Display device

Abstract

The present disclosure relates to a display device, comprising: a display panel; a cushion layer, the cushion layer being below the display panel; a heat sink, the heat sink being below the cushion layer; and a flexible circuit substrate, the flexible circuit substrate being electrically connected to the display panel and being bent toward a rear surface of the display panel. The display panel comprises a first region overlapping with the flexible circuit substrate in a direction perpendicular to the rear surface and a second region overlapping with the cushion layer. The cushion layer and the heat sink only overlap with the second region in a direction perpendicular to the rear surface.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2018-0145389 filed on November 22, 2018, in the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to a display device. Background Art

[0004] The display device includes a display panel, a flexible circuit substrate, and a frame. The flexible circuit substrate is electrically connected to the display panel and is bent toward the rear surface of the display panel. A driving device in the flexible circuit substrate is located in an opening or a container area defined in the frame. In the case where the opening or the container area is formed therein, the thickness of the frame may be reduced, which may cause degradation or reduction in the durability of the display device. Summary of the invention

[0005] Embodiments of the inventive concept provide a display device having a reduced thickness.

[0006] According to an embodiment of the present invention, a display device may include: a display panel; a pad layer, the pad layer is below the display panel; a heat sink, the heat sink is below the pad layer; and a flexible circuit substrate, the flexible circuit substrate is electrically connected to the display panel and is bent toward the rear surface of the display panel. The display panel may include a first area overlapping with the flexible circuit substrate in a direction perpendicular to the rear surface and a second area overlapping with the pad layer. The pad layer and the heat sink may overlap only with the second area in a direction perpendicular to the rear surface.

[0007] In an embodiment, the display device may further include an embossing layer between the display panel and the cushion layer. The embossing layer may overlap the first region and the second region in a direction perpendicular to the rear surface.

[0008] In an embodiment, the embossed layer may have two opposing surfaces, each of the opposing surfaces having adhesive properties.

[0009] In an embodiment, the flexible circuit substrate and the pad layer may be attached to a bottom surface of the printed layer.

[0010] In an embodiment, the display device may further include an electromagnetic shielding member between the printed layer and the flexible circuit substrate.

[0011] In an embodiment, a side surface of the electromagnetic shielding member may face a side surface of the cushion layer.

[0012] In an embodiment, the flexible circuit substrate and the electromagnetic shield may be attached to a bottom surface of the printed layer.

[0013] In an embodiment, a side surface of the pad layer may face a side surface of the flexible circuit substrate.

[0014] In an embodiment, the pad layer and the flexible circuit substrate may be spaced apart from each other in a direction parallel to the rear surface, and the heat sink and the flexible circuit substrate may be spaced apart from each other in a direction parallel to the rear surface.

[0015] In an embodiment, the display device may further include a frame under the heat sink, wherein an area of ​​the frame overlapping with the first area in a direction perpendicular to the rear surface has a first thickness, and an area of ​​the frame overlapping with the second area in a direction perpendicular to the rear surface has a second thickness less than the first thickness. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Example embodiments will be more clearly understood from the following brief description taken in conjunction with the accompanying drawings.The accompanying drawings represent non-limiting example embodiments as described herein.

[0017] Figure 1 is a perspective view illustrating a display device according to an embodiment of the inventive concept.

[0018] Figure 2 is a schematic cross-sectional view illustrating a display device according to an embodiment of the inventive concept.

[0019] Figure 3 is a cross-sectional view illustrating a display panel according to an embodiment of the inventive concept.

[0020] Figure 4 is a cross-sectional view illustrating a display device according to an embodiment of the inventive concept.

[0021] Figure 5 is a rear view of a display device exemplarily illustrating some elements of the display device according to an embodiment of the inventive concept.

[0022] Figure 6 is a cross-sectional view illustrating a display device according to an embodiment of the inventive concept.

[0023] Figure 7 is a cross-sectional view illustrating a display device according to an embodiment of the inventive concept.

