Light-emitting device

Abstract

A light emitting device, for example, further expands light distribution related to one of two mutually orthogonal directions. The light emitting device comprises: a light emitting element (110) having a first upper surface (110a) and a first side surface (110c); a light-transmitting component (120A) disposed above the first upper surface of the light emitting element and having a rectangular shape when viewed from above; a wavelength conversion component (150E) located between the light emitting element and the light-transmitting component and having a plurality of side surfaces (154c); and a reflective component (130A), the light-transmitting component having: two second side surfaces (122c) each including one side of a rectangular first side (121s) parallel to each other; and two third side surfaces (123c) each including one side of a rectangular second side (122s) perpendicular to the first side, the reflective component covering the first side surface of the light emitting element, the entirety of the plurality of side surfaces of the wavelength conversion component, and the entirety of the second side surface of the light-transmitting component, and a portion of each of the two third side surfaces of the light-transmitting component is exposed from the reflective component.

Description

Technical Field

[0001] The present disclosure relates to a light emitting device. Background Art

[0002] Semiconductor light emitting elements represented by LEDs are widely used as light sources for display devices, etc. Patent Documents 1 and 2 below disclose a light emitting device in which an LED chip is arranged in a concave portion of a package body having a concave portion, and the concave portion is filled with a light-transmitting resin.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2008-108994

[0004] Patent Document 2: Japanese Patent Application Publication No. 2010-093226

[0005] There is a demand for a light emitting device to have a wide directional characteristic with respect to a certain direction and a narrow directional characteristic with respect to another certain direction. Summary of the invention

[0006] A light-emitting device in a certain embodiment of the present disclosure comprises: at least one light-emitting element having a first upper surface and a first side surface; a light-transmitting component, which is arranged above the first upper surface of the light-emitting element and has a rectangular shape when viewed from above; a wavelength conversion component, which is located between the light-emitting element and the light-transmitting component and has multiple side surfaces; and a reflecting component, the light-transmitting component having: two second side surfaces, each of which includes one side of the mutually parallel first sides of the rectangular shape; and two third side surfaces, each of which includes one side of the second sides of the rectangular shape that are perpendicular to the first side, the reflecting component covers the first side surface of the light-emitting element, the entirety of the multiple side surfaces of the wavelength conversion component, and the entirety of the second side surface of the light-transmitting component, and a portion of each of the two third side surfaces of the light-transmitting component is exposed from the reflecting component.

[0007] A light-emitting device according to another embodiment of the present disclosure comprises: at least one light-emitting element having a first upper surface and a first side surface; a light-transmitting component arranged above the first upper surface of the light-emitting element and having a rectangular shape when viewed from above; a wavelength conversion component located between the light-emitting element and the light-transmitting component; and a reflective component, the light-transmitting component having: two second side surfaces, each including one of the mutually parallel first sides of the rectangular shape; and two third side surfaces, each including one of the second sides of the rectangular shape perpendicular to the first side; the wavelength conversion component having: a fourth side surface parallel to the second side surface of the light-transmitting component; and a fifth side surface parallel to the third side surface of the light-transmitting component; the reflective component covers the first side surface, the second side surface, the third side surface, the fourth side surface and the fifth side surface of the light-emitting element as a whole; the reflective component including: a first portion covering the third side surface of the light-transmitting component; and a second portion covering the fifth side surface of the wavelength conversion component, the first portion being thinner than the second portion, and the second portion having an upper surface located outside the first portion.

[0008] According to an embodiment of the present disclosure, for example, a light emitting device is provided in which light distribution is further expanded in one of two directions orthogonal to each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a perspective view showing a light emitting device according to a first embodiment of the present disclosure.

[0010] Figure 2 Yes Figure 1 The light emitting device 100A shown is a schematic cross-sectional view when it is cut parallel to the YZ plane.

[0011] Figure 3 Yes Figure 1 The light emitting device 100A shown is a schematic cross-sectional view when it is cut parallel to the ZX plane.

[0012] Figure 4 1 is a schematic plan view showing the lower surface 100 b of the light emitting device 100A.

[0013] Figure 5 This is an exemplary plan view schematically showing a state where a plurality of light emitting devices are mounted on a wiring substrate.

[0014] Figure 6 This is a schematic cross-sectional view showing a modified example of the light emitting device according to the first embodiment of the present disclosure.

[0015] Figure 7This is a schematic cross-sectional view showing another modified example of the light emitting device according to the first embodiment of the present disclosure.

[0016] Figure 8 It is a perspective view showing still another modified example of the light emitting device according to the first embodiment of the present disclosure.

[0017] Fig. 9 This is a schematic plan view showing another example of a light source device in which four light emitting devices are mounted on a wiring substrate.

[0018] Fig.10 This is a perspective view showing an example of a light emitting device having a light-transmitting member having a rectangular shape in a plan view.

[0019] Fig.11 Yes Fig.10 The light emitting device 100E shown is a schematic cross-sectional view when the light emitting device 100E is cut parallel to the YZ plane near the center.

[0020] Fig.12 It is a schematic YZ cross-sectional view of a light-emitting device as a second sample in which all four side surfaces of the light-transmitting component are covered by the reflective component.

[0021] Fig.13 It is a diagram showing the measurement results of the light distribution characteristics of the first and second samples in the long-side direction.

[0022] Fig.14 This is a perspective view showing an example of a light emitting device having a rectangular shape in a plan view and having a concave portion in a reflecting member.

[0023] Fig.15 It is a schematic plan view showing still another example of a light source device including a plurality of light emitting devices.

[0024] Fig.16 It is a perspective view showing another example of a light emitting device having a substrate.

[0025] Fig.17 Yes Fig.16 The light emitting device 100G shown is a schematic cross-sectional view when the light emitting device 100G is cut parallel to the YZ plane near the center.

[0026] Fig.18 Yes Fig.16 The light emitting device 100G shown is a schematic cross-sectional view when the light emitting device 100G is cut parallel to the ZX plane near the center.

[0027] Fig.19 It is a schematic front view showing still another example of a light source device including a plurality of light emitting devices.

[0028] Fig. 20 This is a schematic plan view showing an example of a backlight in which a light emitting device and a light guide plate are combined.

[0029] Fig.21 This is a perspective view of still another modified example of the light emitting device according to the first embodiment of the present disclosure as viewed from the front side.

[0030] Fig. 22 Observed from the back side Fig.21 A perspective view of the light emitting device shown.

[0031] Fig.23 Yes Fig.21 The light emitting device 100H shown is a schematic cross-sectional view when the light emitting device 100H is cut parallel to the YZ plane near the center.

[0032] Fig.24 Yes means including Figure 21 to Figure 23 A schematic top view of an example of a light source device of the light emitting device shown.

[0033] Fig.25 is a schematic cross-sectional view showing another example of a light-emitting device having a plurality of light-emitting elements.

[0034] Fig.26 It means including multiple Fig.25 A schematic front view of a light source device of the light emitting device shown.

[0035] Fig. 27 It is a perspective view showing a light emitting device according to a second embodiment of the present disclosure.

[0036] Fig.28 It means that Fig. 27 The light emitting device 100K shown is a schematic cross-sectional view when the light emitting device 100K is cut parallel to the YZ plane near the center.

[0037] Fig.29 Yes Fig. 27 The light emitting device 100K shown is a schematic cross-sectional view when the light emitting device 100K is cut parallel to the ZX plane near the center.

[0038] Fig.30 This is a graph showing the relationship between the thickness of the reflective member and the transmittance.

[0039] Fig.31 It is a schematic cross-sectional view showing another example of the light emitting device according to the second embodiment of the present disclosure.

[0040] Fig.32 This is a perspective view of still another example of the light emitting device according to the second embodiment of the present disclosure as viewed from the front side.

[0041] Fig.33 Yes Fig.32 The light emitting device 100M shown is a schematic cross-sectional view when the light emitting device 100M is cut parallel to the YZ plane near the center.

[0042] Fig.34 It means including and referring to Fig.16 The same substrate as the light emitting device described in the reference Fig.10 A three-dimensional view of a light emitting device having a reflective component similar to that of the light emitting device is illustrated.

[0043] Fig.35 It is a schematic perspective view for explaining an exemplary method of manufacturing a light emitting device according to an embodiment of the present disclosure.

[0044] Fig.36 It is a schematic perspective view for explaining an exemplary method of manufacturing a light emitting device according to an embodiment of the present disclosure.

[0045] Fig.37 It is a schematic cross-sectional view for explaining an exemplary method of manufacturing the light emitting device according to the embodiment of the present disclosure.

[0046] Fig.38 It is a schematic perspective view for explaining an exemplary method of manufacturing a light emitting device according to an embodiment of the present disclosure.

[0047] Fig.39 It is a schematic perspective view for explaining an exemplary method of manufacturing a light emitting device according to an embodiment of the present disclosure.

[0048] Fig.40 It is a schematic perspective view for explaining an exemplary method of manufacturing a light emitting device according to an embodiment of the present disclosure.

[0049] Fig.41 It is a schematic perspective view for explaining an exemplary method of manufacturing a light emitting device according to an embodiment of the present disclosure.

