A packaging device and packaging method for composite packaging testing

Abstract

The present invention discloses a packaging device and packaging method for composite packaging testing. The packaging device includes a chip, a packaging substrate, and an optical lens. The chip is fixed to the packaging substrate, which is provided with insertion slots of various sizes. The optical lens is inserted into the corresponding insertion slots to cover the chip. Light emitted by the chip passes through the optical lens to emit the light required for testing. The packaging device of the present invention can package chips of different sizes through the interaction between the packaging substrate and the optical lens. Testing can be performed by only using a single fixture to clamp the packaging substrate, effectively reducing costs.

Description

Technical Field

[0001] The present invention relates to the technical field of light emitting diode packaging, and in particular to a packaging device and a packaging method for composite packaging testing. Background Art

[0002] After LED chip production is complete, packaging testing is required to determine the chip's optoelectronic performance. Traditional packaging utilizes different packaging formats based on different chips and applications. This requires the use of different material boxes, die-bonding fixtures, wire-bonding fixtures, sealant fixtures, and test fixtures, depending on the specific bracket. Even different die-bonding machines and wire-bonding machines may be required. This creates a wide variety of materials and fixtures for product development and verification, leading to high costs and lengthy packaging times.

[0003] like Figure 1 As shown, existing packaging methods generally include SMD, SMT, LAMP and COB. Each packaging method uses different tools such as brackets, material boxes, die bonding fixtures, and wire bonding fixtures. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a packaging device for composite packaging testing, which can be used to package chips of different sizes, effectively reduce the materials and fixtures provided, and reduce costs.

[0005] The technical problem to be solved by the present invention is to provide a packaging method that is simple to operate and can simultaneously package chips of different sizes and simultaneously package the chips in different ways.

[0006] In order to solve the above technical problems, the present invention provides a packaging device for composite packaging testing, including a chip, a packaging substrate and an optical lens. The chip is fixed on the packaging substrate, and the packaging substrate is provided with insertion grooves of various sizes. The optical lens is inserted into the corresponding insertion groove to cover the chip. The light emitted by the chip passes through the optical lens to emit the light required for testing.

[0007] As an improvement to the above solution, the insertion slot includes a first insertion slot and a second insertion slot, the optical lens includes an inner cover body and an outer cover body, the inner cover body is inserted into the first insertion slot to cover the chip, the outer cover body is inserted into the second insertion slot to cover the inner cover body, and fluorescent glue is filled between the outer cover body and the inner cover body.

[0008] As an improvement to the above solution, the inner cover is made of a light-transmitting material, and the light-transmitting material is polymethyl methacrylate, polycarbonate or glass;

[0009] The outer cover comprises a light-emitting surface and a non-light-emitting surface, wherein the light-emitting surface is made of a light-transmitting material, and the non-light-emitting surface is made of a reflective material.

[0010] As an improvement to the above solution, the distance between the inner cover and the outer cover is 0.5 to 3 mm.

[0011] As an improvement to the above solution, the light-emitting surface of the optical lens is provided with a quantum film, and the quantum film is made of quantum dot material.

[0012] As an improvement of the above solution, the material of the packaging substrate is ceramic, polyphthalamide, poly(1,4-cyclohexanedimethanol terephthalate) or epoxy resin injection molding compound.

[0013] As an improvement to the above solution, a pad is provided on the package substrate, and the chip is conductively connected to the pad via a bonding wire;

[0014] The packaging substrate is provided with a four-pin or six-pin power-on structure, which can be used for common cathode powering or parallel powering of the three-color tubes.

[0015] Accordingly, the present invention also provides a packaging method, comprising:

[0016] 1. Fixing the chip on a packaging substrate, wherein the packaging substrate is provided with insertion slots of various sizes;

[0017] Second, insert the optical lens into the corresponding insertion slot to cover the chip. The light emitted by the chip passes through the optical lens and emits the light required for testing.