[0024] These drawings are intended to illustrate the general characteristics of the methods, structures and / or materials utilized in certain example embodiments, and are intended to supplement the written description provided below. However, these drawings may not be to scale and may not accurately reflect the precise structure or performance characteristics of any given embodiment, and may not be interpreted as defining or limiting the range of values ​​or performances contained by the example embodiments. For example, the relative thickness and positioning of molecules, layers, regions and / or structural elements may be reduced or exaggerated for clarity. The use of similar or identical reference numerals in the various drawings is intended to indicate the presence of similar or identical elements or features. DETAILED DESCRIPTION

[0025] Example embodiments of the present invention will now be more fully described with reference to the accompanying drawings in which example embodiments are shown. However, example embodiments of the present invention can be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein; rather, these embodiments are provided so that the present disclosure will be sufficient and complete, and these embodiments fully convey the concepts of the example embodiments to those of ordinary skill in the art. In the accompanying drawings, the thickness of layers and regions is exaggerated for clarity. Like reference numerals in the drawings represent like elements, and therefore their description will be omitted.

[0026] It will be understood that when an element is referred to as being "connected" or "coupled" to another element, the element may be directly connected to or directly coupled to another element, or there may be an intermediate element. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there is no intermediate element. Other words used to describe the relationship between an element or layer should be interpreted in a similar manner (e.g., "between" versus "directly between", "adjacent" versus "directly adjacent", "on" versus "directly on"). The same mark always indicates the same element. As used herein, the term "and / or" includes any and all combinations of one or more related listed items.

[0027] It will be understood that, although the terms "first", "second", etc. may be used herein to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer or part discussed below may be referred to as a second element, component, region, layer or part.

[0028] For ease of description, spatially relative terms such as "under," "below," "below," "above," "on," and the like may be used herein to describe the relationship of one element or feature to another (multiple) element or feature (multiple features) as shown in the figure. It will be understood that, in addition to the orientations depicted in the accompanying drawings, spatially relative terms are intended to encompass different orientations of the device in use or operation. For example, if the device in the accompanying drawings is flipped, an element described as "under" or "below" other elements or features will subsequently be positioned "above" the other elements or features. Thus, the exemplary term "under" may include both above and below orientations. In addition, the device may be positioned otherwise (e.g., rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein may be interpreted accordingly.

[0029] The terms used herein are only used to describe specific embodiments and are not intended to limit the exemplary embodiments. Unless the context clearly indicates otherwise, as used herein, the singular forms "a", "a", and "the" are also intended to include plural forms. It will be further understood that if the terms "include", "comprise", "contain", and / or "have" are used in this article, the stated features, wholes, steps, operations, elements, and / or components are indicated, but the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or their groups are not excluded.

[0030] Herein, example embodiments of the inventive concept will be described with reference to cross-sectional views that are schematic diagrams of idealized embodiments (and intermediate structures) of the example embodiments. As such, variations in the shapes of the illustrations, such as those caused by manufacturing techniques and / or tolerances, can be expected. Therefore, example embodiments of the inventive concept should not be construed as limited to the particular shapes of the regions shown herein, but will include deviations in shapes, such as those caused by manufacturing.

[0031] Unless otherwise defined, all terms used herein (including, for example, technical and scientific terms) have the same meaning as commonly understood by a person of ordinary skill in the art to which the exemplary embodiments of the inventive concept belong. It will be further understood that, unless explicitly defined as such herein, terms (such as those defined in general dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formalized sense.

[0032] The terms used herein are for the purpose of describing specific embodiments only and are not intended to limit the inventive concept. As used herein, the terms "substantially," "approximately," and the like are used as terms of approximation, rather than as terms of degree, and are intended to take into account the inherent deviations in measurements or calculations that will be recognized by those of ordinary skill in the art.

