Heat exchanger and its manufacturing method

Abstract

A heat exchanger and a manufacturing method thereof, relating to the field of cooling devices; the heat exchanger and the manufacturing method thereof include a bottom chip, a top chip and a plurality of chip units; the chip units include short-side chips and long-side chips; short-side chips are arranged between the top chip and the topmost long-side chips; the bottom chip, the top chip, the short-side chips and the long-side chips all have substrates and flanges; heat sinks are connected between adjacent two substrates; the flange heights of adjacent two odd-numbered chip layers are both higher than the flange heights of the even-numbered chip layers between adjacent two odd-numbered chip layers; and the flanges of adjacent two odd-numbered chip layers and the flanges of the even-numbered chip layers between adjacent two odd-numbered chip layers form flange grooves; the flange grooves are filled with solder without copper. The purpose of the present invention is to provide a heat exchanger and a manufacturing method thereof, so as to solve to a certain extent the technical problem in the prior art that using copper as a welding material causes the engine to be easily damaged.

Description

Technical Field

[0001] The present invention relates to the field of cooling devices, and more particularly, to a heat exchanger and a manufacturing method thereof. Background Art

[0002] Existing heat exchangers use copper as a welding material for vacuum brazing. With the increase in engine power and the update of emission regulations, the oil temperature of the engine is getting higher and higher. Some additives in the oil accelerate the reaction with the copper solder as the temperature rises, resulting in more and more copper being precipitated into the engine oil; copper easily reacts with sulfur in the engine oil to form copper sulfide (CuS) precipitation, which deposits locally in the engine and is likely to damage other engine components. Summary of the Invention

[0003] An object of the present invention is to provide a heat exchanger and a manufacturing method thereof, so as to solve to a certain extent the technical problem in the prior art that using copper as a welding material causes easy damage to the engine.

[0004] Embodiments of the present invention are implemented as follows:

[0005] A heat exchanger includes a bottom chip, a top chip, and a plurality of chip units; the chip units sequentially include a short-side chip and a long-side chip from bottom to top; the short-side chip is disposed between the top chip and the long-side chip of the chip unit located at the topmost layer.

[0006] The bottom chip, the top chip, the short-side chip, and the long-side chip all have a substrate and flanges provided around the substrate, and the flanges extend upward above the substrate; the flanges of the bottom chip, the plurality of chip units, the short-side chip, and the top chip are sequentially connected from bottom to top; heat dissipation fins are connected between adjacent two substrates.

[0007] When the bottom chip, the top chip, the short-side chip, and the long-side chip are all used as chip layers, the flange heights of adjacent two odd-numbered chip layers are both higher than the flange heights of the even-numbered chip layers between adjacent two odd-numbered chip layers; and the flanges of adjacent two odd-numbered chip layers and the flanges of the even-numbered chip layers between adjacent two odd-numbered chip layers form flange grooves; the flange grooves are filled with copper-free solder.

[0008] In any of the above technical solutions, optionally, adjacent two substrates form a medium channel for medium flow.

[0009] The substrates of the short-side chips and the long-side chips respectively have two corresponding bosses and two corresponding recesses; the bottom chip has two corresponding bosses and two through holes of the bottom chip, and the top chip has two corresponding recesses and two through holes of the top chip; both the bosses and the recesses have through holes for the circulation of the medium;

[0010] Among two adjacent substrates, the boss on the lower-layer substrate is hermetically connected to the corresponding recess on the upper-layer substrate, and the through hole of the boss on the lower-layer substrate communicates with the through hole of the corresponding recess on the upper-layer substrate, so that the first medium channel and the second medium channel of the heat exchanger are arranged at intervals from top to bottom in sequence.

