Substrate processing equipment

Abstract

The substrate processing apparatus of the present invention comprises a loading unit, a first processing unit, a first conveying mechanism, a second processing unit, a second conveying mechanism, a first placement unit, a second placement unit, and a control unit. The first conveying mechanism repeatedly performs a first cycle action including three approach actions (specifically, a first approach action, a second approach action, and a third approach action). The second conveying mechanism repeatedly performs a second cycle action including three approach actions (specifically, a fourth approach action, a fifth approach action, and a sixth approach action).

Description

Technical Field

[0001] The present invention relates to a substrate processing device for processing a substrate, such as a semiconductor wafer, a substrate for a liquid crystal display, a substrate for an organic EL (Electroluminescence), a substrate for an FPD (Flat Panel Display), a substrate for an optical display, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, and a substrate for a solar cell. Background Art

[0002] Japanese Patent Publication No. 2009-010291 discloses a substrate processing device. In the following, the symbols recorded in Japanese Patent Publication No. 2009-010291 are indicated by brackets. The substrate processing device (1) includes a transport mechanism (TID), a transport mechanism (T1), a transport mechanism (T2) and a transport mechanism (TIFA). The transport mechanisms (TID, T1, T2, TIFA) transport substrates respectively.

[0003] The substrate processing device (1) includes a loading section (PASS1), a loading section (PASS2) and a loading section (PASS5). The loading sections (PASS1, PASS2, PASS5) are used to load substrates respectively. The transport mechanism (TID) and the transport mechanism (T1) transfer the substrate via the loading section (PASS1). The transport mechanism (T1) and the transport mechanism (T2) transfer the substrate via the loading section (PASS2). The transport mechanism (T2) and the transport mechanism (TIFA) transfer the substrate via the loading section (PASS5).

[0004] The substrate processing device (1) comprises a coating processing unit (31), a heat treatment unit (41), an edge exposure unit (EEW), a developing processing unit (DEV) and a heat treatment unit (42). The coating processing unit (31), the heat treatment unit (41), the edge exposure unit (EEW), the developing processing unit (DEV) and the heat treatment unit (42) process the substrate respectively. The transport mechanism (T1) transports the substrate to the coating processing unit (31) and the heat treatment unit (41). The transport mechanism (T2) transports the substrate to the edge exposure unit (EEW), the developing processing unit (DEV) and the heat treatment unit (42).

[0005] The transport mechanism (T1) repeatedly performs a series of actions (hereinafter referred to as "circulation actions"). The circulation action of the transport mechanism (T1) includes at least the following four approach actions.

[0006] ·1st approach action: Approaching the placement section (PASS1)

[0007] · Second approach action: Approaching the placement section (PASS2)

[0008] · Third approaching action: approaching the coating processing unit (31)

[0009] Fourth approach action: approaching the heat treatment unit (41)

[0010] The conveying mechanism (T2) repeatedly performs a series of actions (hereinafter referred to as "circulation actions"). The circulation actions of the conveying mechanism (T2) include at least the following five approach actions.

[0011] · Fifth approach action: Approaching the placement section (PASS2)

[0012] ·Sixth approach action: Approaching the placement section (PASS5)

[0013] ·7th approach action: Approaching the edge exposure unit (EEW)

[0014] 8th approaching action: approaching the developing unit (DEV)

[0015] · Ninth approach action: approaching the heat treatment unit (42)

[0016] The substrate processing device (1) includes a transport space (A1) and a transport space (A2). The transport space (A1) is arranged on the side of the coating processing unit (31) and the heat treatment unit (41). The transport mechanism (T1) is arranged in the transport space (A1). The transport space (A2) is arranged on the side of the edge exposure unit (EEW), the development processing unit (DEV) and the heat treatment unit (42). The transport mechanism (T2) is arranged in the transport space (A2). The loading section (PASS2) is arranged across the transport space (A1) and the transport space (A2). Summary of the invention

[0017] [Problems to be solved by the invention]

[0018] There is a demand for further improvement in the throughput (the number of substrates that can be processed per unit time) of substrate processing apparatuses. However, with the structure of the substrate processing apparatus (1) disclosed in Japanese Patent Application Laid-Open No. 2009-010291, it is difficult to further improve the throughput.

[0019] In addition, it is required to further reduce the footprint (installation area) of the substrate processing apparatus. However, with the structure of the substrate processing apparatus (1) shown in Japanese Patent Laid-Open No. 2009-010291, it is difficult to further reduce the footprint of the substrate processing apparatus (1).

[0020] The present invention has been made in view of the above circumstances, and a first object is to provide a substrate processing apparatus capable of improving throughput. Furthermore, a second object is to provide a substrate processing apparatus capable of reducing the footprint of the substrate processing apparatus.

[0021] [Technical means to solve the problem]

[0022] The present invention adopts the following configuration to achieve the above-mentioned object.

[0023] That is, the present invention is a substrate processing device, comprising: a loading unit that unloads a substrate from a carrier; a first processing unit that processes the substrate; a first conveying mechanism that conveys the substrate to the first processing unit; a second processing unit that processes the substrate differently from the first processing unit; a second conveying mechanism that conveys the substrate to the second processing unit; a first loading unit that carries a substrate to be carried between the loading unit and the first conveying mechanism; a second loading unit that carries a substrate to be carried between the first conveying mechanism and the second conveying mechanism; and a control unit that controls the loading unit, the first processing unit, the first conveying mechanism, the second processing unit, and the second conveying mechanism; and according to the control of the control unit, the first conveying mechanism repeatedly performs a process including three approach actions The first cycle action, one of the approach actions included in the first cycle action is a first approach action to approach the first loading section, another of the approach actions included in the first cycle action is a second approach action to approach the first processing section, and the remaining one of the approach actions included in the first cycle action is a third approach action to approach the second loading section. According to the control of the control section, the second conveying mechanism repeatedly performs a second cycle action including two or three approach actions, one of the approach actions included in the second cycle action is a fourth approach action to approach the second loading section, and the remaining one of the approach actions included in the second cycle action is a fifth approach action to approach the second processing section.

[0024] The substrate is transferred between the loading section and the first transfer mechanism via the first loading section. The substrate is transferred between the first transfer mechanism and the second transfer mechanism via the second loading section. The first transfer mechanism transfers the substrate to the first processing section. The second transfer mechanism transfers the substrate to the second processing section. The first processing section and the second processing section process the substrate respectively. The processing performed on the substrate by the second processing section is different from the processing performed on the substrate by the first processing section.

[0025] Here, the first conveying mechanism repeatedly performs the first cycle action according to the control of the control unit. The first cycle action includes three approach actions. That is, the number of approach actions included in the first cycle action is three. The approach actions included in the first cycle action are specifically the first approach action, the second approach action and the third approach action. Like this, the number of approach actions included in the first cycle action is relatively small. Therefore, the number of first cycle actions that can be performed by the first conveying mechanism per unit time is relatively large. In other words, the number of substrates that can be conveyed by the first conveying mechanism per unit time is relatively large. In short, the efficiency of the first conveying mechanism in conveying substrates (hereinafter appropriately referred to as "conveying efficiency") is relatively high.

[0026] The second conveying mechanism repeatedly performs the second cycle action according to the control of the control unit. The second cycle action is composed of only 2 or 3 approach actions. In other words, the number of approach actions included in the second cycle action is 2 or 3. Specifically, the approach actions included in the second cycle action are the 4th approach action and the 5th approach action. As such, the number of approach actions included in the second cycle action is relatively small. Therefore, the conveying efficiency of the second conveying mechanism is relatively high.

[0027] As described above, the first transport mechanism and the second transport mechanism have relatively high transport efficiencies, so the number of substrates that can be processed per unit time by the substrate processing apparatus is relatively large. Thus, the substrate processing apparatus can appropriately improve throughput.

[0028] In the substrate processing apparatus, it is preferred that the first approaching action includes an action of the first conveying mechanism that takes in a substrate on the first loading section and places the substrate on the first loading section, the second approaching action includes an action of the first conveying mechanism that carries a substrate into the first processing section and carries out a substrate from the first processing section, the third approaching action includes an action of the first conveying mechanism that takes in a substrate on the second loading section and places the substrate on the second loading section, the fourth approaching action includes an action of the second conveying mechanism that takes in a substrate on the second loading section and places the substrate on the second loading section, and the fifth approaching action includes an action of the second conveying mechanism that carries a substrate into the second processing section and carries out a substrate from the second processing section. Accordingly, the first conveying mechanism and the second conveying mechanism can carry the substrate supplied from the loading section to the first processing section and the second processing section. Furthermore, the first transfer mechanism and the second transfer mechanism can move the substrate processed in the first processing section and the second processing section back to the loading section.

[0029] In the substrate processing apparatus, it is preferred that the first processing unit is arranged outside the second area where the second conveying mechanism can convey substrates, and the second processing unit is arranged outside the first area where the first conveying mechanism can convey substrates. The first processing unit is arranged outside the second area of ​​the second conveying mechanism. Therefore, the first conveying mechanism can approach the first processing unit without interfering with the second conveying mechanism. Similarly, the second processing unit is arranged outside the first area of ​​the first conveying mechanism. Therefore, the second conveying mechanism can approach the second processing unit without interfering with the first conveying mechanism.

[0030] In the substrate processing device, it is preferred that the first area is roughly circular when viewed from above, and the second area is roughly circular when viewed from above. Since the first area is roughly circular when viewed from above, the first conveying mechanism can efficiently perform the three approach actions included in the first circulation action. In other words, the first conveying mechanism can efficiently perform the first circulation action. As a result, the conveying efficiency of the first conveying mechanism is higher. Similarly, since the second area is roughly circular when viewed from above, the second conveying mechanism can efficiently perform the two or three approach actions included in the second circulation action. In other words, the second conveying mechanism can efficiently perform the second circulation action. As a result, the conveying efficiency of the second conveying mechanism is higher.

[0031] In the substrate processing apparatus, it is preferred that the first loading portion is arranged between the loading portion and the first conveying mechanism, the second loading portion is arranged between the first conveying mechanism and the second conveying mechanism, the first processing portion is arranged on the side of the first conveying mechanism, and the second processing portion is arranged on the side of the second conveying mechanism. The first loading portion is arranged between the loading portion and the first conveying mechanism. Therefore, the loading portion and the first conveying mechanism can easily approach the first loading portion. The second loading portion is arranged between the first conveying mechanism and the second conveying mechanism. Therefore, the first conveying mechanism and the second conveying mechanism can easily approach the second loading portion. The first processing portion is arranged on the side of the first conveying mechanism. Therefore, the first conveying mechanism can easily approach the first processing portion. The second processing portion is arranged on the side of the second conveying mechanism. Therefore, the second conveying mechanism can easily approach the second processing portion.

[0032] In the substrate processing device, the first conveying mechanism, the second conveying mechanism and the second loading unit are preferably arranged in a triangle when viewed from above. Accordingly, the first conveying mechanism, the second conveying mechanism and the second loading unit are respectively located at the vertices of the triangle when viewed from above. Therefore, the distance between the first conveying mechanism and the second conveying mechanism can be reduced. As a result, the installation area (occupied area) of the substrate processing device can be reduced.

[0033] In the substrate processing device, the first conveying mechanism preferably comprises: a first pillar, which is arranged to be fixed and extends in the up-down direction; a first lifting part, which is supported by the first pillar and can move in the up-down direction; a first rotating part, which is supported by the first lifting part and can rotate around a first axis parallel to the up-down direction; and a first holding part, which is supported by the first rotating part and holds the substrate; and the first rotating part is arranged to be unable to move in the horizontal direction, and the first processing part comprises a plurality of first processing units for processing the substrate piece by piece, and each of the first processing units is arranged parallel to the first axis in a side view. The second conveying mechanism is provided with: a second pillar, which is arranged to be fixed and extends in the vertical direction; a second lifting part, which is supported by the second pillar and can move in the vertical direction; a second rotating part, which is supported by the second lifting part and can rotate around a second axis parallel to the vertical direction; and a second holding part, which is supported by the second rotating part and holds the substrate; and the second rotating part is arranged to be unable to move in the horizontal direction, and the second processing part is provided with a plurality of second processing units that process the substrate piece by piece, and each of the second processing units is arranged at a position overlapping with the second axis in a side view. The first pillar is arranged to be fixed. The first rotating part is arranged to be unable to move in the horizontal direction. Therefore, the first conveying mechanism can perform the first to third approach actions in a short time. Furthermore, each first processing unit is arranged at a position overlapping with the first axis in a side view. Therefore, the first conveying mechanism can easily approach each first processing unit. Similarly, the second pillar is arranged to be fixed. The second rotating part is arranged to be unable to move in the horizontal direction. Therefore, the second conveying mechanism can perform the fourth and fifth approaching operations in a short time. Furthermore, each second processing unit is arranged at a position overlapping with the second axis in a side view. Therefore, the second conveying mechanism can easily approach each second processing unit.

[0034] In the substrate processing device, it is preferred that one of the first processing unit and the second processing unit is a heat treatment unit that performs heat treatment on the substrate, and the heat treatment units are arranged in a vertical direction. Since the heat treatment units are arranged in a vertical direction, either the first conveying mechanism or the second conveying mechanism can easily approach each heat treatment unit. For example, when the first processing unit is a heat treatment unit, the first conveying mechanism can easily approach each heat treatment unit. For example, when the second processing unit is a heat treatment unit, the second conveying mechanism can easily approach the heat treatment unit.

[0035] In the substrate processing apparatus, preferably, in a plan view, the distance between the first axis and the second axis is less than 5 times the radius of the substrate. Accordingly, the distance between the first conveying mechanism and the second conveying mechanism can be reduced. Thus, the installation area (occupied area) of the substrate processing apparatus can be reduced.

[0036] In the substrate processing apparatus, the second placement unit is preferably arranged at a position not overlapping with a virtual straight line connecting the first axis and the second axis in a plan view. This can appropriately reduce the distance between the first transport mechanism and the second transport mechanism.

[0037] In the substrate processing apparatus, preferably, in a plan view, a distance between the first axis and the second mounting portion is substantially equal to a distance between the second axis and the second mounting portion. Thus, the first transport mechanism and the second transport mechanism can each easily approach the second mounting portion.

[0038] In the substrate processing apparatus, the second loading section preferably includes: a first portion overlapping the first processing section in a plan view; and a second portion overlapping the second processing section in a plan view. That is, the second loading section is arranged at a position overlapping both the first processing section and the second processing section in a plan view. As a result, it is possible to appropriately balance the reduction of the distance between the first conveying mechanism and the second conveying mechanism and the ease with which the first conveying mechanism and the second conveying mechanism can approach the second loading section.

[0039] In the substrate processing apparatus, the second placement unit preferably further includes a third portion that does not overlap the first processing unit and the second processing unit in a plan view. The first transfer mechanism and the second transfer mechanism can each more easily approach the second placement unit.

[0040] In the substrate processing apparatus, the third portion of the second placement unit preferably overlaps with a transfer space in which the first transfer mechanism and the second transfer mechanism are installed in a plan view. The first transfer mechanism and the second transfer mechanism can each more easily approach the second placement unit.

[0041] In the substrate processing device, it is preferred that the substrate processing device comprises: a plurality of first slots arranged on the side of the first conveying mechanism and arranged in a row in the vertical direction; and a plurality of second slots arranged on the side of the second conveying mechanism and arranged in a row in the vertical direction; and at least one of the first slots is a first processing slot for setting the first processing unit, and another of the first slots is a first loading slot for setting the second loading unit, and at least one of the second slots is a second processing slot for setting the second processing unit, and another of the second slots is a second loading slot for setting the second loading unit, and the second loading slot is arranged at the same height as the first loading slot, and the second loading unit is arranged across the first loading slot and the second loading slot. It is possible to effectively use a part of the first slot and a part of the second slot to appropriately set the second loading unit.

[0042] In the substrate processing device, it is preferred that the substrate processing device comprises: a third processing unit that performs a processing on the substrate that is different from that of the first processing unit and the second processing unit; a third conveying mechanism that conveys the substrate to the third processing unit; and a third loading unit for loading the substrate to be transported between the second conveying mechanism and the third conveying mechanism; and the control unit further controls the third processing unit and the third conveying mechanism, the second cycle action includes three of the approach actions, and the remaining one of the approach actions included in the second cycle action except the fourth approach action and the fifth approach action is a sixth approach action approaching the third loading unit, and according to the control of the control unit, the third conveying mechanism repeatedly performs a third cycle action including two or three approach actions, one of the approach actions included in the third cycle action is a seventh approach action approaching the third loading unit, and another one of the approach actions included in the third cycle action is an eighth approach action approaching the third processing unit.

[0043] The substrate is transported between the second transport mechanism and the third transport mechanism via the third loading unit. The third transport mechanism transports the substrate to the third processing unit. The third processing unit processes the substrate. The processing performed on the substrate by the third processing unit is different from the processing performed on the substrate by the first processing unit and is different from the processing performed on the substrate by the second processing unit.

[0044] Here, the second circulation action of the second conveying mechanism includes three approach actions. That is, the number of approach actions included in the second circulation action is three. Specifically, the approach actions included in the second circulation action are the fourth approach action, the fifth approach action, and the sixth approach action. As such, the number of approach actions included in the second circulation action is relatively small. Therefore, the conveying efficiency of the second conveying mechanism is relatively high.

[0045] According to the control of the control unit, the third conveying mechanism repeatedly performs the third cycle action. The third cycle action consists of only two or three approach actions. The number of approach actions included in the third cycle action is two or three. The approach actions included in the third cycle action are the seventh approach action and the eighth approach action. As such, the number of approach actions included in the third cycle action is relatively small. Therefore, the conveying efficiency of the third conveying mechanism is relatively high.

[0046] As described above, since the transfer efficiency of each of the first transfer mechanism, the second transfer mechanism, and the third transfer mechanism is high, the substrate processing apparatus can suitably improve throughput.

