Motherboard assembly line

Abstract

The present application provides a motherboard assembly line, which relates to the technical field of motherboard assembly. The motherboard assembly line includes: a reflow jig line and a motherboard loading station, a memory bar assembly station, a radiator assembly station and a finished product unloading station which are spaced from the upstream to the downstream of the reflow jig line. And the robot completes: delivering the motherboard from the motherboard conveyor line of the motherboard loading station to the reflow jig line; delivering the memory bar from the memory bar conveyor line of the memory bar assembly station and assembling it to the motherboard; delivering the radiator from the radiator conveyor line of the radiator assembly station and assembling it to the motherboard; delivering the assembled motherboard finished product from the reflow jig line to the finished product conveyor line of the finished product unloading station. The motherboard assembly line can connect various work links in series by relying on the reflow jig line, and realize the assembly of the motherboard through automated loading of the motherboard, memory bar, and radiator, assembly and unloading of the robot, thereby reducing the intensity of manual labor.

Description

Technical Field

[0001] The present application relates to the technical field of motherboard assembly, and in particular to a motherboard assembly line. Background Art

[0002] In the prior art, there is a lack of a production line for the overall assembly of the motherboard, and many links require manual intervention, such as loading and unloading, memory stick, heat sink assembly, etc., which will reduce the assembly efficiency of the motherboard and increase the labor intensity. Summary of the invention

[0003] The purpose of the present application is to provide a motherboard assembly line, which can improve the problems of low motherboard assembly efficiency and high manual labor intensity.

[0004] The embodiment of the present application is implemented as follows:

[0005] An embodiment of the present application provides a motherboard assembly line, comprising: a reflow jig line and a motherboard loading station, a memory bar assembly station, a heat sink assembly station and a finished product unloading station which are sequentially spaced from upstream to downstream of the reflow jig line;

[0006] The following operations are completed by the robot:

[0007] Delivering the mainboard from the mainboard conveying line of the mainboard loading station to the reflow fixture line;

[0008] Delivering the memory stick from the memory stick conveying line of the memory stick assembly station and assembling the memory stick to the mainboard;

[0009] Delivering the heat sink from the heat sink conveying line of the heat sink assembly station and assembling it to the mainboard;

[0010] The assembled motherboard product is delivered from the reflow fixture line to the finished product conveying line of the finished product unloading station.

[0011] The reflow fixture line can link the motherboard assembly processes of loading, assembling and unloading, and perform different tasks at different workstations through robots, which greatly reduces the manual operation links, makes the overall assembly effect higher, reduces the labor intensity, and due to less human intervention, there are fewer errors during assembly, which is also beneficial to reducing the overall cost.

[0012] In addition, the motherboard assembly line provided according to the embodiment of the present application may also have the following additional technical features:

[0013] In an optional embodiment of the present application, the mainboard loading station also includes a base tray conveyor line, and the first robot first delivers the base tray from the base tray conveyor line to the fixture on the reflow fixture line, and then delivers the mainboard to the base tray located on the reflow fixture line.

[0014] By setting up a bottom bracket conveyor line, the step of manually placing the bottom bracket can be further eliminated, further reducing the labor intensity of manual work.

[0015] In an optional embodiment of the present application, a first actuator is connected to the end of the first manipulator, and the first actuator includes a base transfer mechanism for picking up and placing the base and a mainboard clamping mechanism for picking up and placing the mainboard.

[0016] Since the base transfer mechanism and the mainboard clamping mechanism are provided on the first actuator, the first manipulator can have different service objects without the need to provide an additional manipulator or other transfer mechanism for the base, thereby reducing equipment costs.

[0017] In an optional embodiment of the present application, the memory bar assembly station is provided with a second manipulator, the end of the second manipulator is connected to a second actuator, and the second actuator includes an opening mechanism and a memory bar clamping mechanism;

[0018] The opening mechanism is used to open the hippocampus head on the mainboard for clamping the memory stick, and the memory stick clamping mechanism is used to grab the memory stick. After the opening mechanism opens the hippocampus head, the second manipulator can drive the memory stick clamping mechanism to insert the memory stick into the memory stick slot on the mainboard.

