Wafer Rotating Spin-Drying Tank for Wafer Wet Process Equipment
By designing a placement rack mechanism with adjustable swing, the vertical and horizontal rotating and drying of the wafer is achieved, solving the problem of centrifugal impact in the prior art wafer during the swing and drying process, and significantly reducing the risk of damage to the wafer surface.
Patent Information
- Application Number
- CN201911332461.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2019-12-22
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2039-12-22
AI Technical Summary
Existing rotary drying groove equipment cannot adjust the position or orientation of the wafer in a moving manner, resulting in the wafer being impacted by centrifugal force during the drying process, which may cause surface damage.
A wafer rotary drying groove including a placement rack mechanism, a first drive mechanism and a second drive mechanism are designed. The placing frame mechanism can be rotated along the output shaft of the first driving mechanism, and swinging vertically or horizontally relative to the rotation axis direction by the control of the second driving mechanism.
The vertical and horizontal drying mode of the wafer is switched, reducing the centrifugal impact of the wafer during the drying process and avoiding impact damage on the wafer surface.
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Figure CN110911323B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a wafer rotating drying tank for wafer wet process equipment. Background Art
[0002] In the IC industry, the spin washing and drying process is an important part of wafer cleaning. Existing spin drying tank equipment can only perform spin drying in a fixed axis and cannot adjust the wafer placement or orientation. When a vertically placed wafer rotates along the vertical axis, the centrifugal force on the wafer surface is relatively large. If it rotates too fast continuously, the wafer surface (especially the edge) may be damaged by rupture. Summary of the invention
[0003] The purpose of the present invention is to overcome the deficiencies in the prior art and to provide a wafer rotating drying tank for wafer wet process equipment.
[0004] To achieve the above objectives, the following technical solutions are used:
[0005] A wafer rotating spin-drying tank for wafer wet process equipment includes a placement rack mechanism for placing wafers, a first drive mechanism and a second drive mechanism. The placement rack mechanism is transmission-connected to the first drive mechanism so that the placement rack mechanism as a whole can rotate along the output shaft of the first drive mechanism for spin-drying. The placement rack mechanism itself is adjustable and swingable relative to the axial direction of the output shaft. The placement rack mechanism is control-connected to the second drive mechanism so that the swing position of the placement rack mechanism is controlled and positioned by the second drive mechanism.
[0006] Preferably, the placement rack mechanism includes a placement table, a placement rack is provided on the placement table, a transmission shaft mechanism is provided under the placement table, the first driving mechanism includes a first driving motor, the transmission shaft mechanism and the placement table are provided with a central through hole, the first driving motor is transmission-connected to the transmission shaft mechanism and thereby drives the placement table to rotate along the axis of the central through hole, the second driving mechanism includes a second driving motor, the output shaft of the second driving motor is movably and telescopically arranged in the central through hole, a transmission connecting rod assembly is provided on the placement rack, the placement rack can freely swing relative to the axial direction of the central through hole, the transmission connecting rod assembly is linked to the central through hole as the placement rack swings, and the output shaft of the second driving motor is movably supported on the transmission connecting rod assembly to thereby limit the swing position of the placement rack.
[0007] Preferably, it includes a casing frame, the placing rack mechanism is arranged inside the casing frame, the transmission shaft mechanism includes a transmission rotating shaft and an outer fixed seat, the outer fixed seat is installed on the casing frame, the placing table is rotatably installed on the outer fixed seat, the transmission rotating shaft movably penetrates inside the outer fixed seat, the upper end of the transmission rotating shaft is fixedly connected to the placing table, a bearing is arranged between the transmission rotating shaft and the outer fixed seat, the first driving motor is connected to the transmission rotating shaft through a transmission belt to drive the placing table to rotate, and the axis of the transmission rotating shaft is penetrated to form the central through hole.
[0008] Preferably, the first driving motor is fixedly installed beside the bottom of the casing frame, and the second driving motor is fixedly installed under the bottom surface of the casing frame, and then the output shaft of the second driving motor vertically penetrates into the central through hole.
[0009] Preferably, the placing rack is eccentrically installed on the placing table and can freely swing with its own center of gravity. The transmission link assembly includes a linkage push block that moves up and down inside the central through hole; when the output shaft of the second driving motor rises and supports at the rising limit position of the linkage push block, the transmission link assembly supports the placing rack so that the placing rack is perpendicular to the placing table; when the output shaft of the second driving motor descends and supports at the descending limit position of the linkage push block, the transmission link assembly relaxes the placing rack so that the placing rack is horizontal to the placing table.
