Power conversion device

Abstract

This case is about a power conversion device. It includes a shell, a mainboard, an electromagnetic filter board, a signal board and a heat dissipation module. The shell includes a first heat dissipation wall and a coolant flow channel. The mainboard is structured on the shell. The mainboard includes a first surface and a first power device. The first surface faces the shell. The heat dissipation module includes a first insulating heat conductive sheet and a first elastic clamp. The first insulating heat conductive sheet is attached to the corresponding first heat dissipation wall. When the first surface of the mainboard tends toward the shell and the first power device is clamped in the accommodating space, the first elastic clamp presses the first power device to fit the first insulating heat conductive sheet, so that the first power device is thermally coupled with the first heat dissipation wall and the coolant flow channel through the first insulating heat conductive sheet.

Description

Technical Field

[0001] The present invention relates to a power supply device, and more particularly to a high power density power conversion device. Background Art

[0002] On Board Charge Module (OBCM) refers to a power conversion device installed on an electric vehicle to charge the onboard battery pack through the ground AC power grid. When charging, the user can directly plug the AC power cable into the socket of the electric vehicle to charge the electric vehicle. This type of power conversion device includes at least a power conversion module and a base shell, etc. The power conversion module is used to convert the external power supply into AC / DC power of various voltage levels used in the car. When the power conversion module is in operation, a large amount of heat will be generated. The base shell provides a heat dissipation design to dissipate the heat generated by the power conversion module to avoid affecting the overall performance of the power conversion module due to heat accumulation. However, the current design of the power conversion module and the corresponding heat dissipation design provided by the base shell are not good, resulting in a relatively large overall volume of the on-board charging module and a low power density.

[0003] Therefore, how to develop a power conversion device to solve the problems faced by the prior art is indeed a topic that needs to be solved urgently in the art. Summary of the invention

[0004] The purpose of this case is to provide a power conversion device, which optimizes the layout of each component to make its assembly and fixation simple and reliable, while enhancing the heat dissipation capacity of each component, reducing the overall volume of the power conversion device and improving the overall power density of the power conversion device.

[0005] Another purpose of the present invention is to provide a power conversion device. The power device on the mainboard is fixed and attached to the heat dissipation surface of the shell through a heat-conducting and insulating heat dissipation module, and each component is arranged between the mainboard and the shell and accommodated in the housing groove of the shell. The heat dissipation surface and the housing groove of the shell are thermally coupled to the coolant flow channel of the shell at the same time, so as to reduce the interface thermal resistance and simplify the assembly structure, thereby achieving the purpose of reducing costs and improving the reliability and heat dissipation capacity of the power conversion device.

[0006] To achieve the above-mentioned purpose, the present invention provides a power conversion device. It includes a housing, a mainboard, an electromagnetic filter board, a signal board and a heat dissipation module. The housing includes at least one first heat dissipation wall and a coolant flow channel, wherein the first heat dissipation wall is thermally coupled to the coolant flow channel. The mainboard is structured on the housing, wherein the mainboard includes a first surface and at least one first power device, wherein the first surface faces the housing, the first power device is arranged on the mainboard, and includes a first surface and a second surface. The electromagnetic filter board is structured on the housing and electrically connected to the mainboard. The signal board is structured on the housing and electrically connected to the mainboard. The heat dissipation module includes at least one first insulating heat conductive sheet and at least one first elastic clip, wherein the first insulating heat conductive sheet is attached to the corresponding first heat dissipation wall, and the first elastic clip is fixed to the shell and relative to the first insulating heat conductive sheet so that the first elastic clip and the first insulating heat conductive sheet structure form a accommodating space. When the first surface of the mainboard tends toward the shell and the first power device is clamped in the accommodating space between the first elastic clip and the first insulating heat conductive sheet, the first elastic clip presses against the first surface of the first power device, and the second surface of the first power device is attached to the first insulating heat conductive sheet, so that the first power device is thermally coupled to the first heat dissipation wall and the coolant flow channel through the first insulating heat conductive sheet. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 is a structural exploded view of a power conversion device according to a first preferred embodiment of the present invention;

[0008] Figure 2 is a partial structural exploded view of a power conversion device according to a first preferred embodiment of the present invention;

[0009] Figure 3 is a partial structural exploded view of the power conversion device of the first preferred embodiment of the present invention from another perspective;

[0010] Figure 4 It is a cooling liquid flow channel configuration diagram that discloses the first preferred embodiment of the present case;

[0011] Figure 5 is a circuit block diagram of a power conversion device according to a first preferred embodiment of the present invention;

[0012] Figures 6 to 9 It is a schematic diagram of the structure of the power conversion device in different assembly stages according to the first preferred embodiment of the present invention.

