value and the second reference value may be greater than the battery voltage (285). The boost converter circuit (330) may operate in boost mode. The boost converter circuit (330) may turn on both the connection circuit (531) and the boost switching circuit (532). The boost voltage (385) may be generated as a larger value between the first reference value and the second reference value. The first buck converter circuit (351) may operate in buck mode. Since the battery voltage (285) is less than the first reference value, the first buck converter circuit (351) cannot obtain the first supply voltage (271) by stepping down the battery voltage (285). The first bypass switching circuit (544) may be turned off. The first buck converter circuit (351) may generate the first supply voltage (271) by stepping down the boost voltage (385). The first connection circuit (541) and the first buck switching circuit (542) can be turned on. The first buck converter circuit (351) can output the first supply voltage (271). The second buck converter circuit (352) can operate in buck mode. Since the battery voltage (285) is lower than the second reference value, the second buck converter circuit (352) cannot step down the battery voltage (285) to obtain the second supply voltage (272). The second bypass switching circuit (554) can be turned off. The second buck converter circuit (352) can step down the boost voltage (385) to generate the second supply voltage (272). The second connection circuit (551) and the second buck switching circuit (552) can be turned on. The second buck converter circuit (352) can output the second supply voltage (272).

[0090] For example, the battery voltage (285) may be greater than the second reference value, and the first reference value may be greater than the battery voltage (285). The boost converter circuit (330) may operate in boost mode. The boost converter circuit (330) may turn on both the connection circuit (531) and the boost switching circuit (532). With the first reference value, the boost voltage (385) may be generated. The first buck converter circuit (351) may operate in buck mode. Since the battery voltage (285) is less than the first reference value, the first buck converter circuit (351) cannot step down the battery voltage (285) to obtain the first supply voltage (271). The first bypass switching circuit (544) may be turned off. The first buck converter circuit (351) may step down the boost voltage (385) to generate the first supply voltage (271). The first connection circuit (541) and the first buck switching circuit (542) can be turned on. The first buck converter circuit (351) can output the first supply voltage (271). The second buck converter circuit (352) can operate in buck mode. Since the battery voltage (285) is greater than the second reference value, the second buck converter circuit (352) can obtain the second supply voltage (272) by stepping down the battery voltage (285). The second bypass switching circuit (554) can be turned on. Since the boost voltage (385) is unnecessary, the second connection circuit (551) can be turned off. The second buck converter circuit (352) can generate the second supply voltage (272) by stepping down the battery voltage (285). The second buck switching circuit (552) can be turned on. The second buck converter circuit (352) can output the second supply voltage (272). Unlike the above example, if the battery voltage (285) is greater than the first reference value and the second reference value is greater than the battery voltage (285), the operations of the switching circuits in the first buck converter circuit (351) and the operations of the switching circuits in the second buck converter circuit (251) may be opposite.At this time, the boost voltage (385) of the boost converter circuit (330) may be generated based on a second reference value according to the second supply voltage (272). As a non-limiting example, instead of re-inforcing the boost voltage (385), the first buck converter circuit (351) may provide the first supply voltage (271) corresponding to the boost voltage (385) by passing the boost voltage (385).

[0091] For example, the battery voltage (285) may be greater than each of the first reference value and the second reference value. In this case, a boost using the boost voltage (385) may not be required. The boost converter circuit (330) may turn off both the connection circuit (531) and the boost switching circuit (532). The first buck converter circuit (351) may operate in buck mode. Since the battery voltage (285) is greater than the first reference value, the first buck converter circuit (351) may step down the battery voltage (285) to obtain the first supply voltage (271). The first bypass switching circuit (544) may be turned on. Since the boost voltage (385) of the boost converter circuit (330) is unnecessary, the first connection circuit (541) may be turned off. The first buck converter circuit (351) can generate a first supply voltage (271) by stepping down the battery voltage (285). The first buck switching circuit (542) can be turned on. The first buck converter circuit (351) can output the first supply voltage (271). The second buck converter circuit (352) can operate in a buck mode. Since the battery voltage (285) is greater than the second reference value, the second buck converter circuit (352) can step down the battery voltage (285) to obtain the second supply voltage (272). The second bypass switching circuit (554) can be turned on. Since the boost voltage (385) of the boost converter circuit (330) is unnecessary, the second connection circuit (551) can be turned off. The second buck converter circuit (352) can generate the second supply voltage (272) by stepping down the battery voltage (285). The second buck switching circuit (552) can be turned on. The second buck converter circuit (352) can output the second supply voltage (272).