[0019] By integrating the opening mechanism and the memory stick clamping mechanism on the second manipulator, the transfer and assembly of the memory stick can be completed without adding any additional structure. The overall structure is simple and practical.

[0020] In an optional embodiment of the present application, the second manipulator drives and presses the memory stick to eject the memory stick from the memory stick slot.

[0021] By pressing and assembling for many times, the diaphragm of the memory module can be destroyed, thereby improving the contact performance between the memory module and the memory module slot.

[0022] In an optional embodiment of the present application, the memory stick assembly station also includes a memory stick front and back detection mechanism, and a second robot delivers the memory stick on the memory stick conveyor line to the memory stick front and back detection mechanism, and then delivers and assembles the tested memory stick to the mainboard.

[0023] The memory stick front and back detection mechanism can help identify whether the memory stick is loaded with the correct front and back, ensuring that the memory stick is assembled on the motherboard in the correct direction.

[0024] In an optional embodiment of the present application, the memory stick assembly station further includes a dust removal device, which is arranged next to the reflow jig line and is used to remove dust from the memory stick slot on the motherboard.

[0025] Through the operation of the dust removal device, the memory module slot can be cleaned before assembling the memory module, thereby preventing dust and other impurities from affecting the normal operation of the memory module after installation.

[0026] In an optional embodiment of the present application, the radiator assembly station is provided with a third manipulator, the end of the third manipulator is connected to a third actuator, and the third actuator includes a radiator clamping mechanism and a screw locking mechanism;

[0027] The radiator clamping mechanism is used to clamp the radiator. After the third manipulator drives the radiator clamping mechanism to deliver the radiator to the radiator mounting portion of the mainboard, the screw locking mechanism fixes the radiator to the radiator mounting portion through screws.

[0028] The third manipulator can drive the radiator clamping mechanism to clamp and transfer the radiator and place it in place. Then the screws can be directly taken through the screw locking mechanism and the radiator can be locked on the mainboard to realize the assembly of the radiator.

[0029] In an optional embodiment of the present application, the radiator assembly station is provided with a pressing device, which is arranged next to the reflow fixture line. When the screw locking mechanism is working, the pressing device pre-fixes the radiator to the radiator mounting part.

[0030] The pressing device can temporarily fix the heat sink before tightening the screws to prevent the screws from driving the heat sink to move during the tightening process, thereby ensuring that the screws are screwed into the correct position and the heat sink is stably fixed on the motherboard.

[0031] In an optional embodiment of the present application, a rework station is further provided between the radiator assembly station and the finished product unloading station, the reflow jig line is provided with a transfer device, and the rework station is provided with a rework conveyor line, and the transfer device is used to transfer the motherboard to be reworked after the radiator assembly is completed to the rework conveyor line.

[0032] By setting up a rework station before unloading, unqualified products can be prevented from flowing into the unloading station and eventually being transported together with other qualified products, thus ensuring product quality and eliminating the risk of unqualified products flowing into other production links or consumption links in the later stage. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0034] Figure 1 This is a top view of the motherboard assembly line;

[0035] Figure 2 This is a schematic diagram of the reflow fixture line;

[0036] Figure 3 This is a schematic diagram of the double-layer AGV docking line;

[0037] Figure 4 is a schematic diagram of a first actuator;

[0038] Figure 5 It is a schematic diagram of the empty tray transfer mechanism;

[0039] Figure 6 A schematic diagram of a memory module assembly station;

[0040] Figure 7 is a schematic diagram from one perspective of the second actuator;

[0041] Figure 8 is a schematic diagram of the second actuator from another perspective;

[0042] Fig. 9 The figure is a schematic diagram of a memory stick front and back detection mechanism;

[0043] Fig.10 is a schematic diagram of a dust removal device;

[0044] Fig.11 A schematic diagram of a radiator assembly station;

[0045] Fig.12 is a schematic diagram of the third actuator;

[0046] Fig.13 is a schematic diagram of a pressing device;

[0047] Fig.14 It is a schematic diagram of the transfer device of the reflow fixture line;

[0048] Fig.15 This is a schematic diagram of the finished motherboard.