[0013]

Explanation of symbols

[0014] 1: Power conversion device

[0015] 10: Shell

[0016] 11: The first heat dissipation wall

[0017] 12: Coolant channel

[0018] 12a: Liquid inlet tube

[0019] 12c, 12d, 12f: Channel

[0020] 12b, 12e: Narrow side

[0021] 12g: Liquid output tube

[0022] 13: First receiving groove

[0023] 14: Second storage tank

[0024] 15: Second heat dissipation wall

[0025] 16: Power input terminal

[0026] 17: Power output terminal

[0027] 18: Signal transmission end

[0028] 19: Bottom cover

[0029] 20: Motherboard

[0030] 21: First Surface

[0031] 22: Second Surface

[0032] 23: The first power device

[0033] 23a: Side 1

[0034] 23b: Side 2

[0035] 24: Transformer module

[0036] 25: Second power device

[0037] 25a: Side 1

[0038] 25b: Side 2

[0039] 27: Power factor correction circuit

[0040] 28: Isolated DC / DC Converter

[0041] 29: High voltage DC electromagnetic filter circuit

[0042] 30: Heat dissipation module

[0043] 31: The first insulating thermal conductive sheet

[0044] 32: First elastic clip

[0045] 33: Accommodation space

[0046] 34: Second insulating thermal conductive sheet

[0047] 35: Second elastic clip

[0048] 36: Thermal conductive adhesive

[0049] 40: Electromagnetic filter board

[0050] 50: Signal board

[0051] 60: Outer cover

[0052] L1: First side

[0053] L2: Second side DETAILED DESCRIPTION

[0054] Some typical embodiments that embody the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various variations in different aspects without departing from the scope of the present invention, and the descriptions and illustrations therein are essentially for illustrative purposes rather than for limiting the present invention.

[0055] Figure 1 It is a structural exploded view of the power conversion device according to the first preferred embodiment of the present invention. Figure 2 It is a partial structural exploded view of the power conversion device of the first preferred embodiment of the present invention. Figure 3 This is a partial structural exploded view of the power conversion device of the first preferred embodiment of the present invention from another perspective. Figures 1 to 3As shown, the power conversion device 1 of the present case includes a housing 10, a mainboard 20, an electromagnetic filter board 40, a signal board 50 and a heat dissipation module 30. The housing 10 includes at least one first heat dissipation wall 11 and a coolant flow channel 12, wherein the first heat dissipation wall 11 is thermally coupled to the coolant flow channel 12. The mainboard 20 is structured on the housing 10. The mainboard 20 includes a first surface 21, a second surface 22 and at least one first power device 23, wherein the first surface 21 faces the housing 10, the first power device 23 is arranged on the first surface 21, and includes a first surface 23a and a second surface 23b. The electromagnetic filter board 40 is arranged between the first surface 21 of the mainboard 20 and the housing 10, and is electrically connected to the mainboard 20. The signal board 50 is arranged between the first surface 21 of the mainboard 20 and the housing 10, and is electrically connected to the mainboard 20. The heat dissipation module 30 includes at least one first insulating heat conductive sheet 31 and at least one first elastic clip 32. The first insulating heat conductive sheet 31 may be, for example, but not limited to, a direct bond copper (DBC) ceramic substrate. The first insulating heat conductive sheet 31 is attached to the corresponding first heat dissipation wall 11, and the first elastic clip 32 is fixed to the housing 10 and relative to the first insulating heat conductive sheet 31, so that the first elastic clip 32 and the first insulating heat conductive sheet 31 form a receiving space 33. When the first surface 21 of the mainboard 20 approaches the housing 10 and the first power device 23 is clamped in the receiving space 33 between the first elastic clip 32 and the first insulating heat conductive sheet 31, the first elastic clip 32 presses against the first surface 23a of the first power device 23, and the second surface 23b of the first power device 23 is attached to the first insulating heat conductive sheet 31, so that the first power device 23 is thermally coupled with the first heat dissipation wall 11 and the coolant channel 12 through the first insulating heat conductive sheet 31. It should be emphasized that the style of the first elastic clip 32 pressing against the first surface 23a of the first power device 23 and the order of assembly in the housing 10, or the number of first power devices 23 corresponding to each first elastic clip 32, etc. can be adjusted according to actual needs, but this is not a necessary feature of the technology of the present case. Any elastic clip that can form a accommodating space 33 relative to the first heat dissipation wall 11 and maintain elastic force can be applied to the present case, and the present case is not limited thereto. It is also worth noting that in other embodiments, the first power device 23 can be set on the second surface 22 of the mainboard 20, and the mainboard 20, the electromagnetic filter board 40 and the signal board 50 are jointly structured in the housing 10.When the first surface 21 of the mainboard 20 is directed toward the housing 10, the mainboard 20, the electromagnetic filter board 40, the signal board 50 and the first power device 23 are accommodated in the housing 10, and when the first power device 23 on the second surface 22 is clamped in the accommodation space 33 between the first elastic clamp 32 and the first insulating heat conductive sheet 31, the first elastic clamp 32 presses against the first surface 23a of the first power device 23, and the second surface 23b of the first power device 23 is attached to the first insulating heat conductive sheet 31, so that the first power device 23 is thermally coupled with the first heat dissipation wall 11 and the coolant flow channel 12 through the first insulating heat conductive sheet 31. Therefore, the position of the first power device 23 on the mainboard 20 can also be adjusted according to the actual application requirements. The present case is not limited to the aforementioned implementation and will not be repeated. In the above embodiment, the mainboard 20 can be composed of one circuit board or multiple circuit boards.