[0010] Preferably, the placing rack is established on the placing table through a vertical support rod. Both sides of the placing rack are connected to the top ends of the vertical support rods through movable shafts, and then the placing rack can eccentrically swing around the movable shafts. The transmission link assembly includes a linkage rod and a gear transmission shaft. The gear transmission shaft is horizontally installed on the placing table and can rotate by itself. The upper end of the linkage rod is fixedly connected to the movable shaft, and the lower end of the linkage rod is fixedly connected to the end of the gear transmission shaft. Then the linkage rod is linked with the swing of the placing rack. The linked linkage rod drives the gear transmission shaft to rotate by itself. A transmission gear is arranged on the gear transmission shaft. An elevating tooth block that can move up and down is arranged in the central through hole to form the linkage push block. The elevating tooth block meshes with the transmission gear. The output shaft of the second driving motor telescopically supports the elevating tooth block to limit the rotation of the gear transmission shaft, thereby forcing the linkage rod to control the swing position of the placing rack.
[0011] Preferably, a central fixing block is installed at the central through hole of the placing table, and the elevating tooth block slides on the central fixing block and then moves up and down in the central through hole.
[0012] Preferably, a wafer blocking mechanism is provided on the placement table. When the placement rack is horizontal to the placement table, the wafer blocking mechanism correspondingly blocks the wafers placed on the placement rack.
[0013] Preferably, the wafer blocking mechanism is reciprocally swingably arranged and forcedly linked to the transmission link assembly, and the output shaft of the second drive motor simultaneously telescopically supports the wafer blocking mechanism and the transmission link assembly; when the output shaft of the second drive motor rises and supports, the wafer blocking mechanism moves away from the placement rack; when the output shaft of the second drive motor descends and supports, the wafer blocking mechanism approaches the placement rack.
[0014] Preferably, the wafer blocking mechanism is elastically forcedly linked to the transmission link assembly.
[0015] Preferably, the wafer blocking mechanism includes at least two blocking rods. The bottom ends of the blocking rods are reciprocally swingably mounted on the placement table through swing mounting blocks. An actuating push rod is provided on the swing mounting block and extends towards the central through hole. A lifting connecting rod is slidably arranged on the central fixing block. The upper end of the lifting connecting rod is hinged to the extending end of the actuating push rod, and the lower end of the lifting connecting rod extends to the lower end of the lifting tooth block and is linked to move down in the central through hole along with the lifting tooth block. Furthermore, the output shaft of the second drive motor simultaneously telescopically supports the lifting connecting rod and the lifting tooth block; when the output shaft of the second drive motor rises and supports, the lifting connecting rod rises and pushes the actuating push rod to force the blocking rods to move away from the vertical placement rack; when the output shaft of the second drive motor descends and supports, the lifting connecting rod is forced to descend together with the lifting tooth block and pull the actuating push rod to force the blocking rods to approach the horizontal placement rack, and the wafers horizontally placed on the placement rack are limited and blocked by the blocking rods.
[0016] Preferably, a spring rod is penetrated through the lifting tooth block, and the spring rod elastically expands and contracts at the bottom of the lifting tooth block. Furthermore, when the lifting tooth block descends, the spring rod elastically touches the lifting connecting rod.
[0017] Preferably, it includes a machine shell frame. The placement rack mechanism is arranged inside the machine shell frame, and a heating mechanism, a drying mechanism, and a blowing mechanism are provided on the machine shell frame.
[0018] Preferably, the heating mechanism is a quartz heater and is installed at the bottom of the machine shell frame and the placement rack mechanism.
[0019] Preferably, the drying mechanism is an oven and is installed on one side of the machine shell frame and the placement rack mechanism.
[0020] Preferably, the drying mechanism is a hair dryer and is installed on the other side of the casing frame and the placement rack mechanism relative to the drying mechanism, and a switchable grille window is provided between the hair dryer and the placement rack mechanism.
[0021] Preferably, it comprises a casing frame, the placement rack mechanism is arranged in the casing frame, and an openable cover is arranged on the top of the casing frame.
[0022] Preferably, a plurality of the cover plates are provided on the top of the casing frame, and at least two of the cover plates can be foldably opened and closed on the top of the casing frame via a hinge structure.
