Radiation detector and method for manufacturing the same, and radiation imaging device

Abstract

Provided are a radiation detector and a method for manufacturing the same, and a radiation imaging device. The radiation detector includes: a flexible substrate; a plurality of pixels disposed on the substrate and each including a photoelectric conversion element; a scintillator having a plurality of columnar crystals stacked on the substrate; and a deflection suppression member for suppressing deflection of the substrate. When the average value of the height of the columnar crystals is set to L, the average value of the radius of the columnar crystals is set to r, the average value of the intervals between the columnar crystals is set to d, the average value of the angle of the front end of the columnar crystals is set to Φ, and the radius of curvature of the deflection generated on the substrate due to the weight of the scintillator is set to R, the deflection suppression member has a condition satisfying R≥L‑r / tanФ+4r·{(L‑r / tanФ) 2 ‑(d / 2) 2} 1 / 2 / d rigidity.

Description

Technical Field

[0001] The disclosed technology relates to a radiation detector and a method for manufacturing the same, and a radiation imaging device. Background Art

[0002] As a technology related to a radiographic imaging device, for example, the following technology is known. Japanese Patent Publication No. 2012-173275 (Patent Document 1) describes a radiographic imaging device, which comprises: a radiographic imaging device body having a scintillator and a light detecting portion disposed on the radiation incident side of the scintillator; and a supporting member, which is disposed on the radiation incident side of the radiographic imaging device body and supports the object. The light detecting portion comprises: a thin film portion that detects fluorescence as an electrical signal; and a reinforcing member disposed on the side of the thin film portion opposite to the scintillator side. The reinforcing member is joined to the supporting member and is in close contact along the joining surface.

[0003] Japanese Patent Gazette No. 2012-189487 (Patent Document 2) describes a radiation imaging device comprising: a scintillator panel having a scintillator and a supporting substrate supporting the scintillator; a sensor panel having a light sensor for detecting light converted by the scintillator and a sensor substrate on which the light sensor is provided, the sensor panel being bonded to the scintillator via a first adhesive layer; and a reinforcing plate being bonded to the supporting substrate via a second adhesive layer.

[0004] Japanese Patent Publication No. 2012-132768 (Patent Document 3) describes a radiation detection panel, which includes a housing, a scintillator housed in the housing, and a light detection unit arranged on the light emitting side of the scintillator in the housing. The housing is provided with a top plate that is bent by a load on the surface irradiated with radiation. The scintillator has a plurality of columnar crystals arranged upright, and is deformed by the bending of the top plate. The gaps between the columnar crystals are larger at the peripheral portion of the surface where the columnar crystals are provided than at the central portion. Summary of the invention

[0005] Problems to be solved by the invention

[0006] As a radiation detector used in a radiographic imaging device, there is known a radiation detector comprising: a substrate; a plurality of pixels disposed on the surface of the substrate and each comprising a photoelectric conversion element; and a scintillator stacked on the substrate. In recent years, as a material constituting the substrate of the radiation detector, a flexible material such as a resin film has been used. In the case where the substrate is flexible, for example, in the manufacturing process of the radiation detector, when the substrate is handled, the weight of the scintillator stacked on the substrate may cause a large local deflection of the substrate. In the case where the scintillator includes a plurality of columnar crystals, when the substrate is greatly deflected, adjacent columnar crystals come into contact with each other, which may damage the scintillator.

[0007] As one aspect of the disclosed technology, the purpose is to reduce the risk of damage to the scintillator caused by deflection of the substrate generated by the weight of the scintillator, compared to a case where a deflection suppression member whose rigidity is determined by the height, radius, angle of the front end and the spacing between the columnar crystals constituting the scintillator is not used.

[0008] Means for solving problems

[0009] A radiation detector of a first mode of the disclosed technology includes: a substrate having flexibility; a plurality of pixels, which are arranged on the substrate and each include a photoelectric conversion element; a scintillator, which has a plurality of columnar crystals stacked on the substrate; and a deflection suppression member, which suppresses deflection of the substrate, when the average value of the height of the columnar crystals is set to L, the average value of the radius of the columnar crystals is set to r, the average value of the intervals between the columnar crystals is set to d, the average value of the angle of the front end of the columnar crystal is set to Φ, and the curvature radius of the deflection generated on the substrate due to the weight of the scintillator is set to R,

[0010] The deflection restraining member has a rigidity satisfying the following equation:

[0011] R ≥ Lr / tanΦ+4r×{(Lr / tanΦ) 2 -(d / 2) 2} 1 / 2 / d.

[0012] In a radiation detector of a second mode of the disclosed technology, a scintillator is stacked on a first surface side of a substrate, and a deflection suppression member is stacked on at least one of a second surface side of the substrate opposite to the first surface side and a surface side of the scintillator opposite to a surface side in contact with the substrate.

[0013] In the third type of radiation detector of the disclosed technology, the deflection suppression member is laminated on both the second surface side of the substrate and the surface side of the scintillator opposite to the surface side in contact with the substrate.

[0014] In the radiation detector of the fourth aspect of the disclosed technology, the deflection suppression member has higher rigidity than the substrate.

[0015] In the radiation detector of the fifth aspect of the disclosed technology, the deflection suppression member extends over a range larger than the range over which the scintillator extends.

[0016] In the radiation detector of a sixth aspect of the disclosed technology, the substrate has a connection region connected to the flexible wiring, and the deflection suppression member is provided in a region covering at least a portion of the connection region and the scintillator.

[0017] In the radiation detector according to a seventh aspect of the disclosed technology, the bending elastic modulus of the deflection suppression member is 1000 MPa or more and 3500 MPa or less.

[0018] In the radiation detector of an eighth aspect of the disclosed technology, a ratio of a thermal expansion coefficient of the deflection suppression member to a thermal expansion coefficient of the scintillator is 0.5 or more and 2 or less.

[0019] In the radiation detector of a ninth aspect of the disclosed technology, the thermal expansion coefficient of the deflection suppression member is 30 ppm / K or more and 80 ppm / K or less.

[0020] In the radiation detector according to a tenth aspect of the disclosed technology, the deflection suppression member is configured to include at least one of acrylic, polycarbonate, and polyethylene terephthalate.

[0021] The radiation detector according to the eleventh aspect of the disclosed technology further includes a reinforcing member provided in a region straddling an end portion of the scintillator, and reinforcing a deflection suppressing effect of the deflection suppressing member.

[0022] In the radiation detector of the twelfth aspect of the disclosed technology, the reinforcing member has higher rigidity than the substrate.

[0023] In the radiation detector of the thirteenth aspect of the disclosed technology, the reinforcing member is made of the same material as the deflection suppressing member.

[0024] In the radiation detector according to a fourteenth aspect of the disclosed technology, the substrate is configured to include a resin film.

[0025] In the fifteenth mode of the radiation detector of the disclosed technology, the substrate is constructed to include a base material composed of a resin material having a particle layer, the particle layer including particles composed of an inorganic material having an average particle size of greater than 0.05 μm and less than 2.5 μm, and the particle layer is arranged on the second surface side of the substrate opposite to the first surface on which the multiple pixels are arranged.

[0026] In the radiation detector of the sixteenth aspect of the disclosed technology, the microparticles contain an element having an atomic number greater than that of an element constituting the resin material and having an atomic number of 30 or less.

[0027] In the radiation detector of the seventeenth aspect of the disclosed technology, the thermal expansion coefficient of the substrate at 300° C. to 400° C. is 20 ppm / K or less.

[0028] In the radiation detector of the eighteenth aspect of the disclosed technology, the substrate satisfies at least one of the following two conditions: the thermal shrinkage rate in the longitudinal direction at 400°C when the thickness of the substrate is set to 25 μm is 0.5% or less, and the elastic modulus at 500°C is 1 GPa or more.

[0029] A radiation detector according to a nineteenth aspect of the disclosed technology further includes a buffer layer provided between the substrate and the scintillator and having a thermal expansion coefficient between the thermal expansion coefficient of the substrate and the thermal expansion coefficient of the scintillator.

[0030] In the radiation detector of the twentieth aspect of the disclosed technology, the scintillator has a non-columnar portion on one end side of the columnar crystal, and the non-columnar portion is in contact with the substrate.

[0031] In the radiation detector of the twenty-first aspect of the disclosed technology, the deflection suppression member extends in regions corresponding to the central portion and the peripheral portion of the scintillator.

[0032] In the radiation detector of the twenty-second aspect of the disclosed technology, the deflection suppression member is bent along the inclination of the peripheral edge portion of the scintillator.

[0033] In the radiation detector of the twenty-third aspect of the disclosed technology, a space corresponding to the inclination of the peripheral portion of the scintillator is formed between the deflection suppression member and the scintillator.

[0034] In the radiation detector of the twenty-fourth aspect of the disclosed technology, the space formed between the deflection suppressing member and the scintillator is filled with a filling material.

[0035] In the radiation detector according to the twenty-fifth aspect of the disclosed technology, the end portion of the deflection suppression member is supported by the spacer.

[0036] In the radiation detector of a twenty-sixth aspect of the disclosed technology, the deflection suppression member is bent along the inclination of the peripheral edge portion of the scintillator, and an end portion of the deflection suppression member is sealed by a sealing member.

[0037] In the radiation detector of a twenty-seventh aspect of the disclosed technology, the reinforcing member is provided in a region that does not overlap with the pixel region.

[0038] A radiation imaging device according to a twenty-eighth aspect of the disclosed technology includes: a radiation detector according to any one of the first to twenty-seventh aspects; a readout unit that reads out charges accumulated in pixels; and a generation unit that generates image data based on the charges read out from the pixels.

[0039] The radiation imaging device of the twenty-ninth aspect of the disclosed technology further includes a housing having a radiation incident surface on which radiation is incident and accommodating the radiation detector, wherein the substrate of the substrate and the scintillator is arranged on the radiation incident surface side.

[0040] The manufacturing method of the radiation detector of the thirtieth aspect of the disclosed technology includes the following steps: a step of forming a plurality of pixels each including a photoelectric conversion element on a flexible substrate; a step of forming a scintillator having a plurality of columnar crystals on the substrate; and a step of configuring a deflection suppression member for suppressing deflection of the substrate, and adjusting the rigidity of the deflection suppression member according to the height of the columnar crystal, the radius of the columnar crystal, the angle of the front end of the columnar crystal, and the spacing between the columnar crystals.

[0041] In the manufacturing method of the thirty-first aspect of the disclosed technology, when the average value of the height of the columnar crystals is set to L, the average value of the radius of the columnar crystals is set to r, the average value of the intervals between the columnar crystals is set to d, the average value of the angles of the front ends of the columnar crystals is set to Φ, and the curvature radius of the deflection of the substrate caused by the weight of the scintillator is set to R,

[0042] The deflection restraining member has a rigidity satisfying the following equation:

[0043] R ≥ Lr / tanΦ+4r×{(Lr / tanΦ) 2 -(d / 2) 2} 1 / 2 / d.

[0044] In the manufacturing method of the thirty-second aspect of the disclosed technology, the step of forming the scintillator includes the step of growing columnar crystals on the surface of the substrate by a vapor phase growth method.

[0045] Effects of the Invention

[0046] According to the first method of the disclosed technology, the risk of damage to the scintillator caused by deflection of the substrate generated by the weight of the scintillator can be reduced compared to the case where a deflection suppression component whose rigidity is determined by the height, radius, angle of the front end and the spacing between the columnar crystals is not used.

[0047] According to the second aspect of the disclosed technology, the deflection suppressing effect of the deflection suppressing member can be effectively exerted.

[0048] According to the third aspect of the disclosed technology, the risk of damaging the scintillator due to deflection of the substrate can be further reduced.

[0049] According to the fourth aspect of the disclosed technology, the deflection suppressing effect of the deflection suppressing member can be effectively exerted.

[0050] According to the fifth aspect of the disclosed technology, the deflection suppressing effect of the deflection suppressing member can be effectively exerted.

[0051] According to the sixth aspect of the disclosed technology, the deflection suppressing effect of the deflection suppressing member can be effectively exerted.

[0052] According to the seventh aspect of the disclosed technology, it is possible to have rigidity that is suitable as a deflection suppression member.

[0053] According to the eighth aspect of the disclosed technology, the risk of separation between the substrate and the scintillator can be suppressed compared to a case where the ratio of the thermal expansion coefficient of the deflection suppression member to the thermal expansion coefficient of the scintillator is not within the above range.

