Heat conducting device and processing method thereof

Abstract

This application discloses a heat conduction device and a processing method thereof. The heat conduction device comprises: a main body component having a sealable inner cavity capable of accommodating a medium and allowing the medium to flow within the inner cavity while carrying heat; wherein the surface surrounding the inner cavity is a concave-convex surface with a height difference, multiple portions of the concave-convex surface have the height difference, and microchannels for conducting the medium are provided in the portions with the height difference. This heat conduction device structure not only ensures good fluidity of the medium but also increases the maximum heat storage capacity, thus providing the heat conduction device with multiple advantages and significantly improving the heat conduction effect of the heat conduction device.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a heat conducting device. The present application also relates to a processing method of the heat conducting device. Background Art

[0002] Currently, electronic devices such as laptop computers often use thermal conductive devices to transfer heat generated inside the electronic devices to the outside of the electronic devices for more timely and sufficient dissipation. However, the thermal conductivity of existing thermal conductive devices is not ideal, which affects the improvement of the heat dissipation performance of electronic devices. Summary of the Invention

[0003] In view of this, the present application provides a heat conducting device, the heat conducting effect of which is significantly improved.

[0004] In order to achieve the above objectives, this application provides the following technical solutions:

[0005] A heat conducting device, comprising:

[0006] a main body component having a closable inner cavity capable of accommodating a medium and allowing the medium to flow in the inner cavity while carrying heat;

[0007] The surface surrounding the inner cavity is a concave-convex surface with a height difference, multiple parts of the concave-convex surface have the height difference, and microchannels for guiding the medium are provided on the parts with the height difference.

[0008] Preferably, in the above-mentioned heat-conducting device, the main component is a tubular component, the first end of the tubular component contacts the heating element, and the second end opposite to the first end contacts the heat dissipation element, and the medium circulates between the first end and the second end to transfer heat from the first end to the second end.

[0009] Wherein, a plurality of protrusions protruding from the inner wall are connected to the inner wall of the tubular member, the surface of the inner wall of the tubular member and the surface of the protrusions constitute the concave-convex surface, and there is the height difference between the protruding ends of the protrusions and the inner wall of the tubular member.

[0010] Preferably, in the above heat conduction device, the protrusion is a solid piece composed of metal powder, so that the protrusion has microporous channels;

[0011] The protrusions are strip-shaped pieces extending along the axial direction of the tubular piece, and a plurality of the protrusions are spaced apart in the circumferential direction of the tubular piece so that any two adjacent protrusions and the inner wall of the tubular piece can form a groove for guiding the medium.

[0012] Preferably, in the above-mentioned heat-conducting device, the strip-shaped protrusion extends parallel to the axis of the tubular member so that the groove is a parallel groove parallel to the tubular member, or the strip-shaped protrusion extends around the axis of the tubular member so that the groove is a spiral groove around the axis of the tubular member.

[0013] Preferably, in the above-mentioned heat-conducting device, the main body component has a first surface and a second surface arranged opposite to each other, the first surface is a heating contact surface in contact with the heating element, and the second surface is a heat dissipation contact surface in contact with the heat dissipation element, and the medium circulates between the first surface and the second surface to transfer heat from the heating contact surface to the heat dissipation contact surface.

[0014] Preferably, in the above heat conduction device, the main body component includes a first groove-shaped member having the first surface and a second groove-shaped member having the second surface, and the first groove-shaped member and the second groove-shaped member enclose the inner cavity;

[0015] Wherein, a plurality of protrusions are provided on the bottom wall of the groove of the first groove-shaped member, the surface of the bottom wall of the groove and the surface of the protrusions constitute the concave-convex surface, and there is the height difference between the protruding ends of the protrusions and the inner wall of the groove.

[0016] A method for processing a heat conducting device, comprising:

[0017] Processing to obtain the main components;

[0018] A concave-convex surface with microchannels is formed on the main body component, wherein the main body component has a closable inner cavity, and the inner cavity can accommodate a medium and enable the medium to flow in the inner cavity, and the surface surrounding the inner cavity is set as the concave-convex surface with a height difference, and the height difference is set at multiple locations of the concave-convex surface, and the microchannels for guiding the medium are set at the locations with the height difference.

[0019] Preferably, the processing method of the above-mentioned heat conducting device includes:

[0020] First, forming the concave-convex surface on the main body component, and then forming the microchannel on the concave-convex surface;

[0021] Alternatively, while forming the concave-convex surface on the main body component, the microchannel is formed on the concave-convex surface;

[0022] Alternatively, the microchannel is first formed on the protruding member, and then the protruding member with the microchannel is arranged on the main body component to form the concave-convex surface.

