Electronic atomization device, atomization core and preparation method thereof

Abstract

The present invention discloses an electronic atomization device, an atomization core and a preparation method thereof. The atomization core includes a porous ceramic substrate, a ceramic covering layer and a heating film, the ceramic covering layer is bonded to the surface of the porous ceramic substrate, the heating film is bonded to the surface of the ceramic covering layer away from the porous ceramic substrate, the porosity of the ceramic covering layer is lower than the porosity of the porous ceramic substrate, and a plurality of through holes are formed on the ceramic covering layer. By bonding a ceramic covering layer with a porosity lower than that of the porous ceramic substrate to the surface of the porous ceramic substrate close to the heating element, since the ceramic covering layer with a lower porosity has a higher density and does not have a powder falling phenomenon, the atomization core can be prevented from powder falling; moreover, since the ceramic covering layer with a lower porosity can isolate the precipitation of heavy metals inside the porous ceramic substrate, it can prevent the heavy metals from being brought into the airflow during suction, thereby improving the safety performance of the electronic atomization device.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic cigarettes, and in particular to an electronic atomization device, an atomization core and a preparation method thereof. Background Art

[0002] Electronic cigarettes have a similar appearance and taste to cigarettes, but generally do not contain tar, suspended particles and other harmful ingredients in cigarettes, which greatly reduces the harm to the user's body. Therefore, they are mostly used as a substitute for cigarettes to help people quit smoking. The safety of electronic cigarettes is the primary consideration.

[0003] At present, during the puffing process, the atomizer core of the electronic cigarette will inevitably be at risk of powder falling due to repeated thermal cycles and erosion by the e-liquid; in addition, the heavy metals inside the atomizer core and the heavy metals in the heating film in a high-temperature environment will be brought into the airflow during puffing, all of which will pose a safety hazard to the user's health. Summary of the invention

[0004] The present invention provides an electronic atomization device, an atomization core and a preparation method thereof, so as to solve the technical problems of powder loss and heavy metal absorption of the atomization core in the prior art.

[0005] In order to solve the above technical problems, a technical solution adopted by the present invention is: to provide an atomization core of an electronic atomization device, comprising: a porous ceramic substrate, a ceramic covering layer and a heating film, the ceramic covering layer is bonded to the surface of the porous ceramic substrate, the heating film is bonded to the surface of the ceramic covering layer away from the porous ceramic substrate, the porosity of the ceramic covering layer is lower than the porosity of the porous ceramic substrate, and a plurality of through holes are formed on the ceramic covering layer.

[0006] Optionally, the porosity of the porous ceramic substrate is 40%-80%; and / or the average pore size of the micropores on the porous ceramic substrate is 10μm-40μm; and / or the material used to form the porous ceramic substrate is zirconium oxide, silicon oxide, aluminum oxide or mullite; and / or the thickness of the porous ceramic substrate is 1-4mm.

[0007] Optionally, the porosity of the ceramic covering layer is 10%-20%; and / or the material used to form the ceramic covering layer is zirconium oxide, silicon oxide, aluminum oxide, silicon carbide or mullite; and / or the thickness of the ceramic covering layer is 0.05-0.2 mm; and / or the powder particle size of the material used to form the ceramic covering layer is 0.1-5 μm.

[0008] Optionally, a diameter of each of the holes is 5-50 μm.

[0009] Optionally, the ratio of the sum of the opening areas of the plurality of holes to the area of ​​the cross section of the ceramic covering layer perpendicular to the extension direction of the holes is 5%-15%.

[0010] Optionally, the heating film is made of metal or alloy; and / or the heating film has a thickness of 2-10 μm.

[0011] To solve the above technical problems, another technical solution adopted by the present invention is: to provide a method for preparing an atomization core of an electronic atomization device, the preparation method comprising: preparing a porous ceramic substrate; preparing a ceramic covering layer, and forming a plurality of holes penetrating the ceramic covering layer on the ceramic covering layer, wherein the porosity of the ceramic covering layer is lower than the porosity of the porous ceramic substrate; stacking the porous ceramic substrate and the ceramic covering layer and combining them into an integral structure; and forming a heating film on the surface of the ceramic covering layer away from the porous ceramic substrate.

[0012] Optionally, the step of preparing the porous ceramic substrate comprises: preparing a first casting slurry from raw materials for forming the porous ceramic substrate; and preparing the porous ceramic substrate by a casting process, wherein the porous ceramic substrate has a thickness of 1-4 mm.

