Antenna packaging structure with air chamber and packaging method

Abstract

The present invention provides an antenna packaging structure and packaging method with an air chamber, the structure comprising: a rewiring layer, the rewiring layer comprising a first surface and a second surface opposite to each other; a chamber side wall formed on the second surface of the rewiring layer; a substrate comprising a first surface and a second surface opposite to each other, an antenna metal layer formed on the first surface of the substrate, the substrate bonded to the chamber side wall, the substrate, the chamber side wall and the rewiring layer forming an air chamber; an antenna circuit chip, the antenna circuit chip is electrically bonded to the second surface of the rewiring layer and is located in the air chamber; a metal bump is formed on the first surface of the rewiring layer to realize electrical extraction of the rewiring layer. The present invention sets the air chamber below the antenna metal layer, which can greatly reduce the loss of antenna signals compared to other packaging materials, thereby effectively enhancing the antenna's transceiver efficiency.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor packaging, and in particular relates to an antenna packaging structure with an air cavity and a packaging method. Background Art

[0002] With the advancement of technology, various high-tech electronic products have been developed to facilitate people's lives, including various electronic devices such as notebook computers, mobile phones, tablet computers (PADs), etc.

[0003] With the popularization of these high-tech electronic products and the increase in people's needs, in addition to the significant increase in the functions and applications configured in these high-tech products, in particular, the wireless communication function has been added to meet people's needs for mobility. Therefore, people can use these high-tech electronic products at any place or at any time through these high-tech electronic devices with wireless communication functions. This greatly increases the flexibility and convenience of using these high-tech electronic products. Therefore, people no longer have to be confined to a fixed area, breaking the boundaries of the scope of use, making the application of these electronic products truly convenient for people's lives.

[0004] In antenna applications, such as in mobile phone terminals, the antenna needs to transmit and receive signals through multiple functional chip modules. The known practice is to directly make the antenna on the surface of the circuit board (PCB). The disadvantage is that this practice will make the antenna occupy additional circuit board area, and because the transmission signal line is long, the performance is poor, the power consumption is large, and the package volume is large. In particular, the traditional PCB package has too much loss under 5G millimeter wave transmission. In terms of antenna packaging, in theory, any material will cause antenna attenuation and loss. Summary of the invention

[0005] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide an antenna packaging structure with an air chamber and a packaging method, so as to solve the problem of large loss of the antenna packaging structure in the prior art.

[0006] To achieve the above-mentioned purpose and other related purposes, the present invention provides an antenna packaging structure with an air chamber, the antenna packaging structure comprising: a rewiring layer, the rewiring layer comprising a first surface and a second surface opposite to each other; a chamber side wall formed on the second surface of the rewiring layer; a substrate comprising a first surface and a second surface opposite to each other, an antenna metal layer being formed on the first surface of the substrate, the substrate being bonded to the chamber side wall, the substrate, the chamber side wall and the rewiring layer forming an air chamber; an antenna circuit chip, the antenna circuit chip being electrically bonded to the second surface of the rewiring layer and being located in the air chamber; a metal bump formed on the first surface of the rewiring layer to achieve electrical lead-out of the rewiring layer.

[0007] Optionally, the material of the chamber sidewall includes one of silicon, glass, metal and polymer.

[0008] Optionally, the antenna circuit chip includes one or both of active components and passive components, wherein the active component includes one of a power management circuit, a transmitting circuit and a receiving circuit, and the passive component includes one of a resistor, a capacitor and an inductor.

[0009] Optionally, the substrate comprises a silicon substrate, and the thickness of the substrate ranges from 50 microns to 100 microns.

[0010] Optionally, the first surface of the substrate is bonded to the side wall of the chamber so that the antenna metal layer is encapsulated in the air chamber.

[0011] Optionally, the second surface of the substrate is bonded to the chamber side wall so that the antenna metal layer is located outside the air cavity.

[0012] The present invention also provides an antenna packaging method with an air chamber, comprising the following steps: 1) providing a supporting substrate, and forming a separation layer on the supporting substrate; 2) forming a rewiring layer on the separation layer, and the rewiring layer includes a first surface connected to the separation layer and an opposite second surface; 3) forming a chamber side wall on the rewiring layer; 4) providing an antenna circuit chip, and electrically bonding the antenna circuit chip to the second surface of the rewiring layer; 5) providing a substrate, and forming an antenna metal layer on the first surface of the substrate, and bonding the first surface or the second surface of the substrate to the chamber side wall, the substrate, the chamber side wall and the rewiring layer form an air chamber, and the antenna circuit chip is located in the air chamber; 6) peeling off the rewiring layer and the supporting substrate based on the separation layer to expose the first surface of the rewiring layer; 7) forming a metal bump on the first surface of the rewiring layer to achieve electrical lead-out of the rewiring layer.