[0023] The beneficial effects of the present invention include:
[0024] 1) The placement rack mechanism of the present application can not only perform vertical or vertical spin drying as the first drive mechanism rotates, but also can perform vertical or even horizontal swing adjustment relative to the direction of the rotation axis under the control of the second drive mechanism. When the placement rack in the placement rack mechanism is adjusted to be horizontal to the position of the placement table, the wafer inserted in the placement rack can be horizontally rotated and spun. Compared with the rotational spin drying in the vertical or vertical state, the centrifugal impact force received by the wafer is much smaller (almost none). In this way, the spin drying mode in two states is realized to avoid impact damage to the wafer surface.
[0025] 2) The placement table is connected to the first driving mechanism through a transmission shaft mechanism and thus rotates along the axial direction of the central through hole of the transmission shaft mechanism; at the same time, the placement frame is eccentrically installed, and then, under the action of its own gravity, the placement frame swings around the horizontal activity on the placement table without being forced, and transmission connecting rod assemblies are also fixedly connected to both sides of the placement frame, and the transmission connecting rod assemblies are linked with the swinging of the placement frame to drive the lifting gear block in the transmission connecting rod assembly to move up and down, and the output shaft of the second driving motor is telescopically lifted and retracted in the central through hole, and when the output shaft of the second driving motor rises and supports at the rising limit position of the lifting gear block, the transmission connecting rod assembly supports the placement frame so that the placement frame is perpendicular to the placement table; when the output shaft of the second driving motor descends and supports at the falling limit position of the linkage pushing block, the transmission connecting rod assembly relaxes the placement frame so that the placement frame is horizontal to the placement table; in this way, through mechanical coordination, the vertical and horizontal placement of the placement frame can be adjusted.
[0026] 3) Further, a wafer blocking mechanism is also provided on the placement table. The wafer blocking mechanism is elastically and forcedly linked with the transmission link assembly. When the output shaft of the second drive motor simultaneously expands and contracts to support the lifting connecting rod and the lifting tooth block; when the output shaft of the second drive motor rises to support, the lifting connecting rod rises and pushes the actuating push rod to force the blocking rod away from the vertical placement rack; when the output shaft of the second drive motor descends to support, the lifting connecting rod is forced to descend together with the lifting tooth block and pulls the actuating push rod to force the blocking rod close to the horizontal placement rack, and the horizontally placed wafers on the placement rack are blocked and limited by the blocking rod; thus, through mechanical cooperation, the blocking and limiting of the horizontal wafers can be adjustably and synchronously realized, preventing the horizontally rotating wafers from running out of the placement rack and its hanging basket.
[0027] 4) This application also has a casing frame. A casing can be set on the casing frame to protect the placement rack mechanism and perform spin-drying within the casing frame; a quartz heater, an oven, and a hair dryer are also provided within the casing frame to heat, dry, and blow-dry the wafers comprehensively while spin-drying, with comprehensive functions. Description of the Drawings
[0028] Figure 1 is the overall structural schematic diagram of the wafer rotary spin-drying tank for the wafer wet process equipment of the present invention.
[0029] Figure 2 Corresponding to Figure 1 the schematic diagram of the back structure.
[0030] Figure 3 Corresponding to Figure 1 the three-dimensional structural schematic diagram of the casing frame and the cover plate in
[0031] Figure 4 Corresponding to Figure 3 the top view structural schematic diagram.