[0050] Description of Reference Numerals

[0051] 100A~100I, 100K~100N...light-emitting device; 110, 110P, 110Q...light-emitting element; 110c...side of the light-emitting element; 111...first electrode of the light-emitting element; 112...second electrode of the light-emitting element; 120A, 120E, 120P, 120Q...light-transmitting component; 121s...first side; 122c...side of the light-transmitting component (second side); 122s...second side ; 123c…the side surface of the light-transmitting component (the third side surface); 130A~130I…the reflecting component; 130Cd…the reflecting surface of the reflecting component; 130K~130N…the reflecting component; 130Kw, 130Lw, 130Mw…the wall portion of the reflecting component; 130r, 130rm…the recessed portion of the reflecting component; 140…the light-guiding component; 150E, 150K, 150P, 150Q…the wavelength conversion component. 154c…side surface of the wavelength conversion component (fourth side surface); 155c…side surface of the wavelength conversion component (fifth side surface); 200E, 200G, 200H…substrate; 201E, 201G, 201H…first conductive portion of the substrate; 202E, 202G, 202H…second conductive portion of the substrate; 210E, 210G, 210H…main body of the substrate; 300A, 300D, 300F~300I…light source device; 350…light guide plate; 350d…light introduction surface of the light guide plate; 400…backlight. DETAILED DESCRIPTION

[0052] Hereinafter, the embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The following embodiments are for illustration only, and the light-emitting device of the present disclosure is not limited to the following embodiments. For example, the numerical values, shapes, materials, steps, and the order of the steps shown in the following embodiments are merely examples, and various changes can be made as long as there is no technical contradiction.

[0053] The sizes and shapes of the components shown in the drawings are exaggerated for ease of understanding and sometimes do not reflect the size and shape of the actual light-emitting device and the size relationship between the components. In addition, in order to avoid making the drawings too complicated, some elements are sometimes omitted.

[0054] In the following description, components having substantially the same function are indicated by common reference symbols, and description is sometimes omitted. In the following description, terms indicating specific directions or positions are sometimes used (for example, "upper", "lower", "right", "left" and other terms including these terms). However, these terms are only used to facilitate understanding of the relative directions or positions in the referenced drawings. As long as the relationship between the relative directions or positions of the terms such as "upper" and "lower" in the referenced drawings is the same, the drawings, actual products, manufacturing devices, etc. outside the present disclosure may not be configured the same as the referenced drawings. In the present disclosure, "parallel" includes the case where two straight lines, edges, surfaces, etc. are within the range of about 0°±5° unless otherwise specifically mentioned. In addition, in the present disclosure, "vertical" or "orthogonal" includes the case where two straight lines, edges, surfaces, etc. are within the range of about 90°±5° unless otherwise specifically mentioned.

[0055] (First Embodiment)

[0056] Figure 1 to Figure 3 The light emitting device of the first embodiment of the present disclosure is shown. Figure 1 to Figure 3 In the figure, arrows indicating the X direction, Y direction, and Z direction that are orthogonal to each other are shown together. In other drawings of the present disclosure, arrows indicating these directions may be shown together.

[0057] Figure 1 to Figure 3 The light emitting device 100A shown generally includes a light emitting element 110, a light transmitting component 120A, and a reflective component 130A. Figure 2 and Figure 3 As schematically shown, in this example, the light emitting device 100A further includes a light guiding member 140 , and a portion of the light guiding member 140 is located between the lower surface 120Ab of the light transmissive member 120A and the upper surface 110 a (first upper surface) of the light emitting element 110 . Figure 2 and Figure 3 Each of them is a schematic cross-sectional view when the light emitting device 100A is cut perpendicularly to the upper surface 120Aa of the light-transmitting member 120A near the center of the light emitting device 100A. Figure 2 The cross section shown is a cross section when the light emitting device 100A is cut in parallel with the YZ plane. Figure 3 The cross section shown is a cross section when the light emitting device 100A is cut parallel to the ZX plane. As shown in the figure, the light guide member 140 can have a portion located on the side surface 110 c (first side surface) of the light emitting element 110 .

[0058] The light-transmitting member 120A is a plate-shaped member located above the upper surface 110a of the light-emitting element 110. The light-transmitting member 120A has a rectangular shape when viewed from above. Figure 1 As schematically shown in FIG. 1 , the upper surface 120Aa of the light-transmitting member 120A is square in plan view. The term "rectangular shape" in this specification means a quadrilateral shape defined by four sides, including, for example, a rectangular shape and a square shape.

[0059] exist Figure 1 to Figure 3 In the illustrated structure, the rectangular shape of the upper surface 120Aa is defined by a group of mutually parallel first sides 121s and a group of mutually parallel second sides 122s orthogonal to the first sides 121s. Here, the first sides 121s and the second sides 122s are parallel to the Y direction and the X direction, respectively, and the length of the first side 121s is equal to the length of the second side 122s.

[0060] like Figure 3 As shown in FIG. 1 , the light-transmitting member 120A has two side surfaces 122c (second side surfaces) that are parallel to the YZ plane and include the first side 121s. Figure 2 As shown, the light-transmitting member 120A has two side surfaces 123c (third side surfaces) which are parallel to the ZX plane and respectively include the second edges 122s. Figure 2 and Figure 3 As can be seen from the comparison, the reflective component 130A covers the side surface 110c of the light emitting element 110 and the entire side surfaces 122c of the light-transmitting component 120A, while a portion of each of the side surfaces 123c of the light-transmitting component 120A is exposed from the reflective component 130A.

[0061] The reflective member 130A is formed of, for example, a resin material in which a light-reflective filler is dispersed, and exhibits a reflectivity of, for example, 60% or more with respect to light having a peak wavelength of light emission of the light-emitting element 110. Therefore, the light emitted from the light-emitting element 110 is basically captured to the outside of the light-emitting device 100A via the light-transmitting member 120A. Here, a portion of each of the two side surfaces 123c of the light-transmitting member 120A is exposed from the reflective member 130A. Therefore, light can be captured not only from the upper surface 120Aa of the light-transmitting member 120A, but also from each side surface 123c. As a result, with respect to the direction in which the first side 121s extends, a light distribution that is more expanded than the direction in which the second side 122s extends can be obtained. That is, with respect to the YZ plane, compared with the light distribution in the ZX plane, the range of the emission angle of light that shows a certain intensity or more when the normal line of the upper surface 120Aa is used as a reference can be further expanded. As described above, according to the embodiment of the present disclosure, for example, a light distribution characteristic can be obtained in which the light distribution is narrow in the direction in which the second side 122 s extends and is further expanded in the direction in which the first side 121 s extends.

[0062] Hereinafter, each component will be described in detail.

[0063] [Light emitting element 110]

[0064] The light emitting element 110 is a well-known semiconductor light emitting element such as an LED (Light Emitting Diode). In the example shown in the figure, the light emitting element 110 has an element body 116, and a first electrode 111 and a second electrode 112 located on the side opposite to the upper surface 110a. In this example, the upper surface of the element body 116 constitutes the upper surface 110a of the light emitting element 110. The shape of the light emitting element 110 when viewed from above is typically a rectangular shape, and therefore, the light emitting element 110 has four side surfaces 110c.

[0065] The element body 116 includes, for example, a supporting substrate such as a sapphire substrate or a gallium nitride substrate, and a semiconductor stacking structure on the supporting substrate. The semiconductor stacking structure includes an active layer, and an n-type semiconductor layer and a p-type semiconductor layer sandwiching the active layer. The first electrode 111 and the second electrode 112 are electrically connected to the n-type semiconductor layer and the p-type semiconductor layer, respectively. The semiconductor stacking structure can include a nitride semiconductor (In x Al y Ga 1-x-y N, 0≤x, 0≤y, x+y≤1). Hereinafter, an LED that emits blue light is exemplified as the light emitting element 110.

[0066] [Light-transmitting member 120A]

[0067] The light-transmitting member 120A covers the light-emitting element 110 and functions as a protective layer for the light-emitting element 110. The light-transmitting member 120A is formed of, for example, a resin composition having a silicone resin as a base material. Typically, the light-transmitting member 120A has a transmittance of 60% or more for light having a peak emission wavelength of the light-emitting element 110. From the perspective of efficient use of light, it is beneficial if the transmittance of the light-transmitting member 120A at the peak emission wavelength of the light-emitting element 110 is 70% or more, and even more beneficial if it is 80% or more.

[0068] As the base material of the light-transmitting component 120A, for example, in addition to silicone resin, silicone-modified resin, epoxy resin, phenolic resin, polycarbonate resin, acrylic resin, polymethylpentene resin or polynorbornene resin, or a material containing two or more of the above can be applied. By dispersing a material having a refractive index different from that of the base material in the base material, the light-transmitting component 120A can also be given a light diffusion function. The terms "translucent" and "translucent" in this specification are interpreted as also including diffusivity for incident light, and are not limited to "transparent". Alternatively, the light-transmitting component 120A can also be formed of glass.

[0069] [Reflection member 130A]

[0070] As described above, the reflective member 130A is formed of, for example, a resin material in which a light-reflective filler is dispersed, and reflects incident light. The reflective member 130A has, for example, a reflectivity of 60% or more with respect to light having a peak emission wavelength of the light-emitting element 110. The reflectivity at the peak emission wavelength of the light-emitting element 110 may be 70% or more, or 80% or more.

