Inductor and manufacturing method thereof, package module and manufacturing method thereof

Abstract

The present invention discloses an inductor and a method for manufacturing the same, as well as a packaging module and a method for manufacturing the same. The inductor includes a magnetic core and a winding, including an outer winding ring and a winding center column located inside the outer winding ring; wherein the winding center column is surrounded by the magnetic core, and the magnetic core is wrapped by the outer winding ring, so that the upper surface of the magnetic core is exposed. Because the outer winding ring wraps around the magnetic core, the cross-sectional area of ​​the winding becomes larger, and the area of ​​current flowing through the winding increases, thereby reducing the current impedance of the inductor and resulting in reduced inductance loss. In addition, the air gap of the inductor is surrounded by the winding, and when the inductor is used in high-frequency applications, it will not generate external electromagnetic interference.

Description

Technical Field

[0001] The present invention relates to a semiconductor technology, and more particularly, to an inductor and a manufacturing method thereof, as well as a packaging module and a manufacturing method thereof. Background Art

[0002] Since the increase in switching frequency can significantly reduce the size of magnetic components, the current IC package integrated power supply is constantly developing towards high frequency in order to improve the overall power density of the power supply. The power supply products have lower and lower requirements on the inductance of magnetic components. However, for high power and high current inductors, DC impedance is very important, which directly determines the loss of the inductor. There are many types of inductors at present. In high current applications, many single-turn inductor solutions have been proposed, such as Figure 1 The inductor structure 100 shown in FIG. 1 includes a magnetic core 102, a winding 100, and a cover 101. This inductor structure has the advantage of a high window fill ratio, but has the disadvantage of high DCR (direct current resistance) losses in the windings in high-current applications, making them difficult to dissipate. Furthermore, in high-frequency applications, the exposed air gap of the inductor structure can easily generate electromagnetic interference. Summary of the Invention

[0003] In view of this, the present invention provides an inductor and a manufacturing method thereof, a packaging module and a manufacturing method thereof, so as to reduce the DC impedance of the inductor.

[0004] According to a first aspect of the present invention, an inductor is provided, comprising: a magnetic core, and a winding, comprising an outer winding ring and a winding center column located inside the outer winding ring; wherein the winding center column is surrounded by the magnetic core, and the magnetic core is wrapped by the outer winding ring, so that the upper surface of the magnetic core is exposed.

[0005] Preferably, the outer ring of the winding is a closed structure with an open top.

[0006] Preferably, the winding center column is a cylinder located inside the closed structure.

[0007] Preferably, the winding center column does not contact the side wall of the closed structure, and a predetermined space is left between the winding center column and the side wall of the closed structure.

[0008] Preferably, the predetermined space is used to accommodate the magnetic core.

[0009] Preferably, the magnetic core has an opening for accommodating the winding center leg.

[0010] Preferably, the winding is made of metal material.

[0011] Preferably, an air gap of the inductor is opened on the magnetic core.

[0012] Preferably, the inductor comprises at least one air gap.

[0013] Preferably, the air gap of the inductor extends from an upper surface of the magnetic core to a lower surface of the magnetic core, wherein the upper surface and the lower surface of the magnetic core are opposite to each other.

[0014] Preferably, the upper surface of the winding center column is higher than the upper surface of the magnetic core to facilitate winding output.

[0015] Preferably, at least a portion of the upper surface of the outer ring of the winding is higher than the upper surface of the magnetic core for winding output.

[0016] Preferably, the remaining portion of the upper surface of the outer ring of the winding is in the same plane as the upper surface of the magnetic core.

[0017] Preferably, the material of the magnetic core is ferrite or magnetic powder core material.

[0018] According to a second aspect of the present invention, there is provided a method for forming an inductor, comprising: providing a magnetic core; forming a winding, the winding comprising an outer winding ring and a winding center column located inside the outer winding ring to form a winding structure; and placing the magnetic core in a void portion of the winding structure, wherein the winding center column is surrounded by the magnetic core, and the magnetic core is wrapped by the outer winding ring, so that the upper surface of the magnetic core is exposed.

[0019] Preferably, the magnetic core is bonded to the bottom of the outer ring of the winding by glue.

