Anti-loose heat sink and fixing element thereof

Abstract

The present application relates to a kind of anti-loose heat dissipation fin and its fixing element, fixing element has a fixed part and a soldering pin, fixed part is used to be fixed with a heat dissipation fin body, the first end of soldering pin is connected with the lower end of fixed part;The second end of soldering pin forms a hook part, and is formed by the first side surface protrusion, the guide part is formed between hook part and first end so that hook part and first end are staggered in width direction;When soldering pin is put into the soldering hole of circuit board, the surface of the second side of guide part is pushed by the inner wall of soldering hole so that fixing element moves to the first side, so that hook part goes beyond the edge of soldering hole and hooks circuit board when heat dissipation fin is shaken, soldering pin cannot be reversely removed from soldering hole, ensure the connection strength of heat dissipation fin and circuit board.

Description

Technical Field

[0001] A heat sink and its fixing element, particularly an anti-loosening heat sink and its fixing element. Background Technology

[0002] High-power active components, such as transistors, often generate a significant amount of heat during operation. If this heat is not properly dissipated, it can damage the component or circuit board due to overheating. Generally, a common heat dissipation method involves attaching and fixing a large-area metal heat sink to the surface of the transistor's resin package. This conducts the heat generated by the transistor through the high thermal conductivity of the large heat sink to the outside environment, preventing the transistor from overheating. When the transistor is soldered to the circuit board, the heat sink is also additionally soldered to the circuit board using a fixing component to ensure a secure connection between the transistor and the heat sink. See also... Figure 9 As shown, the fixing element 40 generally has a fixing part 41 and a pin 42. The fixing part 41 is used to fix the fixing element 40 to the heat sink 51. Please refer to the following: Figure 10 As shown, when the heat sink 51 needs to be soldered to a circuit board 52, the pin 42 of the fixing element 40 is placed in a soldering hole of the circuit board 52 and further soldered to fix it, so that the heat sink 51 is fixed to the circuit board 52 by the fixing element 40, and avoids the large-area heat sink 51 being pulled off the circuit board 52 and damaged when it is hit or vibrated.

[0003] However, when the fixing component 40 is soldered to the circuit board 52, if only the pins 42 of the fixing component and the circuit board 52 are connected by solder, the heat sink 51, being larger and heavier than the transistor component, will experience greater shaking when the circuit board 52 is subjected to vibration. This can cause the pins 42 to easily detach from the solder holes on the circuit board 52, thus losing its function of securing the heat sink 51. Therefore, the existing heat sink and its fixing component must be further improved. Summary of the Invention

[0004] Given that existing heat sinks, when connected only by soldering, are prone to losing their fixing pins from the solder holes on the circuit board, leading to loss of fixation and excessive stress on the electronic component pins connected to the heat sink, causing them to detach and become damaged, this invention provides an anti-loosening heat sink and its fixing element. The fixing element includes a fixing portion and a soldering pin. The fixing portion has an upper end and a lower end opposite each other along a height direction. The soldering pin has a first end and a second end opposite each other along the height direction, and a first side and a second side opposite each other along a width direction. The first end of the soldering pin is connected to the lower end of the fixing portion. The height direction is perpendicular to the width direction. Furthermore, the second end of the soldering pin forms a hook portion, which protrudes outward from the first side of the soldering pin. In addition, there is an oblique guide portion between the first end of the soldering pin and the hook portion, which causes the hook portion and the first end to be offset in the width direction.

[0005] The anti-loosening heat sink includes the fixing element as described above and a heat sink body. The fixing element is fixed to the heat sink body by the fixing portion, and the soldering pins of the fixing element extend out of the heat sink body for placement in soldering holes of a circuit board for further soldering. The circuit board has a first surface and a second surface opposite to each other.

[0006] When the fixing element is inserted into a solder hole of the circuit board from the first surface of the circuit board along the height direction at the second end of the soldering pin, the hook portion of the second end will first enter the solder hole. As the inner edge of the solder hole on the first surface of the circuit board abuts against the guide portion, the fixing element is guided by the solder hole and moves from the second side to the first side along the width direction. When the fixing element is fully inserted into the solder hole, that is, when the hook portion protrudes from the second surface of the circuit board, the sliding of the fixing element along the guide portion allows the hook portion to abut against the second surface of the circuit board, causing the fixing element to hook the circuit board with the hook portion. Furthermore, because the hook portion is offset from the first end of the soldering pin in the width direction, when the hook portion hooks the circuit board, the first end of the soldering pin abuts against the inner wall of the solder hole with its second side. Therefore, the fixing element cannot move in the width direction towards the second side to allow the hook to re-enter the solder hole. In this way, when the fixing element shakes, the hook portion will abut against the second surface of the circuit board, preventing the solder pins of the fixing element from coming out of the solder hole from the first surface of the circuit board in the opposite direction.

