Sensor, manufacturing method thereof, and detection device

Abstract

The present invention discloses a sensor, a manufacturing method thereof, and a detection device. The sensor includes a light-transmitting plate assembly; an optoelectronic module, one side of the optoelectronic module for emitting light and sensing light is attached to the surface of the light-transmitting plate assembly so that the optical path of the optoelectronic module can pass through the light-transmitting plate assembly, and the optoelectronic module is provided with electrically connected pins; and a light-shielding layer, the light-shielding layer covers the side of the optoelectronic module facing away from the light-transmitting plate assembly and abuts against the light-transmitting plate assembly, and the electrically connected pins are exposed through the light-shielding layer. The technical solution of the present invention aims to ensure the uniform flatness of the side of the optoelectronic module for emitting light and sensing light, improve the emission and reception effects of the optical path, and thus improve the detection accuracy of the sensor.

Description

Technical Field

[0001] The present invention relates to the technical field of sensors, and particularly to a sensor, a manufacturing method thereof, and a detection device. Background Art

[0002] At present, with the development of science and technology, products focusing on health applications have gradually emerged widely in society. The technological progress of integrated circuit technology and microchip manufacturing has further led to the emergence of numerous products such as smart wearable devices, and sensors using optoelectronic modules for information detection have also been gradually designed.

[0003] In exemplary technologies, the optoelectronic module of an optical sensor is generally first welded to a circuit board assembly through pins. Due to the possible length tolerances of the pins, the setting tolerances of the pads, and the welding errors during actual welding, these errors cause the flatness of the side of the optoelectronic module for light emission and light sensing to be uneven after welding, affecting the light path emission and reception effects, and thus affecting the detection accuracy of the sensor.

[0004] The above is only used to assist in understanding the technical solution of the present application and does not represent an admission of existing technology. Summary of the Invention

[0005] The main object of the present invention is to provide a sensor, a manufacturing method thereof, and a detection device, aiming to ensure the uniform flatness of the side of the optoelectronic module for light emission and light sensing, improve the light path emission and reception effects, and thus improve the detection accuracy of the sensor.

[0006] To achieve the above object, the present invention provides a sensor, including:

[0007] A light substrate assembly;

[0008] An optoelectronic module, the side of the optoelectronic module for light emission and light sensing is adhered to the surface of the light-transmitting plate assembly, so that the light path of the optoelectronic module can pass through the light-transmitting plate assembly, and the optoelectronic module is provided with electrical connection pins; and

[0009] A light-shielding layer, the light-shielding layer covers the side of the optoelectronic module facing away from the light-transmitting plate assembly and abuts against the light-transmitting plate assembly, and the electrical connection pins are exposed through the light-shielding layer.

[0010] In some embodiments of the present invention, the light-shielding layer is formed with a communication hole, and the electrical connection pins pass through the communication hole.

[0011] In some embodiments of the present invention, the sensor further includes a metal layer, the metal layer is disposed on the surface of the light-shielding layer facing away from the light-transmitting plate assembly and is electrically connected to the electrical connection pins.

[0012] In some embodiments of the present invention, the optoelectronic module includes a light emitter and a light receiver spaced apart from the light emitter. The light-emitting optical path of the emitter and the light-receiving optical path of the light receiver both pass through the light-transmitting plate assembly;

[0013] The electrical connection pins include a first pin and a second pin. The first pin is connected to the light emitter, and the second pin is connected to the light receiver. One end of the first pin facing away from the light emitter and one end of the second pin facing away from the light receiver are both exposed to the light-shielding layer.

[0014] In some embodiments of the present invention, the light-transmitting plate assembly includes a light-transmitting plate and an optical adhesive provided on one surface of the light-transmitting plate. The side of the optoelectronic module for light emission and light sensing is adhered to the optical adhesive, and the light-shielding layer abuts against the optical adhesive.

[0015] The present invention also provides a method for manufacturing a sensor. The method for manufacturing the sensor includes the following steps:

[0016] Provide a light-transmitting plate, and adhere the side of the optoelectronic module for light emission and light sensing to one surface of the light-transmitting plate;

[0017] Provide a light-shielding layer on the surface of the light-transmitting plate provided with the optoelectronic module, so that the light-shielding layer covers the optoelectronic module and the light-transmitting plate;

[0018] Form a through-hole in the light-shielding layer that communicates with the electrical connection terminals of the optoelectronic module;

[0019] Form electrical connection pins in the through-hole. One end of the electrical connection pin is connected to the electrical connection terminal of the optoelectronic module.

[0020] In some embodiments of the present invention, the step of providing a light-transmitting plate and adhering the side of the optoelectronic module for light emission and light sensing to one surface of the light-transmitting plate includes:

[0021] Control the processing platform to fix the light-transmitting plate;

[0022] Coat an optical adhesive on the light-transmitting plane of the light-transmitting plate;

[0023] Mount the optoelectronic module on the light-transmitting plane coated with the optical adhesive on the light-transmitting plate. The optoelectronic module includes a light emitter and a light receiver.

[0024] In some embodiments of the present invention, the step of providing a light-shielding layer on the surface of the light-transmitting plate provided with the optoelectronic module, so that the light-shielding layer covers the optoelectronic module and the light-transmitting plate includes:

[0025] The coater aligns with the light-transmitting plate through the alignment marks on the light-transmitting plate;

[0026] Adjust the distance between the nozzle of the coater and the light-transmitting plate;

[0027] Control the nozzle to coat the light-shielding layer on the specified area through a control system;

[0028] When the thickness of the light-shielding layer on the specified area of the light-transmitting plate reaches a predetermined value, the control system controls the nozzle to stop coating.