[0020] Preferably, the outer ring of the winding is a closed structure with an open top.

[0021] Preferably, the winding center column is a column located inside the closed structure, and the winding center column does not contact the side wall of the closed structure.

[0022] Preferably, the magnetic core has an opening, and the opening is used to accommodate the winding center column.

[0023] According to a third aspect of the present invention, a method for forming an inductor is provided, comprising: providing a magnetic core having an opening; forming a winding outer ring wrapping the magnetic core, wherein the upper surface of the magnetic core is exposed by the winding outer ring; and forming a winding center column located in the magnetic core opening.

[0024] Preferably, the method for forming the outer ring of the winding includes: encapsulating the magnetic core with a packaging material to form a first enclosure; and plating copper on other surfaces of the first enclosure except the upper surface to form the outer ring of the winding.

[0025] Preferably, the method for forming the winding center column includes: punching the upper surface of the first enclosure to form an opening, the opening of the first enclosure coincides with the opening of the magnetic core; and forming the winding center column in the opening of the magnetic core.

[0026] Preferably, a metal layer is electroplated in the opening of the magnetic core to form the winding center column.

[0027] Preferably, a machined metal post is welded into the opening of the magnetic core to form the winding center post.

[0028] Preferably, the diameter of the opening of the first enclosure is not greater than the diameter of the opening of the magnetic core.

[0029] Preferably, the method further comprises forming a gap on at least one side of the magnetic core, the gap extending from the upper surface to the lower surface of the magnetic core, so as to form an air gap of the inductor.

[0030] According to a fourth aspect of the present invention, a packaging module is provided, comprising: an inductor according to any one of the above descriptions, and a chip.

[0031] Preferably, the chip is located on the upper surface of the inductor, and the electrodes on the upper surface of the inductor are electrically connected to corresponding conductive protrusions on the chip.

[0032] According to a fifth aspect of the present invention, a method for manufacturing a packaging module is provided, comprising: encapsulating an inductor with a packaging material to form a first package, wherein the first package exposes the electrodes on the upper surface of the inductor; placing the chip on the upper surface of the first package, and electrically connecting the electrodes on the upper surface of the inductor to corresponding conductive protrusions on the chip.

[0033] Preferably, the conductive protrusions of the wafer are arranged away from the upper surface of the first package.

[0034] Preferably, the conductive protrusions of the wafer are arranged to face the upper surface of the first package.

[0035] Preferably, before placing the wafer on the upper surface of the first package, the method further includes forming a metal layer on the exposed electrodes of the inductor.

[0036] Preferably, the method for electrically connecting the electrode on the upper surface of the inductor with the corresponding conductive protrusion on the chip includes: encapsulating the metal layer and the chip with a packaging material to form a second package, the second package exposing the upper surface of the metal layer and the conductive protrusion; forming an electrical connection layer on the second package through an electroplating process to achieve electrical connection between the metal layer and the conductive protrusion; and encapsulating the electrical connection layer with a packaging material to form a third package, the third package exposing the upper surface of the electrical connection layer.

[0037] Preferably, the method further comprises forming pad pins of the packaging module on the exposed electrical connection layer.

[0038] Preferably, the method further comprises encapsulating the pad pins with a packaging material to form a fourth package, wherein the fourth package exposes the upper surface of the pad pins to achieve electrical connection with an external circuit.

[0039] According to an embodiment of the present invention, an inductor structure is provided within a closed structure with an open top, wherein a column is provided to form a winding. The column does not contact the sidewalls of the closed structure, leaving a predetermined space to accommodate the magnetic core. Because the closed structure encloses the magnetic core, the cross-sectional area of ​​the winding increases, and the area through which current flows increases, thereby reducing the current impedance of the inductor and resulting in reduced inductor losses. Furthermore, the inductor's air gap is surrounded by the winding, and when the inductor is used in high-frequency applications, it does not generate external electromagnetic interference.

