Cooling device for heat exchange of CPU radiator

Abstract

The present invention discloses a cooling device for heat exchange of a CPU radiator. The cooling device for heat exchange of the CPU radiator includes: a heat dissipation copper bottom, which is arranged at the bottom of the cooling device; a housing, which is arranged above the heat dissipation copper bottom, and a composite chamber is formed inside the housing. The composite chamber includes an impeller chamber and a heat exchange chamber that are vertically arranged and separated by a horizontal wall. The impeller chamber is located above the heat exchange chamber; an impeller, which is arranged in the impeller chamber, and an impeller cover is arranged above the housing; and a motor wire group, which is arranged on the impeller cover; wherein, the heat exchange chamber and the impeller chamber are communicated through at least one pipe arranged on the side wall of the heat exchange chamber, and the side wall of the heat exchange chamber and the horizontal wall are separated by a step. The cooling device of the present invention provides sufficient space for the connecting pipes, enabling the coolant to perform heat exchange more efficiently.

Description

Technical Field

[0001] The present invention relates to the technical field of CPU radiators, and particularly to a cooling device for heat exchange of a CPU radiator. Background Art

[0002] With the rapid development of electronic technology and information network technology, computers have become an essential part of people's daily lives. With the rapid development of electronic technology, the performance of computers has also increased rapidly. The improvement of performance is accompanied by an increase in the heat generated by the internal components of the computer, which has a serious impact on the performance and service life of the computer.

[0003] The water-cooled radiator commonly used for cooling computer processors dissipates heat through the circulation of coolant. The water-cooled radiator includes a water-cooled pump head, pipes, a radiator, etc. The water-cooled pump head of the prior art includes a heat exchange cavity and a pump cavity, which are separated by a horizontal wall. The coolant communicates the heat dissipation cavity and the pump cavity through pipes vertically opened on the horizontal wall to achieve the purpose of circulating heat dissipation. However, the method of connecting the pump cavity and the heat exchange cavity through the horizontal wall has limitations, which will cause problems such as partial narrowing of the connecting pipes, thereby affecting the heat dissipation effect.

[0004] The information disclosed in this background art section is only intended to enhance the overall understanding of the present invention and should not be regarded as an admission or any form of suggestion that this information constitutes prior art already known to those of ordinary skill in the art. Summary of the Invention

[0005] An object of the present invention is to provide a cooling device for heat exchange of a CPU radiator, which can overcome the above problems of the prior art.

[0006] To achieve the above object, the present invention provides a cooling device for heat exchange of a CPU radiator, which includes: a heat dissipation copper bottom disposed at the bottom of the cooling device; a housing disposed above the heat dissipation copper bottom, and a composite chamber is formed inside the housing, the composite chamber includes an impeller chamber and a heat exchange chamber which are vertically arranged and separated by a horizontal wall, and the impeller chamber is located above the heat exchange chamber; an impeller disposed in the impeller chamber, and an impeller cover is disposed above the housing; and a motor wire group disposed on the impeller cover; wherein, the heat exchange chamber and the impeller chamber are connected through at least one pipe disposed on the side wall of the heat exchange chamber, and the side wall of the heat exchange chamber and the horizontal wall are separated by a step.

[0007] In a preferred embodiment, the impeller cavity and the heat exchange cavity are integrally injection-molded. An upper water inlet and a lower water outlet are provided in the impeller cavity. Among them, the upper water inlet is communicated with one of the pipelines provided on the side wall of the heat exchange cavity, and the lower water outlet is communicated with the other pipeline provided on the side wall of the heat exchange cavity. Moreover, the upper water inlet and the lower water outlet are respectively arranged on the side wall of the heat exchange cavity.

[0008] In a preferred embodiment, a first water inlet and a first water outlet are provided on the outer side surface of the housing. The first water inlet and the first water outlet are respectively connected to an external water inlet nozzle and a water outlet nozzle.

[0009] In a preferred embodiment, the cooling device further includes a flow guiding plate which is arranged in the heat exchange cavity. An inlet water flow channel, a lower water flow channel and a first outlet water flow channel are provided on the front surface of the flow guiding plate. A second outlet water flow channel is provided in the center of the back surface of the flow guiding plate, and second water inlets are respectively provided on both sides. Among them, the inlet water flow channel is communicated with the first water inlet, the lower water flow channel is communicated with the first water outlet, and the inlet water flow channel is communicated with the second outlet water flow channel. Two second water outlets are provided on the first outlet water flow channel.