[0054] According to the ninth aspect of the disclosed technology, compared with a case where the thermal expansion coefficient of the deflection suppression member is not within the above range, the risk of separation between the substrate and the scintillator can be suppressed.

[0055] According to the tenth aspect of the disclosed technology, compared with a case where the deflection suppressing member is composed of other materials, the deflection suppressing effect of the deflection suppressing member can be effectively exerted, and the risk of separation between the substrate and the scintillator can be suppressed.

[0056] According to the eleventh aspect of the disclosed technology, compared with a case where no reinforcing member is included, deflection of the portion of the substrate corresponding to the end portion of the scintillator can be suppressed.

[0057] According to the twelfth aspect of the disclosed technology, the effect of reinforcing the deflection suppressing effect of the deflection suppressing member is effectively exerted.

[0058] According to the thirteenth aspect of the disclosed technology, the effect of reinforcing the deflection suppressing effect of the deflection suppressing member is effectively exerted.

[0059] According to the fourteenth aspect of the disclosed technology, compared with the case where a glass substrate is used as the material of the substrate, it is possible to achieve a reduction in weight and cost of the radiation detector, and further, it is possible to reduce the risk of damage to the substrate due to impact.

[0060] According to the fifteenth aspect of the disclosed technology, compared with a case where the substrate does not include a particle layer, backscattered rays generated in the substrate can be suppressed.

[0061] According to the sixteenth aspect of the disclosed technology, compared with the case where the atomic number of the microparticles is not in the above range, backscattered radiation can be suppressed more effectively and absorption of radiation in the microparticle layer can be suppressed.

[0062] According to the seventeenth aspect of the disclosed technology, compared with a case where the thermal expansion coefficient of the substrate is not within the above range, it is possible to appropriately form pixels on the substrate.

[0063] According to the eighteenth aspect of the disclosed technology, compared with the case where the thermal shrinkage rate and the elastic modulus of the substrate are not within the above ranges, it is possible to appropriately form pixels on the substrate.

[0064] According to the nineteenth aspect of the disclosed technology, the thermal stress acting on the interface between the substrate and the scintillator can be suppressed compared to a case where no buffer layer is included.

[0065] According to the twentieth aspect of the disclosed technology, the non-columnar portion of the scintillator is in contact with the substrate, and the tip of the columnar crystal is on the surface side of the scintillator. The disclosed technology is particularly effective when the tip of the columnar crystal is on the surface side of the scintillator.

[0066] According to the twenty-eighth embodiment of the disclosed technology, the risk of damage to the scintillator caused by the deflection of the substrate generated by the weight of the scintillator can be reduced compared to the case where a deflection suppression component whose rigidity is determined by the height, radius, angle of the front end and the spacing between the columnar crystals is not used.

[0067] According to the twenty-ninth aspect of the disclosed technology, the resolution of the radiation image can be improved compared to a case where the scintillator among the substrate and the scintillator is arranged on the radiation incident surface side.

[0068] According to the thirtieth embodiment of the disclosed technology, regarding the rigidity of the deflection suppression member, the risk of damage to the scintillator caused by the deflection of the substrate generated by the weight of the scintillator can be reduced compared to the case where a deflection suppression member whose rigidity is determined by the height, radius, angle of the front end and the spacing between the columnar crystals is not used.

[0069] According to the thirty-first aspect of the disclosed technology, it is possible to ensure that the risk of damage to the scintillator caused by deflection on the substrate due to the weight of the scintillator is reduced.

[0070] According to the thirty-second aspect of the disclosed technology, columnar crystals can be stably formed. BRIEF DESCRIPTION OF THE DRAWINGS

[0071] Figure 1 This is a perspective view showing an example of the structure of a radiation imaging device according to an embodiment of the disclosed technology.

[0072] Figure 2This is a cross-sectional view showing an example of the structure of a radiation imaging device according to an embodiment of the disclosed technology.

[0073] Figure 3 This is a diagram showing an example of the electrical configuration of a radiation imaging device according to an embodiment of the disclosed technology.

[0074] Figure 4 This is a diagram showing a state in which two adjacent columnar crystals are in contact with each other due to arc-shaped deflection of the substrate.

[0075] Figure 5A This is a cross-sectional view showing an example of a method for manufacturing a radiation detector according to an embodiment of the disclosed technology.

[0076] Figure 5B This is a cross-sectional view showing an example of a method for manufacturing a radiation detector according to an embodiment of the disclosed technology.

[0077] Figure 5C This is a cross-sectional view showing an example of a method for manufacturing a radiation detector according to an embodiment of the disclosed technology.

[0078] Figure 5D This is a cross-sectional view showing an example of a method for manufacturing a radiation detector according to an embodiment of the disclosed technology.

[0079] Figure 6 : is a cross-sectional view showing a columnar crystal formed on a substrate according to an embodiment of the disclosed technology.

[0080] Fig. 7A This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0081] Figure 7B This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0082] Fig. 8A This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0083] Figure 8B This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0084] Figure 8C This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0085] Fig. 9 This is a cross-sectional view showing an example of a state in which a substrate is bent due to the weight of a scintillator.

[0086] Fig.10This is a cross-sectional view showing an example of the structure of a substrate according to an embodiment of the disclosed technology.

[0087] Fig.11A is a cross-sectional view showing backscattered rays generated in a substrate having a microparticle layer.

[0088] Fig. 11B It is a cross-sectional view showing backscattered rays generated in a substrate having no microparticle layer.

[0089] Fig.12 This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0090] Fig.13 This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0091] Fig.14 This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0092] Fig.15 This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0093] Fig.16 This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0094] Fig.17 This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0095] Fig.18 This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0096] Fig.19 This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0097] Fig. 20 This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0098] Fig.21 This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0099] Fig. 22 This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0100] Fig.23 This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0101] Fig.24 This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0102] Fig.25 This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0103] Fig.26 This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0104] Fig. 27 This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0105] Fig.28 This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0106] Fig.29 This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0107] Fig.30 This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0108] Fig.31 This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0109] Fig.32 This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0110] Fig.33 This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0111] Fig.34 This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0112] Fig.35 This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0113] Fig.36 This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0114] Fig.37 This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0115] Fig.38This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0116] Fig.39 This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0117] Fig.40 This is a plan view showing an example of the structure of the deflection suppression member according to the embodiment of the disclosed technology.

[0118] Fig.41 This is a perspective view showing an example of the structure of the deflection suppression member according to the embodiment of the disclosed technology.

[0119] Fig.42 This is a cross-sectional view showing an example of the structure of a radiation detector according to an embodiment of the disclosed technology.

[0120] Fig.43 This is a plan view showing an example of the structure of the deflection suppression member according to the embodiment of the disclosed technology.

[0121] Fig.44 This is a plan view showing an example of the structure of the deflection suppression member according to the embodiment of the disclosed technology.

[0122] Fig.45 This is a cross-sectional view showing an example of the structure of a radiation imaging device according to an embodiment of the disclosed technology.

[0123] Fig.46 This is a cross-sectional view showing an example of the structure of a radiation imaging device according to an embodiment of the disclosed technology.

[0124] Fig.47 This is a cross-sectional view showing an example of the structure of a radiation imaging device according to an embodiment of the disclosed technology.

[0125] Description of reference numerals:

[0126] 10. Radiographic imaging devices;

[0127] 12 control unit;

[0128] 14 housing;

[0129] 15 Radiation incident surface;

[0130] 16 supporting plate;

[0131] 18 adhesive layer;

[0132] 19 Circuit board;

[0133] 20 COF;

[0134] 22 gate line driving unit;

[0135] 24 Charge amplifier;

[0136] 26 Signal Processing Unit;

[0137] 28 Image memory;

[0138] 29 Control Department;

[0139] 30, 30A radiation detector;

[0140] 32 Scintillator;

[0141] 32a Columnar crystals;

[0142] 32b non-columnar part;

[0143] 32E end;

[0144] 34 substrate;

[0145] 36 Photoelectric conversion element;

[0146] 41 pixels;

[0147] 42 TFT;

[0148] 43 gate lines;

[0149] 44 signal lines;

[0150] 50 reflective film;

[0151] 60 deflection restraining member;

[0152] 70 reinforcement members;

[0153] L wiring;

[0154] R: radius of curvature;

[0155] S1 first side;

[0156] S2 side 2;

[0157] S3, S4, S5, S6 surfaces;

[0158] R: radius of curvature;

[0159] L is the average value of the height of the columnar crystals;

[0160] Z is the average value of the height of the columnar crystals excluding the front end;

[0161] r is the average value of the radius of the columnar crystals;

[0162] Φ is the average value of the angles of the front ends of the columnar crystals;

[0163] d is the average value of the spacing between columnar crystals;

[0164] θ is the tilt angle of the columnar crystal. DETAILED DESCRIPTION

[0165] Hereinafter, an example of an embodiment of the disclosed technology will be described with reference to the drawings. It should be noted that the same reference numerals are given to the same or equivalent components and parts in each of the drawings.

[0166] [First embodiment]

[0167] Figure 1 1 is a perspective view showing an example of the structure of a radiation imaging device 10 according to an embodiment of the disclosed technology. The radiation imaging device 10 has a movable electronic cassette mode. The radiation imaging device 10 is configured to include a radiation detector 30 (FPD: Flat Panel Detectors), a control unit 12, a support plate 16, and a housing 14 that accommodates the radiation detector 30, the control unit 12, and the support plate 16.

[0168] The housing 14 has a single shell structure made of a carbon fiber reinforced resin (carbon fiber) that is highly permeable to radiation such as X-rays, light, and highly durable. The upper surface of the housing 14 serves as a radiation incident surface 15 on which radiation emitted from a radiation source (not shown) and transmitted through a subject (not shown) is incident. In the housing 14, a radiation detector 30 and a support plate 16 are arranged in order from the radiation incident surface 15 side.

[0169] The support plate 16 supports a circuit board 19 (see Figure 2 ) is supported and fixed to the housing 14. The control unit 12 is arranged at an end portion in the housing 14. The control unit 12 is configured to include a battery (not shown) and a control unit 29 (see Figure 3 ).

[0170] Figure 2 1 is a cross-sectional view showing an example of the structure of the radiation imaging device 10. The radiation detector 30 includes a flexible substrate 34; a plurality of photoelectric conversion elements 36 (see FIG. 1 ) provided on the surface of the substrate 34; and Figure 3 ) a plurality of pixels 41; a scintillator 32 stacked on a substrate 34; and a deflection suppressing member 60 for suppressing deflection of the substrate 34.

[0171] The substrate 34 is a flexible substrate having flexibility. In this specification, the flexibility of the substrate 34 means that when one of the four sides of the rectangular substrate 34 is fixed, due to the weight of the substrate 34, the height of the portion separated by 10 cm from the fixed side of the substrate 34 is more than 2 mm lower than the height of the fixed side. For example, as the material of the substrate 34, a resin substrate, a metal foil substrate, a thin glass with a thickness of about 0.1 mm can be used, and in particular, a resin film such as Xenomax (registered trademark) which is a highly heat-resistant polyimide film can be used. By using a resin film as the material of the substrate 34, compared with the case where a glass substrate is used as the material of the substrate 34, the radiation detector 30 can be made lighter and less expensive, and the risk of damage to the substrate 34 due to impact can be reduced. A plurality of pixels 41 are respectively arranged on the first surface S1 of the substrate 34.

[0172] The thickness of the substrate 34 may be a thickness that provides desired flexibility according to the hardness and size of the substrate 34. When the substrate 34 is formed as a base material including a resin material, the thickness of the substrate 34 is preferably 5 μm to 125 μm, and more preferably 20 μm to 50 μm.

[0173] It should be noted that the coefficient of thermal expansion (CTE) of the substrate 34 at a temperature of 300°C to 400°C is preferably the same as the coefficient of thermal expansion (about ±5ppm / K) of the material (e.g., amorphous silicon) constituting the photoelectric conversion element 36, and specifically, preferably 20ppm / K or less. In addition, the thermal shrinkage rate in the MD (Machine Direction) direction at 400°C when the thickness of the substrate 34 is 25μm is preferably 0.5% or less. In addition, the substrate 34 preferably does not have a transition point that is possessed by ordinary polyimide in the temperature range of 300°C to 400°C, and the elastic modulus at 500°C is preferably 1GPa or more. Since the substrate 34 has the above-mentioned characteristics, it can withstand the heat treatment associated with the formation of the pixel 41 on the substrate 34, and the pixel 41 can be properly formed on the substrate 34.