[0023] Preferably, the processing method of the above-mentioned heat conducting device includes:

[0024] Processing to obtain the tubular main body component;

[0025] The metal powder is sintered to obtain a protruding piece connected to the main body component and having the microchannel, so that the surface of the main body component forms the concave-convex surface.

[0026] Preferably, the processing method of the above-mentioned heat conducting device includes:

[0027] Processing to obtain the plate-shaped main body component;

[0028] Etching the main body component to obtain a protruding piece connected to the main body component, so as to form the concave-convex surface on the main body component;

[0029] The microchannel is formed on the protruding piece by micro-electromechanical machining.

[0030] The heat conducting device provided herein has a main body component having an inner cavity that can be filled with a medium and allowed to flow therein. By flowing in the inner cavity, the medium can transfer the heat it carries between different components of the main body component. The surface of the main body component surrounding the inner cavity (this surface is the inner surface of the main body component) is a concave-convex surface with a height difference, and multiple portions of the concave-convex surface have a height difference. This allows grooves to be formed on the surface of the inner cavity for the liquid medium to flow, thus providing the heat conducting device with better medium fluidity, thereby enabling the heat conducting device to achieve more timely and rapid heat transfer. Microchannels are also provided in these portions with the height difference. These microchannels constitute a capillary structure. When the liquid medium flows in the microchannels, the capillary force causes the medium to overcome gravity and flow in a direction opposite to gravity. This not only satisfies the need for heat dissipation from a higher heat source to the bottom, but also allows the capillary force to cause the medium to fill the capillary structure (i.e., fill all the microchannels), thereby allowing the heat conducting device to absorb more heat and increase its maximum heat storage capacity. The heat conducting device with this structure can increase the maximum heat storage while ensuring good fluidity of the medium, so that the heat conducting device has multiple advantages and the heat conducting effect of the heat conducting device is significantly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without any creative work.

[0032] Figure 1A schematic structural diagram of a main body component of a first preferred structure of a heat conducting device provided in an embodiment of the present application;

[0033] Figure 2 for Figure 1 A cross-sectional view of the main body component shown;

[0034] Figure 3 Schematic diagram of the exploded view of the main components of the second preferred structure;

[0035] Figure 4 for Figure 3 Assembly drawing of the main components shown.

[0036] exist Figures 1-4 middle:

[0037] 1-main body, 2-inner cavity, 3-protrusion, 4-microporous channel, 5-groove, 6-heat conducting column;

[0038] 11-first groove member, 12-second groove member;

[0039] 101 - first end, 102 - second end, 103 - first surface, 104 - second surface. DETAILED DESCRIPTION

[0040] The present application provides a heat conducting device, the heat conducting effect of which is significantly improved.

[0041] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0042] like Figures 1-4As shown, an embodiment of the present application provides a heat conducting device, which can be installed in an electronic device such as a laptop computer to conduct heat inside the electronic device to the outside of the electronic device. The heat conducting device mainly includes a main body component 1, which is a component constituting the main structure of the heat conducting device, and has an inner cavity 2. The inner cavity 2 can accommodate a medium and allow the medium to flow therein, and the medium can absorb and carry heat and realize heat movement (i.e., heat conduction) by flowing in the inner cavity 2. After the medium is filled into the inner cavity 2, the inner cavity 2 can be sealed to prevent leakage of the medium. The surface of the main body component 1 that forms the inner cavity 2 is a concave-convex surface, and multiple parts of the concave-convex surface have a height difference, that is, multiple parts of the concave-convex surface are uneven. It is precisely because of the existence of this uneven part that multiple grooves 5 are formed on the concave-convex surface to allow the liquid medium to flow more quickly and smoothly in the inner cavity 2, thereby making the conduction The thermal device can conduct heat more efficiently, and a microchannel that can also be used to conduct liquid media is also provided on the part with the groove 5 (i.e., the part with the height difference). This microchannel refers to a tiny channel that can allow liquid media to enter and flow therein. The specific structure of the microchannel can be a micropore (i.e., microporous channel 4) with an inner diameter of less than 20 microns opened on the main part 1, and both ends of each microchannel are directly connected to the inner cavity 2 or connected to the inner cavity 2 through connection with other microchannels. Since the inner diameter of the microchannel is small enough, the capillary force will have a greater impact on the medium entering the microchannel, and the medium will flow in the microchannel under the action of the capillary force, and then it can fill (in the process of filling, in some cases it is necessary to overcome gravity) the capillary structure composed of all microchannels, so that the medium can be fully dispersed in the inner cavity 2, so that the maximum heat storage capacity of the heat conduction device can be improved. In addition, the specific structure of the microchannel can also be of other types, for example, the microchannel can be a strip-shaped groove opened on the concave and convex surface, the cross-sectional shape of the strip-shaped groove can be semicircular or multi-semicircular (multi-semicircular refers to a shape formed by an arc with an arc length greater than a semicircle and less than a full circle), and its inner diameter can also be less than 20 microns.