[0013] Optionally, the supporting substrate includes one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate and a ceramic substrate.

[0014] Optionally, the separation layer includes a light-to-heat conversion layer, and in step 6), laser is used to irradiate the light-to-heat conversion layer to separate the light-to-heat conversion layer from the rewiring layer and the supporting substrate, thereby peeling off the rewiring layer and the supporting substrate.

[0015] Optionally, step 2) preparing the rewiring layer includes the steps of: 2-1) forming a first dielectric layer on the surface of the separation layer; 2-2) forming a seed layer on the surface of the first dielectric layer by a sputtering process, forming a first metal layer on the seed layer, and etching the first metal layer and the seed layer to form a patterned first metal wiring layer; 2-3) forming a second dielectric layer on the surface of the patterned first metal wiring layer, and etching the second dielectric layer to form a second dielectric layer with a patterned through hole; 2-4) filling the patterned through hole with a conductive plug, and then forming a second metal layer on the surface of the second dielectric layer by a sputtering process, and etching the metal layer to form a patterned second metal wiring layer.

[0016] Optionally, in step 3), a printing process is used to form chamber sidewalls on the rewiring layer.

[0017] Optionally, the material of the chamber sidewall includes one of silicon, glass, metal and polymer.

[0018] Optionally, step 5) includes: 5-1) providing a substrate, forming a patterned photoresist layer on the substrate, and a window in the photoresist layer exposes the substrate; 5-2) forming a metal layer on the photoresist layer and the surface of the substrate; 5-3) removing the photoresist layer and the metal layer on the photoresist layer, retaining the metal layer in the window to form the antenna metal layer.

[0019] Optionally, the substrate includes a silicon wafer, and further includes step 5-4) thinning the silicon wafer, wherein the thickness of the silicon wafer after thinning ranges from 50 microns to 100 microns.

[0020] Optionally, the antenna circuit chip includes one or both of active components and passive components, wherein the active component includes one of a power management circuit, a transmitting circuit and a receiving circuit, and the passive component includes one of a resistor, a capacitor and an inductor.

[0021] Optionally, step 4) also includes the step of filling a sealing protection layer between the antenna circuit chip and the rewiring layer.

[0022] Optionally, the first surface of the substrate is bonded to the side wall of the chamber so that the antenna metal layer is encapsulated in the air chamber.

[0023] Optionally, the second surface of the substrate is bonded to the chamber side wall so that the antenna metal layer is located outside the air cavity.

[0024] As described above, the antenna packaging structure and packaging method with an air cavity of the present invention have the following beneficial effects:

[0025] The present invention can integrate all active components or passive components into one packaging structure through the line arrangement of different rewiring layers, which can effectively reduce the packaging size.

[0026] The antenna circuit chip, rewiring layer and antenna metal structures of the present invention are arranged in a vertical arrangement, which can effectively shorten the conduction path between components, have better electrical properties and antenna performance, and have lower power consumption.

[0027] The present invention sets an air chamber under the antenna metal layer, which can greatly reduce the loss of antenna signals compared to other packaging materials, thereby effectively enhancing the antenna's transceiver efficiency.

[0028] The present invention can package the antenna metal layer and the antenna circuit chip in the air chamber, which can effectively protect the antenna metal layer and the antenna circuit chip, avoid damage to the antenna metal layer and the antenna circuit chip, and improve the stability of the antenna packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 to Figure 14 It is a schematic structural diagram of each step of the antenna packaging method with an air cavity according to Embodiment 1 of the present invention, wherein: Fig.14 Shown is a structural schematic diagram of an antenna packaging structure with an air cavity according to Embodiment 1 of the present invention.

[0030] Fig.15 Shown is a structural schematic diagram of an antenna packaging structure with an air cavity according to Embodiment 2 of the present invention.