[0174] In addition, when the substrate 34 is formed of a base material composed of a resin material such as polyimide, Fig.10As shown, the base material made of a resin material preferably has a particle layer 34L, and the particle layer 34L includes a plurality of particles 34P made of an inorganic material having an average particle diameter of 0.05 μm or more and 2.5 μm or less. In addition, the particle layer 34L is preferably provided on the second surface S2 side of the substrate 34 opposite to the first surface S1 on which the pixels 41 are provided. That is, the particles 34P are preferably biased toward the second surface S2 side of the substrate 34. The particles 34P sometimes cause the surface of the substrate 34 to have unevenness, so it is difficult to form the pixels 41 on the surface of the particle layer 34L. By configuring the particle layer 34L on the second surface S2 side of the substrate 34, the flatness of the first surface S1 can be ensured, and the pixels 41 can be easily formed.

[0175] The material of the microparticles 34P is preferably an inorganic material containing an element having an atomic number greater than the atomic number of each element constituting the base material of the substrate 34 and being 30 or less. For example, when the base material of the substrate 34 is composed of a resin material such as polyimide containing C, H, O, and N, the microparticles 34P are preferably an inorganic material containing an element having an atomic number greater than the atomic number of the constituent elements (C, H, O, and N) of the resin material and being 30 or less. As specific examples of such microparticles 34P, SiO2, an oxide of silicon with an atomic number of 14, MgO, an oxide of Mg with an atomic number of 12, Al2O3, an oxide of Al with an atomic number of 13, and TiO2, an oxide of Ti with an atomic number of 22, are cited. In addition, as a specific example of a resin sheet having the above-mentioned characteristics and having a microparticle layer 34L, XENOMAX (registered trademark) is cited.

[0176] It should be noted that the above-mentioned thickness in the present embodiment was measured using a micrometer. The thermal expansion coefficient was measured in accordance with JIS K7197:1991. It should be noted that the measurement was performed in the following manner: a test piece was cut out from the main surface of the substrate 34 at an angle of 15 degrees each time, the thermal expansion coefficient of each test piece cut out was measured, and the highest value was set as the thermal expansion coefficient of the substrate 34. In the measurement of the thermal expansion coefficient, the MD (Machine Direction) direction and the TD (Transverse Direction) direction were measured at intervals of 10°C in -50°C to 450°C, respectively, and (ppm / °C) was converted into (ppm / K). In the measurement of the thermal expansion coefficient, a TMA4000S device manufactured by MAC science was used, the sample length was set to 10 mm, the sample width was set to 2 mm, and the initial load was set to 34.5 g / mm 2, the heating rate was set to 5°C / min, and the ambient gas was set to argon. The elastic modulus was measured in accordance with K 7171:2016. It should be noted that the measurement was performed as follows: a test piece was cut out from the main surface of the substrate 34 at an angle of 15 degrees each time, and a tensile test was performed on each of the cut test pieces, and the highest value was set as the elastic modulus of the substrate 34.

[0177] The scintillator 32 is stacked on the first surface S1 side of the substrate 34. The scintillator 32 includes a phosphor that converts the irradiated radiation into light. As an example, the scintillator 32 is composed of an aggregate of columnar crystals including CsI:T1 (cesium iodide with added thallium). The columnar crystals of CsI:T1 can be directly formed on the substrate 34 by, for example, a vapor phase growth method. By forming the columnar crystals by the vapor phase growth method, the columnar crystals can be stably formed. It should be noted that the columnar crystals of CsI:T1 formed on a substrate different from the substrate 34 can also be attached to the substrate 34. The photoelectric conversion element 36 (see Figure 3 ) generate electric charges based on the light emitted from the scintillator 32, respectively.

[0178] The surface S3 of the scintillator 32 on the opposite side of the surface S6 in contact with the substrate 34 and the surface S4 intersecting the surface S3 are covered by a reflective film 50. The reflective film 50 has a function of reflecting light emitted from the scintillator 32 toward the substrate 34 side. As a material of the reflective film 50, Al2O3 can be used, for example. The reflective film 50 covers the surface S3 and the surface S4 of the scintillator 32, and also covers the substrate 34 at the peripheral portion of the scintillator 32. It should be noted that in the case where a radiographic image of desired image quality can be obtained in the radiographic imaging device 10 even without providing the reflective film 50, the reflective film 50 can be omitted.

[0179] In the present embodiment, the radiation imaging device 10 adopts an imaging method based on a surface reading method (ISS: Irradiation Side Sampling) in which a substrate 34 is arranged on the incident side of the radiation. By adopting the surface reading method, the distance between the strong light emission position in the scintillator 32 and the pixel 41 can be shortened compared to the case of adopting a back reading method (PSS: Penetration Side Sampling) in which a scintillator 32 is arranged on the incident side of the radiation, and as a result, the resolution of the radiation image can be improved. It should be noted that the radiation imaging device 10 may also adopt a back reading method.

[0180] The support plate 16 is arranged on the side opposite to the radiation incident side of the scintillator 32. A gap is provided between the support plate 16 and the scintillator 32. The support plate 16 is fixed to the side of the housing 14. A circuit board 19 is provided on the surface of the support plate 16 on the side opposite to the scintillator 32. The circuit board 19 is equipped with a signal processing unit 26 that generates image data, an image memory 28 that stores the image data generated by the signal processing unit 26, and the like.

[0181] The circuit board 19 and the substrate 34 are electrically connected via a flexible cable 20 printed on a flexible printed circuit (FPC), TCP (Tape Carrier Package) or COF (Chip On Film). The cable 20 is equipped with a charge amplifier 24 that converts the charge read from the pixel 41 into an electrical signal. Figure 2 The gate line driving unit 22 (see FIG. Figure 3 ).

[0182] The deflection suppression member 60 is stacked on the second surface S2 side of the substrate 34 opposite to the first surface S1. The deflection suppression member 60 plays a role in giving the substrate 34 the rigidity required for the substrate 34 to support the scintillator 32. That is, by providing the deflection suppression member 60, the deflection of the substrate 34 caused by the weight of the scintillator 32 is suppressed compared with the case where the deflection suppression member 60 is not provided. The deflection suppression member 60 extends in a range larger than the range where the scintillator 32 extends. That is, the area of ​​the deflection suppression member 60 in a planar view is larger than the area of ​​the scintillator 32, and the scintillator 32 is arranged inside the range where the deflection suppression member 60 extends. Therefore, the end of the deflection suppression member 60 in the planar direction is located at a position outside the end of the scintillator 32 in the planar direction. As a result, the effect of suppressing the deflection of the substrate 34 caused by the weight of the scintillator 32 is promoted. In addition, the substrate 34 has a connection area 80 connected to the cable 20 at the outer periphery of the substrate 34. The deflection suppression member 60 is provided in a region covering at least a portion of the connection region 8 and the scintillator 32. The substrate 34 is also susceptible to deflection in the connection region 80 connected to the cable 20, but by providing the deflection suppression member 60 in a region covering at least a portion of the connection region 80, deflection in the connection region 80 of the substrate 34 can be suppressed.

[0183] From the viewpoint of suppressing the deflection of the substrate 34, the deflection suppression member 60 preferably has a higher rigidity than the substrate 34. The deflection suppression member 60 is preferably a member using a raw material having a bending elastic modulus of 1000 MPa or more and 3500 MPa or less. By setting the bending elastic modulus of the raw material constituting the deflection suppression member 60 to 1000 MPa or more, the function of suppressing the deflection of the substrate 34 in the deflection suppression member 60 can be effectively exerted. By setting the bending elastic modulus of the raw material constituting the deflection suppression member 60 to 3500 MPa or less, for example, in the manufacturing process of the radiation detector 30, when the deflection suppression member 60 is attached to the substrate 34 and a support body (not shown) supporting the substrate 34 is peeled off from the substrate, the substrate 34 is moderately deflected, and thus the peeling of the support body from the substrate 34 becomes easy. It should be noted that the measurement method of the bending elastic modulus can be applied to the measurement method specified in JIS K 7171: 2016. In addition, the bending rigidity of the deflection suppression member 60 is preferably 3600 Pa·cm 4 Above and 196000Pa·cm 4 In addition, the thickness of the deflection suppression member 60 is preferably about 0.1 mm.

[0184] The thermal expansion coefficient of the deflection suppression member 60 is preferably greater than or equal to 30 ppm / K and less than or equal to 80 ppm / K. In addition, the thermal expansion coefficient of the deflection suppression member 60 is preferably close to the thermal expansion coefficient of the scintillator 32. Specifically, the ratio (C2 / C1) of the thermal expansion coefficient C2 of the deflection suppression member 60 to the thermal expansion coefficient C1 of the scintillator 32 is preferably greater than or equal to 0.5 and less than or equal to 2. By satisfying the above-mentioned conditions for the thermal expansion coefficient of the deflection suppression member 60, the risk of separation between the substrate 34 and the scintillator 32 can be suppressed during heating and heat generation. For example, when the scintillator 32 is configured to mainly contain CsI:T1, the thermal expansion coefficient of the scintillator 32 is 50 ppm / K. In this case, polyvinyl chloride (PVC) having a thermal expansion coefficient of 60 ppm / K to 80 ppm / K, acrylic having a thermal expansion coefficient of 70 ppm / K to 80 ppm / K, polyethylene terephthalate (PET) having a thermal expansion coefficient of 65 to 70 ppm / K, polycarbonate (PC) having a thermal expansion coefficient of 65 ppm / K, and Teflon (registered trademark) having a thermal expansion coefficient of 45 ppm / K to 70 ppm / K can be used as the material of the deflection suppression member 60. When the above-mentioned bending elastic modulus is taken into consideration, the material of the deflection suppression member 60 is preferably a material including at least one of acrylic, PET, and PC.

[0185] As other candidate materials for the deflection suppression member 60, for example, resins such as polyphenylene sulfide (PPS), polyarylate (PAR), polysulfone (PSF), polyethersulfone (PES), polyetherimide (PEI), polyamideimide (PAI), polyetheretherketone (PEEK), phenolic resin, polytetrafluoroethylene, polychlorotrifluoroethylene, silicone resin, and polyethylene naphthalate (PEN) can be used. In addition, as the material of the deflection suppression member 60, metals such as aluminum, iron, or alloys thereof can also be used. In addition, as the material of the deflection suppression member 60, a laminated body formed by laminating resins and metals can also be used. The surface S5 of the deflection suppression member 60 on the opposite side of the contact surface with the substrate 34 is adhered to the inner wall of the housing 14 via the adhesive layer 18.

[0186] Figure 3 1 is a diagram showing an example of the electrical structure of the radiation imaging device 10. A plurality of pixels 41 are arranged in a matrix on the first surface S1 of the substrate 34. The pixels 41 each include: a photoelectric conversion element 36 that generates charge based on light emitted from the scintillator 32; and a TFT (Thin Film Transistor) 42 as a switching element that becomes conductive when reading the charge generated in the photoelectric conversion element 36. The photoelectric conversion element 36 may be, for example, a photodiode made of amorphous silicon.

[0187] The first surface S1 of the substrate 34 is provided with gate lines 43 extending in one direction (row direction) along the arrangement of the pixels 41, and signal lines 44 extending in a direction (column direction) intersecting the direction in which the gate lines 43 extend. The pixels 41 are provided corresponding to the intersections of the gate lines 43 and the signal lines 44.

[0188] The gate lines 43 are connected to the gate line driving section 22, respectively. The gate line driving section 22 reads out the charge accumulated in the pixel 41 based on the control signal supplied from the control section 29. The signal lines 44 are connected to the charge amplifier 24, respectively. The charge amplifier 24 is provided corresponding to the plurality of signal lines 44, respectively. The charge amplifier 24 generates an electric signal based on the charge read out from the pixel 41. The output terminal of the charge amplifier 24 is connected to the signal processing section 26. The signal processing section 26 performs a predetermined process on the electric signal supplied from the charge amplifier 24 based on the control signal supplied from the control section 29, thereby generating image data. The image memory 28 is connected to the signal processing section 26. The image memory 28 stores the image data generated by the signal processing section 26 based on the control signal supplied from the control section 29.

[0189] The control unit 29 communicates with a console (not shown) connected to the radiation source via a wired or wireless communication unit (not shown), controls the gate line driving unit 22, the signal processing unit 26 and the image memory 28, and thereby controls the operation of the radiation imaging device 10. The control unit 29 may also be configured to include a microcomputer, for example. It should be noted that the gate line driving unit 22 is an example of a readout unit in the public technology. The signal processing unit 26 is an example of a generation unit in the public technology.