[0043] In the above structure, among the different parts of the concave and convex surface with height differences, such as Figure 2 and Figure 3In the structure shown, the height difference of each part can be exactly the same, or only partially the same or different, that is, the height of the protrusion of each part relative to the inner wall of the main part 1 can be completely the same, partially the same or different, so that the depth of the groove formed in different parts is different, so that the performance of the flow-guiding medium in different parts of the groove is different. For example, the performance of the flow-guiding medium in different parts of the groove can be made higher and higher as it approaches a certain end of the main part 1, so that the flow of the medium becomes smoother and smoother; at the same time, microchannels can be set on each part of these parts with height differences, or microchannels can be set on only some parts to meet the requirements. Different installation situations have different thermal conductivity requirements. For example, when the medium only flows horizontally, the medium is only located in the lower half of the inner cavity 2, so microchannels are only set on the concave and convex surface surrounding this lower half of the space, and there is no need to set microchannels on the concave and convex surface of the upper half of the space that will not contact the medium, thereby simplifying the processing procedure of the main component 1 and reducing the processing workload; when the medium flows obliquely (that is, when there is a height difference between the two parts that the medium needs to reach), the medium flowing in the inner cavity 2 may contact all parts of the concave and convex surface surrounding the inner cavity 2, so microchannels need to be set on each part.

[0044] The heat conducting device of the above structure has a concave-convex surface enclosing the inner cavity 2, macroscopically, forming grooves 5 for the medium to flow through, allowing the medium to flow more quickly and smoothly within the inner cavity 2. Microscopically, microchannels are also provided in the areas of the concave-convex surface where the grooves 5 are formed, creating a capillary structure there. This capillary structure encloses the grooves 5, and as the medium flows within the grooves 5, the capillary structure formed by the microchannels increases the maximum heat storage capacity of the heat conducting device. This allows the heat conducting device to combine the advantages of the good flowability of the grooves 5 with the large heat storage capacity of the capillary structure. This dual optimization significantly enhances the heat conduction performance of the heat conducting device. Moreover, since there is a large difference between the depth of the groove 5 and the size of the inner cavity 2, that is, the size of the groove 5 is also small, the flow of the medium in the groove 5 is also affected by capillary force. Since microchannels are provided at the location where the groove 5 is formed, the medium flows in the microchannel while flowing in the groove 5. As a result, the medium is affected by both the groove capillary force and the microchannel capillary force during flow, and these two capillary forces promote each other, so that the total capillary force on the medium is not only greater than the capillary force of the groove alone and the capillary force of the microchannel alone, but also greater than the sum of the capillary force of the groove and the capillary force of the microchannel. As a result, the flow of the medium is smoother than that of the medium flowing only in the groove, only in the capillary structure, and only in the structure consisting of alternating grooves and capillary structures, thereby further improving the heat conduction effect of the heat conduction device.

[0045] In this embodiment, the closed inner cavity 2 of the heat-conducting device is filled with a medium, that is, the heat-conducting device includes not only the main body component 1 but also the medium, and the medium can flow in the inner cavity 2 to realize the transfer of heat between different parts of the main body component 1. The heat-conducting principle of the heat-conducting device provided in this application is: the first part of the main body component 1 is in contact with the high-temperature component, and the second part is in contact with the low-temperature component, so that the main body component 1 can transfer (or conduct) the heat from the high-temperature component to the low-temperature component; or the first part of the main body component 1 is located in a high-temperature environment, and the second part is located in a low-temperature environment, so that the main body component 1 can transfer the heat in the high-temperature environment to the low-temperature environment. The medium filled in the inner cavity 2 is liquid when it does not absorb heat (that is, the medium is liquid at room temperature). When the heat in the high-temperature component or high-temperature environment enters the inner cavity 2 from the first part, the medium located in the first part absorbs heat. Due to the absorption of heat, the medium is converted from liquid to liquid. It changes into gaseous state, and then the gaseous medium carrying heat drifts in the inner cavity 2 and moves to the second part. At this time, the heat is transferred between the first part and the second part. Then the second part absorbs the heat carried by the medium and allows the heat to enter the low-temperature component or low-temperature environment. Due to heat release, the medium in the second part changes from gas to liquid again. Then this part of the liquid medium will flow back to the first part through the capillary structure composed of the groove 5 and the microchannel (when the setting height of the high-temperature component is greater than that of the low-temperature component, the reflux direction of the liquid medium is upward, so the medium needs to overcome gravity during the flow process). The medium completes a cycle in the inner cavity 2, and then the medium repeats the above process to start the next cycle.