[0049] Icons: 100-mainboard conveyor line; 110-first manipulator; 120-bottom support transfer mechanism; 130-mainboard clamping mechanism; 131-clamping claw; 132-bidirectional cylinder; 133-stroke cylinder; 200-memory bar conveyor line; 210-second manipulator; 220-opening mechanism; 221-opening claw; 222-guide groove; 223-guide rod; 224-opening cylinder; 225-opening head; 230-memory bar clamping mechanism; 231-clamping block; 2311-clamping groove; 232-buffering structure; 240-memory bar positive and negative detection mechanism; 241-light source; 242-reflection sensor; 250-dust removal device; 251-coordinate manipulator; 252-suction mechanism; 260-tray picking mechanism; 300-radiator conveyor line; 310-third manipulator; 321-finger cylinder; 3 22-clamping part; 330-electric screwdriver; 340-pressing device; 341-slide cylinder; 342-slide rail; 343-pressing part; 400-bottom support conveyor line; 500-return fixture line; 510-stopper; 520-lifting device; 600-finished product conveyor line; 610-unloading manipulator; 700-repair conveyor line; 710-scanner; 720-synchronous belt; 730-maintenance work Table; 800- fixture; 900- CCD lens; 910- empty tray transfer mechanism; 911- single-axis manipulator; 912- material picking unit; 913- opening and closing cylinder; 1000- finished motherboard; 1100- raw material of motherboard; 1200- finished memory stick; 1300- finished radiator; 1400- hippocampus head; 1500- barcode scanner; 1600- lifting mechanism; 1700- correction workbench. DETAILED DESCRIPTION

[0050] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0051] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0052] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0053] In the description of this application, it should be noted that the terms "upper", "lower", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product is usually placed when in use, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", etc. are only used to distinguish descriptions, and cannot be understood as indicating or implying relative importance.

[0054] In the description of this application, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "disposed" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0055] Example

[0056] Please refer to Figures 1 to 14 The present application provides a motherboard assembly line, which can assemble motherboards into Fig.15 The motherboard finished product 1000 shown in FIG. Among them, the motherboard raw material 1100 is provided with a memory card slot (i.e. Fig.15 The motherboard raw material 1100 is provided with a position where the finished memory stick 1200 is inserted), the heat sink mounting portion (i.e. Fig.15 The motherboard raw material 1100 is fixed to the position of the finished heat sink 1300), and the two ends of the memory card slot have hippocampus heads 1400 to fix the memory. These are existing structures and will not be described in detail below.

[0057] like Figure 1 As shown, specifically, the motherboard assembly line includes: a reflow fixture line 500 and a motherboard loading station, a memory bar assembly station, a heat sink assembly station and a finished product unloading station which are sequentially spaced from the upstream to the downstream of the reflow fixture line 500;

[0058] The following operations are completed by the robot:

[0059] Delivering the mainboard (i.e., the mainboard raw material 1100) from the mainboard conveying line 100 of the mainboard loading station to the reflow fixture line 500;

[0060] Deliver the memory stick from the memory stick conveying line 200 of the memory stick assembly station and assemble it to the mainboard;

[0061] Delivering the heat sink from the heat sink conveyor line 300 of the heat sink assembly station and assembling it to the mainboard;

[0062] The assembled motherboard product 1000 is delivered from the reflow fixture line 500 to the finished product conveying line 600 of the finished product unloading station.