[0013] Optionally, the step of preparing the ceramic covering layer includes: preparing a second casting slurry from raw materials for forming the ceramic covering layer, the powder particle size of the material for forming the ceramic covering layer is 0.1-5 μm; forming the ceramic covering layer by a casting process or a dry pressing process, the thickness of the ceramic covering layer is 0.05-0.2 mm.

[0014] Optionally, the step of stacking the porous ceramic substrate and the ceramic covering layer and combining them into an integrated structure includes: connecting the porous ceramic substrate and the ceramic covering layer by bonding or sintering.

[0015] Optionally, the step of forming a heating film on the surface of the ceramic covering layer away from the porous ceramic substrate includes: forming the heating film on the surface of the ceramic covering layer away from the porous ceramic substrate by PVD, CVD, electroplating, electrodeposition, ion plating or spraying, and the thickness of the heating film is 2-10μm.

[0016] In order to solve the above technical problems, another technical solution adopted by the present invention is: to provide an electronic atomization device, which includes a liquid storage chamber for storing smoke liquid and an atomization core as described above, and the smoke liquid in the liquid storage chamber can be transferred to the ceramic covering layer through the porous ceramic substrate.

[0017] The beneficial effects of the present invention are as follows: different from the prior art, the embodiment of the present invention combines a ceramic covering layer with a porosity lower than that of the porous ceramic substrate on the surface of the porous ceramic substrate close to the heating element. Since the ceramic covering layer with a lower porosity has a higher density and does not fall off, it can prevent the atomization core from falling off. Moreover, since the ceramic covering layer with a lower porosity can isolate the precipitation of heavy metals inside the porous ceramic substrate, it can prevent heavy metals from being brought into the airflow during inhalation, thereby improving the safety performance of the electronic atomization device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0019] Figure 1 is a schematic cross-sectional structural diagram of an atomizer core in one embodiment of the present invention;

[0020] Figure 2 yes Figure 1 A schematic diagram of the cross-sectional structure of the atomizer core taken along direction II;

[0021] Figure 3 is a partially enlarged schematic diagram of the cross-sectional structure of the atomizer core in another embodiment of the present invention;

[0022] Figure 4 It is a schematic diagram of a process for preparing an atomizer core in one embodiment of the present invention;

[0023] Figure 5 is with Figure 4 Schematic diagram of the processing process corresponding to the production process in;

[0024] Figure 6 yes Figure 4 A schematic flow chart of step S105 in FIG.

[0025] Figure 7 is a schematic flow chart of a method for preparing an atomizer core in another embodiment of the present invention;

[0026] Figure 8 is with Figure 7 Schematic diagram of the processing process corresponding to the production process in . DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] See also Figure 1 , Figure 1 Schematic diagram of the cross-sectional structure of an atomizer core in one embodiment of the present invention. The present invention provides an atomizer core 100 of an electronic atomization device, the atomizer core 100 comprising a porous ceramic substrate 10, a ceramic covering layer 20 and a heating film 30. The ceramic covering layer 20 is bonded to the surface of the porous ceramic substrate 10, the heating film 30 is bonded to the surface of the ceramic covering layer 20 away from the porous ceramic substrate 10, the porosity of the ceramic covering layer 20 is lower than the porosity of the porous ceramic substrate 10, and a plurality of through holes 21 are formed on the ceramic covering layer 20.

[0029] The porosity refers to the ratio of the total volume of the micro-voids in the porous medium to the total volume of the porous medium. The ceramic covering layer 20 is bonded to the surface of the porous ceramic substrate 10, specifically, the ceramic covering layer 20 is bonded to the surface of the porous ceramic substrate 10 close to the heating element, so as to prevent the porous ceramic substrate 10 from directly contacting the heating element. Figure 1 As shown, in this embodiment, the ceramic cover layer 20 is bonded to the upper surface of the porous ceramic substrate 10 .

[0030] The embodiment of the present invention combines a ceramic covering layer 20 with a porosity lower than that of the porous ceramic substrate 10 on the surface of the porous ceramic substrate 10 close to the heating element. Since the ceramic covering layer 20 with a lower porosity has a higher density and does not fall off, the atomizer core 100 can be prevented from falling off. Moreover, since the ceramic covering layer 20 with a lower porosity can isolate the precipitation of heavy metals inside the porous ceramic substrate 10, it can prevent heavy metals from being brought into the airflow during inhalation, thereby improving the safety performance of the electronic atomization device.