[0047] In the substrate processing apparatus, it is preferred that the sixth approaching action includes an action of the second conveying mechanism to obtain the substrate on the third loading section and to load the substrate on the third loading section, the seventh approaching action includes an action of the third conveying mechanism to obtain the substrate on the third loading section and to load the substrate on the third loading section, and the eighth approaching action includes an action of the third conveying mechanism to load a substrate into the third processing section and to load a substrate out of the third processing section. Accordingly, the first conveying mechanism, the second conveying mechanism, and the third conveying mechanism can transfer the substrate supplied from the loading section to the first processing section, the second processing section, and the third processing section. Furthermore, the first conveying mechanism, the second conveying mechanism, and the third conveying mechanism can move the substrate processed in the first processing section, the second processing section, and the third processing section back to the loading section.

[0048] In the substrate processing device, it is preferred that one of the first processing unit and the second processing unit is an edge exposure processing unit that exposes the peripheral portion of the substrate, the other of the first processing unit and the second processing unit is a heat treatment unit that performs heat treatment on the substrate, and the third processing unit is a liquid treatment unit that performs liquid treatment on the substrate. The first processing unit and the second processing unit are arranged at positions closer to the loading unit than the third processing unit. Therefore, the edge exposure processing unit and the heat treatment unit can be arranged at positions relatively close to the loading unit. In other words, the third processing unit is arranged at a position far away from the loading unit compared to the first processing unit and the second processing unit. Therefore, the liquid processing unit can be arranged at a position relatively far from the loading unit.

[0049] In the substrate processing device, it is preferred that the first conveying mechanism, the second conveying mechanism and the third conveying mechanism sequentially convey the substrate supplied from the loading section to the edge exposure processing section, the liquid processing section and the heat treatment section according to the control performed by the control section, and the first conveying mechanism and the second conveying mechanism move the substrate removed from the heat treatment section back to the loading section without delivering it to the third conveying mechanism according to the control performed by the control section. The third conveying mechanism does not convey the substrate removed from the heat treatment section. In other words, the third conveying mechanism does not contact the substrate after the heat treatment. The third conveying mechanism only conveys the substrate before the heat treatment to the liquid processing section. Therefore, the third conveying mechanism will not be thermally affected by the substrate after the heat treatment. As a result, the substrate transported to the liquid processing section will not be thermally affected by the third conveying mechanism. As a result, the quality of the liquid processing in the liquid processing section can be appropriately prevented from being damaged.

[0050] The substrate processing apparatus preferably includes a heat-insulating space that separates the third processing unit from the second processing unit. This can effectively reduce the thermal influence on the third processing unit from the second processing unit.

[0051] In the substrate processing apparatus, it is preferred that the third processing section includes a third long processing section and a third short processing section, the third conveying mechanism is disposed between the third long processing section and the third short processing section, the third long processing section, the third conveying mechanism and the third short processing section are arranged in the width direction, the length of the third short processing section in the front-rear direction orthogonal to the width direction is smaller than the length of the third long processing section in the front-rear direction, and the substrate processing apparatus includes a maintenance space, and the maintenance space and the third short processing section are arranged in the front-rear direction. The substrate processing apparatus includes the maintenance space, so that the substrate processing apparatus can be appropriately maintained.

[0052] In the substrate processing device, it is preferred that the substrate processing device comprises: a first block accommodating the first processing unit, the first conveying mechanism, the second processing unit, the second conveying mechanism and the second loading unit; and a second block connected to the first block accommodating the third processing unit and the third conveying mechanism; and the first block is roughly rectangular in front view, top view and side view, and the second block is roughly rectangular in front view, top view and side view. The first processing unit and the second processing unit are arranged in the first block. The third processing unit is arranged in the second block. Thereby, the first processing unit and the second processing unit can be appropriately separated from the third processing unit.

[0053] In the substrate processing apparatus, it is preferred that the substrate processing apparatus comprises: a first frame provided as a skeleton of the first block, supporting the first conveying mechanism, the second conveying mechanism, the first processing unit, the second processing unit, and the second loading unit; and a second frame provided as a skeleton of the second block, supporting the third conveying mechanism and the third processing unit; and the second frame is connected to the first frame. The first block and the second block can be appropriately configured by using the first frame and the second frame.

[0054] In addition, the present invention is a substrate processing device, comprising: a first processing part for processing a substrate; a second processing part for processing a substrate; a conveying space formed on the side of the first processing part and the second processing part; a first conveying mechanism disposed in the conveying space for conveying a substrate to the first processing part; a second conveying mechanism disposed in the conveying space for conveying a substrate to the second processing part; and a loading part for loading a substrate to be conveyed between the first conveying mechanism and the second conveying mechanism; and the loading part has a first portion overlapping with the first processing part in a plan view, and a second portion overlapping with the second processing part.

[0055] The substrate is transferred between the first transfer mechanism and the second transfer mechanism via the placement unit. The first transfer mechanism transfers the substrate to the first processing unit. The second transfer mechanism transfers the substrate to the second processing unit. The first processing unit and the second processing unit process the substrate, respectively.

[0056] The placement unit is arranged at a position overlapping with both the first processing unit and the second processing unit. Therefore, the distance between the first conveying mechanism and the second conveying mechanism can be reduced. As a result, the footprint of the substrate processing apparatus can be reduced.

[0057] In the substrate processing apparatus, the placement unit preferably includes a third portion overlapping the transfer space in a plan view. The first transfer mechanism and the second transfer mechanism can each easily access the placement unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0058] Although several aspects currently considered to be preferred are shown in the drawings for the purpose of explaining the invention, it should be understood that the invention is not limited to the structures and measures shown in the drawings.

[0059] Figure 1 This is a conceptual diagram of the substrate processing apparatus according to the first embodiment.

[0060] Figure 2 It is a diagram schematically showing the first to third cycle operations.

[0061] Figure 3 It is a diagram schematically showing a substrate transport path.

[0062] Figure 4 It is a top view of the substrate processing apparatus according to the first embodiment.

[0063] Figure 5 It is a left side view showing the structure of the left portion of the substrate processing apparatus.

[0064] Figure 6 It is a left side view showing the structure of the central portion of the substrate processing apparatus in the width direction.

[0065] Figure 7 It is a right side view showing the structure of the right part of the substrate processing apparatus.

[0066] Figure 8 It is a front view showing the structure of the first block.

[0067] Fig. 9 This is a top view of Block 1.

[0068] Fig.10 It is a rear view showing the structure of the second block.

[0069] Fig.11A , 11B Each of them is a plan view of a substrate processing apparatus according to a second embodiment.

[0070] Fig.12 It is a left side view showing the structure of the left portion of the substrate processing apparatus.

[0071] Fig.13 It is a left side view showing the structure of the central portion of the substrate processing apparatus in the width direction.

[0072] Fig.14 It is a right side view showing the structure of the right part of the substrate processing apparatus.

[0073] Fig.15 It is a front view showing the structure of the first block.

[0074] Fig.16 It is a rear view showing the structure of the second block.

[0075] Fig.17 It is a diagram schematically showing the circulation operation of the conveying mechanism.

[0076] Fig.18 It is a diagram schematically showing a substrate transport path.

[0077] Fig.19 1 is a top view of a substrate processing apparatus according to a modified embodiment. DETAILED DESCRIPTION

[0078] Hereinafter, a substrate processing apparatus according to the present invention will be described with reference to the accompanying drawings.

[0079] [First embodiment]

[0080] <Overview of Substrate Processing Apparatus>

[0081] Figure 1 1 is a conceptual diagram of a substrate processing apparatus according to the first embodiment. The substrate processing apparatus 1 according to the first embodiment performs a series of processes on a substrate (eg, a semiconductor wafer).

[0082] The substrate W is, for example, a semiconductor wafer, a liquid crystal display substrate, an organic EL (Electroluminescence) substrate, an FPD (Flat Panel Display) substrate, an optical display substrate, a magnetic disk substrate, a magneto-optical disk substrate, a photomask substrate, or a solar cell substrate. The substrate W has a substantially circular shape in plan view.

[0083] The substrate processing apparatus 1 includes a loader 11. The loader 11 unloads a substrate W from a carrier C. Furthermore, the loader 11 loads a substrate W into a carrier C. The carrier C accommodates a plurality of substrates W. The carrier C is, for example, a FOUP (front opening unified pod).

[0084] The substrate processing apparatus 1 includes a first processing unit 34, a second processing unit 37, and a third processing unit 64. The first processing unit 34, the second processing unit 37, and the third processing unit 64 process a substrate W, respectively. The processing performed on the substrate W by the first processing unit 34 is different from the processing performed on the substrate W by the second processing unit 37. The processing performed on the substrate W by the first processing unit 34 is different from the processing performed on the substrate W by the third processing unit 64. The processing performed on the substrate W by the second processing unit 37 is different from the processing performed on the substrate W by the third processing unit 64.

[0085] The first processing unit 34 is, for example, an edge exposure processing unit that exposes the peripheral portion of the substrate W. The processing performed on the substrate W by the first processing unit 34 is, for example, an edge exposure processing that exposes the peripheral portion of the substrate W.

[0086] The second processing unit 37 is, for example, a heat processing unit that performs a heat treatment on the substrate W. The processing performed by the second processing unit 37 on the substrate W is, for example, a heat treatment. The heat treatment performed by the second processing unit 37 includes a heat treatment in which the substrate W is heated.

[0087] The third processing section 64 is, for example, a liquid processing section that performs liquid processing on the substrate W. The processing performed by the third processing section 64 on the substrate W is, for example, liquid processing. The liquid processing performed by the third processing section 64 is, for example, a developing process in which a developing liquid is supplied to the substrate W to develop the substrate W.

[0088] The substrate processing apparatus 1 includes a first conveying mechanism 46, a second conveying mechanism 48, and a third conveying mechanism 68. The first conveying mechanism 46, the second conveying mechanism 48, and the third conveying mechanism 68 respectively convey substrates W. The first conveying mechanism 46 conveys the substrate W to the first processing section 34. The first conveying mechanism 46 does not convey the substrate W to the second processing section 37 and the third processing section 64. The second conveying mechanism 48 conveys the substrate W to the second processing section 37. The second conveying mechanism 48 does not convey the substrate W to the first processing section 34 and the third processing section 64. The third conveying mechanism 68 conveys the substrate W to the third processing section 64. The third conveying mechanism 68 does not convey the substrate W to the first processing section 34 and the second processing section 37.

[0089] The substrate processing apparatus 1 includes a first loading unit 21, a second loading unit 41, and a third loading unit 51. The first loading unit 21, the second loading unit 41, and the third loading unit 51 are used to load substrates W. The first loading unit 21 is used to load substrates W transferred between the loading unit 11 and the first conveying mechanism 46. The second loading unit 41 is used to load substrates W transferred between the first conveying mechanism 46 and the second conveying mechanism 48. The third loading unit 51 is used to load substrates W transferred between the second conveying mechanism 48 and the third conveying mechanism 68.

[0090] The substrate processing apparatus 1 includes a control unit 81. The control unit 81 is provided, for example, at the loader 11. The control unit 81 controls the substrate processing apparatus 1. Specifically, the control unit 81 controls the loader 11, the first processing unit 34, the second processing unit 37, the third processing unit 64, the first conveying mechanism 46, the second conveying mechanism 48, and the third conveying mechanism 68.

[0091] The control unit 81 is implemented by a central processing unit (CPU (Central Processing Unit)) that executes various processing, a RAM (Random-Access Memory) that serves as a work area for processing, and a storage medium such as a fixed disk. Various information such as a processing recipe (processing program) for processing the substrate W and information for identifying each substrate W is stored in the storage medium.

[0092] Figure 2 Schematically showing the first to third cycle operations. Under the control of the control unit 81, the first conveying mechanism 46 repeatedly performs the first cycle operation. Under the control of the control unit 81, the second conveying mechanism 48 repeatedly performs the second cycle operation. Under the control of the control unit 81, the third conveying mechanism 68 repeatedly performs the third cycle operation.

[0093] The first circulation operation of the first conveying mechanism 46 includes three approach operations. The three approach operations included in the first circulation operation are as follows.

[0094] · First approaching operation of approaching the first placement unit 21

[0095] · Second approaching operation of approaching the first processing unit 34

[0096] · Third approaching operation of approaching the second placement section 41

[0097] Here, the first approaching operation includes the operation of the first conveying mechanism 46 taking the substrate W on the first mounting portion 21, and the operation of the first conveying mechanism 46 placing the substrate W on the first mounting portion 21. The second approaching operation includes the operation of the first conveying mechanism 46 carrying the substrate W into the first processing portion 34, and the operation of the first conveying mechanism 46 carrying the substrate W out of the first processing portion 34. The third approaching operation includes the operation of the first conveying mechanism 46 taking the substrate W on the second mounting portion 41, and the operation of the first conveying mechanism 46 placing the substrate W on the second mounting portion 41.

[0098] The second circulation operation of the second conveying mechanism 48 includes three approach operations. The three approach operations included in the second circulation operation are as follows.

[0099] Fourth approaching operation of approaching the second placement unit 41

[0100] Fifth approaching operation of approaching the second processing unit 37

[0101] ·Sixth approaching operation of approaching the third placement unit 51

[0102] Here, the fourth approach operation includes an operation of the second conveying mechanism 48 taking in the substrate W on the second mounting portion 41, and an operation of the second conveying mechanism 48 placing the substrate W on the second mounting portion 41. The fifth approach operation includes an operation of the second conveying mechanism 48 carrying the substrate W into the second processing portion 37, and an operation of the second conveying mechanism 48 carrying out the substrate W from the second processing portion 37. The sixth approach operation includes an operation of the second conveying mechanism 48 taking in the substrate W on the third mounting portion 51, and an operation of the second conveying mechanism 48 placing the substrate W on the third mounting portion 51.

[0103] The third circulation operation of the third conveying mechanism 68 includes two approach operations. The two approach operations included in the third circulation operation are as follows.

[0104] ·Seventh approaching operation of approaching the third placement unit 51

[0105] · Eighth approaching operation of approaching the third processing unit 64

[0106] Here, the seventh approach operation includes the operation of the third conveying mechanism 68 taking the substrate W on the third mounting portion 51, and the operation of the third conveying mechanism 68 mounting the substrate W on the third mounting portion 51. The eighth approach operation includes the operation of the third conveying mechanism 68 carrying the substrate W into the third processing portion 64, and the operation of the third conveying mechanism 68 carrying the substrate W out of the third processing portion 64.

[0107] The substrate processing apparatus 1 operates, for example, as follows. According to the control performed by the control unit 81, the first conveying mechanism 46, the second conveying mechanism 48, and the third conveying mechanism 68 convey the substrate W supplied from the loading unit 11 to the first processing unit (edge ​​exposure processing unit) 34, the third processing unit (liquid processing unit) 64, and the second processing unit (heat treatment unit) 37 in sequence. Thereafter, the first conveying mechanism 46 and the second conveying mechanism 48 convey the substrate W from the second processing unit 37 to the loading unit 11. Here, the first conveying mechanism 46 and the second conveying mechanism 48 move the substrate W removed from the second processing unit (heat treatment unit) 37 back to the loading unit 11 without delivering it to the third conveying mechanism 68. The following is a more detailed description of an operation example of the substrate processing apparatus 1.

[0108] Reference Figure 2 , 3 . Figure 3 It is a diagram schematically showing a substrate transport path.

[0109] The loader 11 unloads the substrate W from the carrier C. The loader 11 places the substrate W on the first placement portion 21 . Thus, the loader 11 transfers the substrate W from the carrier C to the first placement portion 21 .

[0110] The first conveying mechanism 46 takes the substrate W on the first loading section 21 (first approaching action). The first conveying mechanism 46 carries the substrate W into the first processing section 34 (second approaching action). Thus, the first conveying mechanism 46 carries the substrate W from the first loading section 21 to the first processing section 34. The first processing section 34 processes the substrate W (edge ​​exposure processing). The first conveying mechanism 46 carries out the substrate W from the first processing section 34 (second approaching action). The first conveying mechanism 46 places the substrate W on the second loading section 41 (third approaching action). Thus, the first conveying mechanism 46 carries the substrate W from the first processing section 34 to the second loading section 41.

[0111] The second transport mechanism 48 takes the substrate W on the second mounting portion 41 (fourth approach operation). The second transport mechanism 48 mounts the substrate W on the third mounting portion 51 (sixth approach operation). Thus, the second transport mechanism 48 transports the substrate W from the second mounting portion 41 to the third mounting portion 51.

[0112] The third transport mechanism 68 takes the substrate W on the third loading section 51 (the seventh approach action). The third transport mechanism 68 carries the substrate W into the third processing section 64 (the eighth approach action). Thus, the third transport mechanism 68 carries the substrate W from the third loading section 51 to the third processing section 64. The third processing section 64 processes the substrate W (liquid treatment). The third transport mechanism 68 carries the substrate W out of the third processing section 64 (the eighth approach action). The third transport mechanism 68 carries the substrate W on the third loading section 51 (the seventh approach action). Thus, the third transport mechanism 68 carries the substrate W from the third processing section 64 to the third loading section 51.

[0113] The second transport mechanism 48 takes the substrate W on the third loading section 51 (the sixth approach action). The second transport mechanism 48 carries the substrate W into the second processing section 37 (the fifth approach action). Thus, the second transport mechanism 48 carries the substrate W from the third loading section 51 to the second processing section 37. The second processing section 37 processes (heat-treats) the substrate W. The second transport mechanism 48 carries the substrate W out of the second processing section 37 (the fifth approach action). The second transport mechanism 48 carries the substrate W on the second loading section 41 (the fourth approach action). Thus, the second transport mechanism 48 carries the substrate W from the second processing section 37 to the second loading section 41.

[0114] The first transport mechanism 46 takes the substrate W on the second mounting portion 41 (third approach operation). The first transport mechanism 46 mounts the substrate W on the first mounting portion 21 (first approach operation). Thus, the first transport mechanism 46 transports the substrate W from the second mounting portion 41 to the first mounting portion 21.