[0040] The package module proposed in this embodiment not only integrates the inductor into the IC packaging process, but also features a closed outer winding structure similar to a heat sink. When connected to the output voltage pins on a printed circuit board (PCB), the outer winding facilitates heat dissipation from the inductor and chip to the PCB, facilitating heat dissipation from the package module. Furthermore, due to the shielding effect of the outer winding, radiation from components within the package module does not interfere with external structures. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0042] Figure 1 It is a structural schematic diagram of a single-turn inductor in the prior art;

[0043] Figure 2A schematic structural diagram of an inductor provided according to an embodiment of the present invention;

[0044] Figure 3 Cross-sectional views of various stages of a first method for forming an inductor provided by an embodiment of the present invention;

[0045] Figures 4a-4d Cross-sectional views of various stages of a second method for forming an inductor provided by an embodiment of the present invention;

[0046] Figures 5a-5e Cross-sectional views of various stages of a method for forming a package module according to an embodiment of the present invention. DETAILED DESCRIPTION

[0047] The present invention is described below based on the following embodiments, but the present invention is not limited to these embodiments. In the detailed description of the present invention below, certain specific details are described in detail. Those skilled in the art can fully understand the present invention without these details. To avoid obscuring the essence of the present invention, well-known methods, processes, procedures, components, and circuits are not described in detail.

[0048] Furthermore, persons of ordinary skill in the art will appreciate that the figures provided herein are for illustration purposes only and are not necessarily drawn to scale.

[0049] At the same time, it should be understood that in the following description, "circuit" refers to a conductive loop composed of at least one element or subcircuit connected electrically or electromagnetically. When an element or circuit is said to be "connected to" another element or an element / circuit is said to be "connected" between two nodes, it can be directly coupled or connected to the other element or there can be intermediate elements. The connection between the elements can be physical, logical, or a combination thereof. Conversely, when an element is said to be "directly coupled to" or "directly connected to" another element, it means that there are no intermediate elements between the two.

[0050] Unless the context clearly requires otherwise, throughout the specification and claims, the words "include," "comprising," and similar words should be construed in an inclusive sense rather than an exclusive or exhaustive sense; that is, in the sense of "including but not limited to."

[0051] In the description of the present invention, it should be understood that the terms "first", "second", etc. are used for descriptive purposes only and should not be understood to indicate or imply relative importance. In addition, in the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0052] Figure 2The inductor 20 is a schematic structural diagram of an inductor according to an embodiment of the present invention. The inductor 20 includes a winding 210 and a magnetic core 220. In this embodiment, the winding 210 includes an outer winding 211 and a winding center column 212 located inside the outer winding. The winding center column 212 is surrounded by the magnetic core 220, and the magnetic core 220 is wrapped by the outer winding 211, so that the upper surface of the magnetic core 220 is exposed. Specifically, the outer winding 211 is a closed structure with an open top, that is, the closed structure includes a bottom surface and a side surface connected to the bottom surface. The winding center column 212 is a column located in the closed structure. The bottom surface of the winding center column 212 contacts the bottom surface of the closed structure, and the winding center column 212 does not contact the side walls of the closed structure. A predetermined space is left between the winding center column 212 and the side walls of the closed structure for accommodating the magnetic core 220. In this embodiment, the magnetic core 220 is a hollow cylinder with an opening for accommodating the center leg of the winding. The outer dimensions of the magnetic core match the dimensions of the outer winding coil, i.e., the outer dimensions of the magnetic core are no larger than the dimensions of the outer winding coil. An air gap 222 of the inductor is defined within the magnetic core. The air gap 222 extends from the upper surface of the magnetic core 220 to the lower surface of the magnetic core 220, and from the opening of the magnetic core 220 to the outer surface of the magnetic core. The upper and lower surfaces of the magnetic core are opposed to each other. In inductor 20, the upper surface of the winding center leg 212 is not lower than the upper surface of the magnetic core 220. Preferably, the upper surface of the winding center leg 212 is higher than the upper surface of the magnetic core 220, allowing the winding wire to be routed out. At least a portion 201 of the upper surface of the winding outer ring 211 is not lower than the upper surface of the magnetic core 220. Preferably, at least a portion 201 of the upper surface of the winding outer ring 211 is higher than the upper surface of the magnetic core 220, allowing the winding wire to be routed out. The remaining portion of the upper surface of the winding outer ring 211 is coplanar with the upper surface of the magnetic core 220. The upper surface of the winding center leg 212 and at least a portion 201 of the upper surface of the winding outer ring 211 serve as the electrodes of the inductor. When the inductor is used in a modular circuit, current typically flows into the winding center leg and out of the winding outer ring. In this embodiment, the winding is made of metal, specifically copper. The material of the magnetic core is ferrite or magnetic powder core material.