[0007] In this way, even when the fixing component shakes, in addition to being connected to the circuit board by soldering, the fixing component also hooks onto the circuit board through the hook part, further ensuring the connection strength between the heat sink body and the circuit board through the fixing component, and preventing the heat sink from falling off the circuit board and causing damage to the circuit board connection. Attached Figure Description

[0008] Figure 1 This is a three-dimensional schematic diagram of the fixing element of the present invention.

[0009] Figure 2 This is a planar schematic diagram of the fixing element of the present invention.

[0010] Figure 3 This is a three-dimensional schematic diagram of the anti-loosening heat sink of the present invention.

[0011] Figure 4 This is a cross-sectional schematic diagram of the application state of the fixing element of the present invention.

[0012] Figure 5 This is a cross-sectional schematic diagram of another application state of the fixing element of the present invention.

[0013] Figure 6 This is a cross-sectional schematic diagram of another application state of the fixing element of the present invention.

[0014] Figure 7 This is another three-dimensional schematic diagram of the anti-loosening heat sink of the present invention.

[0015] Figure 8 This is a three-dimensional schematic diagram of the application state of the anti-loosening heat sink of the present invention.

[0016] Figure 9 A three-dimensional schematic diagram of the existing heat sink fixing components.

[0017] Figure 10 This is a schematic diagram illustrating the application of existing heat sinks and their mounting components. Detailed Implementation

[0018] This invention provides an anti-loosening heat sink and its fixing element. In this embodiment, the anti-loosening heat sink is used for heat dissipation of transistors, but is not limited to its use in transistor heat dissipation. Please refer to [link to relevant documentation]. Figure 1 and Figure 2As shown, the fixing element 10 of the heat sink includes a fixing portion 11 and a soldering pin 12. The fixing portion 11 has an upper end and a lower end opposite each other along a height direction Z. The soldering pin 12 has a first end and a second end opposite each other along the height direction Z, and a first side and a second side opposite each other along a width direction Y. The first end of the soldering pin 12 is connected to the lower end of the fixing portion 11, and the second end of the soldering pin 12 extends away from the lower end of the fixing portion 11. Furthermore, the second end of the soldering pin 12 forms a hook portion 121, and the hook portion 121 protrudes outward from the first side of the soldering pin 12. In addition, the soldering pin 12 has a guide portion 122, which is formed between the first end of the soldering pin 12 and the hook portion, and the guide portion 122 causes the first end of the soldering pin and the hook portion to be offset in the width direction. The height direction Z is perpendicular to the width direction Y.

[0019] Furthermore, the guide portion 122 of the welding pin 12 has two opposing bevels 1221, which are formed by extending from the first side of the welding pin 12 toward the second side of the welding pin 12.

[0020] Please see Figure 3 As shown, the anti-loosening heat sink of the present invention includes the fixing element 10 and a heat sink body 20 as described above. The fixing element 10 is fixed to the heat sink body 20, and is fixed to the heat sink body 20 by the fixing part 11. When the fixing element 10 is fixed to the heat sink body 20, the soldering pin 12 extends out of the heat sink body 20 for placement in a corresponding soldering hole on a circuit board for soldering.

[0021] Please see Figure 4 As shown, the circuit board 30 has a first surface 31 and a second surface 32 facing each other, and a solder hole 301 is formed connecting the first surface 31 and the second surface 32. The solder pin 12 of the fixing element 10 is inserted into the solder hole 301 from the first surface 31 of the circuit board 30 along the height direction.

[0022] When the soldering pin 12 of the fixing element 10 is inserted into the soldering hole 301 of the circuit board 30, the inner diameter of the soldering hole 301 along the width direction Y is slightly larger than the width W of the hook portion 121 along the width direction Y to the second side of the soldering pin 12. Therefore, the second end of the soldering pin 12 can be smoothly inserted into the soldering hole 301. When the soldering pin 12 continues to be inserted into the soldering hole 301 along the height direction Z, the edge of the soldering hole 301 on the first surface 31 of the circuit board 30 will touch the guide portion 122 of the fixing element 10, that is, the bevel 1221 formed on the first side of the soldering pin 12. The fixing element 10 is guided by the bevel 1221, so that the fixing element 10 is pushed towards the first side in the width direction Y during the process of being inserted into the soldering hole 301 along the height direction Z.

