Wafer loading equipment
By vertically setting the wafer table in the wafer chip loading equipment and using a crystal extraction arm and a pivoting mechanism for crystal extraction and chip loading, the error and efficiency problems caused by the relay supply of multiple arms in the prior art are solved, and efficient wafer chip loading is achieved.
Patent Information
- Application Number
- CN201911007677.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2019-10-22
- Publication Date
- 2025-05-06
- Estimated Expiration
- 2039-10-22
AI Technical Summary
Existing wafer chip loading equipment is usually arranged horizontally, resulting in the need of multiple conveyor arms to relay the chip during the chip supply process, resulting in a decrease in equipment accuracy and production capacity.
A wafer chip loading device for vertical chip supply is designed, and the wafer stage is set vertically and a vacuum suction hole and a first translation mechanism are provided thereon, the XY movement of the wafer stage in the vertical plane is realized. At the same time, the crystal extraction arm and the pivoting mechanism are used to pivot at 90° to complete the crystal extraction and chip assembly operations.
Through the design of vertical sheet supply, one crystal extraction arm can complete the crystal extraction and sheet loading actions, overcome the errors during relay crystal extraction by multiple arms, improve the efficiency of sheet loading, and meet the chip loading needs of modern industrial production.
Smart Images

Figure CN110648953B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of wafer loading, and in particular to a wafer loading device for vertical wafer feeding. Background Art
[0002] Wafer loading equipment is a key equipment in semiconductor packaging production lines, and it is widely used in wafer packaging. With the advancement of technology, the loading accuracy of the loading machine is developing towards the sub-micron level, which in turn supports what is currently known as micro-assembly technology in the industry. However, existing wafer loading equipment is usually set horizontally. In order to achieve wafer feeding, it is usually necessary to set up multiple conveyor arms to relay wafer feeding, which leads to a certain decrease in equipment accuracy and production capacity. Therefore, it is necessary to propose further solutions to the above problems. Summary of the invention
[0003] The present invention aims to provide a wafer loading device to overcome the deficiencies in the prior art.
[0004] In order to solve the above technical problems, the technical solution of the present invention is:
[0005] A wafer loading device, comprising:
[0006] A wafer table having a table top for fixing a wafer, the wafer table being arranged in a vertical direction, the wafer table being arranged on a first translation mechanism, and the first translation mechanism driving the wafer table to perform XY motion in a vertical plane;
[0007] A crystal retrieval device, comprising: a crystal retrieval arm and a pivot mechanism, wherein the crystal retrieval arm is driven by the pivot mechanism to pivot 90° in a plane perpendicular to the table;
[0008] A film loading table having a working surface for fixing a substrate, the film loading table being arranged in a horizontal direction, the film loading table being arranged on a second translation mechanism, and the second translation mechanism driving the film loading table to perform XY motion in a horizontal plane;
[0009] The cam mechanism comprises cams, and the cams are respectively arranged at the crystal taking position and the wafer loading position.
[0010] As an improvement of the wafer loading device of the present invention, vacuum suction holes are opened on the wafer table, and the vacuum suction holes are evenly arranged on the table surface, and the distance between adjacent vacuum suction holes is less than the minimum size of a wafer.
[0011] As an improvement of the wafer loading equipment of the present invention, the first translation mechanism includes: a first base, a first guide rail for the first base to slide along the X direction, a second base arranged on the first base, and a second guide rail arranged on the first base for the second base to slide along the Y direction, and the first translation mechanism is arranged on a bracket arranged in a vertical direction.
[0012] As an improvement of the wafer loading device of the present invention, the pivot mechanism is a rotating motor, and one end of the crystal retrieval arm is drivingly connected to the rotating motor.
[0013] As an improvement to the wafer loading device of the present invention, a pressing plate is further provided on the loading table, and the pressing plate presses the edges of the substrate to be loaded.
[0014] As an improvement of the wafer loading equipment of the present invention, the second translation mechanism includes: a third base, a third guide rail for the third base to slide along the X direction, a fourth base arranged on the third base, and a fourth guide rail arranged on the third base for the fourth base to slide along the Y direction, and the second translation mechanism is arranged on a bracket arranged in a horizontal direction.
[0015] As an improvement to the wafer loading device of the present invention, the wafer retrieval position and the wafer loading position are fixed positions, and the cam is driven by a motor to drive the wafer retrieval arm to retrieve the wafer and load the wafer.
[0016] As an improvement of the wafer loading equipment of the present invention, the wafer loading equipment also includes a glue sticking station, the glue sticking station is located upstream of the loading station, a conveying arm is arranged between the glue sticking station and the loading station, and a glue sticking tank is arranged on the glue sticking station.