[0032] Figure 5 Corresponding to Figure 1 the three-dimensional structural schematic diagram of the connection and cooperation between the first drive mechanism and the placement rack mechanism in
[0033] Figure 6 Corresponding to Figure 5 the three-dimensional structural schematic diagram of another perspective after hiding the wafers in
[0034] Figure 7 Corresponding to Figure 5 the structural schematic diagram of the connection between the first drive motor and the placement table transmission in
[0035] Figure 8 Corresponding to Figure 7 the structural schematic diagram of the lower transmission shaft mechanism of the placement table in
[0036] Figure 9 For corresponding to Figure 6 The three-dimensional structure schematic diagram of the connection and cooperation between the second driving mechanism and the placement rack mechanism in
[0037] Figure 10 For corresponding to Figure 9 The enlarged top view structure schematic diagram of area A in
[0038] Figure 11 For corresponding to Figure 9 The three-dimensional structure schematic diagram of its back side
[0039] Figure 12 For corresponding to Figure 11 The enlarged structure schematic diagram of area B in
[0040] Figure 13 For corresponding to Figure 11 The side structure schematic diagram of the placement rack and its transmission link assembly in
[0041] Figure 14 For corresponding to Figure 13 The structure schematic diagram of the back side
[0042] Figure 15 For corresponding to Figure 9 Or Figure 10 The schematic diagram of the cooperation relationship between the wafer blocking mechanism and the lifting shaft under the placement table in
[0043] Figure 16 For corresponding to Figure 15 The three-dimensional enlarged structure schematic diagram of area C in
[0044] Figure 17 For corresponding to Figure 1 Or Figure 5 The schematic diagram of the state after the wafer is swung and placed flat in
[0045] Figure 18 For the side structure schematic diagram of the placement rack mechanism and the second driving motor in Specific implementation manner
[0046] The present invention will be described in detail below with reference to the accompanying drawings:
[0047] Such as Figure 1 And Figure 2As shown in the figure, a wafer rotation and drying tank for a wafer wet process equipment includes a placement rack mechanism 2 for placing a wafer 99, a first driving mechanism 3, a second driving mechanism 4, and a housing frame 1. The placement rack mechanism 2 is arranged inside the housing frame 1. The placement rack mechanism 2 is in transmission connection with the first driving mechanism 3, and thus the entire placement rack mechanism 2 can rotate along the output shaft of the first driving mechanism 3 for drying. The placement rack mechanism 2 is adjustably swingably arranged relative to the axial direction of the output shaft. The placement rack mechanism 2 is in control connection with the second driving mechanism 4, and thus the swing position of the placement rack mechanism 2 is controlled and positioned by the second driving mechanism 4.
[0048] Specifically, a heating mechanism 5, a drying mechanism 6, and a blowing mechanism 7 are provided on the housing frame 1. The heating mechanism is a quartz heater 5 and is installed at the bottom of the housing frame 1 and the placement rack mechanism 2. The drying mechanism is an oven 6 and is installed on one side of the housing frame 1 and the placement rack mechanism 2. The blowing mechanism is a blower 7 and is installed on the other side of the housing frame 1 and the placement rack mechanism 2 relative to the drying mechanism 6. A switchable grid window 70 is provided between the blower 7 and the placement rack mechanism 2. A housing can be added around the housing frame 1 to provide comprehensive protection and isolation.
[0049] Combined with Figure 3 and Figure 4 As shown in the figure, an openable cover plate 8 is provided at the top of the housing frame 1. A plurality of the cover plates 8 are provided at the top of the housing frame 1. At least two of the cover plates 8 are foldably opened and closed in a pair on the top of the housing frame 1 through a hinge structure 80 or a link structure. Figure 4 Two of the cover plates 8 in the figure are hidden.
[0050] As Figure 5 and Figure 6As shown, the placement rack mechanism 2 includes a placement table 20, on which is a placement rack 22 in the form of a frame basket, a transmission shaft mechanism 9 is provided under the placement table 20, the first driving mechanism includes a first driving motor 3, the transmission shaft mechanism 9 and the placement table 20 are provided with a central through hole 90, the first driving motor 3 is transmission-connected with the transmission shaft mechanism 9 to drive the placement table 20 to rotate along the central through hole 90, the second driving mechanism includes a second driving motor 4, the output shaft 40 of the second driving motor 4 is movably and telescopically arranged in the central through hole 90, a transmission connecting rod assembly 21 is provided on the placement rack 22, the placement rack 22 can freely swing relative to the axial direction of the central through hole 90, the transmission connecting rod assembly 21 is linked to the central through hole 90 with the swinging of the placement rack 22, and the output shaft 40 of the second driving motor 4 is movably supported on the transmission connecting rod assembly 21 to limit the swinging position of the placement rack 22. The first drive motor 3 is fixedly installed beside the bottom of the housing frame 1 , and the second drive motor 4 is fixedly installed under the bottom surface of the housing frame 1 so that the output shaft 40 of the second drive motor 4 vertically penetrates into the central through hole 90 .
[0051] like Figure 7 and Figure 8 As shown, the transmission shaft mechanism 9 includes a transmission shaft 92 and an external fixing seat 94, and the external fixing seat 94 is installed on the middle seat 18 of the housing frame 1 (combined with Figure 3 and Figure 4 As shown), the placement table 20 is rotatably mounted on the outer fixing seat 94, the transmission shaft 92 is movably arranged in the outer fixing seat 94, the upper end of the transmission shaft 92 is fixedly connected to the placement table 20, and a bearing 96 is provided between the transmission shaft 92 and the outer fixing seat 94 ( Figure 8 In the figure, the outer fixing seat 94 is hidden), the bottom of the first driving motor 3 is connected to the bottom of the driving shaft 92 through the driving belt 30 to drive the placement table 20 to rotate, and the axis of the driving shaft 92 passes through to form the central through hole 90.