[0115] The loader 11 takes in the substrate W on the first mounting part 21 . The loader 11 carries the substrate W into the carrier C. Thus, the loader 11 carries the substrate W from the first mounting part 21 to the carrier C.

[0116] Here, the substrate processing apparatus 1 can simultaneously process a plurality of substrates W. When the substrate processing apparatus 1 simultaneously processes a plurality of substrates W, in one first approach operation, the following operations are performed: the first transport mechanism 46 takes the substrate W on the first mounting portion 21; and the first transport mechanism 46 mounts the substrate W on the first mounting portion 21. The same is true in the second to eighth approach operations.

[0117] <Main Effects of the First Embodiment>

[0118] According to the substrate processing apparatus 1, the following effects are achieved.

[0119] The substrate processing apparatus 1 includes three processing units (34, 37, 64). The substrate processing apparatus 1 includes a conveying mechanism (46, 48, 68) for each processing unit (34, 37, 64). The first conveying mechanism 46 is provided corresponding to the first processing unit 34, the second conveying mechanism 48 is provided corresponding to the second processing unit 37, and the third conveying mechanism 68 is provided corresponding to the third processing unit 64. Therefore, the number of processing units to which the first conveying mechanism 46 conveys the substrate W is one. Therefore, the number of approach actions included in the first circulation action of the first conveying mechanism 46 can be appropriately prevented from becoming four or more. Similarly, the number of processing units to which the second conveying mechanism 48 conveys the substrate W is one. Therefore, the number of approach actions included in the second circulation action of the second conveying mechanism 48 can be appropriately prevented from becoming four or more. The number of processing units to which the third conveying mechanism 68 conveys the substrate W is one. Therefore, it is possible to preferably prevent the number of approach operations included in the third circulation operation of the third transport mechanism 68 from becoming four or more.

[0120] Specifically, the number of approach actions included in the first cycle action is 3. The number of approach actions included in the first cycle action is relatively small. Therefore, the number of first cycle actions that can be performed by the first transport mechanism 46 per unit time is relatively large. In other words, the number of substrates W that can be transported by the first transport mechanism 46 per unit time is relatively large. In short, the efficiency of the first transport mechanism 46 in transporting the substrates W (hereinafter appropriately referred to as "transport efficiency") is relatively high.

[0121] The number of approaching operations included in the second circulation operation is 3. The number of approaching operations included in the second circulation operation is relatively small. Therefore, the conveying efficiency of the second conveying mechanism 48 is relatively high.

[0122] The number of approaching operations included in the third circulation operation is 2. The number of approaching operations included in the third circulation operation is relatively small. Therefore, the conveying efficiency of the third conveying mechanism 68 is relatively high.

[0123] As described above, the first transport mechanism 46, the second transport mechanism 48, and the third transport mechanism 68 have relatively high transport efficiencies, so the substrate processing apparatus 1 can process a relatively large number of substrates W per unit time. This can appropriately improve the throughput of the substrate processing apparatus 1.

[0124] The first approach operation includes an operation of taking in a substrate W on the first loading section 21 and an operation of placing the substrate W on the first loading section 21. The second approach operation includes an operation of carrying the substrate W into the first processing section 34 and an operation of carrying the substrate W out of the first processing section 34. The third approach operation includes an operation of taking in a substrate W on the second loading section 41 and an operation of placing the substrate W on the second loading section 41. The fourth approach operation includes an operation of taking in a substrate W on the second loading section 41 and an operation of placing the substrate W on the second loading section 41. The fifth approach operation includes an operation of carrying in a substrate W into the second processing section 37 and an operation of carrying the substrate W out of the second processing section 37. The sixth approach operation includes an operation of taking in a substrate W on the third loading section 51 and an operation of placing the substrate W on the third loading section 51. The seventh approach operation includes an operation of taking in a substrate W on the third loading section 51 and an operation of placing the substrate W on the third loading section 51. The eighth approach operation includes an operation of carrying the substrate W into the third processing unit 64 and an operation of carrying the substrate W out of the third processing unit 64. Therefore, the first, second, and third transport mechanisms 46, 48, and 68 can transport the substrate W supplied from the loader 11 to the first, second, and third processing units 34, 37, and 64. Furthermore, the first, second, and third transport mechanisms 46, 48, and 68 can move the substrate W processed in the first, second, and third processing units 34, 37, and 64 back to the loader 11.

[0125] The first conveying mechanism 46, the second conveying mechanism 48, and the third conveying mechanism 68 convey the substrate W supplied from the loading part 11 to the first processing part (edge ​​exposure processing part) 34, the third processing part (liquid processing part) 64, and the second processing part (heat treatment part) 37 in sequence. Furthermore, the first conveying mechanism 46 and the second conveying mechanism 48 return the substrate W unloaded from the second processing part (heat treatment part) 37 to the loading part 11 without delivering it to the third conveying mechanism 68. Therefore, the third conveying mechanism 68 does not convey the substrate W unloaded from the second processing part (heat treatment part) 37. In other words, the third conveying mechanism 68 does not contact the substrate W after the heat treatment. The third conveying mechanism 68 conveys only the substrate W before the heat treatment. Therefore, the third conveying mechanism 68 is not thermally affected by the substrate W after the heat treatment. Thus, the third conveying mechanism 68 can convey the substrate W to the third processing part (liquid processing part) 64 without causing thermal influence on the substrate W. For example, the third transport mechanism 68 can transport the substrate W to the third processing section (liquid processing section) 64 without changing the temperature of the substrate W. This can preferably prevent the processing quality in the third processing section (liquid processing section) 64 from being impaired.

[0126] Hereinafter, the structure of the substrate processing apparatus 1 will be described in further detail.

[0127] <Overall Structure of Substrate Processing Apparatus 1>

[0128] Figure 4 1 is a top view of a substrate processing apparatus 1 according to a first embodiment. The substrate processing apparatus 1 includes a loading unit 11, a first block 31, and a second block 61. The first block 31 is connected to the loading unit 11. The second block 61 is connected to the first block 31. The first block 31 accommodates a first processing unit 34, a second processing unit 37, a second loading unit 41, a first conveying mechanism 46, and a second conveying mechanism 48. The second block 61 accommodates a third processing unit 64 and a third conveying mechanism 68. The first loading unit 21 is provided across the loading unit 11 and the first block 31. The third loading unit 51 is provided across the first block 31 and the second block 61.

[0129] The loading section 11 , the first block 31 , and the second block 61 are arranged in a row in the horizontal direction. The first block 31 is arranged between the loading section 11 and the second block 61 .

[0130] Here, the direction in which the loading section 11, the first block 31, and the second block 61 are arranged is referred to as the "front-to-back direction X". The direction from the second block 61 toward the loading section 11 in the front-to-back direction X is referred to as the "front". The direction opposite to the front is referred to as the "rear". The horizontal direction perpendicular to the front-to-back direction X is referred to as the "width direction Y" or the "side". One direction of the "width direction Y" is appropriately referred to as the "right". The direction opposite to the right is referred to as the "left". The vertical direction is referred to as the "up-down direction Z". The up-down direction Z is perpendicular to the front-to-back direction X and to the width direction Y. In each figure, the front, back, right, left, top, and bottom are appropriately shown for reference.

[0131] Hereinafter, each part of the substrate processing apparatus 1 will be described.

[0132] <Loading Unit 11>

[0133] Reference Figure 4-7 . Figure 5 It is a left side view showing the structure of the left portion of the substrate processing apparatus 1. Figure 6 1 is a left side view showing the structure of the central portion of the substrate processing apparatus 1 in the width direction Y. FIG. Figure 7 It is a right side view showing the structure of the right part of the substrate processing apparatus 1.

[0134] The loading section 11 includes carrier placement sections 12A and 12B. The carrier placement sections 12A and 12B are arranged so as to be aligned in the width direction Y. The carrier placement section 12A is arranged on the right side of the carrier placement section 12B. One carrier C is placed on each of the carrier placement sections 12A and 12B.

[0135] When distinguishing between the carrier C on the carrier placement portion 12A and the carrier C on the carrier placement portion 12B, the carrier C on the carrier placement portion 12A is described as “carrier CA” and the carrier C on the carrier placement portion 12B is described as “carrier CB”.

[0136] The loading section 11 includes a transfer space 13. The transfer space 13 is disposed behind the carrier placement sections 12A and 12B.

[0137] The loading section 11 includes loading conveying mechanisms 14A and 14B. The loading conveying mechanisms 14A and 14B are provided in the conveying space 13. The loading conveying mechanisms 14A and 14B are arranged in a row in the width direction Y. The loading conveying mechanism 14B is arranged on the left side of the loading conveying mechanism 14A. The loading conveying mechanism 14A is arranged behind the carrier loading section 12A. The loading conveying mechanism 14B is arranged behind the carrier loading section 12B.

[0138] The loading transport mechanism 14A includes a support column 15a, a lifting unit 15b, a rotating unit 15c, and holding units 15d and 15e. The holding unit 15e is shown in FIG. Figure 7 . The pillar 15a extends in the up-down direction Z. The pillar 15a is set to be fixed. That is, the pillar 15a cannot move. The lifting part 15b is supported on the pillar 15a. The lifting part 15b cannot move in the up-down direction Z relative to the pillar 15a. The lifting part 15b cannot move in the horizontal direction. The rotating part 15c is supported on the lifting part 15b. The rotating part 15c can rotate relative to the lifting part 15b. The rotation axis of the rotating part 15c is parallel to the up-down direction Z. The rotating part 15c cannot move in the horizontal direction. The holding parts 15d and 15e are supported on the rotating part 15c. The holding parts 15d and 15e can move forward and backward in the horizontal direction relative to the rotating part 15c. The holding parts 15d and 15e can move forward and backward independently. The holding parts 15d and 15e are in contact with the substrate W respectively. The holding parts 15d and 15e each hold one substrate W in a horizontal posture.

[0139] The loading conveying mechanism 14B has substantially the same structure as the loading conveying mechanism 14A. Specifically, the loading conveying mechanism 14B includes a support column 15a, a lifting unit 15b, a rotating unit 15c, and holding units 15d and 15e.

[0140] As described above, in this specification, when different elements have the same structure, the structure is denoted by a common reference numeral and detailed description thereof is omitted.

[0141] The loading transport mechanism 14A can approach the carrier CA and the first loading section 21 .

[0142] The loader transport mechanism 14A can unload a substrate W from the carrier CA and load a substrate W into the carrier CA. The loader transport mechanism 14A can load a substrate W on the first loading portion 21 and can take a substrate W on the first loading portion 21. The loader transport mechanism 14A cannot approach the carrier CB.

[0143] The loading transport mechanism 14B can approach the carrier CB and the first placement section 21 .

[0144] The loader transport mechanism 14B can unload a substrate W from the carrier CB and load a substrate W into the carrier CB. The loader transport mechanism 14B can load a substrate W on the first loading portion 21 and can take a substrate W on the first loading portion 21. The loader transport mechanism 14B cannot approach the carrier CA.

[0145] The loading transport mechanisms 14A and 14B are controlled by the control unit 81. According to the control of the control unit 81, the loading transport mechanism 14A alternately performs the approaching operation to the carrier CA and the approaching operation to the first loading unit 21. According to the control of the control unit 81, the loading transport mechanism 14B alternately performs the approaching operation to the carrier CB and the approaching operation to the first loading unit 21. Thus, the loader 11 unloads the substrate W from the carrier C, and delivers the substrate W unloaded from the carrier C to the first transport mechanism 46. Furthermore, the loader 11 receives the substrate W from the first transport mechanism 46, and transfers the substrate W received from the first transport mechanism 46 to the carrier C.

[0146] <Block 1 31>

[0147] Reference Figure 4-8 . Figure 8 1 is a front view showing the structure of the first block 31 (specifically, the second processing unit 37 and the second conveying mechanism 48). The first block 31 has a substantially box shape. The first block 31 is substantially rectangular in plan view, side view, and front view.

[0148] The first block 31 has a first frame 32. The first frame 32 is provided as a framework (skeleton) of the first block 31. The first frame 32 defines the shape of the first block 31. The first frame 32 is made of metal, for example.

[0149] The first frame 32 supports the first processing section 34 , the second processing section 37 , the second placement section 41 , the first transport mechanism 46 , and the second transport mechanism 48 .

[0150] The substrate processing apparatus 1 includes a transport space 45. The transport space 45 is formed in the first block 31. The transport space 45 is formed on the side of the first processing unit 34 and the second processing unit 37. More specifically, the transport space 45 is formed in the central portion of the first block 31 in the width direction Y. The transport space 45 extends in the front-rear direction X. The transport space 45 extends from the front portion of the first block 31 to the rear portion of the first block 31. The transport space 45 is connected to the transport space 13 of the loading unit 11. The transport space 45 and the first processing unit 34 are arranged in the width direction Y. The transport space 45 and the second processing unit 37 are arranged in the width direction Y.

[0151] The first conveying mechanism 46 and the second conveying mechanism 48 are provided in the conveying space 45. The first conveying mechanism 46 is arranged behind the loading unit 11. The second conveying mechanism 48 is arranged behind the first conveying mechanism 46. The first conveying mechanism 46 and the second conveying mechanism 48 are arranged in a manner aligned in the front-rear direction X. The first conveying mechanism 46 is arranged between the loading unit 11 and the second conveying mechanism 48.

[0152] The first processing section 34 is arranged on the side of the first conveying mechanism 46. More specifically, the first processing section 34 and the first conveying mechanism 46 are arranged in the width direction Y. The first processing section 34 is arranged at a position to the right of the first conveying mechanism 46 and at a position to the left of the first conveying mechanism 46. The first processing section 34 arranged at a position to the right of the first conveying mechanism 46 is referred to as a "first right processing section 34R". The first processing section 34 arranged at a position to the left of the first conveying mechanism 46 is referred to as a "first left processing section 34L". The first right processing section 34R, the first conveying mechanism 46, and the first left processing section 34L are arranged in a row in the width direction Y. The first conveying mechanism 46 is arranged between the first right processing section 34R and the first left processing section 34L.

[0153] The second processing section 37 is arranged on the side of the second conveying mechanism 48. In more detail, the second processing section 37 and the second conveying mechanism 48 are arranged in the width direction Y. The second processing section 37 is arranged at a position to the right of the second conveying mechanism 48 and a position to the left of the second conveying mechanism 48. The second processing section 37 arranged at a position to the right of the second conveying mechanism 48 is referred to as a "second right processing section 37R". The second processing section 37 arranged at a position to the left of the second conveying mechanism 48 is referred to as a "second left processing section 37L". The second right processing section 37R, the second conveying mechanism 48 and the second left processing section 37L are arranged in a row in the width direction Y. The second conveying mechanism 48 is arranged between the second right processing section 37R and the second left processing section 37L.

[0154] The first treatment section 34 and the second treatment section 37 are arranged in the front-to-back direction X. The second treatment section 37 is arranged behind the first treatment section 34. The second treatment section 37 is arranged at a position that does not overlap with the first treatment section 34 in a plan view. The second right treatment section 37R is arranged behind the first right treatment section 34R. The first right treatment section 34R and the second right treatment section 37R are arranged in the front-to-back direction X along the conveying space 45. The second left treatment section 37L is arranged behind the first left treatment section 34L. The first left treatment section 34L and the second left treatment section 37L are arranged in the front-to-back direction X along the conveying space 45.

[0155] The second placement portion 41 is disposed between the first conveying mechanism 46 and the second conveying mechanism 48. The second placement portion 41 is disposed on the left and rear side of the first conveying mechanism 46. The second placement portion 41 is disposed on the left and front side of the second conveying mechanism 48.

[0156] The second placement unit 41, the first conveying mechanism 46, and the second conveying mechanism 48 are arranged in a triangle in a plan view. Specifically, the second placement unit 41, the first conveying mechanism 46, and the second conveying mechanism 48 are located at vertices of an imaginary triangle (specifically, an acute triangle) in a plan view.

[0157] The second placement portion 41 is arranged at a position overlapping the first processing portion 34 and the second processing portion 37 in a plan view. Specifically, the second placement portion 41 has a first portion 41a overlapping the first processing portion 34 in a plan view, and a second portion 41b overlapping the second processing portion 37 in a plan view. More specifically, the first portion 41a of the second placement portion 41 overlaps the first left processing portion 34L in a plan view. The second portion 41b of the second placement portion 41 overlaps the second left processing portion 37L in a plan view.

[0158] Furthermore, the second placing portion 41 extends toward the transport space 45. Specifically, the second placing portion 41 has a third portion 41c that overlaps with the transport space 45 in a plan view. The third portion 41c of the second placing portion 41 does not overlap with the first processing portion 34 and the second processing portion 37 in a plan view. The third portion 41c of the second placing portion 41 protrudes toward the transport space 45 more than the first left processing portion 34L and the second left processing portion 37L.

[0159] The second placement section 41 is disposed approximately equidistant from the first conveying mechanism 46 and the second conveying mechanism 48. Specifically, in a plan view, the distance between the first conveying mechanism 46 and the second placement section 41 is approximately equal to the distance between the second conveying mechanism 48 and the second placement section 41.

[0160] The first processing section 34 includes a plurality of (for example, two) first processing units 35 that process substrates W piece by piece. The first processing unit 35 is an edge exposure processing unit. Each first processing unit 35 performs edge exposure processing on one substrate W. One first processing unit 35 is arranged on the right side of the first conveying mechanism 46. The first processing unit 35 arranged on the right side of the first conveying mechanism 46 belongs to the first right processing section 34R. The remaining one first processing unit 35 is arranged on the left side of the first conveying mechanism 46. The first processing unit 35 arranged on the left side of the first conveying mechanism 46 belongs to the first left processing section 34L.