[0056] Specifically, the first heat dissipation wall 11 of the present case can be arranged at any position on the housing 2 that can be thermally coupled with the coolant flow channel 12 according to actual application requirements, and in this embodiment, it is more preferably arranged adjacent to the peripheral side of the housing 10. Furthermore, the first power device 23 can be, for example, but not limited to, arranged vertically relative to the mainboard 20 and inserted on the first surface 21 of the mainboard 20, and is preferably arranged adjacent to the peripheral side of the mainboard 20. On the other hand, the first insulating heat conductive sheet 31 can be pre-bonded to the corresponding first heat dissipation wall 11 by, for example, but not limited to, a thermally conductive adhesive (not shown), and the first elastic clip 32 can be pre-fixed to the housing 10 by, for example, but not limited to, a bolt, so that the first elastic clip 32 and the first insulating heat conductive sheet 31 form the required accommodation space 33 to accommodate and clamp the first power device 23 later. In one embodiment, the first power device 23 can be bonded to the first insulating heat conductive sheet 31 by, for example, but not limited to, a thermally conductive adhesive (not shown). It is worth noting that, since the heat dissipation module 30 is arranged on the peripheral side of the housing 10 relative to the first heat dissipation wall 11, and the first power device 23 is arranged adjacent to the peripheral side of the mainboard 20, the first elastic clip 32 can be fixed on the housing 10 in advance or after the mainboard 20 is arranged on the housing 10, the first elastic clip 32 can be locked to the housing 10 by, for example but not limited to, a bolt, so that the first elastic clip 32 presses against the first surface 23a of the first power device 23, and the second surface 23b of the first power device 23 is attached to the first insulating heat conductive sheet 31, so that the first power device 23 is accommodated and clamped in the accommodation space 33, and the first power device 23 is thermally coupled with the first heat dissipation wall 11 and the coolant flow channel 12 through the first insulating heat conductive sheet 31. In addition, the power conversion device 1 also includes an outer cover 60, which is arranged on the housing 10 and the mainboard 20, and covers the second surface 22 of the mainboard 20, so as to protect the power conversion device 1.