[0017] As an improvement of the wafer loading equipment of the present invention, a visual inspection device is also provided at the wafer retrieval position and the loading position.
[0018] Compared with the prior art, the beneficial effects of the present invention are as follows: the wafer loading equipment of the present invention sets the wafer table vertically, and one crystal retrieval arm can complete the crystal retrieval and loading actions, which overcomes the errors caused by multiple arms relaying crystal retrieval, and at the same time improves the loading efficiency, fully meeting the loading needs of modern industrial production. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0020] Figure 1 It is a front view of a specific implementation mode of the wafer loading equipment of the present invention. DETAILED DESCRIPTION
[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0022] like Figure 1 As shown, the present invention provides a wafer loading device, which is used for assembling a wafer and a substrate in an integrated circuit. Specifically, the wafer loading device comprises: a wafer table 1, a wafer taking device 2, a loading table 3, and a cam mechanism 4.
[0023] The wafer table 1 is used to provide wafers to be assembled, wherein the wafers are from a larger wafer, and the wafer is pre-cut to form multiple small wafers. The wafer table 1 has a table for fixing the wafer, and the wafer table 1 is arranged in a vertical direction. In this way, it is convenient to complete the wafer taking and wafer loading actions through a wafer taking arm.
[0024] At the same time, in order to keep the wafer fixed, vacuum holes are opened on the wafer table 1, and the vacuum holes are evenly arranged on the table surface, and the spacing between adjacent vacuum holes is less than the minimum size of a wafer. In this way, each wafer is initially adsorbed on the wafer table 1.
[0025] In order to provide different wafers to the wafer retrieval arm for retrieval, the wafer table 1 is arranged on a first translation mechanism 5, and the first translation mechanism 5 drives the wafer table 1 to perform XY motion in a vertical plane. In this way, through the drive of the first translation mechanism 5, the wafer table 1 delivers wafers at different positions to the retrieval position for retrieval.
[0026] In one embodiment, the first translation mechanism 5 includes: a first base 51, a first guide rail 52 for the first base 51 to slide along the X direction, a second base 53 disposed on the first base 51, and a second guide rail 54 disposed on the first base 51 for the second base 53 to slide along the Y direction, and the first translation mechanism 5 is disposed on a bracket disposed in a vertical direction. Thus, the first base 51 first moves along the first guide rail 52 to the X direction coordinate of the crystal retrieval position, and then the second base 53 moves along the second guide rail 54 to the Y direction coordinate of the crystal retrieval position, completing the wafer feeding.
[0027] The crystal retrieval device 2 is used to pick up the wafer provided by the wafer table 1 and complete the loading of the wafer. The crystal retrieval device 2 includes: a crystal retrieval arm 21 and a pivot mechanism 22. The crystal retrieval arm 21 is driven by the pivot mechanism 22 to pivot 90° in a plane perpendicular to the table surface, and a suction nozzle is provided at the end of the corresponding crystal retrieval arm 21. Thus, the crystal retrieval arm 21 is initially arranged horizontally, and after sucking the wafer through the suction nozzle, it is pivoted to a vertical state for loading. In one embodiment, the pivot mechanism 22 is a rotating motor, and one end of the crystal retrieval arm 21 is transmission-connected to the rotating motor.
[0028] The loading table 3 is used to provide a loading platform, on which the substrate to be loaded is fixed, and the wafer taking arm 21 packages the wafer on it to the corresponding position of the substrate. Specifically, the loading table 3 has a working surface for fixing the substrate, and the loading table 3 is arranged in the horizontal direction. Correspondingly, a pressure plate is also arranged on the loading table 3, and the pressure plate presses the edges of the substrate to be loaded. The pressure plate is roughly a U-shaped structure, which is driven by a servo motor to move up and down. The loading table 3 is arranged on the second translation mechanism 6, and the second translation mechanism 6 drives the loading table 3 to perform XY movement in the horizontal plane. Thereby, through the second translation mechanism 6, the loading table 3 sends different loading positions of the substrate to the bottom of the crystal taking arm 21 for loading.
[0029] In one embodiment, the second translation mechanism 6 includes: a third base 61, a third guide rail 62 for the third base 61 to slide along the X direction, a fourth base 63 disposed on the third base 61, and a fourth guide rail 64 disposed on the third base 61 for the fourth base 63 to slide along the Y direction, and the second translation mechanism 6 is disposed on a bracket disposed in a horizontal direction. Thus, the third base 61 first moves along the third guide rail 62 to the X direction coordinate of the loading position, and then the fourth base 63 moves along the fourth guide rail 64 to the Y direction coordinate of the loading position, waiting for the wafer taking arm 21 to load the wafer.