[0092] For example, the battery voltage (285) may be within a critical range of the first supply voltage (271). Here, the critical range may mean that it is within an error range that is smaller than the margin of the first reference value described above based on the first supply voltage (271). If the battery voltage (285) substantially corresponds to the first supply voltage (271), the first buck converter circuit (351) does not need to operate in buck mode. The first bypass switching circuit (544) may be turned on, and the first connection circuit (541) and the first buck switching circuit (542) may be turned off. The boost converter circuit (330) may be operated according to the comparison result of the battery voltage (285) and the second reference value. If the battery voltage (285) is greater than the second reference value, the boost mode may be turned off. The connection circuit (351) and the boost switching circuit (352) may be turned off. If the battery voltage (285) is not greater than the second reference value, the boost mode may be turned on. The connection circuit (351) and the boost switching circuit (352) may be turned on. If the second buck converter circuit (351) operates in the buck mode based on the battery voltage (285), the second bypass switch circuit (554) may be turned on, and the second buck switching circuit (552) may be turned on. The second connection circuit (551) may be turned off. If the second buck converter circuit (351) operates in the buck mode based on the boost voltage (385), the second bypass switching circuit (554) may be turned off, and the second buck switching circuit (552) may be turned on. The second connection circuit (551) may be turned on. Unlike the above example, if the battery voltage (285) is within the critical range of the second supply voltage (272), the operations of the switching circuits in the first buck converter circuit (351) and the operations of the switching circuits in the second buck converter circuit (251) may be opposite. In this case, the operation of the boost converter circuit (330) may be determined based on the first reference value according to the first supply voltage (271).

[0093] FIG. 6 illustrates an example of a boost converter circuit (e.g., a boost converter circuit (330)), a first buck converter circuit (e.g., a first buck converter circuit (351)), or a second buck converter circuit (e.g., a second buck converter circuit (352)) within a power supply circuit (e.g., a power supply circuit (250)) according to one embodiment. Like reference numerals may represent like descriptions.

[0094] Referring to FIG. 6, unlike FIG. 5, a structure is described in which a boost voltage (385) is always provided to a buck converter circuit (e.g., a first buck converter circuit (351) or a second buck converter circuit (352)). The description of FIG. 5 may be referred to for each component of the power supply circuit (250). Unlike FIG. 5, even if the boost converter circuit (330) does not operate in boost mode, it can provide a boost voltage (385) corresponding to the battery voltage (285) to each of the buck converter circuits (e.g., the first buck converter circuit (351) or the second buck converter circuit (352)). In order to provide the battery voltage (285) to each buck converter circuit, the connection circuit (531) can be turned on and the boost switching circuit (532) can be turned off.

[0095] Unlike FIG. 5, when the first buck converter circuit (351) uses the battery voltage (285), since there is no separate battery path, the first buck converter circuit (351) may not include the first bypass switching circuit (544). For example, the first buck converter circuit (351) may include a first connection circuit (541), a first buck switching circuit (542), and a first control circuit (543). A boost voltage (385) corresponding to the battery voltage (285) may be obtained through the first connection circuit (541). Whether the first buck converter circuit (351) operates in the buck mode may be determined depending on whether the boost voltage (385) corresponding to the battery voltage (285) is within a critical range of the first supply voltage (271). When the second buck converter circuit (352) uses the battery voltage (285), since there is no separate battery path, the second buck converter circuit (352) may not include the first bypass switching circuit (554). For example, the second buck converter circuit (352) may include a second connection circuit (551), a second buck switching circuit (552), and a second control circuit (553). A boost voltage (385) corresponding to the battery voltage (285) may be obtained through the second connection circuit (551). Whether the second buck converter circuit (352) operates in buck mode may be determined depending on whether the boost voltage (385) corresponding to the battery voltage (285) is within a critical range of the second supply voltage (272).

[0096] Based on the circuit structure of FIG. 6, the processor (210) can control the on or off of components (e.g., switching circuits) in the power supply circuit (250) to provide the first supply voltage (271) and the second supply voltage (272) in various types of situations. In the following examples, instead of the supply voltage (e.g., the first supply voltage (271) or the second supply voltage (272)), a value considering the margin of the supply voltage can be used to specify the situation. Hereinafter, a value obtained by adding some margin to the first supply voltage (271) can be referred to as a first reference value, and a value obtained by adding some margin to the second supply voltage (272) can be referred to as a second reference value.