[0161] Each first processing unit 35 includes a rotating holding portion 36a and a light irradiation portion 36b. The rotating holding portion 36a holds one substrate W in a horizontal position. The rotating holding portion 36a can rotate the held substrate W. The rotation axis of the substrate W is substantially parallel to the up-down direction Z. The light irradiation portion 36b irradiates light to the peripheral portion of the substrate W held by the rotating holding portion 36a. The peripheral portion of the substrate W is exposed by the light irradiated by the light irradiation portion 36b.

[0162] The second processing section 37 includes a plurality of (eg, nine) second processing units 38 that process each substrate W. The second processing units 38 are heat treatment units. Each second processing unit 38 heat treats one substrate W. The heat treatment units are arranged in a vertical direction Z.

[0163] Reference Figure 7 , 8 The five second processing units 38 are arranged on the right side of the second conveying mechanism 48. All the second processing units 38 arranged on the right side of the second conveying mechanism 48 belong to the second right processing section 37R. All the second processing units 38 belonging to the second right processing section 37R are arranged in a row in the vertical direction Z.

[0164] Reference Figure 5 , 8 The remaining four second processing units 38 are arranged on the left side of the second conveying mechanism 48. All the second processing units 38 arranged on the left side of the second conveying mechanism 48 belong to the second left processing section 37L. All the second processing units 38 belonging to the second left processing section 37L are arranged in a row in the vertical direction Z.

[0165] Reference Figure 4 , 8. Each second processing unit 38 includes a first plate 39a and a second plate 39b. The first plate 39a places a substrate W in a horizontal position. The second plate 39b places a substrate W in a horizontal position. The first plate 39a and the second plate 39b are arranged in a manner arranged in the width direction Y. The first plate 39a is arranged at a position closer to the conveying space 45 than the second plate 39b. Each second processing unit 38 includes a local conveying mechanism not shown in the figure. The local conveying mechanism conveys the substrate W between the first plate 39a and the second plate 39b. Each second processing unit 38 also includes a temperature control machine not shown in the figure. The temperature control machine is installed on the second plate 39b. The temperature control machine adjusts the temperature of the second plate 39b. The temperature control machine is, for example, a heater. Therefore, the second plate 39b can heat the substrate W placed on the second plate 39b to a specific temperature.

[0166] Reference Figure 5 , 8 The second mounting portion 41 includes a plurality of (for example, two) flat plates 42a and 42b. Each flat plate 42a and 42b mounts a substrate W in a horizontal position. The flat plates 42a and 42b are arranged in a row in the vertical direction Z. The flat plate 42b is arranged below the flat plate 42a. The flat plate 42b overlaps the flat plate 42a in a plan view.

[0167] Reference Figure 5 , 7 , 8. The substrate processing apparatus 1 includes grooves 43a-43j and grooves 44a-44j. The grooves 43a-43c and 43f-43h support the first processing unit 34. The grooves 43a-43c and 43f-43h function as a frame or a stay for installing the first processing unit 34. The grooves 44a-44h and 44j support the second processing unit 37. The grooves 44a-44h and 44j function as a frame or a stay for installing the second processing unit 37. The grooves 43i and 44i support the second loading unit 41. The grooves 43i and 44i function as a frame or a stay for installing the second loading unit 41. The grooves 43a-43j and 44a-44j have substantially the same shape and structure.

[0168] When the grooves 43a to 43j are not distinguished, they are referred to as "grooves 43". When the grooves 44a to 44j are not distinguished, they are referred to as "grooves 44".

[0169] The groove 43 is arranged on the side of the first conveying mechanism 46. The groove 43 and the first conveying mechanism 46 are arranged in the width direction Y. The grooves 43a-43e are arranged at the right position of the first conveying mechanism 46. The grooves 43f-43j are arranged at the left position of the first conveying mechanism 46. The groove 44 is arranged on the side of the second conveying mechanism 48. The groove 44 and the second conveying mechanism 48 are arranged in the width direction Y. The grooves 44a-44e are arranged at the right position of the second conveying mechanism 48. The grooves 44f-44j are arranged at the left position of the second conveying mechanism 48.

[0170] Reference Figure 7 The grooves 43a to 43e are arranged in a row in the vertical direction Z. The grooves 43a, 43b, 43c, 43d, and 43e are arranged in order from top to bottom. The groove 43a is arranged at the highest position among the grooves 43a to 43e. The groove 43e is arranged at the lowest position among the grooves 43a to 43e.

[0171] Reference Figure 5 The grooves 43f to 43j are arranged in a row in the vertical direction Z. The grooves 43f, 43g, 43h, 43i, and 43j are arranged in order from top to bottom. The groove 43f is arranged at the highest position among the grooves 43f to 43j. The groove 43j is arranged at the lowest position among the grooves 43f to 43j.

[0172] Reference Figure 7 , 8 The grooves 44a to 44e are arranged in a row in the vertical direction Z. The grooves 44a, 44b, 44c, 44d, and 44e are arranged in order from top to bottom. The groove 44a is arranged at the highest position among the grooves 44a to 44e. The groove 44e is arranged at the lowest position among the grooves 44a to 44e.

[0173] Reference Figure 5 , 8 The grooves 44f to 44j are arranged in a row in the vertical direction Z. The grooves 44f, 44g, 44h, 44i, and 44j are arranged in order from top to bottom. The groove 44f is arranged at the highest position among the grooves 44f to 44j. The groove 44j is arranged at the lowest position among the grooves 44f to 44j.

[0174] The groove 43 and the groove 44 are arranged in the front-to-back direction X. The groove 44 is arranged behind the groove 43. Specifically, the groove 43a and the groove 44a are arranged in the front-to-back direction X. The groove 44a is arranged behind the groove 43a. The groove 44a is arranged at the same height position as the groove 43a. Similarly, the grooves 43b-43e and the grooves 44b-44e are arranged in the front-to-back direction X. The grooves 44b-44e are arranged behind the grooves 43b-43e, respectively. The grooves 44b-44e are arranged at the same height position as the grooves 43b-43e, respectively. The grooves 43f-43j and the grooves 44f-44j are arranged in the front-to-back direction X. The grooves 44f-44j are arranged behind the grooves 43f-43j, respectively. The grooves 44f-44j are arranged at the same height position as the grooves 43f-43j, respectively.

[0175] Reference Figure 5 , 7 . One first processing unit 35 has a size equivalent to three slots 43 continuous in the up-down direction Z. The first processing unit 35 belonging to the first right processing unit 34R is arranged across the slots 43a-43c. The horizontal wall portion separating the slots 43a and 43b, and the horizontal wall portion separating the slots 43b and 43c are omitted. The first processing unit 35 belonging to the first left processing unit 34L is arranged across the slots 43f-43h. The horizontal wall portion separating the slots 43f and 43g, and the horizontal wall portion separating the slots 43g and 43h are omitted.

[0176] The grooves 43d, 43e, and 43j are empty. Neither the first processing unit 35 nor the second placement portion 41 is provided in the grooves 43d, 43e, and 43j.

[0177] Reference Figure 5 , 7 , 8. One second processing unit 38 has a size corresponding to one slot 44. One second processing unit 38 is provided in each of the slots 44a to 44h and 44j.

[0178] The second carrier 41 is provided across the groove 43i and the groove 44i. The second carrier 41 is provided across the groove 43i and the groove 44i. The vertical wall portion separating the groove 43i and the groove 44i is omitted. The first portion 41a of the second carrier 41 is accommodated in the groove 43i. The second portion 41b of the second carrier 41 is accommodated in the groove 44i. The third portion 41c of the second carrier 41 bulges out from the groove 43i and the groove 44i.

[0179] Grooves 43f-43j are examples of the first groove in the present invention. In particular, three of the first grooves (specifically, grooves 43f-43h) are examples of the first groove for processing in the present invention. Another of the first grooves (specifically, groove 43i) is an example of the first groove for loading in the present invention. Grooves 44f-44j are examples of the second groove in the present invention. In particular, four of the second grooves (specifically, grooves 44f-44h, 44j) are examples of the second groove for processing in the present invention. Another of the second grooves (specifically, groove 44i) is an example of the second groove for loading in the present invention.

[0180] Reference Figure 6 , 9 . Fig. 9 4 is a top view of the first block 31. The first conveying mechanism 46 includes first pillars 47a, 47b, a first lifting portion 47c, a first rotating portion 47d, and first holding portions 47e, 47f. The first pillars 47a, 47b extend in the up-down direction Z. The first pillars 47a, 47b are arranged in a manner arranged in the width direction Y. The first pillars 47a, 47b are set to be fixed. Therefore, the first pillars 47a, 47b cannot move. Specifically, the first pillars 47a, 47b are fixed to the first frame 32. The first pillars 47a, 47b cannot move relative to the first frame 32. The first lifting portion 47c is supported by the first pillars 47a, 47b. The first lifting portion 47c cannot move relative to the first pillars 47a, 47b. The first lifting portion 47c can move in the up-down direction Z. The first lifting portion 47c cannot move in the horizontal direction. The first rotating part 47d is supported by the first lifting part 47c. The first rotating part 47d can rotate relative to the first lifting part 47c. The first rotating part 47d can rotate around the first axis A1. The first axis A1 is parallel to the up-down direction Z. The first rotating part 47d cannot move in the horizontal direction. The first axis A1 cannot move in the horizontal direction. The first holding parts 47e and 47f are supported by the first rotating part 47d. The first holding parts 47e and 47f can move forward and backward in the horizontal direction relative to the first rotating part 47d. The first holding parts 47e and 47f can move forward and backward independently. The first holding parts 47e and 47f are in contact with the substrate W respectively. The first holding parts 47e and 47f respectively hold one substrate W in a horizontal posture.

[0181] Reference Figure 6 , 8, 9. The second conveying mechanism 48 includes second pillars 49a, 49b, a second lifting part 49c, a second rotating part 49d and second holding parts 49e, 49f. The second pillars 49a, 49b extend in the up-down direction Z. The second pillars 49a, 49b are arranged in a manner arranged in the width direction Y. The second pillars 49a, 49b are set to be fixed. Therefore, the second pillars 49a, 49b cannot move. Specifically, the second pillars 49a, 49b are fixed to the first frame 32. The second pillars 49a, 49b cannot move relative to the first frame 32. The second lifting part 49c is supported by the second pillars 49a, 49b. The second lifting part 49c can move relative to the second pillars 49a, 49b. The second lifting part 49c can move in the up-down direction Z. The second lifting part 49c cannot move in the horizontal direction. The second rotating part 49d is supported by the second lifting part 49c. The second rotating part 49d can rotate relative to the second lifting part 49c. The second rotating part 49d can rotate around the second axis line A2. The second axis line A2 is parallel to the up-down direction Z. The second rotating part 49d cannot move in the horizontal direction. The second axis line A2 cannot move in the horizontal direction. The second holding parts 49e and 49f are supported on the second rotating part 49d. The second holding parts 49e and 49f can move forward and backward in the horizontal direction relative to the second rotating part 49d. The second holding parts 49e and 49f can move forward and backward independently. The second holding parts 49e and 49f are in contact with the substrate W respectively. The second holding parts 49e and 49f respectively hold one substrate W in a horizontal posture.

[0182] Reference Figure 5 , 7 . Each first processing unit 35 is arranged at a position overlapping with the first axis A1 in a side view. That is, all first processing units 35 overlap with the first axis A1 in a side view. Each second processing unit 38 is arranged at a position overlapping with the second axis A2 in a side view. That is, all second processing units 38 overlap with the second axis A2 in a side view.

[0183] Reference Fig. 9 . Fig. 9 The imaginary straight line L connecting the first axis A1 and the second axis A2 is shown. The imaginary straight line L is parallel to the front-rear direction X in a plan view. The second placement portion 41 is arranged at a position not overlapping the imaginary straight line L in a plan view. The second placement portion 41 is arranged to the left of the imaginary straight line L in a plan view.

[0184] In a plan view, a distance D1 between the first axis A1 and the second axis A2 is less than 5 times the radius r of the substrate W. In a plan view, a distance D1 between the first axis A1 and the second axis A2 is more than 4 times the radius r of the substrate W.

[0185] The second mounting portion 41 is disposed substantially equidistant from the first axis A1 and the second axis A2 in plan view. Specifically, the distance between the first axis A1 and the second mounting portion 41 and the distance between the second axis A2 and the second mounting portion 41 are substantially equal in plan view.

[0186] The center point of the substrate W placed on the second placement portion 41 is referred to as "point P1". In a plan view, the distance D2 between the first axis A1 and point P1 and the distance D3 between the second axis A2 and point P1 are substantially equal. For example, the difference between the distance D2 and the distance D3 is less than the radius r of the substrate W.

[0187] In a plan view, the first axis A1 is disposed approximately equidistant from the second placement portion 41 and the first treatment portion 34. Specifically, in a plan view, the distance between the first axis A1 and the second placement portion 41 is approximately equal to the distance between the first axis A1 and the first treatment portion 34.

[0188] The center point of the substrate W mounted on the rotation holding portion 36a is referred to as "point P2". In a plan view, a distance D2 between the first axis A1 and point P1 and a distance D4 between the first axis A1 and point P2 are substantially equal. The difference between the distance D2 and the distance D4 is less than the radius r of the substrate W.

[0189] In a plan view, the second axis A2 is disposed approximately equidistant from the second placement portion 41 and the second treatment portion 37. Specifically, in a plan view, the distance between the second axis A2 and the second placement portion 41 is approximately equal to the distance between the second axis A2 and the second treatment portion 37.

[0190] The center point of the substrate W placed on the first plate 39a is referred to as "point P3". In plan view, the distance D3 between the second axis A2 and point P1 and the distance D5 between the second axis A2 and point P3 are substantially equal. The difference between the distance D3 and the distance D5 is less than the radius r of the substrate W.

[0191] Reference Figure 4 , 9 The substrate processing apparatus 1 further includes a space E. The space E is formed in the first block 31 . The space E is disposed behind the second processing unit 37 . The space E is disposed on the side of the transfer space 45 .

[0192] The space E includes spaces E1 and E2. The space E1 is formed behind the second right processing section 37R and on the right side of the conveying space 45. The space E2 is formed behind the second left processing section 37L and on the left side of the conveying space 45.

[0193] <Block 2 61>

[0194] Reference Figure 4-7 、10. Fig.102 is a rear view showing the structure of the second block 61. The second block 61 has a substantially box shape. The second block 61 is substantially rectangular in a plan view, a side view, and a front view.

[0195] The second block 61 has a second frame 62. The second frame 62 is provided as a skeleton of the second block 61. The second frame 62 defines the shape of the second block 61. The second frame 62 is made of metal, for example.

[0196] The second frame 62 is connected to the first frame 32. The second frame 62 supports the third processing unit 64 and the third transport mechanism 68.

[0197] The substrate processing apparatus 1 includes a transfer space 67. The transfer space 67 is formed in the second block 61. The transfer space 67 is formed on the side of the third processing unit 64. More specifically, the transfer space 67 is formed in the central portion of the second block 61 in the width direction Y. The transfer space 67 extends in the front-rear direction X. The transfer space 67 extends from the front portion of the second block 61 to the rear portion of the second block 61. The transfer space 67 is connected to the transfer space 45. The transfer space 67 and the third processing unit 64 are arranged in the width direction Y.

[0198] The third conveying mechanism 68 is provided in the conveying space 67. The third conveying mechanism 68 is arranged behind the second conveying mechanism 48. The first conveying mechanism 46, the second conveying mechanism 48, and the third conveying mechanism 68 are arranged in a row in the front-rear direction X. The second conveying mechanism 48 is arranged between the first conveying mechanism 46 and the third conveying mechanism 68.

[0199] The third processing section 64 is arranged on the side of the third conveying mechanism 68. More specifically, the third processing section 64 and the third conveying mechanism 46 are arranged in the width direction Y. The third processing section 64 is arranged at a position to the right of the third conveying mechanism 68 and at a position to the left of the third conveying mechanism 68. The third processing section 64 arranged at a position to the right of the third conveying mechanism 68 is referred to as a "third right processing section 64R". The third processing section 64 arranged at a position to the left of the third conveying mechanism 68 is referred to as a "third left processing section 64L". The third right processing section 64R, the third conveying mechanism 68, and the third left processing section 64L are arranged in the width direction Y. The third conveying mechanism 68 is arranged between the third right processing section 64R and the third left processing section 64L.

[0200] The length G1 of the third right processing portion 64R in the front-to-back direction X is smaller than the length G2 of the third left processing portion 64L in the front-to-back direction X. The length G1 of the third right processing portion 64R in the front-to-back direction X is preferably smaller than the length G2 of the third left processing portion 64L in the front-to-back direction X by 500 [mm] or more. In other words, the difference between the length G1 and the length G2 is preferably 500 [mm] or more. The length G2 is, for example, about 1.5 times the length G1.

[0201] The third right processing unit 64R is an example of a third short processing unit in the present invention. The third left processing unit 64L is an example of a third long processing unit in the present invention.

[0202] The substrate processing apparatus 1 includes a space F. The space F is formed in the second block 61. The space F and the third right processing unit 64R are arranged in the front-rear direction X. The space F is arranged in front of the third right processing unit 64R. The space F is arranged on the side of the third conveying space 67. The space F and the third conveying space 67 are arranged in the width direction Y. The space F is arranged on the right side of the conveying space 67. The space F is arranged on the side of the third conveying mechanism 68. The space F and the third conveying mechanism 68 are arranged in the width direction Y. The space F is arranged on the right side of the third conveying mechanism 68. The space F, the conveying space 67, and the third left processing unit 64L are arranged in the width direction Y. The space F faces the third left processing unit 64L across the conveying space 67. The conveying space 67 is arranged between the space F and the third left processing unit 64L. The space F preferably has a size that allows a person (for example, an operator of the substrate processing apparatus 1) to enter.

[0203] The space F is an example of a maintenance space in the present invention.