[0063] The motherboard conveyor line 100, the memory stick conveyor line 200, the heat sink conveyor line 300 and the bottom bracket conveyor line 400 mentioned below in this embodiment all adopt Figure 3 The double-layer AGV docking line shown can be docked with an AGV (Automated Guided Vehicle, which is a transport vehicle equipped with an electromagnetic or optical automatic guidance device, capable of traveling along a specified guidance path, and having safety protection and various transfer functions), receiving the delivered material boxes at the upper receiving point and scanning and identifying the incoming material boxes through a barcode scanner 1500, and transporting the empty material boxes that have completed the delivery from the lower layer to facilitate the AGV to transport the empty material boxes away. Among them, a lifting mechanism 1600 is configured at one end of the double-layer AGV docking line close to the return fixture line 500 to realize the transfer of empty material boxes from the upper layer to the lower layer.

[0064] Of course, the finished product unloading station of this embodiment also uses a double-layer AGV connection line as a rework conveyor line 700. After the motherboard finished product 1000 is filled with a material box, it can be sent out, for example, it can be handed over to an AGV car to be transported to a storage area or other work area, such as a chassis assembly area, etc. The double-layer AGV connection line used in this embodiment and the corresponding lifting mechanism 1600, barcode scanner 1500, etc. can all refer to general technology and will not be repeated here.

[0065] The reflow fixture line 500 can link the motherboard assembly processes of loading, assembling and unloading, and perform different tasks at different workstations through robots, which greatly reduces the manual operation links, making the overall assembly effect higher and reducing the labor intensity. In addition, due to less human intervention, fewer errors occur during assembly, which is also beneficial to reducing the overall cost.

[0066] Specifically, Figure 1 As shown, in this embodiment, the mainboard loading station further includes a bottom bracket conveyor line 400, and the first manipulator 110 first delivers the bottom bracket from the bottom bracket conveyor line 400 to the fixture 800 on the reflow fixture line 500, and then delivers the mainboard to the bottom bracket located on the reflow fixture line 500. By setting the bottom bracket conveyor line 400, the step of manually placing the bottom bracket can be further eliminated, and the labor intensity of manual labor can be further reduced.

[0067] The first actuator is connected to the end of the first manipulator 110, and the first actuator includes a base transfer mechanism 120 for picking up and placing the base and a mainboard clamping mechanism 130 for picking up and placing the mainboard. Since the base transfer mechanism 120 and the mainboard clamping mechanism 130 are provided on the first actuator, the first manipulator 110 can have different service objects without having to provide another manipulator or other transfer mechanism for the base, thereby reducing the equipment cost.

[0068] In detail, the mainboard clamping mechanism 130 has two opposing clamping claws 131, and the clamping claws 131 are driven to close or move away by a bidirectional cylinder 132 to achieve clamping or loosening of the mainboard. The bottom support transfer mechanism 120 is provided with a suction cup, which can suck the bottom support by generating negative pressure through air extraction, and when the air extraction stops, the bottom support can be loosened. Of course, the bottom support transfer mechanism 120 and the mainboard clamping mechanism 130 are each equipped with a stroke cylinder 133, which can further drive the corresponding mechanism to approach the mainboard or bottom support to be taken when the first manipulator 110 moves into place.

[0069] In addition, when taking the base and the main board, the front and back sides will be judged by the photo detection function to prevent the material on the fixture 800 from being placed upside down. And after loading the material to the fixture 800, the scanner 710 arranged on the reflux fixture line 500 can be used to scan the code, and the fixture 800 code and the main board code can be bound to facilitate the statistics of product quantity, finished product rate, defective rate, etc., or when a problem occurs, it is precisely known which product on the fixture 800 has a problem. Among them, the photo detection can be implemented by using a CCD (Charge Coupled Device) lens and a matching detection circuit, which are all existing technologies, and the scanning and binding of the scanner 710 are also mature technologies, which will not be repeated here. It should be noted that the CCD lens 900 used in this embodiment is all existing technology, and the differences in structure can be selected according to functional requirements, and should not be restrictively understood as the structure must be the same or different.

