Fully automatic pressing device for flexible circuit boards

Abstract

The present invention relates to the technical field of flexible circuit board lamination, and discloses a fully automatic lamination device for flexible circuit boards, including a fast press machine part and a robot part; the fast press machine part includes a lamination area and a power element for performing high-temperature lamination on a flexible circuit board wrapped with a release film, an upper pressing plate and a lower pressing plate are respectively arranged above and below the lamination area, and the power element drives the upper pressing plate and the lower pressing plate to approach or move away from each other; the robot part includes a film material conveying mechanism for outputting the release film, a film supporting structure for supporting the film material output by the film material conveying mechanism to form at least one upper and lower double-layer film structure, an opening and closing mechanism for driving the upper and lower films of the upper and lower double-layer film structures to open or close to each other, and a robot for transporting the flexible circuit board to be laminated into the upper and lower double-layer film structures or moving the laminated flexible circuit board away from the upper and lower double-layer film structures; the upper and lower double-layer film structures are formed in the lamination area; and fully automatic lamination is achieved.

Description

Technical Field

[0001] The invention relates to the technical field of flexible circuit board pressing, in particular to a fully automatic pressing device for a flexible circuit board. Background Art

[0002] Flexible circuit board, also called FPC board, refers to a printed circuit made of flexible insulating substrate. It has many advantages that rigid printed circuit boards do not have. It can be bent, wound, and folded freely. It can be arranged arbitrarily according to the spatial layout requirements, and can be moved and stretched arbitrarily in three-dimensional space, so as to achieve the integration of component assembly and wire connection. The use of FPC flexible board can greatly reduce the size of electronic products, which is suitable for the development of electronic products towards high density, miniaturization, and high reliability. Therefore, FPC flexible board has been widely used in aerospace, military, mobile communications, laptops, computer peripherals, PDAs, digital cameras and other fields or products.

[0003] In the production and processing of flexible circuit boards, there is a process of laminating the flexible circuit boards. In the existing process of laminating the flexible circuit boards, the flexible circuit boards are manually wrapped with release films, and then the wrapped flexible circuit boards are placed on the laminating window of the laminating machine, and then the laminating machine is started for laminating. After the machine laminating work is completed, the pressed product is manually taken out from the laminating window, and then the release film is peeled off to obtain the pressed flexible circuit board.

[0004] In the above operation mode, since the pressing window is a high-temperature zone, there are certain safety risks in manually placing the flexible circuit board to be pressed on the pressing window and taking out the pressed flexible circuit board. In addition, the degree of automation of the entire operation process is not high, the pressing efficiency of the flexible circuit board is low, the manual operation process is repetitive and cumbersome, and personnel are easily fatigued, resulting in product misplacement or omission, affecting product quality, and the pressing effect is average. Summary of the invention

[0005] The purpose of the present invention is to provide a fully automatic pressing device for a flexible circuit board, aiming to solve the problem of lack of a fully automatic pressing device for a flexible circuit board in the prior art.

[0006] The present invention is implemented as follows: a fully automatic pressing device for a flexible circuit board comprises a fast pressing machine part and a robot part; the fast pressing machine part comprises a pressing area and a power element for performing high-temperature pressing on a flexible circuit board wrapped with a release film, an upper pressing plate and a lower pressing plate are respectively arranged above and below the pressing area, and the power element drives the upper pressing plate and the lower pressing plate to move closer to or away from each other; the robot part comprises a film material conveying mechanism for outputting the release film, a film supporting structure that supports the film material output by the film material conveying mechanism to form at least one upper and lower double-layer film structure, an opening and closing mechanism that drives the upper and lower films of the upper and lower double-layer film structures to open or close to each other, and a robot for transporting the flexible circuit board to be pressed into the upper and lower double-layer film structures or moving the pressed flexible circuit board away from the upper and lower double-layer film structures; the upper and lower double-layer film structures are formed in the pressing area.

[0007] Furthermore, the upper and lower double-layer membrane structure includes an upper membrane, a lower membrane and a side membrane for connecting the upper membrane and the lower membrane. The lower membrane is formed with a placement area for placing the flexible circuit board to be pressed.