[0057] On the other hand, in this embodiment, the power conversion device 1 is further structured as a unidirectional power conversion device for converting an AC power source into a high-voltage DC power source. In addition to the aforementioned electromagnetic filter board 40 and the signal board 50 electrically connected to the mainboard 20, the mainboard 20 also includes a transformer module 24 and at least one second power device 25 to structure the power conversion device 1 as a unidirectional power conversion device. The transformer module 24 and the second power device 25 are disposed on the first surface 21 of the mainboard 20, and the second power device 25 is disposed flat relative to the mainboard 20. On the other hand, in order to enable the power conversion device 1 to achieve a high power density and high heat dissipation efficiency structure at the same time, the housing 10 also includes a second heat dissipation wall 15, a first accommodating groove 13 and a second accommodating groove 14, wherein the second heat dissipation wall 15, the first accommodating groove 13, the second accommodating groove 14 are thermally coupled to the coolant flow channel 12 in the same manner as the aforementioned first heat dissipation wall 11. The heat dissipation module 30 further includes at least one second insulating heat conductive sheet 34 and at least one second elastic clip 35. The second insulating heat conductive sheet 34 is attached to the corresponding second heat dissipation wall 15. The second elastic clip 35 is disposed between the first surface 21 of the mainboard 20 and the first surface 25a of the second power device 25. When the mainboard 20 is mounted on the housing 10, the second surface 23b of the first power device 23 and the second surface 25b of the second power device 25 are thermally coupled to the first heat dissipation wall 11 and the second heat dissipation wall 15 of the housing 10 through the first insulating heat conductive sheet 31 and the second insulating heat conductive sheet 34 of the heat dissipation module 30, respectively. In addition, in the present embodiment, the transformer module 24 is further accommodated in the first accommodation groove 13, while the electromagnetic filter board 40 and the signal board 50 are accommodated in the second accommodation groove 14. Since the first receiving groove 13 and the second receiving groove 14 are thermally coupled to the cooling liquid flow channel 12, the heat generated by the transformer module 24 and the electromagnetic filter board 40 can be conducted to the cooling liquid flow channel 12 through the first receiving groove 13 and the second receiving groove 14 to dissipate. In one embodiment, when the transformer module 24, the electromagnetic filter board 40 and the signal board 50 are respectively accommodated in the first receiving groove 13 and the second receiving groove 14, an insulating thermal conductive adhesive (not shown) such as but not limited to can be added to the first receiving groove 13 and the second receiving groove 14 to enhance the efficiency of the transformer module 24 and the electromagnetic filter board 40 being thermally coupled to the cooling liquid flow channel 12 through the first receiving groove 13 and the second receiving groove 14. In this embodiment, the second receiving groove 14 is arranged around the three adjacent side walls of the first receiving groove 13. The first heat dissipation wall 11 is arranged on the peripheral side of the housing 10 and is adjacent to a side wall of the first receiving groove 13 or a side wall of the second receiving groove 14. The second heat dissipation wall 15 is disposed on the top surface of the other opposite side wall of the first heat dissipation wall 11 and the side wall adjacent to the first receiving groove 13 .When the first surface 21 of the mainboard 20 faces the housing 10 and is structured on the housing 10, the first power device 23 in the power conversion device 1 is thermally coupled to the first heat dissipation wall 11 through the first insulating heat conductive sheet 31, the transformer module 24 is accommodated and thermally coupled to the first accommodation groove 13, and the second power device 25 is thermally coupled to the second heat dissipation wall 15 through the second insulating heat conductive sheet 34. The first power device 23 and the second power device 25 can be respectively structured as a combination of a secondary side power device and a primary side power device. Since the first heat dissipation wall 11 and the second heat dissipation wall 15 corresponding to the first power device 23 and the second power device 25 are respectively adjacent to the opposite side walls of the first accommodation groove 13, the first power device 23 and the second power device 25 can be adjacent to the transformer module 24, so that the power conversion device 1 is structured as a unidirectional power conversion device with high power density. In addition, the electromagnetic filter board 40 and the signal board 50 electrically connected to the mainboard 20 are further accommodated in the second accommodation groove 14. Thus, the first power device 23, the second power device 25, the transformer module 24, the electromagnetic filter board 40 and the signal board 50 can be simply and reliably assembled and fixed between the housing 10 and the main board 20, while enhancing the heat dissipation capacity of the first power device 23, the second power device 25, the transformer module 24 and the electromagnetic filter board 40, reducing the overall volume of the power conversion device 1 and improving the overall power density of the power conversion device. In this embodiment, the coolant flow channel 12 of the housing 10 is formed on the other opposite surface relative to the first heat dissipation wall 11, the second heat dissipation wall 15, the first accommodating groove 13 and the second accommodating groove 14, and can include at least one channel 12c, 12d, 12f and at least one narrow surface 12b, 12e, and is covered with a bottom cover 19. The bottom cover 19 can be fastened to the housing 10 by bolts, for example, but not limited to bolts, to form the coolant flow channel 12. The housing 10 further includes a liquid input pipe 12 a and a liquid output pipe 12 g , and the liquid input pipe 12 a is connected to the liquid output pipe 12 g through the cooling liquid channel 12 . Figure 4 1 is a diagram showing the configuration of the cooling liquid flow channel in the first preferred embodiment of the present invention. Figure 2 , Figure 3 as well as Figure 4As shown, in this embodiment, the cooling liquid flow channel 12 includes, for example, three channels 12c, 12d, and 12f and two narrow surfaces 12b and 12e. The channels 12c and 12f are thermally coupled to the first heat dissipation wall 11, the channel 12d is thermally coupled to the second heat dissipation wall 15, and the channels 12c and 12d are thermally coupled to two opposite side walls of the first receiving groove 13. On the other hand, the narrow surface 12b and the narrow surface 12e are thermally coupled to the first receiving groove 13 and the second receiving groove 14, respectively. The liquid input pipe 12a is connected to the liquid output pipe 12g through the narrow surface 12b, the channel 12c, the channel 12d, the narrow surface 12e and the channel 12f of the cooling liquid flow channel 12, whereby the cooling liquid flow channel 12 can effectively take away the heat generated by the first power device 23 thermally coupled to the first heat dissipation wall 11 through the first insulating heat conductive sheet 31, the second power device 25 thermally coupled to the second heat dissipation wall 15 through the second insulating heat conductive sheet 34, the transformer module 24 thermally coupled to the first receiving groove 13 and the electromagnetic filter board 40 thermally coupled to the second receiving groove 14, thereby improving the heat dissipation capacity of the power conversion device. Of course, the layout of the cooling liquid flow channel 12 of the housing 10 relative to the first heat dissipation wall 11, the second heat dissipation wall 15, the first receiving groove 13 and the second receiving groove 14 can be adjusted and changed according to actual needs, and the present case is not limited thereto and will not be described in detail. It is also worth noting that in other embodiments, the first power device 23 is an integrated power module, and the second power device 25 is an integrated power module, which can simplify the assembly structure of the power conversion device 1 and reduce the cost.