[0052] like Figures 9 to 12As shown, the placement rack 22 is eccentrically installed on the placement table 20 and can freely swing with its own center of gravity. The transmission link assembly 21 includes a linkage push block 210 that moves up and down in the central through hole 90. When the output shaft 40 of the second drive motor 4 rises and supports at the upper limit position of the linkage push block 210, the transmission link assembly 21 supports the placement rack 22 so that the placement rack 22 is perpendicular to the placement table 20. When the output shaft 40 of the second drive motor 4 descends and supports at the lower limit position of the linkage push block 210, the transmission link assembly 21 releases the placement rack 22 so that the placement rack 22 is horizontal to the placement table 20.
[0053] Specifically, in combination with Figure 13 and Figure 14 as shown, Figure 13 the placement table 20 in
[0054] is hidden. The placement rack 22 is established on the placement table 20 through vertical support rods 222 on both sides. Both sides of the placement rack 22 are connected to the top ends of the vertical support rods 220 through movable shafts 220, and thus the placement rack 22 can eccentrically swing around the movable shafts 220. The transmission link assembly 21 includes two sets of linkage links 211 on both sides and a gear transmission shaft 212. The gear transmission shaft 212 is horizontally installed on the placement table 20 and can rotate self. The upper end of the linkage link 211 is fixedly connected to the movable shaft 220, and the lower end of the linkage link 211 is fixedly connected to the end of the gear transmission shaft 212. Thus, the linkage link 211 is linked with the swing of the placement rack 22, and the linked linkage link 211 drives the gear transmission shaft 212 to rotate self. A transmission gear 213 is fixedly provided on the middle part of the gear transmission shaft 212. An elevating gear block 210 that can move up and down is provided in the central through hole 90 to form the linkage push block. The elevating gear block 210 meshes with the transmission gear 213. The output shaft 40 of the second drive motor 4 telescopically supports the elevating gear block 210 to limit the rotation of the gear transmission shaft 212 and thus force the linkage link 211 to control the swing position of the placement rack 22.
[0055] On the other hand, a wafer blocking mechanism 24 is provided on the placement table 20 to block and limit the horizontally placed wafer 99. As Figure 9 , Figure 10 , Figure 11 , Figure 12 , Figure 15 and Figure 16As shown, when the placement rack 22 is horizontal to the placement table 20, the wafer blocking mechanism 24 correspondingly blocks the wafers 99 placed on the placement rack 22. Specifically, the wafer blocking mechanism 24 is reciprocally swingably arranged and elastically forcedly linked to the transmission link assembly 21, and the output shaft 40 of the second drive motor 4 simultaneously telescopically supports the wafer blocking mechanism 24 and the transmission link assembly 21; when the output shaft 40 of the second drive motor 4 rises and supports, the wafer blocking mechanism 24 moves away from the placement rack 22; when the output shaft 40 of the second drive motor 4 descends and supports, the wafer blocking mechanism 24 approaches the placement rack 22.
[0056] As Figures 15 to 18 shown, the wafer blocking mechanism 24 includes at least two blocking rods 240. The bottom ends of the blocking rods 240 are reciprocally swingably mounted on the placement table 20 through swing mounting blocks 242. An actuating push rod 244 is provided on the swing mounting blocks 242. The actuating push rod 244 extends towards the central through hole 90. A vertically L-shaped lifting connecting rod 246 is slidably arranged on the central fixing block 29. The upper end of the lifting connecting rod 246 is hinged to the extending end of the actuating push rod 244 through the two ends of a straight rod. The lower end of the lifting connecting rod 246 extends to the lower end of the lifting tooth block 210 and is linked to move down in the central through hole 90 along with the lifting tooth block 210. Furthermore, the output shaft 40 of the second drive motor 4 simultaneously telescopically supports the lifting connecting rod 246 and the lifting tooth block 210; when the output shaft 40 of the second drive motor 4 rises and supports, the lifting connecting rod 246 rises and pushes the actuating push rod 244 to force the blocking rods 240 to move away from the vertical placement rack 22; when the output shaft 40 of the second drive motor 4 descends and supports, the lifting connecting rod 246 is forced to move down together with the lifting tooth block 210 and pulls the actuating push rod 244 to force the blocking rods 240 to approach the horizontal placement rack 22, and the wafers 99 horizontally placed on the placement rack 22 are limited and blocked by the blocking rods 240.