[0031] Optionally, the material used to form the porous ceramic substrate 10 may be zirconium oxide, silicon oxide, aluminum oxide or mullite, etc., and the material used to form the ceramic covering layer 20 may be zirconium oxide, silicon oxide, aluminum oxide, silicon carbide or mullite, etc. The material of the porous ceramic substrate 10 may be the same as or different from the material of the ceramic covering layer 20, and the embodiment of the present invention does not limit the types of the material of the porous ceramic substrate 10 and the material of the ceramic covering layer 20.

[0032] Optionally, the porosity of the porous ceramic substrate 10 may be 40%-80%. The porosity may be adjusted according to the composition of the smoke liquid. For example, when the viscosity of the smoke liquid is high, a higher porosity is selected to ensure the liquid guiding effect.

[0033] In this embodiment, the porosity of the porous ceramic substrate 10 is 50-60%. By controlling the porosity of the porous ceramic substrate 10 to 50-60%, on the one hand, the porous ceramic substrate 10 can be guaranteed to have a good liquid conduction efficiency, and the phenomenon of dry burning due to poor liquid flow can be prevented, so as to improve the atomization effect. On the other hand, it can prevent the porous ceramic substrate 10 from conducting liquid too quickly, making it difficult to lock liquid, resulting in a greatly increased probability of leakage.

[0034] Optionally, the average pore size of the micropores on the porous ceramic substrate 10 is 10 μm-40 μm, for example, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm or 40 μm, etc., which is not specifically limited in the embodiment of the present invention.

[0035] The above optional embodiments can make the porous ceramic substrate 10 conduct liquid uniformly and achieve better atomization effect by setting the pore size of the micropores to be appropriately sized and evenly distributed.

[0036] Optionally, the thickness of the porous ceramic substrate 10 is 1-4 mm. The thickness of the porous ceramic substrate 10 refers to the length of the porous ceramic substrate 10 along the stacking direction of the porous ceramic substrate 10 and the ceramic covering layer 20. In this embodiment, the stacking direction of the porous ceramic substrate 10 and the ceramic covering layer 20 is Figure 1 In the X direction shown in FIG, the thickness H of the porous ceramic substrate 10 in the X direction is 1-4 mm. By setting the porous ceramic substrate 10 with an appropriate thickness, the liquid guide path can be shortened to make the liquid flow smoothly; on the other hand, dry burning can also be avoided.

[0037] Optionally, the thickness H of the porous ceramic substrate 10 in the X direction may be 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm, 3.5 mm or 4 mm, etc., which is not specifically limited in the embodiment of the present invention.

[0038] Optionally, the porosity of the ceramic covering layer 20 is 10%-20%. In the same atomizer core 100, the porosity of the ceramic covering layer 20 is lower than the porosity of the porous ceramic substrate 10, thereby forming a dense ceramic covering layer 20 on the surface of the porous ceramic substrate 10. In one embodiment, the porosity of the ceramic covering layer 20 may be 10-18%, 10-16%, 10-14%, 10-12%, 12-18%, 12-16%, 12-14%, 14-16%, 14-18% or 16-18%, etc. In another embodiment, the porosity of the porous ceramic substrate 10 is 50-60%, and the porosity of the ceramic covering layer 20 is 14-16%.

[0039] Optionally, the thickness of the ceramic covering layer 20 is 0.05-0.2 mm. The thickness of the ceramic covering layer 20 refers to the length of the ceramic covering layer 20 along the stacking direction of the porous ceramic substrate 10 and the ceramic covering layer 20. In this embodiment, the stacking direction of the porous ceramic substrate 10 and the ceramic covering layer 20 is Figure 1 In the X direction shown in FIG, the thickness R of the ceramic covering layer 20 in the X direction is 0.05-0.2 mm. For example, the thickness R of the ceramic covering layer 20 in the X direction may be 0.05 mm, 0.07 mm, 0.09 mm, 0.11 mm, 0.13 mm, 0.15 mm, 0.17 mm or 0.2 mm, etc., which is not specifically limited in the embodiment of the present invention.

[0040] Optionally, the powder particle size of the material used to form the ceramic cover layer 20 is 0.1-5 μm. The powder particle size is also called the particle size, which refers to the dimension of the space occupied by the particle. For a spherical particle, the powder particle size is a single parameter: diameter D. For an irregularly shaped particle, the powder particle size can be expressed by the projected height H (arbitrary), the maximum length M, the horizontal width W, the diameter of a sphere of equal volume, or the diameter D of a sphere with equal surface area.

