Dust-proof structure, microphone packaging structure, and electronic device

Abstract

The present invention discloses a dustproof structure, a microphone packaging structure and an electronic device, comprising: a carrier layer, a through hole formed in the middle of the carrier layer; a membrane layer, the membrane layer comprising a grid structure and a connecting portion arranged around the grid structure, the grid structure covers one end of the through hole, and the connecting portion is connected to the carrier layer; a warping compensation layer, the warping compensation layer is fixed on the side of the carrier layer away from the membrane layer, and the thermal expansion coefficient of the warping compensation layer is lower than the thermal expansion coefficient of the carrier layer. One technical effect of the present invention is that by providing a warping compensation layer with a lower thermal expansion coefficient than the carrier layer, the warping deformation of the dustproof structure during the installation process is effectively suppressed.

Description

Technical Field

[0001] The present invention relates to the technical field of MEMS microphones, and more specifically, to a dustproof structure, a microphone packaging structure and an electronic device. Background Art

[0002] The microphone is provided with a dustproof structure, which is a device that can prevent foreign objects such as powder and particles from entering and causing the microphone to produce erroneous reactions, and can allow sound waves to pass through.

[0003] The dustproof structure is composed of different materials, and the thermal expansion coefficients of different materials are different. During the installation process of the dustproof structure, the dustproof structure will warp during heat treatment. This makes the installation of the dustproof structure more difficult.

[0004] Therefore, a new technical solution is needed to solve the above problems. Summary of the invention

[0005] An object of the present invention is to provide a new technical solution for a dustproof structure, a microphone packaging structure and an electronic device.

[0006] According to a first aspect of the present invention, there is provided a dustproof structure, comprising:

[0007] A carrier layer, wherein a through hole is formed in the middle of the carrier layer;

[0008] A film body layer, the film body layer comprising a grid structure and a connecting portion arranged around the grid structure, the grid structure covers one end of the through hole, and the connecting portion is connected to the carrier layer;

[0009] The warpage compensation layer is fixed on a side of the carrier layer away from the film layer, and the thermal expansion coefficient of the warpage compensation layer is lower than the thermal expansion coefficient of the carrier layer.

[0010] Optionally, the film body layer is a metal material, the carrier layer is an organic material, and the thermal expansion coefficient of the warpage compensation layer is the same as the thermal expansion coefficient of the film body layer.

[0011] Optionally, the grid structure includes an elastic telescopic structure along the plane direction where the grid structure is located.

[0012] Optionally, the elastic coefficient of the grid structure is anisotropic.

[0013] Optionally, the opening ratios of various locations of the grid structure are different.

[0014] Optionally, a stress relief portion is provided at a position of the carrier layer fixed to the connecting portion.

[0015] Optionally, the material of the film layer is metallic glass.

[0016] Optionally, the material of the carrier layer is epoxy resin or PI.

[0017] Optionally, the warpage compensation layer is also fixed to a side surface of the carrier layer.

[0018] According to another aspect of the present invention, there is provided a microphone packaging structure, comprising any one of the above-mentioned dustproof structures, wherein the dustproof structure is fixed on the sound hole of the microphone packaging structure;

[0019] Alternatively, the dustproof structure covers the MEMS chip in the microphone packaging structure.

[0020] According to another aspect of the present invention, an electronic device is provided, comprising the microphone packaging structure described above.

[0021] According to an embodiment of the present disclosure, by providing a warping compensation layer having a thermal expansion coefficient lower than that of the carrier layer, warping deformation of the dustproof structure during the installation process is effectively suppressed.

[0022] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0024] Figure 1 It is a cross-sectional view of a dustproof structure according to an embodiment of the present invention.

[0025] Figure 2 It is a schematic diagram of the membrane layer structure of an embodiment of the present invention.

[0026] Figure 3 It is a schematic structural diagram of a warpage compensation layer fixed to the side of the carrier layer in one embodiment of the present invention.

[0027] Figure 4 It is a schematic diagram of a dustproof structure provided inside a sound hole on a substrate of a microphone packaging structure according to an embodiment of the present disclosure.

