A negative pressure structure for chip arrangement machine
By designing a negative pressure structure on the chip stripper and using vertical airflow to increase the friction between the chip and the fixture board, the problem of chip displacement when the robot moves is solved, stable arrangement is achieved and the chip replacement process is simplified.
Patent Information
- Application Number
- CN201811526339.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2018-12-13
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2038-12-13
AI Technical Summary
The existing chip chip strippers can only move in a straight line, which makes it easy for the placement of chips to be displaced due to slight vibration or airflow when moving the material tray, which will destroy the neat arrangement.
Design a negative pressure structure, including a base, fan, fan fixing seat, screen plate and cylinder, generate a negative pressure area through vertical downward airflow, increase the friction between the chip and the fixture board, and stabilize the chip position , and the movable guide plate is used to lift and lower the fixture plate for replacement.
It effectively avoids the damage to the chip arrangement under the influence of external forces, ensures the neat arrangement of the chips, the structure is simple and easy to use, and is suitable for preventing external forces from interfering during chip discharging.
Smart Images
Figure CN109545732B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of automated processing equipment, and in particular to a negative pressure structure for a chip arrangement machine. Background Art
[0002] On the integrated circuit chip arrangement machine, the chips need to be neatly placed on the tray by a robot. Since the robots on many devices do not support movement in a two-dimensional plane and can only support linear movement along the guide rail, the robot alone can only place one row of chips in a straight line. If multiple rows of chips need to be placed, the tray can only be moved.
[0003] In actual operation, since the weight of the chip is too small, even a small external force can cause it to move. When moving the tray, it is easy to cause the placed chips to move due to slight vibrations or airflow, thus destroying the neatness of the entire tray. Therefore, it is necessary to optimize the existing chip arrangement method to avoid affecting the position of the placed chips when moving the tray. Summary of the invention
[0004] In order to solve the above technical problems, the present invention provides a negative pressure structure for a chip arrangement machine.
[0005] The present invention is achieved according to the following technical solutions:
[0006] A negative pressure structure for a chip arrangement machine, the negative pressure structure is installed on the chip arrangement machine and is used to place chips on a chip fixture; the negative pressure mechanism includes a base, multiple sets of fans and a fan fixing seat; the fan fixing seat includes a middle partition, a fan is installed under the middle partition, a circular hole-shaped air duct is formed in the area directly above each fan on the middle partition, and air flow channels are formed on the left and right partitions of the fan fixing seat; a screen plate is fixed on the top of the fan fixing seat; the base is deployed on a movable module; four linear guide sleeves supporting a movable guide plate and a cylinder for pushing the movable guide plate up and down are installed on the base; the fan fixing seat is installed on the movable guide plate.
[0007] Furthermore, the base includes a bottom plate and two side plates; the linear guide sleeve and the cylinder are both installed on the upper surface of the bottom plate; the negative pressure structure is also provided with a jig receiving plate, the four corners of the jig receiving plate are fixed to the top of the side plate, a rectangular vacant area is formed in the middle of the jig receiving plate, and the area on the jig plate for placing the chip is exposed from the vacant area on the jig receiving plate.
[0008] Furthermore, all fans in the negative pressure structure have the same direction of rotation, and the airflow directions they generate are all vertically downward.
[0009] Furthermore, a plurality of circular holes of equal size and arranged in a matrix are formed on the screen plate.
[0010] The advantages and positive effects of the present invention are:
[0011] The present invention is installed on a chip arrangement machine. When the jig plate with neatly arranged chips is moved, a vertical downward airflow can be generated, and a negative pressure area is generated under the chip, so that the chip is subjected to an additional downward pressure, which increases the friction between the chip and the jig plate. When the chip arrangement machine vibrates slightly or is impacted by external airflow, the neatly arranged chips will not be affected by other external forces and their arrangement will not be destroyed. The pressure received by the chip can be adjusted by the size of the wind. In addition, the present invention is also provided with a movable guide plate that can be raised and lowered. When the jig plate is full of chips, the movable guide plate can be lowered to create a gap between the jig receiving plate and the jig supporting plate, so that the new jig plate can be easily taken out and replaced. The present invention has a simple structure and is easy to use. It well avoids the problem that the chip arrangement effect is easily affected by external forces during chip arrangement, and has good application prospects. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 It is a schematic diagram of the structure of the present invention (front direction of the mobile module);
[0013] Figure 2 It is a schematic diagram of the structure of the present invention (side direction of the mobile module);
[0014] Figure 3 It is a schematic diagram of the installation position of the present invention on a chip arrangement machine.
[0015] Among them, 1. Base; 101. Bottom plate; 102. Side plate; 2. Jig plate; 3. Jig support plate; 4. Screen plate; 5. Fan fixing seat; 6. Fan; 7. Movable guide plate; 8. Linear guide sleeve; 9. Cylinder; 10. Moving module; 11. Jig receiving plate; 12. Main machine table; 13. Feed tray; 14. Robot arm. DETAILED DESCRIPTION
[0016] The present invention is described in detail below with reference to the accompanying drawings and embodiments.