[0029] In some embodiments of the present invention, the step of forming a communication hole connecting the electrical connection terminal of the optoelectronic module in the light-shielding layer includes:

[0030] Form a communication hole in the light-shielding layer through a photolithography process;

[0031] Alternatively, form a communication hole in the light-shielding layer by laser drilling.

[0032] In some embodiments of the present invention, after the step of forming an electrical connection pin in the communication hole, wherein one end of the electrical connection pin is connected to the electrical connection terminal of the optoelectronic module, the following steps are further included:

[0033] A metal layer connected to the electrical connection pin is provided on the surface of the light-shielding layer facing away from the light-transmitting plate;

[0034] A welding bump is formed on the surface of the metal layer facing away from the light-shielding layer.

[0035] The present invention also provides a detection device, the detection device includes a sensor, and the sensor includes:

[0036] A light-transmitting plate assembly;

[0037] An optoelectronic module, the side of the optoelectronic module for light emission and light sensing is adhered to the surface of the light-transmitting plate assembly, so that the optical path of the optoelectronic module can pass through the light-transmitting plate assembly, and the optoelectronic module is provided with electrical connection pins; and

[0038] A light-shielding layer, the light-shielding layer covers the side of the optoelectronic module facing away from the light-transmitting plate assembly and abuts against the light-transmitting plate assembly, and the electrical connection pins are exposed from the light-shielding layer to form the above-mentioned sensor;

[0039] Alternatively, the detection device includes a sensor, the sensor is manufactured by the manufacturing method of the sensor, and the manufacturing method of the sensor includes the following steps:

[0040] Provide a light-transmitting plate, and adhere the side of the optoelectronic module for light emission and light sensing to a surface of the light-transmitting plate;

[0041] A light-shielding layer is provided on the surface of the light-transmitting plate provided with the optoelectronic module, so that the light-shielding layer covers the optoelectronic module and the light-transmitting plate;

[0042] Form a communication hole connecting the electrical connection terminal of the optoelectronic module in the light-shielding layer;

[0043] Form electrical connection pins in the communication holes, wherein one end of the electrical connection pins is connected to the electrical connection terminals of the optoelectronic module.

[0044] The technical solution of the present invention is to provide an optoelectronic module on one surface of the light-transmitting plate assembly. Specifically, the side of the optoelectronic module for light emission and light sensing is adhered to the surface of the light-transmitting plate assembly. Thus, the optical path of the optoelectronic module can pass through the light-transmitting plate assembly. With this arrangement, the side of the optoelectronic module for light emission and light sensing is exactly flush with the light-transmitting plate assembly. As long as the placement of the light-transmitting plate assembly is flat, the installation of the optoelectronic module can be ensured to be stable, and further, the flatness of the side of the optoelectronic module for light emission and light sensing can be ensured to be uniform. Further, by providing a light-shielding layer covering the side of the optoelectronic module facing away from the light-transmitting plate assembly and abutting against the light-transmitting plate assembly, the free end of the optoelectronic module is fixed, so that the side of the optoelectronic module for light emission and light sensing is more firmly adhered to the surface of the light-transmitting plate assembly, further ensuring the flatness of the light emission and light reception of the optoelectronic module. And it prevents external light from interfering with the optical path of the optoelectronic module, improving the detection accuracy of the optoelectronic module. Also, by exposing the electrical connection pins of the optoelectronic module to the light-shielding layer, when it is necessary to connect the sensor to a circuit board or other electronic components, the electrical connection pins can be electrically connected to the circuit board or other electronic components. In this way, the technical solution of the present invention can ensure the uniform flatness of the side of the optoelectronic module for light emission and light sensing, improve the light emission and reception effects of the optical path, and further improve the detection accuracy of the sensor. Description of the Drawings

[0045] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0046] Figure 1 It is a schematic structural diagram of an embodiment of the present invention for arranging an optoelectronic module and a light-transmitting substrate assembly of the sensor;

[0047] Figure 2 It is a schematic structural diagram of an embodiment of the present invention for arranging an optoelectronic module, a light-transmitting substrate assembly and a light-shielding layer of the sensor;

[0048] Figure 3 It is a schematic structural diagram of an embodiment of the present invention for the sensor;

[0049] Figure 4 It is a schematic structural diagram of an embodiment of the present invention for the sensor;

[0050] Figure 5 Flow chart of an embodiment of the manufacturing method of the sensor of the present invention;

[0051] Figure 6 Flow chart of another embodiment of the manufacturing method of the sensor of the present invention;

[0052] Figure 7 Flow chart of another embodiment of the manufacturing method of the sensor of the present invention;

[0053] Figure 8 Flow chart of another embodiment of the manufacturing method of the sensor of the present invention.

[0054] Explanation of the reference numerals in the attached drawings:

[0055] Label Name Label Name 100 Sensor 22 Light emitter 10 [[ID=DB14]]Light-transmitting substrate assembly 23 Light receiver 11 Light-transmitting plate 30 Light-shielding layer 12 Optical adhesive 31 Relief mounting groove 20 Optoelectronic module 40 Metal layer 21 Electric connection pin 50 Welding bump 211 First pin 60 Controller 212 Second pin 70 Sealing member

[0056] The realization of the object, functional features and advantages of the present invention will be further described with reference to the embodiments and the attached drawings. Detailed implementation manners

[0057] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art without creative efforts based on the embodiments of the present invention belong to the scope protected by the present invention.

[0058] It should be noted that all the directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the attached drawings). If the specific posture changes, the directional indications will also change accordingly.