[0070] Please combine Figures 6 to 10 Specifically, in this embodiment, the memory bar assembly station is provided with a second manipulator 210, the end of the second manipulator 210 is connected to a second actuator, and the second actuator includes an opening mechanism 220 and a memory bar clamping mechanism 230;

[0071] The opening mechanism 220 is used to open the hippocampus head 1400 on the mainboard for clamping the memory stick, and the memory stick clamping mechanism 230 is used to grab the memory stick. After the opening mechanism 220 opens the hippocampus head 1400, the second manipulator 210 can drive the memory stick clamping mechanism 230 to insert the memory stick into the memory stick slot on the mainboard. By integrating the opening mechanism 220 and the memory stick clamping mechanism 230 on the second manipulator 210, the transfer and assembly of the memory stick can be completed without adding a separate structure, and the overall structure is simple and practical.

[0072] The memory stick clamping mechanism 230 has two clamping blocks 231 and is driven by a bidirectional cylinder (not shown) to open and close. The clamping block 231 has a clamping groove 2311 to prevent the memory stick from shifting sideways when clamping the memory stick. A buffer structure 232 is provided in the area between the two clamping blocks 231 to prevent the memory stick from being damaged during the process of pressing down the memory stick, and also to provide a buffer for the mainboard to prevent the mainboard from being crushed.

[0073] Among them, the opening mechanism 220 has two opening claws 221, and two guide grooves 222 corresponding to the opening claws 221 are opened on the base plate on which the opening mechanism 220 is installed. A guide rod 223 is provided on one side of the opening claw 221, and an opening cylinder 224 is provided at one end of the opening head 225 hinged to the opening claw 221. When the opening cylinder 224 drives the opening head 225 to move, the opening head 225 can drive the opening claw 221 to move. Due to the action of the guide rod 223 and the guide groove 222, the two opening claws 221 move away from each other. When the opening claws 221 contact the hippocampal head 1400 respectively, such movement away from each other can pry the hippocampal head 1400 and make the hippocampal head 1400 open.

[0074] In detail, after the second manipulator 210 drives the memory stick to enter and exit the memory stick slot multiple times, the memory stick is assembled into the memory stick slot of the mainboard. In this embodiment, after the second manipulator 210 drives the memory stick to be inserted into the memory stick slot for the first time, the hippocampus head 1400 is automatically locked;

[0075] The second manipulator 210 presses the memory stick clamping mechanism 230 again to make the memory stick pop out and the hippocampus head 1400 unlock;

[0076] After the second robot 210 presses the memory bar for the third time, the memory bar is assembled to the mainboard.

[0077] By pressing and assembling for many times, the diaphragm of the memory module can be destroyed, thereby improving the contact performance between the memory module and the memory module slot.

[0078] In detail, the memory stick assembly station also includes a memory stick front and back detection mechanism 240, and the second manipulator 210 delivers the memory stick on the memory stick conveyor line 200 to the memory stick front and back detection mechanism 240, and then delivers and assembles the tested memory stick to the mainboard. The memory stick front and back detection mechanism 240 can help identify whether the front and back of the memory stick are correct when loading, and ensure that the direction of the memory stick assembled on the mainboard is correct. The memory stick front and back detection mechanism 240 has a CCD lens 900 to ensure that the memory stick captured by the second actuator is scanned and accurately positioned, and is equipped with a light source 241, and then uses a corresponding sensor 242 to perform front and back detection on the memory stick. These are relatively existing methods and will not be repeated here.

[0079] In this embodiment, the memory bar assembly station also includes a dust removal device 250, which is arranged next to the reflow fixture line 500 and is used to remove dust from the memory bar slot on the mainboard. Through the operation of the dust removal device 250, the memory bar slot can be cleaned before assembling the memory bar to prevent dust and other impurities from affecting the normal operation of the memory bar after installation. Generally speaking, the dust removal device 250 is provided with a coordinate manipulator 251, and a CCD lens 900 is also provided to locate the memory bar slot, and a suction mechanism 252 is also provided to remove dust. The coordinate manipulator 251 can drive the CCD lens 900 to move to determine the position of the memory bar slot, and then the suction mechanism 252 is driven by a linear drive structure such as a cylinder, close to the memory bar slot, and sucks the dust in the memory bar slot to achieve the purpose of cleaning the memory bar slot. The specific structure of the dust removal device 250 can also refer to the equipment used for the general device for cleaning the memory bar slot, which will not be repeated here.

