Transistor Press-Fit Package Structure

Abstract

The present invention provides a transistor crimping packaging structure, which relates to the technical field of power electronic switches. The transistor crimping packaging structure comprises a first crimping block, a second crimping block, an elastic crimping assembly, a circuit board and a transistor; the first crimping block and the second crimping block are relatively pressed together, the elastic crimping assembly, the circuit board and the transistor are arranged between the first crimping block and the second crimping block, and the elastic crimping assembly crimps the transistor onto the circuit board. In this way, the structure is simple, the reliability is high, the space utilization rate is high, and the post-processing packaging, disassembly and maintenance are convenient.

Description

Technical Field

[0001] The present invention relates to the technical field of power electronic switches, and more particularly, to a transistor press-fit packaging structure. Background Art

[0002] Power semiconductor devices, also known as power electronic devices, are the core devices for power electronic devices to achieve electric energy conversion and circuit control. Among them, MOSFET transistors are widely used in various electronic products and devices. At the same time, the packaging technology of MOSFET transistors has also developed rapidly. There is an urgent need in the market for semiconductor device packaging technologies with low manufacturing costs, multi-functional integration, and high reliability.

[0003] The existing packaging structures of MOSFET transistors are complex in structure, poor in reliability, low in space utilization, and inconvenient for later processing, packaging, disassembly, and maintenance. Summary of the Invention

[0004] The purpose of the present invention is to provide a transistor press-fit packaging structure, which has a simple structure, high reliability, high space utilization, and is convenient for later processing, packaging, disassembly, and maintenance.

[0005] The technical solution provided by the present invention:

[0006] A transistor press-fit packaging structure includes a first press-fit block, a second press-fit block, an elastic press-fit assembly, a circuit board, and a transistor; the first press-fit block and the second press-fit block are relatively press-fitted, and the elastic press-fit assembly, the circuit board, and the transistor are arranged between the first press-fit block and the second press-fit block, and the elastic press-fit assembly presses the transistor onto the circuit board.

[0007] In a preferred embodiment of the present invention, the elastic press-fit assembly includes a third press-fit block, a press-fit guide post, and a press-fit disc spring; the third press-fit block is provided with a mounting hole, the press-fit guide post is arranged in the mounting hole, and the press-fit disc spring is arranged between the third press-fit block and the press-fit guide post for supporting the press-fit guide post to press the transistor tightly.

[0008] In a preferred embodiment of the present invention, the elastic press-fit assembly further includes a snap ring, the snap ring is sleeved on one end of the press-fit guide post extending out of the third press-fit block, and the other end of the press-fit guide post is used to press the transistor tightly.

[0009] In a preferred embodiment of the present invention, the press-fit guide post includes a first section and a second section, the diameter of the second section is larger than that of the first section, the first section is inserted into the mounting hole, the press-fit disc spring is sleeved on the first section and abuts against the end face of the second section, and the second section is used to press the transistor tightly.

[0010] In a preferred embodiment of the present invention, the transistor press-fit packaging structure further includes a fixing screw. A first through hole is formed in the elastic press-fit component, and a threaded hole is formed in the first press-fit block. The fixing screw passes through the first through hole and is screwed with the threaded hole, so as to connect the elastic press-fit component with the first press-fit block.

[0011] In a preferred embodiment of the present invention, the transistor is soldered to the circuit board.

[0012] In a preferred embodiment of the present invention, the circuit board is a copper substrate.

[0013] In a preferred embodiment of the present invention, the first press-fit block and the second press-fit block are made of oxygen-free copper.

[0014] In a preferred embodiment of the present invention, the transistor press-fit packaging structure further includes positioning posts. Positioning grooves are formed in the first press-fit block and / or the second press-fit block. The positioning posts are connected to the circuit board, and the positioning posts cooperate with the positioning grooves to determine the position of the circuit board relative to the first press-fit block and / or the second press-fit block.

[0015] In a preferred embodiment of the present invention, the circuit board is circular, and the transistors are arranged in a circular array form on the circuit board. Alternatively, the circuit board is rectangular, and the transistors are arranged in a matrix form on the circuit board.

[0016] The beneficial effects of the transistor press-fit packaging structure provided by the present invention are as follows:

[0017] The first press-fit block and the second press-fit block are arranged in a relatively press-fitted manner. The elastic press-fit component, the circuit board, and the transistor are arranged between the first press-fit block and the second press-fit block. The elastic press-fit component presses the transistor onto the circuit board. In this way, the structure is simple, the reliability is high, the space utilization rate is high, and the later processing, packaging, disassembly, and maintenance are convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0019] Figure 1 FIG. is a schematic diagram of the overall structure of the transistor press-fit packaging structure provided by the embodiment of the present invention.

[0020] Figure 2 Schematic exploded view of the transistor press-fit package structure provided by the embodiment of the present invention.

[0021] Figure 3 Schematic full-section view of the transistor press-fit package structure provided by the embodiment of the present invention.