[0033] Any numerical range described herein is intended to include all sub-ranges of the same numerical precision included in the described range. For example, the range of "1.0 to 10.0" is intended to include all sub-ranges between the described minimum value 1.0 and the described maximum value 10.0 (and including the described minimum value 1.0 and the described maximum value 10.0), that is, having a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0, such as, for example, 2.4 to 7.6. Any maximum numerical limit described herein is intended to include all lower numerical limits included herein, and any minimum numerical limit described in this specification is intended to include all higher numerical limits included herein.

[0034] Figure 1 is a perspective view illustrating a display device according to an embodiment of the inventive concept.

[0035] Reference Figure 1 , the display device DD can be activated by an electrical signal. The display device DD can be used to implement various electronic devices. For example, the display device DD can be used in large electronic devices (e.g., televisions, monitors, and outdoor billboards) or small or medium-sized electronic devices (e.g., personal computers, notebook computers, personal digital assistants, car navigation systems, game consoles, portable electronic devices, and cameras). However, it should be understood that these are merely examples of the inventive concept, and other electronic devices can be used to implement the inventive concept as long as they do not depart from the inventive concept. In this embodiment, as Figure 1 As shown, the display device DD may be a smart phone.

[0036] The display device DD can display an image IM, which is displayed on a display surface IS parallel to the first direction DR1 and the second direction DR2, and the image IM is provided toward a third direction DR3. The display surface IS for displaying the image IM may correspond to the front surface of the display device DD and the front surface of the window layer WP. Hereinafter, all of the display surface or front surface IS of the display device DD and the front surface of the window layer WP may be the same surface. The image IM may be a video image (e.g., a dynamic image) or a still image. As an example of the image IM, Figure 1 The clock window and icon are shown in FIG.

[0037] In this embodiment, the front surface or top surface and the rear surface or bottom surface of each element can be defined based on the display direction of the image IM. The front surface and the rear surface can be opposite to each other in the third direction DR3, and the direction orthogonal to each of the front surface and the rear surface can be parallel to the third direction DR3.

[0038] In the present specification, the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 may be relative concepts, and in an embodiment, the directions may be used to indicate other directions. Hereinafter, the first direction to the third direction may be directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3, respectively, and will be represented by the same reference numerals. In the present specification, the surface defined by the first direction DR1 and the second direction DR2 may be referred to as a "plane", and the expression "when viewed in a plan view" may mean viewing an object to be described there from a direction perpendicular to the plane.

[0039] The housing EDC together with the window layer WP may define the appearance of the display device DD. Although the housing EDC is shown as a single body, the housing EDC may include a plurality of bodies assembled to each other. For example, the housing EDC may include a plurality of frames and / or plates, each of which is formed of at least one of glass, plastic, and metal materials.

[0040] The front surface of the display device DD may be divided into (e.g., may include) a transmissive area TA and a frame area BZA. The front surface of the display device DD may be substantially defined by the front surface IS of the window layer WP. The window layer WP may include a transmissive area TA and a frame area BZA. Hereinafter, the front surface of the display device DD and the front surface of the window layer WP may be represented by the same reference numeral IS.

[0041] Figure 2 is a schematic cross-sectional view illustrating a display device according to an embodiment of the inventive concept.

[0042] Reference Figure 2 In addition to the window layer WP, the display device DD may further include an adhesive layer OCA, an anti-reflection layer RPP, an input sensing layer SU, a display panel DP, a printing layer EB, a cushion layer CSH, a heat sink HP, and a frame BRK.

[0043] The window layer WP may define the appearance of the display device DD. The window layer WP may protect the internal elements of the display device DD from external impacts, and may be an element that generally provides the display surface IS of the display device DD. For example, the window layer WP may include a glass substrate, a sapphire substrate, and / or a plastic film. The window layer WP may have a single-layer or multi-layer structure. For example, the window layer WP may have a stacked structure including a plurality of plastic films bonded to each other by an adhesive layer, or may have a stacked structure including a glass substrate and a plastic film bonded to each other by an adhesive layer.

