A heat dissipation structure for IGBT

Abstract

The present application provides a heat dissipation structure for IGBT, including a base plate, a cooling plate, a radiator including multiple heat sinks, and multiple flexible heat pipes; one side of the radiator is fixed on the base plate; the two ends of the heat pipe are respectively fixed on the radiator and the cooling plate, each heat pipe is arranged in pairs, and the corresponding ends of a pair of heat pipes are respectively fixed on the radiator and the cooling plate relatively; the cooling plate is fixed on the top of the radiator through the heat pipe; the IGBT module is fixed on the surface of the cooling plate away from the radiator; a flow channel of a set shape is provided in the cooling plate, and a liquid inlet and a liquid outlet are provided on the cooling plate corresponding to the flow channel, and the coolant flows into the flow channel through the liquid inlet and flows out of the cooling plate through the liquid outlet. The beneficial effects of the present application are: the cooling plate and the radiator can play two cooling modes of liquid cooling and air cooling for the IGBT module, and the two cooling modes can work simultaneously or separately, thereby increasing the heat dissipation efficiency and improving the reliability of the heat dissipation function.

Description

Technical Field

[0001] The present disclosure relates to the technical field of power electronic cooling, and in particular to a heat dissipation structure for IGBT. Background Art

[0002] With the development of electronic technology, electronic devices are increasingly moving towards high frequency, high speed and modularization. The widespread application of high-power 6-inch components and high-power IGBT modules has led to an increase in the heat generated by electronic devices. Data show that 55% of electronic equipment operating errors are caused by overheating, so electronic device cooling has become an increasingly important part of electronic product development and research. The quality of heat dissipation directly affects the cost, reliability, and performance of electronic products. Summary of the invention

[0003] The purpose of this application is to provide a heat dissipation structure for IGBT in view of the above problems.

[0004] In a first aspect, the present application provides a heat dissipation structure for an IGBT, comprising a base plate, a cooling plate, a radiator with multiple cooling fins, and multiple flexible heat pipes; one side of the radiator is fixed to the base plate; each of the heat pipes is connected between the radiator and the cooling plate, each of the heat pipes is arranged in pairs, a pair of the heat pipes forms a closed curve, and the corresponding ends of the pair of heat pipes are respectively fixed to the radiator and the cooling plate relative to each other; the IGBT module is fixed on the surface of the cooling plate away from the radiator; a flow channel of a set shape is provided in the cooling plate, and a liquid inlet and a liquid outlet are provided on the cooling plate corresponding to the flow channel, and the coolant flows into the flow channel through the liquid inlet and flows out of the cooling plate through the liquid outlet.

[0005] According to the technical solution provided in the embodiment of the present application, the flow channel includes a plurality of branch channels and a common flow channel arranged outside each of the branch channels, the liquid inlets are respectively connected to one end of each of the branch channels, and the other end of each of the branch channels is connected to the common flow channel, and the common flow channel is connected to the liquid outlet.

[0006] According to the technical solution provided in the embodiment of the present application, first slots are respectively provided on the base plate corresponding to the heat sinks of the radiator, and the heat sinks can be movably snapped into the first slots and fixed to the base plate by soldering with solder paste.

[0007] According to the technical solution provided in the embodiment of the present application, the radiator is provided with a first through hole corresponding to the pair of heat pipes, and one end of the pair of heat pipes can be movably inserted into the first through hole respectively.

[0008] According to the technical solution provided in the embodiment of the present application, the heat pipe inserted into the first through hole is fixed in the radiator by soldering with solder paste.

[0009] According to the technical solution provided in the embodiment of the present application, the cooling plate is provided with a second slot corresponding to the heat pipe, and the side of the heat pipe away from the radiator can be movably connected in the second slot.

[0010] According to the technical solution provided in the embodiment of the present application, the end of the heat pipe clamped in the second clamping groove is configured as a rectangular head.

[0011] According to the technical solution provided in the embodiment of the present application, the heat pipe clamped in the second clamping slot is fixedly connected to the cooling plate by soldering with solder paste.

[0012] According to the technical solution provided in the embodiment of the present application, it also includes a fan arranged corresponding to the radiator.

[0013] According to the technical solution provided in the embodiment of the present application, it also includes a water pump arranged corresponding to the cooling plate.