[0028] Figure 5 It is a schematic diagram of a dustproof structure provided at a MEMS chip on a microphone packaging structure substrate according to an embodiment of the present disclosure.

[0029] In the figure, 1 is a membrane layer, 11 is a connecting part, 12 is a grid structure, 2 is a carrier layer, 3 is a warping compensation layer, 4 is an acoustic hole, and 5 is a MEMS chip. DETAILED DESCRIPTION

[0030] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0031] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0032] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0033] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0034] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0035] According to one embodiment of the present disclosure, a dustproof structure is provided, such as Figure 1 ,2, the dustproof structure includes:

[0036] A carrier layer 2, wherein a through hole is formed in the middle of the carrier layer 2;

[0037] A film layer 1, wherein the film layer 1 comprises a grid structure 12 and a connecting portion 11 arranged around the grid structure 12, wherein the grid structure 12 covers one end of the through hole, and the connecting portion 11 is connected to the carrier layer 2;

[0038] The warpage compensation layer 3 is fixed at least on the side of the carrier layer 2 away from the film layer 1 , and the thermal expansion coefficient of the warpage compensation layer 3 is lower than the thermal expansion coefficient of the carrier layer 2 .

[0039] In this embodiment, the film layer 1 and the carrier layer 2 form the basic structure of the dustproof structure, and the warpage compensation layer 3 is fixed at the bottom of the carrier layer 2 . The thermal expansion coefficient (CTE) of the warpage compensation layer 3 is lower than that of the carrier layer 2 .

[0040] The grid structure 12 can prevent dust and other particles from passing through, and can allow sound waves to pass through. For example, the connection portion 11 is enclosed in the film layer 1 formed outside the grid structure 12, and the grid structure 12 as a whole can be a regular or irregular shape such as a rectangle, triangle, or ellipse.

[0041] During the installation of the dustproof structure, the carrier layer 2 and the film layer 1 may cause the overall structure to warp due to the heat treatment process during the installation process. However, the thermal expansion coefficient of the warping compensation layer 3 in this embodiment is lower than that of the carrier layer 2. When subjected to heat during the process, the deformation of the warping compensation layer 3 is smaller than that of the carrier layer 2. This can limit the occurrence of warping of the carrier layer 2 and effectively suppress the warping deformation of the dustproof structure itself.

[0042] For example, the warping compensation layer 3 is fixed together with the carrier layer 2 . When the carrier layer 2 is warped, the deformation of the warping compensation layer 3 is small, which limits the degree of warping of the carrier layer 2 .

[0043] In one embodiment, the film body layer 1 is made of metal material, the carrier layer 2 is made of organic material, and the thermal expansion coefficient of the warpage compensation layer 3 is the same as the thermal expansion coefficient of the film body layer 1 .

[0044] In this embodiment, the film layer 1 is a metal material, and the carrier layer 2 is an organic material. The thermal expansion coefficient of the metal material is lower than that of the organic material, and the difference is very large. During the installation of the dustproof structure, the heat treatment process will cause the carrier layer 2 to undergo a large deformation, and the deformation of the film layer 1 is small. The thermal expansion coefficient of the warping compensation layer 3 fixed at the bottom of the carrier layer 2 is the same as the thermal expansion coefficient of the film layer 1. For example, the warping compensation layer 3 can be a metal material or other material with the same thermal expansion coefficient as the film layer 1. Alternatively, the warping compensation layer 3 is a material close to the thermal expansion coefficient of the film layer 1. In this way, the warping compensation layer 3 will basically not warp and deform. The warping compensation layer 3 is fixed to the carrier layer 2, which can effectively limit the warping of the carrier layer 2 and reduce the deformation of the carrier layer 2. This can effectively prevent the dustproof structure from warping and ensure the reliability of the installation of the dustproof structure.

