An intelligent Android integrated basic control box

Abstract

The present invention discloses an intelligent Android integrated basic control box, comprising a chassis and a cover, wherein two ends of the bottom of the chassis are provided with slide grooves, the interior of the slide grooves is connected with a bracket, the bracket is fixed to the chassis by a first screw, wherein a mounting hole is provided at the bottom end of the bracket, a card plate is provided at the top edge of the chassis, a card slot is provided inside the card plate, the cover is connected to the card slot inside the card plate, a fixing plate is provided at one side edge of the cover, and the fixing plate is connected to a groove on one side of the chassis. The intelligent Android integrated basic control box, when it is necessary to clean the heat sink for ventilation and heat dissipation inside the chassis, the knob on the threaded column is turned so that the knob is removed from the threaded column, and then the heat sink in the through hole is pushed from the side of the chassis so that the heat sink is removed along the threaded column, thereby facilitating the cleaning of the heat sink blocked by the ventilation holes.

Description

Technical Field

[0001] The present invention relates to the technical field of intelligent integrated equipment, and in particular to an intelligent Android integrated basic control box. Background Art

[0002] The control box designed based on the Android development board and the circuit control board is designed to extend the hardware functions and meet the development of different application scenarios. It was designed in the early days to adapt to the multi-purpose scenarios of RFID and the development of projects with different technical extensions. As a basic intelligent hardware architecture, it can play the role of basic development components in different fields of intelligent identification technology. The existing intelligent Android integrated basic control box still has troubles in use and installation. For this reason, we hope to improve the installation efficiency of the intelligent Android integrated basic control box through innovation of the intelligent Android integrated basic control box, facilitate disassembly and maintenance, improve the use efficiency, and maximize its value. With the development of science and technology, the intelligent Android integrated basic control box has developed to a great extent. Its development has brought great convenience to people in installing and protecting intelligent integrated equipment, and its types and quantities are also increasing day by day.

[0003] Although there are many types and quantities of smart Android integrated basic control boxes on the market, the smart Android integrated basic control boxes have the following disadvantages: the smart Android integrated basic control boxes are not easy to assemble or disassemble during installation and use, the smart Android integrated basic control boxes are not easy to open for maintenance, and the cooling rack for ventilation inside the smart Android integrated basic control boxes is not easy to clean. Therefore, the current smart Android integrated basic control boxes need to be improved. Summary of the invention

[0004] The purpose of the present invention is to provide an intelligent Android integrated basic control box to solve the problems raised by the above background technology that the intelligent Android integrated basic control box currently on the market is not convenient to assemble or disassemble during installation and use, the intelligent Android integrated basic control box is not convenient to open the cover for maintenance, and the heat dissipation rack for internal ventilation of the intelligent Android integrated basic control box is not convenient to clean.

[0005] To achieve the above object, the present invention provides the following technical solution: an intelligent Android integrated basic control box, comprising a chassis and a cover, wherein two ends of the bottom of the chassis are provided with a slide groove, the interior of the slide groove is connected with a bracket, and the bracket is fixed to the chassis by a first screw, wherein:

[0006] A mounting hole is provided at the bottom end of the bracket, a card plate is provided at the top edge of the chassis, a card slot is provided inside the card plate, the cover is connected to the card slot inside the card plate, a fixing plate is provided at one side edge of the cover, the fixing plate is connected to a groove on one side of the chassis, and the fixing plate is fixed to the chassis by a second screw;

[0007] A circuit control board is arranged at the bottom of the inner side of the chassis, a first interface is welded and fixed on a side of the circuit control board close to the chassis surface, an Android development board is arranged on an adjacent side of the circuit control board, a second interface is welded and fixed on a side of the Android development board away from the first interface, a 4G module is installed on the surface of the Android development board, a speaker is installed at one end of the chassis close to the circuit control board and the Android development board, a through hole is opened on the side of the inner wall of the chassis close to the speaker, a threaded column is arranged at the corner of the through hole, the threaded column is through-connected with the heat sink, and a knob is connected to the side of the threaded column extending out of the heat sink.

[0008] Preferably, the brackets are symmetrically and parallelly distributed on both sides of the bottom of the chassis, and the cross-sectional shape of the brackets connected in the slide groove is an isosceles trapezoid, and the cross-sectional dimensions of the brackets match those of the slide groove, and the brackets form a sliding structure between the slide groove and the chassis.

[0009] Preferably, the thickness of the card plate matches the thickness of the machine cover, and the card plate is connected to the two ends of the machine cover through the inner card slot, and the card plate forms a card structure with the machine cover through the card slot.

[0010] Preferably, the fixing plate is in the shape of an isosceles trapezoid, and the fixing plate is located on the vertical center line of the chassis, and the size of the fixing plate matches the size of the groove.

[0011] Preferably, the threaded column and the heat dissipation frame are butted together at the corners, the threaded column and the knob are threadedly connected, and the threaded column and the heat dissipation frame are vertically distributed.