[0031] Component number description

[0032] 101 Support base

[0033] 102 Separation Layer

[0034] 201 First dielectric layer

[0035] 202 First metal wiring layer

[0036] 203 Second dielectric layer

[0037] 204 Second metal wiring layer

[0038] 205 Chamber side wall

[0039] 601 substrate

[0040] 602 Photoresist layer

[0041] 603 Antenna Metal Layer

[0042] 401 Antenna Circuit Chip

[0043] 402 Sealing protective layer

[0044] 501 metal bumps DETAILED DESCRIPTION

[0045] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0046] For example, when describing the embodiments of the present invention in detail, for the sake of convenience, the cross-sectional view showing the device structure will not be partially enlarged according to the general scale, and the schematic view is only an example, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional space dimensions of length, width and depth should be included.

[0047] For ease of description, spatially relative terms such as "under", "below", "below", "below", "above", "on", etc. may be used herein to describe the relationship of one element or feature shown in the drawings to other elements or features. It will be understood that these spatially relative terms are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the drawings. In addition, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present.

[0048] In the context of the present application, a structure in which a first feature is described as being "above" a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0049] It should be noted that the illustrations provided in this embodiment are only used to illustrate the basic concept of the present invention in a schematic manner, and therefore the illustrations only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0050] Example 1

[0051] like Figure 1 to Figure 14 As shown, this embodiment provides an antenna packaging method with an air cavity, and the packaging method includes the following steps:

[0052] like Figure 1 As shown, step 1) is first performed to provide a supporting substrate 101 and to form a separation layer 102 on the supporting substrate 101 .

[0053] As an example, the support substrate 101 includes one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate and a ceramic substrate. In this embodiment, the support substrate 101 is selected as a glass substrate, which has a low cost, is easy to form a separation layer 102 on its surface, and can reduce the difficulty of the subsequent stripping process.

[0054] As an example, the separation layer 102 includes a light-to-heat conversion layer (LTHC), which is formed on the support substrate 101 by a spin coating process and then solidified by a curing process. The light-to-heat conversion layer (LTHC) has stable performance and a smooth surface, which is conducive to the subsequent preparation of the rewiring layer, and in the subsequent stripping process, the stripping difficulty is relatively low.

[0055] like Figure 2 to Figure 5 As shown, step 2) is then performed to form a rewiring layer on the separation layer 102, wherein the rewiring layer includes a first surface connected to the separation layer 102 and an opposite second surface.

[0056] Step 2) manufacturing the rewiring layer comprises the steps of:

[0057] like Figure 2 As shown, step 2-1) is performed to form a first dielectric layer 201 on the surface of the separation layer 102 using a chemical vapor deposition process or a physical vapor deposition process. The material of the first dielectric layer 201 includes one or a combination of two or more of epoxy resin, silica gel, PI, PBO, BCB, silicon oxide, phosphosilicate glass, and fluorine-containing glass.

[0058] For example, the material of the first dielectric layer 201 is selected as PI (polyimide) to further reduce the process difficulty and process cost.

[0059] like Figure 3 As shown, step 2-2) is performed to form a seed layer on the surface of the first dielectric layer 201 by a sputtering process, to form a first metal layer on the seed layer, and to etch the first metal layer and the seed layer to form a patterned first metal wiring layer 202. The material of the seed layer includes a stack of a titanium layer and a copper layer. The material of the first metal wiring layer 202 includes one or a combination of two or more of copper, aluminum, nickel, gold, silver, and titanium.

[0060] like Figure 4As shown, step 2-3) is performed to form a second dielectric layer 203 on the surface of the patterned first metal wiring layer 202 by chemical vapor deposition or physical vapor deposition, and the second dielectric layer 203 is etched to form a second dielectric layer 203 with patterned through holes. The material of the second dielectric layer 203 includes one or a combination of two or more of epoxy resin, silica gel, PI, PBO, BCB, silicon oxide, phosphorus silicon glass, and fluorine-containing glass.

[0061] For example, the material of the second dielectric layer 203 is selected to be PI (polyimide) to further reduce the process difficulty and process cost.

[0062] like Figure 4 As shown, step 2-4) is performed to fill the patterned through hole with a conductive plug, and then a second metal layer is formed on the surface of the second dielectric layer 203 by a sputtering process, and the metal layer is etched to form a patterned second metal wiring layer 204. The material of the second metal wiring layer 204 includes one or a combination of two or more of copper, aluminum, nickel, gold, silver, and titanium.

