A PCB board gold finger gluing device and a gluing method

Abstract

The present invention discloses a PCB board gold finger gluing device and a gluing method. The gluing device includes a workbench, a clamping device, a glue feeding device, a negative pressure structure and a glue cutting device. The workbench is provided with a linearly extending slot; the clamping device is arranged at the slot, and the clamping device is used for clamping the PCB board, and the clamping device has two relatively movable clamping surfaces; the glue feeding device includes a material roll, a glue clamping component and a first driving device. The glue clamping component is used for clamping the tape on the material roll, and the first driving device is used for driving the glue clamping component to move along the slot; the negative pressure structure is arranged below the workbench, and the negative pressure structure is used for forming a negative pressure downward to the workbench in the area where the clamping device is located; the glue cutting device is arranged beside the material roll and is used for cutting the tape pulled out by the glue clamping component. It realizes full-automatic gluing, has simple operation, and is basically applicable to the gluing of various different models of PCB boards.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit boards, and particularly relates to a gold finger gluing device and a gluing method for a PCB board. Background Art

[0002] In the production and manufacturing process of a PCB board (Printed Circuit Board), after the PCB board undergoes electrical testing, the PCB board with gold fingers must be pasted with a high-temperature tape during the processing to protect the gold fingers from being oxidized or scratched and damaged.

[0003] Currently, when pasting a high-temperature tape on the gold finger part of a PCB board, generally, the tape is pasted manually or by a tape pasting machine. Manual tape pasting is slow, prone to deviation and wrinkling, has low pasting efficiency and inaccurate pasting precision. At the same time, manual pasting is likely to leave fingerprints and sweat stains on the board surface, causing the PCB board to be oxidized, thus affecting the yield of the PCB board. At the same time, it is also very likely to cause scratches on the board surface and other consequences. Although using a tape pasting machine can avoid the problems of manual tape pasting, different models of PCB boards require different tape pasting machines for pasting, resulting in high pasting costs and being not suitable for batch pasting. Summary of the Invention

[0004] Aiming at the defects existing in the prior art, the purpose of the present invention is to provide a gold finger gluing device and a gluing method for a PCB board, which can achieve full-automatic gluing, have simple operation, and are basically applicable to the gluing of various different models of PCB boards.

[0005] To achieve the above object, the technical solution adopted by the present invention is:

[0006] A gold finger gluing device for a PCB board, comprising:

[0007] A workbench, which is provided with a slot extending linearly;

[0008] A clamping device arranged at the slot, the clamping device is used for clamping the PCB board, and the clamping device has two clamping surfaces that can move relative to each other;

[0009] A tape feeding device, which includes a material roll, a tape clamping assembly and a first driving device, the tape clamping assembly is used for clamping the tape on the material roll, and the first driving device is used for driving the tape clamping assembly to move along the slot;

[0010] A negative pressure structure, which is arranged below the workbench, and the negative pressure structure is used for forming a negative pressure towards the lower part of the workbench in the area where the clamping device is located;

[0011] A tape cutting device, which is arranged beside the material roll and is used for cutting the tape pulled out by the tape clamping assembly.

[0012] Based on the above technical solution, the clamping device includes:

[0013] Two oppositely arranged clamping plates, and two of the clamping surfaces are respectively arranged on the opposite wall surfaces of the two clamping plates;

[0014] A second driving device, which is connected to at least one of the clamping plates and is used to drive the clamping plate connected to it to approach and move away from the other clamping plate.

[0015] Based on the above technical solution, the negative pressure structure includes:

[0016] A plurality of air inlets, which are opened at the top of the clamping plate and are arranged at intervals along the length direction of the clamping plate;

[0017] An air outlet, which is arranged at the bottom or side of the clamping plate and is communicated with the air inlets;

[0018] A negative pressure mechanism, which is communicated with the air outlet.

[0019] Based on the above technical solution, the glue sandwiching assembly includes two glue sandwiching heads arranged up and down, and the two glue sandwiching heads can move open and close relative to each other to loosen and clamp the tape.