[0011] In any of the above technical solutions, optionally, the boss includes a boss bottom rising area, a boss flat area, and a boss top rising area provided with a through hole, which are connected in sequence from bottom to top, and the boss bottom rising area is fixedly connected to the substrate;

[0012] The recess includes a recess descending area and a recess flat area provided with a through hole, which are connected from top to bottom, the recess descending area is fixedly connected to the substrate, the boss flat area is connected to the corresponding recess flat area, the recess flat area is spaced from the boss top rising area, and the boss flat area, the recess flat area, and the boss top rising area form a communicating groove; or, the recess includes a recess descending area, a recess flat area, and a recess rising area provided with a through hole, which are connected in sequence, the recess descending area is fixedly connected to the substrate, both the recess descending area and the recess rising area are higher than the recess flat area, the boss flat area is connected to the corresponding recess flat area, the recess rising area is spaced from the boss top rising area, and the recess rising area, the boss flat area, and the boss top rising area form a communicating groove;

[0013] The communicating groove is filled with copper-free solder.

[0014] In any of the above technical solutions, optionally, a mounting plate is connected to the bottom of the bottom chip; the mounting plate has an inlet hole and an outlet hole of the first medium channel corresponding to the two through holes of the bottom chip, and the mounting plate has an inlet hole and an outlet hole of the second medium channel corresponding to the two bosses of the bottom chip; a copper-free solder is coated between the mounting plate and the bottom chip;

[0015] And / or, a top plate is connected to the top surface of the substrate of the top chip; the top plate is provided with four protrusions; the two recesses and the two through holes of the top chip respectively correspond to the four protrusions; a copper-free solder is coated between the top plate and the top chip.

[0016] In any of the above technical solutions, optionally, a plurality of claws are provided on the peripheral wall of the bottom chip through hole; the claws extend downward;

[0017] The claws are respectively clamped with the inlet hole or the outlet hole of the mounting plate.

[0018] In any of the above technical solutions, optionally, the flanging depth dimension of the short-side chip is h1, the flanging depth dimension of the long-side chip is h2, and the distance between two adjacent substrates is h3, then h2 > h1 + h3;

[0019] And / or, the flanging of the long-side chip of the topmost chip unit is flush with the flanging of the top chip.

[0020] In any of the above technical solutions, optionally, the heat sink includes multiple rows of heat dissipation parts; the heat dissipation parts are in the shape of trapezoidal waves;

[0021] A part of the top surfaces of two adjacent rows of the heat dissipation parts are connected, and a part of the bottom surfaces of two adjacent rows of the heat dissipation parts are connected.

[0022] In any of the above technical solutions, optionally, the heat sink is formed by stamping a sheet material;

[0023] And / or, solders without copper are coated on the top surface and the bottom surface of the heat sink.

[0024] In any of the above technical solutions, optionally, the included angle between the substrate and the flanging is 90° - 100°;

[0025] And / or, the solder without copper is nickel-based solder paste.

[0026] A manufacturing method of a heat exchanger is applicable to the above heat exchanger; the method includes,

[0027] Using a roller to coat nickel-based solder paste without copper on the top surface and the bottom surface of the heat sink.

[0028] The beneficial effects of the present invention mainly lie in:

[0029] The heat exchanger and its manufacturing method provided by the present invention have the bottom chip, multiple chip units with short-side chips and long-side chips, and the flangings of the short-side chips and the top chip are sequentially connected and stacked from bottom to top. By forming flanging grooves between the flangings of two adjacent odd-numbered chip layers and the flangings of the even-numbered chip layers between two adjacent odd-numbered chip layers, it is convenient to fill solder without copper in the flanging grooves, and then firmly weld the flangings of each layer of chips. To a certain extent, the heat exchanger is welded using solder without copper, and to a certain extent, the problem in the prior art that using copper as a welding material causes easy damage to the engine is solved.

[0030] To make the above objects, features, and advantages of the present application more obvious and understandable, the following provides preferred embodiments in conjunction with the accompanying drawings and detailed descriptions are as follows. Description of the Drawings

[0031] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0032] Figure 1 A perspective sectional view of the heat exchanger provided by the embodiment of the present invention;

[0033] Figure 2 is Figure 1 An enlarged view of area A of the heat exchanger shown;

[0034] Figure 3 An exploded view of the heat exchanger provided by the embodiment of the present invention;

[0035] Figure 4 A front sectional view of the heat exchanger provided by the embodiment of the present invention;

[0036] Figure 5 is Figure 4 An enlarged view of area B of the heat exchanger shown;

[0037] Figure 6 and Figure 7 Partial views of two perspectives of the heat exchanger provided by the embodiment of the present invention;

[0038] Figure 8 A partial view of another structure of the concave platform of the heat exchanger provided by the embodiment of the present invention;

[0039] Figure 9 A schematic structural view of the heat sink of the heat exchanger provided by the embodiment of the present invention;

[0040] Figure 10 A front view of the heat sink of the heat exchanger provided by the embodiment of the present invention;

[0041] Figure 11 A perspective view of the short-side chip or long-side chip provided by the embodiment of the present invention.