[0046] Specifically, the structure of the main body component 1 can be selected in many ways, such as Figure 1 and Figure 2As shown, in the first preferred structure, the main body component 1 can be a tubular component, and of the two ends of the tubular component, the first end 101 (i.e., the first portion mentioned above) contacts the heating element (i.e., the high-temperature component mentioned above), and the second end 102 (i.e., the second portion mentioned above) opposite to the first end 101 contacts the heat dissipation element (i.e., the low-temperature component), and the medium circulates between the first end 101 and the second end 102 to transfer heat from the first end 101 to the second end 102. Among them, the heating element can be an electronic device arranged inside the shell of an electronic device, such as a CPU, etc., and when the tubular main body component 1 is set on the electronic device, its first end 101 can be extended into the interior of the electronic device and contact the electronic device, while the second end 102 is extended to the outside of the shell of the electronic device. During the operation of the electronic device, the heat generated by the electronic device will be conducted to the first end 101 of the main body component 1 and absorbed by the medium. Then, through the above-mentioned transfer process, the heat is transferred to the second end 102, and the heat is transferred to the heat sink (such as a heat sink fin) at the second end 102. The heat sink dissipates the heat to the environment outside the electronic device to achieve heat dissipation of the electronic device.

[0047] When the main body part 1 is a tubular part, as Figure 2 As shown, the inner wall of the tubular member is connected to a plurality of protruding members 3 protruding from the inner wall. The surface of the inner wall of the tubular member and the surface of the protruding members 3 constitute the above-mentioned concave-convex surface, and the protruding end of the protruding member 3 has the above-mentioned height difference with the inner wall of the tubular member. That is, in the first preferred structure, the surface of the inner cavity 2 is made into a concave-convex surface by providing a protruding member 3 protruding relative to the inner wall on the inner wall of the tubular member. At this time, the surface of the part of the inner wall not covered by the protruding member 3 and the surface of the protruding member 3 together constitute the concave-convex surface, that is, the surface of the protruding member 3 is convex relative to the surface of the inner wall, and the surface of the inner wall is concave relative to the surface of the protruding member 3. The height difference of the concave-convex surface refers to the difference in the protrusion of the protruding member 3 from the inner wall. Forming the concave-convex surface in this way in the tubular member is conducive to the simultaneous formation of microchannels (described in the following content). In addition, the concave-convex surface can also be formed by processing the inner wall of the tubular member (for example, cutting, thermoforming, etching, etc.).

[0048] Preferably, in this embodiment, the protrusion 3 is a solid piece composed of metal powder (the material of the metal powder can be copper, aluminum, stainless steel, etc.), so that the protrusion 3 has a microporous channel 4. There are also multiple options for the molding method of the protrusion 3. The reason why this embodiment preferably uses a combination of metal powders is that after a large number of powder particles are aggregated, there will be gaps between the powder particles. These gaps constitute the microporous channel 4. In this way, the protrusion 3 can have a microporous channel 4 at the same time as the protrusion 3 is molded, so that there is no need to perform a special microporous channel 4 processing operation, saving the operation process. In addition, since the gaps between the powder particles are disordered and interconnected, the capillary structure thus formed can better achieve the diversion of the medium, so that the maximum heat storage capacity of the heat conducting device is greatly improved.

[0049] In this embodiment, it is also preferred that the protrusion 3 is a strip extending along the axial direction of the tubular member, and a plurality of protrusions 3 are spaced apart in the circumferential direction of the tubular member so that any two adjacent protrusions 3 and the inner wall of the tubular member can form a groove 5 for guiding the flow medium, such as Figure 2 As shown. As mentioned above, the medium needs to flow from one end of the tubular member to the other end during the backflow process, so the protrusion 3 that guides the backflow of the medium needs to extend continuously along the axial direction of the tubular member as a whole, so it is preferably a strip-shaped member. On this basis, multiple protrusions 3 are spaced apart in the circumferential direction of the tubular member to form a groove 5, so that the backflowing medium can flow in the groove 5, and because the side wall of the groove 5 is composed of the protrusion 3 with the microporous channel 4, when the medium flows in the groove 5, it can not only achieve fast and smooth flow through the guidance of the groove 5, but also enter the microporous channel 4 and achieve the maximum increase in heat storage through the capillary structure formed by the microporous channel 4.