[0097] For example, the first reference value and the second reference value may be greater than the battery voltage (285). The boost converter circuit (330) may operate in boost mode. The boost converter circuit (330) may turn on both the connection circuit (531) and the boost switching circuit (532). The boost voltage (385) may be generated as a larger value between the first reference value and the second reference value. The first buck converter circuit (351) may operate in buck mode. The first buck converter circuit (351) may generate the first supply voltage (271) by stepping down the boost voltage (385). The first connection circuit (541) and the first buck switching circuit (542) may be turned on. The first buck converter circuit (351) may output the second supply voltage (271). The second buck converter circuit (352) may operate in buck mode. The second buck converter circuit (352) can generate a second supply voltage (272) by stepping down the boost voltage (385). The second connection circuit (551) and the second buck switching circuit (552) can be turned on. The second buck converter circuit (352) can output the second supply voltage (272).

[0098] For example, the battery voltage (285) may be greater than the second reference value, and the first reference value may be greater than the battery voltage (285). The boost converter circuit (330) may operate in boost mode. The boost converter circuit (330) may turn on both the connection circuit (531) and the boost switching circuit (532). With the first reference value, the boost voltage (385) may be generated. The first buck converter circuit (351) may operate in buck mode. The first buck converter circuit (351) may step down the boost voltage (385) to generate the first supply voltage (271). The first connection circuit (541) and the first buck switching circuit (542) may be turned on. The first buck converter circuit (351) may output the first supply voltage (271). The second buck converter circuit (352) may operate in buck mode. Since the first supply voltage (271) is greater than the second supply voltage (272), the second buck converter circuit (352) can obtain the second supply voltage (272) by stepping down the boost voltage (385) supplied to the second buck converter circuit (352). The second connection circuit (551) and the second buck switching circuit (552) can be turned on. The second buck converter circuit (352) can output the second supply voltage (272). Unlike the above example, if the battery voltage (285) is greater than the first reference value and the second reference value is greater than the battery voltage (285), the operations of the switching circuits in the first buck converter circuit (351) and the operations of the switching circuits in the second buck converter circuit (251) may be opposite. At this time, the boost voltage (385) of the boost converter circuit (330) can be generated based on a second reference value according to the second supply voltage (272).

[0099] For example, the battery voltage (285) may be greater than each of the first reference value and the second reference value. In this case, a boost using the boost voltage (385) may not be required. The boost converter circuit (330) may turn off the boost switching circuit (532). To transmit the boost voltage (385) corresponding to the battery voltage (285), the connection circuit (531) may be turned on. The first buck converter circuit (351) may operate in a buck mode. The first buck converter circuit (351) may generate the first supply voltage (271) by stepping down the boost voltage (385). The first connection circuit (541) and the first buck switching circuit (542) may be turned on. The first buck converter circuit (351) may output the first supply voltage (271). The second buck converter circuit (352) may operate in a buck mode. The second buck converter circuit (352) can obtain the second supply voltage (272) by stepping down the boost voltage (385). The second connection circuit (551) and the second buck switching circuit (552) can be turned on. The second buck converter circuit (352) can output the second supply voltage (272).

[0100] For example, the battery voltage (285) may be within a threshold range of the first supply voltage (271). If the battery voltage (285) is within the threshold range of the first supply voltage (271) and the battery voltage (285) is greater than a second reference value, the boost mode may be turned off. Here, the threshold range may mean an error range that is smaller than a margin of the first reference value described above with respect to the first supply voltage (271). If the battery voltage (285) substantially corresponds to the first supply voltage (271), the first buck converter circuit (351) does not need to operate in the buck mode. Since the battery voltage (285) is greater than the second reference value, the boost voltage (385) may correspond to the battery voltage (285). The first connection circuit (541) may be turned on, and the first buck switching circuit (542) may be turned off. The first buck converter circuit (351) can output a boost voltage (385) corresponding to the battery voltage (285) through the sixth port (506). Since the boost mode is off, the connection circuit (351) can be on and the boost switching circuit (352) can be off. The second buck converter circuit (351) can operate in the buck mode based on the boost voltage (385). The second connection circuit (551) can be on and the second buck switching circuit (552) can be on. Unlike the above example, if the battery voltage (285) is within the critical range of the second supply voltage (272), the operations of the switching circuits in the first buck converter circuit (351) and the operations of the switching circuits in the second buck converter circuit (251) can be opposite. At this time, the operation of the boost converter circuit (330) can be determined based on a first reference value according to the first supply voltage (271).

[0101] FIG. 7 illustrates an example of an electronic device (e.g., electronic device (101)) including a power supply circuit (e.g., power supply circuit (250)) and a plurality of radio frequency front end (RFFE) modules. The power supply circuit (250) may be configured to output a first supply voltage (271) through a first output port (391). The power supply circuit (250) may be configured to output a second supply voltage (272) through a second output port (392).

