Unit board and manufacturing method thereof

Abstract

The present invention relates to a unit board and a method for making the same. The method for making the unit board comprises: solid-crystal bonding a plurality of pixel units on a circuit board, and arranging the plurality of pixel units at intervals; spraying black ink in the gap between any pixel unit and the pixel units around it to form a prefabricated unit board; and encapsulating the pixel units on the prefabricated unit board and the area where the black ink is located. The unit board applies the above method for making the unit board. In the above-mentioned unit board and method for making the same, after solid-crystal bonding a plurality of pixel units on a circuit board, a gap is formed between any pixel unit and the pixel units around it, and by spraying black ink in the gap, the contrast of the unit board can be effectively improved. At the same time, after ink is sprayed in the gap formed between the pixel unit and the pixel units around it, the pixel unit and the area where the black ink is located are encapsulated, so that the pixel unit and the area where the black ink is located can be protected.

Description

Technical Field

[0001] The present invention relates to the technical field of display screens, and in particular to a unit board and a manufacturing method thereof. Background Art

[0002] Large-size micro-pitch display screens are all made of unit boards. The color reproduction of the unit boards plays a decisive role in the display effect of the display screen. However, the current unit boards generally have the problem of low contrast and low color reproduction, which affects the display effect. Summary of the invention

[0003] Based on this, it is necessary to provide a method for manufacturing a unit panel and a unit panel, so as to improve the contrast of the unit panel.

[0004] The technical solution is as follows:

[0005] A method for manufacturing a unit board, comprising:

[0006] Die-bonding a plurality of pixel units on a circuit board, and arranging the plurality of pixel units at intervals;

[0007] Spraying black ink in the gap between any one of the pixel units and the pixel units around it to form a prefabricated unit plate;

[0008] The pixel units on the prefabricated unit board and the area where the black ink is located are packaged.

[0009] In the manufacturing method of the unit board, after the plurality of pixel units are die-bonded on the circuit board, a gap is formed between any pixel unit and the pixel units around it, and by spraying black ink in the gap, the contrast of the unit board can be effectively improved. At the same time, after the ink is sprayed in the gap formed between the pixel unit and the pixel units around it, the pixel unit and the area where the black ink is located are packaged, so that the pixel unit and the area where the black ink is located can be protected.

[0010] The technical solution is further described below:

[0011] In one embodiment, a plurality of the pixel units are arranged in an array to form an array structure, wherein the array structure includes a row pixel region formed by the pixel units in the same row, and a column pixel region formed by the pixel units in the same column, a first gap is formed between two adjacent row pixel regions, and a second gap is formed between two adjacent column pixel regions;

[0012] The step of spraying black ink in the gap between any one of the pixel units and the surrounding pixel units to form a prefabricated unit board includes:

[0013] Spraying black ink on all the first gaps in sequence along a column direction of the array structure;

[0014] Black ink is sprayed sequentially on all the second gaps along the row direction of the array structure.

[0015] In one embodiment, a plurality of the pixel units are arranged in an array to form an array structure, wherein the array structure includes a row pixel region formed by the pixel units in the same row, and a column pixel region formed by the pixel units in the same column, a first gap is formed between two adjacent row pixel regions, and a second gap is formed between two adjacent column pixel regions;

[0016] The step of spraying black ink in the gap between any one of the pixel units and the surrounding pixel units to form a prefabricated unit board includes:

[0017] Spraying black ink on all the second gaps in sequence along a row direction of the array structure;

[0018] Black ink is sprayed sequentially on all the first gaps along the column direction of the array structure.

[0019] In one embodiment, the step of encapsulating the pixel unit and the area where the black ink is located on the prefabricated unit board includes:

[0020] Placing the prefabricated unit board into the mold core, and making the side of the prefabricated unit board where the pixel unit is located face the mold pressing surface of the mold core in a spaced relationship;

[0021] Applying pressure to the prefabricated unit plate through an upper mold so that the prefabricated unit plate is pressed onto the mold core;

[0022] The packaging glue is injected between the surface of the prefabricated unit board where the pixel unit is located and the molding surface, so that the packaging glue is encapsulated on the area where the pixel unit and the black ink are located.