[0190] Hereinafter, an example of the operation of the radiation imaging device 10 will be described. When radiation emitted from a radiation source (not shown) and transmitted through a subject enters the radiation incident surface 15 of the radiation imaging device 10, the scintillator 32 absorbs the radiation and emits visible light. The photoelectric conversion element 36 constituting the pixel 41 converts the light emitted from the scintillator 32 into electric charge. The electric charge generated by the photoelectric conversion element 36 is accumulated in the corresponding pixel 41. The amount of the electric charge generated by the photoelectric conversion element 36 is reflected by the pixel value of the corresponding pixel 41.

[0191] When generating a radiographic image, the gate line driving unit 22 supplies a gate signal to the TFT 42 via the gate line 43 based on a control signal supplied from the control unit 29. The TFT 42 is turned on in a row unit by the gate signal. When the TFT 42 is turned on, the charge accumulated in the pixel 41 is read out from the signal line 44 and supplied to the charge amplifier 24. The charge amplifier 24 generates an electrical signal based on the charge read out from the signal line 44, and supplies the electrical signal to the signal processing unit 26.

[0192] The signal processing unit 26 includes a plurality of sampling and holding circuits, a multiplexer, and an analog-to-digital converter (none of which is shown in the figure). The plurality of sampling and holding circuits are respectively provided corresponding to the plurality of signal lines 44. The electrical signal supplied from the charge amplifier 24 is held by the sampling and holding circuit. The electrical signal held by each sampling and holding circuit is input to the analog-to-digital converter via the multiplexer and converted into a digital signal. The signal processing unit 26 generates data as image data by establishing a correspondence between the digital signal generated by the analog-to-digital converter and the position information of the pixel 41, and supplies the image data to the image memory 28. The image memory 28 stores the image data generated by the signal processing unit 26.

[0193] Since the substrate 34 is flexible, for example, when the substrate 34 is handled in the manufacturing process of the radiation detector 30, the substrate 34 may be partially bent relatively greatly due to the weight of the scintillator 32. In the case where the scintillator 32 includes a plurality of columnar crystals, when the substrate 34 is greatly bent, adjacent columnar crystals may contact each other, and the scintillator 32 may be damaged.

[0194] Figure 42 is a diagram showing a state in which two adjacent columnar crystals 32a constituting the scintillator 32 are in contact with each other due to the arc-shaped deflection of the substrate 34. Figure 4 In the figure, R is the radius of curvature of the deflection produced by the substrate 34, L is the average value of the height of the columnar crystals 32a (also referred to as the average height L). Z is the average value of the height of the columnar crystals 32a excluding the front end, r is the average value of the radius of the columnar crystals 32a (also referred to as the average radius r). Φ is the average value of the angle of the front end of the columnar crystals 32a (also referred to as the average angle Φ), and d is the average value of the interval between adjacent columnar crystals 32a (also referred to as the average interval d). θ is the tilt angle of the columnar crystals 32a caused by the deflection produced by the substrate 34.

[0195] The interval d between the columnar crystals 32 a corresponds to the length of the chord of a sector having a radius Z and a central angle 2θ, and therefore the following formula (1) can be derived, and formula (2) can be derived from formula (1).

[0196] d=2Z×sinθ···(1)

[0197] sinθ=d / 2Z···(2)

[0198] On the other hand, regarding Figure 4 For the length D in , the following equation (3) holds true.

[0199] D=d / 2+2r×cosθ=R×sinθ···(3)

[0200] In addition, about Figure 4 For the length h in , according to the Pythagorean theorem, the following equation (4) holds.

[0201] h={Z 2 -(d / 2) 2} 1 / 2 ···(4)

[0202] In addition, regarding cosθ, the following formula (5) holds.

[0203] cosθ=h / Z={Z 2 -(d / 2) 2} 1 / 2 / Z···(5)

[0204] When equations (2) and (5) are substituted into equation (3), the following equation (6) can be derived.

[0205] d / 2+2r×{Z 2 -(d / 2) 2} 1 / 2 / Z=R×d / 2Z···(6)

[0206] When equation (6) is solved for the curvature radius R, equation (7) is obtained.

[0207] R=Z+4r×{Z 2 -(d / 2) 2} 1 / 2 / d···(7)

[0208] Here, regarding Z, the following equation (8) holds true, and when equation (8) is substituted into equation (7), equation (9) is obtained.

[0209] Z=Lr / tanΦ···(8)

[0210] R=Lr / tanΦ+4r×{(Lr / tanΦ) 2 -(d / 2) 2} 1 / 2 / d···(9)

[0211] Formula (9) means that when the curvature radius R of the deflection generated by the substrate 34 satisfies Formula (9), the possibility of the adjacent columnar crystals 32a contacting each other is high. Therefore, by limiting the curvature radius R to the range of the following formula (10), the risk of damage to the scintillator 32 caused by the contact between the columnar crystals 32a due to the deflection of the substrate 34 can be reduced compared to the case where Formula (10) is not satisfied.

[0212] R ≥ Lr / tanΦ+4r×{(Lr / tanΦ) 2 -(d / 2) 2} 1 / 2 / d···(10)

[0213] For example, when the average radius r of the columnar crystals 32a is 5 μm, the average height L of the columnar crystals 32a is 500 μm, the average angle Φ of the front end of the columnar crystals 32a is 30°, and the average interval d between adjacent columnar crystals 32a is 1 μm or less, the risk of damage to the scintillator 32 can be reduced by setting the curvature radius R of the bending of the substrate 34 to be 10.318 mm or more. In addition, even if the bending is applied locally, there is a risk of damage, so it is necessary to use a member that can prevent bending locally such as folds.

[0214] In the radiation detector 30 of the present embodiment, the deflection suppression member 60 has a rigidity such that the radius of curvature R of the deflection generated on the substrate 34 due to the weight of the scintillator 32 in a state where the end of the substrate 34 is fixed satisfies the formula (10). In other words, the rigidity of the deflection suppression member 60 is adjusted in such a manner that the radius of curvature R of the deflection generated on the substrate 34 due to the weight of the scintillator 32 in a state where the end of the substrate 34 is fixed satisfies the formula (10). That is, the rigidity of the deflection suppression member 60 is determined by the height, radius, angle of the front end of the columnar crystals 32a constituting the scintillator 32, and the interval between the columnar crystals 32a. As a result, for example, when the substrate 34 is handled in the manufacturing process of the radiation detector 30, the risk of damaging the scintillator 32 due to the deflection generated on the substrate 34 due to the weight of the scintillator 32 can be reduced compared to a case where the formula (10) is not satisfied. For example, as the height L of the columnar crystals 32 a increases, the allowable curvature radius R increases, and therefore, the deflection suppression member 60 having high rigidity is used.

[0215] The rigidity of the deflection suppression member 60 can be adjusted by, for example, the thickness, density, elastic modulus, etc. of the deflection suppression member 60. In addition, the rigidity of the deflection suppression member 60 can also be adjusted by selecting the material constituting the deflection suppression member 60.

[0216] Next, a method for manufacturing the radiation detector 30 will be described. Figure 5A to Figure 5D It is a cross-sectional view showing an example of a method of manufacturing the radiation detector 30 .

[0217] First, a plurality of pixels 41 ( Figure 5A ). It should be noted that the pixels 41 may be formed while the substrate 34 is supported by a support body (not shown) for supporting the substrate 34 .

[0218] Next, the deflection suppression member 60 ( Figure 5B ). The bending suppression member 60 has a rigidity such that the curvature radius R of the bending generated on the substrate 34 due to the weight of the scintillator 32 satisfies the formula (10). That is, the rigidity of the bending suppression member 60 is adjusted according to the average height L of the columnar crystals 32a, the average radius r of the columnar crystals 32a, the average interval d between the columnar crystals 32a, and the average angle Φ of the front end of the columnar crystals 32a. For example, the higher the average height L of the columnar crystals 32a, the higher the rigidity of the bending suppression member 60.

[0219] Next, the scintillator 32 ( Figure 5C). The scintillator 32 can be formed by, for example, growing a columnar crystal of CsI doped with Tl directly on the substrate 34 using a vapor phase growth method.

[0220] here, Figure 6 3 is a cross-sectional view showing a columnar crystal 32a formed on a substrate 34. According to a process of directly forming a columnar crystal 32a of CsI on a substrate 34 by a vapor phase growth method, a non-columnar portion 32b that does not constitute a columnar crystal is formed on the substrate 34 at the initial stage of growth, and the columnar crystal 32a is formed based on the non-columnar portion 32b. Therefore, in this case, the non-columnar portion 32b is in contact with the substrate 34, and the front end of the columnar crystal 32a becomes the surface side of the scintillator 32. It should be noted that a columnar crystal of CsI:T1 formed on a substrate different from the substrate 34 may be attached to the substrate 34. According to this process, the front end of the columnar crystal 32a is in contact with the substrate 34, and the non-columnar portion 32b becomes the surface side of the scintillator 32. In the case where the front end of the columnar crystal 32a becomes the surface side of the scintillator 32, compared with the case where the non-columnar portion 32b becomes the surface side of the scintillator 32, the columnar crystals 32a become easier to contact each other due to the deflection of the substrate 34. Therefore, the disclosed technology is particularly effective in the former case.

[0221] After the scintillator 32 is formed on the substrate 34, a reflective film 50 is formed to cover the surface S3 of the scintillator 32 opposite to the surface S6 in contact with the substrate 34 and the surface S4 intersecting the surface S3 ( Figure 5D As a material of the reflection film 50, Al2O3 can be used, for example. The reflection film 50 may be formed so as to cover the substrate 34 also at the peripheral portion of the scintillator 32.

[0222] According to the radiation detector 30 and the radiation imaging device 10 of the embodiment of the disclosed technology, the deflection suppression member 60 has a rigidity such that the radius of curvature R of the deflection of the substrate 34 caused by the weight of the scintillator 32 satisfies the formula (10). Therefore, the radius of curvature R of the deflection of the substrate 34 caused by the weight of the scintillator 32 is limited to the range shown in the formula (10). Therefore, when the substrate 34 is handled in the manufacturing process of the radiation detector 30, for example, even if the substrate 34 is deflected due to the weight of the scintillator 32, the risk of damage to the scintillator 32 caused by the contact between adjacent columnar crystals 32a can be reduced compared to the case where the disclosed technology is not applied.

[0223] here, Fig.11A , Fig. 11B Each of them is a cross-sectional view showing an example of a partial structure of a radiation imaging device 10 to which the ISS method is applied as a radiation reading method. Fig.11A and Fig. 11BThe substrate 34 is respectively configured to include a base material made of a resin material such as polyimide, Fig.11A In the case where the substrate 34 includes the particle layer 34L, Fig. 11B When the ISS method is applied, the substrate 34 of the substrate 34 and the scintillator 32 is arranged on the radiation incident surface 15 side of the housing 14. That is, the radiation R incident on the radiation incident surface 15 passes through the substrate 34 and then enters the scintillator 32.

[0224] When radiation enters the substrate 34 including a resin material having relatively small atomic numbers such as C, H, O, and N as constituent elements, a large amount of backscattered radiation Rb is generated due to the Compton effect, and the backscattered radiation Rb may leak toward the object 200. Fig.11A As shown, by providing a particle layer 34L including particles 34P made of an inorganic material on the substrate 34, the backscattered rays Rb generated in the substrate 34 can be absorbed in the particle layer 34L. The inorganic material includes an element with an atomic number larger than the atomic number of the constituent elements (C, H, O, and N) of the resin material. Fig. 11B ), the amount of backscattered rays Rb leaking to the object 200 can be suppressed. It should be noted that the larger the atomic number of the element constituting the microparticle 34P, the higher the effect of absorbing the backscattered rays Rb, but on the other hand, the amount of radiation absorbed also increases, and the amount of radiation reaching the scintillator 32 decreases. Therefore, the atomic number of the element constituting the microparticle 34P is preferably 30 or less.

[0225] It should be noted that, in the above-mentioned embodiment, the case where the deflection suppression member 60 is provided on the second surface S2 side of the substrate 34 is exemplified, but the disclosed technology is not limited to this embodiment. Fig. 7A As shown, the deflection suppression member 60 may be stacked on the surface S3 side of the scintillator 32 opposite to the surface S6 contacting the substrate 34. This configuration can achieve substantially the same effect as when the deflection suppression member 60 is provided on the second surface S2 side of the substrate 34.