[0063] It should be noted that the above steps 2-3) to 2-4) may be repeated to form a rewiring layer with a multi-layer stacking structure to achieve different wiring functions.

[0064] like Figure 5 As shown, step 3) is then performed to form a chamber sidewall 205 on the rewiring layer.

[0065] For example, a printing process can be used to form the chamber sidewall 205 on the rewiring layer. The material of the chamber sidewall 205 includes one of silicon, glass, metal and polymer. In this embodiment, the material of the chamber sidewall 205 can be selected as polymer to reduce the process difficulty and process cost.

[0066] like Figure 6 As shown, the next step is to perform step 4), provide an antenna circuit chip 401, and electrically bond the antenna circuit chip 401 to the second surface of the rewiring layer.

[0067] For example, the antenna circuit chip 401 may be bonded to the second surface of the rewiring layer by a welding process or a ball planting process.

[0068] There may be multiple antenna circuit chips 401, and the antenna circuit chips 401 include one or both of active components and passive components, wherein the active components include one of a power management circuit, a transmitting circuit, and a receiving circuit, and the passive components include one of a resistor, a capacitor, and an inductor. The present invention can integrate all active components or passive components into a packaging structure through different wiring arrangements of the rewiring layer, which can effectively reduce the package size.

[0069] In this embodiment, there is a gap between the antenna circuit chip 401 and the rewiring layer. This embodiment also includes the step of filling a sealing protection layer 402 between the antenna circuit chip 401 and the rewiring layer. Fig.13 The dense protection layer can improve the structural strength between the antenna circuit chip 401 and the rewiring layer, and avoid damage to the antenna circuit chip 401 due to compression or the like.

[0070] like Figure 7 to Figure 12 As shown, then proceed to step 5), provide a substrate 601, the first surface of the substrate 601 is formed with an antenna metal layer 603, the first surface or the second surface of the substrate 601 is bonded to the chamber side wall 205, the substrate 601, the chamber side wall 205 and the rewiring layer form an air chamber, and the antenna circuit chip 401 is located in the air chamber. The present invention sets the air chamber below the antenna metal layer, which can greatly reduce the loss of antenna signals compared to other packaging materials, thereby effectively enhancing the antenna's transceiver efficiency.

[0071] Specifically, step 5) includes the following steps:

[0072] like Figure 7 and Figure 8 As shown, firstly, step 5-1) is performed to provide a substrate 601, and a patterned photoresist layer 602 is formed on the substrate 601, and the window of the photoresist layer 602 exposes the substrate 601. For example, the substrate 601 can be a silicon wafer or the like.

[0073] like Fig. 9 As shown, step 5-2) is then performed to form a metal layer on the surface of the photoresist layer 602 and the substrate 601.

[0074] like Fig.10 As shown, step 5-3) is then performed to remove the photoresist layer 602 and the metal layer on the photoresist layer 602, and retain the metal layer in the window to form the antenna metal layer 603.

[0075] like Fig.11As shown, step 5-4) is finally performed to thin the silicon wafer. After thinning, the thickness of the silicon wafer ranges from 50 microns to 100 microns, so as to ensure mechanical strength while reducing signal attenuation.

[0076] like Fig.12 As shown, in this embodiment, the first surface of the substrate 601 is bonded to the chamber sidewall 205, and the substrate 601, the chamber sidewall 205 and the rewiring layer form an air chamber, so that the antenna metal layer 603 is encapsulated in the air chamber. The present invention can encapsulate the antenna metal layer and the antenna circuit chip in the air chamber, which can effectively protect the antenna metal layer and the antenna circuit chip, avoid damage to the antenna metal layer and the antenna circuit chip, and improve the stability of the antenna packaging structure. The antenna metal layer can also be electrically connected to the rewiring layer using a metal wiring process or other processes.

[0077] like Fig.12 As shown, step 6) is then performed to peel off the rewiring layer and the supporting substrate 101 based on the separation layer 102 to expose the first surface of the rewiring layer.

[0078] Specifically, the separation layer 102 includes a light-to-heat conversion layer, and laser is used to irradiate the light-to-heat conversion layer to separate the light-to-heat conversion layer from the rewiring layer and the supporting substrate 101 , thereby peeling off the rewiring layer and the supporting substrate 101 .

[0079] like Fig.14 As shown, step 7) is finally performed to form a metal bump 501 on the first surface of the rewiring layer to realize the electrical lead-out of the rewiring layer. For example, the metal bump 501 can be one of tin solder, silver solder and gold-tin alloy solder.