[0050] On the basis that the protrusion 3 extends along the axial direction of the tubular member as a whole, there are also many options for the specific arrangement of the protrusion 3 on the inner wall of the tubular member. For example, the strip-shaped protrusion 3 can be extended parallel to the axis of the tubular member so that the groove 5 is a parallel groove 5 parallel to the tubular member, such as Figure 2 As shown, the groove 5 is connected to the first end 101 and the second end 102 of the tubular member in a straight line, thereby reducing the medium backflow stroke and allowing the medium to return more quickly. Alternatively, the strip-shaped protrusion 3 can be extended around the axis of the tubular member to make the groove 5 a spiral groove 5 around the axis of the tubular member, that is, the groove 5 is continued in a spiral shape. In this way, the medium can be better dispersed on the inner wall of the tubular member, so that the maximum heat storage capacity of the heat conducting device is improved.

[0051] In addition, under the premise of ensuring normal backflow of the medium, the protrusion 3 may also be other structures instead of a strip structure, for example, the protrusion 3 may be a cylindrical or conical member protruding from the inner wall of the tubular member, and multiple cylindrical or conical members may be discretely distributed, matrix distributed or disorderly distributed on the inner wall of the tubular member.

[0052] On the basis of the above, under the premise of being able to normally form the groove 5, the cross-sectional shape of the protrusion 3 can also have a variety of options, such as Figure 1 The triangle shown may also be a rectangle, a trapezoid, a semicircle, etc.

[0053] like Figure 2 As shown, in this embodiment, the inner wall of the tubular member is preferably a smooth inner wall, and this smooth inner wall serves as the bottom wall of the groove 5. That is, the inner wall of the tubular member is not a concave-convex wall surface. Before the protrusion 3 is provided, the inner wall of the tubular member is smooth, and the concave-convex surface is formed by the provision of the protrusion 3. After the protrusion 3 is provided, this smooth inner wall directly serves as the bottom wall of the groove 5. The advantage of such a configuration is that, in the radial direction of the tubular member, the portion corresponding to the groove 5 only has components of the tubular member, and no other structures. This reduces the wall thickness of the tubular member, thereby reducing thermal resistance. Therefore, during the heat transfer process, a portion of the heat in the inner cavity 2 can be directly dissipated through radial heat conduction of the tubular member, which means that the main component 1 has a good heat dissipation effect, and thus can further improve the heat dissipation performance of the electronic device. In addition, the inner wall of the tubular member may not be a smooth inner wall. For example, a plurality of recessed grooves may be arranged at intervals on the inner wall of the tubular member, and these recessed grooves are arranged one-to-one with the groove 5, that is, each recessed groove is located at the bottom of a groove 5, so that the recessed groove becomes an integral part of the groove 5. In this way, while further improving the flow conduction performance of the groove 5, the wall thickness of the tubular member can be further reduced, and the heat dissipation effect of the heat conducting device can be further improved.

[0054] In addition, if Figure 3 and Figure 4As shown, in the second preferred structure, the main body component 1 can be a plate-shaped component, that is, the main body component 1 has a first surface 103 and a second surface 104 arranged opposite to each other, the first surface 103 (that is, the above-mentioned first part) is a heating contact surface in contact with the heating element (that is, the above-mentioned high-temperature component), and the second surface 104 (that is, the above-mentioned second part) is a heat dissipation contact surface in contact with the heat dissipation element (that is, the above-mentioned low-temperature component), and the medium circulates between the first end 101 and the second end 102 to transfer heat from the heating contact surface to the heat dissipation contact surface. When a heat-conducting device of this structure is set in an electronic device, it can be completely located inside the housing of the electronic device, and the first surface 103 can also contact the heat-generating electronic components of the electronic device, while the second surface 104 can contact the heat dissipation system of the electronic device. During the operation of the electronic device, the heat generated by the electronic components will be conducted to the first surface 103 and absorbed by the medium. Then, through the above-mentioned transfer process, the heat is transferred to the second surface 104 and the heat is evenly distributed on the second surface 104. Then, the heat on the second surface 104 is transferred to the heat dissipation system, and the heat is dissipated to the environment outside the electronic device through the heat dissipation system to achieve heat dissipation of the electronic device.