[0045] For example, the film layer 1 is a metal film, and the carrier layer 2 is an organic film. In such a dustproof structure, the thermal expansion coefficients of the carrier layer 2 and the film layer 1 are very different. In the process of installing the dustproof structure, the dustproof structure is affected by the heat generated during the heat treatment process, and the carrier layer 2 undergoes a large deformation, which may cause the dustproof structure to warp and be difficult to install. For example, the dustproof structure is fixed by thermal bonding during installation. By using a thermosetting adhesive to fix the dustproof structure, heat will affect the dustproof structure during the installation process. In the above example, a warping compensation layer 3 is fixed at the bottom of the carrier layer 2, and the material of the warping compensation layer 3 is the same as that of the film layer 1, so that the thermal expansion coefficient of the warping compensation layer 3 is lower than that of the carrier layer 2. In the process of being affected by heat, the warping compensation layer 3 basically does not deform, so that the deformation of the carrier layer 2 caused by heat can be suppressed. The dustproof structure is prevented from warping. This makes the installation process of the dustproof structure easier.

[0046] In an example, Figure 3 As shown, the warpage compensation layer 3 is also fixed to the side surfaces of the carrier layer 2 .

[0047] After the carrier layer 2 is affected by the heat of the heat treatment process, the carrier layer 2 will deform. The deformation of the carrier layer 2 occurs in the overall structure of the carrier layer 2. When the warp compensation layer 3 limits the deformation of the carrier layer 2 from the bottom of the carrier layer 2, the warp compensation layer 3 is also fixed on the side of the carrier layer 2. A structure is formed in which the warp compensation layer 3 covers the bottom and side of the carrier layer 2. In this way, the deformation of the carrier layer 2 can be limited to the greatest extent by the warp compensation layer 3, and the dustproof structure can be more effectively prevented from warping.

[0048] For example, during the installation of the dustproof structure, the heat of the heat treatment process affects the dustproof structure. The carrier layer 2 expands in volume and changes in shape due to the heat. Under the same heat influence, the change in volume of the warpage compensation layer 3 is negligible relative to the carrier layer 2. The warpage compensation layer 3 limits the expansion of the carrier layer 2 from the bottom and sides of the carrier layer 2 to prevent the deformation of the carrier layer 2 from being too large, so that the dustproof structure will not warp.

[0049] In one embodiment, the grid structure 12 includes an elastic telescopic structure along the plane where the grid structure 12 is located.

[0050] The grid structure 12 is a structure in the dustproof structure that is used to prevent foreign objects such as powder from entering the device and to allow sound waves to pass through. Foreign objects entering the device will cause the device to receive abnormal information and produce erroneous reactions or instructions. During the installation of the dustproof structure, if the dustproof structure is warped due to heat, the deformed dustproof structure may damage the structure of the grid structure 12. This will cause the dustproof structure to lose its own function.

[0051] In this example, the grid structure 12 is provided with an elastic telescopic structure, which is arranged along the plane direction of the grid structure 12. The grid structure 12 is located in the film layer 1, or the elastic telescopic structure is arranged along the plane direction of the film layer 1, and the elastic telescopic structure can be elastically telescopic in this direction.

[0052] For example, an elastic telescopic structure is provided in the grid structure 12, or the grid structure 12 is an elastic telescopic structure. For example, the elastic telescopic structure is provided as a mesh structure. In this way, the grid structure 12 can prevent foreign matter such as dust and powder from entering, and sound waves can pass through, and the grid structure 12 can also achieve elastic telescopicity.

[0053] During the installation of the dustproof structure, during the heat treatment installation process, the warping deformation of the dustproof structure caused by the heat will squeeze the grid structure 12, and the grid structure 12 will be deformed. In the case where the grid structure 12 can achieve elastic expansion and contraction, when the grid structure 12 is squeezed, the elastic expansion and contraction structure 12 contracts, or when the grid structure 12 is stretched, the elastic expansion and contraction structure is stretched. Because the grid structure 12 has the ability to expand and contract, the grid structure 12 will not be damaged during the extrusion or stretching process. It can also return to its original state due to its own expansion and contraction ability.

[0054] In addition, during the warping of the dustproof structure, wrinkles may also be generated in the grid structure 12 due to stress. After the elastic telescopic structure is provided in this example, wrinkles in the grid structure 12 can be effectively avoided.

[0055] For example, after being subjected to force, the grid structure 12 forms wrinkles. Under the action of the elastic telescopic structure, the grid structure 12 restores its original structure and does not wrinkle.