[0008] Furthermore, the fully automatic pressing device for the flexible circuit board includes a shell, and the manipulator includes an X-axis guide rail formed inside the shell and arranged horizontally, a Z-axis guide rail that can move horizontally along the X-axis guide rail and is arranged longitudinally, and a vacuum suction cup mechanism that can move longitudinally along the Z-axis guide rail and is arranged horizontally; the vacuum suction cup structure vacuum suction cup mechanism is used to suck the flexible circuit board to be pressed to the placement area or move the pressed flexible circuit board away from the placement area.

[0009] Furthermore, a raw material area for placing flexible circuit boards to be pressed is provided inside the shell, and the flexible circuit boards to be pressed are stacked and placed in the raw material area; a finished product area for placing pressed flexible circuit boards is provided inside the shell, and the pressed flexible circuit boards are stacked and placed in the finished product area.

[0010] Furthermore, the vacuum suction cup structure is provided with a sensor for sensing whether there are flexible circuit boards to be pressed in the raw material area. The sensor is electrically connected to a first alarm. When the sensor senses that there are no flexible circuit boards to be pressed in the raw material area, the first alarm sends out a reminder alarm.

[0011] Furthermore, the membrane-supporting structure of the membrane-supporting mechanism includes a lower membrane-supporting assembly and an upper membrane-supporting assembly which are arranged vertically opposite to each other; the lower membrane-supporting assembly includes a first rear membrane-supporting rod which can move horizontally and vertically and a first front membrane-supporting rod which can move vertically, the first rear membrane-supporting rod abuts against the upper end surface of the lower membrane, and the first front membrane-supporting rod abuts against the lower end surface of the lower membrane; the upper membrane-supporting assembly includes a second rear membrane-supporting rod and a second front membrane-supporting rod, the second rear membrane-supporting rod abuts against the lower end surface of the upper membrane, and the second front membrane-supporting rod abuts against the upper end surface of the upper membrane.

[0012] Furthermore, the opening and closing mechanism includes a brake mechanism for pressing and fixing the first front film support rod and the release film, a first front film support rod fixing structure for fixing the first front film support rod and the lower pressure plate, and a first rear film support rod fixing structure for fixing the first rear film support rod and the lower pressure plate.

[0013] Furthermore, the brake mechanism includes a push rod extending horizontally and capable of horizontal movement, wherein the movement direction of the push rod is perpendicular to the extension direction of the push rod, and along the extension direction of the push rod, a plurality of pressing members for pressing the release film are arranged at intervals on the periphery of the push rod, wherein the pressing members have a contact end surface for contacting the release film, and adhesive is provided on the contact end surface.

[0014] Furthermore, the supporting membrane structure is expanded to form two upper and lower double-layer membrane structures arranged longitudinally opposite to each other, namely a first upper and lower double-layer membrane structure and a second upper and lower double-layer membrane structure located above the first upper and lower double-layer membrane structure. The upper membrane of the first upper and lower double-layer membrane structure is connected to the lower membrane of the second upper and lower double-layer membrane structure through a connecting membrane body.

[0015] Furthermore, a supporting connecting membrane assembly for stretching the connecting membrane body is arranged between the upper membrane of the first upper and lower double-layer membrane structure and the lower membrane of the second upper and lower double-layer membrane structure, and the connecting membrane assembly includes a plurality of staggered and horizontally arranged support rods; the length of the connecting membrane body stretched by the supporting connecting membrane assembly is the same as the length of the lower membrane of the second upper and lower double-layer membrane structure.

