High-precision half-hole type wireless module circuit board

Abstract

The present invention discloses a high-precision half-hole type wireless module circuit board, which includes a first circuit board. A first heat dissipation layer is installed at the bottom end of the first circuit board. A second circuit board is installed at the bottom end of the first heat dissipation layer. A second heat dissipation layer is installed at the bottom end of the second circuit board. A third circuit board is installed at the bottom end of the second heat dissipation layer. A first connection half-hole is opened at the top end of the first circuit board, and a third connection half-hole is opened at the bottom end of the third circuit board. A heat dissipation layer is provided between two circuit boards. Moreover, heat dissipation columns and heat dissipation blocks are provided in the heat dissipation layer. The heat dissipation horizontal holes and vertical holes are connected and communicate with the heat dissipation half-holes, so as to fully dissipate heat inside the circuit board, which is beneficial to improving the service life of the circuit board. A plurality of connection half-holes are opened at both the top end and the bottom end of the circuit board for connecting other electronic components.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and more specifically to a high-precision half-hole type wireless module circuit board. Background Art

[0002] In recent years, with the rapid development of electronic products, high density, multi-function, and miniaturization have become the development trends. The modularization of circuit boards can carry more electronic components or other circuit boards in electronic assembly. However, during the loading process, the problem of insufficient adhesion and subsequent detachment is likely to occur, leading to the failure and scrapping of the entire product. Moreover, when the modular circuit board is working, it will emit a large amount of heat energy. If the heat cannot be dissipated in time, it will affect the service life of the modular circuit board.

[0003] The Chinese invention patent with the authorization announcement number CN207518941U was publicly disclosed on June 19, 2018, which discloses a high-precision PCB metallized half-hole circuit board, including a PCB circuit board. The PCB circuit board includes a first pad and a second pad. A third pad is provided above the PCB circuit board. An upper copper foil layer is provided on the upper surface of the first pad. A lower copper foil layer is provided on the lower surface of the second pad. A heat dissipation layer is fixed between the first pad and the second pad. A heat conduction interlayer is provided between the first pad and the third pad. A small copper foil layer is provided on the upper surface of the third pad. A first metal half-hole is processed on the upper surface of the third pad. A plurality of second metal half-holes are processed on the upper surface of the first pad. A pair of blind holes are provided between the first pad and the second pad. Two pairs of through holes are processed on the upper surface of the PCB circuit board. The beneficial effect of the present invention is that the structure is simple and the practicability is strong.

[0004] For the existing high-precision half-hole type wireless module circuit board, although the structure is simple and the practicability is strong. However, the heat dissipation performance of the circuit board is poor, and moreover, the number of half-holes on the surface for mounting other electronic components is small, resulting in low utilization rate. Summary of the Invention

[0005] The purpose of the present invention is to provide a high-precision half-hole type wireless module circuit board to solve the problem of poor heat dissipation performance of the circuit board.

[0006] To achieve the above purpose, the present invention provides the following technical solution: A high-precision half-hole type wireless module circuit board, including a first circuit board. A first heat dissipation layer is installed at the bottom end of the first circuit board. A second circuit board is installed at the bottom end of the first heat dissipation layer. A second heat dissipation layer is installed at the bottom end of the second circuit board. A third circuit board is installed at the bottom end of the second heat dissipation layer. A first connection half-hole is opened at the top end of the first circuit board. A third connection half-hole is opened at the bottom end of the third circuit board.

[0007] Preferably, a first heat dissipation semi-hole is formed at the bottom end of the first circuit board, a second heat dissipation semi-hole is formed at the top end of the second circuit board, a heat dissipation block is installed inside the first heat dissipation layer, a first heat dissipation column is fixed at the top end of the heat dissipation block, the first heat dissipation column is inserted into the first heat dissipation semi-hole, a second heat dissipation column is fixed at the bottom end of the heat dissipation block, and the second heat dissipation column is inserted into the second heat dissipation semi-hole.

[0008] Preferably, a first heat dissipation transverse hole is formed inside the first heat dissipation column, a second heat dissipation transverse hole is formed inside the second heat dissipation column, a third heat dissipation transverse hole is formed inside the heat dissipation block, and a heat dissipation vertical hole is formed inside the heat dissipation block.

[0009] Preferably, a first copper foil is arranged at the top end of the first circuit board, a third copper foil is arranged at the bottom end of the third circuit board, and a bonding board is installed on the side surface of the first circuit board.

[0010] Preferably, the first circuit board, the second circuit board and the third circuit board are identical in shape and size, and the side surfaces of the first heat dissipation layer and the second heat dissipation layer protrude from the first circuit board.