[0071] As a matrix material for dispersing the light-reflective filler, for example, a silicone resin, a modified silicone resin, an epoxy resin, a modified epoxy resin, a urea-formaldehyde resin, a phenolic resin, an acrylic resin, a polyurethane resin or a fluororesin, or a resin containing two or more of the above resins can be used. As a light-reflective filler, particles of an inorganic material or an organic material having a higher refractive index than the matrix material can be used. Examples of light-reflective fillers are particles of titanium dioxide, zirconium dioxide, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, mullite, niobium oxide, barium sulfate, silicon oxide, various rare earth oxides (e.g., yttrium oxide, gadolinium oxide), etc.

[0072] like Figure 2 and Figure 3 As shown, the reflective component 130A covers the four side surfaces 110c of the light emitting element 110. The term "covering" in this specification is not limited to the form in which the covered components are in direct contact with the covered components, but also includes the form in which other components are sandwiched between them. In this example, the light guide component 140 is sandwiched between the side surface 110c of the light emitting element 110 and the reflective component 130A. However, the reflective component 130A covers the entire outer surface 140c of the light guide component 140, which means that the entire four side surfaces 110c of the light emitting element 110 are covered by the reflective component 130A.

[0073] like Figure 2 and Figure 3 As illustrated, the reflective member 130A may cover not only the side surface 110 c of the light emitting element 110 but also the surface opposite to the upper surface 110 a . Figure 4FIG. 1 shows an example of the lower surface 100b of the light emitting device 100A. Figure 4 As shown in the figure, in this example, the reflective member 130A covers the side opposite to the upper surface 110a of the light emitting element 110, and the lower surfaces of the first electrode 111 and the second electrode 112 are exposed from the reflective member 130A in the lower surface 100b. The portion of the lower surface 100b of the light emitting device 100A other than the first electrode 111 and the second electrode 112 is occupied by the reflective member 130A, so that light can be suppressed from being emitted from the lower surface 100b side of the light emitting device 100A, thereby achieving an effect of improving the light utilization efficiency.

[0074] The lower surfaces of the first electrode 111 and the second electrode 112 are exposed from the reflective member 130A, so that the light emitting device 100A can be easily mounted on a wiring substrate or the like by flip-chip connection. Figure 4 As illustrated, by making the shapes of the portions exposed from the reflective member 130A different between the first electrode 111 and the second electrode 112 , it is easy to distinguish which is the positive electrode and which is the negative electrode.

[0075] Figure 5 The diagram shows a state where a plurality of light emitting devices 100A are mounted on a wiring substrate. Figure 5 The light source device 300A shown includes a wiring substrate 310 and four light emitting devices 100A arranged in a row on the wiring substrate 310. Figure 5 In FIG. 1 , a relatively lower portion of the upper surface of the reflective member 130A of each light emitting device 100A is indicated by marking dark shadows.

[0076] like Figure 5 As shown in the example, by arranging the plurality of light emitting devices 100A along the direction in which the first side 121s of the upper surface 120Aa extends, the light distribution is narrow in the direction perpendicular to the direction in which the plurality of light emitting devices 100A are arranged, and the light distribution can be widened in the direction in which the plurality of light emitting devices 100A are arranged. Therefore, compared with the case where all the side surfaces of the light-transmitting member 120A are covered by the reflective member, for example, the interval between the light emitting devices 100A can be widened.

[0077] [Light guide member 140]

[0078] Reference Figure 2 and Figure 3 The light guide member 140 is a light-transmitting structure including at least a portion located on a portion of the side surface 110c of the light-emitting element 110, and has an outer surface 140c, which is an interface with the reflective member 130A. As shown in the figure, the reflective member 130A typically also has a portion located between the upper surface 110a of the light-emitting element 110 and the lower surface 120Ab of the light-transmitting member 120A.

[0079] As the material of the light-guiding component 140, a resin composition containing a transparent resin material as a base material can be used. For the base material of the light-guiding component 140, the same material as the base material of the light-transmitting component 120A can be used. Similar to the light-transmitting component 120A, the light-guiding component 140 has a transmittance of 60% or more for light having the peak emission wavelength of the light-emitting element 110. The light-guiding component 140 can also have a light diffusion function by, for example, dispersing a material having a refractive index different from that of the base material. From the viewpoint of efficient use of light, it is beneficial if the transmittance of the light-guiding component 140 at the peak emission wavelength of the light-emitting element 110 is 70% or more, and even more beneficial if it is 80% or more.

[0080] As shown in the figure, the light guide component 140 includes a portion located between the side surface 110c of the light emitting element 110 and the reflective component 130A. By providing the light guide component 140, a portion of the light emitted by the light emitting element 110 that comes out from the side surface 110c of the light emitting element 110 can be incident on the light guide component 140. The light incident on the light guide component 140 is reflected toward the top of the light emitting element 110 at the position of the outer surface 140c of the light guide component 140, and is emitted toward the outside of the light emitting device 100A via the light-transmitting component 120A. Therefore, by providing the light guide component 140, the light acquisition efficiency can be improved. The light guide component 140 can also cover the entirety from the lower end to the upper end of the element body 116. If the light guide component 140 covers more areas of the side surface 110c of the light emitting element 110, it is beneficial because more light can be guided toward the top of the light emitting element 110.

[0081] The shape of the outer surface 140c when viewed in cross section is not limited to Figure 2 and Figure 3 The shape of the outer surface 140c when viewed in section may also be a broken line, a curve protruding in a direction close to the light emitting element 110, a curve protruding in a direction away from the light emitting element 110, etc. If the shape of the outer surface 140c of the light guide member 140 when viewed in section is a curve protruding in a direction away from the light emitting element 110, more light emitted from the side surface 110c of the light emitting element 110 and passing through the light guide member 140 can be more effectively guided to the upper surface side of the light emitting device 100A. As a result, the light acquisition efficiency can be more advantageously improved.

[0082] As described above, the reflective member 130A covers the entirety of both side surfaces 122c of the light-transmitting member 120A and covers a portion of both side surfaces 123c perpendicular to the side surfaces 122c. However, the reflective member 130A does not necessarily cover a portion of each side surface 123c of the light-transmitting member 120A.

[0083] Figure 6 A modified example of the light emitting device according to the first embodiment of the present disclosure is shown. Figure 6 and Figure 2 Similarly, a cross section of the light emitting device cut in parallel with the YZ plane near the center of the light emitting device is schematically shown.

[0084] Compared with the above-mentioned light emitting device 100A, Figure 6 The light emitting device 100B shown in the figure has a reflective member 130B instead of the reflective member 130A. Figure 6 In the example shown, the entire side surfaces 123c of the light-transmitting member 120A are exposed from the reflecting member 130B. By exposing the entire side surfaces 123c from the reflecting member 130B, the light distribution in the direction in which the first side 121s extends can be more effectively expanded, in other words, the light distribution in the YZ plane can be more effectively expanded.

[0085] Figure 7 Another modified example of the light emitting device according to the first embodiment of the present disclosure is shown. Figure 7 The light emitting device 100C shown has a reflecting member 130C having a reflecting surface 130Cd provided on the side opposite to the lower surface 100b of the light emitting device 100C. The reflecting surface 130Cd faces a region of the side surface 123c of the light transmitting member 120A exposed from the reflecting member 130C and is inclined relative to the side surface 123c.

[0086] like Figure 7 As shown in the example, by providing the reflective surface 130Cd opposite to the side surface 123c of the light-transmitting member 120A on the reflective member 130C, the light emitted from the side surface 123c of the light-transmitting member 120A can be reflected by the reflective surface 130Cd and directed toward the upper side of the light-emitting device 100C. That is, the light acquisition efficiency can be improved. For example, when a light guide plate is arranged to be opposite to the upper surface 120Aa of the light-transmitting member 120A, more light can be introduced into the light guide plate by using the reflection on the reflective surface 130Cd of the reflective member 130C.

[0087] Figure 8 This is another modified example of the light emitting device according to the first embodiment of the present disclosure. Figure 8 The light emitting device 100D shown has a reflective component 130D. The reflective component 130D has recesses 130r on both sides of the light-transmitting component 120A in the direction in which the first side 121s extends. Alternatively, it can be said that the portion of the reflective component 130D covering the side surface 122c of the light-transmitting component 120A has a portion that extends beyond the position of the side surface 123c and in the positive direction and the negative direction of Y.

[0088] In this example, a portion of the side surface 123c of the light-transmitting member 120A is exposed from the reflecting member 130D at the position of the recess 130r. Figure 8 As in the example shown, by applying a shape in which a portion of the upper surface is cut away to the reflective member 130D, a light distribution characteristic that is further expanded in the direction in which the first side 121s extends can be obtained, as in the above-mentioned examples. Of course, it does not matter if the entirety of each of the two side surfaces 123c is exposed from the reflective member 130D at the position of the recess 130r.