[0226] In addition, if Figure 7B As shown in FIG. 1 , the deflection suppression member 60 may be laminated on both sides of the second surface S2 of the substrate 34 and the surface S3 of the scintillator 32 opposite to the surface S6 of the scintillator 32 in contact with the substrate 34. By laminating the deflection suppression member 60 on at least one of the second surface S2 of the substrate 34 and the surface S3 of the scintillator 32 opposite to the surface S6 of the scintillator 32 in contact with the substrate 34, the deflection suppression effect of the deflection suppression member 60 is promoted. In addition, as Figure 7BAs shown, by laminating the deflection suppression member 60 on both the second surface S2 side of the substrate 34 and the surface S3 side of the scintillator 32, the deflection suppression effect of the deflection suppression member 60 can be promoted, and the risk of damage to the scintillator 32 due to deflection of the substrate 34 can be further reduced. It should be noted that when the deflection suppression member 60 is laminated on both the second surface S2 side of the substrate 34 and the surface S3 side of the scintillator 32, the amount of radiation absorbed by the deflection suppression member 60 laminated on the radiation incident side, that is, the second surface S2 side of the substrate 34 is preferably less than the amount of radiation absorbed by the deflection suppression member 60 laminated on the surface S3 side of the scintillator 32.

[0227] [Second embodiment]

[0228] Fig. 8A 2 is a cross-sectional view showing an example of the structure of a radiation detector 30A according to a second embodiment of the disclosed technology. The radiation detector 30A differs from the radiation detector 30 according to the first embodiment in that it further includes a reinforcing member 70 for reinforcing the deflection suppressing effect of the deflection suppressing member 60 .

[0229] exist Fig. 8A In the structure shown, the deflection suppression member 60 is provided on the second surface S2 side of the substrate 34, and the reinforcing member 70 is provided on the surface S5 side of the deflection suppression member 60 opposite to the surface side in contact with the substrate 34. The reinforcing member 70 is provided in a region spanning the end (outer edge, edge) 32E in the plane direction of the scintillator 32. That is, the reinforcing member 70 is not provided in the deflection suppression member 60 on the surface S5 side of the deflection suppression member 60 in a state spanning the boundary between the region where the scintillator 32 exists and the region where the scintillator 32 does not exist. From the viewpoint of reinforcing the deflection suppression effect of the deflection suppression member 60, the reinforcing member 70 preferably has a higher rigidity than the substrate 34. The preferred ranges of the bending elastic modulus and the thermal expansion coefficient in the reinforcing member 70 are the same as those of the deflection suppression member 60. The reinforcing member 70 may be made of the same material as the deflection suppression member 60, for example, or may be made of a material having a higher rigidity than the deflection suppression member 60.

[0230] here, Fig. 9 A cross-sectional view showing an example of a state in which the substrate 34 is bent due to the weight of the scintillator 32. Fig. 9 As shown, in the region of the substrate 34 where the scintillator 32 extends, the deflection amount of the substrate 34 is relatively small due to the rigidity of the scintillator 32. On the other hand, in the portion of the substrate 34 corresponding to the end 32E of the scintillator 32, the deflection amount of the substrate 34 is relatively large. The portion of the substrate 34 where the deflection amount is large has a higher risk of damaging the scintillator 32 than the portion where the deflection amount is small.

[0231] According to the radiation detector 30A of the second embodiment of the disclosed technology, the reinforcing member 70 that reinforces the deflection suppression effect of the deflection suppression member 60 is provided in the region spanning the end 32E of the scintillator 32. Thus, compared with a case where the reinforcing member 70 is not provided, it is possible to suppress deflection at the portion of the substrate 34 corresponding to the end 32E of the scintillator 32. Therefore, compared with a case where the reinforcing member 70 is not provided, the risk of damage to the scintillator 32 can be reduced.

[0232] It should be noted that if Figure 8B As shown in FIG. 1 , when the deflection suppression member 60 is provided on the surface S3 of the scintillator 32 opposite to the surface S6 in contact with the substrate 34, the reinforcing member 70 may be provided on the second surface S2 of the substrate 34. Figure 8C As shown, when the deflection suppression member 60 is provided on both the second surface S2 of the substrate 34 and the surface S3 of the scintillator 32, the reinforcing member 70 may be provided on the surface S5 of the deflection suppression member 60 opposite to the surface side in contact with the substrate 34. Figure 8B and Figure 8C In any of the structures shown, the reinforcing member 70 is provided in a region spanning the end (outer edge, rim) 32E of the scintillator 32. Figure 8B In the structure shown, the reinforcing member 70 is provided on the substrate 34 on the second surface S2 side of the substrate 34 in a state of straddling the boundary between the region where the scintillator 32 exists and the region where the scintillator 32 does not exist. Figure 8C In the illustrated structure, the reinforcing member 70 is provided on the surface S5 side of the deflection suppressing member 60 in a state of straddling the boundary between the region where the scintillator 32 exists and the region where the scintillator 32 does not exist.

[0233] [Third Embodiment]

[0234] Fig.12 1 is a cross-sectional view showing an example of the structure of a radiation detector 30B according to a third embodiment of the disclosed technology. The radiation detector 30B has a buffer layer 90 disposed between a substrate 34 and a scintillator 32. The buffer layer 90 has a thermal expansion coefficient between the thermal expansion coefficient of the substrate 34 and the thermal expansion coefficient of the scintillator 32. As the buffer layer 90, for example, a polyimide film and a polyparaxylene film can be used. When XENOMAX (registered trademark) is used as the material of the substrate 34, the difference in thermal expansion coefficient between the substrate 34 and the scintillator 32 becomes larger than when a glass substrate is used as the substrate 34, and the thermal stress acting on the interface between the substrate 34 and the scintillator 32 becomes excessive. By providing the buffer layer 90 between the substrate 34 and the scintillator 32, the thermal stress acting on the interface between the substrate 34 and the scintillator 32 can be suppressed.

[0235] [Other embodiments]

[0236] Figure 13 to Figure 33 Each of them is a cross-sectional view showing an example of the arrangement of the deflection suppression member 60 when the deflection suppression member 60 is stacked on the surface of the scintillator 32 opposite to the surface in contact with the substrate 34. Figure 13 to Figure 33 , a region on the substrate 34 where a plurality of pixels 41 are provided, namely, a pixel region 41A is shown.

[0237] In the case where the scintillator 32 is formed by vapor deposition, as shown in FIG. Figure 13 to Figure 33 As shown in FIG. 1 , the scintillator 32 is formed to have an inclination in which the thickness gradually becomes thinner toward the outer edge thereof. Hereinafter, the central region of the scintillator 32, whose thickness is assumed to be substantially constant when manufacturing errors and measurement errors are ignored, is referred to as the central portion 33A. In addition, the peripheral region of the scintillator 32, which has a thickness of, for example, 90% or less of the average thickness of the central portion 33A of the scintillator 32, is referred to as the peripheral portion 33B. That is, the scintillator 32 has an inclined surface inclined relative to the substrate 34 at the peripheral portion 33B.

[0238] like Figure 13 to Figure 33 As shown, an adhesive layer 51 , a reflective film 50 , an adhesive layer 52 , a protective layer 53 , and an adhesive layer 54 may be provided between the scintillator 32 and the deflection suppression member 60 .

[0239] The adhesive layer 51 covers the entire surface of the scintillator 32 including the central portion 33A and the peripheral portion 33B of the scintillator 32. The adhesive layer 51 has the function of fixing the reflective film 50 to the scintillator 32. The adhesive layer 51 preferably has light transmittance. As the material of the adhesive layer 51, for example, acrylic adhesives, hot melt adhesives and silicone adhesives can be used. As acrylic adhesives, for example, polyurethane acrylate, acrylic resin acrylate and epoxy acrylate are cited. As hot melt adhesives, for example, thermoplastic plastics such as EVA (ethylene-vinyl acetate copolymer), EAA (copolymer of ethylene and acrylic acid), EEA (ethylene-ethyl acrylate copolymer) and EMMA (ethylene-methyl methacrylate copolymer) are cited. The thickness of the adhesive layer 32 is preferably not less than 2 μm and not more than 7 μm. By setting the thickness of the adhesive layer 32 to not less than 2 μm, the effect of fixing the reflective film 50 to the scintillator 32 can be fully exerted. In addition, the risk of forming an air layer between the scintillator 32 and the reflective film 50 can be suppressed. When an air layer is formed between the scintillator 32 and the reflective film 50, multiple reflections may occur in which light emitted from the scintillator 32 is repeatedly reflected between the air layer and the scintillator 32 and between the air layer and the reflective film 50. In addition, by setting the thickness of the adhesive layer 32 to 7 μm or less, it is possible to suppress the decrease in MTF (Modulation Transfer Function) and DQE (Detective Quantum Efficiency).

[0240] The reflective film 50 covers the entire surface of the adhesive layer 51. The reflective film 50 has the function of reflecting the light converted by the scintillator 32. The reflective film 50 is preferably made of an organic material. As the material of the reflective film 50, for example, white PET (Polyethylene Terephthalate), TiO2, Al2O3, foamed white PET, polyester-based high-reflective sheet and mirror-reflective aluminum can be used. It should be noted that white PET refers to a material obtained by adding white pigments such as TiO2 or barium sulfate to PET. In addition, the polyester-based high-reflective sheet refers to a sheet (film) having a multilayer structure in which a plurality of thinner polyester sheets are overlapped. In addition, foamed white PET refers to white PET whose surface becomes porous. The thickness of the reflective film 50 is preferably greater than 10 μm and less than 40 μm.

[0241] The adhesive layer 52 covers the entire surface of the reflective film 50. The end of the adhesive layer 52 extends to the surface of the substrate 34. That is, the adhesive layer 52 is bonded to the substrate 34 at its end. The adhesive layer 52 has a function of fixing the reflective film 50 and the protective layer 53 to the scintillator 32. As a material for the adhesive layer 52, the same material as that of the adhesive layer 51 can be used, but the adhesive force of the adhesive layer 52 is preferably greater than the adhesive force of the adhesive layer 51.

[0242] The protective layer 53 covers the entire surface of the adhesive layer 52. That is, the protective layer 53 is provided to cover the entire scintillator 32, and its end portion covers a portion of the substrate 34. The protective layer 53 functions as a moisture-proof film that prevents moisture from penetrating into the scintillator 32. As a material for the protective layer 53, for example, an organic film including organic materials such as PET, PPS (PolyPhenylene Sulfide), OPP (Oriented PolyPropylene), PEN (PolyEthyleneNaphthalate), and PI can be used. In addition, as the protective layer 53, a sheet of Mylar tape (registered trademark) in which aluminum is laminated on an insulating sheet (film) such as polyethylene terephthalate by bonding aluminum foil or the like can also be used.

[0243] The deflection suppression member 60 is provided on the surface of the protective layer 53 via the adhesive layer 54. As the material of the adhesive layer 54, for example, the same material as that of the adhesive layer 51 and the adhesive layer 54 can be used.

[0244] exist Fig.13 In the example shown, the deflection suppression member 60 extends in the regions corresponding to the central portion 33A and the peripheral portion 33B of the scintillator 32, and the outer peripheral portion of the deflection suppression member 60 is bent to be inclined along the peripheral portion 33B of the scintillator 32. The deflection suppression member 60 is bonded to the protective layer 53 via the adhesive layer 54 in both the region corresponding to the central portion 33A and the region corresponding to the peripheral portion 33B of the scintillator 32. Fig.13 In the illustrated example, the end portion of the deflection suppressing member 60 is arranged in a region corresponding to the peripheral edge portion 33B of the scintillator 32 .

[0245] like Fig.14 As shown, the deflection suppression member 60 is provided only in the region corresponding to the central portion 33A of the scintillator 32 . In this case, the deflection suppression member 60 is bonded to the protective layer 53 via the adhesive layer 54 in the region corresponding to the central portion 33A of the scintillator 32 .

[0246] like Fig.15As shown, when the deflection suppression member 60 extends in the region corresponding to the central portion 33A and the peripheral portion 33B of the scintillator 32, the deflection suppression member 60 may not have a bent portion along the inclination at the peripheral portion of the scintillator 32. In this case, the deflection suppression member 60 is bonded to the protective layer 53 via the adhesive layer 54 in the region corresponding to the central portion 33A of the scintillator 32. In the region corresponding to the peripheral portion 33B of the scintillator 32, a space corresponding to the inclination at the peripheral portion 33B of the scintillator 32 is formed between the scintillator 32 (protective layer 53) and the deflection suppression member 60.