[0057] As Figure 15 and Figure 16 shown, a spring rod 219 is penetrated through the lifting tooth block 210 (hidden) or the central fixing block 29. The spring rod 219 elastically expands and contracts at the bottom of the lifting tooth block 210. Thus, when the lifting tooth block 210 descends, the spring rod 219 elastically touches the lifting connecting rod 246. In this way, elastic driving is realized.
[0058] After having the above structural features, the present invention can be implemented according to the following process:
[0059] a. As Figure 1 and Figure 2As shown, open the cover plate 8, slowly lower the multiple wafers 99 neatly placed in the hanging basket 98 onto the placement rack 22 inside the casing frame 1 and fixedly install them. Start the second drive motor 4 so that the output shaft 40 of the second drive motor 4 rises to support the lifting connecting rod 246 and the lifting tooth block 210 until reaching the rising limit position. In this way, the multiple wafers 99 are all perpendicular to the placement table 20.
[0060] b. Close the cover plate 8, start the first drive motor 3, rotate the placement table 20, and then rotate the multiple vertically / vertically placed wafers 99 along the vertical axis for a period of time to perform the first-stage vertical drying operation; while drying, the quartz heater 5, the oven 6, and the hair dryer 7 inside the casing frame 1 are started in sequence to comprehensively heat, dry, and blow-dry the wafers 99.
[0061] c. Turn off the first drive motor 3 to end the first-stage drying. Control the output shaft 40 of the second drive motor 4 to descend. As the output shaft descends a certain distance, the lifting connecting rod 246 and the lifting tooth block 210 gradually lose the supporting force and also gradually descend (as shown by the arrow directions in each figure). The transmission link assembly 21 is in a slack state. Furthermore, the placement rack 22 freely swings from the vertical position to the horizontal position under its own gravity. The lifting tooth block 210 is driven by the transmission link assembly 21 to move downward in linkage and drive the lifting connecting rod 246 downward together to pull the blocking rod 240 of the wafer blocking mechanism 24 closer to the placement rack 22. After the lifting connecting rod 246 and the lifting tooth block 210 descend to a certain position, they are still supported by the output shaft 40 of the second drive motor 4, that is, they reach the descending limit position. In this way, the wafers 99 on the placement rack 22 swing 90° and remain horizontal relative to the placement table 20. At the same time, the two blocking rods 240 can just block the outer edges of the horizontal wafers 99, as Figure 17 and Figure 18 shown. After the swing of the placement rack 22 is completed, start the first drive motor 3 again to rotate the placement table 20 and continue the second-stage horizontal drying operation.
[0062] d. After completing the second-stage drying operation, turn off the first drive motor 3, stop the rotation of the placement table 20, and then make the placement rack 22 return to the vertical and vertical placement position through the support of the second drive motor 4 (as shown by the arrow directions in each figure). Open the cover plate 8 again, and finally take out the dried and vertically placed wafers 99 and the hanging basket 98 from the casing frame. In this way, all the operation procedures are completed.
[0063] The wafer rotating drying trough for wafer wet process equipment provided by the present invention has a delicate structure and is convenient to operate. It realizes the vertical rotation drying and horizontal rotation drying of wafers through an adjustable swing placement rack.
[0064] The embodiments in the present invention are only used to illustrate the present invention and do not constitute a limitation on the scope of the claims. Other substantially equivalent alternatives that can be conceived by those skilled in the art are within the protection scope of the present invention.