[0089] Fig. 9 The light source device 300D is shown in which four light emitting devices 100D are mounted on a wiring substrate 310 . Fig. 9 The dark shadow in FIG. 1 shows the portion of the upper surface of the reflective member 130D where the recess 130r is formed. Figure 5 Similarly to the example described above, by arranging the plurality of light emitting devices 100D along the direction in which the first side 121s of the upper surface 120Aa extends, it is possible to expand light distribution in the direction in which the plurality of light emitting devices 100D are arranged.

[0090] (Other Modifications)

[0091] In the above-mentioned examples, the upper surface 120Aa of the light-transmitting member 120A has a square shape. However, the shape of the upper surface 120Aa in a plan view is not limited to a square shape.

[0092] Fig.10 An example of a light emitting device having a light-transmitting member having a rectangular shape in a plan view is shown. Fig.11 Indicates that Fig.10 The light emitting device 100E shown is a cross section when it is cut parallel to the YZ plane near the center of the light emitting device 100E.

[0093] and Figure 1 Compared with the light emitting device 100A shown, Fig.10 and Fig.11 The light emitting device 100E shown in the figure includes a light transmissive member 120E having an upper surface 120Ea having a rectangular shape in a plan view, instead of the light transmissive member 120A. Fig.10 As shown, the light emitting device 100E has an outer shape that is longer in the Y direction than in the X direction. In this example, two first sides 121s defining the rectangular shape of the upper surface 120Ea are the long sides of the rectangular shape, and two second sides 122s are the short sides of the rectangular shape.

[0094] The light-emitting device 100E includes a reflective member 130E having a shape longer in the Y direction than in the X direction, corresponding to the shape of the light-transmitting member 120E being longer in the Y direction than in the X direction. Similar to the light-emitting device 100A described above, at least a portion of the side surface 123c of the light-transmitting member 120E is exposed from the reflective member 130E.

[0095] Reference Fig.11 . Fig.11 The cross section shown is a cross section obtained when the light emitting device 100E is cut in parallel with the YZ plane near the center of the light emitting device 100E. In this example, the element body 116 of the light emitting element 110 has a shape that is longer in the Y direction than in the X direction, similarly to the light-transmitting member 120E. Fig.11 As shown, the light emitting device 100E further includes a wavelength conversion component 150E located between the upper surface 110a of the light emitting element 110 and the lower surface 120Eb of the light transmissive component 120E.

[0096] [Wavelength conversion component 150E]

[0097] The wavelength conversion member 150E is typically a plate-shaped member having a thickness of about 100 μm, for example, in which particles of a phosphor are dispersed in a resin. The wavelength conversion member 150E absorbs at least a portion of the light emitted from the light emitting element 110 and emits light of a wavelength different from the wavelength of the light from the light emitting element 110. For example, the wavelength conversion member 150E converts a portion of the blue light from the light emitting element 110 into yellow light by wavelength conversion. According to such a structure, white light is obtained by mixing the blue light passing through the wavelength conversion member 150E and the yellow light emitted from the wavelength conversion member 150E.

[0098] exist Fig.11 In the illustrated structure, the wavelength conversion component 150E has an upper surface 150Ea (second upper surface), a lower surface 150Eb on the opposite side of the upper surface 150Ea, and a side surface 154c (fourth side surface) located between the upper surface 150Ea and the lower surface 150Eb. Two of the four side surfaces 154c of the wavelength conversion component 150E are roughly aligned with the side surface 123c of the light-transmitting component 120E. In this example, the reflective component 130E covers the substantially entirety of the two side surfaces 154c parallel to the ZX plane, and the side surfaces 154c and 154c of the light-transmitting component 120E are roughly aligned with the side surfaces 123c of the light-transmitting component 120E. Fig.11The substantially entire two side surfaces 154c parallel to the YZ plane not shown in the figure. By covering the substantially entire side surface 154c with the reflective component 130E, the light directed from the inside of the wavelength conversion component 150E toward the side surface 154c can be reflected at the position of the side surface 154c and returned to the wavelength conversion component 150E. As a result, the relative intensity of the components that have not been subjected to wavelength conversion in the light emitted at a relatively large emission angle relative to the normal of the upper surface 120Ea of the light-transmitting component 120E can be reduced, and the color temperature of the obtained white light can be reduced. That is, in the area where the emission angle is relatively large, the light subjected to wavelength conversion and the light passing through the wavelength conversion component 150E can be more reliably mixed, and the blue color of the emitted light can be reduced, thereby suppressing the color unevenness in the direction in which the first side 121s extends.

[0099] From the perspective of suppressing color unevenness in the direction in which the first side 121s extends, it is beneficial for the reflective component 130E to cover the entire side 154c. However, the reflective component 130E does not necessarily have to cover the entire side 154c, and exposure of the side 154c in a range of about 3% can be allowed in the direction from the upper surface 150Ea of the wavelength conversion component 150E toward the lower surface 150Eb. That is, by covering more than 97% of the side 154c of the wavelength conversion component 150E from the lower surface 150Eb of the wavelength conversion component 150E toward the upper surface 150Ea of the wavelength conversion component 150E by the reflective component 130E, the effect of suppressing color unevenness in the direction in which the first side 121s extends can be expected.

[0100] The wavelength conversion component 150E can be formed using a resin composition in which particles of a phosphor or the like as a wavelength conversion substance are dispersed. As a resin for dispersing particles of a phosphor or the like, a silicone resin, a modified silicone resin, an epoxy resin, a modified epoxy resin, a urea-formaldehyde resin, a phenolic resin, an acrylic resin, a polyurethane resin or a fluororesin, or a resin containing two or more of these resins can be used. Known materials can be applied to the phosphor. Examples of phosphors are fluoride-based phosphors such as YAG-based phosphors and KSF-based phosphors, nitride-based phosphors such as CASN, β-sialon phosphors, and the like. YAG-based phosphors are examples of wavelength conversion substances that convert blue light into yellow light, KSF-based phosphors and CASN are examples of wavelength conversion substances that convert blue light into red light, and β-sialon phosphors are examples of wavelength conversion substances that convert blue light into green light. The phosphor can also be a quantum dot phosphor.

[0101] [Substrate 200E]

[0102] In addition, the light emitting device 100E further includes a substrate 200E on the side opposite to the upper surface where the upper surface 120Ea of the light-transmitting member 120E is located. The substrate 200E has a main body portion 210E, a first conductive portion 201E, and a second conductive portion 202E.

[0103] The main body 210E of the substrate 200E is typically a support body formed of an insulating material such as ceramic or resin, and has a thickness of about 140 μm, for example. The main body 210E may also be a component formed of a composite material such as epoxy glass. As the main body 210E, a metal substrate with an insulating layer provided on the surface may also be used.

[0104] like Fig.11 As schematically shown, a portion of the first conductive portion 201E is located on the upper surface 210Ea of the main body 210E and is electrically connected to the first electrode 111 of the light emitting element 110 through a bonding member not shown. In addition, the first conductive portion 201E includes a portion located on the lower surface 210Eb of the main body 210E and a portion located on the inner side surface of the through hole 220 provided in the main body 210E. The portion of the first conductive portion 201E located on the lower surface 210Eb of the main body 210E is electrically connected to the first electrode 111 of the light emitting element 110 via the portion located on the inner side surface of the through hole 220. Similarly, the second conductive portion 202E includes a portion electrically connected to the second electrode 112 of the light emitting element 110 on the upper surface 210Ea and a portion electrically connected to the second electrode 112 on the lower surface 210Eb of the main body 210E via the portion formed on the inner side surface of the through hole 220. In addition, the space in the through hole 220 can be filled with a resin or the like.

[0105] The portion of the first conductive portion 201E located on the lower surface 210Eb of the main body 210E and the portion of the second conductive portion 202E located on the lower surface 210Eb function as terminals for physically and electrically connecting the light emitting device 100E to a wiring substrate, etc. Examples of materials of the first conductive portion 201E and the second conductive portion 202E include Au, Pt, Pd, Rh, Ni, W, Mo, Cr, Ti, Fe, Cu, Al, Ag, etc., or alloys containing one or more of these. The first conductive portion 201E and the second conductive portion 202E may be formed in the form of a single layer film or a laminated film.

[0106] exist Fig.10 and Fig.11 In the illustrated structure, the structure on the substrate 200E has an outer shape that is longer in the Y direction than in the X direction, and the reflective component 130E reaches the upper surface 210Ea of the main body 210E of the substrate 200E, and can be similar to the reference except that the wavelength conversion component 150E is included. Figure 2 to Figure 4The structure on the substrate 200E can also be applied to the light emitting device 100A described above. Figure 8 The light emitting device 100D shown in the figure includes a reflecting member 130D having a recess 130r.

[0107] Here, the effect of expanding the light distribution by exposing the side surface 123 c of the light-transmitting member 120E from the reflecting member 130E was evaluated in the following procedure.

[0108] First, as a first sample, a light emitting device was prepared which had a rectangular shape in a plan view similar to the above-mentioned light emitting device 100E, and in which the entire side surface 123c of the short side of the light-transmitting component was exposed from the reflecting component. Fig.10 In addition, as a second sample, a light-emitting device was produced in which the entire four sides of the light-transmitting component were covered by the reflective component. Fig.12 , a YZ cross section of a light emitting device 500 as a second sample is schematically shown. The reflective component 530 of the light emitting device 500 covers the entirety of the four side surfaces of the light-transmitting component 120E including the two side surfaces 123c. In addition, the thickness of the portion of the reflective component 530 covering the side surface 123c is approximately 50 μm, and the thickness of the portion covering the side surface 122c perpendicular to the side surface 123c is approximately 35 μm. The thickness of the portion of the reflective component of the first sample covering the side surface 122c perpendicular to the side surface 123c is approximately the same as that of the reflective component 530.