[0058] It is worth noting that in this embodiment, when the power conversion device 1 is structured as a unidirectional power conversion device for converting an AC power source into a high-voltage DC power source, the assembly structure of the power conversion device 1 also includes a power input terminal 16, a power output terminal 17 and a signal transmission terminal 18, which can be, for example, arranged on a first side L1 of the shell 10 and relative to the second side L2 where the liquid input pipe 12a and the liquid output pipe 12g are arranged. Figure 5 : is a circuit block diagram of the power conversion device of the first preferred embodiment of the present case. In order to realize a unidirectional power conversion device, the first power device 23, the second power device 25 and the transformer module 24 on the mainboard 20 are further configured with other electronic components to form, for example, a power factor correction circuit 27, an isolated DC / DC converter 28 and a high-voltage DC electromagnetic filter circuit 29. The electromagnetic filter board 40 electrically connected to the mainboard 20 can be configured as, for example, an AC electromagnetic filter board. In addition, the signal board 50 electrically connected to the mainboard 20 can be configured as, for example, a low-voltage signal board. See Figure 3 as well as Figure 5When the power conversion device performs power conversion, an input AC power source can first be transmitted to the AC electromagnetic filter board of the electromagnetic filter board 40 through the power input terminal 16, and then transmitted to the power factor correction circuit 27 of the main board 20, and then output through the power output terminal 17 after being converted and processed by the main board 20 into a high-voltage DC power source. On the other hand, when the power conversion device performs signal processing, the input signal is transmitted to the low-voltage signal board of the signal board 50 through the signal transmission terminal 18, and then output through the signal board 50 and the signal transmission terminal 18 after passing through the primary side and the secondary side of the first power device 23 and the second power device 25 on the main board 20. It is worth noting that the electromagnetic filter board 40 and the signal board 50 accommodated in the second accommodation groove 14 of the housing 10, in this embodiment, in response to the aforementioned power conversion and signal processing requirements, the electromagnetic filter board 40 and the signal board 50 are adjacent to the first side L1 where the power input terminal 16 and the signal transmission terminal 18 are located, reducing the distance from the power input terminal 16 to the electromagnetic filter board 40 and the distance from the signal transmission terminal 18 to the signal board 50, thereby improving the power efficiency of the power conversion device 1. Of course, the layout of the power input terminal 16, the power output terminal 17 and the signal transmission terminal 18 relative to the electromagnetic filter board 40 and the signal board 50 can also be adjusted according to actual needs, and the present case is not limited to the aforementioned embodiment.

[0059] Specifically, the power conversion device 1 can optimize the layout of each component to achieve unidirectional power conversion, making its assembly and fixation simple and reliable, while enhancing the heat dissipation capacity of each component, reducing the overall volume of the power conversion device and improving the overall power density of the power conversion device. Figures 6 to 9 1 is a schematic diagram showing the structure of the power conversion device of the first preferred embodiment of the present invention at different assembly stages. Figure 6 As shown, in this embodiment, the housing 10 includes at least a first heat dissipation wall 11, a coolant flow channel 12 (see Figure 2 ), the first accommodating groove 13, the second accommodating groove 14, the second heat dissipation wall 15 (see Figure 1), power input terminal 16, power output terminal 17, signal transmission terminal 18, liquid input pipe 12a and liquid output pipe 12g. The power input terminal 16, power output terminal 17 and signal transmission terminal 18 are disposed on the first side L1 of the housing 10. The liquid input pipe 12a and liquid output pipe 12g are disposed on the second side L2 opposite to the first side L1. The coolant flow channel 12 is disposed on an opposite bottom surface relative to the first heat dissipation wall 11, the first receiving groove 13, the second receiving groove 14 and the second heat dissipation wall 15 to be thermally coupled to the first heat dissipation wall 11, the first receiving groove 13, the second receiving groove 14 and the second heat dissipation wall 15. The first insulating heat conductive sheet 31 and the second insulating heat conductive sheet 34 of the heat dissipation module 30 may be, for example but not limited to, a direct bond copper (DBC) ceramic substrate, and are respectively pre-bonded to the corresponding first heat dissipation wall 11 and the second heat dissipation wall 15 by, for example but not limited to, a thermal conductive adhesive 36.

[0060] In this embodiment, the first elastic clip 32 of the heat dissipation module 30 is pre-fixed on the housing 10 by, for example, but not limited to, a bolt, so that the required accommodation space 33 is formed between the first elastic clip 32 and the first insulating heat conductive sheet 31, so as to accommodate and clamp the first power device 23 thereafter. However, the order in which the first elastic clip 32 is fixed to the housing 10 is not a necessary technical feature limiting the present invention. In one embodiment, after the first elastic clip 32 is placed adjacent to the first insulating heat conductive sheet 31 on the second surface 23b of the first power device 23, the first elastic clip 32 is locked to the housing 10, so that the first elastic clip 32 is pressed against the first surface 23a of the first power device 23, and the second surface 23b of the first power device 23 is attached to the first insulating heat conductive sheet 31, so that the first power device 23 is accommodated and clamped in the accommodation space 33, and the first power device 23 is thermally coupled to the first heat dissipation wall 11 and the coolant flow channel 12 through the first insulating heat conductive sheet 31. On the other hand, the transformer module 24 electrically connected to the mainboard 20 may also be pre-accommodated in the first accommodating groove 13. In the present embodiment, when the transformer module 24 is accommodated in the first accommodating groove 13, a material such as but not limited to an insulating thermal conductive adhesive (not shown) may be added into the first accommodating groove 13 to enhance the efficiency of thermally coupling the transformer module 24 to the coolant channel 12 through the first accommodating groove 13.