Claims
1. A wafer spinning drying tank for a wafer wet process equipment, It is characterized in that The invention comprises a placement rack mechanism for placing wafers, a first driving mechanism and a second driving mechanism, wherein the placement rack mechanism is transmission-connected with the first driving mechanism so that the placement rack mechanism as a whole can rotate along the output shaft of the first driving mechanism for drying, the placement rack mechanism itself can be adjusted and swung relative to the axial direction of the output shaft, the placement rack mechanism is control-connected with the second driving mechanism so that the swing position of the placement rack mechanism is controlled and positioned by the second driving mechanism, The placement rack mechanism includes a placement table, a placement rack is arranged on the placement table, a transmission shaft mechanism is arranged under the placement table, a central through hole is arranged on the transmission shaft mechanism and the placement table, the first driving mechanism includes a first driving motor, the second driving mechanism includes a second driving motor, a transmission connecting rod assembly is arranged on the placement rack, and the placement rack can freely swing relative to the axial direction of the central through hole, The placement rack is eccentrically mounted on the placement table and can swing freely with its own center of gravity, and the transmission connecting rod assembly includes a linkage pushing block that moves up and down in the central through hole; when the output shaft of the second drive motor rises and supports at the rising limit position of the linkage pushing block, the transmission connecting rod assembly supports the placement rack so that the placement rack is perpendicular to the placement table; when the output shaft of the second drive motor descends and supports at the descending limit position of the linkage pushing block, the transmission connecting rod assembly relaxes the placement rack so that the placement rack is horizontal to the placement table. It comprises a casing frame, the placing rack mechanism is arranged in the casing frame, and the casing frame is provided with a heating mechanism, a drying mechanism and a blowing mechanism.
2. The wafer spinning drying tank for wafer wet process equipment according to claim 1, Features The first drive motor is connected to the transmission shaft mechanism to drive the placement table to rotate along the central through hole. The output shaft of the second drive motor is movably and telescopically arranged in the central through hole. The transmission connecting rod assembly is linked to the central through hole as the placement rack swings. The output shaft of the second drive motor is movably supported on the transmission connecting rod assembly to limit the swing position of the placement rack.
3. The wafer spinning drying tank for wafer wet process equipment according to claim 2, It is characterized in that It includes a casing frame, the placement frame mechanism is arranged in the casing frame, the transmission shaft mechanism includes a transmission shaft and an external fixing seat, the external fixing seat is installed on the casing frame, the placement table is rotatably installed on the external fixing seat, the transmission shaft is movably passed through the external fixing seat, the upper end of the transmission shaft is fixedly connected to the placement table, a bearing is provided between the transmission shaft and the external fixing seat, the first driving motor is connected to the transmission shaft through a transmission belt to drive the placement table to rotate, and the axis of the transmission shaft passes through to form the central through hole.
4. The wafer spinning drying tank for wafer wet process equipment according to claim 3, It is characterized in that The first driving motor is fixedly installed beside the bottom of the machine shell frame, and the second driving motor is fixedly installed under the bottom surface of the machine shell frame, and then the output shaft of the second driving motor vertically penetrates into the central through hole.
5. The wafer rotating and drying tank for wafer wet process equipment according to claim 1, characterized in that the placement rack is established on the placement table through vertical support rods, both sides of the placement rack are connected to the top ends of the vertical support rods through movable shafts, and then the placement rack can eccentrically swing around the movable shafts. The transmission link assembly includes a linkage link and a gear transmission shaft. The gear transmission shaft is horizontally installed on the placement table and can rotate by itself. The upper end of the linkage link is fixedly connected to the movable shaft, and the lower end of the linkage link is fixedly connected to the end of the gear transmission shaft. Then the linkage link is linked with the swing of the placement rack, and the linked linkage link drives the gear transmission shaft to rotate by itself. A transmission gear is provided on the gear transmission shaft, and a liftable and lowerable lift tooth block is provided in the central through hole to form the linkage push block. The lift tooth block meshes with the transmission gear, and the output shaft of the second driving motor telescopically supports the lift tooth block to limit the rotation of the gear transmission shaft, thereby forcing the linkage link to control the swing position of the placement rack.
6. The wafer rotating and drying tank for wafer wet process equipment according to claim 1, characterized in that the heating mechanism is a quartz heater and is installed at the bottom of the machine shell frame and the placement rack mechanism.
7. The wafer rotating and drying tank for wafer wet process equipment according to claim 1, characterized in that it includes a machine shell frame, the placement rack mechanism is arranged in the machine shell frame, and an openable cover plate is provided at the top of the machine shell frame.
8. The wafer rotating and drying tank for wafer wet process equipment according to claim 7, characterized in that a plurality of the cover plates are provided at the top of the machine shell frame, and at least two of the cover plates are foldably opened and closed in a fan shape at the top of the machine shell frame through a hinge structure.
Citation Information
Patent Citations
Wafer rotary spin-drying groove for wafer wet processing equipment
CN211088219U
Drying processor
JP1999288916A