[0102] Referring to FIG. 7, the electronic device (101) may include a processor (210), an RF transceiver (220), RFFE modules, and a power supply circuit (250). Each of the RFFE modules may be configured to process signals provided through the processor (210) and the RF transceiver (220). Each of the RFFE modules may operate under the control of the processor (210) and / or the RF transceiver (220). For each component, the descriptions of FIGS. 2, 3, 4, 5, and 6 may be referenced. The electronic device (101) may include RFFE modules to support various frequency bands. For example, the electronic device (101) may include a first RFFE module (741), a second RFFE module (742), a third RFFE module (743), a fourth RFFE module (744), and / or a fifth RFFE module (745). The first RFFE module (741) may include a first power amplifier (761). The second RFFE module (742) may include a second power amplifier (762). The third RFFE module (743) may include a third power amplifier (763). The fourth RFFE module (744) may include a fourth power amplifier (764). The fifth RFFE module (745) may include a fifth power amplifier (765). For each RFFE module, reference may be made to the description of the first RFFE circuit (241) and the second RFFE circuit (242) of FIG. 2. For each PA, reference may be made to the description of the first power amplifier (261) and the second power amplifier (262) of FIG. 2.

[0103] The power supply circuit (250) can be configured to supply power to a plurality of RFFE modules (e.g., a first RFFE module (741), a second RFFE module (742), a third RFFE module (743), a fourth RFFE module (744), and a fifth RFFE module (745)). The power supply circuit (250) can provide a plurality of supply voltages for the plurality of RFFE modules. The power supply circuit (250) can provide a supply voltage to each RFFE module of the plurality of RFFE modules. According to one embodiment, the power supply circuit (250) can supply a first supply voltage (271) (V) through a first power path (711). CC1 ) can be provided to the first power amplifier (761) of the first RFFE module (741) or to the second power amplifier (762) of the second RFFE module (742). According to one embodiment, the power supply circuit (250) can provide a second supply voltage (272) (V) via the second power path (712). CC2 ) can be provided to the first power amplifier (761) of the first RFFE module (741) or to the second power amplifier (762) of the second RFFE module (742). According to one embodiment, the power supply circuit (250) provides the first supply voltage (271) (V) via the third power path (713). CC1 ) can be provided to the third power amplifier (763) of the third RFFE module (743) or to the fourth power amplifier (764) of the fourth RFFE module (744). According to one embodiment, the power supply circuit (250) may provide the second supply voltage (272) (V) via the fourth power path (714). CC2 ) can be provided to the third power amplifier (763) of the third RFFE module (743) or to the fourth power amplifier (764) of the fourth RFFE module (744).

[0104] According to one embodiment, a first switching circuit (751) may be used to provide a supply voltage to each of the first power amplifier (761) and the second power amplifier (762). The first switching circuit (751) may selectively connect the first power path (711) or the second power path (712) to the first PA path (721). For example, when the first switching circuit (751) electrically connects the first power path (711) and the first PA path (721), the first power amplifier (761) may supply the first supply voltage (V) through the first power path (711) and the first PA path (721). cc1 ) can be obtained. For example, if the first switching circuit (751) electrically connects the second power path (712) and the first PA path (721), the first power amplifier (761) can obtain the second supply voltage (V) through the second power path (712) and the first PA path (721). cc2 ) can be obtained. The first switching circuit (751) can be connected to the first subsequent power path (722). The subsequent power path may be referred to as a continuous power path, a sub-power path, an additional power path, an auxiliary power path, a supplementary power path, an extended power path, and / or equivalent technical terms in addition to the subsequent power path in that it supplies power from one RFFE module to another RFFE module. The first switching circuit (751) can selectively connect the first power path (711) or the second power path (712) to the first subsequent power path (722). For example, when the first switching circuit (751) electrically connects the first power path (711) and the first PA path (721), the second power amplifier (762) supplies the first supply voltage (V) through the first power path (711) and the first subsequent power path (722). cc1) can be obtained. For example, if the first switching circuit (751) electrically connects the second power path (712) and the first PA path (721), the second power amplifier (762) can obtain the second supply voltage (V) through the second power path (712) and the first subsequent power path (722). cc2 ) can be obtained.