[0010] In a preferred embodiment, the coolant can flow in from the first water inlet, pass through the inlet water flow channel and the second outlet water flow channel and flow into the heat absorption plate on the heat dissipation copper bottom for heat exchange. After heat exchange, the coolant respectively converges into one of the pipelines from the two second water inlets, the first outlet water flow channel and the upper water inlet and enters the impeller cavity. After being pressurized by the impeller, the coolant can enter the lower water flow channel via the lower water outlet, the other pipeline and the lower water outlet, and flow out from the first water outlet.

[0011] In a preferred embodiment, a groove is provided at the middle position of the impeller cavity. The groove is used for storing the coolant, and a water isolation plate is provided in the groove. A through hole is provided at the center of the water isolation plate. The water isolation plate is used for guiding the water on the side to the center.

[0012] In a preferred embodiment, the water isolation plate shields above the upper water inlet, and a vertical baffle is provided on the side of the water isolation plate close to the upper water inlet.

[0013] In a preferred embodiment, a central shaft is provided inside the impeller cover. One end of the central shaft is connected to the inner wall of the top of the impeller cover, and the other end of the central shaft is used to pass through the center of the impeller and is arranged in the through hole of the water isolation plate.

[0014] In a preferred embodiment, the diameter of the through hole is larger than the diameter of the central shaft.

[0015] In a preferred embodiment, a soft film is provided between the flow guiding plate and the heat absorption plate on the heat dissipation copper bottom. Sealing rings are provided between the impeller cover and the housing, and between the housing and the heat dissipation copper bottom. Moreover, a sealing thread ring is provided at the bottom of the heat dissipation copper bottom.

[0016] Compared with the prior art, the cooling device for CPU radiator heat exchange according to the present invention has the following advantages: the horizontal wall and the side wall of the present invention are significantly separated, with right-angle transitions and steps, fundamentally differentiating the horizontal wall and the side wall. The connecting pipe between the heat exchange chamber and the impeller chamber of the present invention is arranged on the side wall of the heat exchange chamber, thus avoiding the drawbacks of the prior art, providing sufficient space for the connecting pipe, and enabling the coolant to conduct heat exchange more efficiently. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a front view schematic diagram of a cooling device according to an embodiment of the present invention;

[0018] Figure 2 is an internal three-dimensional structure diagram of a cooling device according to an embodiment of the present invention;

[0019] Figure 3 is an internal three-dimensional structure diagram of a cooling device according to an embodiment of the present invention from another direction;

[0020] Figure 4 is an exploded view of a cooling device according to an embodiment of the present invention;

[0021] Figure 5 is a three-dimensional structure diagram of a housing according to an embodiment of the present invention;

[0022] Figure 6 is a front view of a housing according to an embodiment of the present invention;

[0023] Figure 7 is a top view of a housing according to an embodiment of the present invention;

[0024] Figure 8 is Figure 7 a cross-sectional view taken along the B-B direction in

[0025] Figure 9 is Figure 7 a cross-sectional view taken along the A-A direction in

[0026] Figure 10 is a bottom three-dimensional structure diagram of a housing according to an embodiment of the present invention;

[0027] Figure 11 is a three-dimensional structure diagram of a deflector according to an embodiment of the present invention;

[0028] Figure 12 is a front view schematic diagram of a deflector according to an embodiment of the present invention;

[0029] Figure 13 is a back view schematic diagram of a deflector according to an embodiment of the present invention;

[0030] Figure 14 is a three-dimensional structural diagram of a water baffle according to an embodiment of the present invention;

[0031] Figure 15 is a three-dimensional internal structural diagram of an impeller cover according to an embodiment of the present invention.

[0032] Main reference numerals description:

[0033] 1 - heat dissipation copper bottom, 2 - housing, 3 - impeller, 4 - impeller cover, 5 - motor wire group, 6 - composite chamber, 7 - horizontal wall, 8 - impeller chamber, 9 - heat exchange chamber, 10 - side wall of the heat exchange chamber, 11 - upper water inlet, 12 - lower water outlet, 13 - upper water inlet entrance, 14 - first water inlet, 15 - first water outlet, 16 - flow guide plate, 17 - water inlet channel, 18 - lower water channel, 19 - first water outlet channel, 20 - second water outlet channel, 21 - second water inlet, 22 - second water outlet, 23 - groove, 24 - water baffle, 25 - soft film, 29 - heat absorption plate, 30 - vertical baffle. Detailed implementation manners

[0034] The following will describe in detail the specific implementation manners of the present invention with reference to the accompanying drawings, but it should be understood that the protection scope of the present invention is not limited by the specific implementation manners.

[0035] Unless otherwise clearly stated, throughout the specification and claims, the term "comprising" or its variations such as "comprises" or "including" etc. will be understood to include the stated elements or components, without excluding other elements or other components.