[0017] like Figure 1-3 As shown, a negative pressure structure for a chip arrangement machine is installed on the chip arrangement machine for placing chips on a chip fixture; the negative pressure mechanism includes a base 1, multiple sets of fans 6 and a fan fixing seat 5; the fan fixing seat 5 includes a middle partition, and fans 6 are installed under the middle partition. The area directly above each fan 6 on the middle partition forms a circular hole-shaped air duct, and air flow channels are formed on the left and right side partitions of the fan fixing seat 5; a screen plate 4 is fixed on the top of the fan fixing seat 5; the base 1 is deployed on the movable module 10; four linear guide sleeves 8 supporting the movable guide plate 7 and a cylinder 9 for pushing the movable guide plate 7 up and down are installed on the base 1; the fan fixing seat 5 is installed on the movable guide plate 7.
[0018] The base 1 includes a bottom plate 101 and two side plates 102; the linear guide sleeve 8 and the cylinder 9 are both installed on the upper surface of the bottom plate 101; the negative pressure structure is also provided with a jig receiving plate 11, the four corners of the jig receiving plate 11 are fixed to the top of the side plate 102, and a rectangular vacant area is formed in the middle of the jig receiving plate 11, and the area on the jig plate 2 for placing the chip is exposed in the vacant area on the jig receiving plate 11.
[0019] All fans 5 in the negative pressure structure have the same direction of rotation, and the airflow directions they generate are all vertically downward.
[0020] The screen plate 4 is formed with a plurality of circular holes of equal size and arranged in a matrix.
[0021] like Figure 3 As shown, the present invention is installed in the middle of the main stage 12 of the chip arrangement machine. The main stage is also provided with a manipulator 14 and a main bracket. The main bracket is provided with a track. The manipulator 14 moves left and right along the track and can extend a suction nozzle in the vertical direction to suck the chip or put down the sucked chip. Feed trays 13 are provided on both sides of the fixture plate 2. When two manipulators are provided on the main bracket and work together, the material is fed from the left and right sides. When there is only one manipulator, only one of the feed trays can be used for feeding.
[0022] The manipulator 14 first moves to the top of the feed tray 13, fine-tunes it to align with a target chip in the vertical direction, then extends the suction nozzle downward and presses it on the upper surface of the chip; the suction nozzle is a suction cup structure, and a negative pressure device is connected to the tail. When the negative pressure device is activated, the suction nozzle will suck the chip. Lift the manipulator, move it to the top of the fixture support plate 3, fine-tune it to the set target position and put it down, close the negative pressure mechanism connected to the suction nozzle, and then put down the chip, so that the chip is moved from the feed tray 13 to the fixture plate 3. Repeat the above process to arrange the chips on the fixture plate 3.
[0023] Before the chip arrangement starts, the fan 6 is turned on to generate airflow, so that the airflow below the jig plate 3 passes through the sieve plate 4 vertically downward, resulting in negative pressure below the jig plate. The sieve plate 4 can make the negative pressure area evenly distributed below the jig plate 3. The uniform negative pressure is equivalent to applying an additional downward pressure above the chip on the jig plate 2, so that the chip fits more closely with the jig plate 2 and is not easy to move.
[0024] Since the robot 14 can only move along the guide rail in the horizontal direction but cannot move in the direction perpendicular to the guide rail, after a row of chips is fully arranged along the guide rail, the moving module 10 needs to drive the entire negative pressure mechanism and the fixture plate 2 to move in the direction perpendicular to the guide rail, so that the robot 14 can arrange the next row of chips, and so on, until the entire fixture plate 2 is full.
[0025] When the jig plate is full of chips, start the cylinder 9 to move the movable guide plate 7 downward, so that all parts between the jig plate 2 and the movable guide plate move downward, so that a gap is generated between the jig receiving plate 11 and the jig supporting plate 3, which is convenient for taking out and replacing a new jig plate 2.
Claims
1. A negative pressure structure for a chip arrangement machine, wherein the negative pressure structure is installed on the chip arrangement machine and is used to place chips on a chip fixture; characterized in that: The negative pressure structure comprises a base (1), a plurality of sets of fans (6) and a fan fixing seat (5); the fan fixing seat (5) comprises a middle partition, a fan (6) is installed below the middle partition, a circular hole-shaped air duct is formed in the area directly above each fan (6) on the middle partition, and air flow channels are formed on the left and right partitions of the fan fixing seat (5); a screen plate (4) is fixed on the top of the fan fixing seat (5); the base (1) is deployed on the movable module (10); four linear guide sleeves (8) supporting the movable guide plate (7) and a cylinder (9) for pushing the movable guide plate (7) to move up and down are installed on the base (1); the fan fixing seat (5) is installed on the movable guide plate (7); The base (1) comprises a bottom plate (101) and two side plates (102); the linear guide sleeve (8) and the cylinder (9) are both mounted on the upper surface of the bottom plate (101); the negative pressure structure is also provided with a jig receiving plate (11), the four corners of the jig receiving plate (11) are fixed to the top of the side plates (102), a rectangular vacant area is formed in the middle of the jig receiving plate (11), and an area on the jig plate (2) for placing chips is exposed in the vacant area on the jig receiving plate (11); All fans (6) in the negative pressure structure have the same direction of rotation, and the airflow directions they generate are all vertically downward; The screen plate (4) is formed with a plurality of circular holes of equal size and arranged in a matrix.