[0016] Compared with the prior art, the fully automatic lamination device for flexible circuit boards provided by the present invention has a film material conveying mechanism that conveys the release film in an orderly manner, and a film supporting mechanism that supports the conveyed release film to form at least one upper and lower double-layer film structure, and an opening and closing mechanism that enables the upper film and the lower film of the upper and lower double-layer film structure to move toward or away from each other, thereby realizing the mutual opening or closing of the upper and lower films of the upper and lower double-layer film structure; when the upper film and the lower film are opened to each other, the robot carries the flexible circuit board to be pressed onto the lower film, and then the opening and closing mechanism drives the upper film The film and the lower film move towards each other, so that the upper film and the lower film are closed to each other, so that the flexible circuit board is tightly wrapped by the upper film and the lower film, and then the power element drives the upper pressing plate and the lower pressing plate to approach each other, so as to realize the pressing of the flexible circuit board wrapped with the release film; after the pressing is completed, the power element drives the upper pressing plate and the lower pressing plate to move away from each other, and the opening and closing mechanism drives the upper film and the lower film to move away from each other, so that the upper film and the lower film are opened to each other, and the pressed flexible circuit board is exposed, and the robot moves the pressed flexible circuit board away. The film material conveying mechanism continues to output the release film and repeats the above steps to complete the pressing of the next flexible circuit board. The cycle is repeated to realize the fully automatic pressing of the flexible circuit board, with high pressing efficiency and good pressing effect, avoiding the manual placement of the flexible circuit board to be pressed into the pressing window and the removal of the pressed flexible circuit board, which is safe and convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the internal structure of a fully automatic pressing device for a flexible circuit board provided in an embodiment of the present invention;

[0018] Figure 2 is a three-dimensional schematic diagram of a fully automatic pressing device for a flexible circuit board provided in an embodiment of the present invention;

[0019] Figure 3 is a structural diagram of a fully automatic pressing device for a flexible circuit board provided in an embodiment of the present invention;

[0020] Figure 4 It is a three-dimensional diagram of the fast pressing machine part of the fully automatic pressing device for flexible circuit boards provided by an embodiment of the present invention;

[0021] Figure 5 It is a structural diagram of a release film formed by being stretched out by a fully automatic pressing device for a flexible circuit board provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0023] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limitations on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0024] The implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0025] Reference Figure 1-5 As shown, a preferred embodiment of the present invention is provided.

[0026] The fully automatic pressing device for a flexible circuit board comprises a fast pressing machine part 10 and a robot part 20; the fast pressing machine part 10 comprises a pressing area 100 and a power element for pressing a flexible circuit board wrapped with a release film at high temperature, an upper pressing plate 110 and a lower pressing plate 120 are respectively arranged above and below the pressing area 100, and the power element drives the upper pressing plate 110 and the lower pressing plate 120 to move closer to or away from each other; the robot part 20 comprises a film material conveying unit for conveying the release film A film feeding mechanism 210, a film supporting structure that supports the film material output by the film material feeding mechanism 210 to form at least one upper and lower double-layer membrane structure 250, an opening and closing mechanism that drives the upper film 251 and the lower film 252 of the upper and lower double-layer membrane structure 250 to open or close to each other, and a robot 240 for transporting the flexible circuit board to be pressed into the upper and lower double-layer membrane structure 250 or for moving the pressed flexible circuit board away from the upper and lower double-layer membrane structure 250; the upper and lower double-layer membrane structure 250 is formed in the pressing area 100.

[0027] The fully automatic pressing device for the flexible circuit board provided above is provided with a fast pressing machine part 10 and a robot part 20; the fast pressing machine part 10 includes a pressing area 100 and a power element for high-temperature pressing the flexible circuit board wrapped with a release film, and an upper pressing plate 110 and a lower pressing plate 120 are respectively arranged above and below the pressing area 100, and the power element drives the upper pressing plate 110 and the lower pressing plate 120 to move closer to or away from each other; the robot part 20 includes a press part for outputting the release film A film material conveying mechanism 210, a film supporting structure that supports the film material output by the film material conveying mechanism 210 to form at least one upper and lower double-layer membrane structure 250, an opening and closing mechanism that drives the upper film 251 and the lower film 252 of the upper and lower double-layer membrane structure 250 to open or close to each other, and a robot 240 for transporting the flexible circuit board to be pressed into the upper and lower double-layer membrane structure 250 or moving the pressed flexible circuit board away from the upper and lower double-layer membrane structure 250; the upper and lower double-layer membrane structure 250 is formed in the pressing area 100.