[0204] The second processing section 37 and the third processing section 64 are arranged in the front-to-back direction X. The third processing section 64 is arranged behind the second processing section 37. The second right processing section 37R and the third right processing section 64R are arranged in the front-to-back direction X. The third right processing section 64R is arranged behind the second right processing section 37R. The first right processing section 34R, the second right processing section 37R, and the third right processing section 64R are arranged in a row in the front-to-back direction X. The second left processing section 37L and the third left processing section 64L are arranged in the front-to-back direction X. The third left processing section 64L is arranged behind the second left processing section 37L. The first left processing section 34L, the second left processing section 37L, and the third left processing section 64L are arranged in a row in the front-to-back direction X.

[0205] The space E and the space F are arranged between the second processing section 37 and the third processing section 64. The space E1 and the space F are arranged between the second right processing section 37R and the third right processing section 64R. The second right processing section 37R, the space E1, the space F, and the third right processing section 64R are arranged in the front-to-back direction X. The second right processing section 37R, the space E1, the space F, and the third right processing section 64R are arranged in a row in sequence. The space E2 is arranged between the second left processing section 37L and the third left processing section 64L. The second left processing section 37L, the space E2, and the third left processing section 64L are arranged in the front-to-back direction X. The second left processing section 37L, the space E2, and the third left processing section 64L are arranged in a row in sequence.

[0206] Space E and space F are examples of heat-insulating space in the present invention. Space F is an example of maintenance space in the present invention and an example of heat-insulating space in the present invention. That is, space F serves as both maintenance space and heat-insulating space in the present invention.

[0207] The substrate processing apparatus 1 has an inspection port 71 and a cover 72. The inspection port 71 is formed in the second block 61. The inspection port 71 is an opening formed in the right wall of the second block 61. The inspection port 71 is preferably large enough for an operator to pass through. The cover 72 is mounted on the second block 61. The cover 72 is mounted on the right wall of the second block 61. The cover 72 can rotate relative to the second block 61. The cover 72 can open and close the inspection port 71.

[0208] The third processing section 64 includes a plurality of (eg, ten) third processing units 65 that process each substrate W. Each third processing unit 65 performs liquid processing on one substrate W. More specifically, each third processing unit 65 performs development processing on one substrate W.

[0209] Reference Figure 7 The four third processing units 65 are arranged on the right side of the third conveying mechanism 68. All the third processing units 65 arranged on the right side of the third conveying mechanism 68 belong to the third right processing section 64R.

[0210] The third processing units 65 belonging to the third right processing section 64R are arranged in a matrix in the front-to-back direction X and the up-down direction Z. Two third processing units 65 are arranged in the upper section of the third right processing section 64R. The remaining two third processing units 65 are arranged in the lower section of the third right processing section 64R. The two third processing units 65 arranged in the upper section of the third right processing section 64R are arranged in a manner arranged in the front-to-back direction X. The two third processing units 65 arranged in the lower section of the third right processing section 64R are arranged in a manner arranged in the front-to-back direction X. The two third processing units 65 arranged in the lower section of the third right processing section 64R overlap with the two third processing units 65 arranged in the upper section of the third right processing section 64R in a plan view.

[0211] Reference Figure 5 The six third processing units 65 are arranged on the left side of the third conveying mechanism 68. All the third processing units 65 arranged on the left side of the third conveying mechanism 68 belong to the third left processing section 64L.

[0212] The third processing units 65 belonging to the third left processing section 64L are arranged in a matrix in the front-to-back direction X and the up-down direction Z. Three third processing units 65 are arranged in the upper section of the third left processing section 64L. The remaining three third processing units 65 are arranged in the lower section of the third left processing section 64L. The three third processing units 65 arranged in the upper section of the third left processing section 64L are arranged in a manner arranged in the front-to-back direction X. The three third processing units 65 arranged in the lower section of the third left processing section 64L are arranged in a manner arranged in the front-to-back direction X. The three third processing units 65 arranged in the lower section of the third left processing section 64L overlap with the three third processing units 65 arranged in the upper section of the third left processing section 64L in a plan view.

[0213] Each third processing unit 65 includes a rotating holding portion 66a, a nozzle 66b, and a cup 66c. The rotating holding portion 66a holds a substrate W in a horizontal position. The rotating holding portion 66a can rotate the held substrate W. The axis of rotation of the substrate W is substantially parallel to the up-down direction Z. The nozzle 66b sprays a processing liquid onto the substrate W. The processing liquid is, for example, a developer. The nozzle 66b is arranged so as to be movable to a processing position and a retreat position. The processing position is a position above the substrate W held by the rotating holding portion 66a. The processing position is a position overlapping with the substrate W held by the rotating holding portion 66a in a plan view. The retreat position is a position not overlapping with the substrate W held by the rotating holding portion 66a in a plan view. The cup 66c is arranged around the rotating holding portion 66a. The cup 66c recovers the processing liquid.

[0214] The substrate processing apparatus 1 includes a plurality of chambers (housings) 72 a to 72 d. The chambers 72 a to 72 d are arranged on the side of the transfer space 67 .

[0215] Reference Figure 7 , 10 The chambers 72a and 72b are arranged at the right side of the transfer space 67. The chambers 72a and 72b are arranged in a manner to be arranged in the up-down direction Z. The chamber 72b is arranged below the chamber 72a. The chamber 72a accommodates two third processing units 65 arranged at the upper stage of the third right processing section 64R. The chamber 72b accommodates two third processing units 65 arranged at the lower stage of the third right processing section 64R.

[0216] Reference Figure 5 , 10The chambers 72c and 72d are arranged at the left side of the transfer space 67. The chambers 72c and 72d are arranged in a manner to be arranged in the up-down direction Z. The chamber 72d is arranged below the chamber 72c. The chamber 72c accommodates the three third processing units 65 arranged in the upper section of the third left processing section 64L. The chamber 72d accommodates the three third processing units 65 arranged in the lower section of the third left processing section 64L.

[0217] Reference Figure 4 , 6 , 10. The third conveying mechanism 68 includes third pillars 69a, 69b, a third lifting part 69c, a third horizontal moving part 69d, a third rotating part 69e and third holding parts 69f, 69g. The third pillars 69a, 69b extend in the up-down direction Z. The third pillars 69a, 69b are arranged in a manner arranged in the front-back direction X. The third pillars 69a, 69b are arranged at a position closer to the third left processing part 64L than the third right processing part 64R. The third pillar 69a is arranged at the left front part of the conveying space 67. The third pillar 69b is arranged at the left rear part of the conveying space 67. The third pillars 69a, 69b are set to be fixed. Therefore, the third pillars 69a, 69b cannot move. Specifically, the third pillars 69a, 69b are fixed to the second frame 62. The third pillars 69a, 69b cannot move relative to the second frame 62. The third lifting part 69c extends in the front-back direction X. The third lifting part 69c is supported by the third pillars 69a and 69b. The third lifting part 69c cannot move relative to the third pillars 69a and 69b. The third lifting part 69c can move in the up-down direction Z. The third lifting part 69c cannot move in the horizontal direction. The third horizontal moving part 69d is supported by the third lifting part 69c. The third horizontal moving part 69d can move relative to the third lifting part 69c. The third horizontal moving part 69d can move in the horizontal direction (specifically, the front-back direction X). The third rotating part 69e is supported by the third horizontal moving part 69d. Therefore, the third rotating part 69e can move in the horizontal direction (specifically, the front-back direction X). The third rotating part 69e can rotate relative to the third horizontal moving part 69d. The rotation axis of the third rotating part 69e is parallel to the up-down direction Z. The rotation axis of the third rotating part 69e can move in the front-back direction X. The third holding parts 69f and 69g are supported by the third rotating part 69e. The third holding parts 69f and 69g can move forward and backward in the horizontal direction relative to the third rotating part 69e. The third holding parts 69f and 69g can move forward and backward independently. The third holding parts 69f and 69g are in contact with the substrate W respectively. The third holding parts 69f and 69g each hold one substrate W in a horizontal posture.

[0218] <First Loading Section 21 and Third Loading Section 51>

[0219] The first loading section 21 is arranged between the loading section 11 and the first conveying mechanism 46. The first loading section 21 is arranged across the loading section 11 and the first block 31. The first loading section 21 is arranged across the conveying space 13 of the loading section 11 and the conveying space 45 of the first block 31. A part of the first loading section 21 is arranged in the conveying space 13 of the loading section 11. The remaining part of the first loading section 21 is arranged in the conveying space 45 of the first block 31.

[0220] The first loading portion 21 is arranged between the loading conveying mechanism 14A and the loading conveying mechanism 14B. The first loading portion 21 is arranged behind and to the left of the loading conveying mechanism 14A. The first loading portion 21 is arranged behind and to the right of the loading conveying mechanism 14B. The first loading portion 21 is arranged at a position approximately equidistant from the loading conveying mechanisms 14A and 14B. Specifically, in a plan view, the distance between the loading conveying mechanism 14A and the first loading portion 21 is approximately equal to the distance between the loading conveying mechanism 14B and the first loading portion 21.

[0221] The first loading portion 21 and the first conveying mechanism 46 are arranged in the front-to-back direction X. The first loading portion 21 is arranged in front of the first conveying mechanism 46. The first loading portion 21, the first conveying mechanism 46, and the second conveying mechanism 48 are arranged in a row in the front-to-back direction X. Fig. 9 As shown in FIG. 1 , the first placement section 21 is disposed at a position overlapping with the imaginary straight line L in a plan view.

[0222] The third loading section 51 is disposed between the second conveying mechanism 48 and the third conveying mechanism 68. The third loading section 51 is disposed across the first block 31 and the second block 61. The third loading section 51 is disposed across the conveying space 45 of the first block 31 and the conveying space 67 of the second block 61. A portion of the third loading section 51 is disposed in the conveying space 45 of the first block 31. The remaining portion of the third loading section 51 is disposed in the conveying space 67 of the second block 61.

[0223] The third loading portion 51 is disposed behind the second conveying mechanism 48. The first conveying mechanism 46, the second conveying mechanism 48, and the third loading portion 51 are arranged in a row in the front-rear direction X. Fig. 9 As shown in FIG. 1 , the third placement portion 51 is disposed at a position overlapping with the virtual straight line L in a plan view.

[0224] The third placement portion 51 is disposed in front of the third conveying mechanism 68. The second conveying mechanism 48, the third placement portion 51, and the third conveying mechanism 68 are arranged in a row in the front-rear direction X.

[0225] Reference Figure 6The first mounting portion 21 includes a plurality of flat plates 22a and 22b. Each of the flat plates 22a and 22b mounts a substrate W in a horizontal position. The flat plates 22a and 22b are arranged in a row in the vertical direction Z. The flat plate 22b is arranged below the flat plate 22a. The flat plate 22b overlaps the flat plate 22a in a plan view.

[0226] The third mounting portion 51 includes a plurality of flat plates 52a and 52b. Each of the flat plates 52a and 52b mounts a substrate W in a horizontal position. The flat plates 52a and 52b are arranged so as to be aligned in the vertical direction Z. The flat plate 52b is arranged below the flat plate 52a. The flat plate 52b overlaps the flat plate 52a in a plan view.

[0227] <Transportation Agency>

[0228] Reference Figure 4 The placing parts and processing parts accessible to the first, second, and third conveying mechanisms 46, 48, and 68 are summarized below. Furthermore, the placing parts and processing parts inaccessible to the first, second, and third conveying mechanisms 46, 48, and 68 are summarized below.

[0229] The first conveying mechanism 46 is accessible to the first loading section 21. The first conveying mechanism 46 is accessible to the flat plates 22a and 22b of the first loading section 21. The first conveying mechanism 46 is accessible to each first processing unit 35. The first conveying mechanism 46 is accessible to the rotation holding portion 36a of each first processing unit 35. The first conveying mechanism 46 is accessible to the second loading section 41. The first conveying mechanism 46 is accessible to the flat plates 42a and 42b of the second loading section 41.

[0230] The second conveying mechanism 48 can approach the second loading section 41. The second conveying mechanism 48 can approach the flat plates 42a and 42b of the second loading section 41. The second conveying mechanism 48 can approach each second processing unit 38. The second conveying mechanism 48 can approach the first flat plate 39a of each second processing unit 38. The second conveying mechanism 48 can approach the third loading section 51. The second conveying mechanism 48 can approach the flat plates 52a and 52b of the third loading section 51.

[0231] The third conveying mechanism 68 is accessible to the third placement section 51. The third conveying mechanism 68 is accessible to the plates 52a and 52b of the third placement section 51. The third conveying mechanism 68 is accessible to each third processing unit 65. The third conveying mechanism 68 is accessible to the rotation holding section 66a of each third processing unit 65.

[0232] Figure 4The first region B1 where the first transport mechanism 46 can transport the substrate W is indicated by a dotted chain line. The first transport mechanism 46 cannot transport the substrate W outside the first region B1. The substrate W is moved in the first region B1 by the first transport mechanism 46. The first region B1 is substantially circular in a plan view. The center of the first region B1 is substantially consistent with the first axis A1 in a plan view. The first loading section 21, the first processing section 34, and the second loading section 41 are arranged in the first region B1. At least a portion of the first plate 39a of the second processing section 37 is arranged outside the first region B1. In this way, the second processing section 37 is substantially arranged outside the first region B1 of the first transport mechanism 46. That is, the first transport mechanism 46 cannot approach the second processing section 37. Similarly, the third processing section 64 is arranged outside the first region B1 in a plan view. That is, the first transport mechanism 46 cannot approach the third processing section 64. The third placement section 51 is disposed outside the first area B1 in a plan view. That is, the first conveying mechanism 46 cannot approach the third placement section 51 .

[0233] Figure 4 The second region B2 in which the second conveying mechanism 48 can convey the substrate W is indicated by a dotted chain line. The second region B2 is roughly circular when viewed from above. The center of the second region B2 is roughly consistent with the second axis A2 when viewed from above. The second loading section 41, the second processing section 37, and the third loading section 51 are arranged in the second region B2. The rotating holding section 36a of the first processing section 34 is arranged outside the second region B2 of the second conveying mechanism 48. In other words, the second conveying mechanism 48 cannot approach the first processing section 34. Similarly, the third processing section 64 is arranged outside the second region B2 when viewed from above. In other words, the second conveying mechanism 48 cannot approach the third processing section 64. The first loading section 21 is arranged outside the second region B2 when viewed from above. In other words, the second conveying mechanism 48 cannot approach the first loading section 21.

[0234] Figure 4 The third region B3 where the third transport mechanism 68 can transport the substrate W is indicated by a dotted chain line. The third region B3 is longer in the front-rear direction X in a plan view. In a plan view, the length of the third region B3 in the front-rear direction X is greater than the length of the third region B3 in the width direction Y. The third loading section 51 and the third processing section 64 are arranged in the third region B3. The first processing section 34 and the second processing section 37 are arranged outside the third region B3 of the third transport mechanism 68. In other words, the third transport mechanism 68 cannot approach the first processing section 34 and the second processing section 37. Similarly, the first loading section 21 and the second loading section 41 are arranged outside the third region B3. In other words, the third transport mechanism 68 cannot approach the first loading section 21 and the second loading section 41.

[0235] <Other Effects of the First Embodiment>

[0236] The main effects of the first embodiment are as described above. Other effects of the first embodiment will be described below.

[0237] The first processing section 34 is disposed outside the second area B2 . Therefore, the first transport mechanism 46 can approach the first processing section 34 without interfering with the second transport mechanism 48 .

[0238] The first processing section 34 is disposed outside the third area B3 . Therefore, the first transport mechanism 46 can approach the first processing section 34 without interfering with the third transport mechanism 68 .

[0239] The second processing section 37 is disposed outside the first area B1 . This allows the second transport mechanism 48 to approach the second processing section 37 without interfering with the first transport mechanism 46 .

[0240] The second processing section 37 is disposed outside the third area B3 . This allows the second transport mechanism 48 to approach the second processing section 37 without interfering with the third transport mechanism 68 .

[0241] The third processing section 64 is disposed outside the first area B1 . This allows the third transport mechanism 68 to approach the third processing section 64 without interfering with the first transport mechanism 46 .

[0242] The third processing section 64 is disposed outside the second area B2 . Thus, the third transport mechanism 68 can approach the third processing section 64 without interfering with the second transport mechanism 48 .

[0243] The first placement section 21 is disposed outside the second area B2 and the third area B3 . Thus, the first conveying mechanism 46 can approach the first placement section 21 without interfering with the second conveying mechanism 48 and the third conveying mechanism 68 .

[0244] The second placement section 41 is disposed outside the third area B3 . This allows the first conveying mechanism 46 and the second conveying mechanism 48 to approach the second placement section 41 without interfering with the third conveying mechanism 68 .

[0245] The third placement section 51 is disposed outside the first area B1 . This allows the second conveying mechanism 48 and the third conveying mechanism 68 to approach the third placement section 51 without interfering with the first conveying mechanism 46 .

[0246] The first area B1 is substantially circular in a plan view. Therefore, the first conveying mechanism 46 can efficiently perform the first approaching action, the second approaching action, and the third approaching action. Thus, the first conveying mechanism 46 can efficiently perform the first circulation action. In other words, the conveying efficiency of the first conveying mechanism 46 is higher.

[0247] The second area B2 of the second conveying mechanism 48 is substantially circular in a plan view. Therefore, the second conveying mechanism 48 can efficiently perform the fourth approaching action, the fifth approaching action, and the sixth approaching action. Thus, the second conveying mechanism 48 can efficiently perform the second circulation action. In other words, the conveying efficiency of the second conveying mechanism 48 is higher.

[0248] The first conveying mechanism 46 is arranged between the loader 11 and the second conveying mechanism 48. Therefore, the substrate W can be appropriately conveyed between the loader 11 and the first conveying mechanism 46, and the substrate W can be appropriately conveyed between the first conveying mechanism 46 and the second conveying mechanism 48. Specifically, the first conveying mechanism 46 is arranged behind the loader 11. Therefore, the substrate W can be appropriately conveyed between the loader 11 and the first conveying mechanism 46. The second conveying mechanism 48 is arranged behind the first conveying mechanism 46. Therefore, the substrate W can be appropriately conveyed between the first conveying mechanism 46 and the second conveying mechanism 48.