[0061] Then, if Figure 7As shown, the electromagnetic filter board 40 and the signal board 50 connected to the main board 20 can also be pre-accommodated in the second accommodating groove 14. Similarly, in this embodiment, when the electromagnetic filter board 40 and the signal board 50 are accommodated in the second accommodating groove 14, a material such as but not limited to an insulating thermal conductive adhesive (not shown) can also be added into the second accommodating groove 14 to enhance the efficiency of the electromagnetic filter board 40 and the signal board 50 being thermally coupled to the cooling liquid flow channel 12 through the second accommodating groove 14. It is worth noting that since the power conversion device 1 of the present case can be, for example, structured as a unidirectional power conversion device, in response to the aforementioned power conversion and signal processing requirements, when the electromagnetic filter board 40 and the signal board 50 are accommodated in the second accommodating groove 14, the electromagnetic filter board 40 and the signal board 50 can be respectively arranged adjacent to the first side L1 where the power input terminal 16 and the signal transmission terminal 18 are located, reducing the distance from the power input terminal 16 to the electromagnetic filter board 40 and the distance from the signal transmission terminal 18 to the signal board 50, thereby improving the power density of the assembly structure of the power conversion device 1.

[0062] Then, if Figure 8 As shown, when the first surface 21 of the mainboard 20 approaches the housing 10, the first power device 23 and the second power device 25 on the mainboard 20 correspond to the first heat dissipation wall 11 and the second heat dissipation wall 15 respectively, and the mainboard 20 is fixed to the housing 10 by, for example but not limited to, a bolt. In this embodiment, the second elastic clip 35 (see Figure 2 ) can be, for example, disposed between the first surface 21 of the mainboard 20 and the first surface 25a of the second power device 25. When the first surface 21 of the mainboard 20 approaches the housing 10, the second elastic clip 35 presses against the first surface 25a of the second power device 25, and the second surface 25b of the second power device 25 adheres to the second insulating heat conductive sheet 34, so that the second power device 25 is thermally coupled with the second heat dissipation wall 15 and the coolant flow channel 12 through the second insulating heat conductive sheet 34. In addition, if the first elastic clip 32 is pre-fixed to the housing 10 and forms an accommodation space 33 with the first insulating heat conductive sheet 31, then when the first surface 21 of the mainboard 20 approaches the housing 10, the first power device 23 is inserted into the accommodation space 33, so that the first elastic clip 32 presses against the first surface 23a of the first power device 23, and the second surface 23b of the first power device 23 adheres to the first insulating heat conductive sheet 31, so that the first power device 23 is thermally coupled with the first heat dissipation wall 11 and the coolant flow channel 12 through the first insulating heat conductive sheet 31. The assembled power conversion device 1 is as follows Fig. 9 shown.

[0063] It is worth noting that in this embodiment, the first elastic clip 32 of the heat dissipation module 30 is arranged on the peripheral side of the housing 10 relative to the first heat dissipation wall 11, and the first power device 23 is arranged adjacent to the peripheral side of the mainboard 20. The first elastic clip 32 can be assembled and arranged on the housing 10 by, for example but not limited to, a bolt and then locked to the housing 10, so that the first elastic clip 32 is pressed against the first surface 23a of the first power device 23, and the second surface 23b of the first power device 23 is attached to the first insulating heat conductive sheet 31, so that the first power device 23 is thermally coupled with the first heat dissipation wall 11 and the coolant flow channel 12 through the first insulating heat conductive sheet 31. Of course, the first elastic clip 32 can also be pre-arranged on the peripheral side of the housing 10, and after the mainboard 20 is arranged on the housing 10, the elastic force of the first elastic clip 32 pressing against the first surface 23a of the first power device 23 is adjusted. It should be emphasized that the pattern of the first elastic clip 32 pressing against the first surface 23a of the first power device 23 and the order of assembling it in the housing 10 can be adjusted according to actual needs, but this is not a necessary feature to limit the technology of this case. Any elastic clip that can form a receiving space 33 relative to the first heat dissipation wall 11 and maintain elastic force can be applied to the assembly structure of this case, and this case is not limited to this. In this embodiment, the power conversion device 1 may further include an outer cover 60 (see Figure 1 ), which is disposed on the housing 10 and the mainboard 20 and covers the second surface 22 of the mainboard 20 to protect the power conversion device 1.