[0105] According to one embodiment, a second switching circuit (752) may be used to provide a supply voltage to each of the third power amplifier (763) and the fourth power amplifier (764). The second switching circuit (752) may selectively connect the third power path (713) or the fourth power path (714) to the third PA path (723). For example, when the second switching circuit (752) electrically connects the third power path (713) and the third PA path (723), the third power amplifier (763) may receive the first supply voltage (V) through the third power path (713) and the third PA path (723). cc1 ) can be obtained. For example, if the second switching circuit (752) electrically connects the fourth power path (714) and the third PA path (723), the third power amplifier (763) can obtain the second supply voltage (V) through the fourth power path (714) and the third PA path (723). cc2 ) can be obtained. The second switching circuit (752) can be connected to the second subsequent power path (724). The second switching circuit (752) can selectively connect the third power path (713) or the fourth power path (714) to the second subsequent power path (724). For example, when the second switching circuit (752) electrically connects the third power path (713) and the third PA path (723), the fourth power amplifier (764) receives the first supply voltage (V) through the third power path (713) and the second subsequent power path (724). cc1) can be obtained. For example, if the second switching circuit (752) electrically connects the fourth power path (714) and the third PA path (723), the fourth power amplifier (764) can obtain the second supply voltage (V) through the fourth power path (714) and the second subsequent power path (724). cc2 ) can be obtained.

[0106] The power supply circuit (250) according to embodiments of the present disclosure may include a structure in which buck converter circuits (e.g., a first buck converter circuit (351) or a second buck converter circuit (352)) share a single boost converter circuit (330). Accordingly, space constraints within the electronic device (101) are reduced, and a design advantageous in terms of cost and performance can be enabled.

[0107] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0108] In embodiments, an electronic device (101) is provided. The electronic device (101) may include a processor (210) including a processing circuit; an RF (radio frequency) transceiver (220); a first RFFE (radio frequency front end) circuit including a first power amplifier; a second RFFE circuit including a second power amplifier; a power supply circuit including a battery (280) providing a battery voltage (285); a boost converter circuit (330) connected to the battery (280) and configured to provide a boost voltage (385) based on the battery (280) voltage (285), a first buck converter circuit (351) connected to the battery (280) and connected to the boost converter circuit (330), and a second buck converter circuit (352) connected to the battery (280) and connected to the boost converter circuit (330). The power supply circuit may be configured to output a first supply voltage (271) based on the battery (280) voltage (285) or the boost voltage (385) through the first buck converter circuit (351) under the control of the processor (210), and to output a second supply voltage (272) based on the battery (280) voltage (285) or the boost voltage (385) through the second buck converter circuit (352). The first supply voltage (271) output through the first buck converter circuit (351) may be provided to the first power amplifier while a first signal is transmitted through the first power amplifier. The second supply voltage (272) output through the second buck converter circuit (352) may be provided to the second power amplifier while a second signal is transmitted through the second power amplifier.

[0109] For example, the processor (210) may be configured to control the power supply circuit to output the first supply voltage (271) based on the boost voltage (385) based on a determination that the battery (280) voltage (285) and the first supply voltage (271) satisfy a first specified condition.

[0110] The processor (210) may be configured to control the power supply circuit to output the first supply voltage (271) based on the battery (280) voltage (285) upon determining that the battery (280) voltage (285) and the first supply voltage (271) do not satisfy the first specified condition. The processor (210) may be configured to control the power supply circuit to output the second supply voltage (272) based on the boost voltage (385) upon determining that the battery (280) voltage (285) and the second supply voltage (272) satisfy the second specified condition. The processor (210) may be configured to control the power supply circuit to output the second supply voltage (272) based on the battery (280) voltage (285) upon determining that the battery (280) voltage (285) and the second supply voltage (272) do not satisfy the second specified condition.

[0111] For example, the first specified condition may indicate that the ratio of the first supply voltage (271) to the battery (280) voltage (285) is greater than or equal to a threshold value. The second specified condition may indicate that the ratio of the second supply voltage (272) to the battery (280) voltage (285) is greater than or equal to the threshold value.

[0112] For example, the first specified condition may indicate that a value of the first supply voltage (271) minus the battery (280) voltage (285) is greater than or equal to a threshold value. The second specified condition may indicate that a value of the second supply voltage (272) minus the battery (280) voltage (285) is greater than or equal to a threshold value.

[0113] For example, the boost converter circuit (330) may include a boost switching circuit configured to operate in a boost mode to generate the boost voltage (385) based on the battery (280) voltage (285). The processor (210) may control the boost switching circuit not to operate in the boost mode based on a determination that the battery (280) voltage (285) is greater than a first value for the first supply voltage (271) and that the battery (280) voltage (285) is greater than a second value for the second supply voltage (272). The processor (210) may control the boost switching circuit to operate in the boost mode based on a determination that the battery (280) voltage (285) is not greater than the first value for the first supply voltage (271) or that the battery (280) voltage (285) is not greater than the second value for the second supply voltage (272).

