Detection auxiliary device and detection device

Abstract

The present invention discloses a detection auxiliary device and a detection device, wherein the detection auxiliary device comprises: a component to be tested; a mounting plate; a test probe embedded on the mounting plate; and a switching assembly mounted on the bottom of the mounting plate, one end of which is connected to the test probe and the other end is connected to the pin of the component to be tested. The present invention can weaken the driving force on the test probe through the switching assembly, thereby reducing the wear of the test probe on the pin of the component to be tested, thereby ensuring electrical conduction between the test probe and the component to be tested, and ensuring the service life of the component to be tested.

Description

Technical Field

[0001] The present invention relates to the field of detection technology, and in particular to a detection auxiliary device and a detection device. Background Art

[0002] At present, after the chip or PCBA board is successfully prepared, the performance of the chip or PCBA board needs to be tested. Therefore, the chip and PCBA board need to be tested as the components to be tested. With the development of miniaturization of components to be tested, most of the components to be tested are tested by automatic testing devices. The automatic testing device needs to connect the pins of the miniature components to be tested and perform the test according to the pre-stored test program.

[0003] However, the test probes on the current automatic detection devices are directly connected to the pins of the chip or the component to be tested under the action of the driving force. Since there is a certain gap between the test probes and the pins on the component to be tested, the pins on the component to be tested will produce slight sliding in the above situation. After multiple tests, the pins will be worn out, which will cause the test probes and the chip and PCBA board to be disconnected, affecting the accuracy of the test results, and reducing the service life of the chip or PCBA board. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes an auxiliary detection device that can reduce the wear of the test probe on the chip or PCBA board, ensure the accuracy of the test result, and protect the service life of the chip or PCBA board.

[0005] The invention also provides a detection device.

[0006] In a first aspect, an embodiment of the present invention provides a detection auxiliary device, comprising:

[0007] Components to be tested;

[0008] Mounting plate;

[0009] A test probe, embeddedly mounted on the mounting plate;

[0010] The adapter component is arranged at the bottom of the mounting plate, and one end of the adapter component is connected to the test probe, and the other end of the adapter component is connected to the pin of the component to be tested.

[0011] The detection auxiliary device of the embodiment of the present invention has at least the following beneficial effects: the test probe is connected to the pin of the component to be tested through the adapter assembly, so the adapter assembly can weaken part of the force applied to the test probe, thereby reducing the force applied when the adapter assembly is connected to the component to be tested, thereby reducing the wear on the pins on the component to be tested, thereby ensuring stable electrical conduction between the component to be tested and the test probe, and ensuring the service life of the component to be tested.

[0012] According to some other embodiments of the detection auxiliary device of the present invention, the adapter assembly includes:

[0013] An adapter plate, arranged between the mounting plate and the component to be tested;

[0014] The adapter pin is installed in the adapter board, and one end of the adapter pin is connected to the test probe, and the other end of the adapter pin is connected to the pin of the component to be tested.

[0015] According to some other embodiments of the detection auxiliary device of the present invention, the adapter plate includes:

[0016] A transfer mold is arranged at the bottom of the mounting plate, and the transfer needle is installed in the transfer mold;

[0017] The transfer PCB board is installed between the transfer mold and the component to be tested.

[0018] According to some other embodiments of the detection auxiliary device of the present invention, a connecting groove is provided on the mounting plate, and a plurality of first connecting holes connected to the connecting groove are provided on the mounting plate, a second connecting hole corresponding to the first connecting hole is provided on the adapter mold, the adapter needle is located in the second connecting hole and partially extends out of the second connecting hole, and the test probe passes through the first connecting hole and is connected to the adapter needle in the second connecting hole.

[0019] According to some other embodiments of the detection auxiliary device of the present invention, a third connecting hole is opened on the adapter PCB board, and the adapter needle includes: a first adapter part and a second adapter part, and the second adapter part extends out of the third connecting hole and is connected to the pin of the component to be tested.

[0020] According to some other embodiments of the auxiliary detection device of the present invention, a cross-sectional area of ​​the first adapter portion is greater than a cross-sectional area of ​​the third connecting hole.

