A multi-layer embedded computer protection case
An embedded computer and chassis technology, applied in the computer field, can solve the problems of loose parts, low heat dissipation efficiency, no buffer structure, etc., and achieve the effect of avoiding looseness, avoiding work failure, and high efficiency
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Publication Date
- 2020-07-03
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Abstract
Description
Technical field
[0001] The present invention relates to the field of computer technology, in particular to a multi-layer embedded computer protection case. Background technique
[0002] Computers are divided into desktop computers and portable computers (i.e. notebook computers). Desktop computers are usually equipped with larger mainframes, which are equipped with important working parts such as motherboards, CPUs and graphics cards. Therefore, it is usually necessary to use a case to protect the computer mainframe. , To avoid man-made damage to internal parts and high temperature damage during work;
[0003] 1. Most of the existing chassis adopt air-cooled heat dissipation. This kind of heat dissipation efficiency is low and cannot take away the temperature generated by the motherboard, CPU and graphics card in time, which makes the motherboard, CPU and graphics card vulnerable to high temperature damage, which makes the computer easy to appear Work failure
[0004] 2. Most of th...
Examples
Embodiment Construction
[0023] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
[0024] See Figure 1-6 , The present invention provides a technical solution: a multi-layer embedded computer protection chassis, including a protective outer box 1, a storage slot 10 and a heat conduction device 17, the protective outer box 1 is installed with a micro water pump 2 and protects A first water tank 3 is reserved inside the outer tank 1, and a water delivery pipe 4 is installed on the left side of the first water tank 3, an...