[0080] like Fig.14As shown, this embodiment also provides an antenna packaging structure with an air cavity, the antenna packaging structure includes: a rewiring layer, the rewiring layer includes a first surface and a second surface opposite to each other; a cavity side wall 205, formed on the second surface of the rewiring layer; a substrate 601, including a first surface and a second surface opposite to each other, the first surface of the substrate 601 is formed with an antenna metal layer 603, the substrate 601 is bonded to the cavity side wall 205, the substrate 601, the cavity side wall 205 and the rewiring layer form an air cavity; an antenna circuit chip 401, the antenna circuit chip 401 is electrically bonded to the second surface of the rewiring layer, and the antenna circuit chip 401 is located in the air cavity; a metal bump 501 is formed on the first surface of the rewiring layer to realize the electrical extraction of the rewiring layer. The present invention sets the air cavity below the antenna metal layer 603, which can greatly reduce the loss of antenna signals compared with other packaging materials, thereby effectively enhancing the antenna's transceiver efficiency.

[0081] The material of the chamber sidewall 205 includes one of silicon, glass, metal and polymer.

[0082] The antenna circuit chip 401 includes one or both of active components and passive components, wherein the active component includes one of a power management circuit, a transmitting circuit and a receiving circuit, and the passive component includes one of a resistor, a capacitor and an inductor. The present invention can integrate all active components or passive components into a packaging structure through the arrangement of different rewiring layers, which can effectively reduce the packaging size.

[0083] The substrate 601 includes a silicon substrate, and the thickness of the substrate 601 ranges from 50 micrometers to 100 micrometers, so as to ensure mechanical strength while reducing signal attenuation.

[0084] In this embodiment, the first surface of the substrate 601 is bonded to the chamber sidewall 205, so that the antenna metal layer 603 is encapsulated in the air chamber. The present invention can encapsulate the antenna metal layer and the antenna circuit chip in the air chamber, which can effectively protect the antenna metal layer and the antenna circuit chip, avoid damage to the antenna metal layer and the antenna circuit chip, and improve the stability of the antenna packaging structure.

[0085] Example 2

[0086] like Fig.15As shown, this embodiment provides an antenna packaging structure and packaging method with an air cavity, and its basic steps and structure are as in Embodiment 1, wherein the difference from Embodiment 1 is that the second surface of the substrate 601 is bonded to the cavity sidewall 205, so that the antenna metal layer 603 is located outside the air cavity. This packaging structure and method can make the antenna metal layer 603 exposed on the top of the antenna packaging structure, which can facilitate the electrical connection between it and other components, and at the same time can enhance the efficiency of the antenna metal layer 603 in sending and receiving signals.

[0087] As described above, the antenna packaging structure and packaging method with an air cavity of the present invention have the following beneficial effects:

[0088] The present invention can integrate all active components or passive components into one packaging structure through the line arrangement of different rewiring layers, which can effectively reduce the packaging size.

[0089] The antenna circuit chip, rewiring layer and antenna metal structures of the present invention are arranged in a vertical arrangement, which can effectively shorten the conduction path between components, have better electrical properties and antenna performance, and have lower power consumption.

[0090] The present invention sets an air chamber under the antenna metal layer, which can greatly reduce the loss of antenna signals compared to other packaging materials, thereby effectively enhancing the antenna's transceiver efficiency.

[0091] The present invention can package the antenna metal layer and the antenna circuit chip in the air chamber, which can effectively protect the antenna metal layer and the antenna circuit chip, avoid damage to the antenna metal layer and the antenna circuit chip, and improve the stability of the antenna packaging structure.

[0092] Therefore, the present invention effectively overcomes various shortcomings in the prior art and has high industrial utilization value.

[0093] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. An antenna packaging structure with an air chamber, characterized in that: The antenna packaging structure comprises: a rewiring layer, the rewiring layer comprising a first surface and a second surface opposite to each other; A chamber sidewall formed on the second surface of the rewiring layer; A substrate, comprising a first surface and a second surface opposite to each other, an antenna metal layer is formed on the first surface of the substrate, the substrate is bonded to the side wall of the chamber, and the substrate, the side wall of the chamber and the rewiring layer form an air chamber; the first surface of the substrate is bonded to the side wall of the chamber so that the antenna metal layer is encapsulated in the air chamber; the substrate comprises a silicon substrate, and the thickness of the substrate ranges from 50 microns to 100 microns; An antenna circuit chip, the antenna circuit chip is electrically bonded to the second surface of the rewiring layer by a flip-chip method and is located in the air chamber; Metal bumps are formed on the first surface of the rewiring layer to realize electrical extraction of the rewiring layer.