[0042] Icon: 1 - mounting plate; 2 - bottom chip; 201 - bottom chip through - hole; 202 - clamping jaw; 3 - heat sink; 301 - opening window; 4 - short - side chip; 5 - roller; 6 - long - side chip; 7 - top chip; 701 - top chip through - hole; 8 - top plate; 9 - substrate; 10 - flanging; 11 - flanging groove; 12 - boss; 1201 - boss bottom rising area; 1202 - boss flat area; 1203 - boss top rising area; 13 - concave; 1301 - concave descending area; 1302 - concave flat area; 1303 - concave rising area; 14 - connecting groove. Detailed implementation manners

[0043] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. The components of the embodiments of the present invention usually described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0044] Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed present invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0045] It should be noted that: Similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0046] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present invention is usually placed during use. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation of the present invention. In addition, the terms "first", "second", "third", etc. are only used for distinguishing descriptions and cannot be construed as indicating or implying relative importance.

[0047] In addition, the terms "horizontal", "vertical", "hanging", etc. do not mean that the components are required to be absolutely horizontal or hanging, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0048] In the description of the present invention, it should also be noted that, unless otherwise clearly specified and defined, the terms "arranged", "installed", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0049] The following will describe in detail some embodiments of the present invention with reference to the accompanying drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0050] Embodiment

[0051] Please refer to Figures 1 - 11 As shown, this embodiment provides a heat exchanger. Figure 1 is a perspective sectional view of the heat exchanger provided in this embodiment. Figure 4 is a front sectional view of the heat exchanger; for a clearer display of the structure, Figure 2 is Figure 1 an enlarged view of area A of the heat exchanger shown in Figure 5 is Figure 4 an enlarged view of area B of the heat exchanger shown in Figure 3 is an exploded view of the heat exchanger provided in this embodiment. Figures 6 - 8 is a partial schematic view of the mounting plate, bottom chip, short-side chip, and long-side chip provided in this embodiment. Among them, Figure 6 and Figure 7 are sectional views from two different perspectives, Figure 7 and Figure 8 are sectional views of two different structures of the concave platform. Figure 9 and Figure 10 are schematic views of the structure of the heat sink in this embodiment. Figure 11 is a perspective view of the short-side chip or long-side chip provided in this embodiment.

[0052] The heat exchanger provided in this embodiment can be an oil cooler without copper or a heat exchanger without copper used in other occasions. Optionally, the heat exchanger is a box-type heat exchanger.

[0053] The heat exchanger includes a first medium channel for flowing the first medium and a second medium channel for flowing the second medium; the heat exchanger is used for the first medium in the first medium channel and the second medium in the second medium channel to exchange heat energy with each other.

[0054] See Figures 1 - 11As shown, the heat exchanger includes a bottom chip 2, a top chip 7, and a plurality of chip units; the chip units sequentially include a short-side chip 4 and a long-side chip 6 from bottom to top; a short-side chip 4 is provided between the top chip 7 and the long-side chip 6 of the topmost chip unit.

[0055] The bottom chip 2, the top chip 7, the short-side chip 4, and the long-side chip 6 all have a substrate 9 and flanges 10 provided around the substrate 9, and the flanges 10 extend upward above the substrate 9; optionally, the substrate 9 and the flanges 10 have an included angle, that is, the flanges 10 are inclined to facilitate the stacking and connection of the flanges 10 of each layer. Optionally, the included angle between the substrate 9 and the flanges 10 is 90° - 100°; for example, the included angle between the substrate 9 and the flanges 10 is 91°, 95°, 97°, 99°, 100°, etc.