[0080] Please combine Figures 11 to 14 Specifically, in this embodiment, the radiator assembly station is provided with a third manipulator 310, the end of the third manipulator 310 is connected to a third actuator, and the third actuator includes a radiator clamping mechanism and a screw locking mechanism;

[0081] The radiator clamping mechanism is used to clamp the radiator. After the third manipulator 310 drives the radiator clamping mechanism to deliver the radiator to the radiator mounting portion of the mainboard, the screw locking mechanism fixes the radiator to the radiator mounting portion through screws.

[0082] The third actuator is also provided with a CCD lens 900 to take a picture and position the radiator. The radiator clamping mechanism includes a finger cylinder 321 and a clamping part 322. The finger cylinder 321 can clamp and loosen the radiator by driving the clamping part 322. A sensor can be further provided in the clamping part 322 to detect whether the radiator is effectively clamped.

[0083] Among them, the screw locking mechanism is a commonly used electric screwdriver 330, which will not be described here.

[0084] In general, the third manipulator 310 can drive the heat sink clamping mechanism to clamp and transfer the heat sink and place it in place. Then the screws can be directly taken through the screw locking mechanism, and the heat sink can be locked on the mainboard to achieve the assembly of the heat sink.

[0085] In detail, the heat sink assembly station is provided with a pressing device 340, which is arranged next to the reflow fixture line 500. When the screw locking mechanism is working, the pressing device 340 pre-fixes the heat sink to the heat sink mounting portion. The pressing device 340 can temporarily fix the heat sink before tightening the screws, so as to avoid the screws driving the heat sink to move during the screw tightening process, and ensure that the screws are screwed in the correct position and the heat sink is stably fixed on the motherboard.

[0086] The pressing device 340 is provided with a slide cylinder 341 , which cooperates with the slide rail 342 to adjust the position of the pressing portion 343 so as to stabilize the radiator.

[0087] like Figure 5 As shown, it can be selected that in this embodiment, the motherboard loading station and the radiator assembly station are also provided with an empty tray transfer mechanism 910, which can transfer the empty tray without carrying materials to the empty material box on the lifting mechanism 1600, so as to facilitate the lower layer of the double-layer AGV docking line to transport the empty material box and the empty tray loaded inside. Since the working time of the second manipulator 210 at the memory bar assembly station is shorter than that of the motherboard loading station and the radiator assembly station, the second manipulator 210 can be relied on to complete the transfer of the empty tray at the memory bar assembly station, and the second actuator on the second manipulator 210 is also correspondingly equipped with a tray picking mechanism 260 (such as a suction cup device) to complete the grasping of the tray.

[0088] In detail, the empty material tray transfer mechanism 910 is provided with a slide cylinder 341 to drive the single-axis manipulator 911 to move in the horizontal direction. The single-axis manipulator 911 is provided with a material taking part 912 and an opening and closing cylinder 913. The opening and closing cylinder 913 can drive the material taking part 912 to open and close to achieve the clamping of the empty material tray. The single-handed manipulator can make the material taking part 912 move up and down, thereby meeting the requirements of taking and placing the empty material tray. It should be noted that although the specific structure of the slide cylinder 341 mentioned in this embodiment is different, they are all an existing type of cylinder. The cylinder itself is not modified here, and those skilled in the art can select it according to their needs.