[0028] In this way, the film material conveying mechanism 210 conveys the release film in an orderly manner, and the film supporting mechanism expands the conveyed release film to form at least one upper and lower double-layer film structure 250, and the opening and closing mechanism makes the upper film 251 and the lower film 252 of the upper and lower double-layer film structure 250 move toward or away from each other, thereby realizing the mutual opening or closing between the upper film 251 and the lower film 252 of the upper and lower double-layer film structure 250. When the upper film 251 and the lower film 252 are opened to each other, the robot 240 carries the flexible circuit board to be pressed onto the lower film 252, and then the opening and closing mechanism drives the upper film 251 and the lower film 252 to move toward each other, so that The upper film 251 and the lower film 252 are closed to each other, so that the flexible circuit board is tightly wrapped by the upper film 251 and the lower film 252, and then the power element drives the upper pressing plate 110 and the lower pressing plate 120 to approach each other, so as to realize the pressing of the flexible circuit board wrapped with the release film; after the pressing is completed, the power element drives the upper pressing plate 110 and the lower pressing plate 120 to move away from each other, and the opening and closing mechanism drives the upper film 251 and the lower film 252 to move away from each other, so that the upper film 251 and the lower film 252 are opened to each other, the pressed flexible circuit board is exposed, and the robot 240 moves the pressed flexible circuit board away. The film material conveying mechanism 210 continues to output the release film and repeats the above steps to complete the lamination of the next flexible circuit board. This cycle is repeated to achieve fully automatic lamination of the flexible circuit board. The lamination efficiency is high and the lamination effect is good. It avoids the need to manually place the flexible circuit board to be laminated on the lamination window and take out the laminated flexible circuit board, which is safe and convenient.

[0029] Specifically, the upper and lower double-layer membrane structure 250 includes an upper membrane 251 and a lower membrane 252 which are arranged opposite to each other, and a side membrane 253 for connecting the upper membrane 251 and the lower membrane 252; a placement area for placing the flexible circuit board to be pressed is formed on the lower membrane 252; the flexible circuit board to be pressed is transported to the placement area of ​​the lower membrane 252 by the robot 240, and the closure of the upper membrane 251 and the lower membrane 252 realizes the wrapping of the flexible circuit board, which is convenient for pressing the flexible circuit board. After pressing, the upper membrane 251 and the lower membrane 252 are opened to each other, so that the pressed flexible circuit board is exposed, and the robot 240 moves the exposed flexible circuit board away.

[0030] As an embodiment of the present invention, the fully automatic pressing device of the flexible circuit board includes a shell 30, and the manipulator 240 includes an X-axis guide rail 241 formed inside the shell 30 and arranged horizontally, a Z-axis guide rail 242 that can move horizontally along the X-axis guide rail 241 and is arranged longitudinally, and a vacuum suction cup mechanism 243 that can move longitudinally along the Z-axis guide rail 242 and is arranged horizontally; the vacuum suction cup structure vacuum suction cup mechanism is used to suck the flexible circuit board to be pressed to the placement area or move the pressed flexible circuit board away from the placement area; the longitudinally arranged Z-axis guide rail 242 can move along the Z-axis guide rail 242. The X-axis guide rail 241 performs horizontal movement, and the vacuum suction cup structure vacuum suction cup mechanism can perform longitudinal movement along the Z-axis guide rail 242, that is to say, the horizontal movement and longitudinal movement of the vacuum suction cup mechanism 243 are realized, so that the vacuum suction cup mechanism 243 can transport the flexible circuit board to be laminated to the placement area of ​​the lower film 252, or move the laminated flexible circuit board away from the placement area; the vacuum suction cup mechanism 243 absorbs firmly and is not easy to fall off, and a plurality of suction holes are evenly distributed on the vacuum suction cup mechanism, which further enhances the suction effect of the vacuum suction cup structure vacuum suction cup mechanism.

[0031] Furthermore, a raw material area 260 for placing flexible circuit boards to be pressed is provided inside the shell 30, and the flexible circuit boards to be pressed are stacked and placed in the raw material area 260; a finished product area 270 for placing flexible circuit boards that have been pressed is provided inside the shell 30, and the flexible circuit boards that have been pressed are stacked and placed in the finished product area 270; in this way, the robot 240 can grab the flexible circuit boards to be pressed from the raw material area 260 and move them to the placement area of ​​the lower film 252. When the flexible circuit boards are pressed, the robot 240 moves the pressed flexible circuit boards from the placement area of ​​the lower film 252 to the finished product area 270.