[0056] The flanges 10 of the bottom chip 2, the plurality of chip units, the short-side chip 4, and the top chip 7 are sequentially connected from bottom to top, that is, in the direction from bottom to top, the flanges 10 of the bottom chip 2, the short-side chip 4, the long-side chip 6, the short-side chip 4, the long-side chip 6, repeat several short-side chips 4 and long-side chips 6, and the flanges 10 of each layer of the short-side chip 4 and the top chip 7 are sequentially stacked and connected.

[0057] An adjacent two substrates 9 form a medium channel for the medium to flow through; a heat sink 3 is connected between the adjacent two substrates 9; through the heat sink 3, the heat exchange efficiency between the first medium and the second medium is improved.

[0058] When the bottom chip 2, the top chip 7, the short-side chip 4, and the long-side chip 6 are all used as chip layers, the height of the flanges 10 of adjacent two odd-numbered chip layers is higher than the height of the flanges 10 of the even-numbered chip layer between the adjacent two odd-numbered chip layers; that is to say, the height of the flanges 10 of the even-numbered chip layer is lower than the height of the flanges 10 of the two odd-numbered chip layers connected thereto; for example, the height of the flanges 10 of the second layer is lower than the height of the flanges 10 of the first layer and the third layer, and again, the height of the flanges 10 of the fourth layer is lower than the height of the flanges 10 of the third layer and the fifth layer. In this embodiment, the first layer is the bottom chip 2 at the bottommost layer, and then the second layer, the third layer, the fourth layer, and so on, are sequentially the short-side chip 4, the long-side chip 6, the short-side chip 4, the long-side chip 6, repeat several short-side chips 4 and long-side chips 6, the short-side chip 4, and the top chip 7 from bottom to top; those skilled in the art can understand that in this embodiment, the first layer can also be the top chip 7 at the topmost layer, and the principle is the same as that when the first layer is the bottom chip 2 at the bottommost layer, and will not be elaborated here.

[0059] The flanges 10 of adjacent two odd-numbered chip layers and the flanges 10 of the even-numbered chip layer between the adjacent two odd-numbered chip layers form a flange groove 11; for example, the flanges 10 of the first layer, the third layer, and the second layer form a flange groove 11; again, the flanges 10 of the third layer, the fifth layer, and the fourth layer form a flange groove 11.

[0060] See Figure 2 As shown, in this embodiment, the odd-numbered chip layer includes the bottom chip 2, the top chip 7, and the long-side chip 6; the even-numbered chip layer is the short-side chip 4. That is, the height of the flanging 10 of the bottom chip 2 and the height of the flanging 10 of the long-side chip 6 of the chip unit in the bottom layer are both higher than the height of the flanging 10 of the short-side chip 4 of the chip unit in the bottom layer; the flanging 10 of the bottom chip 2, the flanging 10 of the short-side chip 4 of the chip unit in the bottom layer, and the flanging 10 of the long-side chip 6 of the chip unit in the bottom layer form a flanging groove 11. Among two adjacent chip units, the height of the flanging 10 of the two long-side chips 6 is both higher than the height of the flanging 10 of the short-side chip 4 located between the two long-side chips 6; and the flanging 10 of the short-side chip 4 and the flanging 10 of the two long-side chips 6 form a flanging groove 11. The height of the flanging 10 of the long-side chip 6 of the chip unit in the top layer and the height of the flanging 10 of the top chip 7 are both higher than the height of the flanging 10 of the short-side chip 4 of the chip unit in the top layer; the flanging 10 of the long-side chip 6 of the chip unit in the top layer, the flanging 10 of the short-side chip 4 of the chip unit in the top layer, and the height of the flanging 10 of the top chip 7 form a flanging groove 11.

[0061] Optionally, the depth dimension of the flanging 10 of the bottom chip 2 is the same as the depth dimension of the flanging 10 of the long-side chip 6.

[0062] Optionally, the depth dimension of the flanging 10 of the short-side chip 4 is h1, the depth dimension of the flanging 10 of the long-side chip 6 is h2, and the distance between two adjacent substrates 9 is h3, then h2 > h1 + h3; by h2 > h1 + h3, so that the short-side chip 4 forms a flanging groove 11 with the chips in the adjacent odd-numbered chip layer, so that the short-side chip 4 forms a flanging groove 11 with the adjacent bottom chip 2, top chip 7, and long-side chip 6.