[0114] For example, the first buck converter circuit (351) may include a first bypass switching circuit for transferring the battery (280) voltage (285) from the battery (280), a first connection circuit for transferring the boost voltage (385) from the boost converter circuit (330), and a first buck switching circuit configured to operate in a buck mode for generating the first supply voltage (271) based on the boost voltage (385). The second buck converter circuit (352) may include a second bypass switching circuit for transferring the battery (280) voltage (285) from the battery (280), a second connection circuit for transferring the boost voltage (385) from the boost converter circuit (330), and a second buck switching circuit configured to operate in a buck mode for generating the second supply voltage (272) based on the boost voltage (385).

[0115] For example, the boost voltage (385) according to the boost mode may correspond to the second supply voltage (272). When the first value for the first supply voltage (271) is greater than the battery (280) voltage (285) while the boost voltage (385) corresponding to the second supply voltage (272) is provided to the second buck converter circuit (352), the first connection circuit may be activated and the first bypass switching circuit may be deactivated. When the first value for the first supply voltage (271) is not greater than the battery (280) voltage (285) while the boost voltage (385) corresponding to the second supply voltage (272) is provided to the second buck converter circuit (352), the first connection circuit may be deactivated and the first bypass switching circuit may be activated.

[0116] For example, when the voltage (285) of the battery (280) is within the critical range of the first supply voltage (271), the first buck switching circuit can be controlled to be turned off. When the voltage (285) of the battery (280) is outside the critical range of the first supply voltage (271), the first buck switching circuit can be controlled to operate in the buck mode.

[0117] For example, when the second value for the second supply voltage (272) is greater than the battery (280) voltage (285), the second connection circuit may be activated and the second bypass switching circuit may be deactivated. When the second value for the second supply voltage (272) is not greater than the battery (280) voltage (285), the second connection circuit may be deactivated and the second bypass switching circuit may be activated.

[0118] For example, when the battery (280) voltage (285) is within the critical range of the second supply voltage (272), the second buck switching circuit can be controlled to turn off. When the battery (280) voltage (285) is outside the critical range of the second supply voltage (272), the second buck switching circuit can be controlled to operate in the buck mode.

[0119] For example, the electronic device (101) may include a first connection path between the boost converter circuit (330) and the first buck converter circuit (351); a second connection path between the boost converter circuit (330) and the first buck converter circuit (351); a first feedback path connected to the boost converter circuit (330) from a node of the first connection path; and a second feedback path connected to the boost converter circuit (330) from a node of the second connection path.

[0120] For example, each of the first supply voltage (271) and the second supply voltage (272) may be generated based on APT (average power tracking). The frequency band of the first signal and the frequency band of the second signal may correspond to frequency bands for EN (EUTRA-NR)-DC (dual connectivity).

[0121] In embodiments, a power supply circuit is provided. The power supply circuit may include a boost converter circuit (330); a first buck converter circuit (351) connected to the boost converter circuit (330); and a second buck converter circuit (352) connected to the boost converter circuit (330). The boost converter circuit (330) may be configured to provide a boost voltage (385) based on a battery (280) voltage (285). The first buck converter circuit (351) may be configured to output a first supply voltage (271) for a first power amplifier based on the battery (280) voltage (285) or the boost voltage (385) of the boost converter circuit (330). The second buck converter circuit (352) may be configured to output a second supply voltage (272) for the second power amplifier based on the battery (280) voltage (285) or the boost voltage (385) of the boost converter circuit (330).

[0122] For example, the first buck converter circuit (351) may be configured to output the first supply voltage (271) based on the boost voltage (385) when the battery (280) voltage (285) and the first supply voltage (271) satisfy a first specified condition. The first buck converter circuit (351) may be configured to output the first supply voltage (271) based on the battery (280) voltage (285) when the battery (280) voltage (285) and the first supply voltage (271) do not satisfy the first specified condition.

[0123] The second buck converter circuit (352) may be configured to output the second supply voltage (272) based on the boost voltage (385) when the battery (280) voltage (285) and the second supply voltage (272) satisfy a second specified condition. The second buck converter circuit (352) may be configured to output the second supply voltage (272) based on the battery (280) voltage (285) when the battery (280) voltage (285) and the second supply voltage (272) do not satisfy the second specified condition.

[0124] For example, the first specified condition may indicate that the ratio of the first supply voltage (271) to the battery (280) voltage (285) is greater than or equal to a threshold value. The second specified condition may indicate that the ratio of the second supply voltage (272) to the battery (280) voltage (285) is greater than or equal to the threshold value.

[0125] For example, the first specified condition may indicate that a value of the first supply voltage (271) minus the battery (280) voltage (285) is greater than or equal to a threshold value. The second specified condition may indicate that a value of the second supply voltage (272) minus the battery (280) voltage (285) is greater than or equal to the threshold value.

