Method for manufacturing conductive film and conductive film

Abstract

The present invention discloses a method for manufacturing a conductive film, the conductive film includes a substrate, a structural layer and a conductive layer, the method includes: forming a plurality of grooves of the same depth in the structural layer; and forming a first conductive layer having a first pattern in the plurality of grooves; forming an insulating layer having a second pattern in the plurality of grooves; forming a second conductive layer having a third pattern on the insulating layer; wherein the first pattern is different from the third pattern, and the third pattern is at least the same as a part of the pattern of the second pattern. The present invention also discloses a conductive film manufactured by the above method. By manufacturing a plurality of conductive layers with different patterns in the same plurality of grooves, the alignment accuracy of each conductive layer is high, thereby ensuring the use effect of the conductive film.

Description

Technical Field

[0001] The present invention relates to the technical field of conductive films, and in particular to a method for manufacturing a conductive film and the conductive film. Background Art

[0002] In the prior art, the double-layer conductive film usually adopts a two-time stamping technology to form a groove structure, and then fills the conductive material in two different groove structures to form a double-layer conductive structure. However, when the double-layer conductive structure is formed by the two-time stamping technology, there is often a problem of misalignment of the two conductive layers, which will affect the use effect of the conductive film. In addition, the two-time stamping technology usually requires different molds for stamping, which will increase the cost of the mold.

[0003] The preceding description is intended to provide general background information and does not necessarily constitute prior art. Summary of the invention

[0004] The object of the present invention is to provide a method for manufacturing a conductive film with high alignment accuracy of multiple conductive layers and a conductive film.

[0005] The present invention provides a method for manufacturing a conductive film, the conductive film comprising a substrate, a structural layer and a conductive layer, the method comprising: forming a plurality of grooves of the same depth in the structural layer; forming a first conductive layer having a first pattern in the plurality of grooves; forming an insulating layer having a second pattern in the plurality of grooves; forming a second conductive layer having a third pattern on the insulating layer;

[0006] The first figure is different from the third figure, and the third figure is at least partially the same as the second figure.

[0007] In one embodiment, the second pattern is the same as a pattern formed by the plurality of grooves.

[0008] In one embodiment, the third graphic has some parts in common with the first graphic.

[0009] In one embodiment, the step of forming the plurality of grooves includes: coating a layer of UV light-curing glue on the substrate, using a mold to perform a stamping on the UV light-curing glue, and after curing, forming the plurality of grooves, and the UV light-curing glue forms the structural layer.

[0010] In one embodiment, the step of forming the first conductive layer includes: filling the conductive material into the multiple grooves by scraping according to the thickness of the first conductive layer, and curing to form a first conductive circuit; etching away part of the first conductive circuit according to the first pattern to form the first conductive layer.

[0011] In one embodiment, the step of forming the insulating layer includes: filling the insulating material into the multiple grooves by scraping according to the thickness of the insulating layer, and curing to form the insulating layer, wherein the surface of the insulating layer is flat and covers the first conductive layer and the bottoms of the multiple grooves not covered by the first conductive layer.

[0012] In one embodiment, the step of forming the second conductive layer includes: filling the conductive material in the plurality of grooves on the insulating layer by scraping according to the thickness of the second conductive layer, and curing to form a second conductive circuit; etching away part of the second conductive circuit according to the third pattern to form the second conductive layer.

[0013] The present invention also provides a conductive film, comprising a substrate, a structural layer, a first conductive layer, a second conductive layer and an insulating layer, wherein the structural layer is arranged on the substrate, the structural layer is provided with a plurality of grooves of the same depth, the first conductive layer, the second conductive layer and the insulating layer are arranged in the plurality of grooves, wherein the pattern of the first conductive layer is different from the pattern of the second conductive layer, and the pattern of the second conductive layer is at least the same as a portion of the pattern of the insulating layer.

[0014] In one embodiment, a pattern of the insulating layer is the same as a pattern formed by the plurality of grooves.

[0015] In one embodiment, the second conductive layer partially overlaps with the first conductive layer, and the insulating layer is located between the overlapping portions.

[0016] In one embodiment, the groove has a depth of 8-30 um and a width of 1-20 um.

[0017] In one embodiment, the thickness of the first conductive layer and the second conductive layer are both 1-10 um, and the width of both is equal to the width of the groove.

[0018] In one embodiment, the thickness of the insulating layer is 2-15 um, and the width of the insulating layer is equal to the width of the groove.