[0021] According to some other embodiments of the detection auxiliary device of the present invention, the first adapter portion and the second adapter portion are cylindrical in shape, and the diameter of the first adapter portion is greater than the diameters of the second adapter portion and the third connecting hole.

[0022] In a second aspect, another embodiment of the present invention provides a detection device, comprising: the detection auxiliary device as described in the first aspect and a detection device body.

[0023] The detection device of the embodiment of the present invention has at least the following beneficial effects: through the detection auxiliary device, the wear of the test probe on the component to be tested can be reduced, and a stable connection between the component to be tested and the test probe can be ensured.

[0024] Other features and advantages of the present application will be described in the following description, and partly become apparent from the description, or understood by practicing the present application. The purpose and other advantages of the present application can be realized and obtained by the structures specifically pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a schematic structural diagram of a specific embodiment of a detection auxiliary device in an embodiment of the present invention;

[0026] Figure 2 is a top view of a specific embodiment of the detection auxiliary device in the embodiment of the present invention;

[0027] Figure 3 yes Figure 2 Sectional view along line AA.

[0028] Figure numerals: 100, mounting plate; 110, connecting groove; 120, first connecting hole; 200, test probe; 300, adapter assembly; 310, adapter mold; 311, second connecting hole; 320, adapter needle; 321, first adapter part; 322, second adapter part; 330, adapter PCB board; 331, third connecting hole; 340, adapter board. DETAILED DESCRIPTION

[0029] The following will be combined with the embodiments to clearly and completely describe the concept of the present invention and the technical effects produced, so as to fully understand the purpose, characteristics and effects of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without creative work are all within the scope of protection of the present invention.

[0030] In the description of the present invention, if it involves a description of orientation, for example, the orientation or position relationship indicated by "upper", "lower", "front", "back", "left", "right", etc. is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. If a feature is referred to as being "set", "fixed", "connected", or "installed" on another feature, it can be directly set, fixed, or connected to the other feature, or it can be indirectly set, fixed, connected, or installed on the other feature.

[0031] In the description of the embodiments of the present invention, if "several" is involved, it means more than one, if "multiple" is involved, it means more than two, if "greater than", "less than" or "exceed" is involved, it should be understood as not including the number itself, if "above", "below" or "within" is involved, it should be understood as including the number itself. If "first" or "second" is involved, it should be understood as being used to distinguish technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0032] In the first aspect, the present invention is mainly used to test components to be tested, wherein the components to be tested (not shown in the figure) include: radio frequency antennas, chips, components and PCBA, etc., and the devices mainly involving electrical testing after connecting pins can all use the detection auxiliary device disclosed in the present invention to assist in detection.

[0033] Reference Figure 1 and Figure 3 The embodiment of the present invention discloses a detection auxiliary device, including: a component to be tested (not shown in the figure), a mounting plate 100 is arranged above the component to be tested (not shown in the figure), and a test probe 200 is embedded and installed on the mounting plate 100, and the test probe 200 can be extended and retracted on the mounting plate 100. A transfer assembly 300 is arranged on one side of the mounting plate 100 close to the component to be tested (not shown in the figure), one end of the transfer assembly 300 is connected to the test probe 200, and the other end is connected to the pin on the component to be tested (not shown in the figure).

[0034] After the test probe 200 is inserted into the mounting plate 100, the test probe 200 connects to the pins on the component to be tested (not shown in the figure), and the test probe 200 connects to the pins on the component to be tested (not shown in the figure) after passing through the adapter assembly 300. The downward driving force of the test probe 200 can be transferred by the adapter assembly 300, and the adapter assembly 300 partially weakens the driving force, thereby weakening the force of the adapter assembly 300 connecting the pins on the component to be tested (not shown in the figure), so that the wear degree on the component to be tested (not shown in the figure) is reduced, thereby improving the connection stability between the component to be tested (not shown in the figure) and the test probe 200, which can not only improve the test accuracy of the component to be tested (not shown in the figure), but also ensure the life of the component to be tested (not shown in the figure).