[0012] Preferably, the heat sink is rectangular in shape, and the size of the heat sink is larger than the size of the through hole.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] (1) The smart Android integrated basic control box connects one end of the bracket to the slide groove at the bottom of the chassis, so that the slide groove is engaged with the bracket for installation, and then the first screw is used to penetrate the bracket for fixing, and the chassis is installed and fixed through the mounting hole at the bottom of the bracket. Through the connection between the bracket and the slide groove, the basic control box is conveniently assembled or disassembled when in use;

[0015] (2) When the chassis of the smart Android integrated basic control box is installed in the designated position, the second screw in the fixing plate is removed by using the matching hexagonal wrench, and the cover is pulled so that the two ends of the cover and the card slots inside the card plate can be telescopically slid, thereby quickly disassembling and opening the cover, thereby facilitating the opening and maintenance of the basic control box;

[0016] (3) When the heat sink for ventilation and heat dissipation inside the chassis needs to be cleaned, the knob on the threaded column is turned to remove the knob from the threaded column, and then the heat sink in the through hole is pushed from the side of the chassis to remove the heat sink along the threaded column, thereby facilitating the cleaning of the heat sink whose ventilation holes are blocked. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the main structure of the intelligent Android integrated basic control box of the present invention;

[0018] Figure 2 This is a left-view structural diagram of the intelligent Android integrated basic control box of the present invention;

[0019] Figure 3 It is a schematic diagram of the right side cross-sectional structure of the intelligent Android integrated basic control box of the present invention;

[0020] Figure 4 It is a schematic diagram of the top view of the structure of the intelligent Android integrated basic control box with the cover opened.

[0021] In the figure: 1. chassis; 2. slide; 3. bracket; 4. first screw; 5. mounting hole; 6. card plate; 7. card slot; 8. cover; 9. fixing plate; 10. groove; 11. second screw; 12. circuit control board; 13. first interface; 14. Android development board; 15. second interface; 16. 4G module; 17. speaker; 18. through hole; 19. threaded column; 20. heat sink; 21. knob. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] See also Figure 1-4The present invention provides a technical solution: an intelligent Android integrated basic control box, including a chassis 1, a slide 2, a bracket 3, a first screw 4, a mounting hole 5, a card plate 6, a card slot 7, a cover 8, a fixing plate 9, a groove 10, a second screw 11, a circuit control board 12, a first interface 13, an Android development board 14, a second interface 15, a 4G module 16, a speaker 17, a through hole 18, a threaded column 19, a heat sink 20 and a knob 21. The chassis 1 is provided with slides 2 at both ends of the bottom, and the inside of the slide 2 is connected with a bracket 3. The brackets 3 are symmetrically and parallelly distributed on both sides of the bottom of the chassis 1, and the cross-sectional shape of the brackets 3 connected in the slide slot 2 is an isosceles trapezoid, and the cross-sectional size of the brackets 3 is consistent with the cross-sectional size of the slide slot 2, and the brackets 3 form a sliding structure between the slide slot 2 and the chassis 1. The brackets 3 are connected to the bottom of the chassis 1 by the sliding structure formed between the slide slot 2 and the chassis 1, so that the chassis 1 is convenient for assembly or disassembly when it is installed and fixed. The brackets 3 are fixed to the chassis 1 by the first screws 4, wherein,

[0024] A mounting hole 5 is provided at the bottom end of the bracket 3, and a card plate 6 is provided at the top edge of the chassis 1. The thickness of the card plate 6 matches the thickness of the cover 8, and the card plate 6 is connected to the two ends of the cover 8 through the inner card slot 7, and the card plate 6 forms a snap-fit ​​structure with the cover 8 through the card slot 7. The snap-fit ​​structure formed by the card plate 6 through the card slot 7 and the cover 8 allows the card plate 6 to stably dock with the cover 8 and prevent the cover 8 from detaching. The card plate 6 has a card slot 7 inside, and the cover 8 is connected to the inner side of the card plate 6. In the card slot 7, a fixing plate 9 is provided at one side edge of the cover 8, the fixing plate 9 is in the shape of an isosceles trapezoid, and the fixing plate 9 is on the vertical center line of the chassis 1, and the size of the fixing plate 9 is consistent with the size of the groove 10, and the size of the fixing plate 9 is set to be consistent with the size of the groove 10. When the fixing plate 9 and the groove 10 are matched and docked, the fixing plate 9 can be used to close the cover 8 through the second screw 11, and the fixing plate 9 is connected to the groove 10 on one side of the chassis 1, and the fixing plate 9 is fixed to the chassis 1 through the second screw 11;

[0025] A circuit control board 12 is provided at the bottom of the inner side of the chassis 1, a first interface 13 is welded and fixed on one side of the circuit control board 12 close to the surface of the chassis 1, an Android development board 14 is provided on the adjacent side of the circuit control board 12, a second interface 15 is welded and fixed on the side of the Android development board 14 away from the first interface 13, a 4G module 16 is installed on the surface of the Android development board 14, a speaker 17 is installed at one end of the inside of the chassis 1 close to the circuit control board 12 and the Android development board 14, a through hole 18 is opened on the side of the inner wall of the chassis 1 close to the speaker 17, a threaded column 19 is provided at the corner of the through hole 18, and the threaded column 19 and the corner of the heat sink 20 are matched and docked, The threaded column 19 and the knob 21 are threadedly connected, and the threaded column 19 and the heat sink 20 are vertically distributed. The threaded column 19 and the knob 21 are threadedly connected, and the threaded column 19 is connected by the knob 21, so that the heat sink 20 is locked and fixed, and the disassembly of the heat sink 20 is convenient. The threaded column 19 is through-connected with the heat sink 20. The heat sink 20 is rectangular in shape, and the size of the heat sink 20 is larger than the size of the through hole 18. The size of the heat sink 20 is larger than the size of the through hole 18, so that the heat sink 20 blocks the through hole 18, and the chassis 1 is cooled and ventilated through the heat sink 20. The threaded column 19 extends out of the heat sink 20 and is connected to the knob 21 on one side.