[0055] like Figure 3 and Figure 4 As shown, the plate-shaped main body component 1 includes a first channel member 11 having a first surface 103 and a second channel member 12 having a second surface 104. The first channel member 11 and the second channel member 12 enclose an inner cavity 2. The grooves of the first channel member 11 and the second channel member 12 are both components of the inner cavity 2. When the first channel member 11 and the second channel member 12 are engaged, the grooves of the first channel member 11 and the grooves of the second channel member 12 are combined to form the inner cavity 2. The first surface 103 and the second surface 104 are the two outer surfaces with the largest area and oppositely disposed in the plate-shaped structure formed after engagement. This main body component 1 composed of the first channel member 11 and the second channel member 12 has a simple structure and is easy to form, so it is the preferred structure of this embodiment. In addition, the plate-shaped main body component 1 can also be other structures, for example, a necking groove is opened on the vertical side wall of the solid component that is overall plate-shaped, and the volume of the inner space of the necking groove is made close to the volume of the solid component, so that the inner space becomes an inner cavity 2 for accommodating the medium, and a sealing member that can seal the opening is provided at the opening of the necking groove.

[0056] Specifically, such as Figure 3As shown, a plurality of protrusions 3 are provided on the bottom wall of the groove of the first groove-shaped member 11, and the surface of the bottom wall of the groove and the surface of the protrusions 3 constitute the above-mentioned concave-convex surface, and the protruding end of the protrusion 3 has the above-mentioned height difference with the inner wall of the groove. That is to say, in the second preferred structure, the way to make the surface surrounding the inner cavity 2 a concave-convex surface is to provide protrusions 3 protruding relative to the bottom wall of the groove on the bottom wall of the first groove-shaped member 11. At this time, the surface of the local part of the bottom wall of the groove not covered by the protrusions 3 and the surface of the protrusions 3 together constitute a concave-convex surface, that is, the surface of the protrusions 3 is convex relative to the surface of the bottom wall of the groove, and the surface of the bottom wall of the groove is concave relative to the surface of the protrusions 3, and the height difference of the concave-convex surface refers to the difference in the protrusions 3 protruding from the bottom wall of the groove. In order to better realize the reflux and heat absorption of the liquid, the protruding end of the protrusion 3 provided on the first groove-shaped member 11 is close to the bottom wall of the groove of the second groove-shaped member 12 or directly contacts the bottom wall of the groove of the second groove-shaped member 12, as shown in FIG. Figure 4 shown.

[0057] In addition, it is preferred that the protrusion 3 and the first groove part 11 are an integral structure. The specific molding method of the protrusion 3 can be obtained by the etching method described later, and the microporous channel 4 on the protrusion 3 is specially processed using a special process, which is the micro-electromechanical processing described later. This method of making the protrusion 3 and the first groove part 11 an integral structure and forming a capillary structure by opening a hole on the protrusion 3 can reduce the space occupied by the capillary structure while achieving the same effect as setting a capillary structure composed of a fiber or mesh wick in the inner cavity 2. That is, the volume of the protrusion 3 can be smaller than the volume of the fiber or mesh wick, so that the space of the inner cavity 2 can be reduced, so that the wall thickness of an ultra-thin heat-conducting device with a certain thickness (the thickness of an ultra-thin heat-conducting device is generally 0.4 mm) can be increased. For example, when the wall thickness of the first groove part 11 remains unchanged, the wall thickness of the second groove part 12 (this wall refers to the wall where the second surface 104 is located) can be increased from less than 0.1 mm to less than 0.2 mm, thereby improving the structural strength of the entire heat-conducting device and making the heat-conducting device have a longer service life.

[0058] like Figure 3 and Figure 4 As shown, in this embodiment, all microporous channels 4 formed on the first groove member 11 using microelectromechanical machining are preferably linear channels. Furthermore, in addition to the linear microporous channels 4, this embodiment also preferably arranges all microporous channels 4 in parallel and perpendicular to the bottom wall of the groove of the first groove member 11. This structure of microporous channels 4 not only facilitates machining but also reduces the distance required for medium backflow, allowing for faster medium backflow and improving the heat conduction effect of the heat conduction device. Furthermore, as long as normal molding is possible, the microporous channels 4 may also be curved channels.

[0059] like Figure 3 As shown, the bottom wall of the groove of the second groove member 12 is preferably further provided with a plurality of heat-conducting columns 6, distributed in a matrix on the bottom wall of the groove. Firstly, the provision of the heat-conducting columns 6 can further increase the structural strength of the plate-shaped heat-conducting device, reduce the deformation probability of the inner cavity 2, and enable the heat-conducting device to conduct heat more safely and reliably. Secondly, the heat-conducting columns 6 also have a heat-conducting function, which can also play a certain role in the transfer of heat between the first surface 103 and the second surface 104.

