Semiconductor water dispenser
A semiconductor and water dispenser technology, applied in the field of semiconductor water dispensers, can solve the problems of increased cost, unfavorable promotion, complex structure, etc., and achieve the effects of rapid uniformity of water temperature, accelerated energy transfer speed, and simple overall structure
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2011-11-09
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
technical field
[0001] The invention relates to a water dispenser, in particular to a semiconductor water dispenser using semiconductor refrigeration. Background technique
[0002] Water dispensers emerged in the 1990s, using purified water or filtered tap water as the water source, clean and hygienic, and easy to use. The most common type on the market is the hot and cold water dispenser. The heating methods of existing water dispensers are basically the same, but there are many kinds of cooling methods, such as semiconductor refrigeration or refrigerant refrigeration. Water dispensers using semiconductor refrigeration chips consume less power and do not use refrigerants and other substances that cause environmental pollution, which is energy-saving and environmentally friendly. However, the cold water tanks of traditional semiconductor refrigeration water dispensers are fixed, and the water in the cold water tanks exchanges energy by the natural flow generated by the temp...
Examples
Embodiment
[0026] Such as figure 1 , figure 2 As shown, the semiconductor water dispenser of the present invention includes a housing 100, in which a cooling device 200, a heating device 300 and a normal temperature device 400 are respectively arranged, and the upper end of the housing 100 is provided with a water tank 110 connected to a bucket 500, The water tank 110 is respectively connected to the refrigeration device 200, the heating device 300 and the room temperature device 400, the bottom of the refrigeration device 200 is connected to the bottom of the housing 100 by a spring 600, and the housing 100 is respectively provided with a cold water outlet 210 and a hot water outlet. The water outlet 310, the cold water outlet 210 and the hot water outlet 310 are respectively connected to the cooling device 200 and the heating device 300 through pipelines, and the cooling chip 220 of the cooling device 200 is a semiconductor cooling chip.
[0027] The refrigeration device 200 includes...