[0044] The adhesive layer OCA (e.g., the first OCA) may be located below the window layer WP. The window layer WP and the anti-reflection layer RPP may be bonded to or joined to each other through the adhesive layer OCA. The adhesive OCA may include various adhesives or viscous materials. For example, the adhesive layer OCA may include an optically transparent adhesive film, an optically transparent resin, or a pressure-sensitive adhesive film.

[0045] The anti-reflection layer RPP may be located below the window layer WP. The anti-reflection layer RPP may reduce the reflectivity of natural light or sunlight incident on the window layer WP from an external space (e.g., an external source). In an embodiment, the anti-reflection layer RPP may include a phase retarder and a polarizer. The phase retarder may be a film type or a liquid crystal coating type, and may include a λ / 2 and / or λ / 4 phase retarder. The polarizer may be a film type or a liquid crystal coating type. A film-type polarizer may include an extended synthetic resin film, however, a liquid crystal coating type polarizer may include liquid crystals arranged in a specific orientation. In addition to the phase retarder and the polarizer, the anti-reflection layer RPP may further include a protective film. At least one of the phase retarder, the polarizer, and the protective film may be used as a base layer of the anti-reflection layer RPP.

[0046] The adhesive layer OCA (eg, second OCA) may be located below the anti-reflection layer RPP. The anti-reflection layer RPP and the input sensing layer SU may be bonded or joined to each other through the adhesive layer OCA.

[0047] The input sensing layer SU may acquire coordinate information about an external input. In an embodiment, the input sensing layer SU may be directly located on the surface of the display panel DP. For example, the input sensing layer SU may be integrated on the display panel DP in an on-cell manner. The input sensing layer SU may be part of the display panel DP and may be manufactured during the process of manufacturing the display panel DP. However, the inventive concept is not limited to this example, and in an embodiment, the input sensing layer SU may be manufactured by a separate process and may be attached to the display panel DP. The input sensing layer SU may include a touch panel.

[0048] The display panel DP may be located below the input sensing layer SU. The display panel DP may be a light receiving display panel or a light emitting display panel. The light receiving display panel may be, for example, a liquid crystal display panel. The light emitting display panel may be, for example, an organic light emitting display panel or a quantum dot light emitting display panel. The light emitting layer of the organic light emitting display panel may include an organic light emitting material. The light emitting layer of the quantum dot light emitting display panel may include quantum dots and / or quantum rods. The following description refers to an example in which the display panel DP is an organic light emitting display panel. The display panel DP may include a base layer BS, a circuit element layer ML, a display element layer IML, and a thin encapsulation layer TFE.

[0049] The printing layer EB may be located below the display panel DP. The printing layer EB may have a specific color. For example, the printing layer EB may be black. The printing layer EB may absorb light to be incident on the printing layer EB. The printing layer EB may have a layer having adhesive properties on its opposite surface. The printing layer EB may be formed of one or more of various suitable adhesives and / or viscous materials, or may include one or more of various suitable adhesives and / or viscous materials. The display panel DP and the cushion layer CSH may be coupled or combined with each other through the printing layer EB.

[0050] The cushion layer CSH may be located below the embossing layer EB. The cushion layer CSH may have a function of reducing the pressure applied from the frame BRK. The cushion layer CSH may be formed of sponge, blown foam, polyurethane resin and / or any other suitable material, or may include sponge, blown foam, polyurethane resin and / or any other suitable material. The cushion layer CSH may be thicker than the embossing layer EB.

[0051] The heat sink HP may be located below the cushion layer CSH. The heat sink HP may block noise generated from the display panel DP and may help to discharge heat from the display panel DP. For example, the heat sink HP may be a copper (Cu) sheet. However, the inventive concept is not limited to this example, and the heat sink HP may include one or more of various suitable layers. For example, the heat sink HP may be a graphite sheet. In an embodiment, the stacking order of the cushion layer CSH and the heat sink HP may be changed.