[0059] In addition, the descriptions involving "first", "second", etc. in the present invention are only for descriptive purposes, and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement them. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0060] Referring to Figures 1 to 4 , the present invention provides a sensor 100, including:

[0061] A light-transmitting substrate assembly 10;

[0062] An optoelectronic module 20, one side of the optoelectronic module 20 for emitting and sensing light is adhered to the surface of the light-transmitting substrate assembly 10, so that the optical path of the optoelectronic module 20 can pass through the light-transmitting substrate assembly 10, and the optoelectronic module 20 is provided with electrical connection pins 21; and

[0063] A light-shielding layer 30, the light-shielding layer 30 covers the side of the optoelectronic module 20 facing away from the light-transmitting substrate assembly 10 and abuts against the light-transmitting substrate assembly 10, and the electrical connection pins 21 are exposed through the light-shielding layer 30.

[0064] In one embodiment, the sensor 100 can be a PPG sensor 100 (Photoplethysmography), which uses the principles of optical incidence, absorption, and reflection, and calculates the optical signals through operations to obtain information such as the user's pulse, respiration, blood oxygen, and blood pressure.

[0065] In one embodiment of the present application, the sensor 100 further includes a temperature sensor 100. The temperature sensor 100 is disposed within the light-shielding layer 30, and the electrical connection pins 21 of the temperature sensor 100 are exposed through the light-shielding layer 30 to facilitate its electrical connection with an external circuit. The temperature sensor 100 further includes a temperature detection head. When the sensor 100 is in use, the temperature detection head is close to the user's skin to detect the user's body temperature. Thus, by detecting the user's body temperature, the user's exercise state can be assisted in judgment based on the user's body temperature, improving the measurement accuracy of the user's exercise state.

[0066] In one embodiment of the present application, the sensor 100 further includes a memory, which can be configured to store the generated sensor 100 data (e.g., information of the IMU, information of the temperature sensor 100, or other physiological information), or information representing acceleration and / or temperature, and / or other physiological information derived from the sensor 100 data. Additionally, according to some embodiments, the memory can be configured to store computer program code for controlling the controller 60. In some embodiments, the memory can be a volatile memory and / or a non-volatile memory. For example, the memory can include flash memory, static memory, solid-state memory, removable memory cards, or any combination thereof. In certain examples, the memory can be removed from the sensor 100. In some embodiments, for the sensor 100, the memory can be a local module of the sensor 100, while in other examples, the memory can be a remote module of the sensor 100. For example, the memory can be the internal memory of a smartphone, which communicates with the sensor 100, either wired or wirelessly, optically, for example, via radio frequency communication protocols including, for example, WiFi, Zigbee, Bluetooth, medical telemetry, and near field communication (NFC), and / or using infrared or non-infrared LEDs.

[0067] In one embodiment of the present application, the sensor 100 further includes a wireless transmission device, which is disposed within the light-shielding layer 30, and the electrical connection pins 21 of the wireless transmission device are exposed outside the light-shielding layer 30, facilitating its electrical connection with an external circuit and used for the communication connection between the sensor 100 and a mobile terminal. Thus, the sensor 100 can communicate optically (e.g., wirelessly) with a user device such as a smartphone via an application (e.g., program) running on the smartphone. Setting the wireless transmission device enables the sensor 100 to transmit the measurement information of the user's motion state in real time, facilitating the user to understand their motion state information in real time.

[0068] In one embodiment of the present application, the sensor 100 further includes a power source, which can be any type of rechargeable (or disposable) power source for an electronic device, such as, but not limited to, one or more electrochemical cells or batteries, one or more photovoltaic cells, or a combination thereof. In the case of photovoltaic cells, these cells can charge one or more electrochemical cells and / or batteries. According to some embodiments, the power source can be a small battery or capacitor that stores sufficient electrical energy to power on the device and execute a predetermined program sequence before the energy is depleted, such as a sensing device based on NFC (Near Field Communication) or RFID (Radio Frequency Identification).

[0069] In some embodiments of the present application, the material of the light-shielding layer 30 can be a black high-temperature-resistant LCP (Liquid Crystal Polymer) material. The LCP material has properties such as high strength, high rigidity, high temperature resistance, and electrical insulation. On the one hand, it can better shield the optoelectronic module 20 from light. On the other hand, it can protect the optoelectronic module 20 and enable the electrical connection pins 21 of the optoelectronic module 20 to have good electrical connection, avoiding short circuits and improving the working stability of the sensor 100. In another embodiment, the material of the light-shielding layer 30 can be a black high-temperature-resistant PBO (Poly-p-phenylene benzobisoxazole). PBO has very excellent physical and mechanical properties and chemical properties. Its strength and modulus are twice that of Kevlar fibers, not only exceeding steel fibers but also being superior to carbon fibers. Its moisture absorption resistance is much better than aromatic fibers, it has good chemical inertness, is resistant to electron bombardment, laser irradiation, has outstanding UV stability, and has a lower and more stable dielectric constant than aromatic fibers. The impact resistance, friction resistance, and dimensional stability of PBO fibers are all excellent, and it is light and soft. Therefore, on the one hand, it can better shield the optoelectronic module 20 from light. On the other hand, it can protect the optoelectronic module 20 and enable the electrical connection pins 21 of the optoelectronic module 20 to have good electrical connection, avoiding short circuits and improving the working stability of the sensor 100.

[0070] It should be noted that when the communication holes are not provided, the electrical connection pins 21 can be led out from the connection between the light-transmitting substrate assembly 10 and the light-shielding layer 30, thus saving processes.