[0056] In one example, the elastic coefficient of the grid structure 12 is anisotropic.

[0057] Anisotropy refers to the different material properties in different directions of the material. For example, the physical properties of the grid structure 12 itself are different along different directions of the grid structure 12. The elasticity of the grid structure 12 in the direction along the plane where the film layer 1 is located can be set by setting the elastic coefficient of the grid structure 12. The elastic coefficient of the grid structure 12 in the direction perpendicular to the plane where the film layer 1 is located can also be set.

[0058] For example, when the dustproof structure is warped, the film layer 1 will be deformed by compression or tension. During the deformation process, different deformations will occur in different directions of the grid structure 12. In this example, by setting the elastic coefficients in different directions through the anisotropy of the grid structure 12, the grid structure 12 can adapt to deformations of different degrees in different directions. This can effectively prevent the grid structure 12 from being irreversibly deformed due to compression and tension. Or during the compression and tension process, the rigidity of the grid structure 12 is too large, causing the deformation to destroy structures other than the grid structure 12. Ensure that the dustproof structure will not be damaged during the warping process.

[0059] In addition, during the warping of the dustproof structure, wrinkles will also be generated in the grid structure 12 due to stress. The anisotropy of the grid structure 12 adapts to deformations at various locations. And by setting the elastic coefficient of the grid structure 12 in the vertical direction, the vertical displacement caused by the deformation of the dustproof structure during the stress process can also be suppressed.

[0060] In one embodiment, the opening ratios of various locations of the grid structure 12 are different.

[0061] The grid structure 12 is set to a grid structure that can prevent foreign matter such as dust from entering, and sound waves can pass through. For example, the grid structure 12 is a grid structure that can allow sound waves to pass through. Meshes of different sizes on the grid structure have different effects on the passage of sound waves. Smaller meshes will form greater viscous resistance to the passing sound waves. Larger meshes will not prevent foreign matter such as dust from entering.

[0062] Therefore, the dustproof structure can be optimized by adjusting the opening ratio of each part of the mesh structure 12 to a set level. For example, the opening ratio can be adjusted to adjust the air viscosity resistance, thereby adjusting the frequency characteristics of the MEMS microcomputer where the dustproof structure is located.

[0063] In one embodiment, a stress relief portion is provided at a position of the carrier layer 2 fixed to the connecting portion 11 .

[0064] During the warping process of the dustproof structure, the lower part warps more. The stress generated by the warping deformation is the largest in the carrier layer 2, and the stress transmitted from the carrier layer 2 to the film layer 1 is the largest.

[0065] In this example, a stress relief portion is provided at a position of the carrier layer 2 fixed to the connection portion 11. The stress relief portion can control the stress transmitted to the film layer 1 to be maintained at a certain level and reduce it over time. In this way, the stress acting on the grid structure 12 is reduced, and wrinkles of the grid structure 12 caused by stress are avoided.

[0066] In one example, the material of the film layer 1 is metallic glass.

[0067] The membrane layer 1 is the uppermost structure of the dustproof structure, and is most susceptible to external forces during the installation or use of the dustproof structure, such as extrusion from other components or extrusion of the dustproof structure during installation.

[0068] In this example, the material of the film layer 1 is set to metallic glass. This can enhance the mechanical strength of the dustproof structure and enhance its ability to withstand external forces. In addition, during the warping of the dustproof structure, the film layer 1 with greater structural strength can suppress the warping and reduce deformation. This can further protect the structure of the dustproof structure from being easily damaged.

[0069] In one example, the material of the carrier layer 2 is epoxy resin or PI. Epoxy resin is a thermosetting plastic. PI is a polyimide, which has a stable molecular main chain structure, good heat resistance, radiation resistance and good mechanical properties. It is beneficial to improve the structural strength and thermal deformation resistance of the dustproof structure.