[0019] In one embodiment, a protective layer is further included on the outermost conductive layer, and a pattern of the protective layer is the same as a pattern formed by the plurality of grooves.

[0020] In one embodiment, the thickness of the protection layer is 2-10 um, and the width thereof is equal to the width of the grid groove.

[0021] The manufacturing method of the conductive film provided by the present invention manufactures a plurality of conductive layers with different patterns in the same plurality of grooves, so that the alignment accuracy of each conductive layer is high, thereby ensuring the use effect of the conductive film. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a flowchart of a method for manufacturing a conductive film according to an embodiment of the present invention;

[0023] Figure 2 is a flow chart of a method for manufacturing a conductive film according to an embodiment of the present invention;

[0024] Figure 3 4 is a structural diagram of a conductive film according to an embodiment of the present invention. DETAILED DESCRIPTION

[0025] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0026] Please refer to Figure 1 and Figure 2 , a method for manufacturing a conductive film provided in an embodiment of the present invention, the conductive film comprises a substrate coated with a UV light-curing adhesive and two conductive layers, the method comprising:

[0027] S1: forming a plurality of grooves of the same depth in the structural layer.

[0028] Specifically, a layer of UV light-curing adhesive is coated on the substrate, and a mold with the patterns of each conductive layer is used to perform a stamping on the UV light-curing adhesive to form multiple grooves of the same depth, and then the UV light-curing adhesive is cured; after curing, the UV light-curing adhesive layer forms a structural layer. The pattern formed by the multiple grooves is a mesh, including the patterns of each conductive layer; the depth of the mesh groove is determined according to the required number of layers.

[0029] S2: forming a first conductive layer having a first pattern in the mesh-shaped grooves.

[0030] Specifically, the conductive material is filled in the mesh groove by scraping, and the filled conductive material is not flush with the mesh groove. After sintering and curing, a first conductive circuit is formed. The thickness of the first conductive circuit is equal to the thickness of the first conductive layer, and the width is equal to the width of the mesh groove.

[0031] The first conductive circuit is etched according to the first pattern by using laser or chemical method to form a first conductive layer with the same width as the mesh groove.

[0032] In this embodiment, the first pattern is the same as a part of the pattern of the mesh-shaped groove. Therefore, the first conductive layer does not completely cover the bottom of the mesh-shaped groove.

[0033] In other embodiments, the conductive material is filled to be flush with the mesh grooves, and after solidification, etching is performed according to the first pattern and the thickness of the first conductive layer to form the first conductive layer.

[0034] S3: forming an insulating layer having a second pattern in the mesh-shaped grooves.

[0035] Specifically, the insulating material is filled in the mesh groove with the first conductive layer by scraping according to the thickness of the insulating layer, and the insulating material covers the first conductive layer and the bottom of the mesh groove that is not covered by the first conductive layer; after curing, an insulating layer is formed.

[0036] In other embodiments, the insulating material is filled to be flush with the mesh grooves, and after solidification, etching is performed according to the second pattern and the thickness of the insulating layer to form an insulating layer.

[0037] In this embodiment, the second pattern is the same as the pattern of the mesh groove, and the upper surface of the insulating layer is flat, its thickness is less than the remaining depth of the mesh groove having the first conductive layer, and its width is the same as the mesh groove width.

[0038] In other embodiments, the second pattern is the same as a part of the pattern of the mesh groove. That is, the insulating layer is only provided when the first conductive layer is not in contact with the next conductive layer and the lower surface of the next conductive layer is flat. The next conductive layer is provided on the insulating layer.

[0039] S4: forming a second conductive layer having a third pattern on the insulating layer.

[0040] In this embodiment, the third pattern is different from the first pattern, but the third pattern and the first pattern have a part of the same pattern, that is, the second conductive layer partially overlaps with the first conductive layer, and there is an insulating layer between the overlapping parts.

[0041] Specifically, the conductive material is filled in the mesh grooves by scraping on the insulating layer, the filled conductive material is not flush with the mesh grooves, and after sintering and curing, a second conductive circuit is formed. The thickness of the second conductive circuit is equal to the thickness of the first conductive layer, and the width is equal to the width of the mesh grooves.

[0042] According to the third pattern, the second conductive line is etched by laser or chemical etching to form a second conductive layer with the same width as the mesh groove.