[0071] The technical solution of the present invention is to provide an optoelectronic module 20 on one surface of a light-transmitting substrate assembly 10. Specifically, the side of the optoelectronic module 20 for light emission and light sensing is adhered to the surface of the light-transmitting substrate assembly 10. Thus, the optical path of the optoelectronic module 20 can pass through the light-transmitting substrate assembly 10. With this arrangement, the side of the optoelectronic module 20 for light emission and light sensing is completely flush with the light-transmitting substrate assembly 10. As long as the placement of the light-transmitting substrate assembly 10 is flat, the installation of the optoelectronic module 20 can be ensured to be stable, and further, the flatness of the side of the optoelectronic module 20 for light emission and light sensing can be made uniform. Further, by providing a light-shielding layer 30 covering the side of the optoelectronic module 20 facing away from the light-transmitting substrate assembly 10 and abutting against the light-transmitting substrate assembly 10, the free end of the optoelectronic module 20 is fixed, so that the side of the optoelectronic module 20 for light emission and light sensing is more firmly adhered to the surface of the light-transmitting substrate assembly 10, further ensuring the flatness of the light emission and light reception of the optoelectronic module 20. And it prevents external light from interfering with the optical path of the optoelectronic module 20 and improves the detection accuracy of the optoelectronic module 20. Moreover, by exposing the electrical connection pins 21 of the optoelectronic module 20 on the light-shielding layer 30, when it is necessary to connect the sensor 100 to a circuit board or other electronic components, the electrical connection pins 21 can be electrically connected to the circuit board or other electronic components. In this way, the technical solution of the present invention can ensure the uniform flatness of the side of the optoelectronic module 20 for light emission and light sensing, improve the light emission and reception effects of the optical path, and further improve the detection accuracy of the sensor 100.

[0072] Referring to Figure 4 , in some embodiments of the present application, the light-shielding layer 30 is formed with a communication hole, and the electrical connection pin 21 passes through the communication hole. In this embodiment, the light-shielding layer 30 can be injection-molded by a male mold to form a communication hole for the connection pin. Defining that the sensor 100 includes an up-down direction (the stacking direction) and a left-right direction, the communication hole can extend along the left-right direction and penetrate the outer surface of the light-shielding layer 30, or first extend along the left-right direction and then extend upward and penetrate the outer surface of the light-shielding layer 30, as long as it is convenient for the electrical connection pins 21 of the optoelectronic module 20 to be connected to an external circuit.

[0073] Referring to Figure 3 , Figure 4, in some embodiments of the present application, the sensor 100 further includes a metal layer 40, which is disposed on the surface of the light shielding layer 30 facing away from the light-transmitting substrate assembly 10 and is electrically connected to the electrical connection pin 21. By providing the metal layer 40 for connecting the electrical connection pin 21 on the surface of the light shielding layer 30 facing away from the light-transmitting substrate assembly 10, the contact area of the sensor 100 for connecting to an external circuit is increased, improving the connection stability of the sensor 100. For example, when the sensor 100 needs to be connected to a circuit board, the sensor 100 is placed on the pad of the circuit board. Through the contact between the metal layer 40 and the pad, the connection area between the sensor 100 and the circuit board is increased, thereby improving the welding effect.

[0074] Moreover, welding bumps 50 are provided on the surface of the metal layer 40 facing away from the light shielding layer 30. By providing Bumping (bumps), connection to the conductive pads on the circuit board is enabled, so that the optoelectronic module 20 can be well driven when powered on. The welding bumps 50 can be made of the same material as the metal layer 40 (for example, both made of copper and tin materials), thus ensuring electrical conductivity consistency. Or a metal material with better electrical conductivity (such as gold) can be used to improve the electrical signal transmission of the sensor 100.

[0075] In some embodiments of the present application, the number of the welding bumps 50 is multiple, and the multiple welding bumps 50 are evenly arranged on the surface of the metal layer 40 facing away from the light shielding layer 30. By providing multiple welding bumps 50, the contact effect between the metal layer 40 and the pad is further improved, enhancing the welding effect when the sensor 100 is connected to the circuit board.

[0076] Refer to Figures 1 to 4 , in some embodiments of the present application, the optoelectronic module 20 includes a light emitter 22 and a light receiver 23 spaced apart from the light emitter 22. The light-emitting optical path of the emitter and the light-incident optical path of the light receiver 23 both pass through the light-transmitting substrate assembly 10;

[0077] The electrical connection pins 21 include a first pin 211 and a second pin 212. The first pin 211 is connected to the optical transmitter 22, and the second pin 212 is connected to the optical receiver 23. One end of the first pin 211 facing away from the optical transmitter 22 and one end of the second pin 212 facing away from the optical receiver 23 are both exposed to the light-shielding layer 30. In this embodiment, the optoelectronic module 20 includes a separately arranged optical transmitter 22 and an optical receiver 23. Thus, installation errors are more likely to occur during their installation, further causing uneven flatness between the light-emitting surface of the optical transmitter 22 that emits light and the light-incident surface of the optical receiver 23 that receives light. By fitting the light-emitting surface of the optical transmitter 22 on the surface of the light-transmitting substrate assembly 10 and fitting the light-incident surface of the optical receiver 23 on the same surface of the light-transmitting substrate assembly 10 as the optical transmitter 22, the flatness between the light-emitting surface of the optical transmitter 22 and the light-incident surface of the optical receiver 23 is ensured to be uniform. Moreover, by setting the first pin 211 to connect to the optical transmitter 22 and setting the second pin 212 to connect to the optical receiver 23, the first pin 211 and the second pin 212 are further arranged on the sides of the optical transmitter 22 and the optical receiver 23 facing away from the light-transmitting substrate assembly 10, which can shorten the path of the communication hole when forming the communication hole exposing the optical transmitter 22 and the optical receiver 23, and simplify the shape of the communication hole. It only needs to make the communication hole penetrate the light-shielding layer 30 along a straight line, improving production efficiency and product stability.