[0063] Optionally, the flanging 10 of the long-side chip 6 of the chip unit in the top layer is flush or substantially flush with the flanging 10 of the top chip 7 to improve the aesthetics of the heat exchanger.

[0064] The flanging groove 11 is filled with a copper-free solder. Optionally, the copper-free solder is a nickel-based solder paste; since it is difficult and costly to manufacture nickel-based solder sheets, the nickel-based solder paste is selected when using the copper-free nickel-based solder for brazing in this embodiment. Generally, existing copper-based oil coolers use copper solder sheets or form a whole by compounding copper on the chip surface for assembly and brazing. As the engine oil temperature gets higher and higher, some additives in the oil accelerate the reaction with the copper solder as the temperature rises, resulting in more and more copper being precipitated into the engine oil, which is likely to damage other engine components; the production of nickel-based solder sheets in the existing nickel-based solder is difficult and costly, and the use of nickel-based solder paste in this embodiment can greatly improve the feasibility and cost. However, there must be a certain space to place the nickel-based solder paste when coating the nickel-based solder paste on each part. It is difficult to place the nickel-based solder paste on the flanging around the chip in the existing technology. In this embodiment, the flanging groove 11 solves the placement position of the solder paste required for the weld seams around the chip.

[0065] In the heat exchanger of this embodiment, the bottom chip 2, multiple chip units with short-side chips 4 and long-side chips 6, and the flangings 10 of the short-side chips 4 and the top chip 7 are connected and stacked in sequence from bottom to top. The flanging grooves 11 are formed by the flangings 10 of adjacent two odd-numbered chip layers and the flangings 10 of the even-numbered chip layers between adjacent two odd-numbered chip layers, so as to facilitate filling the copper-free solder in the flanging grooves 11, and then firmly welding the flangings 10 of each layer of chips. To a certain extent, the heat exchanger is welded with a copper-free solder, and to a certain extent, the problem that the use of copper as a welding material in the existing technology causes the engine to be easily damaged is solved.

[0066] See Figures 1 - 8 、 Figure 11 As shown, in the alternative solution of this embodiment, adjacent two substrates 9 form a medium channel for medium flow;

[0067] The substrates 9 of the short-side chips 4 and the long-side chips 6 respectively have two corresponding bosses 12 and two corresponding recesses 13; the bottom chip 2 has two corresponding bosses 12 and two bottom chip through-holes 201, and the top chip 7 has two corresponding recesses 13 and two top chip through-holes 701; both the bosses 12 and the recesses 13 have through-holes for medium flow;

[0068] Among two adjacent substrates 9, the boss 12 on the lower-layer substrate 9 is hermetically connected to the corresponding concave groove 13 on the upper-layer substrate 9, so that the medium channels on the lower-layer substrate 9 are disconnected from the medium channels on the upper-layer substrate 9; the through hole of the boss 12 on the lower-layer substrate 9 communicates with the through hole of the corresponding concave groove 13 on the upper-layer substrate 9, so that the medium channels on the layer lower than the lower-layer substrate 9 communicate with the medium channels on the upper-layer substrate 9; thus, the first medium channel and the second medium channel of the heat exchanger are arranged at intervals from top to bottom in sequence. For example, if the boss 12 on the third-layer substrate 9 is hermetically connected to the corresponding concave groove 13 on the fourth-layer substrate 9, the medium channel of the third-layer substrate 9 is disconnected from the medium channel of the fourth layer; if the through hole of the boss 12 on the third-layer substrate 9 communicates with the through hole of the corresponding concave groove 13 on the fourth-layer substrate 9, the medium channel of the second-layer substrate 9 communicates with the medium channel of the fourth layer. Another example is that if the boss 12 on the fourth-layer substrate 9 is hermetically connected to the corresponding concave groove 13 on the fifth-layer substrate 9, the medium channel of the fourth-layer substrate 9 is disconnected from the medium channel of the fifth layer; if the through hole of the boss 12 on the fourth-layer substrate 9 communicates with the through hole of the corresponding concave groove 13 on the fifth-layer substrate 9, the medium channel of the third-layer substrate 9 communicates with the medium channel of the fifth layer, and so on; that is to say, the medium channels of the odd chip layers are connected in sequence, and the medium channels of the even chip layers are connected in sequence. Optionally, the medium channels of the odd chip layers are the first medium channels of the heat exchanger, and the medium channels of the even chip layers are the second medium channels of the heat exchanger; or, the medium channels of the even chip layers are the first medium channels of the heat exchanger, and the medium channels of the odd chip layers are the second medium channels of the heat exchanger.