[0022] Figure 4 Schematic exploded view of the elastic press-fit assembly.

[0023] Reference numerals: 100 - transistor press-fit package structure; 1 - first press-fit block; 11 - threaded hole; 2 - second press-fit block; 3 - elastic press-fit assembly; 31 - third press-fit block; 32 - first through hole; 33 - mounting hole; 34 - press-fit guide post; 341 - first section; 342 - second section; 35 - press-fit disc spring; 36 - snap ring; 4 - circuit board; 5 - transistor; 6 - fixing screw; 7 - positioning post; 8 - positioning groove. Detailed implementation manners

[0024] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Generally, the components of the embodiments of the present invention described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0025] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed present invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without making creative efforts fall within the scope of protection of the present invention.

[0026] It should be noted that: like reference numerals and letters denote like items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0027] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present invention is usually placed during use, or the orientation or positional relationship commonly understood by those skilled in the art. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention.

[0028] In addition, terms such as "first", "second", "third", etc. are only used for distinguishing descriptions and cannot be construed as indicating or implying relative importance.

[0029] In the description of the present invention, it should also be noted that unless otherwise clearly specified and defined, the terms "arranged", "installed", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] Aiming at the defects of the existing packaging structure of MOSFET transistors, such as complex structure, poor reliability, low space utilization rate, and inconvenient post-processing packaging, disassembly, and maintenance, etc., this embodiment provides a transistor crimping packaging structure to improve the above defects.

[0031] Please refer to Figures 1 to 3 , the transistor crimping packaging structure 100 includes a first crimping block 1, a second crimping block 2, an elastic crimping component 3, a circuit board 4, a transistor 5, a fixing screw 6, and a positioning post 7.

[0032] The first crimping block 1 and the second crimping block 2 are relatively pressed and arranged, and the elastic crimping component 3, the circuit board 4, and the transistor 5 are arranged between the first crimping block 1 and the second crimping block 2. The elastic crimping component 3 can be used to crimp the transistor 5 onto the circuit board 4.

[0033] In this embodiment, the transistor 5 is selected as a MOSFET and is of a crimping type. Multiple transistors 5 are simultaneously crimped onto a circuit board 4 to achieve the parallel connection of multiple transistors 5. Compared with the traditional single-welding type MOSFET, the number of parallel connections can be greatly reduced.

[0034] The layout of the transistors 5 on the circuit board 4 can be adjusted according to the actual usage situation. In this embodiment, the circuit board 4 is circular, and the transistors 5 are arranged in a circular array form on the circuit board 4. In other embodiments, the circuit board 4 can also be rectangular, and the transistors 5 are arranged in a matrix form on the circuit board 4.

[0035] The transistor 5 is soldered to the circuit board 4 to play a role in preliminary fixing, positioning, and current conduction. The circuit board 4 is selected as a copper substrate. The copper substrate has good mechanical properties and heat conduction effects, and has a large current-carrying capacity. Its heat conduction effect is many times better than that of aluminum substrates and iron substrates, and it is suitable for heat dissipation in high-frequency circuits, areas with large high and low temperature changes, and precision communication equipment.

[0036] The first crimping block 1 and the second crimping block 2 are selected to be made of oxygen-free copper, and the dimensions and parameters can be corrected according to the actual usage. Radiators and other devices can also be added to the outsides of the first crimping block 1 and the second crimping block 2 according to actual needs.

[0037] Among them, the positioning post 7 is connected to the circuit board 4, and positioning grooves 8 are provided on the first crimping block 1, the second crimping block 2 and the elastic crimping assembly 3. After the transistor crimping and encapsulation structure 100 is assembled, the positioning post 7 cooperates with the positioning groove 8 to determine the position of the circuit board 4 relative to the first crimping block 1, the second crimping block 2 and the elastic crimping assembly 3. The provision of the positioning post 7 can play a role in fixing and limiting.

[0038] A first through hole 32 is provided on the elastic crimping assembly 3, and a threaded hole 11 is provided on the first crimping block 1. The fixing screw 6 passes through the first through hole 32 and is screwed with the threaded hole 11 to connect the elastic crimping assembly 3 with the first crimping block 1. By providing the fixing screw 6, the elastic crimping assembly 3 can be locked with the first crimping block 1 to prevent loosening and falling off.

[0039] Please refer to Figure 3 and Figure 4 , the elastic crimping assembly 3 includes a third crimping block 31, a crimping guide post 34, a crimping disc spring 35 and a snap ring 36; among them, the third crimping block 31 is also made of oxygen-free copper, the third crimping block 31 is provided with a mounting hole 33, the crimping guide post 34 is arranged in the mounting hole 33, and the crimping disc spring 35 is arranged between the third crimping block 31 and the crimping guide post 34 to support the crimping guide post 34, so as to realize the functions of fixing the crimping disc spring 35 and conducting electricity. The snap ring 36 is sleeved on one end of the crimping guide post 34 extending out of the third crimping block 31 to prevent the crimping guide post 34 from accidentally falling out of the mounting hole 33, and the other end of the crimping guide post 34 is used to press the transistor 5.