[0041] Optionally, the powder particle size of the material used to form the ceramic covering layer 20 may be 0.1 μm, 0.5 μm, 1 μm, 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm or 4 μm, etc., which is not specifically limited in the embodiment of the present invention.

[0042] The above optional embodiments can make the ceramic covering layer 20 effectively isolate the absorption of heavy metals by providing a ceramic covering layer 20 with a suitable thickness, micropores of suitable size and uniform distribution, and raw materials with a small powder particle size.

[0043] Furthermore, if Figure 1 and Figure 2 As shown, Figure 2 yes Figure 1Schematic diagram of the cross-sectional structure of the atomizer core after being cut along the II direction. The diameter of each hole 21 formed on the ceramic covering layer 20 is 5-50μm. For example, the diameter of the hole 21 can be 5μm, 10μm, 15μm, 20μm, 25μm, 30μm, 35μm, 40μm, 45μm or 50μm, etc., which is not specifically limited in the embodiment of the present invention. It should be noted that the holes 21 on the ceramic covering layer 20 do not belong to the tiny gaps in the porous medium, and the presence of the holes 21 does not affect the porosity of the ceramic covering layer 20; in other words, the porosity of the ceramic covering layer 20 is not related to the multiple holes 21 formed on the ceramic covering layer 20.

[0044] Specifically, a plurality of holes 21 are formed on the ceramic cover layer 20, and each hole 21 penetrates the ceramic cover layer 20 along the stacking direction of the porous ceramic substrate 10 and the ceramic cover layer 20. By forming a plurality of penetrating holes 21 on the ceramic cover layer 20, the ceramic cover layer 20 can be easily liquid-conducting.

[0045] Optionally, the diameters of the plurality of holes 21 formed on the same ceramic covering layer 20 may be equal or unequal, which is not specifically limited in the embodiment of the present invention.

[0046] Among them, in this embodiment, if Figure 2 As shown, a plurality of holes 21 are arranged in an array on the ceramic cover layer 20. In another embodiment, the plurality of holes 21 may also be distributed in a ring shape, and the embodiment of the present invention does not specifically limit the arrangement of the plurality of holes 21.

[0047] Optionally, in this embodiment, the hole 21 formed on the ceramic cover layer 20 is a circular hole. In other embodiments, the shape of the hole 21 can also be a rectangle, an ellipse, a triangle, a diamond, a regular or irregular polygonal hole, etc., which is not specifically limited in the embodiment of the present invention.

[0048] Further, the ratio of the sum of the opening areas of the plurality of holes 21 to the cross-sectional area of ​​the ceramic cover layer 20 perpendicular to the extension direction of the holes 21 is 5%-15%. For example, the ratio of the sum of the opening areas of the plurality of holes 21 to the cross-sectional area of ​​the ceramic cover layer 20 perpendicular to the extension direction of the holes 21 may be 5-12%, 5-10%, 5-8%, 7-12%, 7-10%, 9-12%, 10-12%, 7-15%, 9-15%, 12-15% or 14-15%, etc., which is not specifically limited in the embodiment of the present invention.

[0049] Specifically, in this embodiment, Figure 1As shown in FIG. 1 , the extension direction of the hole 21 is the axial direction of the circular hole, and the axial direction of the circular hole is parallel to the X direction. Therefore, the cross section of the ceramic covering layer 20 perpendicular to the extension direction of the hole 21 refers to the cross section of the ceramic covering layer 20 perpendicular to the X direction, that is, Figure 2 The sum of the opening areas of the plurality of holes 21 refers to the area of ​​the blank area shown in the figure, and the ratio of the sum of the opening areas of the plurality of holes 21 to the area of ​​the cross section of the ceramic covering layer 20 perpendicular to the extension direction of the holes 21 refers to, Figure 2 The ratio of the blank area in the image to the area of ​​the entire cross section.

[0050] Furthermore, if Figure 1 As shown, the heating film 30 is combined with the surface of the ceramic cover layer 20 away from the porous ceramic substrate 10. The heating film 30 is used to be electrically connected to the electrode and to generate heat to atomize the tobacco liquid.

[0051] Optionally, the thickness of the heating film 30 may be 2-10 μm. The thickness of the heating film 30 refers to the length of the heating film 30 along the stacking direction of the porous ceramic substrate 10 and the ceramic cover layer 20. Figure 1 As shown, the thickness of the heating film 30 is L, wherein the thickness L can be 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 9.5 μm or 10 μm, etc., which is not specifically limited in the embodiment of the present invention.