[0249] The second transport mechanism 48 is disposed between the first transport mechanism 46 and the third transport mechanism 68. Specifically, the third transport mechanism 68 is disposed behind the second transport mechanism 48. Therefore, the substrate W can be appropriately transported between the second transport mechanism 48 and the third transport mechanism 68.

[0250] The first loading portion 21 is arranged between the loading portion 11 and the first conveying mechanism 46. Therefore, the loading portion 11 and the first conveying mechanism 46 can easily approach the first loading portion 21. The second loading portion 41 is arranged between the first conveying mechanism 46 and the second conveying mechanism 48. Therefore, the first conveying mechanism 46 and the second conveying mechanism 48 can easily approach the second loading portion 41. The third loading portion 51 is arranged between the second conveying mechanism 48 and the third conveying mechanism 68. Therefore, the second conveying mechanism 48 and the third conveying mechanism 68 can easily approach the third loading portion 51.

[0251] The first processing section 34 is arranged on the side of the first conveying mechanism 46. Therefore, the first conveying mechanism 46 can easily approach the first processing section 34. The second processing section 37 is arranged on the side of the second conveying mechanism 48. Therefore, the second conveying mechanism 48 can easily approach the second processing section 37. The third processing section 64 is arranged on the side of the third conveying mechanism 68. Therefore, the third conveying mechanism 68 can easily approach the third processing section 64.

[0252] The first conveying mechanism 46 is disposed between the first right processing section 34R and the first left processing section 34L. Therefore, the first conveying mechanism 46 can easily approach the first right processing section 34R and the first left processing section 34L. The second conveying mechanism 48 is disposed between the second right processing section 37R and the second left processing section 37L. Therefore, the second conveying mechanism 48 can easily approach the second right processing section 37R and the second left processing section 37L. The third conveying mechanism 68 is disposed between the third right processing section 64R and the third left processing section 64L. Therefore, the third conveying mechanism 68 can easily approach the third right processing section 64R and the third left processing section 64L.

[0253] The first transfer mechanism 46, the second transfer mechanism 48, and the second placement unit 41 are arranged in a triangular shape in a plan view. This can reduce the distance between the first transfer mechanism 46 and the second transfer mechanism 48. This can reduce the installation area (occupancy area) of the substrate processing apparatus 1.

[0254] The second loading unit 41 is disposed at a position laterally and rearwardly of the first conveying mechanism 46. The second loading unit 41 is disposed at a position laterally and in frontwardly of the second conveying mechanism 48. Thus, the distance between the first conveying mechanism 46 and the second conveying mechanism 48 in the front-rear direction X can be reduced. Thus, the installation area (occupancy area) of the substrate processing apparatus 1 can be reduced.

[0255] The first rotating portion 47d is provided so as not to be movable in the horizontal direction. Therefore, the first conveying mechanism 46 can efficiently perform the first approaching operation, the second approaching operation, and the third approaching operation. Thus, the first conveying mechanism 46 can efficiently perform the first circulation operation.

[0256] Each of the first processing units 35 is disposed at a position overlapping with the first axis A1 of the first transport mechanism 46 in a side view. Therefore, the first transport mechanism 46 can easily approach the first processing section 34.

[0257] The second rotating portion 49d is provided so as not to be movable in the horizontal direction. Therefore, the second conveying mechanism 48 can efficiently perform the fourth approaching operation, the fifth approaching operation, and the sixth approaching operation. Thus, the second conveying mechanism 48 can efficiently perform the second circulation operation.

[0258] Each second processing unit 38 is disposed at a position overlapping with the second axis line A2 of the second transport mechanism 48 in a side view. Therefore, the second transport mechanism 48 can easily approach the second processing section 37.

[0259] The second processing unit 38 is a heat treatment unit. The heat treatment units are arranged in a row in the up-down direction Z. Therefore, the second transport mechanism 48 can easily access each heat treatment unit.

[0260] The five second processing units 38 belonging to the second right processing section 37R are arranged in a row in the vertical direction Z at the right side of the second conveying mechanism 48. Thus, the second conveying mechanism 48 can easily approach the second processing units 38 arranged on the right side of the second conveying mechanism 48. Here, the second processing units 38 are heat treatment units. Thus, the second conveying mechanism 48 can easily approach the heat treatment units arranged on the right side of the second conveying mechanism 48.

[0261] The four second processing units 38 belonging to the second left processing section 37L are arranged in a row in the vertical direction Z to the left of the second conveying mechanism 48. Thus, the second conveying mechanism 48 can easily access the heat treatment units arranged to the left of the second conveying mechanism 48.

[0262] In a plan view, a distance D1 between the first axis A1 and the second axis A2 is less than or equal to 5 times the radius r of the substrate W. Therefore, the distance between the first transfer mechanism 46 and the second transfer mechanism 48 can be reduced. Thus, the installation area of ​​the substrate processing apparatus 1 can be reduced.

[0263] The second placement section 41 is disposed at a position that does not overlap with a virtual straight line L connecting the first axis A1 and the second axis A2 in a plan view. Therefore, the distance between the first conveying mechanism 46 and the second conveying mechanism 48 can be appropriately reduced.

[0264] In a plan view, the distance between the first axis A1 and the second placement portion 41 is substantially equal to the distance between the second axis A2 and the second placement portion 41. Therefore, the first conveying mechanism 46 and the second conveying mechanism 48 can each easily approach the second placement portion 41.

[0265] The second placement unit 41 includes a first portion 41a overlapping the first processing unit 34 in a plan view, and a second portion 41b overlapping the second processing unit 37 in a plan view. Therefore, the distance between the first conveying mechanism 46 and the second conveying mechanism 48 can be reduced. As a result, the occupied area of ​​the substrate processing apparatus 1 can be reduced. Furthermore, the first conveying mechanism 46 and the second conveying mechanism 48 can each easily approach the second placement unit 41.

[0266] The second placement section 41 has a third portion 41c which does not overlap with the first processing section 34 and the second processing section 37 in a plan view. Therefore, the first conveying mechanism 46 and the second conveying mechanism 48 can each more easily approach the second placement section 41.

[0267] The third portion 41c of the second placement portion 41 overlaps the transfer space 45 in which the first transfer mechanism 46 and the second transfer mechanism 48 are installed in a plan view. Therefore, the first transfer mechanism 46 and the second transfer mechanism 48 can each more easily approach the second placement portion 41.

[0268] Since the substrate processing apparatus 1 includes the tanks 43a to 43c and 43f to 43h, the first processing section 34 (specifically, the first processing unit 35) can be appropriately provided.

[0269] Since the substrate processing apparatus 1 includes the tanks 44a to 44h and 44j, the second processing section 37 (specifically, the second processing unit 38) can be appropriately provided.

[0270] Since the substrate processing apparatus 1 includes the groove 43i and the groove 44i, the second placement portion 41 can be appropriately provided.

[0271] The grooves 43f-43j are arranged on the side of the first conveying mechanism 46. The grooves 43f-43j are arranged in a row in the vertical direction Z. The first processing section 34 (the first left processing section 34L) is arranged in the grooves 43f-43h. The second loading section 41 is arranged in the groove 43i. The grooves 44f-44j are arranged on the side of the second conveying mechanism 48. The grooves 44f-44j are arranged in a row in the vertical direction Z. The second processing section 37 (the second left processing section 37L) is arranged in the grooves 44f-44h and 44j. The second loading section 41 is also arranged in the groove 44i. The groove 44i is arranged at the same height position as the groove 43i. The second loading section 41 is arranged across the groove 43i and the groove 44i. In this way, a part of the grooves 43a-43j and a part of the grooves 44a-44j can be effectively used, and the second loading section 41 can be appropriately arranged.

[0272] The grooves 43f-43j are arranged in the up-down direction Z. The groove 43i is neither arranged at the highest position nor at the lowest position among the grooves 43f-43j. In other words, the groove 43i is arranged at a position other than the highest position and the lowest position among the grooves 43f-43j. The grooves 44f-44j are arranged in the up-down direction Z. The groove 44i is neither arranged at the highest position nor at the lowest position among the grooves 44f-44j. In other words, the groove 44i is arranged at a position other than the highest position and the lowest position among the grooves 44f-44j. Therefore, the first conveying mechanism 46 can more easily approach the second loading section 41. Specifically, the lifting amount of the first conveying mechanism 46 when approaching the second loading section 41 can be reduced. Similarly, the second conveying mechanism 48 can more easily approach the second loading section 41.

[0273] The first processing unit 34 is an edge exposure processing unit. The second processing unit 37 is a heat treatment unit. The third processing unit 64 is a liquid processing unit. Therefore, the edge exposure processing unit and the heat treatment unit can be set at a position relatively close to the loading unit 11. The liquid processing unit can be set at a position relatively far from the loading unit 11.

[0274] The substrate processing apparatus 1 includes the spaces E and F that separate the third processing unit 64 from the second processing unit 37. Therefore, the thermal influence on the third processing unit 64 from the second processing unit 37 can be effectively reduced.

[0275] The substrate processing apparatus 1 includes the space F. Therefore, the substrate processing apparatus 1 can be appropriately maintained.

[0276] The length G1 of the third right processing portion 64R in the front-rear direction X is smaller than the length G2 of the third left processing portion 64L in the front-rear direction X. The space F and the third right processing portion 64R are arranged in the front-rear direction X. Thus, the space F can be easily ensured.

[0277] The first block 31 accommodates the first processing unit 34 and the second processing unit 37. The second block 61 accommodates the third processing unit 64. In other words, the heat treatment unit (the second processing unit 37) and the liquid treatment unit (the third processing unit 64) are not accommodated in the same block. Thus, the heat treatment unit (the second processing unit 37) and the liquid treatment unit (the third processing unit 64) can be appropriately configured respectively.

[0278] The substrate processing apparatus 1 includes the first frame 32 . Therefore, the first block 31 can be preferably configured using the first frame 32 .

[0279] The substrate processing apparatus 1 includes the second frame 62 . Therefore, the second block 61 can be preferably configured using the second frame 62 .

[0280] [Second embodiment]

[0281] A substrate processing apparatus 1 according to a second embodiment will be described with reference to the drawings. The same components as those of the first embodiment are denoted by the same reference numerals, and detailed descriptions thereof will be omitted.

[0282] <Overview of Substrate Processing Apparatus>

[0283] Fig.11A , 11B Each of them is a plan view of a substrate processing apparatus 1 according to the second embodiment. The substrate processing apparatus 1 according to the second embodiment has a layered structure. The substrate processing apparatus 1 includes an upper layer 90T and a lower layer 90B. The lower layer 90B is arranged below the upper layer 90T. The lower layer 90B overlaps with the upper layer 90T in a plan view.

[0284] The upper stage 90T and the lower stage 90B respectively include the first conveying mechanism 46, the second conveying mechanism 48, the third conveying mechanism 68, the first processing unit 34, the second processing unit 37, the third processing unit 64, the first mounting unit 21, the second mounting unit 41, and the third mounting unit 51. The upper stage 90T and the lower stage 90B respectively perform conveyance of the substrate W and processing of the substrate W simultaneously.

[0285] <Loading Unit 11>

[0286] Reference Fig.11A , 11B , 12, 13, 14. Fig.12 It is a left side view showing the structure of the left portion of the substrate processing apparatus 1. Fig.13 1 is a left side view showing the structure of the central portion of the substrate processing apparatus 1 in the width direction Y. FIG. Fig.14 This is a right side view showing the structure of the right part of the substrate processing apparatus 1. The loading section 11 includes carrier placement sections 12C and 12D in addition to the carrier placement sections 12A and 12B. The carrier placement section 12C is arranged above the carrier placement section 12A. The carrier placement section 12D is arranged above the carrier placement section 12B. The carrier placement sections 12C and 12D each place one carrier C.

[0287] The carrier C on the carrier placement portion 12C is appropriately described as a “carrier CC.” The carrier C on the carrier placement portion 12D is appropriately described as a “carrier CD.”

[0288] The loading transport mechanism 14A approaches the carriers CA and CC placed on the carrier placement sections 12A and 12C. The loading transport mechanism 14B approaches the carriers CB and CD placed on the carrier placement sections 12B and 12D.

[0289] Fig.11A The loading conveying mechanism 14A shown in FIG. Fig. 11B The loading transport mechanism 14A shown is the same object. Fig.11A The loading conveying mechanism 14B shown in FIG. Fig. 11B The loading transport mechanism 14B shown is the same object.

[0290] <Block 1 31>

[0291] Reference Fig.11A , 11B , 12, 13, 14, 15. Fig.15 1 is a front view showing the structure of the first block 31 (specifically, the second processing unit 37 and the second conveying mechanism 48). The substrate processing apparatus 1 includes two first conveying mechanisms 46. The two first conveying mechanisms 46 are arranged in a vertical direction Z. The upper first conveying mechanism 46 is described as "first upper conveying mechanism 46T", and the lower first conveying mechanism 46 is described as "first lower conveying mechanism 46B".

[0292] The substrate processing apparatus 1 includes two second transport mechanisms 48. The two second transport mechanisms 48 are arranged side by side in the up-down direction Z. The upper second transport mechanism 48 is referred to as "second upper transport mechanism 48T", and the lower second transport mechanism 48 is referred to as "second lower transport mechanism 48B".

[0293] Reference Fig.13 , 15 The substrate processing apparatus 1 includes a partition wall 91. The partition wall 91 is provided in the transport space 45 of the first block 31. The partition wall 91 has a horizontal plate shape. The partition wall 91 separates the transport space 45 from the upper transport space 45T and the lower transport space 45B. The upper transport space 45T is arranged above the lower transport space 45B. The first upper transport mechanism 46T and the second upper transport mechanism 48T are arranged in the upper transport space 45T. The first lower transport mechanism 46B and the second lower transport mechanism 48B are arranged in the lower transport space 45B.

[0294] Reference Fig.11A , 11B The first processing section 34 is arranged on the side of the first upper conveying mechanism 46T and on the side of the first lower conveying mechanism 46B. The first processing section 34 arranged on the side of the first upper conveying mechanism 46T is referred to as "the first upper processing section 34T". The first processing section 34 arranged on the side of the first lower conveying mechanism 46B is referred to as "the first lower processing section 34B".

[0295] The second processing section 37 is disposed on the side of the second upper conveying mechanism 48T and on the side of the second lower conveying mechanism 48B. The second processing section 37 disposed on the side of the second upper conveying mechanism 48T is referred to as "the second upper processing section 37T". The second processing section 37 disposed on the side of the second lower conveying mechanism 48B is referred to as "the second lower processing section 37B".

[0296] The second loading portion 41 is disposed between the first upper conveying mechanism 46T and the second upper conveying mechanism 48T, and between the first lower conveying mechanism 46B and the second lower conveying mechanism 48B. The second loading portion 41 disposed between the first upper conveying mechanism 46T and the second upper conveying mechanism 48T is referred to as a "second upper loading portion 41T". The second loading portion 41 disposed between the first lower conveying mechanism 46B and the second lower conveying mechanism 48B is referred to as a "second lower loading portion 41B".

[0297] Reference Fig.12 , 14 The first upper processing section 34T is arranged above the partition wall 91. The first upper conveying mechanism 46T approaches the first upper processing section 34T. The first lower processing section 34B is arranged below the partition wall 91. The first lower conveying mechanism 46B approaches the first lower processing section 34B.

[0298] Reference Fig.12 , 14 , 15. The second upper processing section 37T is arranged above the partition wall 91. The second upper conveying mechanism 48T approaches the second upper processing section 37T. The second lower processing section 37B is arranged below the partition wall 91. The second lower conveying mechanism 48B approaches the second lower processing section 37B.

[0299] Reference Fig.15 The second upper loading portion 41T is arranged above the partition wall 91. The first upper conveying mechanism 46T and the second upper conveying mechanism 48T approach the second upper loading portion 41T. The second upper loading portion 41T is provided for loading the substrate W to be transferred between the first upper conveying mechanism 46T and the second upper conveying mechanism 48T. The second lower loading portion 41B is arranged below the partition wall 91. The first lower conveying mechanism 46B and the second lower conveying mechanism 48B approach the second lower loading portion 41B. The second lower loading portion 41B is provided for loading the substrate W to be transferred between the first lower conveying mechanism 46B and the second lower conveying mechanism 48B.

[0300] <Block 2 61>

[0301] Reference Fig.11A , 11B , 12, 13, 14, 16. Fig.16 68 is a rear view showing the structure of the second block 61. The substrate processing apparatus 1 includes two third conveying mechanisms 68. The two third conveying mechanisms 68 are arranged in a vertical direction Z. The upper third conveying mechanism 68 is described as "third upper conveying mechanism 68T", and the lower third conveying mechanism 68 is described as "third lower conveying mechanism 68B".

[0302] Reference Fig.13 , 16 The substrate processing apparatus 1 includes a partition wall 92. The partition wall 92 is provided in the transfer space 67. The partition wall 92 has a horizontal plate shape. The partition wall 92 separates the transfer space 67 into an upper transfer space 67T and a lower transfer space 67B. The upper transfer space 67T is arranged above the lower transfer space 67B. The third upper transfer mechanism 68T is arranged in the upper transfer space 67T. The third lower transfer mechanism 68B is arranged in the lower transfer space 67B.

[0303] Reference Fig.11A , 11B The third processing section 64 is arranged on the side of the third upper conveying mechanism 68T and on the side of the third lower conveying mechanism 68B. The third processing section 64 arranged on the side of the third upper conveying mechanism 68T is referred to as "the third upper processing section 64T". The third processing section 64 arranged on the side of the third lower conveying mechanism 68B is referred to as "the third lower processing section 64B".