[0053] In this embodiment, the inductor includes one air gap. In other embodiments, the inductor may include multiple air gaps, which may be opened on various sides of the magnetic core to form distributed air gaps.

[0054] In this embodiment, the magnetic core is a hollow cylinder. In other embodiments, the magnetic core may be composed of multiple parts, without limitation, as long as it occupies the predetermined space of the winding. The winding center column is a solid cylinder. In other embodiments, the winding center column may also be a hollow cylinder, without limitation.

[0055] In this embodiment, the winding center post is cylindrical, and the winding outer ring is a closed structure with an open top, which is a quadrangular prism. Correspondingly, the opening of the magnetic core is also cylindrical, and the outer shape of the magnetic core is also a quadrangular prism. Of course, in other embodiments, the winding center post, the winding outer ring, and the shape of the magnetic core can be any other shape, without limitation, as long as the shape of the opening of the magnetic core is consistent with the shape of the winding center post, and the shape of the winding outer ring is consistent with the outer shape of the magnetic core.

[0056] The inductor structure proposed in this invention features a cylindrical winding within a closed structure with an open top. The cylindrical winding does not contact the sidewalls of the closed structure, leaving a predetermined space to accommodate the magnetic core. Because the closed structure encloses the magnetic core, the cross-sectional area of ​​the winding increases, increasing the area through which current flows, thereby reducing the inductor's current impedance and minimizing inductor losses. Furthermore, the inductor's air gap is surrounded by the winding, preventing electromagnetic interference when used in high-frequency applications.

[0057] The present invention provides a method for forming an inductor, comprising: providing a magnetic core; forming a winding, wherein the winding includes an outer winding ring and a winding center column located inside the outer winding ring to form a winding structure; and placing the magnetic core in a void portion of the winding structure, wherein the winding center column is surrounded by the magnetic core, and the magnetic core is wrapped by the outer winding ring, so that the upper surface of the magnetic core is exposed.

[0058] Figure 3 Cross-sectional views of various stages of a first method for forming an inductor provided in an embodiment of the present invention.

[0059] Specifically, if Figure 3 As shown, a magnetic core 33 is provided, the magnetic core 33 having an opening 331; an air gap 332 is formed in the magnetic core 33, the air gap extending from the upper surface to the lower surface of the magnetic core, and from the opening of the magnetic core to the outer surface of the magnetic core, wherein the upper surface and the lower surface of the magnetic core are opposite. In other embodiments, the air gap may include multiple air gaps, and the multiple air gaps may be distributed on different sides of the magnetic core to form a distributed air gap. The magnetic core is made of ferrite or magnetic powder core material.

[0060] A winding 31 is formed, comprising an outer winding 311 and a winding center post 312 located within the outer winding to form a winding structure. The outer winding 311 is a closed structure with an open top, and the winding center post 312 is a cylinder located within the closed structure. The winding center post 312 does not contact the sidewalls of the closed structure, and a predetermined space is left between the winding center post 312 and the sidewalls of the closed structure to accommodate the magnetic core 33. The opening 331 of the magnetic core is used to accommodate the winding center post 312. The winding is made of metal material. Specifically, in this embodiment, the winding is configured as copper material.

[0061] The magnetic core 33 is placed in the empty space of the winding structure 31, that is, the magnetic core 33 is placed in the predetermined space between the winding center column 312 and the side wall of the closed structure, to form the inductor 30. The magnetic core is bonded to the bottom of the closed structure with glue 32. In the inductor 30, the upper surface of the winding center column 312 is higher than the upper surface of the magnetic core 33, which is used for the winding output; at least a portion of the upper surface of the winding outer ring 311 is higher than the upper surface of the magnetic core 33, which is used for the winding output, and the remaining portion of the upper surface of the winding outer ring 311 is in the same plane as the upper surface of the magnetic core 33. The upper surface of the winding center column 312 and at least a portion of the upper surface of the winding outer ring 311 serve as electrodes of the inductor 30.