[0064] Specifically, in the present embodiment, when the structure of the power conversion device 1 is, for example, a unidirectional power conversion device, the main heat generating components that perform the unidirectional conversion of AC power into high-voltage DC power, such as the first power device 23, the second power device 25 and the transformer module 24 on the mainboard 20 in the present embodiment, and the electromagnetic filter board 40 are all thermally coupled to the coolant channel 12 of the housing 10 at the shortest distance. Among them, for the first power device 23 and the second power device 25 that generate a large amount of heat, the first heat dissipation wall 11 and the second heat dissipation wall 15 that are thermally coupled to the housing 10 are further thermally coupled through a ceramic substrate such as a direct bond copper (DBC) substrate to reduce the interface thermal resistance. More preferably, the second surface 23b of the first power device 23 and the first insulating heat conductive sheet 31, the first insulating heat conductive sheet 31 and the first heat dissipation wall 11, the second surface 25b of the second power device 25 and the second insulating heat conductive sheet 34, and the second insulating heat conductive sheet 34 and the second heat dissipation wall 15 can be thermally coupled through, for example but not limited to, a thermally conductive adhesive 36 (see Figure 6) and other thermal interface materials to further reduce the interfacial thermal resistance in the heat dissipation path. On the other hand, a material such as but not limited to insulating thermal conductive glue (not shown) may be added to the first receiving groove 13 and the second receiving groove 14 that accommodate the transformer module 24, the electromagnetic filter board 40 and the signal board 50 to enhance the efficiency of thermally coupling the transformer module 24 and the electromagnetic filter board 40 to the coolant channel 12. It is worth noting that in addition to considering the shortest distance to thermally couple the main heat generating components to the coolant channel 12, the position layout of the first heat dissipation wall 11, the second heat dissipation wall 15, the first receiving groove 13 and the second receiving groove 14 of the power conversion device 1 in the present case also considers the electrical connection relationship between each main component. For example, in the embodiment, the first power device 23 and the second power device 25 are respectively structured as a secondary side power device and a primary side power device required to perform unidirectional power conversion. Since the first power device 23 and the second power device 25 correspond to the first heat dissipation wall 11 and the second heat dissipation wall 15 respectively, and the first heat dissipation wall 11 and the second heat dissipation wall 15 are respectively arranged adjacent to the two opposite side walls of the first accommodating groove 13, the first power device 23 and the second power device 25 can be arranged adjacent to where the transformer module 24 is located, so as to reduce the conductive distance between the secondary side and the primary side power devices and the transformer, so as to reduce the conductive resistance, avoid interference, and improve efficiency. Similarly, in response to the power conversion device 1 in performing unidirectional power conversion and signal processing requirements, the electromagnetic filter board 40 and the signal board 50 are arranged adjacent to the first side L1 where the power input terminal 16 and the signal transmission terminal 18 are located, which can reduce the conductive distance from the power input terminal 16 to the electromagnetic filter board 40 and the signal transmission terminal 18 to the signal board 50, and also help to improve the efficiency of the power conversion device 1. Furthermore, the liquid input pipe 12a and the liquid output pipe 12g connected to the cooling liquid flow channel 12 can be arranged on the other second side L2 relative to the first side L1, so that the power conversion device 1 can fully integrate and utilize space, reduce the overall volume, and achieve the dual purpose of improving power density and heat dissipation efficiency. However, it should be emphasized that in the aforementioned power conversion device 1, the optimization of the layout of each component between the housing 10 and the mainboard 20 can be adjusted and changed according to actual needs, and the present case is not limited to the combination illustrated in the aforementioned embodiment, and will not be repeated.

[0065] In the above embodiment, the power conversion device 1 is constructed as a unidirectional power conversion device as an example. In other embodiments, the power conversion device 1 can also be constructed as a bidirectional power conversion device to achieve mutual conversion between AC power and high-voltage DC power.

[0066] In summary, the present case provides an assembly structure of a power conversion device. By optimizing the layout of each component, the assembly and fixation thereof are simple and reliable, while the heat dissipation capacity of each component is enhanced, and the overall volume of the power conversion device is reduced and the overall power density of the power conversion device is improved. In addition, by fixing the power device on the mainboard and attaching it to the heat dissipation surface of the shell through a heat-conductive and insulating heat dissipation module, each component is arranged between the mainboard and the shell and accommodated in the housing groove of the shell, and the heat dissipation surface and the housing groove of the shell are thermally coupled to the coolant flow channel of the shell at the same time, so as to reduce the interface thermal resistance and simplify the assembly structure, thereby achieving the purpose of reducing costs, improving the reliability of the assembly structure and the heat dissipation capacity.

[0067] The present invention may be modified in various ways by those skilled in the art, but all of them are within the scope of protection of the attached claims.