[0023] In one embodiment, the molding surface is a plane.

[0024] In one embodiment, the molded surface is provided with a plurality of protrusions, the plurality of protrusions are arranged at intervals on the molded surface, a groove is formed between two adjacent protrusions, and the pixel unit includes a light-emitting chip, and the light-emitting chip is used to extend into the groove.

[0025] In one embodiment, the encapsulant contains melanin.

[0026] In one embodiment, the melanin accounts for 1‰ to 25‰ of the total weight of the packaging glue.

[0027] In one of the embodiments, the pixel unit includes a light emitting chip, and the light emitting chip is a flip-chip LED light emitting chip.

[0028] The present technical solution also provides a unit board, including a circuit board; a plurality of pixel units, wherein the plurality of pixel units are die-bonded on the circuit board and the plurality of pixel units are arranged at intervals; black ink, wherein the black ink is arranged on the circuit board and is located in the gap between any one of the pixel units and the pixel units around it; and packaging glue, wherein the packaging glue covers the pixel units and the black ink.

[0029] In the above-mentioned unit board, after the plurality of pixel units are die-bonded on the circuit board, a gap is formed between any pixel unit and the pixel units around it, and by spraying black ink in the gap, the contrast of the unit board can be effectively improved. At the same time, after the ink is sprayed in the gap formed between the pixel unit and the pixel units around it, the pixel unit and the area where the black ink is located are packaged, so that the pixel unit and the area where the black ink is located can be protected.

[0030] In one embodiment, a side of the packaging glue away from the pixel unit or the black ink is a plane.

[0031] In one embodiment, the packaging glue includes a first packaging part and a second packaging part, the pixel unit includes a light-emitting chip, the first packaging part covers the light-emitting chip, the second packaging part covers the black ink, and the side of the first packaging part away from the pixel unit is farther away from the circuit board than the side of the second packaging part away from the black ink.

[0032] In one embodiment, the encapsulant contains melanin. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 The principle of the method for manufacturing a unit board in one embodiment of the present invention is as follows Figure 1 ;

[0034] Figure 2 The principle of the method for manufacturing a unit board in one embodiment of the present invention is as follows Figure 2 ;

[0035] Figure 3 The principle of the method for manufacturing a unit board in one embodiment of the present invention is as follows Figure 3 ;

[0036] Figure 4 The principle of the method for manufacturing a unit board in one embodiment of the present invention is as follows Figure 4 ;

[0037] Figure 5 A schematic diagram of the local structure of a unit board in an embodiment of the present invention Figure 1 ;

[0038] Figure 6 is a schematic structural diagram of a prefabricated unit panel in one embodiment of the present invention;

[0039] Figure 7 The schematic diagram of the encapsulation glue process of the unit board in one embodiment of the present invention;

[0040] Figure 8 Schematic diagram of the top view of the mold core in one embodiment of the present invention;

[0041] Fig. 9 A schematic diagram of the local structure of a unit board in an embodiment of the present invention Figure 2 .

[0042] Description of reference numerals:

[0043] 1. unit board, 2. lower mold, 3. mold core, 31. molding surface, 32. protrusion, 4. upper mold, 10. prefabricated unit board, 100. circuit board, 200. pixel unit, 210. light-emitting chip, 300. packaging glue, 310. first packaging part, 320. second packaging part, 400. black ink. DETAILED DESCRIPTION

[0044] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific implementation methods described herein are only used to explain the present invention and do not limit the scope of protection of the present invention.

[0045] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0047] The “first” and “second” mentioned in the present invention do not represent specific quantities and orders, but are merely used to distinguish names.