[0032] As an embodiment of the present invention, a sensor for sensing whether there are any flexible circuit boards to be pressed in the raw material area 260 is provided on the vacuum suction cup structure. The sensor is electrically connected to a first alarm. When the sensor senses that there are no flexible circuit boards to be pressed in the raw material area 260, the first alarm sends out a reminder alarm. In this way, when the raw material area 260 is short of materials, the first alarm sends out a reminder alarm to remind the staff to replenish the materials in time. Preferably, the sensor adopts a photoelectric sensor.

[0033] As an embodiment of the present invention, the membrane-supporting structure of the membrane-supporting mechanism includes a lower membrane-supporting assembly and an upper membrane-supporting assembly which are arranged opposite to each other up and down; the lower membrane-supporting assembly includes a first rear membrane-supporting rod 2211 which can move horizontally and up and down, and a first front membrane-supporting rod 2212 which can move up and down, the first rear membrane-supporting rod 2211 abuts against the upper end surface of the lower membrane 252, and the first front membrane-supporting rod 2212 abuts against the lower end surface of the lower membrane 252; the upper membrane-supporting assembly includes a second rear membrane-supporting rod 2221 and a second front membrane-supporting rod 2222, the second rear membrane-supporting rod 2221 abuts against the lower end surface of the upper membrane 251, and the second front membrane-supporting rod 2222 abuts against the upper end surface of the upper membrane 251; in this way, the cooperation of the lower membrane-supporting assembly and the upper membrane-supporting assembly which are arranged opposite to each other up and down realizes the expansion of the release film to form an upper and lower double-layer membrane structure 250.

[0034] Preferably, the power element is arranged below the lower pressing plate 120, and the power element drives the lower pressing plate 120 to move upward to achieve the pressing of the flexible circuit board, and the power element drives the lower pressing plate 120 to move downward to achieve the separation movement between the upper pressing plate 110 and the lower pressing plate 120.

[0035] As a preferred embodiment, the power element is a compression cylinder.

[0036] As an embodiment of the present invention, the opening and closing mechanism includes a brake mechanism for pressing and fixing the first front film-supporting rod 2212 and the release film, a first front film-supporting rod 2212 fixing structure for fixing the first front film-supporting rod 2212 and the lower pressure plate 120, and a first rear film-supporting rod 2211 fixing structure for fixing the first rear film-supporting rod 2211 and the lower pressure plate 120. When the upper film 251 and the lower film 252 of the upper and lower double-layer membrane structure 250 need to be closed to each other, the first front film-supporting rod 2212 and the release film are pressed and fixed by the brake mechanism, and then the power element drives the lower pressure plate 120 to move upward. The upward movement of the lower pressure plate 120 drives the first front film-supporting rod 2212 and the first rear film-supporting rod 2211 to move upward. At the same time, during the upward movement, in order to ensure that the release film is taut, the first rear film-supporting rod 2212 and the lower pressure plate 120 are fixed to each other. The rod 2211 will also move horizontally in a direction away from the first front supporting film rod 2212, thereby achieving the mutual closure of the lower film 252 relative to the upper film 251. That is to say, while the quick pressing machine part 10 is performing pressing, the upper film 251 and the lower film 252 of the upper and lower double-layer membrane structure 250 are closed. When the pressing is completed, the power element will drive the lower pressure plate 120 to move downward. The downward movement of the lower pressure plate 120 will drive the first front supporting film rod 2212 and the first rear supporting film rod 2211 to move downward. During the downward movement, the first rear supporting film rod 2211 will also move horizontally in a direction close to the first front supporting film rod 2212, thereby achieving the opening of the lower film 252 relative to the upper film 251. The pressed flexible circuit board will be exposed, making it convenient for the robot 240 to move the pressed flexible circuit board away.

[0037] As an embodiment of the present invention, the brake mechanism includes a push rod 2311 which extends horizontally and can move horizontally. The movement direction of the push rod 2311 is perpendicular to the extension direction of the push rod 2311. Along the extension direction of the push rod 2311, a plurality of pressing parts 2312 for pressing the release film are arranged at intervals on the outer periphery of the push rod 2311. The pressing parts 2312 have a contact end surface for contacting the release film, and the contact end surface is provided with glue. In this way, when it is necessary to press and fix the first front film support rod 2212 to the release film, it is only necessary to push the push rod 2311 horizontally so that the pressing parts 2312 arranged on the outer periphery of the push rod 2311 press the release film. The adhesive is provided on the contact end surface of the pressing parts 2312 to further improve the pressing and fixing effect.