[0078] Refer to Figure 3 、 Figure 4 , in some embodiments of the present application, the light-transmitting substrate assembly 10 includes a light-transmitting plate 11 and an optical adhesive 12 provided on one surface of the light-transmitting plate 11. The side of the optoelectronic module 20 for emitting and sensing light is fitted to the optical adhesive 12, and the light-shielding layer 30 abuts against the optical adhesive 12. In an embodiment of the present application, the light-transmitting plate 11 is a light-transmitting glass, and the outer contour of the light-transmitting plate 11 can be set according to actual needs, specifically, it can be circular or polygonal. The light-transmitting plate 11 has two opposite light-transmitting planes. Among them, the optoelectronic module 20 is arranged on one of the light-transmitting planes, and the light-emitting surface of the optical transmitter 22 and the light-incident surface of the optical receiver 23 are fitted and arranged on the same light-transmitting plane. The optical adhesive 12 is a special adhesive for bonding transparent optical elements (such as lenses, etc.). It is required to be colorless and transparent, with a light transmittance of more than 90%, good bonding strength, curable at room temperature or medium temperature, and having small curing shrinkage, etc., so that the light-emitting surface of the optical transmitter 22 and the light-incident surface of the optical receiver 23 are well fitted to the light-transmitting plate 11.

[0079] Refer to Figures 1 to 4In some embodiments of the present application, multiple optoelectronic modules 20 are provided. The light-emitting and light-sensing sides of the multiple optoelectronic modules 20 are attached to the surface of the transparent substrate assembly 10 and spaced apart from each other. The provision of multiple optoelectronic modules 20 increases the detection area of the sensor 100, thereby improving the detection accuracy and efficiency of the sensor 100.

[0080] Reference Figure 2 、 Figure 3 In some embodiments of the present application, the surface of the light-shielding layer 30 facing away from the transparent substrate is provided with a recessed mounting groove 31. The sensor 100 further includes a controller 60 and a blocking member 70. The controller 60 is disposed within the recessed mounting groove 31, with the blocking member 70 blocking the notch of the recessed mounting groove 31. The pins of the controller 60 are exposed on the surface of the blocking member 70 facing away from the light-shielding layer 30. The controller 60 may be an MCU (microcontroller unit), which is suitable for processing, diagnosing, and calculating various data from different information sources, thereby improving the response of the sensor 100. It is understood that the PPG sensor 100 measures light signals in contact with the user's skin, and the controller 60 processes the light signals to accurately determine the user's physiological status. In this embodiment, other electronic components can be integrated within the light-shielding layer 30, thereby improving the functionality of the sensor 100, reducing the installation space and production costs, and ensuring better detection accuracy and efficiency of the sensor 100.

[0081] Reference Figures 1 to 5 The present invention also provides a method for manufacturing a sensor 100100, the method for manufacturing the sensor 100 comprising the following steps:

[0082] In step S10, a light-transmitting plate 11 is provided, and the light-emitting and light-sensing side of the photoelectric module 20 is attached to a surface of the light-transmitting plate 11. The light-transmitting plate 11 is made of translucent glass. The outer contour of the light-transmitting plate 11 can be customized according to actual needs, specifically circular or polygonal. The light-transmitting plate 11 has two opposing light-transmitting surfaces, one of which is attached to the light-emitting and light-sensing side of the photoelectric module 20. The thickness of the light-transmitting plate 11 is not limited, as long as it facilitates the passage of light and provides adequate protection for the internal electronic components of the sensor 100.

[0083] Step S20, a light-shielding layer 30 is provided on the surface of the light-transmitting plate 11 where the optoelectronic module 20 is provided, so that the light-shielding layer 30 covers the optoelectronic module 20 and the light-transmitting plate 11; in this embodiment, the color of the light-shielding layer 30 can be black with a relatively high light absorption degree, and specifically, it can be made of a black plastic part, so as to facilitate preventing external stray light from affecting the detection accuracy of the sensor 100. And the optoelectronic module 20 can be limited and fixed, ensuring that the optoelectronic module 20 and the light-transmitting plate 11 module are firmly integrated, and improving the stability of the sensor 100.

[0084] Step S30, a through-hole communicating with the electrical connection terminal of the optoelectronic module 20 is formed in the light-shielding layer 30; by forming a through-hole in the light-shielding layer 30, it is convenient to connect the electrical connection terminal of the optoelectronic module 20 to an external circuit, so that the optoelectronic module 20 can obtain effective power supply. When the light-shielding layer 30 is formed by injection molding using a male mold, a model of the through-hole can be preset in the male mold, and thus, by injection molding with the male mold, a light-shielding layer 30 with a through-hole is formed. Using a male mold can avoid mold opening and reduce production costs. The through-hole can be an arc-shaped hole or a hole with a bent section, as long as it is convenient for molding and convenient for connecting the electrical connection terminal of the optoelectronic module 20 to an external circuit.

[0085] Step S40, an electrical connection pin 21 is formed in the through-hole, wherein one end of the electrical connection pin 21 is connected to the electrical connection terminal of the optoelectronic module 20. With such a setting, the electrically conductive part of the optoelectronic module 20 can be integrated into a specified place, which is convenient for subsequent processing, improves the processing efficiency of the sensor 100, and ensures the yield rate of processing.