[0062] The present invention also provides another method for forming an inductor, comprising: providing a magnetic core having an opening; forming a winding outer ring wrapping the magnetic core, the upper surface of the magnetic core being exposed by the winding outer ring; and forming a winding center column located in the magnetic core opening.

[0063] Figures 4a-4d Cross-sectional views of various stages of a second method for forming an inductor provided by an embodiment of the present invention.

[0064] Specifically, if Figure 4a As shown, a magnetic core is provided, the magnetic core having an opening 401; an air gap 402 is formed in the magnetic core, the air gap extending from the upper surface to the lower surface of the magnetic core, wherein the upper surface and the lower surface of the magnetic core are opposite to each other. The air gap may include multiple air gaps, which can be formed on each side of the magnetic core to form a distributed air gap.

[0065] like Figure 4b As shown, the magnetic core is encapsulated with a packaging material to form a first encapsulation body 403. Then, copper is plated on all surfaces of the first encapsulation body except the upper surface to form the outer winding ring 404. The outer winding ring can also be set to other metal materials, not limited to copper.

[0066] like Figure 4c As shown, the upper surface of the first enclosure is punched to form an opening 405, and the opening 405 of the first enclosure coincides with the opening 401 of the magnetic core; wherein the diameter of the opening 405 of the first enclosure is not greater than the diameter of the opening 401 of the magnetic core, and preferably, the diameter of the opening 405 of the first enclosure is equal to the diameter of the opening 401 of the magnetic core.

[0067] like Figure 4d As shown, a winding center column 406 is formed in the opening 401 of the magnetic core through the opening 405 of the first enclosure. The winding center column 406 can be formed in the opening 401 of the magnetic core by electroplating metal, or by welding a machined metal column into the opening 401 of the magnetic core. The electroplating method can be to electroplating a solid copper column or to electroplating a metal layer only on the inner wall of the magnetic core opening to form a hollow copper column, which is not limited here.

[0068] The present invention also discloses a packaging module, comprising the aforementioned inductor and a chip, wherein the chip is located on the upper surface of the inductor, and the electrodes on the upper surface of the inductor are electrically connected to corresponding conductive protrusions on the chip.

[0069] The packaging module further includes an electrical connection layer for connecting the electrodes of the inductor and the conductive protrusions on the wafer, as well as pad pins for connecting the packaging module to an external circuit. The packaging module also includes an enclosure for encapsulating the inductor and the wafer, wherein the enclosure exposes the pad pins of the packaging module.

[0070] The present invention also discloses a method for forming the packaging module, including: encapsulating the inductor with a packaging material to form a first package, wherein the first package exposes the electrodes of the inductor; placing the chip on the upper surface of the first package, and electrically connecting the electrodes on the upper surface of the inductor to the corresponding conductive protrusions on the chip.

[0071] Figures 5a-5e Cross-sectional views of various stages of a method for forming a package module according to an embodiment of the present invention.

[0072] Specifically, if Figure 5a As shown, the inductor is encapsulated with a packaging material to form a first package 502, and the first package 502 exposes the electrode 501 of the inductor. In this embodiment, the electrode of the inductor is the upper surface of the winding column and the upper surface of at least a part of the outer ring of the winding in the above-mentioned inductor.

[0073] like Figure 5bAs shown, a metal layer 503, i.e., a metal boss, is electroplated on the electrode 501 of the inductor, and the chip 60 is placed on the upper surface of the first package. Preferably, the upper surface of the metal layer 503 is in the same plane as the upper surface of the chip 60. Specifically, in this embodiment, the active surface of the chip 60 includes a conductive protrusion 601, and the conductive protrusion 601 of the chip 60 is set away from the upper surface of the first package. Preferably, the upper surface of the metal layer 503 is in the same plane as the upper surface of the conductive protrusion 601. The back surface of the chip 60 is set on the upper surface of the first package 502 through an adhesive layer, and the active surface of the chip is opposite to the back surface. In other embodiments, the chip can also be set so that its conductive protrusion faces the upper surface of the first package, which is not limited here.