[0035] Reference Figure 2 and Figure 3 In some embodiments, the adapter assembly 300 includes: an adapter plate 340 and an adapter needle 320 , and the adapter plate 340 is located at the bottom of the mounting plate 100 , and the adapter needle 320 is located inside the adapter plate 340 .

[0036] In some embodiments, the adapter plate 340 is integrally formed, and the component to be tested (not shown in the figure) is installed at the bottom of the adapter plate 340, and the adapter pin 320 can extend along the adapter plate 340 to connect with the pin of the component to be tested (not shown in the figure).

[0037] In some embodiments, the transfer assembly 300 includes: a transfer mold 310 and a transfer PCB board 330, the transfer mold 310 is located at the bottom of the mounting plate 100, the transfer pin 320 is installed in the transfer mold 310, and one end of the transfer pin 320 is connected to the test probe 200, and the other end is connected to the pin of the component to be tested (not shown in the figure). The transfer PCB board 330 is installed between the transfer mold 310 and the component to be tested (not shown in the figure), and the transfer pin 320 can be connected to the pin of the component to be tested (not shown in the figure) through the transfer PCB board 330.

[0038] The transfer pin 320 is installed in the transfer mold 310. When the test probe 200 moves downward under the action of the driving force, the test probe 200 drives the transfer pin 320 to extend out of the transfer PCB board 330 and connect with the pin of the component to be tested (not shown in the figure), so that the test probe 200 and the pin of the component to be tested (not shown in the figure) are connected through the transfer pin 320. The transfer pin 320 can weaken the driving force of the test probe 200 downward, thereby reducing the wear on the component to be tested (not shown in the figure).

[0039] For example, when the test probe 200 moves downward under the action of the driving force, the test probe 200 touches the adapter pin 320 and drives the adapter pin 320 to move downward, and the adapter pin 320 moves downward and connects the pin of the component to be tested (not shown in the figure) through the adapter PCB board 330. The adapter pin 320 is installed on the adapter mold 310. If the test probe 200 needs to be connected to the pin of the component to be tested (not shown in the figure), it is connected through the adapter pin 320. Therefore, when the test probe 200 is driven by the driving force, the adapter pin 320 is driven again, and the adapter pin 320 will eliminate part of the driving force. Therefore, the wear of the pin on the component to be tested (not shown in the figure) by the adapter pin 320 is reduced, thereby protecting the test probe 200 and the component to be tested (not shown in the figure) from being electrically conductive, and ensuring the service life of the component to be tested (not shown in the figure).

[0040] In some embodiments, a connection slot 110 is provided on the mounting plate 100, and Figure 1 Two connection slots 110 are provided on the mounting plate 100. The mounting plate 100 is provided with a plurality of first connection holes 120 connected to the connection slots 110. The first connection holes 120 are provided in plurality, and the test probes 200 are inserted into the first connection holes 120 along the connection slots 110. Two test probes 200 are inserted into one connection slot 110. Figure 1The two test probes 200 inserted into the two connection slots 110 are in different directions, that is, the test probes 200 are respectively inserted into different first connection holes 120, so that the plane formed by the two test probes 200 in one connection slot 110 and the plane formed by the two test probes 200 in the other connection slot 110 are not parallel to each other. The transfer mold 310 is provided with a second connection hole 311 corresponding to the first connection hole 120, and a plurality of second connection holes 311 are provided, and the number of second connection holes 311 is the same as the number of first connection holes 120. The transfer pin 320 is located in the second connection hole 311 and partially extends out of the second connection hole 311. The transfer PCBA board 330 is provided with a third connection hole 331 corresponding to the second connection hole 311.

[0041] In some embodiments, if the adapter plate 340 is integrally formed, and the second connection hole 311 and the third connection hole 331 are opened on the adapter plate 340, and the diameter of the second connection hole 311 is larger than the diameter of the third connection hole 331, the adapter needle 320 can extend along the third connection hole 331 and partially abut between the second connection hole 311 and the third connection hole 331.

[0042] The integrated arrangement of the adapter plate 340 can ensure that the adapter pins 320 are normally connected to the pins of the component to be tested (not shown in the figure), and the entire adapter assembly 300 is more stable.