[0060] Based on the above-mentioned heat conducting device, this embodiment further provides a method for processing the heat conducting device, which includes the following steps:

[0061] The main body component 1 is obtained by processing. The main body component 1 can be processed and formed by using existing technology;

[0062] A concave-convex surface with microchannels is machined and formed on the main body component 1, that is, grooves 5 and microchannels are machined and formed on the main body component 1, wherein the machined main body component 1 has a closed inner cavity 2, and the inner cavity 2 can accommodate a medium and allow the medium to flow in the inner cavity 2, and the surface surrounding the inner cavity 2 is also set as the above-mentioned concave-convex surface with a height difference, and the height difference is set at multiple parts of the concave-convex surface, and microchannels for guiding the medium are set at the parts with the height difference, so as to obtain the above-mentioned heat conduction device.

[0063] In the above steps, there are multiple options for forming the concave-convex surface and the microchannel: the concave-convex surface can be formed on the main part 1 first, and then the microchannel can be formed on the concave-convex surface, for example, the main part 1 adopts the above-mentioned second structure forming method of the heat conducting device; or, while the concave-convex surface is formed on the main part 1, the microchannel is simultaneously formed on the concave-convex surface, for example, the main part 1 adopts the above-mentioned first structure forming method of the heat conducting device; or, the microchannel can be first formed on the protruding part 3, and then the protruding part 3 with the microchannel is set on the main part 1 to form the concave-convex surface, that is, the independent protruding part 3 is first processed, and then the microporous channel 4 is processed on the protruding part 3, and then the protruding part 3 is assembled to the main part 1. Among these three forming methods, the method of forming the concave-convex surface first and then forming the microchannel, the microchannel is formed after the concave-convex surface has been formed, so that the microchannel can be processed more accurately on the concave-convex surface, making the processing accuracy of the microchannel higher; the method of forming the concave-convex surface and the microchannel at the same time, can realize the formation of both the concave-convex surface and the microchannel in one step, simplifying the processing procedure, and making the processing of the heat conducting device simpler and more convenient; and the method of forming the microchannel first and then forming the concave-convex surface can realize the processing and molding of the microchannel on the outside of the main component 1, avoiding the limitations caused by the microchannel processing of the main component 1, so that the molding operation of the microchannel can be carried out more conveniently.

[0064] Specifically, the processing method of the heat-conducting device of the main body part 1 having the first preferred structure is: processing to obtain a tubular main body part 1; inserting a forming mold (the forming mold is a round rod with grooves on the outer peripheral surface) into the tubular main body part 1, and there will be a gap between the forming mold and the inner wall of the tubular part, and the outline of this gap is the outline of the protrusion 3; filling the gap with metal powder and ensuring that the metal powder fills the gap; sintering the metal powder (the main body part 1 and the forming mold are heated together) to obtain a protrusion 3 connected to the inner wall of the main body part 1 and having a microchannel, so that the surface of the main body part 1 forms a concave and convex surface; then filling the inner cavity 2 with a medium and sealing the openings at both ends of the main body part 1 to form a closed inner cavity 2.

[0065] The processing method of the heat-conducting device of the main body part 1 with the second preferred structure is as follows: processing to obtain a plate-shaped main body part 1, that is, processing to form a plate-shaped first part and a second part; etching the main body part 1 to obtain a protrusion 3 connected to the main body part 1 to form a concave and convex surface on the main body part 1, that is, etching multiple parts of the first part and the second part to form a first groove-shaped part 11 with a protrusion on the bottom wall of the groove of the first part, that is, when the first groove-shaped part 11 is formed, the concave and convex surface composed of the surface of the bottom wall of the groove and the surface of the protrusion is also formed together, and the second part is formed into a second groove-shaped part 12, and the above-mentioned heat-conducting column 6 is also formed at the same time as the second groove-shaped part 12 is formed; using micro-electromechanical machining (MEME) to form a microchannel on the protrusion 3, that is, using micro-electromechanical machining to form a microporous channel 4 on the protrusion so that the protrusion becomes the protrusion 3; buckling and bonding the first groove-shaped part 11 and the second groove-shaped part 12 to form a closed inner cavity 2.

[0066] In this specification, the structures of each part are described in a progressive manner, and the structure of each part focuses on the differences from the existing structure. The overall and partial structures of the heat conducting device can be obtained by combining the structures of the above multiple parts.