[0074] like Figure 5c As shown, the first package 502, the metal layer 503, and the chip 60 are encapsulated with an encapsulating material to form a second package 504. The second package exposes the upper surfaces of the metal layer 503 and the chip conductive protrusions 601. In other embodiments, the encapsulating material may be used to encapsulate only the metal layer 503 and the chip 60 to form a second package. The second package is located on the first package, and the second package exposes the upper surfaces of the metal layer and the chip conductive protrusions. This is not a limitation herein.

[0075] like Figure 5d As shown, an electrical connection layer 505 is formed through an electroplating process. The electrical connection layer contacts the upper surface of the metal layer and the upper surface of the conductive protrusions of the wafer to achieve electrical connection between the electrodes of the inductor and the conductive protrusions of the wafer. For example, when the package module is a power module, one of the electrodes of the inductor is connected to the connection intersection LX between two transistors on the wafer, and the other electrode is connected to the output voltage pin VOUT on the wafer. In addition, the arrangement of the electrode positions of the package module is also achieved through the electrical connection layer.

[0076] like Figure 5e As shown, the electrical connection layer is encapsulated with an encapsulating material to form a third encapsulating body, and the third encapsulating body exposes the upper surface of the electrical connection layer; then, metal is electroplated at the corresponding position (i.e., the electrode position) on the upper surface of the electrical connection layer to form the pad pin 506 of the packaging module, and finally, the pad pin of the packaging module is encapsulated with an encapsulating material to form a fourth encapsulating body, and the fourth encapsulating body exposes the upper surface of the pad pin of the packaging module for connection to an external circuit. In other embodiments, the third encapsulating body can also be selected to encapsulate the electrical connection layer and the second encapsulating body at the same time. The fourth encapsulating body can also be selected to encapsulate the pad pin of the packaging module and the third encapsulating body at the same time.

[0077] In this embodiment, the electroplating process may be an RDL (Redistribution Layer) process.

[0078] The package module proposed in this embodiment not only integrates the inductor into the IC packaging process, but also features a closed outer winding structure similar to a heat sink. When connected to the output voltage pins on a printed circuit board (PCB), the outer winding facilitates heat dissipation from the inductor, magnetic core, and chip to the PCB, thereby facilitating heat dissipation from the package module. Furthermore, due to the shielding effect of the outer winding, radiation from components within the package module does not interfere with external structures.

[0079] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention are intended to be within the scope of protection of the present invention.

Claims

1. An inductor, comprising: magnetic core, and The winding comprises an outer winding ring and a winding center column located inside the outer winding ring, wherein the outer winding ring is a closed structure with a top opening; The winding center column is surrounded by the magnetic core, and the magnetic core is wrapped by the winding outer ring, so that the upper surface of the magnetic core is exposed and the bottom surface of the winding center column contacts the bottom surface of the winding outer ring.

2. The inductor according to claim 1, wherein The winding center column is a column located inside the closed structure.

3. The inductor according to claim 1, wherein The winding center column does not contact the side wall of the closed structure, and a predetermined space is left between the winding center column and the side wall of the closed structure.

4. The inductor according to claim 3, wherein: The predetermined space is used to accommodate the magnetic core.

5. The inductor according to claim 1, wherein The magnetic core has an opening for accommodating the winding center leg.

6. The inductor according to claim 1, wherein The winding is made of metal material.

7. The inductor according to claim 1, wherein An air gap of the inductor is opened on the magnetic core.

8. The inductor according to claim 1, wherein The inductor includes at least one air gap.

9. The inductor according to claim 1, wherein: An air gap of the inductor extends from an upper surface of the magnetic core to a lower surface of the magnetic core, wherein the upper surface and the lower surface of the magnetic core are opposite to each other.

10. The inductor according to claim 1, wherein The upper surface of the winding center column is higher than the upper surface of the magnetic core so as to be used for winding output.

11. The inductor according to claim 1, wherein At least a portion of the upper surface of the outer ring of the winding is higher than the upper surface of the magnetic core for winding output.

12. The inductor according to claim 11, wherein: The remaining portion of the upper surface of the outer coil of the winding is in the same plane as the upper surface of the magnetic core.

13. The inductor according to claim 1, wherein The material of the magnetic core is ferrite or magnetic powder core material.