[0048] like Figure 1 , Figure 5 , Figure 6 , Figure 7 As shown, an embodiment of the present invention relates to a method for manufacturing a unit board 1, comprising:

[0049] S100 , a plurality of pixel units 200 are die-bonded on the circuit board 100 , and the plurality of pixel units 200 are arranged at intervals.

[0050] like Figure 5 , Figure 6 As shown, specifically, each pixel unit 200 includes three LED (Light Emitting Diode) light emitting chips 210 with different luminous colors, and the light emitting chip can be a red light emitting chip, an LED green light emitting chip, or an LED blue light emitting chip. Fixing a plurality of pixel units 200 to the circuit board 100 refers to transferring the three light emitting chips 210 with different luminous colors constituting each pixel unit 200 to the circuit board 100 through a die bonding machine.

[0051] In one embodiment, the LED red light emitting chip, the LED green light emitting chip and / or the LED blue light emitting chip are flip-chip LED light emitting chips. The flip-chip LED light emitting chip can save the wire bonding process and reduce the pad area on the circuit board 100.

[0052] like Figure 1 , Figure 6 As shown, S200 , black ink 400 is sprayed in the gap between any pixel unit 200 and its surrounding pixel units 200 to form a prefabricated unit plate 10 .

[0053] Specifically, after all the pixel units 200 are die-bonded on the circuit board 100, all the pixel units 200 are spaced apart on the circuit board 100. Thus, a gap is formed between any pixel unit 200 and the pixel units 200 around it. By spraying black ink 400 on the gap, the contrast of the unit board 1 can be greatly improved.

[0054] like Figure 6 As shown, further, a plurality of pixel units 200 are arranged in an array to form an array structure, in which a row pixel region formed by pixel units 200 in the same row and a column pixel region formed by pixel units 200 in the same column are included, a first gap is formed between two adjacent row pixel regions, and a second gap is formed between two adjacent column pixel regions;

[0055] like Figure 2, Figure 6 As shown, in one embodiment, the step of spraying black ink 400 in the gap between any pixel unit 200 and its surrounding pixel units 200 to form the prefabricated unit board 10 includes:

[0056] S210, spraying black ink 400 on all first gaps in sequence along the column direction of the array structure;

[0057] S211 , spraying black ink 400 on all the second gaps in sequence along the row direction of the array structure.

[0058] In the above-mentioned step of spraying black ink 400 in the gaps between any pixel unit 200 and the surrounding pixel units 200 to form a prefabricated unit board 10, first, the black ink 400 is sprayed on all the first gaps in sequence along the column direction of the array structure by an inkjet gun, and then the black ink 400 is sprayed on all the second gaps in sequence along the row direction of the array structure by an inkjet gun, which can greatly improve the inkjet efficiency.

[0059] In another embodiment, the step of spraying black ink 400 in the gap between any pixel unit 200 and surrounding pixel units 200 to form the prefabricated unit board 10 includes:

[0060] S220, spraying black ink 400 on all the second gaps in sequence along the row direction of the array structure;

[0061] S221 , spraying black ink 400 on all first gaps in sequence along the column direction of the array structure.

[0062] In the above-mentioned step of spraying black ink 400 in the gaps between any pixel unit 200 and the surrounding pixel units 200 to form a prefabricated unit board 10, first, the black ink 400 is sprayed on all the second gaps in sequence along the row direction of the array structure by an inkjet gun, and then the black ink 400 is sprayed on all the first gaps in sequence along the column direction of the array structure by an inkjet gun, which can also greatly improve the inkjet efficiency.

[0063] like Figure 1 , Figure 7 As shown, S300, the pixel unit 200 on the prefabricated unit board 10 and the area where the black ink is located are packaged.

[0064] Specifically, after spraying black ink 400 on the gap between any pixel unit 200 and the surrounding pixel units 200, a packaging process can be used to package the pixel unit 200 and the area where the black ink is located on the prefabricated unit board 10 to protect the pixel unit 200 and the area where the black ink is located.