[0069] See Figure 2 and Figure 5 As shown, in an alternative solution of this embodiment, the boss 12 includes a boss bottom rising area 1201, a boss flat area 1202, and a boss top rising area 1203 provided with a through hole, which are connected in sequence from bottom to top. The boss bottom rising area 1201 is fixedly connected to the substrate 9; optionally, the cross-section of the boss 12 is in a shape such as a circle, rectangle, ellipse, etc. with a through hole, and the shape of the concave groove 13 corresponds to the shape of the boss 12; optionally, the shape of the boss 12 is a stepped circular cylindrical shape to facilitate the production and processing of the boss 12. Correspondingly, the shape of the concave groove 13 is a stepped circular cylindrical shape. Optionally, the shapes of the boss bottom rising area 1201, the boss flat area 1202, and the boss top rising area 1203 are all circular cylindrical shapes.

[0070] See Figure 2 、 Figure 5 and Figure 7As shown, optionally, the concave platform 13 includes a concave platform descending area 1301 and a concave platform planar area 1302 provided with a through hole, which are connected from top to bottom. The concave platform descending area 1301 is fixedly connected to the substrate 9. The convex platform planar area 1202 is connected to the corresponding concave platform planar area 1302. The concave platform planar area 1302 and the convex platform top ascending area 1203 are spaced apart, and the convex platform planar area 1202, the concave platform planar area 1302, and the convex platform top ascending area 1203 form a communicating groove 14;

[0071] In this embodiment, the following structure can also be adopted to form the communicating groove 14; specifically, see Figure 8 As shown, the concave platform 13 includes a concave platform descending area 1301, a concave platform planar area 1302, and a concave platform ascending area 1303 provided with a through hole, which are connected in sequence. The concave platform descending area 1301 is fixedly connected to the substrate 9; both the concave platform descending area 1301 and the concave platform ascending area 1303 are higher than the concave platform planar area 1302, that is, the concave platform descending area 1301, the concave platform planar area 1302, and the concave platform ascending area 1303 form a U-shaped with the opening facing upward; the convex platform planar area 1202 is connected to the corresponding concave platform planar area 1302. The concave platform ascending area 1303 and the convex platform top ascending area 1203 are spaced apart, and the concave platform ascending area 1303, the convex platform planar area 1202, and the convex platform top ascending area 1203 form a communicating groove 14;

[0072] The communicating groove 14 is filled with copper-free solder. By filling the communicating groove 14 with copper-free solder, the consistency of the solder volume is better, improving the vacuum brazing quality between the convex platform 12 and the groove; it can also avoid solder offset and prevent the solder from protruding from the base after welding, which may affect the installation of the heat sink 3.

[0073] See Figure 1 and Figure 3 As shown, in an alternative solution of this embodiment, the bottom of the bottom chip 2 is connected to a mounting plate 1; through the mounting plate 1, it is convenient for the installation of the heat exchanger. Optionally, the mounting plate 1 has mounting holes.

[0074] Optionally, the mounting plate 1 has an inlet hole and an outlet hole of the first medium channel corresponding to the two through holes 201 of the bottom chip, and the mounting plate 1 has an inlet hole and an outlet hole of the second medium channel corresponding to the two convex platforms 12 of the bottom chip 2.

[0075] Optionally, a copper-free solder is coated between the mounting plate 1 and the bottom chip 2 to vacuum brazingly connect the mounting plate 1 and the bottom chip 2.