Claims

1. A power conversion device, characterized in that: include: A housing, comprising at least one first heat dissipation wall and a cooling liquid flow channel, wherein the at least one first heat dissipation wall is thermally coupled to the cooling liquid flow channel; A mainboard is structured on the housing, wherein the mainboard comprises a first surface and at least one first power device, wherein the first surface faces the housing, and the at least one first power device is disposed on the mainboard and comprises a first surface and a second surface; An electromagnetic filter board is constructed on the housing and electrically connected to the main board; a signal board, constructed on the housing and electrically connected to the main board; and A heat dissipation module comprises at least one first insulating heat conductive sheet and at least one first elastic clip, wherein the at least one first insulating heat conductive sheet is attached to the corresponding at least one first heat dissipation wall, the at least one first elastic clip is fixed to the housing and relative to the at least one first insulating heat conductive sheet, so that the at least one first elastic clip and the at least one first insulating heat conductive sheet form a containing space, when the first surface of the mainboard tends to the housing and the at least one first power device is clamped in the containing space between the at least one first elastic clip and the at least one first insulating heat conductive sheet, the at least one first elastic clip is pressed against the first surface of the at least one first power device, and the second surface of the at least one first power device is attached to the at least one first insulating heat conductive sheet, so that the at least one first power device is thermally coupled with the at least one first heat dissipation wall and the coolant flow channel through the at least one first insulating heat conductive sheet, The mainboard also includes at least one second power device arranged on the first surface, and the at least one second power device includes a first surface and a second surface, wherein the shell also includes at least one second heat dissipation wall facing the first surface of the mainboard and thermally coupled to the coolant flow channel, wherein the heat dissipation module also includes at least one second insulating thermally conductive sheet and at least one second elastic clip, the at least one second insulating thermally conductive sheet is attached to the corresponding at least one second heat dissipation wall, the at least one second elastic clip is arranged between the first surface of the mainboard and the first surface of the at least one second power device and relative to the at least one second insulating thermally conductive sheet, when the first surface of the mainboard tends to the shell, the at least one second elastic clip presses against the first surface of the at least one second power device, and the second surface of the at least one second power device is attached to the at least one second insulating thermally conductive sheet, so that the at least one second power device is thermally coupled to the at least one second heat dissipation wall and the coolant flow channel through the at least one second insulating thermally conductive sheet.

2. The power conversion device according to claim 1, characterized in that: The at least one first power device is arranged on the first surface, and the electromagnetic filter board and the signal board are both arranged between the first surface of the main board and the housing.

3. The power conversion device according to claim 1, characterized in that: The shell includes a first accommodating groove and a second accommodating groove, which are thermally coupled to the cooling liquid flow channel, wherein the second accommodating groove is partially arranged around the first accommodating groove.

4. The power conversion device according to claim 3, characterized in that: The mainboard also includes a transformer module, which is electrically connected to the mainboard and is arranged between the first surface of the mainboard and the shell.

5. The power conversion device according to claim 4, characterized in that: The transformer module is accommodated in the first accommodating groove, and the electromagnetic filter board and the signal board are accommodated in the second accommodating groove.

6. The power conversion device according to claim 3, 4 or 5, characterized in that: The at least one first heat dissipation wall is disposed adjacent to a side wall of the first accommodating groove or the second accommodating groove.

7. The power conversion device according to claim 3, characterized in that: The cooling liquid flow channel includes at least one channel and at least one narrow surface.

8. The power conversion device according to claim 7, characterized in that: The at least one channel is thermally coupled to the at least one first heat dissipation wall, the side wall of the first containing groove or the side wall of the second containing groove.

9. The power conversion device according to claim 7, characterized in that: The at least one narrow surface is thermally coupled to the bottom surface of the first accommodating groove or the bottom surface of the second accommodating groove.

10. The power conversion device according to claim 1, characterized in that: The housing includes a first accommodating groove, wherein the at least one second heat dissipation wall is opposite to the at least one first heat dissipation wall, and the at least one first heat dissipation wall and the at least one second heat dissipation wall are respectively adjacent to two opposite side walls of the first accommodating groove.

11. The power conversion device according to claim 1 or 10, characterized in that: The at least one second power device is disposed flatly relative to the mainboard.

12. The power conversion device according to claim 1, characterized in that: The at least one first power device is vertically arranged relative to the mainboard.

13. The power conversion device according to claim 1, characterized in that: The power conversion device includes a power input terminal, a power output terminal and a signal transmission terminal, which are arranged on a first side of the shell. The power input terminal is electrically connected to the main board through the electromagnetic filter board, the power output terminal is electrically connected to the main board, and the signal transmission terminal is electrically connected to the main board through the signal board.

14. The power conversion device according to claim 13, characterized in that: The signal board is disposed adjacent to the first side of the housing.

15. The power conversion device according to claim 13, characterized in that: The shell includes a liquid input pipe and a liquid output pipe, the liquid input pipe and the liquid output pipe are communicated through the cooling liquid flow channel and are arranged on a second side of the shell, wherein the first side and the second side are opposite to each other.

16. The power conversion device according to claim 1, characterized in that: The at least one first power device is disposed adjacent to the peripheral side of the mainboard.

17. The power conversion device according to claim 1, characterized in that: The at least one first insulating heat-conducting sheet is a direct copper-clad ceramic substrate.

18. The power conversion device according to claim 1, characterized in that: The heat dissipation module also includes a heat conductive adhesive, which is arranged between the at least one first insulating heat conductive sheet and the at least one first heat dissipation wall.

19. The power conversion device according to claim 1, characterized in that: The at least one first power device is integrated into a power module.

20. The power conversion device according to claim 1, characterized in that: The at least one second power device is integrated into a power module.

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