[0065] like Figure 4 , Figure 7 , Figure 8 As shown, further, in the step of encapsulating the pixel unit 200 on the prefabricated unit board 10 and the area where the black ink is located, the following steps are included:

[0066] S310 , placing the prefabricated unit board 10 into the mold core 3 , and making the surface of the prefabricated unit board 10 where the pixel unit 200 is located face to face with the molding surface 31 of the mold core 3 .

[0067] Specifically, the core mold 3 is first fixed on the lower mold 2 so that the molding surface 31 of the core mold 3 faces upward, and then the prefabricated unit board 10 is placed in the core mold 3 so that the side where the pixel unit 200 is located is spaced apart from the molding surface 31 of the core mold 3, so that the area where the pixel unit 200 and the black ink 400 of the prefabricated unit board 10 are located are spaced apart from the molding surface 31 of the core mold 3.

[0068] S320 , applying pressure to the prefabricated unit panel 10 through the upper mold 4 , so that the prefabricated unit panel 10 is pressed onto the mold core 3 .

[0069] Specifically, the upper mold 4 moves toward the prefabricated unit board 10 under the action of the hydraulic press, so that the upper mold 4 and the lower mold 2 are clamped and the prefabricated unit board 10 is pressed onto the mold core 3 .

[0070] S330 , injecting the packaging glue 300 between the surface of the prefabricated unit board 10 where the pixel unit 200 is located and the molding surface 31 , so that the packaging glue 300 is packaged in the area where the pixel unit 200 and the black ink 400 are located.

[0071] Specifically, after the prefabricated unit board 10 is pressurized by the upper mold 4, the encapsulation glue 300 in the mold core 3 can be injected between the side of the prefabricated unit board 10 where the pixel unit 200 is located and the molding surface 31, so that the encapsulation glue 300 is encapsulated on the pixel unit 200 and the inkjet area.

[0072] In one embodiment, the molding surface 31 of the mold core 3 is a plane.

[0073] like Figure 8 As shown, in another embodiment, the molded surface 31 is provided with a plurality of protrusions 32, and the plurality of protrusions 32 are arranged at intervals on the molded surface, and a groove is formed between two adjacent protrusions 32, and the pixel unit 200 includes a light-emitting chip 210, and the light-emitting chip 210 is used to extend into the groove.

[0074] like Fig. 9As shown, specifically, when the upper mold 4 and the lower mold 2 are molded together, the light emitting chip 210 extends into the groove and is spaced opposite to the bottom wall of the groove. In this way, when the encapsulation glue 300 is injected between the side where the pixel unit 200 is located on the prefabricated unit board 10 and the molding surface 31, the encapsulation glue 300 encapsulated on the light emitting chip 210 will present the same shape as the groove. In this way, the light emission angle of the light emitting chip 210 can be improved.

[0075] In one embodiment, the encapsulant 300 contains melanin.

[0076] Specifically, the packaging glue 300 is epoxy resin, and a certain proportion of melanin is doped into the packaging glue 300, which is beneficial to further improve the contrast of the unit panel 1.

[0077] More specifically, the melanin accounts for 1‰ to 25‰ of the total weight of the encapsulant 300 .

[0078] In the manufacturing method of the unit board 1, after the plurality of pixel units 200 are die-bonded on the circuit board 100, a gap is formed between any pixel unit 200 and the surrounding pixel units 200, and the contrast of the unit board 1 can be effectively improved by spraying the black ink 400 in the gap. At the same time, after the ink is sprayed in the gap formed between the pixel unit 200 and the surrounding pixel units 200, the pixel unit 200 and the area where the black ink 400 is located can be protected by encapsulating the area where the pixel unit 200 and the black ink 400 are located.