[0038] As an embodiment of the present invention, the supporting membrane structure is expanded to form two upper and lower double-layer membrane structures 250 arranged vertically opposite to each other, namely a first upper and lower double-layer membrane structure 250 and a second upper and lower double-layer membrane structure 250 located above the first upper and lower double-layer membrane structure 250. The upper membrane 251 of the first upper and lower double-layer membrane structure 250 is connected to the lower membrane 252 of the second upper and lower double-layer membrane structure 250 through a connecting membrane body 254; in this way, two flexible circuit boards are placed in the placement area on the lower membrane 252 of the first upper and lower double-layer membrane structure 250 and the placement area of ​​the lower membrane 252 of the second upper and lower double-layer membrane structure 250 at one time, respectively, so that the two flexible circuit boards can be fully automatically pressed at one time, and the pressing efficiency is further improved.

[0039] As an embodiment of the present invention, a supporting connecting film body 254 component for supporting the connecting film body 254 is arranged between the upper film 251 of the first upper and lower double-layer membrane structure 250 and the lower film 252 of the second upper and lower double-layer membrane structure 250, and the connecting film body 254 component includes a plurality of staggered and horizontally arranged support rods; the length of the connecting film body 254 supported by the supporting connecting film body 254 component is the same as the length of the lower film 252 of the second upper and lower double-layer membrane structure 250; in this way, when the first upper and lower double-layer membrane structure 250 and the second upper and lower double-layer membrane structure 250 are used to wrap the flexible circuit board and press the flexible circuit board, the connecting film body 254 is transported by the film material conveying mechanism 210 to become the new lower film 252 of the second upper and lower double-layer membrane structure 250, so that the connecting film body 254 is effectively utilized, thereby improving the utilization rate of the release film.

[0040] The fully automatic lamination device for the flexible circuit board also includes a film material storage mechanism 280 for storing used release films; the film material storage mechanism 280 can store used release films, and the cooperation between the film material storage mechanism 280 and the film material conveying mechanism 210 can effectively realize the circulation output and storage of the film material.

[0041] Specifically, the film material storage mechanism 280 includes a first motor, a storage cylinder 282 fixedly connected to the rotating shaft of the first motor, and a first conveying power structure 283 for driving the release film to be transported in the direction of the storage cylinder 282; the first motor drives the storage cylinder 282 to rotate so that the release film conveyed by the first conveying power structure 283 is wound and stored on the outer periphery of the storage cylinder 282; in this way, the first conveying power structure 283 drives the release film to be transported in the direction toward the storage cylinder 282, and at the same time, the rotating shaft of the first motor rotates, and the rotating shaft of the first motor drives the storage barrel to rotate, thereby realizing the storage of the release film conveyed by the first conveying power structure 283; by controlling the rotation of the first motor and the operation of the first conveying power structure 283, it can be controlled whether the used film material is stored.

[0042] Specifically, the first conveying power structure 283 includes two first rotating rods 2831 which are arranged opposite to each other up and down, and the release film is located between the two first rotating rods 2831. The upper end surface of the release film abuts against the upper first rotating rod 2831, and the lower end surface of the release film abuts against the lower first rotating rod 2831; the rotation of the two first rotating rods 2831 respectively generates a first driving force for driving the release film to be conveyed toward the storage tube 282; in this way, the release film is driven to be conveyed toward the storage tube 282 through the rotation of the two first rotating rods 2831.

[0043] A first gravity rod 284 that can move freely up and down is arranged between the first conveying power structure 283 and the storage tube 282. The first gravity rod 284 is arranged horizontally and is located above the release film; the shell 30 is provided with a first track arranged longitudinally, and the first gravity rod 284 is fixedly connected with the first connecting structure, and the first connecting structure is provided with a first track groove extending longitudinally, and the first track groove is freely slidably matched with the first track, so that the first gravity rod 284 can move freely up and down; in this way, through the arrangement of the first gravity rod 284, it can be ensured that the entire release film is in a taut state and will not be in a relaxed state. When the film material conveying mechanism 210 outputs the film material, the second gravity rod 214 will fall to tighten the release film as a whole. When the film material storage mechanism 280 stores the used film material, the film material is stored and the first gravity rod 284 will slide upward.