[0018] As an improvement to the above solution, the insertion slot includes a first insertion slot and a second insertion slot, the optical lens includes an inner cover and an outer cover, the inner cover is inserted into the first insertion slot to cover the chip, the outer cover is inserted into the second insertion slot to cover the inner cover, and fluorescent glue is filled between the outer cover and the inner cover;

[0019] The inner cover is made of a light-transmitting material, and the light-transmitting material is polymethyl methacrylate, polycarbonate or glass;

[0020] The outer cover comprises a light-emitting surface and a non-light-emitting surface, wherein the light-emitting surface is made of a light-transmitting material, and the non-light-emitting surface is made of a reflective material.

[0021] As an improvement to the above solution, a quantum film is provided on the light-emitting surface of the optical lens, and the quantum film is made of quantum dot material.

[0022] The implementation of the present invention has the following beneficial effects:

[0023] The packaged device of the present invention utilizes a package substrate and an optical lens, with insertion slots of varying sizes provided on the package substrate to accommodate chips of varying sizes. Since only one package substrate size is available, testing requires only one fixture to hold the package substrate, eliminating the need to select different fixtures for different devices, effectively reducing costs.

[0024] In addition, after testing of the packaged device of the present invention, the optical lens can be pulled out, the chip removed, and other chips repackaged. The package substrate and optical lens can be reused, effectively reducing costs.

[0025] Furthermore, the present invention can make the chip emit the light required for testing by filling different fluorescent glues between the inner cover and the outer cover, or arranging different quantum films on the light-emitting surface of the optical lens. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a top view of the packaged device of the present invention;

[0027] Figure 2 is a top view of the packaging substrate of the present invention;

[0028] Figure 3 is a stereogram of the optical lens of the present invention;

[0029] Figure 4 This is a diagram showing the packaging methods that can be achieved for the packaging device of the present invention. DETAILED DESCRIPTION

[0030] In order to make the objectives, technical solutions and advantages of the present invention more clear, the present invention will be described in further detail below with reference to the accompanying drawings.

[0031] See also Figure 1 The present invention provides a packaging device for composite packaging testing, including a chip 1, a packaging substrate 2 and an optical lens 3.

[0032] Specifically, the chip 1 is fixed on a packaging substrate 2. The packaging substrate 2 is provided with a pad, and the chip is electrically connected to the pad via a bonding wire.

[0033] In addition, the package substrate is provided with a four-pin or six-pin power supply structure, which can be used for common cathode power supply or parallel power supply of three-color tubes. The above power supply structure is a conventional package substrate power supply structure and is not specifically limited in the present invention.

[0034] The packaging substrate is made of ceramic, polyphthalamide, poly(1,4-cyclohexanedimethanol terephthalate), or epoxy resin injection molding compound. These materials offer excellent heat dissipation, are versatile, and are readily available. Preferably, the packaging substrate has a size of 5.0 mm x 5.0 mm to 7.0 mm x 7.0 mm, but this is not limited thereto.

[0035] See also Figure 2 The package substrate 2 is provided with an insertion groove 21, and the optical lens 3 is inserted into the insertion groove 21, thereby covering the chip 1. The optical lens of the present invention is pre-prepared with fluorescent glue according to packaging requirements such as color temperature and display index. Therefore, the present invention can directly insert the optical lens 3 into the insertion groove of the package substrate 2 to complete the packaging, and then perform testing.

[0036] It should be noted that the packaging format of the packaged device of the present invention is only for testing; formal production still uses conventional packaging. The packaged device of the present invention can be used to test optical and electrical parameters, such as voltage, brightness, wavelength, IR, color temperature, display index, ESD, light output angle, x, y, LI characteristic curves, IV characteristic curves, etc.

[0037] When the test is complete, the optical lens can be pulled out, the chip removed, and repackaged with other chips. The packaging substrate and optical lens can be reused, effectively reducing costs.

[0038] Preferably, the package substrate 2 is provided with insertion slots 21 of various sizes, including 3528, 3014, 2525, and 2835 sizes. These slots can accommodate chips of different sizes. By standardizing the size of the package substrates, the present invention allows testing to be performed using only one size of fixture to clamp the package substrates, eliminating the need to select different fixtures for different devices, effectively reducing costs.

[0039] Since the size of the packaging substrate of the present invention is large enough, multiple chips can be packaged on the packaging substrate at the same time. In addition, since the packaging substrate is provided with insertion slots of different sizes, chips of different sizes can be packaged through optical lenses of different sizes.