[0076] See Figure 1 and Figure 2As shown, optionally, a plurality of claws 202 are provided on the peripheral wall of the bottom chip through hole 201; the claws 202 extend downward; the claws are respectively clamped with the inlet hole or the outlet hole of the mounting plate 1. The mounting plate 1 is positioned and connected through the claws to improve the connection convenience between the mounting plate 1 and the bottom chip 2 and improve the assembly accuracy of the mounting plate 1 and the bottom chip 2.

[0077] See Figure 1 and Figure 3 As shown, in an alternative embodiment of the present embodiment, a top plate 8 is connected to the top surface of the substrate 9 of the top chip 7; the top plate 8 is provided with four protrusions; the two concave platforms 13 and the two top chip through holes 701 of the top chip 7 respectively correspond to the four protrusions; through the protrusions, the strength of the top of the heat exchanger is increased.

[0078] Optionally, a copper-free solder is coated between the top plate 8 and the top chip 7 to enable vacuum brazing connection between the top plate 8 and the top chip 7.

[0079] See Figure 3 、 Figure 9 and Figure 10 As shown, in an alternative embodiment of the present embodiment, the heat sink 3 includes multiple rows of heat dissipation parts; the heat dissipation parts are in a trapezoidal wave shape; a part of the top surfaces of two adjacent rows of heat dissipation parts are connected, and a part of the bottom surfaces of two adjacent rows of heat dissipation parts are connected; that is, the heat sink 3 is a staggered trapezoidal wave structure. On the top and bottom of the trapezoidal wave, nickel-based solder paste is coated on the top and bottom surfaces of the heat sink 3 through a roller 5 for brazing with adjacent chips.

[0080] Optionally, the heat sink 3 is formed by stamping a sheet material; optionally, the heat sink 3 is formed by stamping a thin plate and forms a structure of rows of trapezoidal waves, and concave and convex windows 301 are formed in each trapezoidal wave so that the medium can pass through the heat sink 3.

[0081] See Figures 1 - 4 As shown, in an alternative embodiment of the present embodiment, copper-free solder is coated on the top and bottom surfaces of the heat sink 3 to enable vacuum brazing between the heat sink 3 and the substrates 9 of adjacent chips. Optionally, nickel-based solder paste is coated on the top and bottom surfaces of the heat sink 3 through a roller for welding.

[0082] The heat exchanger of the present embodiment is brazed in a vacuum brazing furnace.

[0083] The present embodiment also provides a manufacturing method of a heat exchanger, which is applicable to the above-mentioned heat exchanger; the method includes,

[0084] Use a roller to coat the top and bottom surfaces of the heat sink with copper-free solder paste. Optionally, use a roller to coat the top and bottom surfaces of the heat sink with nickel-based solder paste. Since the heat sink has a trapezoidal wave structure, directly coating its top and bottom surfaces will cause a great waste of nickel-based solder paste. However, by using a roller for coating, it is possible to coat only the top and bottom surfaces, and there will be no excess solder paste on the other parts, thus saving the usage amount of the solder paste.

[0085] The manufacturing method of the heat exchanger provided in this embodiment is applicable to the above-mentioned heat exchanger, and the technical features of the heat exchanger disclosed above are also applicable to the manufacturing method of this heat exchanger. The technical features of the heat exchanger already disclosed above will not be described repeatedly. The manufacturing method of the heat exchanger described in this embodiment has the advantages of the above-mentioned heat exchanger, and the advantages of the above-mentioned heat exchanger disclosed above will not be described repeatedly here.