[0044] Furthermore, photoelectric sensors are respectively provided at the highest position and the lowest position to which the first gravity rod 284 can move; when the first gravity rod 284 moves to the lowest position, the photoelectric sensor at the lowest position senses the first gravity rod 284, and the first motor of the film material storage mechanism 280 starts working to store the film material; when the first gravity rod 284 moves to the highest position, the photoelectric sensor at the highest position senses the first gravity rod 284, and the first motor of the film material storage mechanism 280 stops working and stops storing the film material.

[0045] In this embodiment, the film material conveying mechanism 210 includes a second motor, a reel 212 fixedly connected to the rotating shaft of the second motor and having multiple layers of release film wrapped around the outer circumference, and a second conveying power structure 213 that drives the release film to be conveyed in a direction away from the reel 212; the reel 212 rotates so that the release film wrapped around the outer circumference of the reel 212 is output, and the output release film is output in a direction away from the reel 212 driven by the second conveying power structure 213; in this way, the rotation of the rotating shaft of the second motor drives the reel 212 to rotate, and the rotation of the reel 212 causes the release film wrapped around the outer circumference of the reel 212 to be output, and at the same time, the second conveying power structure 213 drives the reel 212 to rotate and output the film material in a direction away from the reel 212.

[0046] Specifically, the second conveying power structure 213 includes two second rotating rods 2131 arranged vertically opposite to each other, the release film is located between the two second rotating rods 2131, the upper end surface of the release film abuts against the upper second rotating rod 2131, and the lower end surface of the release film abuts against the lower second rotating rod 2131; the rotation of the two second rotating rods 2131 respectively generates a second driving force to drive the release film to be conveyed in a direction away from the roll 212; in this way, through the rotation of the two second rotating rods 2131, the release film is driven to be conveyed in a direction away from the roll 212.

[0047] The release film is transported forward in a direction away from the reel 212, and a second gravity rod 214 that can move freely up and down is arranged in front of the second conveying power structure 213. The second gravity rod 214 is arranged horizontally, and the second gravity rod 214 is located above the release film; the shell 30 is provided with a longitudinally arranged second track, and the second gravity rod 214 is fixedly connected to the second connecting structure, and the second connecting structure is provided with a longitudinally extending second track groove, and the second track groove is freely slidably matched with the second track, so that the second gravity rod 214 can move freely up and down; in this way, through the arrangement of the second gravity rod 214, it can be ensured that the entire release film is in a taut state and will not be in a relaxed state. When the film material conveying mechanism 210 outputs the film material, the second gravity rod 214 will fall, so that the release film is tightened as a whole. When the film material storage mechanism 280 stores the used film material, the film material is stored, and the film material will move as a whole, driving the second gravity rod 214 to slide upward.

[0048] Furthermore, photoelectric sensors are respectively provided at the highest position and the lowest position to which the second gravity rod 214 can move; when the second gravity rod 214 moves to the lowest position, the photoelectric sensor at the lowest position senses the second gravity rod 214, and the second motor of the film material conveying mechanism 210 stops working; when the film material storage mechanism 280 stores the film material, the second gravity rod 214 will be driven to move to the highest position, and the photoelectric sensor at the highest position senses the second gravity rod 214, then the second motor of the film material conveying mechanism 210 starts working, and the reel 212 rotates and outputs the film material.