[0040] See also Figure 3 The optical lens 3 includes an inner cover 31 and an outer cover 32. Accordingly, the insertion slot 21 includes a first insertion slot 211 and a second insertion slot 212. The inner cover 31 is inserted into the first insertion slot 211 to cover the chip 1, and the outer cover 32 is inserted into the second insertion slot 212 to cover the inner cover. Fluorescent glue is filled between the outer cover 32 and the inner cover 31. Preferably, the inner cover 31 is an inner cube, and the outer cover 32 is an outer cube.

[0041] The inner cover is made of a light-transmitting material such as polymethyl methacrylate, polycarbonate or glass. Preferably, the light transmittance of the inner cover is greater than 95%.

[0042] The outer cover includes a light-emitting surface and a non-light-emitting surface. Specifically, the light-emitting surface of the outer cover is its front surface, i.e., the surface opposite the package substrate, and the non-light-emitting surface of the outer cover is its side surface. In other embodiments of the present invention, both the front and side surfaces of the outer cover can serve as light-emitting surfaces. By selecting different light-emitting surfaces, the present invention can select different light emission modes.

[0043] The light-emitting surface is made of a light-transmitting material, and the non-light-emitting surface is made of a reflective material. Preferably, the material with high reflectivity is silver.

[0044] Preferably, the distance between the inner cover and the outer cover is 0.5 to 3 mm. If the distance between the inner cover and the outer cover is too small, it will be difficult to fill the fluorescent glue; if the distance between the inner cover and the outer cover is too large, the light output will be affected.

[0045] Preferably, the present invention can also provide a quantum film on the light-emitting surface of the outer cover 32, so that the chip emits light of a desired color. The quantum film is made of a quantum dot material. The quantum dot material is an existing material, and different quantum dot materials can cause the chip to emit light of different colors.

[0046] Furthermore, the present invention can also provide a secondary optical lens outside the optical lens 3 to meet different testing requirements.

[0047] See also Figure 4 The packaging substrate and optical lens of the present invention can be packaged in SMD, SMT, LAMP or a combination thereof. In addition, different packaging methods can also be used to package chips of different sizes.

[0048] Specifically, Figure 4 Column A is a top view of the packaging substrate, column B is a side view of the optical lens, and column C is a side view of the packaging device of the present invention; among them, the packaging method of row E is SMD, the packaging method of row F is SMT, the packaging method of row G is LAMP, and the packaging method of row H is a combination of various packaging methods.

[0049] The present invention can design the lens in different ways, thereby enabling the packaged device to achieve different light emission modes.

[0050] Accordingly, the present invention further provides a packaging method, which uses the packaging device of the present invention to package a chip, comprising the following steps:

[0051] 1. Fix the chip on the package substrate and use bonding wires to connect the chip electrodes to the pads on the package substrate to form a conductive connection;

[0052] The package substrate of the present invention is provided with a four-pin or six-pin power supply structure, which can be used for common cathode power supply or parallel power supply of three-color tubes. The above power supply structure is a conventional package substrate power supply structure and is not specifically limited in the present invention.

[0053] The packaging substrate of the present invention is made of ceramic, polyphthalamide, poly(1,4-cyclohexanedimethanol terephthalate), or epoxy resin injection molding compound. These materials offer excellent heat dissipation, are versatile, and are readily available. Preferably, the packaging substrate has a size of 5.0 mm x 5.0 mm to 7.0 mm x 7.0 mm, but this is not limiting.

[0054] The packaging substrate of the present invention is provided with insertion grooves of various specifications.

[0055] 2. Insert the inner cover into the first insertion slot to cover the chip and bonding wires, and insert the outer cover into the second insertion slot to cover the inner cover.

[0056] The inner cover is made of a light-transmitting material such as polymethyl methacrylate, polycarbonate or glass. Preferably, the light transmittance of the inner cover is greater than 95%.

[0057] The light-emitting surface of the outer cover is made of a light-transmitting material, and the non-light-emitting surface is made of a reflective material. Preferably, the material with high reflectivity is silver.