[0067] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present application. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application is not limited to the embodiments shown herein, but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat conducting device comprising: a main body component having a closable inner cavity capable of accommodating a medium and allowing the medium to flow in the inner cavity while carrying heat; The surface surrounding the inner cavity is a concave-convex surface with a height difference, multiple parts of the concave-convex surface have the height difference, and microchannels for guiding the medium are provided on the parts with the height difference, and the microchannels are connected to the inner cavity and can allow the medium to enter and flow therein; A plurality of protruding members protruding from the surface of the inner cavity are connected to the surface of the inner cavity, the surface of the inner cavity and the surfaces of the protruding members constitute the concave-convex surface, and there is the height difference between the protruding ends of the protruding members and the surface of the inner cavity. Any two adjacent protruding members and the surface of the inner cavity can form a groove for guiding the medium, and the protruding members have the microchannels.

2. The heat-conducting device according to claim 1, wherein the main component is a tubular member, a first end of the tubular member contacts a heat-generating member, a second end opposite to the first end contacts a heat-dissipating member, and a medium circulates between the first end and the second end to transfer heat from the first end to the second end.

3. The heat conducting device according to claim 2, wherein the protrusion is a solid piece composed of metal powder, so that the protrusion has microporous channels; The protrusions are strip-shaped pieces extending along the axial direction of the tubular piece, and a plurality of the protrusions are spaced apart in the circumferential direction of the tubular piece so that any two adjacent protrusions and the inner wall of the tubular piece can form a groove for guiding the medium.

4. The heat conducting device according to claim 3, wherein the strip-shaped protrusion extends parallel to the axis of the tubular member so that the groove is a parallel groove parallel to the tubular member, or the strip-shaped protrusion extends around the axis of the tubular member so that the groove is a spiral groove around the axis of the tubular member.

5. The heat-conducting device according to claim 1, wherein the main body component has a first surface and a second surface arranged opposite to each other, the first surface is a heat-generating contact surface in contact with the heat-generating element, and the second surface is a heat-dissipating contact surface in contact with the heat-dissipating element, and a medium circulates between the first surface and the second surface to transfer heat from the heat-generating contact surface to the heat-dissipating contact surface.

6. The heat conducting device according to claim 5, wherein the main body component comprises a first channel-shaped member having the first surface and a second channel-shaped member having the second surface, the first channel-shaped member and the second channel-shaped member enclosing the inner cavity; in, A plurality of protrusions are provided on the bottom wall of the groove of the first groove-shaped member, the surface of the bottom wall of the groove and the surface of the protrusions constitute the concave-convex surface, and there is the height difference between the protruding ends of the protrusions and the inner wall of the groove.

7. A method for processing a heat conducting device, comprising: Processing to obtain the main components; A concave-convex surface with microchannels is formed on the main body component, wherein the main body component has a closable inner cavity, and the inner cavity is capable of accommodating a medium and allowing the medium to flow therein, and the surface surrounding the inner cavity is configured as the concave-convex surface with a height difference, and the height difference is provided at multiple locations of the concave-convex surface, and the microchannels for guiding the medium are provided at the locations with the height difference, and the microchannels are communicated with the inner cavity and can allow the medium to enter and flow therein; A plurality of protruding members protruding from the surface of the inner cavity are connected to the surface of the inner cavity, the surface of the inner cavity and the surfaces of the protruding members constitute the concave-convex surface, and there is the height difference between the protruding ends of the protruding members and the surface of the inner cavity. Any two adjacent protruding members and the surface of the inner cavity can form a groove for guiding the medium, and the protruding members have the microchannels.

8. The method for processing a heat conducting device according to claim 7, comprising: First, forming the concave-convex surface on the main body component, and then forming the microchannel on the concave-convex surface; Alternatively, while forming the concave-convex surface on the main body component, the microchannel is formed on the concave-convex surface; Alternatively, the microchannel is first formed on the protruding member, and then the protruding member with the microchannel is arranged on the main body component to form the concave-convex surface.

9. The method for processing a heat conducting device according to claim 8, comprising: Processing to obtain the tubular main body component; The metal powder is sintered to obtain a protruding piece connected to the main body component and having the microchannel, so that the surface of the main body component forms the concave-convex surface.

10. The method for processing a heat conducting device according to claim 8, comprising: Processing to obtain the plate-shaped main body component; Etching the main body component to obtain a protruding piece connected to the main body component, so as to form the concave-convex surface on the main body component; The microchannel is formed on the protruding piece by micro-electromechanical machining.

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