[0014] Beneficial effects of the present invention: The present application provides a heat dissipation structure for IGBT, comprising a base plate, a cooling plate, a radiator with multiple cooling fins and multiple flexible heat pipes; one side of the radiator is fixed on the base plate; each of the heat pipes is connected between the radiator and the cooling plate, each of the heat pipes is arranged in pairs, a pair of the heat pipes forms a closed curve, and the corresponding ends of a pair of the heat pipes are respectively fixed to the radiator and the cooling plate relatively; the IGBT module is fixed on the surface of the cooling plate away from the radiator; a flow channel of a set shape is provided in the cooling plate, and a liquid inlet and a liquid outlet are provided on the cooling plate corresponding to the flow channel, and the coolant flows into the flow channel through the liquid inlet and flows out of the cooling plate through the liquid outlet.

[0015] The coolant circulates in the cooling plate flow channel to cool down the IGBT module installed on the surface of the cooling plate. At the same time, the radiator located under the cooling plate can effectively dissipate the heat generated by the IGBT module. The cooling plate and the radiator can be used to cool the IGBT module in two cooling modes: liquid cooling and air cooling. The two cooling modes can work simultaneously or separately. On the one hand, the efficiency of heat dissipation can be increased. On the other hand, when any heat dissipation mode fails to work, the other heat dissipation mode can continue to work, ensuring the reliability of the heat dissipation function.

[0016] According to the technical solution provided in the embodiment of the present application, first slots are respectively provided on the base plate corresponding to the heat sinks of the radiator, and the heat sinks can be movably snapped into the first slots and fixed to the base plate by soldering with solder paste.

[0017] The heat sink is clamped in the first clamping slot and the heat sink is fixed to the bottom plate by soldering with solder paste, which can increase the stability of the connection between the heat sink and the bottom plate, increase the strength of the structure, and prevent the two from falling off due to vibration.

[0018] According to the technical solution provided in the embodiment of the present application, the heat pipe inserted into the first through hole is fixed in the radiator by soldering with solder paste. Soldering the radiator and one end of the heat pipe with solder paste can improve the stability of the connection between the two and prevent them from falling off due to vibration.

[0019] According to the technical solution provided in the embodiment of the present application, the heat pipe clamped in the second clamping slot is fixedly connected to the cooling plate by soldering. Using solder paste to fix the cooling plate to one end of the heat pipe by soldering can improve the stability of the connection between the two and prevent them from falling off due to vibration.

[0020] According to the technical solution provided in the embodiment of the present application, the end of the heat pipe clamped in the second clamping slot is set as a rectangular head. Setting the conventional arc-shaped head as a rectangle can increase the stability of the end of the heat pipe fixed in the second clamping slot.

[0021] According to the technical solution provided in the embodiment of the present application, the flow channel includes a plurality of branch channels and a common flow channel arranged outside each of the branch channels, the liquid inlets are respectively connected to one end of each of the branch channels, and the other end of each of the branch channels is connected to the common flow channel, and the common flow channel is connected to the liquid outlet.

[0022] The coolant enters each branch channel after passing through the liquid inlet, and takes away the heat generated by the IGBT module after circulating in the branch channel. In addition, the coolant circulates through each branch channel and finally converges into the public channel, then circulates around the inside of the cooling plate to further take away the heat around the edges of the cooling plate, and finally flows out of the cooling plate from the liquid outlet.

[0023] According to the technical solution provided in the embodiment of the present application, a fan is also provided corresponding to the radiator. The fan operates the radiator to increase the air circulation speed, thereby increasing the efficiency of air cooling and heat dissipation.

[0024] According to the technical solution provided in the embodiment of the present application, a water pump is also provided corresponding to the cooling plate. The water pump is connected to the liquid inlet and the liquid outlet of the cooling plate to increase the circulation speed of the coolant in the cooling plate and thus increase the liquid cooling efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a structural schematic diagram of the first embodiment of the present application;

[0026] Figure 2 This is a structural schematic diagram of the connection between the bottom plate and the radiator in the first embodiment of the present application;

[0027] Figure 3 for Figure 2 A schematic diagram of the enlarged structure of structure A in the middle;

[0028] Figure 4 This is a schematic diagram of the structure of the connection between the heat pipe and the cooling plate in the first embodiment of the present application;

[0029] Figure 5 This is a schematic diagram of the structure of the flow channel in the cooling plate in the first embodiment of the present application;

[0030] The text labels in the figure are as follows: 100, bottom plate; 110, first card slot; 200, cooling plate; 210, liquid inlet; 220, liquid outlet; 230, branch channel; 240, common channel; 300, radiator; 310, first through hole; 320, heat sink; 400, heat pipe; 410, rectangular head; 500, IGBT module. DETAILED DESCRIPTION

[0031] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present application is described in detail below in conjunction with the accompanying drawings. The description in this section is only exemplary and explanatory and should not have any limiting effect on the scope of protection of the present application.

