Chip heating device and manufacturing method of chip heating device

Abstract

A wafer heating device and a manufacturing method of a wafer heating device, relating to a heating device and a manufacturing method. A plurality of through holes are arranged in an array on the surface of a heat spreader, a serpentine inner cavity is provided inside the heat spreader, the serpentine inner cavity matches with the plurality of through holes and is arranged in a staggered manner, a heating resistor is arranged in a matching manner in the serpentine inner cavity, a heat-resistant rubber sleeve is fixed at the corresponding position of each through hole on the upper surface of the heat spreader, the heat-resistant rubber sleeve is cylindrical, a plurality of heat-conducting round rods respectively pass through a heat-resistant rubber sleeve tightly and are vertically inserted into the corresponding through holes, a heat-conducting sheet is fixed at the lower end of each heat-conducting round rod, a plurality of heat-conducting sheets can be spliced ​​into a whole sheet, an insulating rubber head is fixed at the upper end of each heat-conducting round rod, the upper surface of the base is flat and provided with an insulating layer, and the heat spreader is fixed to the base through four columns. Different numbers of heat-conducting parts at different positions can be pressed down according to needs, so as to heat the local position or the whole wafer to meet different heating needs.

Description

Technical Field

[0001] The present invention relates to a heating device and a manufacturing method thereof, in particular to a wafer heating device and a manufacturing method thereof. Background Art

[0002] In semiconductor processing, wafers often need to be heated. There are two types of heating: local heating and overall heating. Local heating is mainly used for high-temperature testing of device performance.

[0003] However, the current high temperature test generally sets a heating layer such as polysilicon on the wafer, and heats the entire heating layer for testing, which inevitably heats the devices that do not need to be tested, affecting the performance of the devices that do not need to be heated. In addition, there are also devices that need to be tested that are cut off from the wafer for testing, which makes the repair process more troublesome.

[0004] Therefore, there is a great need for a wafer heating device that is simple to manufacture and can heat a local portion of a wafer or the entire wafer as required. Summary of the invention

[0005] In order to solve the shortcomings of the background technology, the present invention provides a wafer heating device and a manufacturing method of the wafer heating device.

[0006] To achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a wafer heating device, comprising a heat spreader, a base, a heating resistor, four columns and a plurality of heat conducting members, the heat spreader is horizontally arranged and a plurality of through holes are arranged in an array on its plate surface, a serpentine inner cavity is arranged inside the heat spreader, the serpentine inner cavity is matched with the plurality of through holes and is staggered, the heating resistor is matched and arranged in the serpentine inner cavity and is powered by an external power supply, a heat-resistant rubber sleeve is fixed at a corresponding position of each through hole on the upper surface of the heat spreader, Each of the heat-resistant rubber sleeves is cylindrical, and the multiple heat-conducting parts include a heat-conducting round rod and a heat-conducting sheet. The multiple heat-conducting round rods respectively pass tightly through a heat-resistant rubber sleeve and are vertically inserted into the corresponding through holes. A heat-conducting sheet is horizontally fixed to the lower end of each heat-conducting round rod, and the multiple heat-conducting sheets can be spliced ​​into a whole sheet. An insulating rubber head is fixed to the upper end of each heat-conducting round rod. The base is arranged at intervals below the heat spreader. The upper surface of the base is flat and is provided with an insulating layer. The four corners of the lower surface of the heat spreader are fixedly connected to the upper surface of the base through four columns.

[0007] A method for manufacturing a wafer heating device of the present invention comprises the following steps:

[0008] Step 1: prefabricate molds 1, 2 and 3 corresponding to the thin cover plate, the thick main plate and the heat-conducting parts respectively, and pour the liquid raw materials of the same heat-conducting ceramic into the mold cavities of the molds 1, 2 and 3 respectively, and after cooling and forming, remove the molds 1, 2 and 3 to form the thin cover plate, the thick main plate and a plurality of heat-conducting parts, wherein the heat-conducting round rod and the heat-conducting sheet of each heat-conducting part are integrally formed;

[0009] Step 2: Lay a heating resistor wire in the serpentine groove of the thick main board, connect the heating resistor wire to an external power plug through a wire, and then fix the thin cover plate and the thick main board with resin glue;