[0023] Please see Figure 5 As shown, when the hook portion 121 protrudes from the second surface 32 of the circuit board 30, the inclined edge 1221 of the guide portion 12 continues to slide along the edge of the solder hole 301, causing the fixing element 10 to continue moving towards the first side, so that the hook portion 121 crosses the edge of the solder hole 301 and abuts against the second surface 32 of the circuit board 30. At this time, the fixing element 10 is fully inserted into the solder hole 301. Furthermore, since the hook portion 121 and the first end of the solder pin 12 are misaligned in the width direction Y, when the hook portion 121 protrudes from the solder hole 301 on the second side of the solder pin 12, the first end of the solder pin 12 abuts against the inner wall surface of the solder hole 301 in the direction of the second side. The inner wall surface of the solder hole 301 therefore blocks the fixing element 10 from moving towards the second side of the solder pin 12. In this way, since the hook portion 121 abuts against the second surface 32 of the circuit board 30, the fixing element 10 hooks the circuit board 30 with the hook portion 121. When the fixing element 10 shakes, the hook portion 121 is blocked by the second surface 32 of the circuit board 30, so that the fixing element 10 cannot detach from the circuit board 30.

[0024] Please continue reading. Figure 4 and Figure 5 As shown, in a first preferred embodiment of the present invention, a connecting section 124 is formed at the first end of the soldering pin 12, and the connecting section 124 is parallel to the height direction Z.

[0025] When the fixing element 10 is fully inserted into the solder hole 301, the lower end of the fixing part 11 abuts against the first surface 31 of the circuit board 30, and the inner wall surface of the solder hole 301 near the second side of the solder pin 12 abuts against the surface of the connecting section 124 of the solder pin 12 facing the second side. Since the surface of the connecting section 124 near the second side is parallel to the height direction and also parallel to the inner wall surface of the solder hole 301, it can completely abut against the inner wall surface of the solder hole 301. That is to say, in the width direction Y, the connecting section 124 of the fixing element 10 is blocked by the inner wall surface of the solder hole 301 and cannot move further towards the second side.

[0026] In this way, since the fixing element 10 cannot move towards the second side at this time, when the fixing element 10 is subjected to external force and moves along the height direction Z, the hook portion 121 is blocked by the second surface 32 of the circuit board 30, preventing the solder pin 12 of the fixing element 10 from disengaging from the solder hole 301. When the fixing element 10 moves towards the first side, the hook portion 121 is still blocked by the second surface 32 of the circuit board 30. In short, when the solder pin 12 of the fixing element 10 is fully inserted into the solder hole 301, that is, when the lower end of the fixing part 11 abuts against the circuit board 30, the hook portion 121 will inevitably hook onto the second surface of the circuit board 30 and cannot enter in reverse and pass through the solder hole 301.

[0027] In this way, even if the fixing component 10 shakes, the solder pin 12 cannot easily come out of the solder hole 301, further ensuring the bonding strength between the heat sink 20 and the circuit board 30.

[0028] Please refer to the following: Figure 1 and 6 As shown, in a first preferred embodiment of the present invention, the fixing element 10 is a thin sheet-like element, and the fixing element 10 further includes a locking protrusion 123, which is formed on the soldering pin 12 and protrudes outward along a thickness direction X of the fixing element 10. The thickness direction X is perpendicular to both the height direction Z and the width direction Y. The locking protrusion 123 has a top end, and the hook portion 121 also has a top end. Preferably, the top end 1231 of the locking protrusion 123 and the top end of the hook portion 121 are located at the same horizontal height along the height direction Z.

[0029] By ensuring that the inner diameter of the welding hole 301 along the thickness direction X is slightly less than or equal to the height of the welding pin 12 plus the locking protrusion 123, the locking protrusion 123 at the second end of the welding pin 12 can be pressed tightly into the welding hole 301. When the fixing element 10 is inserted into the welding hole 301, the inner walls of the welding hole 301 on both opposite sides along the thickness direction X will touch the top of the locking protrusion 123 and the other surface of the welding pin 12, so that the locking protrusion 123 is pressed tightly into the welding hole 301 along the thickness direction X. When the fixing element 10 is subjected to continued force and is fully inserted into the welding hole 301, the top of the locking protrusion 123 passes through the welding hole 301. Since the tops of the locking protrusion 123 and the hook portion 121 are at the same horizontal height along the height direction Z, when the top of the hook portion 121 passes through the solder hole 301 and protrudes from the second surface 32 of the circuit board 30, the top of the locking protrusion 123 will also pass through the solder hole 301 and protrude from the second surface 32 of the circuit board 30, and the top of the locking protrusion 123 will abut against the second surface 32 of the circuit board 30. In this way, when the heat sink body 20 and the fixing element 10 are vibrated, the locking protrusion 123 is blocked by the second surface 32, thus also generating resistance to the displacement of the fixing element 10 along the height direction Z, further increasing the connection strength between the heat sink and the circuit board 30.