[0304] Reference Fig.12, 14 , 16. The third upper processing section 64T is arranged above the partition wall 92. The third upper conveying mechanism 68T approaches the third upper processing section 64T. The third lower processing section 64B is arranged below the partition wall 92. The third lower conveying mechanism 68B approaches the third lower processing section 64B.

[0305] <First Loading Section 21>

[0306] Reference Fig.11A , 11B The first loading portion 21 is disposed between the loading portion 11 and the first upper conveying mechanism 46T, and between the loading portion 11 and the first lower conveying mechanism 46B. The first loading portion 21 disposed between the loading portion 11 and the first upper conveying mechanism 46T is referred to as a "first upper loading portion 21T". The first loading portion 21 disposed between the loading portion 11 and the first lower conveying mechanism 46B is referred to as a "first lower loading portion 21B".

[0307] The first upper loading section 21T is arranged to straddle the conveying space 13 of the loading section 11 and the upper conveying space 45T of the first block 31. The first lower loading section 21B is arranged to straddle the conveying space 13 of the loading section 11 and the lower conveying space 45B of the first block 31. The loading conveying mechanism 14A approaches the first upper loading section 21T and the first lower loading section 21B. The loading conveying mechanism 14B approaches the first upper loading section 21T and the first lower loading section 21B. The first upper conveying mechanism 46T approaches the first upper loading section 21T. The first lower conveying mechanism 46B approaches the first lower loading section 21B. The first upper loading section 21T is provided with substrates W to be loaded and conveyed between the loading section 11 (that is, the loading conveying mechanisms 14A and 14B) and the first upper conveying mechanism 46T. The first lower placement portion 21B places the substrate W transferred between the placement portion 11 (that is, the placement transfer mechanisms 14A and 14B) and the first lower transfer mechanism 46B.

[0308] <Third Loading Section 51>

[0309] The third loading section 51 is arranged between the second upper conveying mechanism 48T and the third upper conveying mechanism 68T, and between the second lower conveying mechanism 48B and the third lower conveying mechanism 68B. The third loading section 51 arranged between the second upper conveying mechanism 48T and the third upper conveying mechanism 68T is referred to as "the third upper loading section 51T". The third loading section 51 arranged between the second lower conveying mechanism 48B and the third lower conveying mechanism 68B is referred to as "the third lower loading section 51B". The third upper loading section 51T is arranged to straddle the upper conveying space 45T of the first block 31 and the upper conveying space 67T of the second block 61. The third lower loading section 51B is arranged to straddle the lower conveying space 45B of the first block 31 and the lower conveying space 67B of the second block 61. The second upper conveying mechanism 48T and the third upper conveying mechanism 68T approach the third upper placement portion 51T. The second lower conveying mechanism 48B and the third lower conveying mechanism 68B approach the third lower placement portion 51B. The third upper placement portion 51T is used to place the substrate W transferred between the second upper conveying mechanism 48T and the third upper conveying mechanism 68T. The third lower placement portion 51B is used to place the substrate W transferred between the second lower conveying mechanism 48B and the third lower conveying mechanism 68B.

[0310] The upper layer 90T includes the first upper conveying mechanism 46T, the second upper conveying mechanism 48T, the third upper conveying mechanism 68T, the first upper placement section 21T, the second upper placement section 41T, the third upper placement section 51T, the first upper processing section 34T, the second upper processing section 37T, and the third upper processing section 64T. The lower layer 90B includes the first lower conveying mechanism 46B, the second lower conveying mechanism 48B, the third lower conveying mechanism 68B, the first lower placement section 21B, the second lower placement section 41B, the third lower placement section 51B, the first lower processing section 34T, the second lower processing section 37B, and the third lower processing section 64B.

[0311] <Control Unit 81>

[0312] Control unit 81 (see, for example Figure 1 ) controls the loading unit 11, the first processing unit 34, the first conveying mechanism 46, the second processing unit 37, the second conveying mechanism 48, the third processing unit 64 and the third conveying mechanism 68.

[0313] <Cyclic Operation of Each Transport Mechanism>

[0314] Fig.17 It is a diagram schematically showing the circulation operation of the conveying mechanism.

[0315] The loading transport mechanism 14A repeatedly performs a cycle operation including the following two approach operations.

[0316] Approaching vehicles CA and CC

[0317] Approaching operation toward the first placement section 21 (first upper placement section 21T and first lower placement section 21B)

[0318] The loading transport mechanism 14B repeatedly performs a cycle operation including the following two approach operations.

[0319] Approaching vehicles CB and CD

[0320] Approaching operation toward the first placement section 21 (first upper placement section 21T and first lower placement section 21B)

[0321] The first upper transport mechanism 46T repeatedly performs a first circulation operation including the following three approach operations.

[0322] · First approaching operation of approaching the first upper placement portion 21T

[0323] · Second approaching operation to approach the first upper processing unit 34T

[0324] · Third approaching operation of approaching the second upper placement portion 41T

[0325] The first lower transport mechanism 46B repeatedly performs a first cycle operation including the following three approach operations.

[0326] · First approaching operation of approaching the first loading portion 21B

[0327] · Second approaching operation to approach the first lower processing section 34B

[0328] · Third approaching operation of approaching the second loading portion 41B

[0329] The second upper transport mechanism 48T repeatedly performs the second cycle operation including the following three approach operations.

[0330] Fourth approaching operation of approaching the second upper placement portion 41T

[0331] Fifth approaching operation of approaching the second upper processing unit 37T

[0332] ·Sixth approaching operation of approaching the third upper placement portion 51T

[0333] The second lower transport mechanism 48B repeatedly performs the second circulation operation including the following three approach operations.

[0334] ·Fourth approaching operation of approaching the second loading portion 41B

[0335] · Fifth approaching operation of approaching the second lower processing section 37B

[0336] ·Sixth approaching operation of approaching the third loading portion 51B

[0337] The third upper transport mechanism 68T repeatedly performs a third cycle operation including the following two approach operations.

[0338] ·Seventh approaching operation of approaching the third upper placement portion 51T

[0339] · Eighth approaching operation to the third upper processing unit 64T

[0340] The third lower transport mechanism 68B repeatedly performs a third cycle operation including the following two approach operations.

[0341] ·Seventh approaching operation of approaching the third loading portion 51B

[0342] · Eighth approaching operation of approaching the third lower processing section 64B

[0343] <Action Example>

[0344] Fig.18 2 is a diagram schematically showing a substrate transport path. The substrate processing apparatus 1 operates, for example, as follows.

[0345] <Operation of Loading Unit 11 (1)>

[0346] The loader 11 transfers the substrate W alternately to the first upper mounting portion 21T and the first lower mounting portion 21B.

[0347] Specifically, in one cycle of the loader transport mechanism 14A, the loader transport mechanism 14A unloads the substrate W from any one of the carriers CA and CC, and places the substrate W on the first upper placement portion 21T. In the next cycle of the loader transport mechanism 14A, the loader transport mechanism 14A unloads the substrate W from any one of the carriers CA and CC, and places the substrate W on the first lower placement portion 21B.

[0348] <Operations of the First Block 31 and the Second Block 61>

[0349] The actions in the upper layer 90T are similar to those in the lower layer 90B. Therefore, the actions in the upper layer 90T are described below, and the description of the actions in the lower layer 90B is omitted. Regarding the actions in the lower layer 90B, in the following description, the first, second, and third upper conveying mechanisms 46T, 48T, and 68T are respectively renamed as the first, second, and third lower conveying mechanisms 46B, 48B, and 68B, the first, second, and third upper loading sections 21T, 41T, and 51T are respectively renamed as the first, second, and third lower loading sections 21B, 41B, and 51B, and the first, second, and third upper processing sections 34T, 37T, and 64T are respectively renamed as the first, second, and third lower processing sections 34B, 37B, and 64B.

[0350] The first upper transport mechanism 46T takes the substrate W on the first upper placement part 21T (first approaching action). The first upper transport mechanism 46T carries the substrate W into the first upper processing part 34T (second approaching action). The first upper processing part 34T processes the substrate W (edge ​​exposure processing). The first upper transport mechanism 46T carries the substrate W out of the first upper processing part 34T (second approaching action). The first upper transport mechanism 46T places the substrate W on the second upper placement part 41T (third approaching action).

[0351] The second upper transport mechanism 48T takes in the substrate W on the second upper mounting portion 41T (fourth approach operation). The second upper transport mechanism 48T places the substrate W on the third upper mounting portion 51T (sixth approach operation).

[0352] The third upper transport mechanism 68T takes the substrate W on the third upper placement part 51T (the seventh approach action). The third upper transport mechanism 68T carries the substrate W into the third upper processing part 64T ​​(the eighth approach action). The third upper processing part 64T ​​processes (liquid processing) the substrate W. The third upper transport mechanism 68T carries the substrate W out of the third upper processing part 64T ​​(the eighth approach action). The third upper transport mechanism 68T places the substrate W on the third upper placement part 51T (the seventh approach action).

[0353] The second upper transport mechanism 48T takes the substrate W on the third upper placement part 51T (sixth approach action). The second upper transport mechanism 48T carries the substrate W into the second upper processing part 37T (fifth approach action). The second upper processing part 37T processes (heat-treats) the substrate W. The second upper transport mechanism 48T carries the substrate W out of the second upper processing part 37T (fifth approach action). The second upper transport mechanism 48T places the substrate W on the second upper placement part 41T (fourth approach action).

[0354] The first upper transport mechanism 46T takes in the substrate W on the second upper mounting portion 41T (third approach operation). The first upper transport mechanism 46T places the substrate W on the first upper mounting portion 21T (first approach operation).

[0355] <Operation of Loading Unit 11 (2)>

[0356] The loading unit 11 takes in substrates W alternately from the first upper loading unit 21T and the first lower loading unit 21B.

[0357] Specifically, in one cycle of the loading and transporting mechanism 14B, the loading and transporting mechanism 14B takes the substrate W on the first upper loading portion 21T and carries the substrate W to one of the carriers CB and CD. In the next cycle of the loading and transporting mechanism 14B, the loading and transporting mechanism 14B takes the substrate W on the first lower loading portion 21B and carries the substrate W to one of the carriers CB and CD.

[0358] <Effects of the Second Embodiment>

[0359] According to the second embodiment, the same effect as the first embodiment is also achieved. For example, each first cycle action of the first conveying mechanism 46 (46T, 46B) includes three approach actions. Each second cycle action of the second conveying mechanism 48 (48T, 48B) includes three approach actions. Each third cycle action of the third conveying mechanism 68 (68T, 68B) includes two approach actions. Therefore, the throughput of the substrate processing device 1 can be appropriately improved.

[0360] The second placement section 41 (41T, 41B) has a first portion 41a overlapping the first processing section 34 (34T, 34B) in a plan view, and a second portion 41b overlapping the second processing section 37 (37T, 37B) in a plan view. Therefore, the distance between the first conveying mechanism 46 and the second conveying mechanism 48 can be reduced. Furthermore, the first conveying mechanism 46 and the second conveying mechanism 48 can each easily approach the second placement section 41.

[0361] Furthermore, according to the second embodiment, the following effects are achieved. Two first conveying mechanisms 46 (46T, 46B) are provided corresponding to the first processing unit 34. Two second conveying mechanisms 48 (48T, 48B) are provided corresponding to the second processing unit 37. Two third conveying mechanisms 68 (68T, 68B) are provided corresponding to the third processing unit 64. Therefore, the throughput of the substrate processing apparatus 1 can be doubled.

[0362] The first upper transfer mechanism 46T and the first lower transfer mechanism 46B are arranged so as to be aligned in the up-down direction Z. Therefore, it is possible to preferably suppress an increase in the installation area (occupied area) of the substrate processing apparatus 1 .

[0363] The second upper transfer mechanism 48T and the second lower transfer mechanism 48B are arranged so as to be aligned in the up-down direction Z. Therefore, it is possible to preferably suppress an increase in the installation area (occupancy area) of the substrate processing apparatus 1 .

[0364] The third upper transfer mechanism 68T and the third lower transfer mechanism 68B are arranged so as to be aligned in the up-down direction Z. Therefore, it is possible to preferably suppress an increase in the installation area (occupied area) of the substrate processing apparatus 1 .

[0365] The upper stage 90T and the lower stage 90B are arranged so as to be aligned in the up-down direction Z. Therefore, it is possible to preferably suppress an increase in the installation area (occupied area) of the substrate processing apparatus 1 .

[0366] The present invention is not limited to the above-described embodiments, and can be modified and implemented in the following manners.

[0367] (1) In the first and second embodiments, the second carrier 41 is arranged at a position that does not overlap with the imaginary straight line L connecting the first axis A1 and the second axis A2 in a plan view. However, the present invention is not limited thereto. The second carrier 41 may be arranged at a position that overlaps with the imaginary straight line L connecting the first axis A1 and the second axis A2 in a plan view.

[0368] Fig.19 1 is a top view of a substrate processing apparatus 1 according to a modified embodiment. In addition, the same reference numerals are given to the same components as those in the first embodiment, and detailed descriptions thereof are omitted. The second loading portion 41 is arranged at a position that does not overlap with the first processing portion 34. The second loading portion 41 is arranged at a position that does not overlap with the second processing portion 37. The second loading portion 41 is entirely arranged in the conveying space 45. The second loading portion 41 is arranged at a position that overlaps with an imaginary straight line L connecting the first axis A1 and the second axis A2. The first conveying mechanism 46, the second loading portion 41, and the second conveying mechanism 48 are arranged in a row in the front-rear direction X.

[0369] (2) In the first and second embodiments, the number of processing units is three (specifically, the first to third processing units 34, 37, and 64). However, this is not limited to this. For example, the number of processing units may be two. For example, the number of processing units may be four or more.

[0370] For example, when the third processing unit 64 is omitted, the third loading unit 51 can be omitted. Furthermore, the sixth approaching action can be omitted. As a result, the second circulation action of the second conveying mechanism 48 includes two approaching actions. That is, the number of approaching actions included in the second circulation action is two. Specifically, the two approaching actions included in the second circulation action are as follows.

[0371] Fourth approaching operation of approaching the second placement unit 41

[0372] Fifth approaching operation of approaching the second processing unit 37

[0373] (3) In the first and second embodiments described above, the substrate processing apparatus 1 is not connected to an exposure machine for exposing the substrate W. However, the present invention is not limited thereto. For example, an exposure machine may be connected to the substrate processing apparatus 1 .

[0374] For example, the exposure machine may be connected to the rear of the second block 61. In this case, the substrate processing apparatus 1 may also include a fourth loading portion for loading the substrate W to be transported between the third transport mechanism 68 and the exposure machine. In this variation, the third transport mechanism 68 repeatedly performs a third cycle operation including the following three approach operations.

[0375] ·Seventh approaching operation of approaching the third placement unit 51

[0376] · Eighth approaching operation of approaching the third processing unit 64

[0377] · Ninth approaching operation to the fourth placement unit

[0378] In the present variation, the number of approach operations included in the third cycle operation is 3. Therefore, the transfer efficiency of the third transfer mechanism 68 is still high. Thus, the throughput of the substrate processing apparatus 1 can be improved.

[0379] Alternatively, the third transport mechanism 68 may directly transport the substrate W to the exposure machine. In the present variation, the third transport mechanism 68 repeatedly performs a third cycle operation including the following three approach operations.

[0380] ·Seventh approaching operation of approaching the third placement unit 51

[0381] · Eighth approaching operation of approaching the third processing unit 64

[0382] · The 9th approach action to the exposure machine

[0383] In the present variation, the number of approach operations included in the third cycle operation is 3. Therefore, the transfer efficiency of the third transfer mechanism 68 is still high. Thus, the throughput of the substrate processing apparatus 1 can be improved.

[0384] (4) In the first and second embodiments, the substrate processing apparatus 1 does not include an interface for transferring the substrate W to the exposure machine. However, the present invention is not limited thereto. For example, the substrate processing apparatus 1 may include an interface.

[0385] For example, the interface is connected to the rear of the second block 61. In this case, the substrate processing apparatus 1 may also include a fourth placement portion for placing the substrate W to be transferred between the third transfer mechanism 68 and the interface. In this variation, the third transfer mechanism 68 repeatedly performs a third cycle operation including the following three approach operations.

[0386] ·Seventh approaching operation of approaching the third placement unit 51

[0387] · Eighth approaching operation of approaching the third processing unit 64

[0388] · Ninth approaching operation to the fourth placement unit

[0389] In the present variation, the number of approach operations included in the third cycle operation is 3. Therefore, the transfer efficiency of the third transfer mechanism 68 is still high. Thus, the throughput of the substrate processing apparatus 1 can be improved.

[0390] (5) In the first and second embodiments, the first processing section 34 is an edge exposure processing section, and the second processing section 37 is a thermal processing section. However, this is not limiting. The first processing section 34 may be a thermal processing section. The second processing section may be an edge exposure processing section.

[0391] In the first and second embodiments, the first processing unit 35 is an edge exposure processing unit, and the second processing unit 38 is a heat treatment unit. However, this is not limited to this. The first processing unit 35 may also be a heat treatment unit. The second processing unit 38 may also be an edge exposure processing unit.

[0392] (6) In the first and second embodiments, the liquid treatment performed by the third processing unit 64 is a development treatment. However, the present invention is not limited thereto. The liquid treatment performed by the third processing unit 64 may be, for example, a coating treatment. The coating treatment is a treatment in which a coating material is coated on the substrate W to form a coating on the substrate W. The coating is, for example, a resist film or an antireflection film. The liquid treatment performed by the third processing unit 64 may be, for example, a cleaning treatment. The cleaning treatment is a treatment in which a cleaning liquid is supplied to the substrate W.

[0393] (7) In the first embodiment, the first conveying mechanism 46 includes two first pillars 47a and 47b. However, the present invention is not limited to this. For example, one of the first pillars 47a and 47b may be omitted. Similarly, in the first embodiment, the second conveying mechanism 48 includes two second pillars 49a and 49b. However, the present invention is not limited to this. For example, one of the second pillars 49a and 49b may be omitted.