[0052] Alternatively, if Figure 3 As shown, Figure 3 : This is a partially enlarged schematic diagram of the cross-sectional structure of the atomizer core in another embodiment of the present invention. The heating film 30 may include a first covering film 32 and a second covering film 34. The first covering film 32 is stacked on the surface of the ceramic covering layer 20 away from the porous ceramic substrate 10, and the second covering film 34 is stacked on the surface of the first covering film 32 away from the ceramic covering layer 20.

[0053] The first covering film 32 may be a metal or an alloy. In order to improve the bonding strength between the first covering film 32 and the porous ceramic substrate 10, the material of the first covering film 32 may be selected to have a relatively stable bonding with the porous ceramic substrate 10. For example, the first covering film 32 may be titanium, zirconium, titanium-aluminum alloy, titanium-zirconium alloy, titanium-molybdenum alloy, titanium-niobium alloy, iron-aluminum alloy, or tantalum-aluminum alloy.

[0054] The titanium-zirconium alloy membrane made of titanium-zirconium alloy is itself a locally dense membrane, but because the porous ceramic substrate 10 itself is a porous structure, the titanium-zirconium alloy membrane formed on the surface of the porous ceramic substrate 10 also becomes a porous continuous structure, and the pore size distribution of the titanium-zirconium alloy membrane is slightly smaller than the micropore size on the surface of the porous ceramic substrate 10.

[0055] Furthermore, since the titanium zirconium in the titanium zirconium alloy film has poor stability in the air at high temperatures, zirconium easily absorbs hydrogen, nitrogen, and oxygen, and the zirconium-titanium alloy has a stronger gas absorption property, when the electrode is subsequently prepared, due to the gas absorption property of the titanium zirconium alloy, a violent oxidation reaction will occur during high-temperature sintering (above 300°C), causing a sudden change in the resistance of the first covering film 32. In order to prevent the first covering film 32 from contacting the air, a protective layer needs to be formed on the surface of the first covering film 32. The second covering film 34 can serve as a protective layer.

[0056] The second covering film 34 may also be a metal or alloy. In order to prevent the first covering film 32 from contacting with air and causing an oxidation reaction to cause a sudden change in resistance, the second covering film 34 should be made of a material with strong anti-oxidation performance. For example, the second covering film 34 may be platinum, palladium, palladium-copper alloy, gold-silver-platinum alloy, gold-silver alloy, palladium-silver alloy, gold-platinum alloy, etc.

[0057] Since the protective layer formed by silver and platinum is relatively loose and poor in density, it is difficult to completely isolate the air. Although gold can well protect the titanium-zirconium alloy film, on the one hand, since the formation of a dense protective layer requires a thickness of about 100nm or more, it will greatly reduce the resistance of the entire heating element, and the cost is also very high. Therefore, this embodiment uses a gold-silver alloy to retain the density of the gold protective layer and reduce the cost. Moreover, after alloying in a certain ratio, the resistivity of the gold-silver alloy increases tenfold, which is more conducive to controlling the resistance value of the entire heating element.

[0058] Furthermore, the present invention also provides a method for preparing an atomizer core of an electronic atomizer device, which can be used to prepare the atomizer core 100 in the above embodiment. Figure 4 and Figure 5 As shown, Figure 4 is a schematic diagram of a process for preparing an atomizer core in one embodiment of the present invention. Figure 5 is with Figure 4 The manufacturing method of the atomizer core 100 includes the following steps:

[0059] Step S101: preparing a porous ceramic substrate 10 .

[0060] First, the raw materials for forming the porous ceramic substrate 10 are made into a first casting slurry, wherein the raw materials for forming the porous ceramic substrate 10 can be zirconium oxide, silicon oxide, aluminum oxide or mullite, etc., and at least one of the above raw materials is mixed to form the first casting slurry.

[0061] Then, the first casting slurry is cast through a casting process to form a porous ceramic substrate 10. In addition, the thickness of the porous ceramic substrate 10 can be 1-4 mm by controlling the casting time.

[0062] Step S102 : preparing a ceramic covering layer 20 , and forming a plurality of holes penetrating the ceramic covering layer 20 , wherein the porosity of the ceramic covering layer 20 is lower than the porosity of the porous ceramic substrate 10 .