[0043] In some embodiments, the component to be tested (not shown in the figure) is embedded in the bottom of the transfer PCB board 330, and the transfer pin 320 extends out of the third connection hole 331, but does not extend out of the entire bottom of the transfer PCB board 330 to connect with the pin of the component to be tested (not shown in the figure). In other embodiments, the component to be tested (not shown in the figure) is installed at the bottom of the transfer PCB board 330, and the third connection hole 331 runs through the entire transfer PCB board 330, and the transfer pin 320 extends out of the bottom of the transfer PCB board 330 to connect with the pin of the component to be tested (not shown in the figure).

[0044] After the test probe 200 passes through the connection slot 110, it is inserted into the first connection hole 120. At the junction of the first connection hole 120 and the second connection hole 311, the test probe 200 is connected to the adapter pin 320 in the second connection hole 311. The test probe 200 drives the adapter pin 320 to extend out of the third connection hole 331 under the action of the driving force, and then the adapter pin 320 contacts the pin of the component to be tested (not shown in the figure) on the adapter PCB board 330, thereby completing the electrical connection between the test probe 200 and the component to be tested (not shown in the figure). The mutual correspondence between the first connection hole 120, the second connection hole 311 and the third connection hole 331 facilitates the test probe 200 to directly connect to the adapter pin 320, and facilitates the adapter pin 320 to connect to the pin of the component to be tested (not shown in the figure) under the action of the test probe 200.

[0045] In some embodiments, the adapter pin 320 includes: a first adapter portion 321 and a second adapter portion 322. In this embodiment, the first adapter portion 321 and the second adapter portion 322 are integrally formed, the first adapter portion 321 is close to the first connection hole 120, the second adapter portion 322 is close to the third connection hole 331, and the connection between the first adapter portion 321 and the second adapter portion 322 is in a stepped shape. When the second adapter portion 322 extends out of the third connection hole 331, the stepped position of the first adapter portion 321 and the second adapter portion 322 abuts against the adapter PCB board 330.

[0046] When the test probe 200 drives the transfer needle 320 to approach the pin of the component to be tested (not shown in the figure) under the action of the driving force, the second transfer portion 322 extends out of the third connection hole 331 to connect with the pin of the component to be tested (not shown in the figure), and then the step between the second transfer portion 322 and the first transfer portion 321 abuts against the transfer PCB board 330. The driving force transmitted to the transfer needle 320 by the test probe 200 can be diffused to the transfer PCB board 330 through the step between the first transfer portion 321 and the second transfer portion 322, thereby further weakening the driving force on the transfer needle 320 and further reducing the wear of the transfer needle 320 on the pin of the component to be tested (not shown in the figure).

[0047] For example, when the test probe 200 moves downward under the action of the driving force, and when the test probe 200 touches the first adapter portion 321, the first adapter portion 321 is subjected to a downward force, and since the first adapter portion 321 and the second adapter portion 322 are integrally formed, the second adapter portion 322 is also subjected to a downward force. As a result, the second adapter portion 322 passes through the third connection hole 331 and is connected to the pin of the component to be tested (not shown in the figure). Since the step between the first adapter portion 321 and the second adapter portion 322 abuts against the adapter PCB board 330, the first adapter portion 321 will transfer a part of the force to the adapter PCB board 330, thereby reducing the force on the second adapter portion 322, thereby reducing the wear of the second adapter portion 322 on the component to be tested (not shown in the figure).

[0048] In some embodiments, the material of the adapter pin 320 is copper. Therefore, even if the test probe 200 causes wear to the adapter pin 320 under the action of the driving force, it will not affect the conductivity of the adapter pin 320, thereby ensuring a stable electrical connection between the adapter pin 320 and the component to be tested (not shown in the figure).

[0049] Among them, the cross-sectional area of ​​the first adapter portion 321 is larger than the cross-sectional area of ​​the third connecting hole 331. Therefore, when the second adapter portion 322 extends out of the third connecting hole 331, the first adapter portion 321 is restricted on the adapter PCB board 330, so that the driving force transmitted by the test probe 200 can be dispersed to the adapter PCB board 330 through the first adapter portion 321.