[0058] Preferably, the distance between the inner cover and the outer cover is 0.5 to 3 mm. If the distance between the inner cover and the outer cover is too small, it will be difficult to fill the fluorescent glue; if the distance between the inner cover and the outer cover is too large, the light output will be affected.

[0059] It should be noted that the present invention can select the following solutions to continue packaging according to packaging requirements:

[0060] Solution 1: Fill the space between the outer cover and the inner cover with fluorescent glue of different color temperatures and display indexes to make the chip emit light of the required color.

[0061] Solution 2: A quantum film is provided on the light-emitting surface of the outer cover to enable the chip to emit light of the desired color.

[0062] Specifically, the quantum film is made of quantum dot material.

[0063] In other embodiments of the present invention, after completing step 1, the present invention directly inserts the optical lens that has been adjusted to the corresponding color temperature and display index into the insertion slot to make the chip emit light of the required color.

[0064] Preferably, the present invention can also provide a secondary optical lens outside the optical lens to meet different testing requirements.

[0065] The above disclosure is only a preferred embodiment of the present invention and certainly cannot be used to limit the scope of the present invention. Therefore, equivalent changes made according to the claims of the present invention are still within the scope of the present invention.

Claims

1. A packaging device for composite packaging testing, characterized in that: The device comprises a chip, a packaging substrate and an optical lens. The chip is fixed on the packaging substrate. The packaging substrate is provided with insertion slots of various sizes for packaging chips of different sizes. The optical lens is inserted into the corresponding insertion slot to cover the chip. The light emitted by the chip passes through the optical lens and emits the light required for testing. The optical lens is pluggable and connected to the insertion slot; The insertion slot includes a first insertion slot and a second insertion slot, the optical lens includes an inner cover and an outer cover, the inner cover is inserted into the first insertion slot to cover the chip, the outer cover is inserted into the second insertion slot to cover the inner cover, and the space between the outer cover and the inner cover is filled with fluorescent glue; The inner cover is made of light-transmitting material; The outer cover comprises a light-emitting surface and a non-light-emitting surface, wherein the light-emitting surface is made of a light-transmitting material and the non-light-emitting surface is made of a reflective material; The distance between the inner cover and the outer cover is 0.5~3mm; The package substrate is provided with a pad, and the chip is electrically connected to the pad via a bonding wire; The packaging substrate is provided with a four-pin or six-pin power-on structure, which can be used for common cathode powering or parallel powering of the three-color tubes.

2. The packaging device for composite packaging testing according to claim 1, wherein: The light-transmitting material is polymethyl methacrylate, polycarbonate or glass.

3. The packaging device for composite packaging testing according to claim 1, wherein: The light-emitting surface of the optical lens is provided with a quantum film, and the quantum film is made of quantum dot material.

4. The packaging device for composite packaging testing according to claim 1, wherein: The material of the packaging substrate is ceramic, polyphthalamide, poly(1,4-cyclohexanedimethanol terephthalate) or epoxy resin injection molding compound.

5. A packaging method, implemented based on the packaging device for composite packaging testing according to any one of claims 1 to 4, characterized in that: include:

1. Fixing the chip on a packaging substrate, wherein the packaging substrate is provided with insertion slots of various sizes; 2. Insert the optical lens into the corresponding insertion slot to cover the chip. The light emitted by the chip passes through the optical lens and emits the light required for testing. The insertion slot includes a first insertion slot and a second insertion slot, the optical lens includes an inner cover and an outer cover, the inner cover is inserted into the first insertion slot to cover the chip, the outer cover is inserted into the second insertion slot to cover the inner cover, and the space between the outer cover and the inner cover is filled with fluorescent glue; The inner cover is made of light-transmitting material; The outer cover comprises a light-emitting surface and a non-light-emitting surface, wherein the light-emitting surface is made of a light-transmitting material, and the non-light-emitting surface is made of a reflective material.

6. The packaging method according to claim 5, wherein: The light-transmitting material is polymethyl methacrylate, polycarbonate or glass.

7. The packaging method according to claim 5, wherein: A quantum film is arranged on the light-emitting surface of the optical lens, and the quantum film is made of quantum dot material.

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