[0247] Here, the cable 20 is connected to the terminal 35 of the connection area 80 provided in the outer peripheral portion of the substrate 34. The substrate 34 is connected to the control substrate (see Fig.45 ) connection. If the substrate 34 is bent, the cable 20 may be peeled off from the substrate 34 or may be displaced. In this case, it is necessary to reconnect the cable 20 and the substrate 34. The operation of reconnecting the cable 20 and the substrate 34 is called rework. Figure 13 to Figure 15 As shown, by arranging the end of the deflection suppression member 60 at a position further inside than the end of the scintillator 32 , rework can be easily performed compared to a case where the deflection suppression member 60 extends to the vicinity of the connection region 80 .

[0248] like Figure 16 to Figure 19 As shown, the deflection suppression member 60 may also be arranged so that its end is arranged at a position outside the end of the scintillator 32 and is aligned with the end of the adhesive layer 52 and the protective layer 53 extending onto the substrate 34. It should be noted that the position of the end of the deflection suppression member 60 does not need to be completely consistent with the position of the end of the adhesive layer 52 and the protective layer 53.

[0249] exist Fig.16 In the example shown, the deflection suppression member 60 is bonded to the protective layer 53 via the adhesive layer 54 in the area corresponding to the central portion 33A of the scintillator 32, and in the area corresponding to the peripheral portion 33B of the scintillator 32 and in the area further to the outside thereof, a space corresponding to the inclination of the peripheral portion 33B of the scintillator 32 is formed between the scintillator 32 (protective layer 53) and the deflection suppression member 60.

[0250] exist Fig.17 In the example shown, a filling material 55 is provided in the area corresponding to the peripheral edge portion 33B of the scintillator 32 and in the area further outside thereof, in the space formed between the scintillator 32 (protective layer 53) and the deflection suppression member 60. The material of the filling material 55 is not particularly limited, and, for example, resin can be used. Fig.17In the illustrated example, in order to fix the deflection suppression member 60 to the filling material 55 , the adhesive layer 54 is provided over the entire region between the deflection suppression member 60 and the filling material 55 .

[0251] The method of forming the filling material 55 is not particularly limited. For example, after the adhesive layer 54 and the deflection suppression member 60 are sequentially formed on the scintillator 32 covered by the adhesive layer 51, the reflective film 50, the adhesive layer 52, and the protective layer 53, the filling material 55 having fluidity may be injected into the space formed between the scintillator 32 (protective layer 53) and the deflection suppression member 60 to solidify the filling material 55. In addition, for example, after the scintillator 32, the adhesive layer 51, the reflective film 50, the adhesive layer 52, and the protective layer 53 are sequentially formed on the substrate 34, the filling material 55 may be formed, and the adhesive layer 54 and the deflection suppression member 60 may be sequentially formed to cover the scintillator 32 and the filling material 55 covered by the adhesive layer 51, the reflective film 50, the adhesive layer 52, and the protective layer 53.

[0252] In this way, by filling the filling material 55 into the space formed between the scintillator 32 (protective layer 53) and the deflection suppression member 60, Fig.16 Compared with the embodiment shown in the figure, the deflection suppression member 60 can be prevented from peeling off from the scintillator 32 (protective layer 53). In addition, the scintillator 32 is fixed to the substrate 34 by both the deflection suppression member 60 and the filler 55, so the deflection suppression member 32 can be prevented from peeling off from the substrate 34.

[0253] exist Fig.18 In the example shown, the outer peripheral portion of the deflection suppression member 60 is bent along the inclination of the peripheral edge portion 33B of the scintillator 32, and also covers the portion of the adhesive layer 52 and the protective layer 53 that are covered on the substrate 34. In addition, the end of the deflection suppression member 60 is aligned with the end of the adhesive layer 52 and the protective layer 53. It should be noted that the position of the end of the deflection suppression member 60 and the position of the end of the adhesive layer 52 and the protective layer 53 do not need to be completely consistent.

[0254] The ends of the deflection suppression member 60, the adhesive layer 54, the protective layer 53, and the adhesive layer 52 are sealed by a sealing member 57. The sealing member 57 is preferably provided in the region from the surface of the substrate 34 to the surface of the deflection suppression member 60, and does not cover the region of the pixel region 41A. As a material of the sealing member 57, a resin can be used, and a thermoplastic resin is particularly preferred. Specifically, acrylic paste and polyurethane paste can be used as the sealing member 57. The deflection suppression member 60 has higher rigidity than the protective layer 53, and a restoring force to eliminate the bend acts on the bent portion of the deflection suppression member 60, thereby causing the protective layer 53 to peel off. By sealing the ends of the deflection suppression member 60, the adhesive layer 54, the protective layer 53, and the adhesive layer 52 with the sealing member 57, the peeling of the protective layer 53 can be suppressed.

[0255] exist Fig.19 In the example shown, Fig.17 In the same manner as shown, in the area corresponding to the peripheral portion 33B of the scintillator 32 and the area further outside thereof, a filling material 55 is provided in the space formed between the scintillator 32 (protective layer 53) and the deflection suppression member 60. In addition, in the area corresponding to the end of the scintillator 32, another deflection suppression member 60A is stacked on the surface of the deflection suppression member 60 via the adhesive layer 54A. More specifically, the deflection suppression member 60A is provided in the area spanning the end (outer edge, edge) of the scintillator 32. The deflection suppression member 60A may also be made of the same material as the deflection suppression member 60. As Fig. 9 As shown, the substrate 34 is relatively bent at the end of the scintillator 32. By forming a stacked structure based on the bending suppression members 60 and 60A in the region corresponding to the end of the scintillator 32, the effect of suppressing the bending of the substrate 34 at the end of the scintillator 32 can be promoted.

[0256] like Figure 16 to Figure 19 As shown, even in the case where the end of the deflection suppression member 60 is arranged at a position outside the end of the scintillator 32 and aligned with the ends of the adhesive layer 52 and the protective layer 53, rework can be easily performed compared to the case where the deflection suppression member 60 extends to the vicinity of the connection area 80.

[0257] like Figure 20 to Figure 23 As shown, the deflection suppression member 60 may be provided so that its end is located outside the ends of the adhesive layer 52 and the protective layer 53 extending onto the substrate 34 and inside the end of the substrate 34 .

[0258] exist Fig. 20In the example shown, the bend suppression member 60 is bonded to the protective layer 53 via the adhesive layer 54 in the area corresponding to the central portion 33A of the scintillator 32, and in the area corresponding to the peripheral portion 33B of the scintillator 32 and in the area further to the outside thereof, a space corresponding to the inclination of the peripheral portion 33B of the scintillator 32 is formed between the scintillator 32 (protective layer 53) and the bend suppression member 60, and between the substrate 34 and the bend suppression member 60.

[0259] exist Fig.21 In the example shown, the end of the deflection suppression member 60 is supported by the spacer 39. That is, one end of the spacer 39 is connected to the first surface S1 of the substrate 34, and the other end of the spacer 39 is connected to the end of the deflection suppression member 60 via the adhesive layer 56. By using the spacer 39 to support the end of the deflection suppression member 60 that extends while forming a space between the spacer 39 and the substrate 34, it is possible to suppress the deflection suppression member 60 from peeling off. In addition, the deflection suppression effect of the deflection suppression member 60 can be applied to the vicinity of the end of the substrate 34. It should be noted that, instead of providing the spacer 39, a spacer 39 may be provided in the same manner as in Fig.17 In the illustrated example, the space formed between the scintillator 32 (protective layer 53 ) and the deflection suppressing member 60 and between the substrate 34 and the deflection suppressing member 60 is filled with a filling material.

[0260] exist Fig. 22 In the example shown, the outer peripheral portion of the deflection suppression member 60 is bent to be inclined along the peripheral portion 33B of the scintillator 32, and also covers the portion of the adhesive layer 52 and the protective layer 53 covered on the substrate 34, and the substrate 34 outside the adhesive layer 52 and the protective layer 53. In other words, the ends of the adhesive layer 52 and the protective layer 53 are sealed by the deflection suppression member 60. The portion of the deflection suppression member 60 extending on the substrate 34 is bonded to the substrate 34 via the adhesive layer 54. Thus, by covering the ends of the adhesive layer 52 and the protective layer 53 with the deflection suppression member 60, peeling of the protective layer 53 can be suppressed. It should be noted that the same method may also be used. Fig.18 In the described example, the end portion of the deflection suppression member 60 is sealed using a sealing member.

[0261] exist Fig.23 In the example shown, in a manner in which the end of the deflection suppression member 60 is supported by the spacer 39, another deflection suppression member 60A is further laminated via the adhesive layer 54A in the area of ​​the surface of the deflection suppression member 60 corresponding to the end of the scintillator 32. More specifically, the deflection suppression member 60A is provided in an area spanning the end (outer edge, edge) of the scintillator 32. The deflection suppression member 60A may also be made of the same material as the deflection suppression member 60. Fig. 9As shown in FIG. 1 , the deflection amount of the substrate 34 is relatively large at the end of the scintillator 32. By forming a stacked structure based on the deflection suppression members 60 and 60A in the region corresponding to the end of the scintillator 32, the effect of suppressing the deflection of the substrate 34 at the end of the scintillator 32 can be promoted. It should be noted that, instead of providing the spacer 39, a Fig.17 In the illustrated example, the space formed between the scintillator 32 (protective layer 53 ) and the deflection suppression member 60 and between the substrate 34 and the deflection suppression member 60 is filled with a filling material.

[0262] like Figure 24 to Figure 28 As shown, the deflection suppression member 60 may also be arranged so that its end is aligned with the end of the substrate 34. It should be noted that the position of the end of the deflection suppression member 60 and the position of the end of the substrate 34 do not need to be completely consistent.

[0263] exist Fig.24 In the example shown, the bend suppression member 60 is bonded to the protective layer 53 via the adhesive layer 54 in the area corresponding to the central portion 33A of the scintillator 32, and in the area corresponding to the peripheral portion 33B of the scintillator 32 and in the area further to the outside thereof, a space corresponding to the inclination of the peripheral portion 33B of the scintillator 32 is formed between the scintillator 32 (protective layer 53) and the bend suppression member 60, and between the substrate 34 and the bend suppression member 60.

[0264] exist Fig.25 In the example shown, the end of the deflection suppression member 60 is supported by the spacer 39. That is, one end of the spacer 39 is connected to the cable 20 provided at the end of the substrate 34, and the other end of the spacer 39 is connected to the end of the deflection suppression member 60 via the adhesive layer 56. By supporting the end of the deflection suppression member 60 extending while forming a space between the spacer 39 and the substrate 34, it is possible to suppress the deflection suppression member 60 from peeling off. In addition, the deflection suppression effect of the deflection suppression member 60 can be applied to the vicinity of the end of the substrate 34.

[0265] exist Fig.26 In the example shown, the space formed between the scintillator 32 (protective layer 53) and the deflection suppression member 60 and between the substrate 34 and the deflection suppression member 60 is filled with a filling material 55. In the present embodiment, the connection portion between the cable 20 and the terminal 35 is covered with the filling material 55. In this way, by filling the filling material 55 in the space formed between the scintillator 32 (protective layer 53) and the deflection suppression member 60 and between the substrate 34 and the deflection suppression member 60, the connection portion between the cable 20 and the terminal 35 is covered with the filling material 55. Fig.24Compared with the embodiment shown in the figure, the deflection suppression member 60 can be suppressed from peeling off from the scintillator 32 (protective layer 53). In addition, the scintillator 32 is fixed to the substrate 34 by both the deflection suppression member 60 and the filling material 55, so the scintillator 32 can be suppressed from peeling off from the substrate 34. In addition, by covering the connection portion between the cable 20 and the terminal 35 with the filling material 55, the cable 20 can be suppressed from peeling off.

[0266] exist Fig. 27 In the example shown, the outer peripheral portion of the deflection suppression member 60 is bent along the inclination of the peripheral edge portion 33B of the scintillator 32, and also covers the portion covered by the adhesive layer 52 and the protective layer 53 on the substrate 34, the substrate outside the adhesive layer 52 and the protective layer 53, and the connection portion between the terminal 35 and the cable 20. The portions of the deflection suppression member 60 extending on the substrate 34 and the cable 20 are bonded to the substrate 34 and the cable 20 via the adhesive layer 54, respectively. By covering the connection portion between the cable 20 and the terminal 35 with the deflection suppression member 60, it is possible to suppress the cable 20 from peeling off. In addition, it is assumed that a control substrate equipped with electronic components is connected to the other end of the cable 20, so that the substrate 34 may be relatively greatly deflected at the connection portion between the cable 20 and the terminal 35. By covering the connection portion between the cable 20 and the terminal 35 with the deflection suppression member 60, it is possible to suppress the deflection of the substrate 34 in this portion.