2. The antenna package structure with an air chamber according to claim 1, characterized in that: The material of the chamber sidewall includes one of silicon, glass, metal and polymer.

3. The antenna package structure with an air chamber according to claim 1, characterized in that: The antenna circuit chip includes one or both of active components and passive components, wherein the active component includes one of a power management circuit, a transmitting circuit and a receiving circuit, and the passive component includes one of a resistor, a capacitor and an inductor.

4. A method for packaging an antenna with an air chamber, characterized in that: Includes steps: 1) providing a supporting substrate, and forming a separation layer on the supporting substrate; 2) forming a rewiring layer on the separation layer, wherein the rewiring layer includes a first surface connected to the separation layer and an opposite second surface; 3) forming a chamber sidewall on the rewiring layer; 4) providing an antenna circuit chip, and electrically bonding the antenna circuit chip to the second surface of the rewiring layer by flip-chip method; 5) providing a substrate, wherein an antenna metal layer is formed on the first surface of the substrate, the substrate comprises a silicon wafer, and further comprises a thinned silicon wafer, wherein the thickness of the thinned silicon wafer ranges from 50 microns to 100 microns, the first surface or the second surface of the substrate is bonded to the chamber side wall, the substrate, the chamber side wall and the rewiring layer form an air chamber, and the antenna circuit chip is located in the air chamber; the first surface of the substrate is bonded to the chamber side wall, so that the antenna metal layer is encapsulated in the air chamber; 6) peeling off the rewiring layer and the supporting substrate based on the separation layer to expose the first surface of the rewiring layer; 7) Forming metal bumps on the first surface of the rewiring layer to electrically lead out the rewiring layer.

5. The method for packaging an antenna with an air cavity according to claim 4, wherein: The supporting substrate includes one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate and a ceramic substrate.

6. The method for packaging an antenna with an air cavity according to claim 5, wherein: The separation layer includes a light-to-heat conversion layer. In step 6), a laser is used to irradiate the light-to-heat conversion layer to separate the light-to-heat conversion layer from the rewiring layer and the supporting substrate, thereby peeling off the rewiring layer and the supporting substrate.

7. The method for packaging an antenna with an air cavity according to claim 4, wherein: Step 2) making the rewiring layer comprises the steps of: 2-1) forming a first dielectric layer on the surface of the separation layer; 2-2) forming a seed layer on the surface of the first dielectric layer by a sputtering process, forming a first metal layer on the seed layer, and etching the first metal layer and the seed layer to form a patterned first metal wiring layer; 2-3) forming a second dielectric layer on the surface of the patterned first metal wiring layer, and etching the second dielectric layer to form a second dielectric layer having patterned through holes; 2-4) Filling the patterned through hole with a conductive plug, then forming a second metal layer on the surface of the second dielectric layer by a sputtering process, and etching the metal layer to form a patterned second metal wiring layer.

8. The method for packaging an antenna with an air cavity according to claim 4, wherein: Step 3) forming chamber sidewalls on the rewiring layer using a printing process.

9. The method for packaging an antenna with an air cavity according to claim 4, wherein: The material of the chamber sidewall includes one of silicon, glass, metal and polymer.

10. The method for packaging an antenna with an air cavity according to claim 4, wherein: Step 5) includes: 5-1) providing a substrate, and forming a patterned photoresist layer on the substrate, wherein a window of the photoresist layer exposes the substrate; 5-2) forming a metal layer on the photoresist layer and the surface of the substrate; 5-3) removing the photoresist layer and the metal layer on the photoresist layer, and retaining the metal layer in the window to form the antenna metal layer.

11. The method for packaging an antenna with an air cavity according to claim 4, wherein: Step 4) also includes the step of filling a sealing protection layer between the antenna circuit chip and the rewiring layer.

12. The method for packaging an antenna with an air cavity according to claim 4, wherein: The antenna circuit chip includes one or both of active components and passive components, wherein the active component includes one of a power management circuit, a transmitting circuit and a receiving circuit, and the passive component includes one of a resistor, a capacitor and an inductor.

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