[0036] As Figures 1 to 4 shown, a cooling device for heat exchange of a CPU radiator according to a preferred embodiment of the present invention includes: a heat dissipation copper bottom 1, a housing 2, an impeller 3, an impeller cover 4 and a motor wire group 5. Among them, the heat dissipation copper bottom 1 is arranged at the bottom of the cooling device, the housing 2 is arranged above the heat dissipation copper bottom 1 and fixedly connected to the heat dissipation copper bottom 1. A composite chamber 6 is formed inside the housing 2. The composite chamber 6 includes an impeller chamber 8 and a heat exchange chamber 9 that are vertically arranged and separated by a horizontal wall 7. The impeller chamber 8 is located above the heat exchange chamber 9; the impeller 3 is arranged in the impeller chamber 8, an impeller cover 4 is arranged above the housing, and the motor wire group 5 is arranged on the impeller cover 4. Among them, the heat exchange chamber 9 and the impeller chamber 8 are connected through at least one pipe arranged on the side wall 10 of the heat exchange chamber, and there is an obvious separation between the side wall 10 of the heat exchange chamber and the horizontal wall 7, such as Figure 1 shown by the step 33.

[0037] Preferably, the impeller cavity and the heat exchange cavity are injection-molded into an integral structure, optimizing the split structure into an integral molding structure, thereby avoiding the risk of connection leakage and saving costs. Refer to Figures 5 - 10 As shown, a water inlet 11 and a water outlet 12 are provided in the impeller cavity 8. The water inlet 11 and the water outlet 12 are not on the same horizontal plane, and the position of the water outlet 12 is higher than that of the water inlet 11. Among them, the water inlet 11 is connected to one of the pipelines provided on the side wall 10 of the heat exchange cavity, and the water outlet 12 is connected to the other pipeline provided on the side wall 10 of the heat exchange cavity. Moreover, the water inlet 13 of the water inlet and the water outlet of the water outlet are respectively provided on the side wall 10 of the heat exchange cavity. A first water inlet 14 and a first water outlet 15 are provided on the outer side surface of the housing 2. The first water inlet 14 and the first water outlet 15 are respectively connected to an external water inlet nozzle and a water outlet nozzle.

[0038] Refer to Figures 11 - 13 , the cooling device further includes a flow guide plate 16, which is arranged in the heat exchange cavity. A water inlet flow channel 17, a downward water flow channel 18 and a first water outlet flow channel 19 are provided on the front surface of the flow guide plate 16. A second water outlet flow channel 20 is provided in the center of the back surface of the flow guide plate 16, and second water inlets 21 are respectively provided on both sides. Among them, the water inlet flow channel 17 is connected to the first water inlet 14, the downward water flow channel 18 is connected to the first water outlet 15, and the water inlet flow channel 17 is connected to the second water outlet flow channel 20. Two second water outlets 22 are provided on the first water outlet flow channel.

[0039] Refer to again Figures 1 - 13 , the working process of the cooling device of the present invention is as follows: the coolant can flow in from the first water inlet 14, pass through the water inlet flow channel 17 and the second water outlet flow channel 20 and flow into the heat absorption plate 29 on the heat dissipation copper bottom for heat exchange. The heat-exchanged coolant respectively converges into one of the pipelines on the side wall of the heat exchange cavity from the two second water inlets 21, the first water outlet flow channel 19 and the water inlet 13 of the water inlet and enters the impeller cavity 8. After the coolant is pressurized by the impeller, it can enter the downward water flow channel 18 through the water outlet 12, the other pipeline on the side wall of the heat exchange cavity and the water outlet of the water outlet, and flow out from the first water outlet 15.

[0040] Refer to Figure 4 and Figure 14 As shown, a groove 23 is provided at the middle position of the impeller cavity. The groove 23 is used for storing the coolant, and a water isolation plate 24 is provided above the groove 23. A through hole 32 is provided at the center of the water isolation plate 24. The water isolation plate 24 shields above the water inlet 11, and a vertical baffle 30 is provided on the side of the water isolation plate 24 close to the water inlet. Refer to Figures 14 - 15As shown, a central shaft 31 is provided inside the impeller cover 4. One end of the central shaft 31 is connected to the inner wall of the top of the impeller cover, and the other end of the central shaft 31 is used to pass through the center of the impeller and is arranged in the through hole 32 of the water separation plate. Among them, the diameter of the through hole 32 is larger than the diameter of the central shaft 31, and the water separation plate 24 can guide the water entering from the side to the center.