14. A method of forming an inductor, comprising: providing a magnetic core; forming a winding, the winding comprising a winding outer ring and a winding center post located inside the winding outer ring to form a winding structure, wherein the winding outer ring is a closed structure with a top opening; and Placing the magnetic core in the void portion of the winding structure, The winding center column is surrounded by the magnetic core, and the magnetic core is wrapped by the winding outer ring, so that the upper surface of the magnetic core is exposed and the bottom surface of the winding center column contacts the bottom surface of the winding outer ring.

15. The method according to claim 14, characterized in that The magnetic core is bonded to the bottom of the outer ring of the winding by glue.

16. The method according to claim 14, characterized in that The winding center column is a column located inside the closed structure, and the winding center column does not contact the side wall of the closed structure.

17. The method according to claim 14, characterized in that The magnetic core has an opening, and the opening is used to accommodate the winding center column.

18. A method of forming an inductor, comprising: Providing a magnetic core having an opening; forming an outer winding ring wrapping the magnetic core, wherein the upper surface of the magnetic core is exposed by the outer winding ring; and A winding center column is formed in the magnetic core opening, the winding outer ring is a closed structure with a top opening, and the bottom surface of the winding center column contacts the bottom surface of the winding outer ring.

19. The method according to claim 18, wherein the method of forming the outer coil of the winding comprises: Encapsulating the magnetic core with a packaging material to form a first encapsulation body; as well as Copper is plated on the other surfaces of the first enclosure except the upper surface to form the outer ring of the winding.

20. The method of claim 19, wherein forming the winding midship comprises: Punching an upper surface of the first encapsulation body to form an opening, wherein the opening of the first encapsulation body coincides with the opening of the magnetic core; The winding center leg is formed in the opening of the magnetic core.

21. The method according to claim 20, characterized in that A metal layer is electroplated in the opening of the magnetic core to form the winding center leg.

22. The method according to claim 20, characterized in that A machined metal post is welded into the opening of the magnetic core to form the winding center post.

23. The method according to claim 20, characterized in that The diameter of the opening of the first enclosure is not greater than the diameter of the opening of the magnetic core.

24. The method according to claim 18, wherein The method further includes forming a gap on at least one side of the magnetic core, the gap extending from the upper surface to the lower surface of the magnetic core, so as to form an air gap of the inductor.

25. A packaging module, comprising: The inductor according to any one of claims 1 to 13, and chip.

26. The packaging module according to claim 25, characterized in that The chip is located on the upper surface of the inductor, and the electrodes on the upper surface of the inductor are electrically connected to corresponding conductive protrusions on the chip.

27. A method for manufacturing a package module, comprising: Encapsulating the inductor according to any one of claims 1 to 13 with a packaging material to form a first encapsulation body, wherein the first encapsulation body exposes the electrode on the upper surface of the inductor; placing a wafer on the upper surface of the first package, The electrodes on the upper surface of the inductor are electrically connected to corresponding conductive protrusions on the wafer.

28. The method according to claim 27, characterized in that The conductive protrusions of the wafer are arranged away from the upper surface of the first package.

29. The method according to claim 27, characterized in that The conductive protrusions of the wafer are arranged to face the upper surface of the first package.

30. The method according to claim 28, wherein Before placing the wafer on the upper surface of the first package, the method further includes forming a metal layer on the exposed electrodes of the inductor.

31. The method according to claim 30, wherein The method of electrically connecting the electrodes on the upper surface of the inductor to the corresponding conductive bumps on the wafer includes: Encapsulating the metal layer and the chip with a packaging material to form a second package, wherein the second package exposes the upper surfaces of the metal layer and the conductive protrusion; forming an electrical connection layer on the second encapsulation body by an electroplating process to achieve electrical connection between the metal layer and the conductive protrusion; The electrical connection layer is encapsulated with a packaging material to form a third encapsulation body, wherein the third encapsulation body exposes the upper surface of the electrical connection layer.

32. The method according to claim 31, characterized in that The method further includes forming pad pins of the package module on the exposed electrical connection layer.

33. The method according to claim 32, characterized in that The method further includes encapsulating the pad pins with a packaging material to form a fourth package, wherein the upper surface of the pad pins is exposed by the fourth package to be connected to an external circuit.

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