[0070] During the installation of the dustproof structure, a heat treatment process can be selected for fixing. The carrier layer 2 is set to an epoxy resin material, and the carrier layer 2 itself can be bonded and fixed to the fixed position through heat treatment, without using other adhesives for fixing. Similarly, the carrier layer 2 and the membrane layer 1 can also be fixed without using other adhesives. This can reduce the thickness of the dustproof structure after fixing, which helps to thin the overall structure.

[0071] According to one embodiment of the present invention, there is provided a microphone packaging structure, the microphone packaging structure comprising the above-mentioned dustproof structure, wherein the dustproof structure is fixed on the sound hole 4 of the microphone packaging structure;

[0072] Alternatively, the dustproof structure covers the MEMS chip 5 in the microphone packaging structure.

[0073] Generally, the microphone packaging structure includes a shell forming a receiving cavity and a substrate fixed to the shell. The sound hole 4 can be arranged on the substrate or on the shell.

[0074] In this embodiment, the dustproof structure may be fixed on the sound hole 4 from the outside of the microphone packaging structure, thereby protecting the components in the microphone packaging structure from the outside.

[0075] It can also be, Figure 4 As shown, the dustproof structure is fixed on the sound hole 4 from the inside of the microphone packaging structure, thereby protecting the components of the microphone packaging structure from the inside.

[0076] It can also be, Figure 5 As shown, the dustproof structure is fixed on the substrate to protect the sound hole 31 and the interior of the microphone packaging structure. The MEMS chip 5 is fixed by the dustproof structure.

[0077] Alternatively, the dustproof structure may be fixed inside the microphone packaging structure and cover the MEMS chip 5. This can protect the MEMS chip 5. In this structure, the dustproof structure may be fixed on the substrate where the MEMS chip 5 is located to form a cover. Alternatively, the dustproof structure may be fixed on the substrate of the MEMS chip 5 to form a cover. All of the above structures can protect the MEMS chip 5.

[0078] The microphone packaging structure can effectively prevent the dustproof structure from being damaged by heat during the installation and use of the microphone, and can also protect the components in the microphone, for example, protecting the MEMS chip 5 from being contaminated by external dust and other pollutants.

[0079] According to one embodiment of the present invention, an electronic device is provided, comprising the above-mentioned microphone packaging structure.

[0080] The electronic device includes the microphone packaging structure and has all the advantages of the microphone packaging structure. For example, the electronic device can be an audio device, a mobile phone, a computer, and other products.

[0081] Although some specific embodiments of the present invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A dustproof structure, characterized in that: include: A carrier layer, wherein a through hole is formed in the middle of the carrier layer; A film body layer, the film body layer comprising a grid structure and a connecting portion arranged around the grid structure, the grid structure covers one end of the through hole, and the connecting portion is connected to the carrier layer; A warp compensation layer, wherein the warp compensation layer is fixed on a side of the carrier layer away from the film layer, and the side of the carrier layer is also fixed with the warp compensation layer, and the thermal expansion coefficient of the warp compensation layer is lower than the thermal expansion coefficient of the carrier layer; The film body layer is made of metal material, the carrier layer is made of organic material, and the thermal expansion coefficient of the warpage compensation layer is the same as the thermal expansion coefficient of the film body layer.

2. The dustproof structure according to claim 1, characterized in that: The grid structure includes an elastic telescopic structure along the plane direction where the grid structure is located.

3. The dustproof structure according to claim 2, characterized in that: The elastic coefficient of the grid structure is anisotropic.

4. The dustproof structure according to claim 1, characterized in that: The opening ratios of various locations of the grid structure are different.

5. The dustproof structure according to claim 1, characterized in that: A stress relief portion is provided at a position of the carrier layer fixed to the connection portion.

6. The dustproof structure according to claim 1, characterized in that: The material of the film layer is metallic glass.

7. The dustproof structure according to claim 1, characterized in that: The material of the carrier layer is epoxy resin or PI.

8. A microphone packaging structure, characterized in that: The dustproof structure comprises the dustproof structure according to any one of claims 1 to 7, wherein the dustproof structure is fixed on the sound hole of the microphone packaging structure; Alternatively, the dustproof structure covers the MEMS chip in the microphone packaging structure.

9. An electronic device, characterized in that: Including the microphone packaging structure as described in claim 8.

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