[0052] The frame BRK may be located below the heat sink HP. The frame BRK may accommodate the adhesive layer OCA, the anti-reflection layer RPP, the input sensing layer SU, the display panel DP, the embossing layer EB, the cushion layer CSH, and the heat sink HP. The frame BRK may provide a space for accommodating other components or elements. The frame BRK may include a metal or plastic member. Although in Figure 2 Although one frame BRK is exemplarily shown in FIG. 1 , the display device DD may include a plurality of frames BRK.

[0053] Figure 3 is a cross-sectional view illustrating a display panel (eg, DP) according to an embodiment of the inventive concept.

[0054] like Figure 3 As shown, the circuit element layer ML, the display element layer IML and the thin encapsulation layer TFE may be sequentially arranged on the base layer BS.

[0055] The base layer BS may include a synthetic resin layer. The synthetic resin layer may be formed or positioned on a working substrate for manufacturing the display panel DP. Thereafter, a conductive layer, an insulating layer, etc. may be formed or positioned on the synthetic resin layer. If the working substrate is removed, the synthetic resin layer may be used as the base layer BS. The synthetic resin layer may include at least one thermosetting resin. The synthetic resin layer may be a polyimide-based resin layer, and the inventive concept is not limited to a specific material of the base layer BS. In addition, the base layer BS may include a glass substrate, a metal substrate, and / or an organic / inorganic composite substrate.

[0056] In the present embodiment, the circuit element layer ML may include a buffer layer BFL as an inorganic layer, a first intermediate inorganic layer 10 and a second intermediate inorganic layer 20, and an intermediate organic layer 30 as an organic layer. The inventive concept is not limited to specific materials of the inorganic layer and the organic layer, and the buffer layer BFL may be optional depending on the structure of the circuit element layer ML.

[0057] The first semiconductor pattern OSP1 of the first transistor T1 and the second semiconductor pattern OSP2 of the second transistor T2 may be on the buffer layer BFL. The first semiconductor pattern OSP1 and the second semiconductor pattern OSP2 may be formed of or may include at least one of amorphous silicon, polycrystalline silicon, and metal oxide semiconductor materials.

[0058] The first intermediate inorganic layer 10 may be on the first semiconductor pattern OSP1 and the second semiconductor pattern OSP2 . The first control electrode GE1 of the first transistor T1 and the second control electrode GE2 of the second transistor T2 may be on the first intermediate inorganic layer 10 .

[0059] The second intermediate inorganic layer 20 may be on the first intermediate inorganic layer 10 to cover the first and second control electrodes GE1 and GE2 . The first input electrode DE1 and the first output electrode SE1 of the first transistor T1 and the second input electrode DE2 and the second output electrode SE2 of the second transistor T2 may be on the second intermediate inorganic layer 20 .

[0060] The first input electrode DE1 and the first output electrode SE1 may be connected to two different portions of the first semiconductor pattern OSP1 through the first through hole CH1 and the second through hole CH2, respectively. The first through hole CH1 and the second through hole CH2 penetrate the first intermediate inorganic layer 10 and the second intermediate inorganic layer 20. The second input electrode DE2 and the second output electrode SE2 may be connected to two different portions of the second semiconductor pattern OSP2 through the third through hole CH3 and the fourth through hole CH4, respectively. The third through hole CH3 and the fourth through hole CH4 penetrate the first intermediate inorganic layer 10 and the second intermediate inorganic layer 20. In an embodiment, at least one of the first transistor T1 and the second transistor T2 may have a bottom gate structure.

[0061] The intermediate organic layer 30 may be on the second intermediate inorganic layer 20 to cover the first input electrode DE1, the second input electrode DE2, the first output electrode SE1, and the second output electrode SE2. The intermediate organic layer 30 may provide a flat surface.