[0032] like Figure 1 The first embodiment of the present application is shown, which includes a base plate 100, a cooling plate 200, a heat sink 300 with a plurality of heat sinks 320, and a plurality of flexible heat pipes 400;

[0033] One side of the heat sink 300 is fixed on the base plate 100;

[0034] Each of the heat pipes 400 is connected between the radiator 300 and the cooling plate 200. Each of the heat pipes 400 is arranged in pairs. A pair of the heat pipes 400 forms a closed curve. The corresponding ends of the pair of heat pipes 400 are fixed on the radiator 300 and the cooling plate 200 respectively and relatively.

[0035] The IGBT module 500 is fixed on the surface of the cooling plate 200 away from the heat sink 300;

[0036] A flow channel of a set shape is provided in the cooling plate 200 . A liquid inlet 210 and a liquid outlet 220 are provided on the cooling plate 200 corresponding to the flow channel. Coolant flows into the flow channel through the liquid inlet 210 and flows out of the cooling plate 200 through the liquid outlet 220 .

[0037] The coolant circulates in the flow channel of the cooling plate 200 to cool down the IGBT module 500 disposed on the surface of the cooling plate 200, and the radiator 300 located below the cooling plate 200 can effectively dissipate the heat generated by the IGBT module 500. The cooling plate 200 and the radiator 300 can be used for the IGBT module 500 in two cooling modes: liquid cooling and air cooling. The two cooling modes can work simultaneously or separately. When air cooling and liquid cooling work simultaneously, the efficiency of heat dissipation can be increased. When any heat dissipation mode fails to work, the other heat dissipation mode can continue to work, thereby ensuring the reliability of the heat dissipation function.

[0038] In a preferred embodiment, if Figure 2 and Figure 3 As shown, the first slots 110 are respectively provided on the bottom plate 100 corresponding to the heat sinks 320 of the heat sink 300, and the heat sink 320 is clamped in the first slots 110 and then the heat sink 300 is soldered and fixed to the bottom plate 100 by solder paste. In this preferred embodiment, clamping the heat sink 320 in the first slots 110 and soldering and fixing the heat sink 300 to the bottom plate 100 by solder paste can increase the stability of the connection between the heat sink 300 and the bottom plate 100, increase the strength of the structure, and prevent the two from falling off due to vibration.

[0039] In a preferred embodiment, a pair of first through holes 310 are provided on both sides of the heat sink 300 corresponding to a pair of the heat pipes 400 , and ends of the heat pipes 400 can be movably inserted into the first through holes 310 .

[0040] Preferably, in the above preferred embodiment, the heat pipe 400 inserted into the first through hole 310 is fixedly connected to the radiator 300 by soldering through the solder paste filled in the first through hole 310. Using solder paste to fix the radiator 300 and one end of the heat pipe 400 by soldering can improve the stability of the connection between the two and prevent them from falling off due to vibration.

[0041] In a preferred embodiment, if Figure 4 As shown, the cooling plate 200 is provided with a second slot corresponding to the heat pipe 400 , and the end of the heat pipe 400 away from the radiator 300 can be movably engaged in the second slot.

[0042] Preferably, in the above preferred embodiment, the heat pipe 400 clamped in the second clamping slot is fixedly connected to the cooling plate 200 by soldering through the solder paste filled in the second clamping slot. Using solder paste to fix the cooling plate 200 and one end of the heat pipe 400 by soldering can improve the stability of the connection between the two and prevent them from falling off due to vibration.

[0043] Preferably, in the above preferred embodiment, the end of the heat pipe 400 clamped in the second clamping groove is set as a rectangular head 410. Setting the conventional arc-shaped head to a rectangle can increase the stability of the end of the heat pipe 400 fixed in the second clamping groove.

[0044] In a preferred embodiment, if Figure 5 As shown, the flow channel includes a plurality of branch channels 230 and a common flow channel 240 located in a circle outside each of the branch channels 230, the liquid inlet 210 is respectively connected to one end of each of the branch channels 230, and the other end of each of the branch channels 230 is connected to the common flow channel 240, and one end of the common flow channel 240 is connected to the liquid outlet 220.