[0079] like Figure 5 , Figure 6 As shown, an embodiment further relates to a unit board 1, comprising: a circuit board 100; a plurality of pixel units 200, wherein the plurality of pixel units 200 are all die-bonded on the circuit board 100, and the plurality of pixel units 200 are arranged at intervals; black ink 400, wherein the black ink 400 is arranged on the circuit board 100 and is located in the gap between any pixel unit 200 and the pixel units 200 around it; and a packaging glue 300, wherein the packaging glue 300 covers the pixel units 200 and the black ink 400.

[0080] Specifically, each pixel unit 200 includes three LED (Light Emitting Diode) light emitting chips 210 with different luminous colors, and the light emitting chip can be a red light emitting chip, an LED green light emitting chip, or an LED blue light emitting chip. Fixing the plurality of pixel units 200 to the circuit board 100 refers to transferring the three light emitting chips 210 with different luminous colors constituting each pixel unit 200 to the circuit board 100 through a die bonding machine.

[0081] In one embodiment, the LED red light emitting chip, the LED green light emitting chip and / or the LED blue light emitting chip are flip-chip LED light emitting chips. The flip-chip LED light emitting chip can save the wire bonding process and reduce the pad area on the circuit board 100.

[0082] In the above-mentioned unit board 1, after a plurality of pixel units 200 are die-bonded on the circuit board 100, a gap is formed between any pixel unit 200 and the surrounding pixel units 200, and by spraying the black ink 400 in the gap, the contrast of the unit board 1 can be effectively improved. At the same time, after the ink is sprayed in the gap formed between the pixel unit 200 and the surrounding pixel units 200, the pixel unit 200 and the area where the black ink 400 is located can be protected by encapsulating the area where the pixel unit 200 and the black ink 400 are located.

[0083] like Figure 5 As shown, in one embodiment, the side of the encapsulant 300 away from the pixel unit 200 or the black ink 400 is a plane.

[0084] like Fig. 9 As shown, in another embodiment, the packaging glue 300 includes a first packaging part 310 and a second packaging part 320, the pixel unit 200 includes a light-emitting chip 210, the first packaging part 310 covers the light-emitting chip 210, and the second packaging part 320 covers the black ink 400, and the side of the first packaging part 310 away from the light-emitting chip 210 is farther away from the circuit board 100 than the side of the second packaging part 320 away from the black ink 400.

[0085] Specifically, the first encapsulation part 310 and the second encapsulation part 320 adjacent thereto cooperate to form a step structure, so that the light emission angle of the light emitting chip 210 can be increased.

[0086] In one embodiment, the encapsulant contains melanin.

[0087] Specifically, the packaging glue 300 is epoxy resin, and a certain proportion of melanin is doped into the packaging glue 300, which is beneficial to further improve the contrast of the unit panel 1.

[0088] More specifically, the melanin accounts for 1‰ to 25‰ of the total weight of the encapsulant 300 .

[0089] like Figure 6As shown, in one embodiment, a plurality of pixel units 200 are arranged in an array to form an array structure. In the array structure, a row pixel region is formed by pixel units 200 in the same row, and a column pixel region is formed by pixel units 200 in the same column. A first gap is formed between two adjacent row pixel regions, and a second gap is formed between two adjacent column pixel regions; each first gap and each second gap is provided with black ink.

[0090] In this way, when spraying black ink 400 in the gaps between any pixel unit 200 and the pixel units 200 around it, the black ink 400 can be sprayed on all the first gaps in sequence along the column direction of the array structure through an inkjet gun, and then the black ink 400 can be sprayed on all the second gaps in sequence along the row direction of the array structure through an inkjet gun, which can greatly improve the inkjet efficiency.

[0091] An embodiment also relates to a display screen, comprising the unit panel as described above.

[0092] In the above display screen, after multiple pixel units 200 are die-bonded on the circuit board 100, a gap is formed between any pixel unit 200 and the surrounding pixel units 200, and the contrast of the unit board 1 can be effectively improved by spraying black ink 400 in the gap. At the same time, after the gap formed between the pixel unit 200 and the surrounding pixel units 200 is sprayed with ink, the pixel unit 200 and the area where the black ink 400 is located are packaged, so that the pixel unit 200 and the area where the black ink 400 is located can be protected.