[0126] For example, the boost converter circuit (330) may include a boost switching circuit configured to operate in a boost mode to generate the boost voltage (385) based on the battery (280) voltage (285). The power supply circuit may be configured to control the boost switching circuit to operate in the boost mode when, under the control of the processor (210), the battery (280) voltage (285) is greater than a first value for the first supply voltage (271) and the battery (280) voltage (285) is greater than a second value for the second supply voltage (272). The power supply circuit may be configured to control the boost switching circuit so as not to operate in the boost mode when the battery (280) voltage (285) is less than the first value for the first supply voltage (271) or the battery (280) voltage (285) is less than the second value for the second supply voltage (272), under the control of the processor (210).

[0127] For example, the power supply circuit may include an input port connected to the boost converter circuit (330); an output port connected to the boost converter circuit (330); a first connection port connected to the first buck converter circuit (351) and for the boost voltage (385); a second connection port connected to the second buck converter circuit (352) and for the boost voltage (385); a first output port for outputting the first supply voltage (271); a second output port for outputting the second supply voltage (272); a first feedback path connected to the boost converter circuit (330) from a node between the first connection port and the first buck converter circuit (351); and a second feedback path connected to the boost converter circuit (330) from a node between the second connection port and the second buck converter circuit (352).

[0128] For example, the power supply circuit may include at least one control circuit. The at least one control circuit may be configured to, in response to a control signal from the processor (210) or the RF transceiver (220), turn on or off the boost mode of the boost converter circuit (330), turn on or off the buck mode of the first buck converter circuit (351), and turn on or off the buck mode of the second buck converter circuit (352). The control signal may be obtained through a mobile industry processor interface (MIPI) or a serial peripheral interface (SPI).

[0129] For example, each of the first supply voltage (271) and the second supply voltage (272) may be generated based on APT (average power tracking).

[0130] For one or more embodiments, at least one of the components described in one or more of the preceding drawings may be configured to perform one or more operations, techniques, processes, and / or methods as described herein. For example, a processor (e.g., a baseband processor) described herein with respect to one or more of the preceding drawings may be configured to operate according to one or more examples described herein. For another example, circuitry associated with a user equipment (UE), a base station, a network element, and the like, as described above with respect to one or more of the preceding drawings, may be configured to operate according to one or more examples described herein.

[0131] Any of the embodiments described above may be combined with any other embodiment (or combination of embodiments) unless explicitly stated otherwise. The foregoing description of one or more implementations provides examples and descriptions, but is not intended to be exhaustive or limit the scope of the embodiments to the precise forms disclosed. Modifications and variations are possible in light of the above teachings or may be learned from practicing various embodiments.

[0132] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0133] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0134] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0135] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0136] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0137] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices; A processor comprising a processing circuit; RF(radio frequency) transmitter and receiver; A first radio frequency front end (RFFE) circuit including a first power amplifier; A second RFFE circuit including a second power amplifier; A battery that provides battery voltage; A power supply circuit comprising: A boost converter circuit connected to the battery and configured to provide a boost voltage based on the battery voltage, A first buck converter circuit connected to the battery and connected to the boost converter circuit, and A power supply circuit including a second buck converter circuit connected to the battery and connected to the boost converter circuit, The above power supply circuit, under the control of the processor: Through the first buck converter circuit, a first supply voltage is output based on the battery voltage or the boost voltage, It is configured to output a second supply voltage based on the battery voltage or the boost voltage through the second buck converter circuit, The first supply voltage output through the first buck converter circuit is provided to the first power amplifier while the first signal is transmitted through the first power amplifier, The second supply voltage output through the second buck converter circuit is provided to the second power amplifier while the second signal is transmitted through the second power amplifier. Electronic devices.

2. In claim 1, The above processor: Controlling the power supply circuit to output the first supply voltage based on the boost voltage based on a determination that the battery voltage and the first supply voltage satisfy a first specified condition; Controlling the power supply circuit to output the first supply voltage based on the battery voltage, based on a determination that the battery voltage and the first supply voltage do not satisfy the first specified condition; Controlling the power supply circuit to output the second supply voltage based on the boost voltage based on a determination that the battery voltage and the second supply voltage satisfy the second specified condition; Controlling the power supply circuit to output the second supply voltage based on the battery voltage, based on a determination that the battery voltage and the second supply voltage do not satisfy the second specified condition; Electronic devices.

3. In claim 2, The above first specified condition indicates that the ratio of the first supply voltage to the battery voltage is greater than or equal to a threshold value, The second specified condition indicates that the ratio of the second supply voltage to the battery voltage is greater than or equal to the threshold value. Electronic devices.