[0045] The coolant enters each of the parallel-connected branch channels 230 through the liquid inlet 210, and takes away the heat generated by the IGBT module 500 after circulating in the branch channels 230. In addition, the coolant circulates through each of the branch channels 230 and finally converges into the common channel 240, and then circulates around the inside of the cooling plate 200 to further take away the heat around the edges of the cooling plate 200, and finally flows out of the cooling plate 200.

[0046] In a preferred embodiment, a fan (not shown in the figure) is provided corresponding to the radiator 300. The fan operates the radiator 300 to increase the air circulation speed around the radiator 300, thereby increasing the efficiency of air cooling and heat dissipation.

[0047] In a preferred embodiment, a water pump (not shown in the figure) is provided corresponding to the cooling plate 200. The water pump is connected to the liquid inlet 210 and the liquid outlet 220 of the cooling plate 200 to increase the circulation speed of the coolant in the cooling plate 200, thereby increasing the liquid cooling efficiency.

[0048] This article uses specific examples to illustrate the principles and implementation methods of this application. The above examples are only used to help understand the methods and core ideas of this application. The above is only the preferred implementation method of this application. It should be pointed out that due to the limitations of textual expression and the objective existence of infinite specific structures, ordinary technicians in this technical field can make several improvements, modifications or changes without departing from the principles of this application, and can also combine the above technical features in an appropriate manner; these improvements, modifications, changes or combinations, or the direct application of the concepts and technical solutions of the application to other occasions without improvement, should be regarded as the scope of protection of this application.

Claims

1. A heat dissipation structure for IGBT, characterized in that: It comprises a base plate (100), a cooling plate (200), a heat sink (300) with a plurality of heat sinks (320), and a plurality of flexible heat pipes (400); One side of the heat sink (300) is fixed on the bottom plate (100); Each of the heat pipes (400) is connected between the radiator (300) and the cooling plate (200), each of the heat pipes (400) is arranged in pairs, a pair of the heat pipes (400) forms a closed curve, and corresponding ends of the pair of heat pipes (400) are fixed relatively to the radiator (300) and the cooling plate (200), respectively; The IGBT module (500) is fixed on a surface of the cooling plate (200) away from the heat sink (300); A flow channel of a set shape is provided in the cooling plate (200), and a liquid inlet (210) and a liquid outlet (220) are provided on the cooling plate (200) corresponding to the flow channel, and the cooling liquid flows into the flow channel through the liquid inlet (210) and flows out of the cooling plate (200) through the liquid outlet (220); The cooling plate (200) is provided with a second slot corresponding to the heat pipe (400), and a side of the heat pipe (400) away from the radiator (300) is movably snap-fitted into the second slot; The end of the heat pipe (400) clamped in the second clamping groove is configured as a rectangular sealing head (410); The heat sink (300) is provided with a first through hole (310) corresponding to the pair of heat pipes (400), and one end of the pair of heat pipes (400) is respectively and movably inserted into the first through hole (310).

2. The heat dissipation structure for IGBT according to claim 1, characterized in that: The flow channel comprises a plurality of branch flow channels (230) and a common flow channel (240) arranged on the periphery of each of the branch flow channels (230); the liquid inlet (210) is respectively connected to one end of each of the branch flow channels (230); the other end of each of the branch flow channels (230) is connected to the common flow channel (240); and the common flow channel (240) is connected to the liquid outlet (220).

3. The heat dissipation structure for IGBT according to claim 1, characterized in that: First slots (110) are respectively provided on the base plate (100) corresponding to the heat sinks (320) of the heat sink (300); the heat sinks (320) can be movably snapped into the first slots (110) and fixed to the base plate (100) by soldering with solder paste.

4. The heat dissipation structure for IGBT according to claim 1, characterized in that: The heat pipe (400) inserted into the first through hole (310) is fixed in the heat sink (300) by soldering with solder paste.

5. The heat dissipation structure for IGBT according to claim 1, characterized in that: The heat pipe (400) clamped in the second clamping slot is fixedly connected to the cooling plate (200) by soldering with solder paste.

6. The heat dissipation structure for IGBT according to claim 1, characterized in that: It also includes a fan arranged corresponding to the radiator (300).

7. The heat dissipation structure for IGBT according to claim 1, characterized in that: It also includes a water pump arranged corresponding to the cooling plate (200).

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