[0086] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A heat exchanger, characterized in that, it includes a bottom chip, a top chip and a plurality of chip units; the chip units successively include a short-side chip and a long-side chip from bottom to top; a short-side chip is arranged between the top chip and the long-side chip of the chip unit located at the topmost layer; the bottom chip, the top chip, the short-side chip and the long-side chip all have a substrate and flanges arranged around the substrate, and the flanges extend upward above the substrate; the flanges of the bottom chip, the plurality of chip units, the short-side chip and the top chip are connected successively from bottom to top; heat sinks are connected between adjacent two substrates; when the bottom chip, the top chip, the short-side chip and the long-side chip all serve as chip layers, the flange heights of adjacent two odd-numbered chip layers are all higher than the flange heights of the even-numbered chip layer between adjacent two odd-numbered chip layers; and the flanges of adjacent two odd-numbered chip layers and the flanges of the even-numbered chip layer between adjacent two odd-numbered chip layers form a flange groove; the flange groove is filled with copper-free solder; the substrates of the short-side chip and the long-side chip respectively have two corresponding bosses and two recesses; the boss includes a boss bottom rising area, a boss flat area and a boss top rising area provided with a through hole, which are connected successively from bottom to top, and the boss bottom rising area is fixedly connected to the substrate; the recess includes a recess descending area and a recess flat area provided with a through hole, which are connected from top to bottom, the recess descending area is fixedly connected to the substrate, the boss flat area is connected to the corresponding recess flat area, the recess flat area and the boss top rising area are spaced apart, and the boss flat area, the recess flat area and the boss top rising area form a communicating groove; or, the recess includes a recess descending area, a recess flat area and a recess rising area provided with a through hole, which are connected successively, the recess descending area is fixedly connected to the substrate, both the recess descending area and the recess rising area are higher than the recess flat area, the boss flat area is connected to the corresponding recess flat area, the recess rising area and the boss top rising area are spaced apart, and the recess rising area, the boss flat area and the boss top rising area form a communicating groove; the top surface of the substrate of the top chip is connected with a top plate.

2. The heat exchanger according to claim 1, characterized in that, adjacent two substrates form a medium channel for medium flow; the bottom chip has two corresponding bosses and two bottom chip through holes, and the top chip has two corresponding recesses and two top chip through holes; both the boss and the recess have through holes for medium flow; in adjacent two substrates, the boss on the lower-layer substrate is hermetically connected to the corresponding recess on the upper-layer substrate, and the through hole of the boss on the lower-layer substrate is communicated with the through hole of the corresponding recess on the upper-layer substrate, so that the first medium channel and the second medium channel of the heat exchanger are arranged at intervals from top to bottom in turn.

3. The heat exchanger according to claim 2, characterized in that, The connecting groove is filled with copper-free solder.

4. The heat exchanger according to claim 2, characterized in that a mounting plate is connected to the bottom of the bottom chip; the mounting plate has an inlet hole and an outlet hole of the first medium channel corresponding to the through holes of the two bottom chips, and the mounting plate has an inlet hole and an outlet hole of the second medium channel corresponding to the two bosses of the bottom chip; a copper-free solder is coated between the mounting plate and the bottom chip; the top plate is provided with four protrusions; the two concave platforms and the two through holes of the top chip respectively correspond to the four protrusions; a copper-free solder is coated between the top plate and the top chip.

5. The heat exchanger according to claim 4, characterized in that a plurality of claws are provided on the peripheral wall of the through hole of the bottom chip; the claws extend downward; the claws are respectively clamped with the inlet hole or the outlet hole of the mounting plate.

6. The heat exchanger according to any one of claims 1-5, characterized in that the flanging depth dimension of the short-side chip is h1, the flanging depth dimension of the long-side chip is h2, and the distance between two adjacent substrates is h3, then h2 > h1 + h3; the flanging of the long-side chip of the topmost chip unit is flush with the flanging of the top chip.

7. The heat exchanger according to any one of claims 1-5, characterized in that the heat sink includes multiple rows of heat dissipation parts; the heat dissipation parts are in a trapezoidal wave shape; a part of the top surfaces of two adjacent rows of the heat dissipation parts are connected, and a part of the bottom surfaces of two adjacent rows of the heat dissipation parts are connected.

8. The heat exchanger according to any one of claims 1-5, characterized in that the heat sink is formed by stamping a sheet material; copper-free solder is coated on the top surface and the bottom surface of the heat sink.

9. The heat exchanger according to any one of claims 1-5, characterized in that the included angle between the substrate and the flanging is 90° - 100°; the copper-free solder is nickel-based solder paste.

10. A method for manufacturing a heat exchanger, characterized in that it is applicable to the heat exchanger according to any one of claims 1-9; the method includes using a roller to coat nickel-based solder paste on the top surface and the bottom surface of the heat sink.

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