[0086] This embodiment adheres the light-emitting and light-sensing side of the optoelectronic module 20 to a surface of the light-transmitting plate 11; provides a light-shielding layer 30 on the surface of the light-transmitting plate 11 where the optoelectronic module 20 is located, so that the light-shielding layer 30 covers both the optoelectronic module 20 and the light-transmitting plate 11; forms a connecting hole in the light-shielding layer 30 for connecting to the electrical connection terminal of the optoelectronic module 20; and forms an electrical connection pin 21 in the connecting hole, one end of which connects to the electrical connection terminal of the optoelectronic module 20. This arrangement ensures that the light-emitting and light-sensing side of the optoelectronic module 20 is completely flush with the light-transmitting plate 11 assembly. As long as the light-transmitting plate 11 assembly is placed flat, the optoelectronic module 20 can be installed smoothly, thereby ensuring a uniform flatness on the light-emitting and light-sensing side of the optoelectronic module 20. Furthermore, by providing a light-shielding layer 30 covering the side of the photoelectric module 20 facing away from the light-transmitting plate 11 assembly and abutting the light-transmitting plate 11 assembly, the free end of the photoelectric module 20 is fixed, thereby ensuring that the side of the photoelectric module 20 used for light emission and light sensing is more firmly attached to the surface of the light-transmitting plate 11 assembly, further ensuring the smoothness of the light emission and light input of the photoelectric module 20. Furthermore, external light is prevented from interfering with the optical path of the photoelectric module 20, thereby improving the detection accuracy of the photoelectric module 20. Furthermore, because the fabrication method employed differs from the conventional method of first fabricating the metal layer 40 for connecting the electrical connection terminals of the photoelectric module 20 to the external circuit, the need for a base substrate when fabricating the metal layer 40 is avoided, as well as the process of peeling the base substrate from the metal layer 40 after the sensor 100 is fabricated is avoided, thus saving production costs and reducing the number of processing steps.

[0087] Reference Figure 1 、 Figure 6 In some embodiments of the present application, the step of providing a light-transmitting plate 11 and attaching the light-emitting and light-sensing side of the optoelectronic module 20 to a surface of the light-transmitting plate 11 includes:

[0088] Step S11: Controlling the processing platform to secure the light-transmitting plate 11. In this embodiment, the processing platform may include vacuum nozzles, which are evenly distributed on the platform to suction one light-transmitting surface of the light-transmitting plate 11, thereby facilitating operations on the other light-transmitting surface of the light-transmitting plate 11 and improving processing efficiency. The processing platform may also be a processing platform with a clamping function, where a buffer member is placed on the clamping surface of a fixture to clamp and secure the light-transmitting plate 11, thereby facilitating processing on either side of the two light-transmitting surfaces.

[0089] Step S12, coat the optical glue 12 on the light-transmitting plane of the light-transmitting plate 11; in one embodiment, the optical glue 12 can be coated by spin coating. The spin coating method includes three steps: ingredient preparation, high-speed rotation, and volatilization to form a film. By controlling the time, rotation speed, droplet volume, and the concentration and viscosity of the solution used, the thickness of the formed film can be controlled. The spin coating method can evenly dispose the optical glue 12 on the surface of the light-shielding layer 30.

[0090] Step S13, mount the optoelectronic module 20 on the light-transmitting plane of the light-transmitting plate 11 coated with the optical glue 12, where the optoelectronic module 20 includes a light emitter 22 and a light receiver 23. In this embodiment, the light emitter 22 and the light receiver 23 can be simultaneously adsorbed by an adsorption device. The light emitter 22 and the light receiver 23 can be placed in an installation box with a fixed spacing. Thus, as long as the adsorption device picks them up, they will have a fixed preset spacing.

[0091] In this embodiment, after fixing the light-transmitting plate 11, the optical glue 12 is coated on the light-transmitting plane of the light-transmitting plate 11, and then the light emitter 22 and the light receiver 23 of the optoelectronic module 20 are placed on the light-transmitting plane coated with the optical glue 12. Thus, the side of the optoelectronic module 20 for light emission and light sensing is completely flush with the light-transmitting plate 11 assembly. As long as the placement of the light-transmitting plate 11 assembly is ensured to be flat, the installation of the optoelectronic module 20 can be ensured to be stable, and further, the flatness of the side of the optoelectronic module 20 for light emission and light sensing can be ensured to be uniform. The light path emission and reception effects are improved, and further, the detection accuracy of the sensor 100 is improved.

[0092] Refer to Figure 2 、 Figure 7 , in some embodiments of the present application, the step of disposing the light-shielding layer 30 on the surface of the light-transmitting plate 11 provided with the optoelectronic module 20 so that the light-shielding layer 30 covers the optoelectronic module 20 and the light-transmitting plate 11 includes:

[0093] Step S21, the coater is aligned with the light-transmitting plate 11 through the alignment marks on the light-transmitting plate 11; in this embodiment, a sensor 100 for alignment can be provided on the coater. When the sensor 100 for alignment detects the alignment marks, it feeds back the detection result to the control system. Thus, the control system can obtain the horizontal distance of the nozzle relative to the light-transmitting plate 11 based on the detection result, which is convenient for controlling the nozzle of the coater. In one embodiment, the nozzle can include multiple nozzles, which is convenient for improving the efficiency of coating the light-shielding layer 30.

[0094] Step S22: Adjust the distance between the nozzle of the coater and the light-transmitting plate 11. In this embodiment, a detection camera can be set to determine the vertical height of the nozzle reaching the specified position from the light-transmitting plate 11, so as to facilitate controlling the coating speed of the nozzle and improving the effect of coating the light-shielding layer 30. The adjustment of this height can be achieved by setting the nozzle in a vertical guide rail and then controlling the height of the nozzle through a motor or controlling the height of the nozzle through a screw pair.