[0062] The display element layer IML may be on the intermediate organic layer 30. The display element layer IML may include a pixel defining layer PDL and an organic light emitting diode OLED. The pixel defining layer PDL may be formed of an organic material, or may include an organic material. The first electrode AE ​​may be on the intermediate organic layer 30. The first electrode AE ​​may be connected to the second output electrode SE2 through a fifth through hole CH5 that penetrates the intermediate organic layer 30. An opening OP may be defined in the pixel defining layer PDL. The opening OP of the pixel defining layer PDL may expose at least a portion of the first electrode AE. In an embodiment, the pixel defining layer PDL may be optional.

[0063] In an embodiment, the light emitting region PXA may overlap at least one of the first transistor T1 and the second transistor T2. The opening OP may be provided to have an increased width, and each of the first electrode AE ​​and the light emitting layer EML may be provided to have an increased width.

[0064] The hole control layer HCL may be located in both the light emitting area PXA and the non-light emitting area NPXA. The light emitting layer EML may be on the hole control layer HCL. The light emitting layer EML may be on a region corresponding to the opening OP. The light emitting layer EML may be formed of an organic material and / or an inorganic material, or may include an organic material and / or an inorganic material. The light emitting layer EML may generate light of a specific color.

[0065] The electron control layer ECL may be on the light emitting layer EML. The second electrode CE may be on the electron control layer ECL.

[0066] The thin encapsulation layer TFE may be on the second electrode CE. The thin encapsulation layer TFE may cover the second electrode CE. The cover layer may be further located between the thin encapsulation layer TFE and the second electrode CE to cover the second electrode CE. Here, the thin encapsulation layer TFE may directly cover the cover layer.

[0067] Figure 4 is a cross-sectional view showing a display device according to an embodiment of the inventive concept, and Figure 5 1 is a rear view of a display device exemplarily showing some elements of a display device according to an embodiment of the present invention. In order to reduce the complexity of the drawings and to provide a better understanding of the present invention, Figure 5 Only the display panel DP, the cushion layer CSH and the flexible circuit substrate FP are shown.

[0068] Reference Figure 4 and Figure 5 The display device DD may include a window layer WP, an adhesive layer OCA, an anti-reflection layer RPP, an input sensing layer SU, a display panel DP, a printing layer EB, a flexible circuit substrate FP, a cushion layer CSH, a heat sink HP and a frame BRK.

[0069] The anti-reflection layer RPP may be located below the window layer WP. The window layer WP and the anti-reflection layer RPP may be bonded to or joined to each other through an adhesive layer OCA. In an embodiment, the anti-reflection layer RPP may be optional. The input sensing layer SU may be located below the anti-reflection layer RPP. The anti-reflection layer RPP and the input sensing layer SU may be bonded to or joined to each other through an adhesive layer OCA. The display panel DP may be located below the input sensing layer SU. The display panel DP may include an organic light-emitting display panel. The display panel DP may include a first area DP-1 and a second area DP-2 adjacent to the first area DP-1. The first area DP-1 may overlap with the flexible circuit substrate FP in a direction perpendicular to the rear surface. The second area DP-2 may overlap with the cushion layer CSH in a direction perpendicular to the rear surface.

[0070] The embossing layer EB may be located under the display panel DP. The embossing layer EB may overlap the first area DP-1 and the second area DP-2 in a direction perpendicular to the rear surface. The embossing layer EB may have two opposite surfaces having adhesive properties.

[0071] The flexible circuit substrate FP may be connected to the display panel DP. For example, the flexible circuit substrate FP may be electrically connected to the circuit element layer ML (eg, see FIG. 5 ) of the display panel DP. Figure 2). The flexible circuit substrate FP may be bent toward the rear surface of the display panel DP and may include a portion located below the printed layer EB. The flexible circuit substrate FP and the rear surface of the display panel DP may be bonded or joined to each other through the printed layer EB. The flexible circuit substrate FP may overlap the first area DP-1 in a direction perpendicular to the rear surface.