[0267] exist Fig.28 In the example shown, the space formed between the scintillator 32 (protective layer 53) and the deflection suppression member 60 and between the substrate 34 and the deflection suppression member 60 is filled with a filling material 55. In addition, in the area corresponding to the end of the scintillator 32, another deflection suppression member 60A is stacked on the surface of the deflection suppression member 60 via an adhesive layer 54A. More specifically, the deflection suppression member 60A is provided in the area spanning the end (outer edge, edge) of the scintillator 32. The deflection suppression member 60A may also be made of the same material as the deflection suppression member 60. As Fig. 9 As shown, the substrate 34 is relatively bent at the end of the scintillator 32. By forming a stacked structure based on the bending suppression members 60 and 60A in the region corresponding to the end of the scintillator 32, the effect of suppressing the bending of the substrate 34 at the end of the scintillator 32 can be promoted.

[0268] like Figure 29 to Figure 33 As shown, the deflection suppression member 60 may be provided so that its end is located outside the end of the base plate 34 .

[0269] exist Fig.29In the example shown, the deflection suppression member 60 is bonded to the protective layer 53 via the adhesive layer 54 in the area corresponding to the central portion 33A of the scintillator 32, and in the area corresponding to the peripheral portion 33B of the scintillator 32 and in the area further to the outside thereof, a space corresponding to the inclination of the peripheral portion 33B of the scintillator 32 is formed between the scintillator 32 (protective layer 53) and the deflection suppression member 60 and between the substrate 34 and the deflection suppression member 60.

[0270] exist Fig.30 In the example shown, the end of the deflection suppression member 60 is supported by the spacer 39. That is, one end of the spacer 39 is connected to the cable 20 provided at the end of the substrate 34, and the other end of the spacer 39 is connected to the end of the deflection suppression member 60 via the adhesive layer 56. By supporting the end of the deflection suppression member 60 extending while forming a space between the spacer 39 and the substrate 34, it is possible to suppress the deflection suppression member 60 from peeling off. In addition, the deflection suppression effect of the deflection suppression member 60 can be applied to the vicinity of the end of the substrate 34.

[0271] exist Fig.31 In the example shown, the space formed between the scintillator 32 (protective layer 53) and the deflection suppression member 60 and between the substrate 34 and the deflection suppression member 60 is filled with a filling material 55. In the present embodiment, the connection portion between the cable 20 and the terminal 35 is covered with the filling material 55. In this way, by filling the filling material 55 in the space formed between the scintillator 32 (protective layer 53) and the deflection suppression member 60 and between the substrate 34 and the deflection suppression member 60, the connection portion between the cable 20 and the terminal 35 is covered with the filling material 55. Fig.29 Compared with the embodiment shown in the figure, the deflection suppression member 60 can be suppressed from peeling off from the scintillator 32 (protective layer 53). In addition, the scintillator 32 is fixed to the substrate 34 by both the deflection suppression member 60 and the filling material 55, so the scintillator 32 can be suppressed from peeling off from the substrate 34. In addition, by covering the connection portion between the cable 20 and the terminal 35 with the filling material 55, the cable 20 can be suppressed from peeling off.

[0272] exist Fig.32In the example shown, the outer peripheral portion of the deflection suppression member 60 is bent to be inclined along the peripheral portion 33B of the scintillator 32, and covers the portion covered by the adhesive layer 52 and the protective layer 53 on the substrate 34, the substrate outside the adhesive layer 52 and the protective layer 53, and the connection portion between the terminal 35 and the cable 20. The portions of the deflection suppression member 60 extending on the substrate 34 and the cable 20 are bonded to the substrate 34 and the cable 20 via the adhesive layer 54, respectively. By covering the connection portion between the cable 20 and the terminal 35 with the deflection suppression member 60, it is possible to suppress the cable 20 from peeling off. In addition, it is assumed that a control substrate equipped with electronic components is connected to the other end of the cable 20, so that the substrate 34 may be relatively greatly deflected at the connection portion between the cable 20 and the terminal 35. By covering the connection portion between the cable 20 and the terminal 35 with the deflection suppression member 60, it is possible to suppress the deflection of the substrate 34 in this portion.

[0273] exist Fig.33 In the example shown, the space formed between the scintillator 32 (protective layer 53) and the deflection suppression member 60 and between the substrate 34 and the deflection suppression member 60 is filled with a filling material 55. In addition, in the area corresponding to the end of the scintillator 32, another deflection suppression member 60A is stacked on the surface of the deflection suppression member 60 via an adhesive layer 54A. More specifically, the deflection suppression member 60A is provided in an area spanning the end (outer edge, edge) of the scintillator 32. The deflection suppression member 60A may also be made of the same material as the deflection suppression member 60. As Fig. 9 As shown, the substrate 34 is relatively bent at the end of the scintillator 32. By forming a stacked structure based on the bending suppression members 60 and 60A in the region corresponding to the end of the scintillator 32, the effect of suppressing the bending of the substrate 34 at the end of the scintillator 32 can be promoted.

[0274] Here, in the manufacturing process of the radiation detector 30, a flexible substrate 34 is attached to a support such as a glass substrate, and after the scintillator 32 is stacked on the substrate 34, the support is peeled off from the substrate 34. At this time, the flexible substrate 34 may bend, thereby damaging the pixels 41 formed on the substrate 34. Before peeling the support from the substrate 34, the scintillator 32 is laminated on the substrate 34. Figure 13 to Figure 33 In the illustrated embodiment, the deflection suppressing member 60 is preliminarily laminated on the scintillator 32 , and deflection of the substrate 34 generated when the support body is peeled from the substrate 34 can be suppressed, thereby reducing the risk of damage to the pixel 41 .

[0275] Figure 34 to Figure 39 Each of them is a cross-sectional view showing an example of an arrangement form of the deflection suppression member when the deflection suppression member is provided on the second surface S2 side of the substrate 34 opposite to the first surface S1 in contact with the scintillator 32 .

[0276] exist Figure 34 to Figure 39 In the example shown, substantially the entire second surface S2 of the substrate 34 is in contact with the deflection suppression member 60 via the adhesive layer 54. That is, the area of ​​the deflection suppression member 60 is substantially the same as the area of ​​the substrate 34. On the surface of the deflection suppression member 60 opposite to the surface on the substrate 34 side, another deflection suppression member 60A is also stacked via the adhesive layer 54A. The deflection suppression member 60A may also be made of the same material as the deflection suppression portion 60. In the case where the surface reading method (ISS) is applied as the imaging method of the radiation detector 30, in order to minimize the area of ​​the portion where the deflection suppression member 60A overlaps with the pixel area 41A, it is preferred that the deflection suppression member 60A is only provided on the outer periphery of the substrate 34. That is, as Figure 34 to Figure 39 As shown, the deflection suppression member 60A may be annular with an opening 61 in a portion corresponding to the pixel region 41A. By forming a stacked structure based on the deflection suppression members 60 and 60A on the periphery of the substrate 34, the rigidity of the periphery of the substrate 34, which is more susceptible to deflection, can be enhanced.

[0277] exist Figure 34 to Figure 36 In the example shown, the deflection suppression member 60A is provided in a region spanning the end portion (outer edge, edge) of the scintillator 32. Fig. 9 As shown, the substrate 34 is relatively bent at the end of the scintillator 32. By forming a stacked structure based on the bending suppression members 60 and 60A in the region corresponding to the end of the scintillator 32, the effect of suppressing the bending of the substrate 34 at the end of the scintillator 32 can be promoted.

[0278] When the surface scanning method (ISS) is applied as the imaging method of the radiation detector 30, Fig.34 As shown, when a portion of the deflection suppression member 60A overlaps with the pixel region 41A, the image may be affected depending on the material of the deflection suppression member 60A. Therefore, when a portion of the deflection suppression member 60A overlaps with the pixel region 41A, it is preferable to use plastic as the material of the deflection suppression member 60A.

[0279] like Fig.35 and Fig.36 As shown, the deflection suppression member 60A is most preferably arranged to span the end (outer edge, edge) of the scintillator 32 and not overlap the pixel area 41A (that is, the end of the opening 61 of the deflection suppression member 60A is arranged outside the pixel area 41A). Fig.35 In the example shown, the position of the end of the opening 61 of the deflection suppression member 60A substantially coincides with the position of the end of the pixel region 41A. Fig.36In the illustrated example, the end of the opening 61 of the deflection suppression member 60A is arranged between the end of the pixel region 41A and the end of the scintillator 32 .

[0280] In addition, if Fig.37 As shown, the position of the end of the opening 61 of the deflection suppression member 60A may also be substantially consistent with the position of the end of the scintillator 32. Fig.38 As shown, the position of the end of the opening 61 of the deflection suppression member 60A may be arranged at a position further outward than the end of the scintillator 32. In this case, the deflection suppression member 60A does not have a structure that spans the end (outer edge, edge) of the scintillator 32, and therefore, the effect of suppressing the deflection of the substrate 34 at the end of the scintillator 32 may be reduced. However, by forming a stacked structure based on the deflection suppression members 60 and 60A on the outer periphery of the substrate 34 where the connection between the cable 20 and the terminal 35 exists, the effect of suppressing the deflection of the substrate 34 at the connection between the cable 20 and the terminal 35 is maintained.

[0281] exist Fig.39 In the example shown, the area of ​​the deflection suppression member 60 is larger than the area of ​​the substrate 34, and the end of the deflection suppression member 60 is arranged at a position further outward than the end of the substrate 34. According to this embodiment, the radiation detector 30 can be fixed inside the housing 14 by screwing the portion of the deflection suppression member 60 extending from the substrate 34 to the housing 14 or the like.

[0282] It should be noted that in Figure 34 to Figure 39 In the embodiment, the outer end of the deflection suppressing member 60A is substantially aligned with the end of the substrate 34 , but the present invention is not limited to this embodiment. The outer end of the deflection suppressing member 60A may be arranged outside or inside the end of the substrate 34 .

[0283] In addition, Figure 34 to Figure 39 In the embodiment, a stacked structure based on the deflection suppression members 60 and 60A is formed on the second surface S2 side of the substrate 34, but the present invention is not limited to this structure. Figure 13 to Figure 33 In the illustrated embodiment, when the deflection suppressing member 60 is provided on the scintillator 32 side, only the deflection suppressing member 60A that reinforces the outer peripheral portion of the substrate 34 may be provided on the second surface S2 side of the substrate 34 .

[0284] Fig.40 1 is a plan view showing an example of the structure of the deflection suppression member 60. The deflection suppression member 60 may have a plurality of through holes 62 on its main surface. The size and pitch of the through holes 62 are determined so that the desired rigidity is obtained in the deflection suppression member 60.

[0285] Since the deflection suppression member 60 has a plurality of through holes 62, air introduced into the bonding surface of the deflection suppression member 60 bonded to the scintillator 32 side or the substrate 34 side can be discharged from the through holes 62. Thus, the generation of bubbles at the bonding surface of the deflection suppression member 60 bonded to the scintillator 32 side or the substrate 34 side can be suppressed.

[0286] In the absence of a means for discharging air introduced into the joint surface of the deflection suppression member 60 that is joined to the scintillator 32 side or the substrate 34 side, bubbles may be generated on the above-mentioned joint surface. For example, when the bubbles generated on the above-mentioned joint surface expand due to the heat during the operation of the radiation imaging device 10, the close contact between the deflection suppression member 60 and the scintillator 32 side or the substrate 34 side decreases. As a result, the deflection suppression effect of the deflection suppression member 60 may not be fully exerted. Fig.40 As shown, by using a deflection suppression member 60 having a plurality of through holes 62, as described above, the generation of bubbles at the joint surface of the deflection suppression member 60 joined to the scintillator 32 side or the substrate 34 side can be suppressed, thereby maintaining the close contact between the deflection suppression member 60 and the scintillator 32 side or the substrate 34 side, and maintaining the deflection suppression effect of the deflection suppression member 60.