[0049] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. Fully automatic pressing device for flexible circuit boards, characterized in that: The invention comprises a fast press part and a manipulator part; the fast press part comprises a pressing area and a power element for performing high-temperature pressing on a flexible circuit board wrapped with a release film, an upper pressing plate and a lower pressing plate are respectively arranged above and below the pressing area, and the power element drives the upper pressing plate and the lower pressing plate to approach or move away from each other; the manipulator part comprises a film material conveying mechanism for outputting the release film, a film supporting structure for supporting the film material outputted by the film material conveying mechanism to form at least one upper and lower double-layer film structure, an opening and closing mechanism for driving the upper film and the lower film of the upper and lower double-layer film structure to open or close to each other, and a manipulator for transporting the flexible circuit board to be pressed into the upper and lower double-layer film structure or moving the pressed flexible circuit board away from the upper and lower double-layer film structure; the upper and lower double-layer film structure is formed in the pressing area; The upper and lower double-layer membrane structure comprises an upper membrane, a lower membrane and a side membrane for connecting the upper membrane and the lower membrane, which are arranged vertically opposite to each other; a placement area for placing a flexible circuit board to be pressed is formed on the lower membrane; The fully automatic lamination device for the flexible circuit board comprises a housing, the manipulator comprises an X-axis guide rail formed inside the housing and arranged horizontally, a Z-axis guide rail that can move horizontally along the X-axis guide rail and is arranged longitudinally, and a vacuum suction cup mechanism that can move longitudinally along the Z-axis guide rail and is arranged horizontally; the vacuum suction cup mechanism is used to suck the flexible circuit board to be laminated to the placement area or move the laminated flexible circuit board away from the placement area; The membrane-supporting structure includes a lower membrane-supporting assembly and an upper membrane-supporting assembly which are arranged vertically opposite to each other; the lower membrane-supporting assembly includes a first rear membrane-supporting rod which can move horizontally and vertically and a first front membrane-supporting rod which can move vertically, the first rear membrane-supporting rod abuts against the upper end surface of the lower membrane, and the first front membrane-supporting rod abuts against the lower end surface of the lower membrane; the upper membrane-supporting assembly includes a second rear membrane-supporting rod and a second front membrane-supporting rod, the second rear membrane-supporting rod abuts against the lower end surface of the upper membrane, and the second front membrane-supporting rod abuts against the upper end surface of the upper membrane.

2. The fully automatic pressing device for a flexible circuit board according to claim 1, characterized in that: The shell is provided with a raw material area for placing flexible circuit boards to be pressed, and the flexible circuit boards to be pressed are stacked and placed in the raw material area; the shell is provided with a finished product area for placing pressed flexible circuit boards, and the pressed flexible circuit boards are stacked and placed in the finished product area.

3. The fully automatic pressing device for a flexible circuit board according to claim 1, characterized in that: The vacuum suction cup mechanism is provided with a sensor for sensing whether there are flexible circuit boards to be pressed in the raw material area. The sensor is electrically connected to a first alarm. When the sensor senses that there are no flexible circuit boards to be pressed in the raw material area, the first alarm sends out a reminder alarm.

4. The fully automatic pressing device for a flexible circuit board according to claim 1, characterized in that: The opening and closing mechanism includes a brake mechanism for pressing and fixing the first front film-supporting rod and the release film, a first front film-supporting rod fixing structure for fixing the first front film-supporting rod and the lower pressure plate, and a first rear film-supporting rod fixing structure for fixing the first rear film-supporting rod and the lower pressure plate.

5. The fully automatic pressing device for a flexible circuit board according to claim 4, characterized in that: The brake mechanism includes a push rod extending horizontally and capable of horizontal movement, wherein the movement direction of the push rod is perpendicular to the extension direction of the push rod, and along the extension direction of the push rod, a plurality of pressing members for pressing the release film are arranged at intervals on the outer periphery of the push rod, wherein the pressing members have a contact end surface for contacting the release film, and adhesive is provided on the contact end surface.

6. The fully automatic pressing device for a flexible circuit board according to any one of claims 1 to 5, characterized in that: The membrane support structure is expanded to form two upper and lower double-layer membrane structures arranged longitudinally opposite to each other, namely a first upper and lower double-layer membrane structure and a second upper and lower double-layer membrane structure located above the first upper and lower double-layer membrane structure. The upper membrane of the first upper and lower double-layer membrane structure is connected to the lower membrane of the second upper and lower double-layer membrane structure through a connecting membrane body.

7. The fully automatic pressing device for a flexible circuit board according to claim 6, characterized in that: A supporting connecting membrane assembly for stretching the connecting membrane body is arranged between the upper membrane of the first upper and lower double-layer membrane structure and the lower membrane of the second upper and lower double-layer membrane structure. The connecting membrane assembly includes a plurality of staggered and horizontally arranged support rods. The length of the connecting membrane body stretched by the supporting connecting membrane assembly is the same as the length of the lower membrane of the second upper and lower double-layer membrane structure.

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