4. In claim 2, The above first specified condition indicates that the value excluding the battery voltage from the first supply voltage is greater than or equal to a threshold value, The second specified condition indicates that the value of the second supply voltage minus the battery voltage is greater than or equal to a threshold value. Electronic devices.

5. In claim 1, The boost converter circuit includes a boost switching circuit configured to operate in a boost mode to generate the boost voltage based on the battery voltage, The above processor, Controlling the boost switching circuit so as not to operate in the boost mode based on a determination that the battery voltage is greater than a first value for the first supply voltage and that the battery voltage is greater than a second value for the second supply voltage; Controlling the boost switching circuit to operate in the boost mode based on a determination that the battery voltage is not greater than the first value for the first supply voltage or that the battery voltage is not greater than the second value for the second supply voltage; Electronic devices.

6. In claim 5, The first buck converter circuit comprises a first bypass switching circuit for transmitting the battery voltage from the battery, a first connection circuit for transmitting the boost voltage from the boost converter circuit, and a first buck switching circuit configured to operate in a buck mode for generating the first supply voltage based on the boost voltage. The second buck converter circuit comprises a second bypass switching circuit for transferring the battery voltage from the battery, a second connection circuit for transferring the boost voltage from the boost converter circuit, and a second buck switching circuit configured to operate in a buck mode for generating the second supply voltage based on the boost voltage. Electronic devices.

7. In claim 6, The boost voltage according to the boost mode corresponds to the second supply voltage, When the first value for the first supply voltage is greater than the battery voltage while the boost voltage corresponding to the second supply voltage is provided to the second buck converter circuit, the first connection circuit is activated and the first bypass switching circuit is deactivated; When the boost voltage corresponding to the second supply voltage is provided to the second buck converter circuit while the first value for the first supply voltage is not greater than the battery voltage, the first connection circuit is deactivated and the first bypass switching circuit is activated. Electronic devices.

8. In claim 7, When the battery voltage is within the critical range of the first supply voltage, the first buck switching circuit is controlled to be turned off, When the battery voltage is outside the critical range of the first supply voltage, the first buck switching circuit is controlled to operate in the buck mode. Electronic devices.

9. In claim 8, When the second value for the second supply voltage is greater than the battery voltage, the second connection circuit is activated and the second bypass switching circuit is deactivated; If the second value for the second supply voltage is not greater than the battery voltage, the second connection circuit is deactivated and the second bypass switching circuit is activated. Electronic devices.

10. In claim 9, When the battery voltage is within the critical range of the second supply voltage, the second buck switching circuit is controlled to be turned off, When the battery voltage is outside the critical range of the second supply voltage, the second buck switching circuit is controlled to operate in the buck mode. Electronic devices.

11. In claim 1, A first connection path between the boost converter circuit and the first buck converter circuit; A second connection path between the boost converter circuit and the first buck converter circuit; A first feedback path connected to the boost converter circuit from one node of the first connection path; and A second feedback path connected to the boost converter circuit from one node of the second connection path, Electronic devices.

12. In claim 1, Each of the first supply voltage and the second supply voltage is generated based on APT (average power tracking), The frequency band of the first signal and the frequency band of the second signal correspond to frequency bands for EN (EUTRA-NR)-DC (dual connectivity). Electronic devices.

13. In the power supply circuit; Boost converter circuit; A first buck converter circuit connected to the above boost converter circuit; A second buck converter circuit connected to the boost converter circuit is included, The above boost converter circuit is configured to provide a boost voltage based on the battery voltage, The first buck converter circuit is configured to output a first supply voltage for the first power amplifier based on the battery voltage or the boost voltage of the boost converter circuit, The second buck converter circuit is configured to output a second supply voltage for the second power amplifier based on the battery voltage or the boost voltage of the boost converter circuit. Power supply circuit.

14. In claim 13, The above first buck converter circuit: When the battery voltage and the first supply voltage satisfy a first specified condition, the first supply voltage is output based on the boost voltage, If the battery voltage and the first supply voltage do not satisfy the first specified condition, the first supply voltage is configured to be output based on the battery voltage, The above second buck converter circuit: When the battery voltage and the second supply voltage satisfy the second specified condition, output the second supply voltage based on the boost voltage, If the battery voltage and the second supply voltage do not satisfy the second specified condition, the second supply voltage is configured to be output based on the battery voltage. Power supply circuit.

15. In claim 14, The above first specified condition indicates that the ratio of the first supply voltage to the battery voltage is greater than or equal to a threshold value, The second specified condition indicates that the ratio of the second supply voltage to the battery voltage is greater than or equal to the threshold value. Power supply circuit.

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