[0040] The elasticity of the crimping disc spring 35 can ensure that the other end of the crimping guide post 34 provides sufficient pressing force on the transistor 5. The magnitude of the pressing force, the size and quantity of the crimping disc spring 35 can be determined according to the requirements of the transistor 5.

[0041] Specifically, the crimping guide post 34 includes a first section 341 and a second section 342. The diameter of the second section 342 is larger than that of the first section 341. The first section 341 is inserted into the mounting hole 33, the crimping disc spring 35 is sleeved on the first section 341 and abuts against the end face of the second section 342, and the second section 342 is used to press the transistor 5.

[0042] The beneficial effects of the transistor crimping and encapsulation structure 100 provided in this embodiment:

[0043] 1. The structure design is integrated, and all components are arranged in a stacked and integrated manner. In this way, the structure is simple, highly reliable, has a high space utilization rate, and is also convenient for later processing, packaging, disassembly, and maintenance.

[0044] 2. The transistor 5 is pressed by the pressing disc spring 35, which greatly reduces the number of parallel-connected transistors 5.

[0045] 3. The pressing disc spring 35 provides pressure to the transistor 5 through the pressing guide post 34, reducing the thermal resistance of the contact surface. At the same time, using a copper-based circuit board 4 can enhance the heat dissipation capacity of the overall structure.

[0046] 4. The pressing guide post 34 not only plays a role in fixing the pressing disc spring 35 but also serves as a conductor. The current directly acts on the transistor 5 through the pressing guide post 34, thereby increasing the current-carrying capacity of the overall structure.

[0047] 5. After being pressed by the pressing disc spring 35, it is ensured that sufficient pressure is provided to the transistor 5. Moreover, the pressure of the pressing disc spring 35 will not change due to external pressure, and thus the applicable range of the overall external pressure is larger, and the applicable range of the overall structure is wider.

[0048] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, various changes and modifications can be made to the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A transistor press-fit packaging structure, characterized in that The transistor crimping and encapsulation structure includes a first crimping block (1), a second crimping block (2), a resilient crimping assembly (3), a circuit board (4), and a transistor (5); the first crimping block (1) and the second crimping block (2) are relatively pressed and set, the resilient crimping assembly (3), the circuit board (4), and the transistor (5) are arranged between the first crimping block (1) and the second crimping block (2), and the resilient crimping assembly (3) crimps the transistor (5) onto the circuit board (4). The resilient crimping assembly (3) includes a third crimping block (31), a crimping guide post (34), a crimping disc spring (35), and a snap ring (36); the third crimping block (31) is provided with an installation hole (33), the crimping guide post (34) is arranged in the installation hole (33), the crimping disc spring (35) is arranged between the third crimping block (31) and the crimping guide post (34) for supporting the crimping guide post (34) to tightly press the transistor (5), the snap ring (36) is sleeved on one end of the crimping guide post (34) extending out of the third crimping block (31), and the other end of the crimping guide post (34) is used for tightly pressing the transistor (5). The crimping guide post (34) includes a first section (341) and a second section (342), the diameter of the second section (342) is larger than that of the first section (341), the first section (341) is inserted into the installation hole (33), the crimping disc spring (35) is sleeved on the first section (341) and abuts against the end face of the second section (342), and the second section (342) is used for tightly pressing the transistor (5).

2. The transistor press-fit package structure according to claim 1, characterized in that, The transistor crimping and encapsulation structure further includes a fixing screw (6), a first through hole (32) is formed on the resilient crimping assembly (3), a threaded hole (11) is formed on the first crimping block (1), and the fixing screw (6) penetrates through the first through hole (32) and is screwed with the threaded hole (11) so that the resilient crimping assembly (3) is connected to the first crimping block (1).

3. The transistor press-fit package structure according to claim 1, wherein The transistor (5) is soldered to the circuit board (4).

4. The transistor press-fit package structure according to claim 1, characterized in that The circuit board (4) is a copper substrate board.

5. The transistor press-fit package structure according to claim 1, wherein The first crimping block (1) and the second crimping block (2) are made of oxygen-free copper.

6. The transistor press-fit package structure according to claim 1, wherein The transistor crimping and encapsulation structure further includes a positioning post (7), a positioning groove (8) is formed on the first crimping block (1) and / or the second crimping block (2), the positioning post (7) is connected to the circuit board (4), and the positioning post (7) cooperates with the positioning groove (8) to determine the position of the circuit board (4) relative to the first crimping block (1) and / or the second crimping block (2).

7. The transistor press-fit package structure according to claim 1, characterized in that, The circuit board (4) is circular, and the transistors (5) are arranged in a circular array form on the circuit board (4), or the circuit board (4) is rectangular, and the transistors (5) are arranged in a matrix form on the circuit board (4).

Images