[0089] Please combine Figure 1 and Fig.14A rework station is also provided between the radiator assembly station and the finished product unloading station. The reflow jig line 500 is provided with a transfer device, and the rework station is provided with a rework conveyor line 700. The transfer device is used to transfer the motherboard to be reworked after the radiator assembly is completed to the rework conveyor line 700. The transfer device used in this embodiment is a synchronous belt 720, which can drive the jig 800 to move, so as to transfer the problematic products (NG products) detected by the scanner 710 from the reflow jig line 500 to the rework conveyor line 700. The rework conveyor line 700 can transfer the problematic products to the maintenance workbench 730 for maintenance. By setting up a rework station before unloading, it is possible to prevent unqualified products from flowing into the unloading station and eventually being transported together with other qualified products, thereby ensuring product quality and eliminating the hidden danger of unqualified products flowing into other production links or consumption links in the later stage.

[0090] In addition, it is understandable that corresponding correction workbenches 1700 can also be set up at the motherboard loading station and the radiator assembly station, so that when NG products (problematic raw materials) are detected in the raw materials, they can be taken to the correction workbench 1700 for repair in time, and only OK products (qualified raw materials) will continue to be used for assembly.

[0091] Of course, the corresponding control can be completed by a unified system, or, as in the present application, in addition to the main control system, a control box can be separately set up at workstations such as memory bar assembly workstations and heat sink assembly workstations where the operation steps are more complicated and diverse, so as to facilitate more precise control and feedback the working conditions to the main control system. These are relatively existing control methods and will not be described here.

[0092] The principle of this embodiment is:

[0093] The first robot 110 at the motherboard loading station can first place the base tray into the fixture 800 of the reflow fixture line 500, and then place the qualified motherboard with the correct front and back sides placed in the base tray. The reflow fixture line 500 moves the motherboard to the memory stick assembly station.

[0094] At the memory module assembly station, the dust removal device 250 first removes dust from the memory module slot of the motherboard, and then the second manipulator 210 grabs the memory module according to the correct front and back sides and installs it into the memory module slot of the motherboard, and presses back and forth to break the diaphragm of the memory module, thereby improving the contact performance between the motherboard and the memory module. Then the reflow fixture line 500 moves the motherboard to the heat sink assembly station.

[0095] At the radiator assembly station, the third robot 310 drives the qualified radiator to be placed into the radiator mounting portion of the mainboard in the correct direction, and then tightens the screws with the electric screwdriver 330 under the positioning action of the pressing device 340.

[0096] Then the reflow jig line 500 takes the motherboard through the rework station. If the scanner 710 finds that the product is qualified after scanning, it will continue to be transported to the finished product unloading station, and the unloading robot 610 will transfer the motherboard finished product 1000 into the material box and transport it away from the reflow jig line 500 through the finished product conveyor line 600. If the product is unqualified, it will be transferred by the transfer device of the reflow jig line 500 to the rework conveyor line 700 of the rework station, and then repaired.

[0097] The reflow jig line 500 is provided with a stopper 510, which is convenient for stopping the jig 800 at the corresponding station for assembly or loading and unloading. After the jig 800 completes the delivery of the motherboard finished product 1000, the empty jig 800 will continue to move with the reflow jig line 500 and Figure 2 The lifting device 520 shown is moved to the lower layer of the reflow fixture line 500, and then reflows to the mainboard loading station for cyclic loading. Among them, the reflow fixture line 500 and the lifting device 520 are also existing structures. This application only uses their functions without improving their structures, so they are not described in detail.

[0098] Due to various identification and positioning functions, assembly can be made more accurate and the error rate during manual operation can be reduced. This can also improve the yield rate to a certain extent and avoid the cost increase caused by unqualified products.

[0099] To summarize, the motherboard assembly line of the present application can connect various work links in series by relying on the reflow fixture line 500, and realize the assembly of the motherboard through automated loading of the motherboard, memory stick, and radiator, and assembly and unloading of the robot, thereby reducing manual labor intensity.