[0011] Preferably, the first heat dissipation semi-hole and the second heat dissipation semi-hole are equal in diameter and vertically aligned, and the diameter of the heat dissipation block is not less than the diameter of the first heat dissipation semi-hole.

[0012] Preferably, the first heat dissipation transverse hole, the third heat dissipation transverse hole and the second heat dissipation transverse hole are parallel, and the heat dissipation vertical hole communicates with the first heat dissipation transverse hole, the third heat dissipation transverse hole and the second heat dissipation transverse hole.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. A heat dissipation layer is arranged between the two circuit boards. Moreover, heat dissipation columns and a heat dissipation block are arranged in the heat dissipation layer, the heat dissipation transverse holes and the vertical holes communicate with each other and are also communicated with the heat dissipation semi-holes, so that the heat dissipation inside the circuit board is sufficient, which is beneficial to improving the service life of the circuit board.

[0014] 2. A plurality of connection semi-holes are formed at the top end and the bottom end of the circuit board for connecting other electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0016] Figure 2 is for the Figure 1 enlarged view of part A of the present invention;

[0017] Figure 3 is for the Figure 1 schematic diagram of the partial structure of the heat dissipation block of the present invention.

[0018] In the figure: 1. First circuit board; 2. Second circuit board; 3. First heat dissipation layer; 4. Bonding board; 5. First connecting half-hole; 6. First copper foil; 7. Second heat dissipation layer; 8. Third connecting half-hole; 9. Third copper foil; 10. Third circuit board; 11. Heat dissipation block; 12. First heat dissipation column; 13. Second heat dissipation column; 14. First heat dissipation half-hole; 15. Second heat dissipation half-hole; 16. Second heat dissipation horizontal hole; 17. Heat dissipation vertical hole; 18. Third heat dissipation horizontal hole; 19. First heat dissipation horizontal hole. Detailed implementation manner

[0019] Please refer to Figure 1 , the present invention provides a technical solution: a high-precision half-hole type wireless module circuit board, including a first circuit board 1, a first heat dissipation layer 3 is installed at the bottom end of the first circuit board 1, and a second circuit board 2 is installed at the bottom end of the first heat dissipation layer 3; a second heat dissipation layer 7 is installed at the bottom end of the second circuit board 2, the sides of the first heat dissipation layer 3 and the second heat dissipation layer 7 protrude from the first circuit board 1, a third circuit board 10 is installed at the bottom end of the second heat dissipation layer 7, and the first circuit board 1, the second circuit board 2 and the third circuit board 10 have the same shape and size.

[0020] Please refer to Figure 1 , a first connecting half-hole 5 is opened at the top end of the first circuit board 1, and a third connecting half-hole 8 is opened at the bottom end of the third circuit board 10, both of which are used to connect other electronic components.

[0021] Please refer to Figure 1 , Figure 2 and Figure 3 , a first heat dissipation half-hole 14 is opened at the bottom end of the first circuit board 1, a second heat dissipation half-hole 15 is opened at the top end of the second circuit board 2, and the first heat dissipation half-hole 14 and the second heat dissipation half-hole 15 have the same diameter and are aligned vertically.

[0022] Please refer to Figure 1 , Figure 2 and Figure 3 , a heat dissipation block 11 is installed inside the first heat dissipation layer 3, and the diameter of the heat dissipation block 11 is not less than the diameter of the first heat dissipation half-hole 14; a first heat dissipation column 12 is fixed at the top end of the heat dissipation block 11, and the first heat dissipation column 12 is inserted into the first heat dissipation half-hole 14 for dissipating heat inside the first circuit board 1; a second heat dissipation column 13 is fixed at the bottom end of the heat dissipation block 11, and the second heat dissipation column 13 is inserted into the second heat dissipation half-hole 15 for dissipating heat inside the second circuit board 2.

[0023] Please refer to Figure 1 , Figure 2 and Figure 3 , a first heat dissipation horizontal hole 19 is opened inside the first heat dissipation column 12, the first heat dissipation horizontal hole 19 is in a cross shape, and the first heat dissipation horizontal hole 19 is communicated with the first heat dissipation half-hole 14.

[0024] Please refer toFigure 1 , Figure 2 and Figure 3 , a second heat dissipation cross hole 16 is formed inside the second heat dissipation column 13. The second heat dissipation cross hole 16 is in a cross shape and is communicated with the second heat dissipation half hole 15.

[0025] Please refer to Figure 1 , Figure 2 and Figure 3 , a third heat dissipation cross hole 18 is formed inside the heat dissipation block 11. The outlet of the third heat dissipation cross hole 18 is in contact with the first heat dissipation layer 3. The first heat dissipation cross hole 19, the third heat dissipation cross hole 18 and the second heat dissipation cross hole 16 are parallel; a heat dissipation vertical hole 17 is formed inside the heat dissipation block 11, and the heat dissipation vertical hole 17 is communicated with the first heat dissipation cross hole 19, the third heat dissipation cross hole 18 and the second heat dissipation cross hole 16.