[0020] Based on the above technical solution, the lower surface of the upper one of the two glue sandwiching heads is serrated.

[0021] Based on the above technical solution, the lower one of the two glue sandwiching heads is used to suck and cover the tape through negative pressure.

[0022] Based on the above technical solution, a U-shaped card slot for clamping the PCB board is opened on the glue sandwiching head.

[0023] Based on the above technical solution, the first driving device includes:

[0024] Two driving wheels arranged at intervals;

[0025] A belt, which is connected between the two driving wheels and is connected to the glue sandwiching assembly.

[0026] Based on the above technical solution, the device further includes a clamping device, which is located between the material roll and the glue cutting device and is used to clamp the tape when the glue cutting device cuts the glue.

[0027] The present invention also provides a method for pasting glue on the gold fingers of a PCB board, which uses the above-mentioned PCB board gold finger glue pasting device to paste glue on the gold fingers of the PCB board.

[0028] Compared with the prior art, the advantages of the present invention are as follows:

[0029] In the PCB board gold finger gluing device of the present invention, the first driving device drives the glue clamping assembly to move along the slot. The tape is adsorbed on the clamping device under the action of the negative pressure generated by the negative pressure structure, and the length of the tape is determined according to the length of the PCB board to be pasted, so as to control the moving distance of the material roll, thereby meeting the gluing lengths of PCBs of different models and sizes. The distance between the two clamping surfaces can also be adjusted according to the thickness of the PCB board to clamp the PCB board, so as to paste the tape on the two opposite wall surfaces of the PCB gold finger. The PCB board gold finger gluing device of the present invention performs automatic gluing, and is basically applicable to PCBs of various models and sizes, without the phenomena of deviation and wrinkling during gluing, and has high gluing accuracy and high gluing efficiency. Brief Description of the Drawings

[0030] Figure 1 is a schematic structural diagram of the PCB board gold finger gluing device in the embodiment of the present invention;

[0031] Figure 2 is a front view of the internal structure of the PCB board gold finger gluing device in the embodiment of the present invention;

[0032] Figure 3 is a rear view of the internal structure of the PCB board gold finger gluing device in the embodiment of the present invention;

[0033] Figure 4 is an exploded view of the PCB board gold finger gluing device in the embodiment of the present invention;

[0034] Figure 5 is Figure 4 an enlarged view of part A in

[0035] Figure 6 is a schematic structural diagram of the glue clamping assembly in Embodiment 2 of the present invention.

[0036] In the figure: 1 - workbench, 10 - slot, 2 - clamping device, 21 - clamping plate, 22 - second driving device, 3 - glue feeding device, 30 - material roll, 31 - glue clamping assembly, 310 - glue clamping head, 311 - U-shaped card slot, 32 - first driving device, 320 - driving wheel, 321 - belt, 4 - negative pressure structure, 40 - air inlet, 5 - glue cutting device, 6 - tape, 7 - clamping device. Detailed Description of the Embodiment

[0037] The present invention will be further described in detail below with reference to the drawings and embodiments.

[0038] Embodiment 1:

[0039] Refer to Figure 1As shown in the figure, Embodiment 1 of the present invention provides a PCB board gold finger gluing device, which includes a workbench 1, a clamping device 2, a glue feeding device 3, a negative pressure structure 4 and a glue cutting device 5. There is a linearly extending slot 10 on the workbench 1. The clamping device 2 is arranged at the slot 10. The height of the clamping device 2 is not higher than that of the workbench 1. The clamping device 2 has two relatively movable clamping surfaces. The two clamping surfaces move away from each other to form a clamping space for clamping the PCB board, and the distance between the two clamping surfaces can be adjusted according to the thickness of different PCB boards to clamp PCB boards of different thicknesses; The glue feeding device 3 includes a material roll 30 for winding the tape 6, a glue clamping component 31 and a first driving device 32. The glue clamping component 31 is used to clamp the tape 6 on the material roll 30 to draw the tape 6 to cover the clamping space of the clamping device 2 or the slot 10 on the workbench 1. The first driving device 32 is used to drive the glue clamping component 31 to move along the slot 10; The negative pressure structure 4 is arranged below the workbench 1, and the negative pressure structure 4 is used to form a negative pressure downward to the workbench 1 in the area where the clamping device 2 is located. When the glue clamping component 31 clamps the tape 6 and moves along the slot 10, the tape 6 is adsorbed on the slot 10 or the clamping device 2 under the action of the negative pressure to prevent the deviation or wrinkling of the tape 6 in the running direction; The glue cutting device 5 is arranged beside the material roll 30 and is used to cut the tape 6 pulled out by the glue clamping component 31. According to the length of the PCB gold finger that needs to be glued with different lengths, the running distance of the glue clamping component 31 along the slot 10 is set to control the length of the pulled-out tape 6, avoid the waste of the tape 6 and realize the comprehensive protection of the PCB board gold finger.

[0040] The working principle of the PCB board gold finger gluing device in Embodiment 1 of the present invention is as follows: The first driving device 32 drives the glue clamping component 31 to move in the direction close to the material roll 30, so that the glue clamping component 31 passes through the glue cutting device 5 to pull out and clamp the tape 6 sent by the material roll 30; Then the first driving device 32 drives the glue clamping component 31 to move in the direction away from the material roll 30. The tape 6 is adsorbed on the clamping device 2 under the action of the negative pressure generated by the negative pressure structure 4, and the length of the tape 6 is determined according to the length of the PCB board to be pasted, so as to control the movement distance of the material roll 30, so as to meet the gluing length of PCB boards of different lengths; Then insert the gold finger of the PCB board into the clamping space formed by the two clamping surfaces. The tape 6 is also inserted into the clamping space together with the PCB board. Finally, the two clamping surfaces move closer to clamp the PCB board, and the distance between the two clamping surfaces can be adjusted according to different thicknesses of the PCB, so as to paste the tape 6 on the two opposite wall surfaces of the gold fingers of PCB boards of different thicknesses. The PCB board gold finger gluing device of the embodiment of the present invention glues automatically, and is basically applicable to PCB boards of various models and sizes, without the phenomena of pasting deviation and wrinkling, and has high gluing accuracy and high gluing efficiency.

[0041] See Figure 2As shown, the clamping device 2 includes two oppositely arranged clamping plates 21 and a second driving device 22. Two clamping surfaces are respectively arranged on the opposite wall surfaces of the two clamping plates 21. The second driving device 22 is connected to at least one clamping plate 21 and is used to drive the clamping plate 21 connected thereto to approach and move away from the other clamping plate 21. In Embodiment 1 of the present invention, the second driving device 22 is connected to one clamping plate 21 and drives this clamping plate 21 to approach and move away from the other clamping plate 21. There is a track provided on the workbench 1, and this clamping plate 21 moves along the track under the drive of the second driving device 22.

[0042] See Figure 2 and Figure 3 As shown, the clamping plate 21 in Embodiment 1 of the present invention is a hollow plate. The negative pressure structure 4 includes a plurality of air inlets 40 opened at the top of the clamping plate 21. The plurality of air inlets 40 are arranged along the length direction of the clamping plate 21. It further includes an air outlet provided at the bottom or side of the clamping plate 21. The air outlet is connected to the air inlet 40, and a negative pressure mechanism. The negative pressure mechanism can be an air pump, and the negative pressure mechanism is connected to the air outlet for leading out. The air inside the clamping plate 21 is extracted by the air pump to form a negative pressure, so that the tape 6 passing through the clamping plate 21 is adsorbed on the clamping plate 21 under the action of the negative pressure, ensuring that the running route of the tape 6 is a straight line and will not deviate.