[0072] The driving device P may be located below the flexible circuit substrate FP. The driving device P may output image signals and driving signals required for displaying an image. The driving device P may be electrically connected to a conductive pattern located in an area of ​​the flexible circuit substrate FP. The image signal and the driving signal as output signals from the driving device P may be transmitted to the display panel DP through the flexible circuit substrate FP. Figure 4 An example is shown in which one driving device P is located on the flexible circuit substrate FP, but the inventive concept is not limited to this example. In an embodiment, a plurality of driving devices required to display an image may be on the flexible circuit substrate FP.

[0073] The pad layer CSH may be located below the embossing layer EB. The heat sink HP may be located below the pad layer CSH. The pad layer CSH and the heat sink HP may overlap only the second region DP-2 in a direction perpendicular to the rear surface. In other words, the pad layer CSH and the heat sink HP may not overlap the first region DP-1 in a direction perpendicular to the rear surface.

[0074] The flexible circuit substrate FP and the cushion layer CSH may not overlap each other in a direction perpendicular to the rear surface. The flexible circuit substrate FP and the cushion layer CSH may be located below the printed layer EB. The flexible circuit substrate FP and the heat sink HP may not overlap each other in a direction perpendicular to the rear surface. The side surface FP-S of the flexible circuit substrate FP may face the side surface CSH-S of the cushion layer CSH. The flexible circuit substrate FP and the cushion layer CSH may be spaced apart from each other in the second direction DR2. The flexible circuit substrate FP and the heat sink HP may be spaced apart from each other in the second direction DR2.

[0075] The frame BRK may be located below the heat sink HP. The frame BRK and the heat sink HP may be bonded to each other by a first adhesive tape TP-1. However, the inventive concept is not limited to this example, and in an embodiment, the first adhesive tape TP-1 may be optional.

[0076] In addition, the frame BRK can be bonded to the window layer WP to accommodate the adhesive layer OCA, the anti-reflection layer RPP, the input sensing layer SU, the display panel DP, the embossing layer EB, the flexible circuit substrate FP, the cushion layer CSH and the heat sink HP. The frame BRK and the window layer WP can be bonded to each other by the second adhesive tape TP-2. The frame BRK can be spaced apart from the flexible circuit substrate FP and the driving device P in the third direction DR3.

[0077] According to an embodiment of the inventive concept, the frame BRK may include a flat surface BRK1. The heat sink HP and the cushion layer CSH may not be located between the display panel DP and the flexible circuit substrate FP, and thus the thickness of the display device DD may be reduced. Therefore, in order to reduce the thickness of the display device DD, the frame BRK may not provide an opening or a container area for accommodating the driving device P. Since the frame BRK has a uniform thickness, it is possible to improve the durability of the display device DD.

[0078] Figure 6 2 is a cross-sectional view showing a display device according to an embodiment of the inventive concept. Figure 4 and Figure 5 Described elements may be identified by the same reference numerals without repeating their overlapping descriptions.

[0079] Reference Figure 6 , the display device DD-1 may further include an electromagnetic shielding member EMI. The electromagnetic shielding member EMI may be located below the printed layer EB. The display panel DP and the electromagnetic shielding member EMI may be bonded or joined to each other through the printed layer EB. The electromagnetic shielding member EMI may overlap with the first area DP-1 in a direction perpendicular to the rear surface.

[0080] The flexible circuit substrate FP may be electrically connected to the display panel DP and may be bent toward the rear surface of the display panel DP to include a portion located below the electromagnetic shielding member EMI. The side surface EMI-S of the electromagnetic shielding member EMI may face the side surface CSH-S of the cushion layer CSH. The electromagnetic shielding member EMI may not overlap with the cushion layer CSH in a direction perpendicular to the rear surface. The electromagnetic shielding member EMI may not overlap with the heat sink HP in a direction perpendicular to the rear surface.