[0093] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0094] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for manufacturing a unit board, characterized in that: include: Die-bonding a plurality of pixel units on a circuit board, and arranging the plurality of pixel units at intervals; Spraying black ink in the gap between any one of the pixel units and the pixel units around it to form a prefabricated unit plate; The pixel unit on the prefabricated unit board and the area where the black ink is located are packaged, including: placing the prefabricated unit board into a mold core, and making the side of the prefabricated unit board where the pixel unit is located face the molded surface of the mold core at intervals; pressing the prefabricated unit board onto the mold core; wherein a plurality of protrusions are arranged at intervals on the molded surface, and a groove is formed between two adjacent protrusions, and the light-emitting chip of the pixel unit is used to extend into the groove.

2. The method for manufacturing a unit board according to claim 1, characterized in that: The plurality of pixel units are arranged in an array to form an array structure, wherein the array structure includes a row pixel region formed by the pixel units in the same row, and a column pixel region formed by the pixel units in the same column, a first gap is formed between two adjacent row pixel regions, and a second gap is formed between two adjacent column pixel regions; The step of spraying black ink in the gap between any one of the pixel units and the surrounding pixel units to form a prefabricated unit board includes: Spraying black ink on all the first gaps in sequence along a column direction of the array structure; Spraying black ink on all the second gaps in sequence along a row direction of the array structure; Or the step of spraying black ink in the gap between any one of the pixel units and the surrounding pixel units to form a prefabricated unit board includes: Spraying black ink on all the second gaps in sequence along a row direction of the array structure; Black ink is sprayed sequentially on all the first gaps along the column direction of the array structure.

3. The method for manufacturing a unit board according to claim 1, characterized in that: The step of encapsulating the pixel unit on the prefabricated unit board and the area where the black ink is located also includes: Applying pressure to the prefabricated unit plate through an upper mold so that the prefabricated unit plate is pressed onto the mold core; The packaging glue is injected between the surface of the prefabricated unit board where the pixel unit is located and the molding surface, so that the packaging glue is encapsulated on the area where the pixel unit and the black ink are located.

4. The method for manufacturing a unit board according to claim 3, characterized in that: The molding surface is a plane.

5. The method for manufacturing a unit board according to claim 4, characterized in that: The packaging glue contains melanin.

6. The method for manufacturing a unit board according to claim 5, characterized in that: The melanin accounts for 1‰ to 25‰ of the total weight of the packaging glue.

7. A unit board, characterized in that: include: Circuit boards; A plurality of pixel units, wherein the plurality of pixel units are all die-bonded on the circuit board and are arranged at intervals; The plurality of pixel units are arranged in an array to form an array structure, wherein the array structure includes a row pixel region formed by pixel units in the same row and a column pixel region formed by pixel units in the same column, a first gap is formed between two adjacent row pixel regions, and a second gap is formed between two adjacent column pixel regions; Black ink, the black ink is disposed on the circuit board and is located in a gap between any one of the pixel units and the pixel units around it; wherein each of the first gaps and each of the second gaps is provided with the black ink; and Packaging glue, the packaging glue covers the pixel unit and the black ink.

8. The unit board according to claim 7, characterized in that: The side of the packaging glue away from the pixel unit or the black ink is a plane.

9. The unit board according to claim 7, characterized in that: The packaging glue includes a first packaging part and a second packaging part, the pixel unit includes a light-emitting chip, the first packaging part covers the light-emitting chip, the second packaging part covers the black ink, and the side of the first packaging part away from the light-emitting chip is farther away from the circuit board than the side of the second packaging part away from the black ink.

10. The unit board according to claim 7, characterized in that: The packaging glue contains melanin.

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