[0095] Step S23: Control the nozzle to coat the light-shielding layer 30 on the specified area through the control system. It can be understood that the specified area is the area where the optoelectronic module 20 is attached and distributed. Since this area is the main area of the sensor 100, the attachment of the light-shielding layer 30 in this part needs to be uniform to ensure the stability of the sensor 100. Controlling the nozzle through the control system can ensure the uniformity of spraying.

[0096] Step S24: When the thickness of the light-shielding layer 30 on the specified area of the light-transmitting plate 11 reaches a predetermined value, the control system controls the nozzle to stop coating. Since the specified area where the light emitters 22 and light receivers 23 of the optoelectronic module 20 are attached is higher than other positions of the light-transmitting plate 11, in order to ensure the thickness consistency of the final light-shielding layer 30, the light-shielding layer 30 to be coated at the position where the optoelectronic module 20 is attached needs to be thinner. Specifically, during implementation, after alignment is completed, the control system obtains the attachment position of the optoelectronic module 20. When controlling the nozzle to spray the light-shielding layer 30, when the nozzle approaches the attachment position, the spraying flow rate of the nozzle is controlled to decrease, so as to reduce the thickness of the light-shielding layer 30 at the position where the optoelectronic module 20 is attached. Finally, the thickness of the light-shielding layer 30 is obtained and compared with the preset value. When the predetermined value is reached, the control system controls the nozzle to stop coating.

[0097] In this embodiment, the coater is aligned with the light-transmitting plate 11 through the alignment marks on the light-transmitting plate 11; the distance between the nozzle of the coater and the light-transmitting plate 11 is adjusted; the nozzle is controlled to coat the light-shielding layer 30 on the specified area through the control system; when the thickness of the light-shielding layer 30 on the specified area of the light-transmitting plate 11 reaches a predetermined value, the control system controls the nozzle to stop coating. So that the light-shielding layer 30 is evenly coated on the light-transmitting plate 11, so that the formed light-shielding layer 30 has good light-shielding properties and ensures the working stability of the sensor 100.

[0098] In some embodiments of the present application, the step of forming a communication hole in the light-shielding layer 30 that communicates with the electrical connection terminals of the optoelectronic module 20 includes:

[0099] A connection hole is formed in the light-shielding layer 30 through a photolithography process. In this embodiment, specifically, first, a photoresist can be coated on the surface of the light-shielding layer 30. In this embodiment, a positive photoresist or a negative photoresist can be coated on the surface of the light-shielding layer 30. The part of the positive photoresist irradiated by light will dissolve in the photoresist developer, while the part not irradiated by light will not dissolve in the photoresist developer. The part of the negative photoresist irradiated by light will not dissolve in the photoresist developer, while the part not irradiated by light will dissolve in the photoresist developer. The selection of the specific type of photoresist can be coated according to actual production. Then, the photoresist is exposed and developed to obtain a light-shielding layer 30 with a preset size having a connection hole. In one embodiment, an ultraviolet light source can be selected, and the light emitted by the ultraviolet light source passes through a photomask with a preset size of the connection hole to expose the light-shielding layer 30, and then the exposed light-shielding layer 30 is washed with a developer to obtain a light-shielding layer 30 with a preset size. It should be noted that the preset size of the connection hole includes the outer contour of the cross-section of the connection hole (this part includes the aperture of the connection hole), as well as the number and position distribution of the connection holes, so as to facilitate subsequent work. The light-shielding layer 30 with the attached photoresist is etched, and the photoresist is removed to obtain a plurality of connection holes provided in the light-shielding layer 30. Etching techniques can be divided into two categories: wet etching and dry etching. When etching, the part to be etched is contacted with a chemical solution to achieve the effect of dissolution and corrosion, forming an uneven or hollowed-out shape. The production cost of the photolithography technique is low, and the production efficiency and the yield rate are relatively high, which is convenient for batch formation of connection holes.

[0100] Alternatively, the light-shielding layer 30 is formed with connection holes by laser drilling. Laser drilling is a laser drilling process, which mainly uses a laser beam for photothermal ablation and photochemical ablation to quickly remove the material of the light-shielding layer 30 to be processed. Photothermal ablation means that the material to be processed absorbs a high-energy laser, and is heated, melted and evaporated into a hole in a very short time. Photochemical ablation means that the high photon energy in the ultraviolet region destroys the long molecular chain of the organic material and becomes smaller particles. Its energy is greater than the force of the original molecule. Under an external force, the material of the light-shielding layer 30 is quickly removed to form a micropore. And laser drilling can be performed on various materials such as hard, brittle and soft materials, and there is no tool loss during drilling. Thus, the light-shielding layer 30 is preferably formed with connection holes.

[0101] Refer to Figure 8 , in some embodiments of the present application, after the step of forming an electrical connection pin 21 in the connection hole, where one end of the electrical connection pin 21 is connected to the electrical connection terminal of the optoelectronic module 20, the following steps are further included:

[0102] Step S50, a metal layer 40 connected to the electrical connection pin 21 is provided on the surface of the light-shielding layer 30 facing away from the light-transmitting plate 11; in some embodiments of the present invention, the metal layer 40 can be formed by sputtering process or pulsed laser deposition method. Specifically, an alloy target can be selected and argon gas can be introduced for sputtering to form the metal layer 40.