[0109] Fig.13 The measurement results of the light distribution characteristics of the first and second samples in the long-side direction are shown. Fig.13 In FIG. 1 , the solid line L1 represents the measurement result related to the first sample, and the dotted line L2 represents the measurement result related to the second sample. Fig.13 In the example of , the full width at half maximum (FWHM) of the first sample is expanded to 120° compared to 117° as the full width at half maximum (FWHM) of the second sample. As shown in this way, by exposing the side surface 123c of the light-transmitting component from the reflective component, the effect of expanding the light distribution is obtained.

[0110] Fig.14 An example of a light emitting device having a rectangular shape in a plan view and having a concave portion in a reflecting member is shown. Fig.14 The light emitting device 100F shown is similar to the reference Fig.10 and Fig.11 Compared with the light emitting device 100E described above, the light emitting device 100E includes a reflective member 130F instead of the reflective member 130E. Figure 8The reflective member 130D of the light emitting device 100D described above similarly has recesses 130r on both sides of the light transmissive member 120E in the Y direction. Part or all of each of the two side surfaces 123c of the light transmissive member 120E is exposed from the reflective member 130F at the position of the recesses 130r.

[0111] Fig.15 Another example of a light source device including a plurality of light emitting devices is shown. Fig.15 The light source device 300F shown includes a wiring substrate 310 and three light emitting devices 100F. The three light emitting devices 100F are arranged on the wiring substrate 310 along the direction in which the first side 121s of the upper surface 120Ea extends.

[0112] exist Fig.15 In the example shown, light is emitted from the light emitting device 100F in the normal direction (the direction perpendicular to the paper surface) of the wiring substrate 310. By arranging a plurality of light emitting devices 100F along the direction in which the first side 121s extends, Figure 5 and Fig. 9 Similarly to the example described above, light distribution is obtained in which light spreading is suppressed in the X direction and light spreading further in the Y direction of the arrangement of the light emitting device 100F. Similar light distribution can be achieved when the light emitting device 100E described above is arranged instead of the light emitting device 100F.

[0113] Fig.16 Another example of a light-emitting device having a substrate is shown. Fig.17 Schematically indicating that Fig.16 The light emitting device 100G shown is a cross section when it is cut in parallel with the YZ plane near the center of the light emitting device 100G. Fig.18 The cross section of the light emitting device 100G is schematically shown when the light emitting device 100G is cut parallel to the ZX plane near the center of the light emitting device 100G. Fig.17 In the figure, for easy understanding, not only the end surface but also the portion viewed further back than the cut surface of the reflective member 130G is shaded the same as the end surface.

[0114] Figure 16 to Figure 18 The illustrated light emitting device 100G includes a substrate 200G instead of the substrate 200E. The substrate 200G includes a main body 210G, and a first conductive portion 201G and a second conductive portion 202G provided on the main body 210G. Fig.14Compared with the light emitting device 100F shown in FIG. 1 , the light emitting device 100G includes a reflective member 130G instead of the reflective member 130F. The reflective member 130G is similar to the reflective member 130F described above in that a recess 130r is provided on the upper surface thereof. Similar to the reflective member 130E and the reflective member 130F described above, the reflective member 130G covers the entirety of each of the two side surfaces 122c of the light transmitting member 120E and the entirety of each of the four side surfaces 154c of the wavelength converting member 150E.

[0115] Reference Fig.17 . The first conductive portion 201G is electrically connected to the first electrode 111 of the light-emitting element 110 via the bonding component 230. Similarly, the second conductive portion 202G is electrically connected to the second electrode 112 of the light-emitting element 110 via the bonding component 230. As the bonding component 230, for example, solder can be used. Examples of the material of the bonding component 230 are Au-containing alloys, Ag-containing alloys, Pd-containing alloys, In-containing alloys, Pb-Pd alloys, Au-Ga alloys, Au-Sn alloys, Sn alloys, Sn-Cu alloys, Sn-Cu-Ag alloys, Au-Ge alloys, Au-Si alloys, Al alloys, Cu-In alloys, or mixtures of metals and fluxes. As the material of the bonding component 230, liquid, paste or solid (sheet, block, powder, wire) components can be appropriately used. The bonding component 230 can be composed of a single component or a combination of multiple components.

[0116] like Fig.17 As schematically shown in FIG. 2 , the first conductive portion 201G and the second conductive portion 202G respectively include portions formed on the side surface 210Gc of the main body 210G, so that the substrate 200G is configured to be able to supply power to the first electrode 111 and the second electrode 112 of the light-emitting element 110 from the lower surface 210Gb side of the main body 210G. In this example, the main body 210G also has a substantially rectangular parallelepiped shape. The dimensions of the main body 210G are, for example, 1800 μm in length (Y direction), 300 μm in width (X direction), and 360 μm in height (Z direction).

[0117] Fig.19 Still another example of a light source device including a plurality of light emitting devices is shown. Fig.19 The light source device 300G shown includes a wiring substrate 310 and three light emitting devices 100G arranged on the wiring substrate 310 .

[0118] In this example, each light source device 300G is mounted on the main surface 310a in such a manner that the normal line of the upper surface 120Ea of the light-transmitting member 120E is perpendicular to the normal line of the main surface 310a of the wiring substrate 310. That is, in this example, light is emitted from each light source device 300G in the Z direction of the figure. The light-emitting device 100G is an example of a so-called side-view type light-emitting device.

[0119] Fig. 20 An example of a backlight in which a light emitting device and a light guide plate are combined is shown. Fig. 20 The illustrated backlight 400 includes a light source device 300G having a plurality of light emitting devices 100G, and a light guide plate 350 having a light introduction surface 350d. The light guide plate 350 has an upper surface 350a and a lower surface 350b as two main surfaces, with the light introduction surface 350d located therebetween.

[0120] In this example, the three light emitting devices 100G are arranged on the wiring substrate 310 along the direction in which the first side 121s extends, in other words, along the long side direction of the light emitting devices 100G. In addition, in this example, the light guide plate 350 is also arranged on the wiring substrate 310, and the light introduction surface 350d of the light guide plate 350 is optically coupled to the light emitting device 100G by being opposed to the upper surface 120Ea of the light-transmitting member 120E of each light emitting device 100G.

[0121] like Fig. 20 As schematically shown, light emitted from each light emitting device 100G is introduced into the light guide plate 350 from the light introduction surface 350d, and light incident from the light introduction surface 350d is emitted from the upper surface 350a of the light guide plate 350. The backlight 400 can be applied to a liquid crystal display device, for example. In this case, the light emitting device 100G is arranged at the periphery of the liquid crystal panel, and light is supplied from the periphery of the liquid crystal panel to the back side of the liquid crystal panel via the light guide plate 350.

[0122] According to the present embodiment, white light can be emitted to a wider angle range with respect to the long side direction of the light-emitting device, based on the normal direction of the upper surface of the light-transmitting component. Therefore, uniform white light with suppressed color unevenness can be obtained at a position closer to the upper surface of the light-transmitting component. Therefore, the distance d from the upper surface of the light-transmitting component to the light introduction surface 350d of the light guide plate 350 can be reduced. The reduction in distance d contributes to the miniaturization of display devices such as liquid crystal display devices, especially the narrowing of the frame called the bezel. The distance d between the light emission surface of the light-emitting device 100G, that is, the upper surface 120Ea, and the light introduction surface 350d can be, for example, in the range of 0 μm or more and 300 μm or less. According to the embodiment of the present disclosure, the distance d can also be reduced to a range of about 0 μm or more and 5 μm or less.

[0123] Any light emitting device in the embodiment of the present disclosure can also be applied as the light emitting device combined with the light guide plate 350. The number of light emitting devices optically coupled to the light guide plate 350 is arbitrary.

[0124] Figure 21 to Figure 23 Another modified example of the light emitting device according to the first embodiment of the present disclosure is shown. Fig. 22 Observed from the back side Fig.21 A perspective view of the light emitting device 100H is shown. Fig.23 Yes Fig.21 The light emitting device 100H shown is a schematic cross-sectional view when the light emitting device 100H is cut parallel to the YZ plane near the center.

[0125] Fig.21 The light emitting device 100H shown includes a reflective member 130H, a substrate 200H, and a first light-transmitting member 120P and a second light-transmitting member 120Q disposed on the upper surface 100a thereof. That is, the light emitting device 100H includes two light-transmitting members separated in space.