[0043] See Figure 4 and Figure 5 As shown, the glue clamping assembly 31 includes two glue clamping heads 310 arranged up and down. The two glue clamping heads 310 can move open and close relative to each other to loosen and clamp the tape 6. The glue clamping head 310 in Embodiment 1 of the present invention includes a first section arranged along the length direction of the clamping plate 21 and a second section arranged perpendicular to the first section. The second section is the clamping end for clamping the tape 6.

[0044] Preferably, the lower surface of the upper one of the two glue clamping heads 310 is serrated. The upper surface of the tape 6 is the adhesive surface and the lower surface is the non - adhesive surface. Therefore, the adhesive surface of the tape 6 is bonded to the lower surface of the upper glue clamping head 310. The serrated lower surface of this glue clamping head 310 can reduce its adhesiveness to the adhesive surface of the tape 6. Moreover, the lower one of the two glue clamping heads 310 is used to suck and hold the tape 6 by negative pressure. A channel is opened on this glue clamping head 310. The channel extends towards the upper surface of the glue clamping head 310 to form an air inlet and extends towards the lower surface of the glue clamping head 310 to form an air outlet. The air outlet is connected to an air extraction device. The air extraction device extracts air from the channel to adsorb the tape 6 on the lower glue clamping head 310 and fix and clamp the glue clamping head 310.

[0045] See Figure 3 and Figure 4As shown in the figure, the first driving device 32 includes two driving wheels 320 arranged at intervals, a belt 321 and a track. The belt 321 is connected between the two driving wheels 320 and is connected to the rubber clamping assembly 31. The track is arranged in parallel with the belt 321. The bottom of the rubber clamping assembly 31 slides on the track and slides along the track driven by the belt 321, so as to move closer to and away from the coil 30.

[0046] See Figure 4 As shown in the figure, the device further includes a clamping device 7. The clamping device 7 is located between the coil 30 and the glue cutting device 5 and is used to clamp the tape 6 when the glue cutting device 5 cuts the glue. The clamping device 7 includes two clamping plates that can move open and close relative to each other to loosen and clamp the tape 6.

[0047] Embodiment 2:

[0048] See Figure 6 As shown in the figure, the basic content of Embodiment 2 of the present invention is the same as that of Embodiment 1. The difference lies in the rubber clamping assembly 31. The rubber clamping assembly 31 of Embodiment 2 of the present invention includes two rubber clamping heads 310 arranged up and down. The rubber clamping heads 310 are arranged along the length direction of the clamping plate 21, and a U-shaped card slot 311 for clamping the PCB board is opened on the rubber clamping head 310. The length of the tape 6 clamped by the rubber clamping head 310 is exactly equal to the depth of the slot opening of the U-shaped card slot 311, and the clamping space formed between the U-shaped card slot 311 and the two clamping plates 21 is communicated. When pasting the glue, the PCB board is inserted into the clamping space from the U-shaped card slot 311. In this way, the tape 6 clamped by the rubber clamping head 310 is just pasted at the edge of the PCB board, which will not cause waste of the tape 6, and can more accurately control the length of the tape 6 according to the length of the PCB board, so that the length of the tape 6 pulled out by the rubber clamping assembly 31 is exactly matched with the PCB board that needs to be pasted with glue.

[0049] Embodiment 3:

[0050] Embodiment 3 of the present invention provides a method for pasting gold fingers of a PCB board, which uses the above-mentioned PCB board gold finger pasting device to paste the gold fingers of the PCB board. The specific steps are as follows:

[0051] First, the first driving device 32 drives the glue sandwiching assembly 31 to move towards the direction close to the material roll 30, so that the glue sandwiching assembly 31 passes through the glue cutting device 5 to pull out and clamp the tape 6 sent by the material roll 30; then the first driving device 32 drives the glue sandwiching assembly 31 to move away from the material roll 30, and the tape 6 is adsorbed on the clamping device 2 under the action of the negative pressure generated by the negative pressure structure 4, and the length of the tape 6 is determined according to the length of the PCB board to be pasted, so as to control the moving distance of the material roll 30, so as to meet the pasting length of PCB boards of different lengths; then the gold fingers of the PCB board are inserted into the clamping space formed by the two clamping surfaces, and the tape 6 is also inserted into the clamping space together with the PCB board. Finally, the two clamping surfaces move closer to clamp the PCB board, and the distance between the two clamping surfaces can be adjusted according to the different thicknesses of the PCB board, so as to paste the tape 6 on the two opposite wall surfaces of the gold fingers of PCB boards with different thicknesses. The PCB board gold finger pasting device of the embodiment of the present invention pastes glue automatically, and is basically applicable to PCB boards of various models and sizes, without the phenomena of pasting deviation and wrinkle generation, and has high pasting accuracy and high pasting efficiency.

[0052] The present invention is not limited to the above embodiments. For those of ordinary skill in the art of this technology, without departing from the principle of the present invention, several improvements and retouches can also be made, and these improvements and retouches are also regarded as within the protection scope of the present invention. The content not described in detail in this specification belongs to the prior art well-known to those skilled in the art.

Claims

1. A PCB board gold finger gluing device, characterized in that It includes: A workbench (1) provided with a straight extending slot (10); A clamping device (2) provided at the slot (10), the clamping device (2) being used for clamping a PCB board, and the clamping device (2) having two relatively movable clamping surfaces; An adhesive feeding device (3), which includes a material roll (30), an adhesive clamping assembly (31) and a first driving device (32), the adhesive clamping assembly (31) being used for clamping a tape (6) on the material roll (30), and the first driving device (32) being used for driving the adhesive clamping assembly (31) to move along the slot (10); A negative pressure structure (4), which is provided below the workbench (1), and the negative pressure structure (4) is used for forming a negative pressure towards the lower part of the workbench (1) in the area where the clamping device (2) is located; A glue cutting device (5), which is provided beside the material roll (30) and is used for cutting the tape (6) pulled out by the adhesive clamping assembly (31); The clamping device (2) includes: Two relatively arranged clamping plates (21), and the two clamping surfaces are respectively arranged on the opposite wall surfaces of the two clamping plates (21); A second driving device (22), the second driving device (22) being connected to at least one of the clamping plates (21) and being used for driving the clamping plate (21) connected thereto to approach and move away from the other clamping plate (21); The negative pressure structure (4) includes: A plurality of air inlets (40), the plurality of air inlets (40) being opened at the top of the clamping plate (21) and being arranged at intervals along the length direction of the clamping plate (21); An air outlet, which is provided at the bottom or side of the clamping plate (21) and is communicated with the air inlets (40); A negative pressure mechanism, the negative pressure mechanism being communicated with the air outlet; The adhesive clamping assembly (31) includes two vertically arranged adhesive clamping heads (310), and the two adhesive clamping heads (310) can move relative to each other to open and close so as to loosen and clamp the tape (6); The adhesive clamping head (310) is provided with a U-shaped card slot (311) for clamping the PCB board; 2. The PCB gold finger gluing device according to claim 1, wherein The lower surface of the upper one of the two adhesive clamping heads (310) is serrated; 3. The PCB board gold finger gluing device according to claim 1, wherein The lower one of the two adhesive clamping heads (310) is used for sucking and covering the tape (6) through negative pressure; 4. The PCB board gold finger gluing device according to claim 1, characterized in that, The first driving device (32) includes: Two spaced driving wheels (320); A belt (321), which is connected between the two driving wheels (320) and is connected to the adhesive clamping assembly (31).

5. The PCB board gold finger gluing device according to claim 1, characterized in that, The device further includes a clamping device (7), the clamping device (7) being located between the material roll (30) and the glue cutting device (5) and being used for clamping the tape (6) when the glue cutting device (5) cuts the glue.

6. A method for pasting glue on the gold fingers of a PCB board, characterized in that, It uses the PCB board gold finger pasting device as described in claim 1 to paste glue on the gold fingers of the PCB board.

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