[0010] Step 3: Fix the heat-resistant rubber sleeve at the corresponding position of each through hole on the upper surface of the heat spreader by using a high-temperature resistant adhesive;

[0011] Step 4: Insert the upper ends of the heat-conducting round rods of the multiple heat-conducting parts from bottom to top through the through holes of the heat spreader and tightly into the corresponding heat-resistant rubber sleeves;

[0012] Step 5: Take the base, grind its upper surface and attach an insulation layer, apply high temperature resistant adhesive on both ends of the four columns, and bond and fix the heat spreader to the base through the four columns. The heat conductive plates of multiple heat conductive parts are located between the heat spreader and the base, and the insulation rubber head is bonded and fixed to the upper end of each heat conductive round rod with a high temperature resistant adhesive.

[0013] Compared with the prior art, the beneficial effects of the present invention are: the heat spreader and the heat conductive part of the present invention have simple and ingenious structures, the heat spreader can evenly heat multiple heat conductive parts, and the multiple heat conductive parts can be moved vertically, the heat conductive sheets of the multiple heat conductive parts can be spliced ​​into a whole sheet, and different numbers of heat conductive parts can be pressed down at different positions according to needs, so as to heat the local position or the whole chip, which is easy to operate and meets different heating needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is an axonometric view of the overall structure of the wafer heating device of the present invention;

[0015] Figure 2 It is an axonometric diagram of the split structure of the heat sink of the present invention;

[0016] Figure 3 is an axonometric view of the heat conducting member of the present invention;

[0017] Figure 4 It is an isometric view of the through hole of the heat spreader of the present invention. DETAILED DESCRIPTION

[0018] The technical solution of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0019] Specific implementation method 1: Figure 1~Figure 4 As shown, the present invention discloses a wafer heating device, including a heat spreader 1, a base 7, a heating resistor 8, four columns 6 and a plurality of heat conducting members, wherein the heat spreader 1 is horizontally arranged and a plurality of through holes are arranged in an array on its plate surface, a serpentine inner cavity is arranged inside the heat spreader 1, the serpentine inner cavity is matched with the plurality of through holes and is staggered, the heating resistor 8 is matched and arranged in the serpentine inner cavity and is powered by an external power supply, a heat-resistant rubber sleeve 2 is fixed at a corresponding position of each through hole on the upper surface of the heat spreader 1, and each of the heat-resistant rubber sleeves 2 is cylindrical, and the multiple heat-conducting parts include heat-conducting round rods 3 and heat-conducting sheets 4. The multiple heat-conducting round rods 3 are respectively tightly passed through a heat-resistant rubber sleeve 2 and vertically inserted into the corresponding through holes. A heat-conducting sheet 4 is horizontally fixed to the lower end of each heat-conducting round rod 3. The multiple heat-conducting sheets 4 can be spliced ​​into a whole sheet. An insulating rubber head 5 is fixed to the upper end of each heat-conducting round rod 3. The base 7 is arranged at intervals below the heat spreader 1. The upper surface of the base 7 is flat and is provided with an insulating layer 7-1. The four corners of the lower surface of the heat spreader 1 are fixedly connected to the upper surface of the base 7 through four columns 6.

[0020] Specific implementation method 2: Figure 1 , 2 As shown, this embodiment is a further explanation of the specific embodiment one, the heat spreader 1 includes a thin cover plate 1-2 and a thick main board 1-1 arranged up and down, the thin cover plate 1-2 and the thick main board 1-1 are respectively provided with a plurality of circular holes 1-3 arranged in an array, the upper surface of the thick main board 1-1 is provided with a serpentine detour groove 1-4, the serpentine detour groove 1-4 is matched with the corresponding plurality of circular holes 1-3 of the thick main board 1-1 and is staggered, the lower surface of the thin cover plate 1-2 is bonded and fixed to the upper surface of the thick main board 1-1 to close the serpentine detour groove 1-4 into a serpentine detour inner cavity, and at the same time, the plurality of circular holes 1-3 of the thin cover plate 1-2 are connected with the plurality of circular holes 1-3 of the thick main board 1-1 to form a plurality of through holes.