[0126] exist Fig.21 In the illustrated structure, the reflective component 130H has four recesses 130r provided on the upper surface 100a side of the light emitting device 100H. The four recesses 130r are arranged along the direction in which the first side 121s of the upper surface 120Pa of the light-transmitting component 120P and the first side 121s of the upper surface 120Qa of the light-transmitting component 120Q extend. As shown in the figure, the two side surfaces 123c of the light-transmitting component 120P and the two side surfaces 123c of the light-transmitting component 120Q are exposed from the reflective component 130H at the position of each recess 130r. Therefore, in this example, light is emitted from the upper surface 120Pa and the two side surfaces 123c of the light-transmitting component 120P, and the upper surface 120Qa and the two side surfaces 123c of the light-transmitting component 120Q. In addition, in Fig.23 In, with Fig.17 Similarly, for easy understanding, regarding the reflection member 130H, not only the end surface but also the portion viewed further back than the cut surface (the portion viewed further back than the recess 130r) is shaded the same as the end surface.

[0127] Reference Fig. 22 and Fig.23 The substrate 200H includes a main body 210H and three conductive parts. Fig. 22As shown in FIG. 1 , the three conductive parts include a first conductive part 201H, a second conductive part 202H, and a third conductive part 203H. A portion of each of the first conductive part 201H, the second conductive part 202H, and the third conductive part 203H is located on the lower surface 100b side of the light emitting device 100H. In addition, in the main body 210H, a recess 232 is provided at a position corresponding to the first conductive part 201H, the second conductive part 202H, and the third conductive part 203H on the lower surface 100b side of the light emitting device 100H. As described later, the three recesses 232 are used for electrical and physical connection between the wiring substrate and the conductive parts.

[0128] like Fig.23 As shown, the light-emitting device 100H includes a light-emitting element 110P as a first light-emitting element and a light-emitting element 110Q as a second light-emitting element. The first electrode 111 of the light-emitting element 110P is connected to a portion of the first conductive portion 201H located on the upper surface 210Ha of the main body 210H through a bonding component not shown, and the second electrode 112 of the light-emitting element 110P is connected to a portion of the second conductive portion 202H located on the upper surface 210Ha of the main body 210H. In this example, the first electrode 111 and the second electrode 112 of the light-emitting element 110Q are respectively connected to a portion of the second conductive portion 202H located on the upper surface 210Ha of the main body 210H and a portion of the third conductive portion 203H located on the upper surface 210Ha of the main body 210H. With reference to Fig.11 Similarly, the portion of the first conductive portion 201H located on the upper surface 210Ha of the main body 210H is electrically connected to the portion located on the lower surface 210Hb of the main body 210H via the through hole 220. The same is true for the second conductive portion 202H and the third conductive portion 203H. Therefore, the light emitting device 100H has a structure capable of supplying power to the light emitting element 110P and the light emitting element 110Q from the lower surface 100b side thereof. Fig.23 The example shown is an example of electrically connecting the light emitting element 110P and the light emitting element 110Q in series. Of course, the light emitting element 110P and the light emitting element 110Q may be electrically connected in parallel by connecting the first electrode 111 and the second electrode 112 to the second conductive portion 202H and the third conductive portion 203H, respectively.

[0129] like Fig.23As schematically shown, corresponding to the light emitting element 110P and the light emitting element 110Q supported on the substrate 200H, a wavelength conversion component 150P and a light-transmitting component 120P are arranged above the light emitting element 110P, and a wavelength conversion component 150Q and a light-transmitting component 120Q are arranged above the light emitting element 110Q. The number of light emitting elements 110 included in the light emitting device 100H is not limited to this example, and the light emitting device of the embodiment of the present disclosure may also include three or more light emitting elements 110. When the number of the light emitting elements 110 is two or more, the peak wavelengths of the light emitted therefrom do not need to be the same, and the phosphors contained in the plurality of wavelength conversion components may be different.

[0130] The reflective member 130H has a portion 130Hm located between the light-transmitting member 120P and the light-transmitting member 120Q, and the two recessed portions 130r located near the center of the light-emitting device 100H are not connected. In other words, a portion 130Hm of the reflective member 130H is sandwiched between one of the two side surfaces 123c of the light-transmitting member 120P located near the center of the light-emitting device 100H and one of the two side surfaces 123c of the light-transmitting member 120Q located near the center of the light-emitting device 100H, and the above side surfaces are not opposed to each other.

[0131] Fig.24 Indicates including Figure 21 to Figure 23 The light emitting device shown is an example of a light source device. Fig.24 The light source device 300H shown includes a plurality of light emitting devices 100H arranged on a wiring substrate 310. Here, in order to avoid complicating the drawing, two of the plurality of light emitting devices 100H arranged along the first side 121s are representatively shown.

[0132] and Fig.19 Similarly to the light emitting device 100G in the light source device 300G shown in FIG. 1 , the light emitting device 100H is mounted on the main surface 310a in such a manner that the normal lines of the upper surfaces of the light-transmitting members 120P and 120Q are perpendicular to the normal line of the main surface 310a of the wiring substrate 310. Fig.24 As schematically shown in FIG. 1 , each light emitting device 100H is provided with the above-mentioned recessed portion 232 (see FIG. 2 ) provided corresponding to the first conductive portion 201H, the second conductive portion 202H, and the third conductive portion 203H. Fig. 22 ) is mounted on the wiring substrate 310. A recess 232 is provided on the lower surface 100b of the light emitting device, and the solder 240 is arranged at a position on the wiring substrate 310 corresponding to the recess 232. By electrically and physically connecting the wiring substrate 310 and each conductive part via the solder 240, the light emitting device 100H can be fixed to the wiring substrate 310 more reliably.

[0133] Fig.25 Another example of a light-emitting device including a plurality of light-emitting elements is shown. Fig.25 is equivalent to Fig.23 Schematic cross-sectional view of the YZ cross-sectional view shown. Fig.25 The light emitting device 100I shown is similar to the reference Fig.23 The example to be described also includes the light emitting element 110P and the light emitting element 110Q, and the light transmissive member 120P and the light transmissive member 120Q are respectively arranged above the light emitting element 110P and the light emitting element 110Q.

[0134] and Fig.23 Compared with the light emitting device 100H shown in FIG. 1 , the light emitting device 100I has a reflective member 130I instead of the reflective member 130H. Fig.25 As schematically shown in FIG. 1 , a recess 130rm is formed near the center of the reflective component 130I, and the side 123c of the light-transmitting component 120P and the side 123c of the light-transmitting component 120Q are opposed to each other in the recess 130rm. In other words, the reflective component 130I does not have a portion sandwiched between one of the two side surfaces 123c of the light-transmitting component 120P that is located near the center of the light-emitting device 100I and one of the two side surfaces 123c of the light-transmitting component 120Q that is located near the center of the light-emitting device 100I. Fig.23 Similarly, in Fig.25 In the figure, for ease of understanding, regarding the reflective member 130I, not only the end surface but also the portion viewed further back than the cut surface (the portion viewed further back than the recess 130r and the recess 130rm) is shaded the same as the end surface.

[0135] Fig.26 Indicates that multiple Fig.25 The light source device of the light emitting device shown. Fig.26 The light source device 300I shown in FIG. 1 includes a wiring substrate 310 and two light emitting devices 100I arranged on the wiring substrate 310. Fig.26 As shown, the reflective member 130I may not include a portion between the light-transmitting member 120P and the light-transmitting member 120Q which are separated from each other in the direction in which the first side 121s extends when viewed from above.

[0136] (Second Embodiment)

[0137] Figure 27 to Figure 29 A light emitting device according to a second embodiment of the present disclosure is shown. Fig.28 Schematically indicating that Fig. 27 The light emitting device 100K shown is a cross section when it is cut in parallel with the YZ plane near the center of the light emitting device 100K. Fig.29The cross section when the light emitting device 100K is cut parallel to the ZX plane near the center of the light emitting device 100K is schematically shown.

[0138] Figure 27 to Figure 29 The light emitting device 100K shown generally includes a light emitting element 110, a wavelength conversion component 150K, a light transmitting component 120A, and a reflective component 130K. Fig. 27 As schematically shown, the reflective member 130K covers the two side surfaces 122c of the light-transmitting member 120A. In addition, the reflective member 130K has a wall portion 130Kw that covers the other two side surfaces 123c of the light-transmitting member 120A.

[0139] The wavelength conversion member 150K is located between the light emitting element 110 and the light-transmitting member 120A (see FIG. 1 ), similarly to the wavelength conversion member 150E in the light emitting device 100E described above. Fig.28 and Fig.29 ). Corresponding to the square shape of the light-transmitting component 120A when viewed from above, the wavelength conversion component 150K also has a square shape when viewed from above, and the wavelength conversion component 150K has two mutually opposing side surfaces 154c (fourth side surfaces) and two mutually opposing side surfaces 155c (fifth side surfaces). Here, the side surfaces 154c and 155c of the wavelength conversion component 150K are respectively parallel to the side surfaces 122c and 123c of the light-transmitting component 120A.

[0140] Typically, the side 154c of the wavelength conversion component 150K is aligned with the side 122c of the light-transmitting component 120A, and the side 155c of the wavelength conversion component 150K is aligned with the side 123c of the light-transmitting component 120A. However, it is not necessary for the side of the wavelength conversion component 150K to be aligned with the side of the light-transmitting component 120A. In addition, it is not necessary for the light-transmitting component 120A to have a square shape when viewed from above, and the shape of the upper surface may also be a rectangular shape. In this case, the side 123c is a surface including the short side of the rectangular side that defines the upper surface of the light-transmitting component, and the side 122c is a surface including the long side.

