A semiconductor laser chip welding fixture

Abstract

The present invention discloses a semiconductor laser chip welding fixture, comprising a base, two brackets are symmetrically fixedly installed on both sides of the upper end surface of the base, the brackets are in an inverted "T" shape, a fixing frame is arranged between the two brackets, an intermediate pressure block is arranged in the middle of the bottom of the fixing frame, a side pressure block is arranged on one side of the bottom of the fixing frame, a shell is arranged on the upper end surface of the base, and a fixing seat is arranged inside the shell. The semiconductor laser chip welding fixture uses side pressure blocks and intermediate pressure blocks with stepped bottoms to fix the laser chip during semiconductor laser welding, fixes the same laser chip by two adjacent pressure blocks, and the force of one pressure block acts on two laser chips at the same time, thereby ensuring the uniformity of the force on the laser chip inside the entire laser, effectively improving the flatness of laser chip welding, and effectively improving the operability of laser spot compression shaping.

Description

Technical Field

[0001] The invention relates to the field of laser technology, in particular to a semiconductor laser chip welding fixture. Background Art

[0002] Semiconductor lasers are the most practical and important type of lasers. They are small in size, long in life, and can be pumped by a simple current injection method. Their operating voltage and current are compatible with integrated circuits, so they can be monolithically integrated with them. They can also directly modulate the current at frequencies up to GHz to obtain high-speed modulated laser output. Due to these advantages, semiconductor diode lasers have been widely used in laser communications, optical storage, optical gyroscopes, laser printing, ranging, and radar.

[0003] Semiconductor lasers require laser chips to be welded during the production process. However, when today's semiconductor laser welding fixtures are used to fix the laser chips, the force acting on the laser chips is uneven, which reduces the smoothness of the laser chip welding and is inconvenient to use. Summary of the invention

[0004] The purpose of the present invention is to provide a semiconductor laser chip welding fixture to solve the problem mentioned in the above background technology that the current semiconductor laser welding fixture exerts uneven force on the laser chip when fixing the laser chip, which reduces the flatness of the laser chip welding and is inconvenient to use.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a semiconductor laser chip welding fixture, comprising a base, two brackets are symmetrically fixedly installed on both sides of the upper end surface of the base, the brackets are in an inverted "T" shape, a fixing frame is arranged between the two brackets, an intermediate pressure block is arranged in the middle of the bottom of the fixing frame, and a side pressure block is arranged on one side of the bottom of the fixing frame. The upper end surface of the base is provided with a shell, a stepped heat sink (7) is arranged in the shell (6), and a laser chip (8) is arranged on the stepped heat sink (7).

[0006] Preferably, a groove is provided on the upper end surface of the base, the shell is located inside the groove, and the groove is matched with the shell.

[0007] Preferably, an axial hole is opened on the side of the bracket, connecting shafts are fixedly installed on both ends of the fixing frame, and the fixing frame is fixedly connected to the bracket through the connecting shaft passing through the axial hole.

[0008] Preferably, through holes are opened at equal intervals on the upper end surface of the fixing frame, screws are arranged inside the through holes, springs are fixedly installed between the fixing frame and the middle pressure block and the side pressure block, the screws are located on the inner side of the springs, and the screws are threadedly connected to the middle pressure block and the side pressure block.

[0009] Preferably, the bottom of the intermediate pressure block is step-shaped, and the upper end surface of the fixing seat is also step-shaped. The step at the bottom of the intermediate pressure block is matched with the step on the upper end surface of the stepped heat sink. The upper and lower end surfaces of the fixing frame are both step-shaped, and the step at the bottom of the fixing frame is matched with the upper end surfaces of the intermediate pressure block and the side pressure blocks.

[0010] Compared with the prior art, the beneficial effects of the present invention are as follows: the semiconductor laser chip welding fixture uses side pressing blocks and a middle pressing block with a stepped bottom to fix the laser chip during semiconductor laser welding, and the same laser chip is fixed by two adjacent pressing blocks. At the same time, the force of one pressing block acts on two laser chips at the same time, ensuring the uniformity of the force on the laser chip inside the entire laser, effectively improving the flatness of the laser chip welding, and effectively improving the operability of laser spot compression and shaping. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 The three-dimensional structure of the present invention is shown in FIG. Figure 1 ;

[0012] Figure 2 The three-dimensional structure of the present invention is shown in FIG. Figure 2 ;

[0013] Figure 3 It is a schematic diagram of the structure of A of the present invention;

[0014] Figure 4 This is a schematic diagram of the base structure of the present invention;

[0015] Figure 5 It is a schematic diagram of the structure of the fixing frame of the present invention;

[0016] Figure 6 This is a schematic diagram of the structure of the intermediate pressing block of the present invention;

[0017] Figure 7 It is a schematic diagram of the side pressing block structure of the present invention.

[0018] In the figure: 1. base; 2. bracket; 3. fixing frame; 4. middle pressure block; 5. side pressure block; 6. shell; 7. stepped heat sink; 8. laser chip; 9. groove; 10. shaft hole; 11. connecting shaft; 12. through hole; 13. screw; 14. spring. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] See also Figure 1-7 The present invention provides a technical solution: a semiconductor laser chip welding fixture, comprising a base 1, a bracket 2, a fixing frame 3, an intermediate pressure block 4, a side pressure block 5, a shell 6, a stepped heat sink 7, a laser chip 8, a groove 9, an axial hole 10, a connecting shaft 11, a through hole 12, a screw 13 and a spring 14, two brackets 2 are symmetrically fixedly installed on both sides of the upper end surface of the base 1, the bracket 2 is an inverted "T" shape structure, a fixing frame 3 is arranged between the two brackets 2, an intermediate pressure block 4 is arranged in the middle of the bottom of the fixing frame 3, and a side pressure block 5 is arranged on one side of the bottom of the fixing frame 3, a shell 6 is arranged on the upper end surface of the base 1, a stepped heat sink (7) is arranged inside the shell 6, and a laser chip (8) is arranged on the stepped heat sink (7).