[0026] Please refer to Figure 1 , a first copper foil 6 is arranged at the top end of the first circuit board 1, a third copper foil 9 is arranged at the bottom end of the third circuit board 10, a bonding plate 4 is installed on the side surface of the first circuit board 1, the side surface of the bonding plate 4 is in contact with the side surface of the first heat dissipation layer 3, and the side surface of the bonding plate 4 is spaced from the side surface of the first circuit board 1, which is beneficial to heat dissipation.

[0027] In the specific implementation of the present invention: the first heat dissipation layer 3 is arranged between the first circuit board 1 and the second circuit board 2, and the second heat dissipation layer 7 is arranged between the second circuit board 2 and the third circuit board 10. The first copper foil 6 is arranged at the top end of the first circuit board 1, the third copper foil 9 is arranged at the bottom end of the third circuit board 10, and the bonding plate 4 is installed on the side surface of the first circuit board 1.

[0028] A plurality of first connection half holes 5 are arranged at the top end of the first circuit board 1, and a plurality of third connection half holes 8 are arranged at the bottom end of the third circuit board 10.

[0029] The first heat dissipation half hole 14 at the bottom end of the first circuit board 1 and the second heat dissipation half hole 15 at the top end of the second circuit board 2 are vertically aligned; the heat dissipation block 11 is installed inside the first heat dissipation layer 3, the first heat dissipation column 12 is inserted into the first heat dissipation half hole 14, and the second heat dissipation column 13 is inserted into the second heat dissipation half hole 15. The first heat dissipation cross hole 19 is communicated with the first heat dissipation half hole 14, and the second heat dissipation cross hole 16 is communicated with the second heat dissipation half hole 15.

[0030] When the first circuit board 1 and the second circuit board 2 dissipate heat, the heat is introduced into the heat dissipation vertical hole 17 through the first heat dissipation cross hole 19 and the second heat dissipation cross hole 16, and then is introduced into the third heat dissipation cross hole 18 through the heat dissipation vertical hole 17, and is in contact with the first heat dissipation layer 3 through the third heat dissipation cross hole 18 for heat dissipation.

Claims

1. High-precision semi-hole type wireless module circuit board, comprising a first circuit board (1), characterized in that: A first heat dissipation layer (3) is installed at the bottom end of the first circuit board (1), a second circuit board (2) is installed at the bottom end of the first heat dissipation layer (3), a second heat dissipation layer (7) is installed at the bottom end of the second circuit board (2), a third circuit board (10) is installed at the bottom end of the second heat dissipation layer (7), a first connection half-hole (5) is opened at the top end of the first circuit board (1), and a third connection half-hole (8) is opened at the bottom end of the third circuit board (10); a first heat dissipation half-hole (14) is opened at the bottom end of the first circuit board (1), a second heat dissipation half-hole (15) is opened at the top end of the second circuit board (2), a heat dissipation block (11) is installed inside the first heat dissipation layer (3), a first heat dissipation column (12) is fixed to the top end of the heat dissipation block (11), the first heat dissipation column (12) is inserted into the first heat dissipation half-hole (14), a second heat dissipation column (13) is fixed to the bottom end of the heat dissipation block (11), and the second heat dissipation column (13) is inserted into the second heat dissipation half-hole (15); a first heat dissipation transverse hole (19) is opened inside the first heat dissipation column (12), a second heat dissipation transverse hole (16) is opened inside the second heat dissipation column (13), a third heat dissipation transverse hole (18) is opened inside the heat dissipation block (11), and a heat dissipation vertical hole (17) is opened inside the heat dissipation block (11); a first copper foil (6) is arranged at the top end of the first circuit board (1), a third copper foil (9) is arranged at the bottom end of the third circuit board (10), and a bonding plate (4) is installed on the side surface of the first circuit board (1); the first circuit board (1), the second circuit board (2) and the third circuit board (10) are identical in shape and size, and the sides of the first heat dissipation layer (3) and the second heat dissipation layer (7) protrude from the first circuit board (1); the first heat dissipation half-hole (14) and the second heat dissipation half-hole (15) are equal in diameter and are vertically aligned, and the diameter of the heat dissipation block (11) is not less than the diameter of the first heat dissipation half-hole (14); the first heat dissipation transverse hole (19), the third heat dissipation transverse hole (18) and the second heat dissipation transverse hole (16) are parallel, and the heat dissipation vertical hole (17) communicates with the first heat dissipation transverse hole (19), the third heat dissipation transverse hole (18) and the second heat dissipation transverse hole (16).

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