[0021] Specific implementation method three: Figure 1 , 2 As shown in , 3, this embodiment is a further description of the specific embodiment 1 or the specific embodiment 2, and the heat spreader 1 and multiple heat conducting parts are all made of the same heat conducting ceramic material.

[0022] Specific implementation method four: Figure 3 As shown, this embodiment is a further description of the specific embodiment 3, and the heat-conducting round rod 3 and the heat-conducting sheet 4 of each heat-conducting member are made into one piece.

[0023] Specific implementation method five: Figure 3 , 4 As shown, this embodiment is a further explanation of the specific embodiment three. The side wall of the heat-conducting round rod 3 of each heat-conducting member is provided with a limit slot 3-1 along its length direction, and a limit strip 9 is fixed to the inner wall of each through hole of the heat spreader 1. The limit strip 9 is arranged in cooperation with the limit slot 3-1, so that the heat-conducting round rod 3 can only slide in the corresponding through hole but cannot rotate.

[0024] Specific implementation method six: Figure 1~Figure 3 As shown, this embodiment discloses a method for manufacturing a wafer heating device according to a specific embodiment 3, and the manufacturing method comprises the following steps:

[0025] Step 1: prefabricate molds 1, 2 and 3 corresponding to the thin cover plate 1-2, the thick main plate 1-1 and the heat-conducting parts, and pour the same kind of liquid raw materials of heat-conducting ceramics into the mold cavities of molds 1, 2 and 3 respectively, and remove molds 1, 2 and 3 after cooling and forming to form the thin cover plate 1-2, the thick main plate 1-1 and a plurality of heat-conducting parts, wherein the heat-conducting round rod 3 and the heat-conducting sheet 4 of each heat-conducting part are integrally formed;

[0026] Step 2: Lay the heating resistor wire 8 in the serpentine groove 1-4 of the thick main board 1-1, connect the heating resistor wire 8 to the external power plug through a wire, and then fix the thin cover plate 1-2 and the thick main board 1-1 with resin glue;

[0027] Step 3: The heat-resistant rubber sleeve 2 is fixed to the corresponding position of each through hole on the upper surface of the heat-vaporizing plate 1 by means of a high-temperature resistant adhesive;

[0028] Step 4: Insert the upper ends of the heat-conducting round rods 3 of the multiple heat-conducting parts from bottom to top through the through holes of the heat-spreading plate 1 and tightly insert them into the corresponding heat-resistant rubber sleeves 2;

[0029] Step 5: Take the base 7, grind its upper surface and attach the insulation layer 7-1, apply high temperature resistant adhesive on both ends of the four columns 6, and bond and fix the heat spreader 1 to the base 7 through the four columns 6. The heat conductive plates 4 of the multiple heat conductive parts are located between the heat spreader 1 and the base 7, and the insulation rubber head 5 is bonded and fixed to the upper end of each heat conductive round rod 3 with a high temperature resistant adhesive.

[0030] When using the present invention, the heating resistor wire 8 is connected to an external power supply to preheat the heat spreader 1, and then the chip is placed at a suitable position on the upper surface of the base 7. By pressing down the insulating rubber heads 5 at different positions, the heat conductive sheets 4 of the heat conductive parts at the corresponding positions are fitted with the chip. The chip can be heated locally or as a whole. The operation is simple and convenient to meet different heating requirements.