[0100] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A motherboard assembly line, characterized in that: include: A reflow jig line and a main board loading station, a memory bar assembly station, a heat sink assembly station and a finished product unloading station which are sequentially spaced from upstream to downstream of the reflow jig line; The following operations are completed by the robot: Delivering the mainboard from the mainboard conveying line of the mainboard loading station to the reflow fixture line; Delivering the memory stick from the memory stick conveying line of the memory stick assembly station and assembling the memory stick to the mainboard; Delivering the heat sink from the heat sink conveying line of the heat sink assembly station and assembling it to the mainboard; Delivering the assembled motherboard product from the reflow fixture line to the finished product conveying line of the finished product unloading station; The memory bar assembly station is provided with a second manipulator, the end of the second manipulator is connected to a second actuator, and the second actuator includes an opening mechanism and a memory bar clamping mechanism; The opening mechanism includes two opening claws, two guide grooves corresponding to the opening claws are provided on the base plate on which the opening mechanism is installed, a guide rod is provided on one side of the opening claw, and an opening cylinder is provided at one end of the opening head to which the opening claw is hinged, the opening cylinder drives the opening head to move, so as to drive the opening claw to move, and under the action of the guide rod and the guide groove, the two opening claws move away from each other to open the hippocampus head on the mainboard for clamping the memory stick, the memory stick clamping mechanism is used to grab the memory stick, and the second manipulator can drive the memory stick clamping mechanism to insert the memory stick into the memory stick slot on the mainboard after the opening mechanism opens the hippocampus head; After the second manipulator drives the memory stick to be inserted into the memory stick slot for the first time, the hippocampus head is automatically locked; the second manipulator presses again to unlock the hippocampus head and the memory stick pops out; after the second manipulator presses the memory stick for the third time, the memory stick is assembled to the motherboard, so that the diaphragm of the memory stick is destroyed through multiple press assemblies; The memory stick clamping mechanism has two clamping blocks and is driven by a bidirectional cylinder to open and close; the clamping blocks have clamping grooves to prevent the memory stick from shifting sideways when clamping the memory stick; A buffer structure is provided in the area between the two clamping blocks to prevent the memory bar from being damaged during the process of pressing down the memory bar.

2. The motherboard assembly line according to claim 1, characterized in that: The mainboard loading station also includes a base tray conveyor line, and the first robot first delivers the base tray from the base tray conveyor line to the fixture on the reflow fixture line, and then delivers the mainboard to the base tray located on the reflow fixture line.

3. The motherboard assembly line according to claim 2, characterized in that: The end of the first manipulator is connected to a first actuator, which includes a base transfer mechanism for picking up and placing a base and a mainboard clamping mechanism for picking up and placing a mainboard.

4. The motherboard assembly line according to claim 1, characterized in that: The memory bar assembly station also includes a memory bar front and back detection mechanism, and the second manipulator delivers the memory bar on the memory bar conveyor line to the memory bar front and back detection mechanism, and then delivers and assembles the tested memory bar to the mainboard.

5. The motherboard assembly line according to claim 1, characterized in that: The memory stick assembly station also includes a dust removal device, which is arranged next to the reflow fixture line and is used to remove dust from the memory stick slot on the motherboard.

6. The motherboard assembly line according to claim 1, characterized in that: The radiator assembly station is provided with a third manipulator, the end of the third manipulator is connected to a third actuator, and the third actuator includes a radiator clamping mechanism and a screw locking mechanism; The radiator clamping mechanism is used to clamp the radiator. After the third manipulator drives the radiator clamping mechanism to deliver the radiator to the radiator mounting portion of the mainboard, the screw locking mechanism fixes the radiator to the radiator mounting portion through screws.

7. The motherboard assembly line according to claim 6, characterized in that: The radiator assembly station is provided with a pressing device, which is arranged beside the reflow fixture line. When the screw locking mechanism is working, the pressing device pre-fixes the radiator to the radiator mounting part.

8. The motherboard assembly line according to claim 1, characterized in that: A rework station is also provided between the radiator assembly station and the finished product unloading station, the reflow fixture line is provided with a transfer device, and the rework station is provided with a rework conveyor line. The transfer device is used to transfer the motherboard to be reworked after the radiator assembly is completed to the rework conveyor line.

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