[0394] (8) In the first embodiment and the second embodiment, the first processing section 34 is disposed at the right position of the transport space 45 and the left position of the transport space 45. However, this is not limiting. For example, the first processing section 34 may be disposed at only one of the right position of the transport space 45 and the left position of the transport space 45. The second processing section 37 and the third processing section 64 may also be changed in the same manner.

[0395] (9) In the first and second embodiments, the second processing unit 38 may further include a temperature control device mounted on the first plate 39a and adjusting the temperature of the first plate 39a. For example, the first plate 39a may also adjust the temperature of the substrate W. For example, the first plate 39a may also cool the substrate W heated by the second plate 39b.

[0396] Alternatively, the second processing unit 38 may further include a temperature control device installed in the local transport mechanism and regulating the temperature of the local transport mechanism. For example, the local transport mechanism may also regulate the temperature of the substrate W. For example, the local transport mechanism may also cool the substrate W heated by the second plate 39b.

[0397] (10) In the first and second embodiments, the second placement portion 41 is disposed at a position overlapping the first left processing portion 34L and the second left processing portion 37L in a plan view. However, the present invention is not limited thereto. The second placement portion 41 may be disposed at a position overlapping the first right processing portion 34R and the second right processing portion 37R in a plan view.

[0398] (11) In the first and second embodiments, the space F is arranged in front of the third right processing section 64R. However, the present invention is not limited thereto. The space F may be arranged behind the third right processing section 64R. The space F may be arranged in front of or behind the third right processing section 64R.

[0399] (12) In the first and second embodiments, the length G1 of the third right processing section 64R in the front-to-back direction X is smaller than the length G2 of the third left processing section 64L in the front-to-back direction X. However, this is not limited to this. The length G2 may also be smaller than the length G1. In the case of the present variation, the third right processing section 64R is an example of the third long processing section in the present invention. The third left processing section 64L is an example of the third short processing section in the present invention. In the present variation, the space F and the third left processing section 64L are arranged in the front-to-back direction X. In the present variation, the configuration of the space F may also be appropriately changed.

[0400] (13) In the first embodiment, the operation of the loader 11 is not described in detail. The operation of the loader 11 is exemplified below. For example, the loader 11 may unload a substrate W from the carrier CA on the carrier mounting section 12A and load the substrate W into the carrier CB on the carrier mounting section 12B. In this case, after all the substrates W in the carrier CA on the carrier mounting section 12A are unloaded, the carrier CA on the carrier mounting section 12A may be transferred to the carrier mounting section 12B. The loader 11 may not load the substrate W into the carrier CA on the carrier mounting section 12A. The loader 11 may not unload the substrate W from the carrier CB on the carrier mounting section 12B.

[0401] (14) The configurations of the various modified embodiments described in the embodiment and (1) to (13) above may be modified in appropriate combinations.

[0402] The present invention may be embodied in other specific forms without departing from the spirit or essence thereof and, therefore, reference should be made to the appended claims rather than to the foregoing description as indicating the scope of the invention.

[0403] [Explanation of Symbols]

[0404] 1 Substrate processing device

[0405] 11 Loading unit

[0406] 12A, 12B, 12C, 12D Carrier loading section

[0407] 13 Transport space

[0408] 14A, 14B Loading transport mechanism

[0409] 21 First loading section

[0410] 21T 1st upper loading section

[0411] 21B No. 1 Download Unit

[0412] 22a, 22b Flat Plate

[0413] 31 Block 1

[0414] 32 Frame 1

[0415] 34 1st Processing Unit

[0416] 34R 1st right processing unit

[0417] 34L 1st left processing unit

[0418] 34T 1st upper processing unit

[0419] 34B 1st lower processing unit

[0420] 35 1st processing unit

[0421] 36a Rotation holding portion

[0422] 36b Light irradiation part

[0423] 37 Second Processing Unit

[0424] 37R 2nd right processing unit

[0425] 37L 2nd left processing unit

[0426] 37T 2nd upper processing unit

[0427] 37B 2nd lower processing unit

[0428] 38 2nd processing unit

[0429] 39a Plate 1

[0430] 39b Second Plate

[0431] 41 Second loading section (loading section)

[0432] 41a Part 1

[0433] 41b Part 2

[0434] 41c Part 3

[0435] 41T Second upper loading section

[0436] 41B No. 2 download unit

[0437] 42a, 42b Flat Plate

[0438] Slots 43 and 44

[0439] 43f-43j slot (1st slot)

[0440] 43f-43h tank (1st tank for processing)

[0441] 43i slot (first slot for loading)

[0442] 44f-44j slot (2nd slot)

[0443] 44f-44h, 44j tank (second tank for processing)

[0444] 44i slot (second slot for loading)

[0445] 45 Transport Space

[0446] 45T upper transport space

[0447] 45B Lower transfer space

[0448] 46 First Transport Mechanism

[0449] 46T 1st upper transport mechanism

[0450] 46B 1st lower transport mechanism

[0451] 47a, 47b Pillar 1

[0452] 47c No. 1 elevator

[0453] 47d 1st rotating part

[0454] 47e, 47f First holding portion

[0455] 48 Second transport mechanism

[0456] 48T 2nd upper transport mechanism

[0457] 48B Second lower transport mechanism

[0458] 49a, 49b Pillar 2

[0459] 49c Second Elevator

[0460] 49d Second rotating part

[0461] 49e, 49f Second holding part

[0462] 51 Third loading section

[0463] 51T 3rd upper loading section

[0464] 51B No. 3 download unit

[0465] 52a, 52b Flat Plate

[0466] 61 Block 2

[0467] 62 Frame 2

[0468] 64 Processing Unit 3

[0469] 64R 3rd right processing unit (3rd short processing unit)

[0470] 64L 3rd left processing section (3rd long processing section)

[0471] 64T 3rd upper processing unit

[0472] 64B 3rd lower processing unit

[0473] 65 3rd processing unit

[0474] 66a Rotation holding portion

[0475] 66b Nozzle

[0476] 66c Cup

[0477] 67 Transport Space

[0478] 67T upper transport space

[0479] 67B Lower transfer space

[0480] 68 The third transport mechanism

[0481] 68T 3rd upper transport mechanism

[0482] 68B 3rd lower transport mechanism

[0483] 69a, 69b Pillar 3

[0484] 69c No. 3 Lifting Section

[0485] 69d 3rd horizontal moving part

[0486] 69e 3rd Rotating Unit

[0487] 69f, 69g Third holding part

[0488] 71 Inspection Port

[0489] 72 cover

[0490] 81 Control Department

[0491] 90T Upper Class

[0492] 90B Lower Class

[0493] 91 Next door

[0494] 92 Next door

[0495] A1 1st axis

[0496] A2 2nd Axis

[0497] B1 Area 1

[0498] B2 Area 2

[0499] B3 Area 3

[0500] C, CA, CB, CC, CD carrier

[0501] D1 Distance between the first axis A1 and the second axis A2

[0502] D2 The distance between the first axis A1 and point P1 when viewed from above

[0503] D3 The distance between the second axis A2 and point P1 when viewed from above

[0504] D4 Distance between the first axis A1 and point P2 when viewed from above

[0505] D5 The distance between the second axis A2 and point P3 when viewed from above

[0506] E, E1, E2 space (insulated space)

[0507] F space (insulation space, maintenance space)

[0508] G1 Length of the third right processing part in the front-back direction

[0509] G2 Length of the third left processing section in the front-to-back direction

[0510] L Imaginary straight line

[0511] P1 The center point of the substrate placed on the second mounting portion

[0512] P2 The center point of the substrate placed on the first processing unit (rotation holding unit 36a)

[0513] P3 The center point of the substrate placed on the second processing unit (first plate 39a)

[0514] r substrate radius

[0515] W substrate

[0516] X front and back direction

[0517] Y width direction

[0518] Z Up and Down Direction

Claims

1. A substrate processing device, comprising: A loading unit that unloads a substrate from a carrier; A first processing unit processes the substrate; A first transport mechanism transports the substrate to the first processing section; a second processing section that performs a different processing on the substrate than that performed by the first processing section; a second transport mechanism for transporting the substrate to the second processing section; a first loading portion for loading the substrate to be transferred between the loading portion and the first transfer mechanism; a second placement portion for placing the substrate transferred between the first transfer mechanism and the second transfer mechanism; and a control unit that controls the loading unit, the first processing unit, the first conveying mechanism, the second processing unit, and the second conveying mechanism; and According to the control of the control unit, the first conveying mechanism repeatedly performs a first cycle operation including three approach operations. One of the approaching actions included in the first cycle action is a first approaching action of approaching the first placing portion. Another of the approaching actions included in the first cycle action is a second approaching action of approaching the first processing unit. The other one of the approaching actions included in the first cycle action is a third approaching action of approaching the second placement portion. According to the control of the control unit, the second conveying mechanism repeatedly performs a second cycle action including two or three approach actions. One of the approaching actions included in the second cycle action is a fourth approaching action of approaching the second placing portion, Another of the approaching actions included in the second cycle action is a fifth approaching action of approaching the second processing section; The first loading portion is arranged between the loading portion and the first conveying mechanism. The second loading section is arranged between the first conveying mechanism and the second conveying mechanism. The first processing unit is arranged on the side of the first conveying mechanism. The second processing unit is arranged on the side of the second conveying mechanism; The first conveying mechanism, the second conveying mechanism, and the second placing portion are arranged in a triangle in a plan view.

2. The substrate processing apparatus according to claim 1, wherein The first approaching operation includes an operation of the first conveying mechanism to take the substrate on the first mounting portion and to mount the substrate on the first mounting portion. The second approaching operation includes an operation of the first transport mechanism for transporting a substrate into the first processing section and transporting a substrate out of the first processing section. The third approaching operation includes an operation of the first conveying mechanism to take the substrate on the second placing portion and place the substrate on the second placing portion. The fourth approaching operation includes an operation of the second conveying mechanism to take the substrate on the second mounting portion and to mount the substrate on the second mounting portion. The fifth approach operation includes an operation of the second transport mechanism that carries a substrate into the second processing section and carries a substrate out of the second processing section.

3. The substrate processing apparatus according to claim 1, wherein The first processing unit is arranged outside a second area where the second transport mechanism can transport the substrate. The second processing section is arranged outside a first region where the first transfer mechanism can transfer a substrate.

4. The substrate processing apparatus according to claim 3, wherein The first area is circular in plan view, The second region is circular in a plan view.

5. The substrate processing apparatus according to claim 1, wherein The first conveying mechanism comprises: The first support column is fixed and extends in the up-down direction; A first lifting part, supported by the first support column and movable in the up-down direction; a first rotating portion supported by the first lifting portion and capable of rotating about a first axis parallel to the up-down direction; and a first holding portion supported by the first rotating portion and holding the substrate; and The first rotating part is configured to be unable to move in the horizontal direction. The first processing section includes a plurality of first processing units for processing substrates one by one. The first processing units are each arranged at a position overlapping with the first axis in a side view, The second conveying mechanism comprises: A second support column is arranged to be fixed and extends in the up-down direction; a second lifting part supported by the second support column and movable in the up-down direction; a second rotating portion supported by the second lifting portion and capable of rotating about a second axis parallel to the up-down direction; and a second holding portion supported by the second rotating portion and holding the substrate; and The second rotating part is configured to be unable to move in the horizontal direction. The second processing section includes a plurality of second processing units for processing substrates one by one. Each of the second processing units is arranged at a position overlapping with the second axis in a side view.

6. The substrate processing apparatus according to claim 5, wherein One of the first processing unit and the second processing unit is a heat treatment unit that performs heat treatment on the substrate. The heat treatment units are arranged in an up-and-down direction.

7. The substrate processing apparatus according to claim 5, wherein In a plan view, a distance between the first axis and the second axis is less than 5 times the radius of the substrate.

8. The substrate processing apparatus according to claim 5, wherein The second mounting portion is disposed at a position that does not overlap with a virtual straight line connecting the first axis and the second axis in a plan view.

9. The substrate processing apparatus according to claim 8, wherein In a plan view, a distance between the first axis and the second mounting portion is equal to a distance between the second axis and the second mounting portion.

10. The substrate processing apparatus according to claim 1, wherein The second loading portion includes: The first part overlaps with the first processing part in a plan view; and The second portion overlaps with the second processing unit in a plan view.

11. The substrate processing apparatus according to claim 10, wherein The second placement section further includes a third portion that does not overlap with the first processing section and the second processing section in a plan view.

12. The substrate processing apparatus according to claim 11, wherein The third portion of the second placement unit overlaps with a transport space in which the first transport mechanism and the second transport mechanism are installed in a plan view.

13. The substrate processing apparatus according to claim 1, wherein The substrate processing device comprises: a plurality of first slots disposed on the side of the first conveying mechanism and arranged in a row in the vertical direction; and A plurality of second slots are arranged on the side of the second conveying mechanism and arranged in a row in the vertical direction; and At least one of the first tanks is a first processing tank for installing the first processing unit. The other of the first grooves is a first placement groove for setting the second placement portion. At least one of the second tanks is a second processing tank for setting the second processing unit. The other of the second grooves is a second placement groove for setting the second placement portion. The second placement groove is arranged at the same height position as the first placement groove, The second placement portion is provided across the first placement groove and the second placement groove.

14. A substrate processing device comprising: A loading unit that unloads a substrate from a carrier; A first processing unit processes the substrate; A first transport mechanism transports the substrate to the first processing section; a second processing section that performs a different processing on the substrate than that performed by the first processing section; a second transport mechanism for transporting the substrate to the second processing section; a first loading portion for loading the substrate to be transferred between the loading portion and the first transfer mechanism; a second placement portion for placing the substrate transferred between the first transfer mechanism and the second transfer mechanism; and a control unit that controls the loading unit, the first processing unit, the first conveying mechanism, the second processing unit, and the second conveying mechanism; and According to the control of the control unit, the first conveying mechanism repeatedly performs a first cycle operation including three approach operations. One of the approaching actions included in the first cycle action is a first approaching action of approaching the first placing portion. Another of the approaching actions included in the first cycle action is a second approaching action of approaching the first processing unit. The other one of the approaching actions included in the first cycle action is a third approaching action of approaching the second placement portion. According to the control of the control unit, the second conveying mechanism repeatedly performs a second cycle action including two or three approach actions. One of the approaching actions included in the second cycle action is a fourth approaching action of approaching the second placing portion, Another of the approaching actions included in the second cycle action is a fifth approaching action of approaching the second processing unit; and The substrate processing device comprises: a third processing section that performs a different process on the substrate than the first processing section and the second processing section; a third transport mechanism for transporting the substrate to the third processing section; and a third loading portion for loading the substrate transferred between the second transfer mechanism and the third transfer mechanism; and The control unit further controls the third processing unit and the third conveying mechanism. The second cycle action includes three of the approach actions. The remaining one of the approaching actions included in the second cycle action other than the fourth approaching action and the fifth approaching action is a sixth approaching action of approaching the third placement portion. According to the control of the control unit, the third conveying mechanism repeatedly performs a third cycle action including two or three approach actions. One of the approaching actions included in the third cycle action is a seventh approaching action of approaching the third placing portion, Another of the approaching actions included in the third cycle action is to approach the third processing unit. A close 8th approach; and The third processing unit includes Long Processing Unit 3; and The 3rd short processing unit, The third conveying mechanism is arranged between the third long processing section and the third short processing section. The third long processing section, the third conveying mechanism and the third short processing section are arranged in the width direction. The length of the third short processed portion in the front-to-back direction orthogonal to the width direction is smaller than the length of the third long processed portion in the front-to-back direction. The substrate processing device has a maintenance space, The maintenance space and the third short processing section are arranged in the front-rear direction.

15. The substrate processing apparatus according to claim 14, wherein The sixth approaching operation includes an operation of the second conveying mechanism to obtain the substrate on the third mounting portion and to mount the substrate on the third mounting portion. The seventh approaching operation includes an operation of the third conveying mechanism to obtain the substrate on the third mounting portion and to mount the substrate on the third mounting portion. The eighth approach operation includes an operation of the third transfer mechanism for transferring a substrate into the third processing section and transferring a substrate out of the third processing section.

16. The substrate processing apparatus according to claim 14, wherein One of the first processing unit and the second processing unit is an edge exposure processing unit for exposing a peripheral portion of a substrate. The other of the first processing section and the second processing section is a heat processing section that performs heat treatment on a substrate, and the third processing section is a liquid processing section that performs liquid treatment on a substrate.

17. The substrate processing apparatus according to claim 16, wherein According to the control performed by the control unit, the first conveying mechanism, the second conveying mechanism and the third conveying mechanism sequentially convey the substrate supplied from the loading unit to the edge exposure processing unit, the liquid processing unit and the heat treatment unit, According to the control by the control unit, the first transport mechanism and the second transport mechanism return the substrate carried out from the thermal processing unit to the loading unit without delivering the substrate to the third transport mechanism.

18. The substrate processing apparatus according to claim 16, wherein A heat-insulating space is provided to separate the third processing section from the second processing section.

19. The substrate processing apparatus according to claim 14, wherein The substrate processing device comprises: A first block accommodating the first processing unit, the first conveying mechanism, the second processing unit, the second conveying mechanism, and the second loading unit; and The second block is connected to the first block and accommodates the third processing unit and the third conveying mechanism; and The first block is rectangular in front, top and side views. The second block is rectangular in front view, top view and side view.

20. The substrate processing apparatus according to claim 19, wherein The substrate processing device comprises: a first frame, provided as a skeleton of the first block, supporting the first conveying mechanism, the second conveying mechanism, the first processing section, the second processing section, and the second loading section; and A second frame is provided as a skeleton of the second block, supporting the third conveying mechanism and the third processing unit; and The second frame is connected to the first frame.

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