[0287] Fig.41 is a perspective view showing another example of the structure of the deflection suppression member 60. Fig.41 In the example shown, the deflection suppression member 60 has a concavo-convex structure on the bonding surface with the scintillator 32 side or the substrate 34 side. Fig.41 As shown, the concavo-convex structure may also be configured to include a plurality of grooves 63 arranged parallel to each other. Fig.42 As shown in FIG. 1 , the surface of the deflection suppression member 60 having a concavo-convex structure formed by a plurality of grooves 63 is bonded to the scintillator 32 covered by the reflective film 50. In this way, the deflection suppression member 60 has a concavo-convex structure on the bonding surface with the scintillator 32 side or the substrate 34 side, so that the air introduced into the bonding portion between the deflection suppression member 60 and the scintillator 32 side or the substrate 34 side can be discharged from the grooves 63. Fig.40 Similarly, the embodiment shown can suppress the generation of bubbles at the joint surface of the deflection suppression member 60 with the scintillator 32 side or the substrate 34 side. Thus, the close contact between the deflection suppression member 60 and the scintillator 32 side or the substrate 34 side can be maintained, and the deflection suppression effect of the deflection suppression member 60 can be maintained.

[0288] Fig.43 and Fig.44 1 and 2 are plan views showing other examples of the structure of the deflection suppression member 60. Fig.43 and Fig.44 As shown, the deflection suppression member 60 may also be divided into a plurality of segments 64. Fig.43As shown in FIG. 1 , the deflection suppression member 60 may be divided in such a manner that a plurality of fragments 64 are arranged in one direction. Fig.44 As shown, the deflection suppression member 60 may be divided so that a plurality of fragments 64 are arranged in the longitudinal and transverse directions.

[0289] The larger the area of ​​the deflection suppression member 60 is, the easier it is for bubbles to be generated on the bonding surface of the deflection suppression member 60 with the scintillator 32 side or the substrate 34 side. Fig.43 and Fig.44 As shown, by dividing the deflection suppression member 60 into a plurality of fragments 64, the generation of bubbles at the joint surface of the deflection suppression member 60 with the scintillator 32 side or the substrate 34 side can be suppressed. Thus, the close contact between the deflection suppression member 60 and the scintillator 32 side or the substrate 34 side can be maintained, and the deflection suppression effect of the deflection suppression member 60 can be maintained.

[0290] Figure 45 to Figure 47 Each of these is a diagram showing another configuration example of the radiation imaging device 10. The radiation imaging device 10 is configured to include a housing 14, and a radiation detector 30, a control board 81, and a power supply unit 82 accommodated in the housing 14.

[0291] The control substrate 81 is equipped with Figure 3 The control substrate 81 is a substrate for a part or all of the electronic components of the control unit 29, the image memory 28, the gate line driving unit 22, the charge amplifier 24, and the signal processing unit 26. The control substrate 81 may be a rigid substrate having higher rigidity than the flexible substrate 34. The power supply unit 82 supplies power to the electronic components mounted on the control substrate 81 via the power line 83.

[0292] The housing 14 is preferably lightweight, has a low X-ray absorption rate, and is highly rigid, and is preferably made of a material having an elastic modulus much higher than that of the deflection suppression member 60. As the material of the housing 14, a material having a bending elastic modulus of 10,000 MPa or more is preferably used. As the material of the housing 14, carbon or CFRP (Carbon Fiber Reinforced Plastics) having a bending elastic modulus of about 20,000 to 60,000 MPa can be suitably used.

[0293] During the radiographic imaging of radiographic images by the radiographic imaging device 10, a load from a subject is applied to the radiation incident surface 15 of the housing 14. When the deflection suppression member 60 is made of a material having a relatively low elastic modulus, such as soft plastic, if the rigidity of the housing 14 is insufficient, the substrate 34 is deflected by the load from the subject, and a defect such as damage to the pixel 41 may occur. By accommodating the radiation detector 30 having the deflection suppression member 60 inside the housing 14 made of a material having a bending elastic modulus of 10,000 MPa or more, even when the deflection suppression member 60 is made of a material having a relatively low elastic modulus, such as soft plastic, the deflection of the substrate 34 caused by the load from the subject can be suppressed. By making the deflection suppression member 60 close to the inner wall surface of the housing 14, the effect of suppressing the deflection of the substrate 34 caused by the load from the subject can be further promoted. In this case, the deflection suppression member 60 and the inner wall surface of the housing 14 may be bonded to each other via an adhesive layer, or may simply be in contact with each other without an adhesive layer.

[0294] exist Fig.45 and Fig.46 In the example shown, the radiation detector 30, the control substrate 81 and the power supply unit 82 are arranged side by side in the horizontal direction of the figure. Fig.46 As shown, the thickness of the region of the internal space of the housing 14 that accommodates the radiation detector 30 may be made thinner than the thickness of the region that accommodates the control board 81 and the power supply unit 82. Thus, an extremely thin portable electronic dark box corresponding to the thickness of the radiation detector 30 can be formed. In order to alleviate the step difference between the region that accommodates the radiation detector 30 and the region that accommodates the control board 81 and the power supply unit 82, the housing 14 preferably has an inclined portion 14A at the portion connecting the two regions. By having the inclined portion 14A in the housing 14, when the radiation imaging device 10 is used in a state where it is inserted below a patient who is a subject, the patient's discomfort can be reduced.

[0295] exist Fig.47 In the example shown, a base 37 having a size substantially the same as that of the substrate 34 of the radiation detector 30 is provided in the internal space of the housing 14 at a position overlapping the substrate 34, and a control substrate 81 and a power supply unit 82 are provided on the base 37. According to this structure, the size of the radiation imaging device 10 in a plan view can be reduced compared to a case where the radiation detector 30, the control substrate 81, and the power supply unit 82 are arranged side by side in the horizontal direction in the figure.

[0296] The disclosures of Japanese Patent Application Nos. 2018-051692, 2018-219698, and 2019-022082 are incorporated herein by reference in their entirety.

[0297] All documents, patent applications, and technical standards described in this specification are incorporated into this specification by reference to the same extent as if each document, patent application, or technical standard was specifically and individually described as being incorporated by reference.

Claims

1. A radiation detector, comprising: A substrate having flexibility; A plurality of pixels, which are disposed on the substrate and respectively include a photoelectric conversion element; a scintillator having a plurality of columnar crystals stacked on the substrate; and a deflection suppressing member that suppresses deflection of the substrate, When the average value of the height of the columnar crystals is L, the average value of the radius of the columnar crystals is r, the average value of the intervals between the columnar crystals is d, the average value of the angles of the front ends of the columnar crystals is Φ, and the curvature radius of the deflection generated on the substrate due to the weight of the scintillator is R, The deflection restraining member has a rigidity satisfying the following formula: R≥L-r / tanΦ+4r×{(L-r / tanΦ) 2 -(d / 2) 2 } 1 / 2 / d。 2. The radiation detector according to claim 1, wherein: The scintillator is stacked on the first surface side of the substrate, The deflection suppression member is stacked on at least one of a second surface side of the substrate opposite to the first surface side and a surface side of the scintillator opposite to a surface side in contact with the substrate.

3. The radiation detector according to claim 2, wherein: The deflection suppression member is stacked on both the second surface side of the substrate and the surface side of the scintillator opposite to the surface side in contact with the substrate.

4. The radiation detector according to claim 1, wherein: The deflection suppression member has higher rigidity than the base plate.

5. The radiation detector according to claim 1, wherein: The deflection suppression member extends over a range larger than that of the scintillator.

6. The radiation detector according to claim 1, wherein: The substrate has a connection area connected to a flexible wiring. The deflection suppression member is provided in a region covering at least a portion of the connection region and the scintillator.

7. The radiation detector according to claim 1, wherein: The deflection suppression member has a bending elastic modulus of 1000 MPa or more and 3500 MPa or less.

8. The radiation detector according to claim 1, wherein: A ratio of a thermal expansion coefficient of the deflection suppression member to a thermal expansion coefficient of the scintillator is 0.5 or more and 2 or less.

9. The radiation detector according to claim 1, wherein: The deflection suppression member has a thermal expansion coefficient of 30 ppm / K or more and 80 ppm / K or less.

10. The radiation detector according to claim 1, wherein: The deflection suppression member is configured to include at least one of acrylic, polycarbonate, and polyethylene terephthalate.

11. The radiation detector according to claim 1, wherein: The radiation detector further includes a reinforcing member provided in a region spanning across an end portion of the scintillator and reinforcing a deflection suppressing effect of the deflection suppressing member.

12. The radiation detector according to claim 11, wherein: The reinforcing member has higher rigidity than the base plate.

13. The radiation detector according to claim 11 or 12, wherein: The reinforcing member is composed of the same material as the deflection suppressing member.

14. The radiation detector according to claim 1, wherein: The substrate is configured to include a resin film.

15. The radiation detector according to claim 1, wherein: The substrate is configured to include a base material composed of a resin material having a fine particle layer, the fine particle layer including fine particles composed of an inorganic material having an average particle diameter of 0.05 μm or more and 2.5 μm or less, The particle layer is provided on a second surface side of the substrate which is opposite to a first surface on which the plurality of pixels are provided.

16. The radiation detector according to claim 15, wherein: The fine particles include an element having an atomic number greater than that of an element constituting the resin material and having an atomic number of 30 or less.

17. The radiation detector according to claim 1, wherein: The thermal expansion coefficient of the substrate at 300° C. to 400° C. is 20 ppm / K or less.

18. The radiation detector according to claim 1, wherein: The substrate satisfies at least one of a heat shrinkage rate in a longitudinal direction at 400° C. of 0.5% or less when the thickness of the substrate is 25 μm and an elastic modulus of 1 GPa or more at 500° C.

19. The radiation detector according to claim 1, wherein: The radiation detector further includes a buffer layer provided between the substrate and the scintillator and having a thermal expansion coefficient between a thermal expansion coefficient of the substrate and a thermal expansion coefficient of the scintillator.

20. The radiation detector according to claim 1, wherein: The scintillator has a non-columnar portion on one end side of the columnar crystal, The non-columnar portion is in contact with the substrate.

21. The radiation detector according to claim 1, wherein: The deflection suppression member extends in regions corresponding to a central portion and a peripheral portion of the scintillator.

22. The radiation detector according to claim 5 or 21, wherein: The deflection suppression member is bent along an inclination at a peripheral edge portion of the scintillator.

23. The radiation detector according to claim 5, wherein: A space corresponding to the inclination of the peripheral portion of the scintillator is formed between the deflection suppression member and the scintillator.

24. The radiation detector according to claim 5, wherein: A filling material is filled in a space formed between the deflection suppression member and the scintillator.

25. The radiation detector according to claim 5, wherein: Ends of the deflection suppression member are supported by spacers.

26. The radiation detector according to claim 5, wherein: The deflection suppression member is bent along an inclination at a peripheral edge portion of the scintillator, and an end portion of the deflection suppression member is sealed by a sealing member.

27. The radiation detector according to claim 11, wherein: The reinforcing member is disposed in a region that does not overlap with the pixel region.

28. A radiographic imaging device, comprising: The radiation detector according to any one of claims 1 to 12, claims 14 to 21, and claims 23 to 27; a readout section that reads out the charge accumulated in the pixel; and A generating unit generates image data based on the charges read out from the pixels.

29. The radiation imaging device according to claim 28, wherein: The radiation imaging device further includes a housing having a radiation incident surface for incident radiation and accommodating the radiation detector. Of the substrate and the scintillator, the substrate is arranged on the radiation incident surface side.

30. A method for manufacturing a radiation detector, comprising the following steps: A step of forming a plurality of pixels each including a photoelectric conversion element on a flexible substrate; forming a scintillator having a plurality of columnar crystals on the substrate; and a step of disposing a deflection suppressing member for suppressing deflection of the substrate, The rigidity of the deflection suppression member is adjusted according to the height of the columnar crystals, the radius of the columnar crystals, the angle of the front end of the columnar crystals, and the interval between the columnar crystals. When the average value of the height of the columnar crystals is L, the average value of the radius of the columnar crystals is r, the average value of the intervals between the columnar crystals is d, the average value of the angles of the front ends of the columnar crystals is Φ, and the curvature radius of the deflection of the substrate caused by the weight of the scintillator is R, The deflection restraining member has a rigidity satisfying the following formula: R ≥ Lr / tanΦ+4r×{(Lr / tanΦ) 2 -(d / 2) 2} 1 / 2 / d.

31. The manufacturing method according to claim 30, wherein: The step of forming the scintillator includes the step of growing the columnar crystals on the surface of the substrate by a vapor phase growth method.

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