[0063] First, the raw materials for forming the ceramic covering layer 20 are made into a second casting slurry. The material for forming the ceramic covering layer 20 can be zirconium oxide, silicon oxide, aluminum oxide, silicon carbide or mullite, and the powder particle size of the material for forming the ceramic covering layer 20 is 0.1-5 μm. At least one of the above raw materials is mixed to form the second casting slurry.

[0064] Then, in one embodiment, the second casting slurry can be cast through a casting process to form a ceramic cover layer 20. In addition, the casting time can be controlled so that the thickness of the ceramic cover layer 20 is 0.05-0.2 mm.

[0065] Alternatively, in another embodiment, the second casting slurry may be pressed to form the ceramic covering layer 20 by a dry pressing process, which is not specifically limited in the embodiment of the present invention.

[0066] After the ceramic covering layer 20 is manufactured, it is necessary to form a plurality of holes penetrating the ceramic covering layer 20 on the ceramic covering layer 20. The diameter of each hole 21 is 5-50 μm, and the sum of the areas of the plurality of holes 21 accounts for 5%-15% of the area of ​​the cross section of the ceramic covering layer 20 perpendicular to the extension direction of the holes 21.

[0067] Specifically, a plurality of holes 21 penetrating the ceramic covering layer 20 may be formed directly on the ceramic covering layer 20 by laser drilling, CNC (Computerized Numerical Control) precision drilling, selective etching, etc. By directly forming through holes penetrating the ceramic covering layer 20 on the ceramic covering layer 20, the drilling method is simple, and the depth consistency of the holes 21 on the atomizer core 100 after forming is high.

[0068] Optionally, the diameters of the plurality of holes 21 formed on the same ceramic cover layer 20 may be equal or different. The shape of the hole 21 formed on the ceramic cover layer 20 may be circular, rectangular, elliptical, triangular, diamond, regular or irregular polygonal hole, etc., which is not specifically limited in the embodiment of the present invention.

[0069] In the above embodiment, the porous ceramic substrate 10 is prepared first, and then the ceramic covering layer 20 is prepared. It can be understood that in another embodiment, the ceramic covering layer 20 can also be prepared first, and then the porous ceramic substrate 10 is prepared. Alternatively, in another embodiment, the ceramic covering layer 20 and the porous ceramic substrate 10 can also be prepared at the same time, and the embodiment of the present invention is not specifically limited.

[0070] After performing step S101 and step S102 to obtain the porous ceramic substrate 10 and the ceramic covering layer 20, the following steps are then performed:

[0071] Step S103: stacking the porous ceramic substrate 10 and the ceramic covering layer 20 and combining them into an integrated structure.

[0072] Specifically, in one embodiment, the ceramic covering layer 20 may be stacked on one side of the porous ceramic substrate 10 , and the ceramic covering layer 20 and the porous ceramic substrate 10 may be connected and fixed by bonding.

[0073] In this embodiment, the ceramic covering layer 20 may be stacked on one side of the porous ceramic substrate 10 , and the porous ceramic substrate 10 and the ceramic covering layer 20 may be connected by sintering.

[0074] Sintering refers to the mutual bonding of solid particles of ceramic green body at high temperature (not higher than melting point), grain growth, gradual reduction of voids (pores) and grain boundaries, and the shrinkage of total volume and increase of density through the transfer of substances, and finally becoming a dense polycrystalline sintered body with a certain microstructure. In this embodiment, the ceramic covering layer 20 and the porous ceramic substrate 10 are connected by sintering. Since no harmful substances are produced, the safety performance of the atomizer core 100 can be improved.

[0075] Please continue reading Figure 4 and Figure 5 In this embodiment, after executing step S103 to obtain the porous ceramic substrate 10 and the ceramic covering layer 20 of an integrated structure, the method further includes:

[0076] Step S104 : forming a heating film 30 on a surface of the ceramic cover layer 20 away from the porous ceramic substrate 10 .

[0077] Among them, the thickness of the heating film is 2-10μm. Optionally, the heating film 30 can be formed on the ceramic covering layer 20 by physical vapor deposition, electroplating, electrodeposition, ion plating, spraying, chemical vapor deposition, etc. Through the above methods, a heating film 30 with a thin thickness, a large area and a uniform distribution can be formed. Therefore, when the heating film 30 is electrically connected to the electrode, not only can the heating film 30 generate heat evenly, but also the heating area is large and the heat utilization rate is high; it can also greatly reduce the absorption of heavy metals inside the atomizer core 100, thereby improving safety performance.