[0081] Figure 7 2 is a cross-sectional view showing a display device according to an embodiment of the inventive concept. Figure 4 and Figure 6 Described elements may be identified by the same reference numerals without repeating their overlapping descriptions.

[0082] Reference Figure 7, the display device DD-2 may include a window layer WP, an adhesive layer OCA, an anti-reflection layer RPP, an input sensing layer SU, a display panel DP, a printed layer EB, a flexible circuit substrate FP, a cushion layer CSH, a heat sink HP, and a frame BRK-1. The frame BRK-1 may include at least a portion having a stepped portion. The frame BRK-1 overlapping the first region DP-1 may have a first thickness BRK-11. The frame BRK-1 overlaps the second region DP-2 and may have a second thickness BRL-12. The first thickness BRK-11 may be greater than the second thickness BRL-12. The frame BRK-1 may be spaced apart from the flexible circuit substrate FP and the driving device P in the third direction DR3.

[0083] According to an embodiment of the inventive concept, the heat sink HP and the cushion layer CSH may not be located between the display panel DP and the flexible circuit substrate FP, and therefore, the thickness of the display device DD-2 may be reduced. The thickness of a portion of the frame BRK may be increased. Due to such an increase in the thickness of the frame BRK, it is possible to increase the rigidity or mechanical strength of the frame BRK. Therefore, a display device DD-2 with improved durability may be provided.

[0084] According to an embodiment of the present invention, a display device may include a display panel, a cushion layer located below the display panel, and a flexible circuit substrate electrically connected to the display panel and bent toward the rear surface of the display panel. The flexible circuit substrate may not overlap with the cushion layer in a direction perpendicular to the rear surface. Therefore, the cushion layer may not be located between the flexible circuit substrate and the display panel, and thus, the thickness of the display device may be reduced.

[0085] While example embodiments of the inventive concepts have been particularly shown and described, it will be understood by those skilled in the art that changes in form and details may be made therein without departing from the spirit and scope of the disclosure and its equivalents.

Claims

1. A display device, wherein: The display device comprises: Display panel; A cushion layer, the cushion layer being below the display panel; a heat sink, the heat sink being below the cushion layer; a flexible circuit substrate electrically connected to the display panel and bent toward a rear surface of the display panel; and frame, beneath the heat sink, wherein the display panel includes a first area overlapping with the flexible circuit substrate and a second area overlapping with the cushion layer in a direction perpendicular to the rear surface, and wherein the pad layer and the heat sink only overlap with the second region in the direction perpendicular to the rear surface, wherein a region of the frame overlapping the first region in the direction perpendicular to the rear surface has a first thickness, and A region of the frame overlapping the second region in the direction perpendicular to the rear surface has a second thickness that is smaller than the first thickness.

2. The display device according to claim 1, wherein: The display device further includes a printed layer between the display panel and the cushion layer, The embossed layer overlaps the first region and the second region in the direction perpendicular to the rear surface.

3. The display device according to claim 2, wherein: The embossed layer has two opposing surfaces, each of the opposing surfaces having adhesive properties.

4. The display device according to claim 2, wherein: The flexible circuit substrate and the pad layer are attached to a bottom surface of the printed layer.

5. The display device according to claim 2, wherein: The display device further includes: An electromagnetic shield is provided between the printed layer and the flexible circuit substrate.

6. The display device according to claim 5, wherein: A side surface of the electromagnetic shielding member faces a side surface of the cushion layer.

7. The display device according to claim 5, wherein: The flexible circuit substrate and the electromagnetic shield are attached to a bottom surface of the printed layer.

8. The display device according to claim 1, wherein: A side surface of the pad layer faces a side surface of the flexible circuit substrate.

9. The display device according to claim 1, wherein: In a direction parallel to the rear surface, the pad layer and the flexible circuit substrate are spaced apart from each other, and the heat sink and the flexible circuit substrate are spaced apart from each other.

Images