[0030] The cam mechanism 4 is respectively arranged at the crystal retrieval position and the wafer loading position, wherein the cam mechanism 4 includes a cam. In order to meet the precision requirements, the crystal retrieval position and the wafer loading position are fixed positions, and the cam is driven by a motor to drive the crystal retrieval arm 21 to retrieve the crystal and load the wafer. Correspondingly, a plane that can abut against the cam is arranged on the crystal retrieval arm 21, so that under the action of the cam, the crystal retrieval arm 21 performs crystal retrieval and wafer loading at the corresponding position.
[0031] In addition, in order to meet the requirements of wafer loading, the wafer loading device further includes a glue table 7, the glue table 7 is located upstream of the loading table 3, a conveying arm 8 is provided between the glue table 7 and the loading table 3, and a glue tank is provided on the glue table 7. Thus, the substrate that has been glued at the glue table 7 is sent to the loading table 3 through the conveying arm 8 for loading.
[0032] A visual inspection device 9 is also provided at the crystal retrieval position and the wafer loading position. In one embodiment, the visual inspection device 9 can be an industrial camera, so that according to the detection result of the visual inspection device 9, the corresponding translation mechanisms 5 and 6 can be corrected and compensated, thereby ensuring the accuracy of crystal retrieval and wafer loading.
[0033] In summary, the wafer loading equipment of the present invention sets the wafer table vertically, and one crystal retrieval arm can complete the crystal retrieval and loading actions, which overcomes the errors caused by multiple arms relaying crystal retrieval, and at the same time improves the loading efficiency, fully meeting the loading needs of modern industrial production.
[0034] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.
[0035] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.
Claims
1. A wafer loading device, characterized in that: The wafer loading equipment comprises: A wafer table having a table top for fixing a wafer, the wafer table being arranged in a vertical direction, the wafer table being arranged on a first translation mechanism, and the first translation mechanism driving the wafer table to perform XY motion in a vertical plane; A crystal retrieval device, comprising: a crystal retrieval arm and a pivot mechanism, wherein the crystal retrieval arm is driven by the pivot mechanism to pivot 90° in a plane perpendicular to the table; A film loading table having a working surface for fixing a substrate, the film loading table being arranged in a horizontal direction, the film loading table being arranged on a second translation mechanism, and the second translation mechanism driving the film loading table to perform XY motion in a horizontal plane; A cam mechanism, comprising cams, wherein the cams are respectively arranged at a wafer taking position and a wafer loading position; The first translation mechanism includes: a first base, a first guide rail for the first base to slide along the X direction, a second base arranged on the first base, and a second guide rail arranged on the first base for the second base to slide along the Y direction, and the first translation mechanism is arranged on a bracket arranged in a vertical direction; the second translation mechanism includes: a third base, a third guide rail for the third base to slide along the X direction, a fourth base arranged on the third base, and a fourth guide rail arranged on the third base for the fourth base to slide along the Y direction, and the second translation mechanism is arranged on a bracket arranged in a horizontal direction.
2. The wafer loading device according to claim 1, characterized in that: The wafer table is provided with vacuum suction holes, which are evenly arranged on the table surface, and the spacing between adjacent vacuum suction holes is less than the minimum size of a wafer.
3. The wafer loading device according to claim 1, characterized in that: The pivot mechanism is a rotating motor, and one end of the crystal taking arm is drivingly connected to the rotating motor.
4. The wafer loading device according to claim 1, characterized in that: The loading platform is also provided with a pressing plate, which presses the edges of the substrate to be loaded.
5. The wafer loading device according to claim 1, characterized in that: The crystal retrieval position and the wafer loading position are fixed positions, and the cam is driven by a motor to drive the crystal retrieval arm to retrieve crystals and load wafers.
6. The wafer loading device according to claim 1, characterized in that: The wafer loading equipment further comprises a glue sticking station, wherein the glue sticking station is located upstream of the loading station, a conveying arm is arranged between the glue sticking station and the loading station, and a glue sticking tank is arranged on the glue sticking station.
7. The wafer loading device according to claim 1, characterized in that: The crystal taking position and the wafer loading position are also provided with visual inspection devices.
Citation Information
Patent Citations
Chip taking and placing device for semiconductor chip mounting
CN209266381U
Wafer mounting equipment
CN210443534U