[0078] Optionally, in one embodiment, in combination Figure 3 and Figure 6 As shown, Figure 6 yes Figure 4 The step of forming the heating film 30 on the surface of the ceramic covering layer 20 away from the porous ceramic substrate 10 includes:

[0079] Step S201 : forming a first covering film 32 on a surface of the ceramic covering layer 20 away from the porous ceramic substrate 10 .

[0080] The first covering film 32 may be a metal or an alloy. The first covering film 32 may be made of a material having a strong bonding force with the porous ceramic substrate 10. For example, the first covering film 32 may be titanium, zirconium, titanium-aluminum alloy, titanium-zirconium alloy, titanium-molybdenum alloy, titanium-niobium alloy, iron-aluminum alloy, or tantalum-aluminum alloy.

[0081] Step S202 : forming a second covering film 34 on a surface of the first covering film 32 away from the ceramic covering layer 20 .

[0082] The second covering film 34 may also be a metal or alloy. The second covering film 34 may be made of a material with strong anti-oxidation performance. For example, the second covering film 34 may be platinum, palladium, palladium-copper alloy, gold-silver-platinum alloy, gold-silver alloy, palladium-silver alloy, gold-platinum alloy, etc.

[0083] Optionally, the first covering film 32 and the second covering film 34 can be sequentially formed on the surface of the ceramic covering layer 20 away from the porous ceramic substrate 10 by PVD (Physical Vapor Deposition), CVD (Chemical Vapor Deposition), electroplating, electrodeposition, ion plating or spraying. The first covering film 32 and the second covering film 34 formed by the above method are thin, large in area and evenly distributed. Therefore, when the heating film 30 is electrically connected to the electrode, not only can the heating film 30 generate heat evenly, but also the heating area is large and the heat utilization rate is high; and it can also greatly reduce the absorption of heavy metals inside the atomizer core 100, thereby improving the safety performance.

[0084] In another embodiment, see Figure 7 and Figure 8 , Figure 7 is a schematic diagram of a process for preparing an atomizer core in another embodiment of the present invention. Figure 8 is with Figure 7 The manufacturing method of the atomizer core 100 in this embodiment includes:

[0085] Step S301: preparing a porous ceramic substrate 10 .

[0086] Step S302 : preparing a ceramic covering layer 20 , wherein the porosity of the ceramic covering layer 20 is lower than the porosity of the porous ceramic substrate 10 .

[0087] Step S303: stacking the porous ceramic substrate 10 and the ceramic covering layer 20 and combining them into an integrated structure.

[0088] Step S304 : forming a plurality of holes 21 on the ceramic cover layer 20 .

[0089] Step S305 : forming a heating film 30 on a surface of the ceramic covering layer 20 away from the porous ceramic substrate 10 .

[0090] Among them, step S301 is substantially the same as step S101 in the above embodiment, step S303 is substantially the same as step S103 in the above embodiment, and step S305 is substantially the same as step S104 in the above embodiment. Please refer to the description in the above embodiment, which will not be repeated here. The difference between this embodiment and the above embodiment is that in this embodiment, the plurality of holes 21 located on the ceramic covering layer 20 are not formed when the ceramic covering layer 20 is prepared, but are formed by drilling holes on one side of the ceramic covering layer 20 after the porous ceramic substrate 10 and the ceramic covering layer 20 are combined to form an integrated structure.

[0091] In this embodiment, when drilling, it is necessary to first set the drilling depth equal to the thickness of the ceramic cover layer 20, and then start drilling from the side where the ceramic cover layer 20 is located to form a plurality of blind holes on the integral porous ceramic substrate 10 and the ceramic cover layer 20. The drilling method and the hole size are the same as those in the above embodiment, and please refer to the description in the above embodiment.

[0092] The present invention also provides an electronic atomization device, which comprises a liquid storage chamber for storing smoke liquid and an atomization core. The smoke liquid in the liquid storage chamber can be transferred to the ceramic covering layer through the porous ceramic substrate.

[0093] Among them, the structure of the atomizer core in this embodiment is the same as the structure of the atomizer core in the above embodiment. Please refer to the description in the above embodiment and will not be repeated here.