[0141] like Fig.28 and Fig.29 As shown, the reflective component 130K covers the entire outer surface 140c of the light guide component 140 and the side surface 110c of the light emitting element 110. Further, the reflective component 130K also covers the two side surfaces 154c and the other two side surfaces 155c of the wavelength conversion component 150K. That is, the reflective component 130K covers the side surface 110c of the light emitting element 110, the entire side surface 122c and the side surface 123c of the light-transmitting component 120A, and the entire side surface 154c and the side surface 155c of the wavelength conversion component 150K.

[0142] like Fig.28 As shown, the thickness t3 of the wall portion 130Kw (first portion) of the reflective component 130K covering the side 123c of the light-transmitting component 120A is smaller than the thickness t5 of the portion 130Kx (second portion) of the reflective component 130K covering the side 155c of the wavelength conversion component. As in this example, by providing a relatively thin portion in the reflective component 130K, a portion of the light incident on the reflective component 130K can be transmitted through the relatively thin portion. In particular, in this example, the thickness of the portion covering the side 123c is reduced compared to the portion of the reflective component 130K covering the side 122c of the light-transmitting component 120A. Therefore, the light incident on the portion covering the side 122c of the reflective component 130K can be reflected toward the upper surface 120Aa side of the light-transmitting component 120A, and at least a portion of the light incident on the portion covering the side 123c of the reflective component 130K can be captured to the outside of the light-emitting device 100K. That is, similarly to the first embodiment, a light distribution characteristic can be obtained in which the light distribution is narrow in the direction in which the second side 122s extends, and is further expanded in the direction in which the first side 121s extends. In addition, in this example, the side surfaces 154c and 155c of the wavelength conversion component 150K are covered by a relatively thick portion of the reflective component 130K, so that, for example, for white light, a light distribution characteristic can be achieved in which the light distribution is further expanded in the direction in which the first side 121s extends.

[0143] As described above, the wall portion 130Kw (first portion) of the reflective component 130K is thinner than the other portion of the reflective component 130K, namely, the portion 130Kx (hereinafter, sometimes referred to as the "second portion 130Kx"). That is, the outer side surface of the first portion 130Kw perpendicular to the upper surface 100a of the light-emitting device 100K is located on the inner side compared to the outer side surface of the second portion 130Kx perpendicular to the upper surface 100a of the light-emitting device 100K. Therefore, in this example, the second portion 130Kx of the reflective component 130K has an upper surface 130xa at a position lower than the upper surface of the wall portion 130Kw constituting a portion of the upper surface 100a of the light-emitting device 100K. As described in accordance with Fig. 27 and Fig.28 As can be understood, the upper surface 130xa is formed at two locations on the left and right sides of the light-transmitting member 120A in a plan view and are located outside the wall portion 130Kw. Fig. 27 and Fig.28 In the illustrated structure, the reflective member 130K has a step portion 130Sp formed by the upper surface 130xa of the second portion 130Kx and the wall portion 130Kw.

[0144] The step portion 130Sp is opened at the upper surface 100a of the light emitting device 100K and at one of a pair of outer side surfaces 100c of the light emitting device 100K located on opposite sides of each other with the light-transmitting member 120A interposed therebetween. The step portion 130Sp may also be referred to as a "cutout portion" formed in the reflective member 130K. However, the "cutout portion" referred to here is not limited to a shape formed by actually removing a part of a member by cutting, etc. For example, it may also be a shape formed by providing a convex portion in the mold cavity of a mold when transfer molding is applied. In other words, the "cutout portion" may also be a structure formed in a concave shape without removing a part of the reflective member.

[0145] By forming the upper surface 130xa of the second portion 130Kx at a position lower than the upper surface of the wall portion 130Kw, for example, at a height substantially the same as the lower surface of the light-transmitting member 120A, the thickness t3 of the wall portion 130Kw can be easily made smaller than the thickness t5 of the second portion 130Kx. By reducing the thickness t3 of the wall portion 130Kw compared to the thickness t5 of the second portion 130Kx, the light emitted from the light-emitting element 110 and incident on the side surface 123c of the light-transmitting member 120A can be effectively captured in a direction perpendicular to the side surface 123c. That is, compared with the light distribution in the ZX plane, the light distribution in the YZ plane can be expanded, and a light distribution characteristic in which the light distribution in the direction in which the second side 122s of the light-transmitting member 120A extends is narrow and the light distribution in the direction in which the first side 121s extends is further expanded can be obtained. Regarding the normal direction of the upper surface 120Aa of the light-transmitting member 120A, the height of the upper surface 130xa of the second portion 130Kx based on the height of the lower surface of the light-transmitting member 120A is, for example, in the range of ±20 μm, more preferably in the range of ±10 μm.

[0146] The upper surface 130xa of the second portion 130Kx may be located between the upper surface and the lower surface of the light-transmitting member 120A. According to the configuration of the upper surface 130xa, the thickness of the second portion 130Kx covering the side surface 155c of the wavelength conversion member in the reflective member 130K can be easily formed thicker. By increasing the thickness of the second portion 130Kx of the reflective member 130K, it is expected that the effect of suppressing the deterioration of the wavelength conversion member caused by the entry of moisture from the outside can be improved.

[0147] As described above, in the embodiment of the present disclosure, the reflective member does not necessarily have to be configured to completely reflect the light from the light emitting element. The reflective member may include a portion that is thin enough to transmit a portion of the light from the light emitting element.

[0148] Fig.30 An example of the relationship between the thickness of the reflective member and the transmittance is shown. Fig.30Samples of white resin sheets that imitate reflective components are made by changing the thickness, and the results of measuring the transmittance of each sample are shown. Here, a resin composition in which titanium oxide particles (CR-95 manufactured by Ishihara Sangyo Co., Ltd.) are mixed with a silicone resin (OE7660 manufactured by Dow Corning Co., Ltd.) at a weight ratio of 60wt% is formed into a sheet using a compression molding machine, and the obtained resin sheet is heated and cured in an oven, and then ground to a specified thickness to prepare three samples of different thicknesses. By changing the wavelength so that light is incident vertically, the transmittance of each wavelength is measured for each sample. A spectrophotometer U-3010 manufactured by Hitachi High-Tech Science Co., Ltd. is used for the measurement of transmittance.

[0149] like Fig.30 As shown in the figure, in the region with a wavelength of about 430 nm or more, the smaller the thickness of the sample, the greater the transmittance. For example, the transmittance to light with a wavelength of 450 nm is 3.9%, 5.1% and 6.6% in the samples with thicknesses of 50 μm, 40 μm and 30 μm, respectively. The transmittance to light with a wavelength of 630 nm is 7.1%, 8.9% and 10.9% in the samples with thicknesses of 50 μm, 40 μm and 30 μm, respectively. Fig.30 It can also be seen that the degree of increase in transmittance relative to a decrease in sample thickness is greater in a region with a longer wavelength.

[0150] according to Fig.30 It can be seen that even if the reflective component at the part where light is to be captured is not completely removed, light can be captured to the outside of the light emitting device by reducing the thickness of the reflective component. The thickness of the reflective component can be appropriately determined based on the desired transmittance and the structure of the material of the reflective component.

[0151] Fig.31 Another example of the light emitting device according to the second embodiment of the present disclosure is shown. Fig.31 is equivalent to Fig.28 Schematic cross-sectional view of the YZ cross-sectional view shown.

[0152] Fig.31 The light emitting device 100L shown includes a reflective member 130L having a wall portion 130Lw covering the side surface 123c of the light transmissive member 120A. Fig.31In the illustrated structure, the wall portion 130Lw has a shape in which the thickness decreases from the lower surface 100b side of the light-emitting device 100L toward the upper side. In this way, the thickness of the portion of the reflective component 130L covering the side surface 123c of the light-transmitting component 120A does not need to be constant along the vertical direction of the light-emitting device 100L. The reflective component 130L only needs to have a portion on the side surface 123c that is at least thinner than the portion covering the side surface 155c of the wavelength conversion component 150K. In this example, light can be emitted from the portion of the wall portion 130Lw that is close to the upper surface 120Aa of the light-transmitting component 120A.

[0153] Fig.32 and Fig.33 Still another example of the light emitting device according to the second embodiment of the present disclosure. Fig.33 Schematically indicating that Fig.32 The light emitting device 100M shown is a cross section when it is cut parallel to the YZ plane near the center of the light emitting device 100M.

[0154] Fig.32 The light emitting device 100M shown is similar to the reference Figure 21 to Figure 23 Similarly, the example described includes a substrate 200H, light-transmitting components 120P, 120Q, such as Fig.33 As shown, it has a light emitting element 110P and a light emitting element 110Q.

[0155] As in this example, the light emitting device of the second embodiment may include two or more light emitting elements, and may include a substrate having a conductive portion and connected to the light emitting elements. Fig.32 and Fig.33 In the illustrated structure, the light emitting device 100M includes a reflective component 130M. The reflective component 130M has four wall portions 130Mw whose thickness decreases from the lower surface 100b side of the light emitting device 100M toward the upper surfaces 120Pa and 120Qa of the light transmissive components 120P and 120Q, corresponding to the case where the light emitting device 100M includes two light transmissive components 120P and 120Q. Fig.32 and Fig.33 As schematically shown, the wall portion 130Mw covers the side surface 123 c of the light-transmitting member 120P or the side surface 123 c of the light-transmitting member 120Q.