[0021] Furthermore, a groove 9 is formed on the upper end surface of the base 1 , and the shell 6 is located inside the groove 9 . The groove 9 is matched with the shell 6 , and the shell 6 is fixed by the groove 9 .

[0022] Furthermore, an axial hole 10 is opened on the side of the bracket 2, and connecting shafts 11 are fixedly installed at both ends of the fixing frame 3. The fixing frame 3 is fixedly connected to the bracket 2 through the connecting shaft 11 passing through the axial hole 10, and the fixing frame 3 is suspended by the set bracket 2 and the connecting shaft 11.

[0023] Furthermore, through holes 12 are formed at equal intervals on the upper end surface of the fixing frame 3, screws 13 are arranged inside the through holes 12, springs 14 are fixedly installed between the fixing frame 3 and the middle pressure block 4 and the side pressure block 5, the screws 13 are located on the inner side of the spring 14, the screws 13 are threadedly connected to the middle pressure block 4 and the side pressure block 5, the spring 14 has a certain tension, and the compression length of the spring 14 is adjusted and controlled by turning the screws 13, and finally the force of the middle pressure block 4 and the side pressure block 5 acting on the laser chip 8 is controlled, and at the same time, the force of one middle pressure block 4 acts on two laser chips 8, thereby ensuring the uniformity of the force on the laser chip 8 inside the entire laser, effectively improving the flatness of the laser chip 8 welding, and effectively improving the operability of the laser spot compression shaping.

[0024] Furthermore, the bottom of the intermediate pressure block 4 is stepped, and the upper end surface of the step heat sink 7 is also stepped. The step at the bottom of the intermediate pressure block 4 is matched with the step on the upper end surface of the step heat sink 7. The upper and lower end surfaces of the fixing frame 3 are both stepped. The step at the bottom of the fixing frame 3 is matched with the upper end surfaces of the intermediate pressure block 4 and the side pressure block 5. The laser chip 8 of the semiconductor laser is effectively clamped and fixed during welding by the set stepped intermediate pressure block 4 and the side pressure block 5, wherein two adjacent intermediate pressure blocks 4 can fix the same laser chip 8.

[0025] Working principle: First, place the shell 6 inside the groove 9 on the upper end face of the base 1, and fix the shell 6 through the groove 9, then place the laser chip 8 neatly on the step inside the shell 6, and then fix the fixing frame 3 on the bracket 2 through the connecting shaft 11 through the through hole 12, and then turn the screw 13 to adjust and control the compression length of the spring 14, and finally control the force of the middle pressure block 4 and the side pressure block 5 on the laser chip 8, wherein the force of an middle pressure block 4 acts on two laser chips 8, ensuring the uniformity of the force on the laser chip 8 inside the entire laser, effectively improving the flatness of the laser chip 8 welding, and effectively improving the operability of the laser spot compression shaping.

[0026] Finally, it should be noted that the above content is only used to illustrate the technical solution of the present invention, rather than to limit the scope of protection of the present invention. Simple modifications or equivalent substitutions of the technical solution of the present invention by ordinary technicians in this field do not deviate from the essence and scope of the technical solution of the present invention.

Claims

1. A semiconductor laser chip welding fixture, comprising a base (1), characterized in that: Two brackets (2) are symmetrically fixedly mounted on both sides of the upper end surface of the base (1); the brackets (2) are in an inverted "T"-shaped structure; a fixing frame (3) is arranged between the two brackets (2); an intermediate pressure block (4) is arranged in the middle of the bottom of the fixing frame (3); a side pressure block (5) is arranged on one side of the bottom of the fixing frame (3); a shell (6) is arranged on the upper end surface of the base (1); a stepped heat sink (7) is arranged in the shell (6); and a laser chip (8) is arranged on the stepped heat sink (7); The upper end surface of the base (1) is provided with a groove (9), the shell (6) is located inside the groove (9), and the groove (9) is adapted to the shell (6); An axial hole (10) is provided on the side of the bracket (2), and connecting shafts (11) are fixedly installed at both ends of the fixing frame (3), and the fixing frame (3) is fixedly connected to the bracket (2) by the connecting shaft (11) passing through the axial hole (10); The bottom of the intermediate pressing block (4) is in a step shape, and the upper end surface of the stepped heat sink (7) is also in a step shape. The step at the bottom of the intermediate pressing block (4) is matched with the step at the upper end surface of the stepped heat sink (7). The upper end surface and the lower end surface of the fixing frame (3) are both in a step shape. The step at the bottom of the fixing frame (3) is matched with the upper end surfaces of the intermediate pressing block (4) and the side pressing block (5).

2. A semiconductor laser chip welding fixture according to claim 1, characterized in that: The upper end surface of the fixing frame (3) is provided with through holes (12) at equal intervals, and screws (13) are arranged inside the through holes (12). Springs (14) are fixedly installed between the fixing frame (3) and the middle pressure block (4) and the side pressure block (5), and the screws (13) are located on the inner side of the spring (14). The screws (13) are threadedly connected to the middle pressure block (4) and the side pressure block (5).

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