OPS and Motherboard Connection Simplification Device

Abstract

The present invention discloses a simplified device for connecting an OPS to a main board, which includes an Android main board module, a chip module, a daughter card module, and a standard VBO wire. A first VBO socket is connected to the Android main board module. The HDMI signal of the chip module and the USB of the front port pass through HUBIC, and the detection and control interfaces of the MCU end. In the present invention, the Android main board module is connected with a first VBO socket, the daughter card module includes an OPS socket and a second VBO socket that conform to the INTEL standard. The Android main board module and the daughter card module are connected by a standard VBO wire, and the first VBO socket, the second VBO socket, and the standard VBO wire all contain HDMI signals, USB signals, a detection module, a control module, and a touch circuit, realizing the connection of multiple signals integrated in one wire, simplifying the wire connection, improving the assembly efficiency and product stability, and being more convenient for daily use.

Description

Technical Field

[0001] The present invention relates to the technical field of HDMI signal and other control signal integration, and particularly to a device for simplifying the connection between an OPS and a main board. Background Art

[0002] With the development of the education and conference industries, the functional requirements for dual-system all-in-one machines are increasing currently, and the stability requirements for products are also correspondingly improved, which means that more comprehensive considerations should be given to product technology and mass production. In current dual-system all-in-one machines, the part with the most wiring is the interaction between Android and the OPS computer. The types of wires are complex, and the quality requirements for production line personnel are relatively high.

[0003] Currently, the direct wiring between the main board and the OPS is chaotic, and it is easy to be plugged in wrongly on the production line, resulting in a serious decline in production quality. At the same time, more wire connections reduce the assembly efficiency and are likely to cause poor shipment of the whole machine. Summary of the Invention

[0004] The purpose of the present invention is to provide a device for simplifying the connection between an OPS and a main board in order to solve the problems of complex wires and low assembly efficiency in existing factories.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0006] A device for simplifying the connection between an OPS and a main board includes an Android main board module, a chip module, a daughter card module, and a standard VBO wire. A first VBO socket is connected to the Android main board module. The HDMI signal of the chip module and the USB of the front-end port pass through HUBIC, the detection and control interfaces of the MCU end, and the touch frame USB interface reaches the first VBO socket of the Android main board module in a differential packet ground mode. The daughter card module includes an INTEL-standard OPS socket and a second VBO socket.

[0007] As a further description of the above technical solution:

[0008] The daughter card module is connected to the Android main board module through a standard VBO wire.

[0009] As a further description of the above technical solution:

[0010] The standard VBO wire includes an HDMI signal, multiple OPS module USB signals, a touch frame signal, an OPS module control signal, and an OPS module detection signal.

[0011] As a further description of the above technical solution:

[0012] Both the first VBO socket and the second VBO socket include HDMI signals, USB signals, detection modules, control modules, and touch circuits corresponding to standard VBO wires.

[0013] As a further description of the above technical solution:

[0014] The wire specification of the standard VBO wire is the same as that of the 4K VBO screen wire.

[0015] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0016] In the present invention, the Android main board module is connected to the first VBO socket, the sub-card module includes an OPS socket conforming to the INTEL standard and the second VBO socket, the Android main board module and the sub-card module are connected by a standard VBO wire, and the first VBO socket, the second VBO socket, and the standard VBO wire all contain HDMI signals, USB signals, detection modules, control modules, and touch circuits, realizing the integration of multiple signals in one wire for connection, simplifying the wire connection, improving the assembly efficiency and product stability, and being more convenient for daily use. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the signal flow structure of the OPS and main board connection simplification device proposed by the present invention;

[0018] Figure 2 It is a schematic diagram of the system structure of the OPS and main board connection simplification device proposed by the present invention;

[0019] LEGEND DESCRIPTION:

[0020] 1. Android main board module; 2. Chip module; 3. Sub-card module; 4. Standard VBO wire; 5. First VBO socket; 6. Second VBO socket; 7. OPS socket. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0022] Embodiment 1

[0023] Please refer to Figure 1-2, the OPS and motherboard connection simplification device includes an Android motherboard module 1, a chip module 2, a daughter card module 3, and a standard VBO cable 4. This cable is machine-formed with good consistency. A first VBO socket 5 is connected to the Android motherboard module 1. The HDMI signal of the chip module 2 and the USB of the front port pass through HUBIC, the detection and control interfaces at the MCU end, and the touch frame USB interface reaches the first VBO socket 5 of the Android motherboard module 1 through differential packet routing. The daughter card module 3 includes an OPS socket 7 conforming to the INTEL standard and a second VBO socket 6. The daughter card module 3 is connected to the Android motherboard module 1 through the standard VBO cable 4 to achieve multi-party interaction between the OPS module, the motherboard, and the touch frame.

[0024] Embodiment 2

[0025] Please refer to Figure 1-2 , the standard VBO cable 4 includes an HDMI signal, multiple OPS module USB signals, a touch frame signal, an OPS module control signal, and an OPS module detection signal. Both the first VBO socket 5 and the second VBO socket 6 include an HDMI signal, a USB signal, a detection module, a control module, and a touch circuit corresponding to the standard VBO cable 4. By integrating multiple signals into one cable through the first VBO socket 5, the second VBO socket 6, and the standard VBO cable 4, the cable connection is simplified, which can greatly improve the assembly efficiency and product quality. The cable specification of the standard VBO cable 4 is the same as that of the 4K VBO screen cable, saving the user's inventory cost.

[0026] The steps for design implementation are as follows:

[0027] Step 1: Connect the Android motherboard module 1 to the first VBO socket 5.

[0028] Step 2: The HDMI signal of the chip module 2 and the USB of the front port pass through HUBIC, the detection and control interfaces at the MCU end, and the touch frame USB interface reach the first VBO socket 5 of the Android motherboard module 1 through differential packet routing.

[0029] Step 3: The daughter card module 3 includes an OPS socket 7 conforming to the INTEL standard and a second VBO socket 6. The signals in the second VBO socket 6 are also the HDMI signal, USB signal, detection module, control module, and touch circuit of the corresponding module.

[0030] Step 4: After the circuit design of the daughter card module 3 and the Android motherboard module 1 is completed, the user only needs to connect them through a standard VBO cable 4 to achieve multi-party interaction between the OPS module, the motherboard, and the touch frame.

[0031] As described above, it is only the preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, making equivalent substitutions or changes should be covered within the protection scope of the present invention.

Claims

1. Simplified device for connecting OPS to motherboard, characterized in that, It includes an Android main board module (1), a chip module (2), a daughter card module (3), and a standard VBO wire (4); A first VBO socket (5) is connected to the Android main board module (1); The HDMI signal of the chip module (2) and the USB of the front port pass through HUBIC, the detection and control interfaces at the MCU end, and the touch frame USB interface reaches the first VBO socket (5) of the Android main board module (1) in a differential packet method; The daughter card module (3) includes an OPS socket (7) and a second VBO socket (6) that conform to the INTEL standard; The standard VBO wire (4) includes an HDMI signal, multiple OPS module USB signals, a touch frame signal, an OPS module control signal, and an OPS module detection signal; Both the first VBO socket (5) and the second VBO socket (6) include an HDMI signal, a USB signal, a detection module, a control module, and a touch circuit corresponding to the standard VBO wire (4). Multiple signals are integrated into one wire through the first VBO socket (5), the second VBO socket (6), and the standard VBO wire (4); The daughter card module (3) and the Android main board module (1) are connected through the standard VBO wire (4).

2. The OPS and motherboard connection simplification device according to claim 1, wherein The wire specification of the standard VBO wire (4) is the same as that of the 4K VBO screen wire.

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