[0156] [Exemplary method for manufacturing a light emitting device]

[0157] Next, an exemplary method for manufacturing the light emitting device according to the embodiment of the present disclosure is briefly described. Fig.34 The manufacturing method of the light emitting device 100N shown in FIG. 1 is taken as an example to describe the outline of the manufacturing method. Fig.34As shown, the light emitting device 100N and Fig.16 The light emitting device 100G shown in the figure also has a substrate 200G. The structure on the substrate 200G is similar to that on the substrate 200G. Fig.10 The light emitting device 100E shown is the same, and a part or the whole of the side surface 123c of the light-transmitting member 120E is exposed from the reflecting member 130E.

[0158] First, prepare the light emitting element 110. Here, prepare the light emitting element 110 whose upper surface 110a has a rectangular shape in a plan view. When the light emitting device is a side view type, the ratio between the long side and the short side of the upper surface 110a can be set to, for example, about 2:1 to 50:1. The light emitting element 110 can also be purchased.

[0159] Further, a substrate having a conductive portion is prepared. Fig.35 The substrate 200Gp includes the main body portion 210Gp, the first conductive portion 201Gp, and the second conductive portion 202Gp as shown. The substrate 200Gp can also be purchased and prepared.

[0160] Next, the light emitting element 110 is mounted on the substrate 200Gp. For example, after placing solder balls containing an Au-Sn alloy as the bonding member 230 on the first conductive portion 201Gp and the second conductive portion 202Gp, the light emitting element 110 is placed on the substrate 200Gp in such a manner that the first electrode 111 and the second electrode 112 are located on the solder balls. Thereafter, the light emitting element 110 is bonded to the substrate 200Gp by reflow soldering. Here, as shown in FIG. Fig.36 As shown, three light emitting elements 110 are arranged on the substrate 200Gp along the short side direction of the light emitting element 110 .

[0161] Next, the wavelength conversion member 150E and the light-transmitting member 120E are disposed above the light-emitting element 110. For example, a transparent adhesive 140r is applied to the upper surface 110a of each light-emitting element 110, such as Fig.37 As shown, the stacked body LB of the wavelength conversion component 150E and the light-transmitting component 120E is arranged on the transparent adhesive 140r. The stacked body LB can be produced, for example, by bonding a transparent resin sheet and a resin sheet dispersed with fluorescent material by hot pressing. The area of ​​the stacked body LB when viewed from above can be slightly larger than the area of ​​the upper surface 110a. If necessary, a disc-shaped grinding wheel (hereinafter referred to as "tool") can also be used to adjust the shape of the stacked body LB. Thereafter, by curing the transparent adhesive 140r, the light-guiding component 140 can be formed.

[0162] Next, the structure on the substrate 200Gp is ​​sealed with a resin material in which a light-reflective filler is dispersed. Fig.38As shown, here, a resin layer 130Np is formed to cover all three light emitting elements 110. Transfer molding, compression molding, etc. can be applied to the formation of the resin layer 130Np.

[0163] Next, a portion of the resin layer 130Np is removed by grinding or the like. Fig.39 As shown in FIG. 1 , the upper surface 120Ea of the light-transmitting member 120E is exposed from the ground surface Gs formed on the resin layer 130Np. Fig.40 As schematically shown, by rotating the tool Bd, the tool Bd is moved in the direction in which the second side 122s extends (in the direction in which the second side 122s extends). Fig.40 By moving the side surface 123c of each light-transmitting component 120E in the X direction (in the X direction), another part of the resin layer 130Np can be removed to expose a part or all of the side surface 123c of each light-transmitting component 120E from the resin layer 130Np. The method of exposing the side surface 123c from the resin layer 130Np is not limited to cutting, and laser-based processing can also be applied. Alternatively, in order to prevent the side surface 123c from being covered by the resin layer 130Np, a mold with a convex portion protruding toward the inside of the mold cavity can be used in the process of forming the resin layer 130Np.

[0164] Afterwards, if Fig.41 As schematically shown, for example, by dicing, the resin layer 130Np and the substrate 200Gp are cut at a position between adjacent light emitting elements 110, thereby obtaining Fig.34 The light emitting device 100N shown. The thickness of the portion of the reflective component 130E covering the side surface 122c perpendicular to the side surface 123c can be, for example, in the range of about 0 μm to about 100 μm. The thickness of the portion of the reflective component 130E covering the side surface 122c can be, for example, in the range of about 5 μm to about 80 μm, or can also be in the range of about 10 μm to about 50 μm.

[0165] In addition, Fig.40 In the step of removing a portion of the resin layer 130Np shown in the figure, a tool with a tapered shape or laser processing can also be used to form Fig.31 The wall portion 130Lw as shown or Fig.33 The wall portion 130Mw shown in FIG. can also be formed by using a mold with a convex portion pre-set on the inner side of the mold cavity or laser processing. Fig.16 Recess 130r is shown.

[0166] The embodiments of the present disclosure are applicable to various lighting light sources, vehicle-mounted light sources, display light sources, etc. In particular, the embodiments of the present disclosure can be advantageously applied to applications requiring anisotropy in light distribution.

Claims

1. A light emitting device, wherein: have: at least one light emitting element having a first upper surface and a first side surface; a light-transmitting member disposed above the first upper surface of the light-emitting element and having a rectangular shape in a plan view; a wavelength conversion component, which is located between the light-emitting element and the light-transmitting component and has a plurality of side surfaces; and Reflective components, The light-transmitting component comprises: two second side surfaces, each of which includes one side of the mutually parallel first sides of the rectangular shape; and two third side surfaces, each of which includes one of the second sides of the rectangular shape that is perpendicular to the first side, The reflective member covers the first side surface of the light emitting element, the entirety of the plurality of side surfaces of the wavelength conversion member, and the entirety of the second side surface of the light transmitting member. A portion of each of the two third side surfaces of the light-transmitting component is exposed from the reflective component.

2. The light emitting device according to claim 1, wherein: The two third side surfaces of the light-transmitting component are entirely exposed from the reflective component.

3. The light emitting device according to claim 1 or 2, wherein: The reflecting member has a reflecting surface that faces a region of the third side surface that is exposed from the reflecting member and is inclined with respect to the third side surface.

4. A light emitting device, wherein: have: at least one light emitting element having a first upper surface and a first side surface; a light-transmitting member disposed above the first upper surface of the light-emitting element and having a rectangular shape in a plan view; a wavelength conversion component located between the light emitting element and the light transmissive component; and Reflective components, The light-transmitting component comprises: two second side surfaces, each of which includes one side of the mutually parallel first sides of the rectangular shape; and two third side surfaces, each of which includes one of the second sides of the rectangular shape that is perpendicular to the first side, The wavelength conversion component has: a fourth side surface parallel to the second side surface of the light-transmitting component; and a fifth side surface, which is parallel to the third side surface of the light-transmitting component, The reflective component covers the entire first side surface, the second side surface, the third side surface, the fourth side surface, and the fifth side surface of the light emitting element. The reflective component comprises: a first portion covering the third side surface of the light-transmitting component; and a second portion covering the fifth side surface of the wavelength conversion component, The first portion is thinner than the second portion and transmits at least a portion of the light emitted from the light emitting element, the fourth side surface of the wavelength conversion component and the two second side surfaces of the light-transmitting component are covered by the second portion of the reflective component, The second portion has an upper surface located outside the first portion.

5. The light emitting device according to claim 4, wherein: The first portion of the reflective member includes a portion whose thickness decreases toward an upper side of the light emitting device.

6. The light emitting device according to claim 1 or 4, wherein: The light-transmitting component has a rectangular shape when viewed from above. The first side is the long side of the rectangular shape, The second side is a short side of the rectangular shape.

7. The light emitting device according to claim 1 or 4, wherein: The at least one light emitting element includes a first light emitting element and a second light emitting element, The first light-transmitting member located above the first light-emitting element and the second light-transmitting member located above the second light-emitting element are separated from each other along the direction in which the first side extends.

8. The light emitting device according to claim 7, wherein: The reflective member has a portion interposed between the third side surface of the first light-transmitting member and the third side surface of the second light-transmitting member.

9. The light emitting device according to claim 1 or 4, wherein: The light emitting element has a first electrode and a second electrode arranged on the side opposite to the first upper surface. The light emitting device further includes a substrate having a first conductive portion connected to the first electrode of the light emitting element and a second conductive portion connected to the second electrode of the light emitting element.

10. The light emitting device according to claim 1 or 4, wherein: A light guide member is further provided, the light guide member having a portion located between the first side surface of the light emitting element and the reflective member.

11. A backlight, wherein: have: The light emitting device according to any one of claims 1 to 10; and A light guide plate having two main surfaces and a light introduction surface located between the main surfaces and optically coupled to the light emitting device, A distance between a light emitting surface of the light-transmitting member and the light introducing surface of the light guide plate is greater than or equal to 0 μm and less than or equal to 5 μm.

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