[0026] Working principle: When using the smart Android integrated basic control box, first, connect one end of the bracket 3 with the slide groove 2 at the bottom of the chassis 1, so that the slide groove 2 can be engaged with the bracket 3 for installation, and then use the first screw 4 to penetrate the bracket 3 for fixation, and install and fix the chassis 1 through the mounting hole 5 at the bottom of the bracket 3. When the chassis 1 is installed in the specified position, the second screw 11 in the fixing plate 9 is removed by the matching Allen wrench, and the cover 8 is pulled so that the two ends of the cover 8 and the card slot 7 inside the card plate 6 are telescopically slid, so that the cover 8 can be quickly disassembled and opened. When it is necessary to clean the heat sink 20 for ventilation and heat dissipation inside the chassis 1, turn the knob 21 on the threaded column 19 to remove the knob 21 from the threaded column 19, and then push the heat sink 20 in the through hole 18 from the side of the chassis 1 so that the heat sink The heat rack 20 is disassembled along the threaded column 19, so as to clean the heat rack 20 blocked by the ventilation holes, and then the circuit control board 12 and the Android development board 14 are connected by lines. The circuit control board 12 and the Android development board 14 are mainly connected by the GPI / O port and the backlight power supply, and the on-off 12V power supply is connected to the Android development board 14, and the signal interaction is connected through the first interface 13 on the circuit control board 12 and the second interface 15 on the Android development board 14, so as to transmit the data signal TX / RX of various types of interactive controls through the corresponding TTL port, USB port, 485 port, etc. The hardware interface supported by the entire construction and development controls the operation of the 4G module 16 and the speaker 17 through the circuit control board 12 and the Android development board 14. The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0027] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An intelligent Android integrated basic control box, comprising a chassis (1) and a cover (8), characterized in that: Slide grooves (2) are provided at both ends of the bottom of the chassis (1), a bracket (3) is connected inside the slide groove (2), and the bracket (3) is fixed to the chassis (1) by a first screw (4), wherein: A mounting hole (5) is provided at the bottom end of the bracket (3); a card plate (6) is provided at the top edge of the chassis (1); a card slot (7) is provided inside the card plate (6); the cover (8) is connected to the card slot (7) inside the card plate (6); a fixing plate (9) is provided at one side edge of the cover (8); the fixing plate (9) is connected to a groove (10) on one side of the chassis (1); and the fixing plate (9) is fixed to the chassis (1) by a second screw (11); A circuit control board (12) is arranged at the bottom of the inner side of the chassis (1); a first interface (13) is welded and fixed on a side of the circuit control board (12) close to the surface of the chassis (1); an Android development board (14) is arranged on an adjacent side of the circuit control board (12); a second interface (15) is welded and fixed on a side of the Android development board (14) away from the first interface (13); a 4G module (16) is installed on the surface of the Android development board (14); a speaker (17) is installed at one end of the chassis (1) close to the circuit control board (12) and the Android development board (14); a through hole (18) is opened on the side of the inner wall of the chassis (1) close to the speaker (17); a threaded column (19) is arranged at a corner of the through hole (18); the threaded column (19) is connected to a heat sink (20) through the threaded column (19); and a knob (21) is connected to the side of the threaded column (19) extending out of the heat sink (20); The bracket (3) is symmetrically and parallelly distributed on both sides of the bottom of the chassis (1), and the cross-sectional shape of the bracket (3) connected in the slide groove (2) is an isosceles trapezoid, and the cross-sectional size of the bracket (3) is consistent with the cross-sectional size of the slide groove (2), and the bracket (3) forms a sliding structure between the slide groove (2) and the chassis (1); The thickness of the card plate (6) matches the thickness of the machine cover (8), and the card plate (6) is connected to the two ends of the machine cover (8) by matching the inner card slot (7), and the card plate (6) forms a card-fitting structure with the machine cover (8) through the card slot (7); The fixing plate (9) is in the shape of an isosceles trapezoid, and the fixing plate (9) is located on the vertical center line of the chassis (1), and the size of the fixing plate (9) is consistent with the size of the groove (10); The threaded column (19) and the heat sink (20) are butted together at their corners, the threaded column (19) and the knob (21) are threadedly connected, and the threaded column (19) and the heat sink (20) are vertically distributed; the heat sink (20) is rectangular in shape, and the size of the heat sink (20) is larger than the size of the through hole (18).

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