[0041] Reference Figure 4 As shown, a soft film 25 is provided between the flow guide plate 16 and the heat absorption plate 29 on the heat dissipation copper bottom, a first sealing ring 26 is provided between the impeller cover 4 and the housing 2, a second sealing ring 27 is provided between the housing 2 and the heat dissipation copper bottom 1, and a sealing thread ring 28 is provided at the bottom of the heat dissipation copper bottom 1, significantly improving the sealing performance and reliability of the water cooling head.

[0042] The foregoing description of the specific exemplary embodiments of the present invention is for the purposes of illustration and exemplification. These descriptions are not intended to limit the invention to the precise forms disclosed, and obviously, many changes and variations are possible in light of the above teachings. The purpose of selecting and describing the exemplary embodiments is to explain the specific principles of the invention and its practical applications, so that those skilled in the art can implement and utilize the various different exemplary embodiments of the present invention, as well as various different selections and changes. The scope of the present invention is intended to be defined by the claims and their equivalents.

Claims

1. A cooling device for heat exchange of a CPU radiator, characterized in that, The cooling device for CPU radiator heat exchange includes: A heat dissipation copper base, which is arranged at the bottom of the cooling device; A housing, which is arranged above the heat dissipation copper base. A composite chamber is formed inside the housing. The composite chamber includes an impeller chamber and a heat exchange chamber that are vertically arranged and separated by a horizontal wall. The impeller chamber is located above the heat exchange chamber; An impeller, which is arranged in the impeller chamber, and an impeller cover is arranged above the housing; and A motor wire group, which is arranged on the impeller cover; Wherein, the heat exchange chamber and the impeller chamber are connected through at least one pipe arranged on the side wall of the heat exchange chamber, and the side wall of the heat exchange chamber and the horizontal wall are separated by a step; Wherein, the impeller chamber and the heat exchange chamber are injection-molded into an integral structure. An upper water inlet and a lower water inlet are arranged in the impeller chamber. Among them, the upper water inlet is connected to one of the pipes arranged on the side wall of the heat exchange chamber, and the lower water inlet is connected to the other pipe arranged on the side wall of the heat exchange chamber. And the upper water inlet and the lower water outlet are respectively arranged on the side wall of the heat exchange chamber.

2. The cooling device according to claim 1, characterized in that, A first water inlet and a first water outlet are arranged on the outer side surface of the housing, and the first water inlet and the first water outlet are respectively connected to an external water inlet nozzle and a water outlet nozzle.

3. The cooling device according to claim 2, characterized in that The cooling device further includes a guide plate, which is arranged in the heat exchange chamber. An inlet water flow channel, a lower water flow channel and a first outlet water flow channel are arranged on the front surface of the guide plate. A second outlet water flow channel is arranged in the center of the back surface of the guide plate, and second water inlets are respectively arranged on both sides. Among them, the inlet water flow channel is connected to the first water inlet, the lower water flow channel is connected to the first water outlet, and the inlet water flow channel is connected to the second outlet water flow channel. Two second water outlets are arranged on the first outlet water flow channel.

4. The cooling device according to claim 3, characterized in that, Coolant can flow in from the first water inlet, pass through the inlet water flow channel and the second outlet water flow channel and flow into the heat absorption plate on the heat dissipation copper base for heat exchange. After heat exchange, the coolant respectively flows into one of the pipes through the two second water inlets, the first outlet water flow channel and the upper water inlet to enter the impeller chamber. After being pressurized by the impeller, the coolant can enter the lower water flow channel through the lower water outlet, the other pipe and the lower water outlet, and flow out from the first water outlet.

5. The cooling device according to claim 1, wherein, A groove is arranged at the middle position of the impeller chamber. The groove is used for storing coolant, and a water separation plate is arranged in the groove. A through hole is arranged at the center of the water separation plate, and the water separation plate is used for guiding the water on the side to the center.

6. The cooling device according to claim 5, characterized in that, The water separation plate shields above the upper water inlet, and a vertical baffle is arranged on one side of the water separation plate close to the upper water inlet.

7. The cooling device according to claim 5, characterized in that A central shaft is arranged inside the impeller cover. One end of the central shaft is connected to the inner wall of the top of the impeller cover, and the other end of the central shaft is used to pass through the center of the impeller and is arranged in the through hole of the water separation plate.

8. The cooling device according to claim 7, wherein, The diameter of the through hole is larger than the diameter of the central shaft.

9. The cooling device according to claim 3, wherein A soft film is provided between the flow guide plate and the heat absorption plate on the heat dissipation copper bottom, sealing rings are provided between the impeller cover and the housing and between the housing and the heat dissipation copper bottom, and a sealing thread ring is provided at the bottom of the heat dissipation copper bottom.

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