[0031] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other forms of assembly without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered in all respects as exemplary and non-restrictive, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations within the meaning and range of equivalents of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0032] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A wafer heating device, characterized in that: The invention comprises a heat spreader (1), a base (7), a heating resistor (8), four columns (6) and a plurality of heat conducting members, wherein the heat spreader (1) comprises a thin cover plate (1-2) and a thick main plate (1-1) arranged above and below, wherein the surfaces of the thin cover plate (1-2) and the thick main plate (1-1) are respectively provided with a plurality of circular holes (1-3) arranged in an array, and the upper surface of the thick main plate (1-1) is provided with a serpentine groove (1-4), wherein the serpentine groove (1-4) and the thick main plate (1-1) correspond to the plurality of circular holes (1-3) The thin cover plate (1-2) and the thick main plate (1-1) are matched and staggered, the lower surface of the thin cover plate (1-2) and the upper surface of the thick main plate (1-1) are bonded and fixed to close the serpentine winding groove (1-4) into a serpentine winding inner cavity, and at the same time, the multiple circular holes (1-3) of the thin cover plate (1-2) and the multiple circular holes (1-3) of the thick main plate (1-1) are connected to form multiple through holes, the heating resistance wire (8) is matched and arranged in the serpentine winding inner cavity and powered by an external power supply, and a heat-resistant rubber sleeve (2) is fixed at a corresponding position of each through hole on the upper surface of the heat spreader (1), and each of the heat-resistant rubber sleeves (2) is fixed to the corresponding position of each through hole on the upper surface of the heat spreader (1). The sleeve (2) is cylindrical, and the plurality of heat-conducting parts each include a heat-conducting round rod (3) and a heat-conducting sheet (4). The plurality of heat-conducting round rods (3) respectively pass closely through a heat-resistant rubber sleeve (2) and are vertically inserted into corresponding through holes. A heat-conducting sheet (4) is horizontally fixed to the lower end of each heat-conducting round rod (3). The plurality of heat-conducting sheets (4) are spliced ​​into a whole sheet. A heat-insulating rubber head (5) is fixed to the upper end of each heat-conducting round rod (3). The base (7) is arranged at intervals below the heat-spreading plate (1). The upper surface of the base (7) is a plane and is provided with an insulating The heat layer (7-1) is provided with a heat spreader (1). The four corners of the lower surface of the heat spreader (1) are fixedly connected to the upper surface of the base (7) through four columns (6). The heat-conducting round rod (3) and the heat-conducting plate (4) of each heat-conducting component are made into one piece. The side wall of the heat-conducting round rod (3) of each heat-conducting component is provided with a limit slot (3-1) along its length direction. A limit strip (9) is fixed to the inner wall of each through hole of the heat spreader (1). The limit strip (9) is matched with the limit slot (3-1) so that the heat-conducting round rod (3) can only slide in the corresponding through hole but cannot rotate.

2. A wafer heating device according to claim 1, characterized in that: The heat spreader (1) and the plurality of heat conducting components are all made of the same heat conducting ceramic material.

3. The method for manufacturing a wafer heating device according to claim 2, characterized in that: The manufacturing method comprises the following steps: Step 1: prefabricate molds 1, 2 and 3 respectively corresponding to the thin cover plate (1-2), the thick main plate (1-1) and the heat-conducting parts, and pour liquid raw materials of the same heat-conducting ceramic into the mold cavities of the molds 1, 2 and 3 respectively, and after cooling and forming, remove the molds 1, 2 and 3 to form the thin cover plate (1-2), the thick main plate (1-1) and a plurality of heat-conducting parts, wherein the heat-conducting round rod (3) and the heat-conducting sheet (4) of each heat-conducting part are integrally formed; Step 2: Lay a heating resistance wire (8) in the serpentine groove (1-4) of the thick main board (1-1), connect the heating resistance wire (8) to an external power plug through a wire, and then fix the thin cover plate (1-2) and the thick main board (1-1) by bonding with resin glue; Step 3: bonding and fixing the heat-resistant rubber sleeve (2) at the corresponding position of each through hole on the upper surface of the heat spreader (1) by means of a high-temperature resistant adhesive; Step 4: Insert the upper ends of the heat-conducting round rods (3) of the plurality of heat-conducting parts from bottom to top through the through holes of the heat-spreading plate (1) and tightly insert them into the corresponding heat-resistant rubber sleeves (2); Step 5: Take the base (7), grind its upper surface and attach an insulating layer (7-1), apply a high temperature resistant adhesive to both ends of the four columns (6), and bond the heat spreader (1) and the base (7) together through the four columns (6). The heat conducting plates (4) of the multiple heat conducting parts are located between the heat spreader (1) and the base (7), and a heat insulating rubber head (5) is bonded and fixed to the upper end of each heat conducting round rod (3) through a high temperature resistant adhesive.

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