[0050] In some embodiments, the first adapter portion 321 and the second adapter portion 322 are cylindrical in shape, and the diameter of the first adapter portion 321 is larger than the diameters of the second adapter portion 322 and the third connection hole 331. The first adapter portion 321 and the second adapter portion 322 are cylindrical in shape, so the first adapter portion 321 can evenly distribute the force of the test probe 200 on the adapter PCB board 330, thereby making the pin connection between the second connection portion and the component to be tested (not shown in the figure) more stable.

[0051] In summary, the test probe 200 is inserted into the connection groove 110 and the first connection hole 120, and then the test probe 200 is subjected to a downward driving force to contact the adapter pin 320, and the test probe 200 abuts against the adapter pin 320, so that the adapter pin 320 is subjected to a downward force. Therefore, the second adapter portion 322 of the adapter pin 320 extends out of the third connection hole 331 and contacts the pin of the component to be tested. Since the diameter of the first adapter portion 321 is larger than the diameter of the third connection hole 331, when the adapter pin 320 is driven downward by the force, the connection between the first adapter portion 321 and the second adapter portion 322 abuts against the adapter PCB board 330, thereby reducing the force of the second adapter portion 322 contacting the pin of the component to be tested, thereby reducing the wear on the pin of the component to be tested.

[0052] In the second aspect, an embodiment of the present invention discloses a test device, including a detection auxiliary device and a detection device body as in the first aspect. The specific structure of the detection auxiliary device refers to the description of the first aspect and will not be repeated here. The detection device body is an existing automated circuit board detection device. Therefore, by adding a detection auxiliary device to the existing automated circuit board detection device, the wear of the test device body on the test element (not shown in the figure) during the test process is reduced, the test accuracy is improved, and the service life of the test element (not shown in the figure) is guaranteed.

[0053] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the technical field without departing from the purpose of the present invention. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

Claims

1. A detection auxiliary device, comprising: The component to be tested is characterized in that the detection auxiliary device comprises: Mounting plate; A test probe, embeddedly mounted on the mounting plate; A transfer assembly is arranged at the bottom of the mounting plate, and one end of the transfer assembly is connected to the test probe, and the other end of the transfer assembly is connected to the pin of the component to be tested; Wherein, the adapter assembly comprises: An adapter plate is arranged between the mounting plate and the component to be tested; the component to be tested is installed at the bottom of the adapter plate; An adapter pin is installed in the adapter board, and one end of the adapter pin is connected to the test probe, and the other end of the adapter pin is connected to the pin of the component to be tested; Wherein, the adapter plate comprises: A transfer mold is arranged at the bottom of the mounting plate, and the transfer needle is installed in the transfer mold; A transfer PCB board is installed between the transfer mold and the component to be tested; Among them, the test probe is used to move downward under the action of driving force, and the test probe drives the adapter needle to extend out of the adapter PCB board, and the adapter needle is connected to the pin of the component to be tested; the adapter needle is used to eliminate part of the driving force applied to the test probe.

2. The detection auxiliary device according to claim 1, characterized in that: A connecting groove is provided on the mounting plate, and a plurality of first connecting holes connected to the connecting groove are provided on the mounting plate. A second connecting hole corresponding to the first connecting hole is provided on the adapter mold. The adapter needle is located in the second connecting hole and partially extends out of the second connecting hole. The test probe passes through the first connecting hole and is connected to the adapter needle in the second connecting hole.

3. The detection auxiliary device according to claim 2, characterized in that: A third connection hole is formed on the adapter PCB board, and the adapter pin includes a first adapter portion and a second adapter portion, wherein the second adapter portion extends out of the third connection hole and is connected to the pin of the component to be tested.

4. The detection auxiliary device according to claim 3, characterized in that: The cross-sectional area of ​​the first transition portion is greater than the cross-sectional area of ​​the third connecting hole.

5. The detection auxiliary device according to any one of claims 3 or 4, characterized in that: The first adapter portion and the second adapter portion are cylindrical in shape, and a diameter of the first adapter portion is greater than a diameter of the second adapter portion and the third connecting hole.

6. A detection device, characterized in that: include: A detection auxiliary device and a detection device body as described in any one of claims 1 to 5.

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