[0094] In summary, it is easy for those skilled in the art to understand that by combining a ceramic covering layer 20 having a lower porosity than the porous ceramic substrate 10 on the surface of the porous ceramic substrate 10 close to the heating element, the atomizer core 100 can be prevented from losing powder because the ceramic covering layer 20 with lower porosity has higher density and does not lose powder; moreover, the ceramic covering layer 20 with lower porosity can isolate the precipitation of heavy metals inside the porous ceramic substrate 10, thereby preventing heavy metals from being brought into the airflow during inhalation, thereby improving the safety performance of the electronic atomization device.

[0095] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. An atomizer core of an electronic atomizer device, characterized in that: include: A porous ceramic substrate, a ceramic covering layer and a heating film, wherein the ceramic covering layer is bonded to the surface of the porous ceramic substrate, the heating film is bonded to the surface of the ceramic covering layer away from the porous ceramic substrate, the porosity of the ceramic covering layer is lower than the porosity of the porous ceramic substrate, the porosity of the ceramic covering layer is 10%-20%, a plurality of through holes are formed on the ceramic covering layer, the sum of the opening areas of the plurality of holes accounts for 5%-15% of the area of ​​the cross section of the ceramic covering layer perpendicular to the extension direction of the holes, the diameter of each hole is 5-50µm, the average pore size of the micropores on the porous ceramic substrate is 10µm-40µm, and the heating film is made of metal or alloy.

2. The atomizer core according to claim 1, characterized in that: The porosity of the porous ceramic substrate is 40%-80%; and / or The material used to form the porous ceramic substrate is zirconium oxide, silicon oxide, aluminum oxide or mullite; and / or The thickness of the porous ceramic substrate is 1-4 mm.

3. The atomizer core according to claim 1, characterized in that: The material used to form the ceramic covering layer is zirconium oxide, silicon oxide, aluminum oxide, silicon carbide or mullite; and / or The thickness of the ceramic covering layer is 0.05-0.2 mm; and / or The powder particle size of the material used to form the ceramic covering layer is 0.1-5 μm.

4. The atomizer core according to claim 1, characterized in that: The thickness of the heating film is 2-10 μm.

5. A method for preparing an atomizer core of an electronic atomizer device, characterized in that: The preparation method comprises: Preparing a porous ceramic substrate, wherein the average pore size of the micropores on the porous ceramic substrate is 10µm-40µm; Prepare a ceramic covering layer, and form a plurality of holes penetrating the ceramic covering layer on the ceramic covering layer, wherein the porosity of the ceramic covering layer is lower than the porosity of the porous ceramic substrate, the porosity of the ceramic covering layer is 10%-20%, the sum of the opening areas of the plurality of holes accounts for 5%-15% of the area of ​​the cross section of the ceramic covering layer perpendicular to the extension direction of the holes, and the diameter of each hole is 5-50 μm; stacking the porous ceramic substrate and the ceramic cover layer and combining them into an integral structure; and A heat-generating film is formed on a surface of the ceramic cover layer away from the porous ceramic substrate, and the heat-generating film is made of metal or alloy.

6. The preparation method according to claim 5, characterized in that: The step of preparing the porous ceramic substrate comprises: Prepare a first casting slurry from a raw material for forming a porous ceramic substrate; The porous ceramic substrate is manufactured by a tape casting process, and the thickness of the porous ceramic substrate is 1-4 mm.

7. The preparation method according to claim 5, characterized in that: The step of preparing the ceramic covering layer comprises: The raw material for forming the ceramic covering layer is made into a second casting slurry, wherein the powder particle size of the material for forming the ceramic covering layer is 0.1-5 μm; The ceramic covering layer is made by a tape casting process or a dry pressing process, and the thickness of the ceramic covering layer is 0.05-0.2 mm.

8. The preparation method according to claim 5, characterized in that: The step of stacking the porous ceramic substrate and the ceramic covering layer and combining them into an integrated structure comprises: The porous ceramic substrate and the ceramic covering layer are connected by bonding or sintering.

9. The preparation method according to claim 5, characterized in that: The step of forming a heating film on the surface of the ceramic covering layer away from the porous ceramic substrate comprises: The heating film is formed on the surface of the ceramic covering layer away from the porous ceramic substrate by PVD, CVD, electroplating, electrodeposition, ion plating or spraying, and the thickness of the heating film is 2-10µm.

10. An electronic atomization device, characterized in that: The electronic atomization device comprises a liquid storage chamber for storing smoke liquid and an atomization core according to any one of claims 1 to 4, and the smoke liquid in the liquid storage chamber can be transferred to the ceramic covering layer through the porous ceramic substrate.

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