[0030] Please continue reading. Figure 1 As shown, in a second preferred embodiment of the present invention, a thermal resistance through-hole 111 is formed at the lower end of the fixing portion 11, and the thermal resistance through-hole 111 connects the two opposing surfaces of the fixing portion along the thickness direction X. The thermal resistance through-hole 111 is formed at the lower end of the fixing portion 11, that is, near the connection with the first end of the soldering pin 12. The thermal resistance through-hole 111 forms thermal resistance between the soldering pin 12 and the fixing portion 11. When the soldering pin 12 is soldered in the solder pot, a large amount of heat energy is prevented from being transferred from the soldering pin 12 to the fixing portion 11 and the heat sink body 20, which would result in insufficient temperature of the soldering pin 12 and poor soldering.

[0031] Please refer to the following: Figure 3 , Figure 4 and Figure 7 As shown, in a third preferred embodiment of the present invention, the fixing element 10 and the heat sink body 20 are fixed together by riveting. More specifically, the anti-loosening heat sink includes a rivet 22, the heat sink body forms a first riveting hole 21, and the fixing portion 11 of the fixing element 10 forms a second riveting hole 112, the second riveting hole 112 communicating with two opposing surfaces of the fixing portion along the thickness direction X. Figure 3As shown, the first riveting hole 21 of the heat sink body 20 is correspondingly provided with the second riveting hole 112 of the fixing element 10, so that the rivet 22 is provided in the first riveting hole 21 and the second riveting hole 112 to fix the heat sink body 20 and the fixing element 10.

[0032] Please see Figure 7 and Figure 8 As shown, for example, the anti-loosening heat sink can be used to secure multiple transistors 31, such as... Figure 3 As shown, the heat sink body 20 has at least one bolt hole 23 for bolting at least one transistor 31 to the heat sink body 20 for heat dissipation. The anti-loosening heat sink may also include one or more fixing elements 10 to make the heat sink more stably connected to the circuit board 30, ensuring the stability and yield of the overall device.

[0033] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A fixing element for preventing loosening of a heat sink, characterized in that, include: A fixed connection having an upper end and a lower end opposite each other along a height direction; A soldering pin has a first end and a second end opposite each other along the height direction, and has opposite ends along a width direction. A first side and a second side, wherein the first end of the welding pin is connected to the lower end of the fixed part; A hook portion is formed at the second end of the welding pin, and the hook portion is formed by the first side of the welding pin protruding outward; There is an oblique guide portion between the first end of the welding pin and the hook portion, the guide portion causing the first end of the welding pin and the hook portion to be offset in the width direction; The fixing element is a thin sheet-like element, and the fixing element further includes: A locking protrusion is formed on the welding pin and protrudes outward along a thickness direction of the fixing element, and the locking protrusion has a top end; The hook portion has a top end; The top of the locking protrusion and the top of the locking hook are at the same horizontal level.

2. The fixing element for the anti-loosening heat sink as described in claim 1, characterized in that, The guide portion of the welding pin has two opposing bevels, which are formed by extending from the first side of the welding pin toward the second side of the welding pin.

3. The fixing element for the anti-loosening heat sink as described in claim 1, characterized in that, The first end of the welding pin has a connecting section, which is parallel to the height direction.

4. The fixing element for the anti-loosening heat sink as described in claim 3, characterized in that, The fixed part has a riveting hole that connects two opposing surfaces of the fixed part in a thickness direction.

5. The fixing element for the anti-loosening heat sink as described in claim 3, characterized in that, The fixed part has a thermally resistive perforation, which is formed in the fixed part and connects two opposing surfaces of the fixed part along a thickness direction.

6. A heat sink with anti-loosening feature, characterized in that, include: One heat sink body; A fixing element as described in any one of claims 1 to 5; The fixing element is fixed to the heat sink body by the fixing part, and the welding pin extends out of the heat sink body. The fixing element is a thin sheet-like element, and the fixing element further includes: A locking protrusion is formed on the solder pin and protrudes outward along a thickness direction of the fixing element, and the locking protrusion has a top end.

7. The anti-loosening heat sink as described in claim 6, characterized in that, Further includes: A rivet; The heat sink body has a first riveting hole, and the fixing part of the fixing element has a second riveting hole. The first riveting hole of the heat sink body and the second riveting hole of the fixing element are correspondingly arranged. The rivet is disposed in the first riveting hole and the second riveting hole to fix the heat sink body and the fixing element.

8. The anti-loosening heat sink as described in claim 6, characterized in that, The heat sink body has at least one bolt hole.

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