[0103] Step S60, a welding bump 50 is formed on the surface of the metal layer 40 facing away from the light-shielding layer 30. In this embodiment, the welding bump 50 can be formed on the metal layer 40 while forming the metal layer 40, specifically by magnetron sputtering again. Alternatively, after forming liquid metal, the welding bump 50 is formed by dropping on the surface of the metal layer 40.

[0104] By providing the metal layer 40 connected to the electrical connection pin 21 on the surface of the light-shielding layer 30 facing away from the light-transmitting plate 11, and then forming the welding bump 50 on the surface of the metal layer 40 facing away from the light-shielding layer 30, the contact area of the sensor 100 for connecting to an external circuit is increased, and the connection stability of the sensor 100 is improved. For example, when the sensor 100 needs to be connected to a circuit board, the sensor 100 is placed on the pad of the circuit board. Through the contact between the metal layer 40 and the pad, the connection area between the sensor 100 and the circuit board is increased, and the welding effect is improved.

[0105] The present invention also proposes a detection device (not shown), the detection device includes the sensor 100 described in any one of the above, or includes the sensor 100 manufactured by the manufacturing method of any one of the above sensors 100. Since this detection device adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be elaborated here one by one.

[0106] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent structural transformation made under the inventive concept of the present invention by using the content of the specification and drawings of the present invention, or directly / indirectly applied in other related technical fields, is included in the patent protection scope of the present invention.

Claims

1. A sensor, characterized in that: include: Light-transmitting panel assembly; A photoelectric module, wherein a side of the photoelectric module for emitting and sensing light is attached to the surface of the light-transmitting plate assembly so that the light path of the photoelectric module can pass through the light-transmitting plate assembly, and the photoelectric module is provided with electrical connection pins; and a light shielding layer, the light shielding layer covering a side of the photoelectric module facing away from the light-transmitting plate assembly and abutting against the light-transmitting plate assembly, the electrical connection pins being exposed from the light shielding layer; The optoelectronic module includes a light emitter and a light receiver spaced apart from the light emitter, wherein the light outgoing path of the emitter and the light incoming path of the light receiver both pass through the light-transmitting plate assembly; The electrical connection pins include a first pin and a second pin, the first pin is connected to the light emitter, the second pin is connected to the light receiver, and an end of the first pin facing away from the light emitter and an end of the second pin facing away from the light receiver are both exposed to the light shielding layer; The light shielding layer is formed with a communication hole, and the electrical connection pin is passed through the communication hole.

2. The sensor according to claim 1, wherein The sensor further includes a metal layer, which is disposed on a surface of the light shielding layer facing away from the light-transmitting plate assembly and is electrically connected to the electrical connection pins.

3. The sensor according to any one of claims 1 to 2, characterized in that The light-transmitting plate assembly includes a light-transmitting plate and optical glue provided on one surface of the light-transmitting plate. The side of the photoelectric module used for emitting light and sensing light is attached to the optical glue, and the light-shielding layer abuts against the optical glue.

4. A method for manufacturing a sensor according to any one of claims 1 to 3, characterized in that: The following steps are involved: Providing a light-transmitting plate, and attaching a side of the photoelectric module used for emitting and sensing light to a surface of the light-transmitting plate; A light-shielding layer is provided on the surface of the light-transmitting plate where the photoelectric module is provided, so that the light-shielding layer covers the photoelectric module and the light-transmitting plate; forming a connecting hole in the light shielding layer to connect to the electrical connection terminal of the optoelectronic module; An electrical connection pin is formed in the communication hole, wherein one end of the electrical connection pin is connected to an electrical connection terminal of the optoelectronic module.

5. The method for manufacturing the sensor according to claim 4, wherein: The step of providing a light-transmitting plate and attaching a side of the photoelectric module for emitting light and sensing light to a surface of the light-transmitting plate includes: Control the processing platform to fix the light-transmitting plate; Apply optical glue on the light-transmitting surface of the light-transmitting plate; The photoelectric module is mounted on the light-transmitting surface of the light-transmitting plate coated with optical glue, wherein the photoelectric module includes a light emitter and a light receiver.

6. The method for manufacturing the sensor according to claim 4, wherein: The step of providing a light-shielding layer on the surface of the light-transmitting plate provided with the photoelectric module so that the light-shielding layer covers the photoelectric module and the light-transmitting plate comprises: The coating machine is aligned with the light-transmitting plate through the alignment marks on the light-transmitting plate; Adjusting the distance between the nozzle of the coating machine and the light-transmitting plate; Controlling the nozzle to apply the light-shielding layer to the designated area through a control system; When the thickness of the light-shielding layer on the designated area on the light-transmitting plate reaches a predetermined value, the control system controls the nozzle to stop coating.

7. The method for manufacturing the sensor according to claim 4, wherein: The step of forming a connecting hole in the light shielding layer to connect the electrical connection terminal of the optoelectronic module includes: forming a connecting hole in the light shielding layer by a photolithography process; Alternatively, the light shielding layer is punched with a laser to form a communicating hole.

8. The method for manufacturing a sensor according to any one of claims 4 to 7, characterized in that: After the step of forming an electrical connection pin in the communication hole, wherein one end of the electrical connection pin is connected to an electrical connection terminal of the optoelectronic module, the step further includes: A metal layer connected to the electrical connection pins is provided on the surface of the light shielding layer away from the light-transmitting plate; Solder bumps are formed on the surface of the metal layer facing away from the light shielding layer.

9. A detection device, characterized in that: The detection device comprises a sensor according to any one of claims 1 to 3; Alternatively, the detection device includes a sensor manufactured by the sensor manufacturing method according to any one of claims 4 to 8.

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