[0043] In other embodiments, the conductive material is filled to be flush with the mesh grooves, and after solidification, etching is performed according to the third pattern and the thickness of the third conductive layer to form a second conductive layer.

[0044] In other embodiments, the third graphic is completely different from the first graphic or a portion of the third graphic is completely identical to the first graphic.

[0045] S5: forming a protective layer on the outermost conductive layer.

[0046] Specifically, when the conductive film has two conductive layers, the protective material is filled in the mesh groove having the first conductive layer, the insulating layer and the second conductive layer by scraping, and the protective material evenly fills the entire mesh groove having the first conductive layer, the insulating layer and the second conductive layer and is flush with it. That is, the protective material covers the second conductive layer and the surface of the insulating layer exposed after etching away part of the conductive circuit to form a protective layer. When the conductive film has more than two conductive layers, the protective material can be filled on the outermost conductive layer to form a protective layer with a flat surface.

[0047] Please refer to Figure 3 The present invention also discloses a conductive film, comprising a substrate 1, a structural layer 2, a first conductive layer 3, a second conductive layer 5 and an insulating layer 4. The structural layer 2 is disposed on the substrate 1, and the structural layer 2 is provided with a plurality of grooves 21 of the same depth, and the first conductive layer 3, the second conductive layer 5 and the insulating layer 4 are disposed in the plurality of grooves 21. The pattern of the second conductive layer 5 is different from the pattern of the first conductive layer 3, and the pattern of the second conductive layer 5 is at least the same as a portion of the pattern of the insulating layer 4.

[0048] The substrate 1 is a flexible transparent material; the structural layer 2 is a UV light curing adhesive, and the thickness of the structural layer 2 is slightly greater than the depth of the multiple grooves 21. The multiple grooves 21 are mesh-shaped, and the depth of the mesh grooves 21 is 8-30um and the width is 1-20um.

[0049] In this embodiment, the conductive film is provided with two conductive layers, and the pattern of the first conductive layer 3 is partially the same as the pattern of the second conductive layer 5. The first conductive layer 3 does not completely cover the bottom of the mesh groove 21, and the second conductive layer 5 does not completely cover the insulating layer 4. The insulating layer 4 covers the first conductive layer 3 and the bottom of the mesh groove 21 not covered by the first conductive layer; and the second conductive layer 5 is provided on the insulating layer and does not completely cover the upper surface of the insulating layer 4.

[0050] The first conductive layer 3 and the second conductive layer 5 are both made of silver or copper. Specifically, the first conductive layer 3 and the second conductive layer 5 are made of silver; the thickness of the first conductive layer 3 and the second conductive layer 5 are both 1-10 um, and the width of both is equal to the width of the mesh groove.

[0051] The insulating layer 4 is a UV light-curing adhesive, the upper surface of which is flat, the thickness is 2-15 um, and the width is equal to the width of the mesh groove.

[0052] In other embodiments, the insulating layer 4 is other polymer resins or insulating ink.

[0053] The conductive film is further provided with a protective layer 6, which is any one of ink, slurry or resin. The protective layer 6 covers the second conductive layer 5 and the insulating layer 4 not covered by the second conductive layer 5. The protective layer 6 has a thickness of 2-10 um and a width equal to that of the mesh groove 21.

[0054] In the method of this embodiment, multiple conductive layers with different patterns are made in the same multiple grooves, so that the alignment accuracy of each conductive layer is high, thereby ensuring the use effect of the conductive film. At the same time, multiple grooves formed by one stamping do not need to use different molds for stamping, which reduces the development cost of the mold.

[0055] In the accompanying drawings, the sizes and relative sizes of layers and regions are exaggerated for clarity. It should be understood that when an element, such as a layer, region, or substrate, is referred to as being "formed on," "disposed on," or "located on" another element, the element may be disposed directly on the other element, or there may be intervening elements. Conversely, when an element is referred to as being "formed directly on" or "disposed directly on" another element, there are no intervening elements.

[0056] In this document, the directions or positional relationships indicated by terms such as "up", "down", "front", "back", "left", "right", "top", "bottom", "inside", "outside", "vertical", and "horizontal" are based on the directions or positional relationships shown in the accompanying drawings and are only for the clarity of expressing the technical solutions and the convenience of description, and therefore should not be understood as limitations of the present invention.

[0057] In this document, the ordinal adjectives “first”, “second”, etc. used to describe elements are only used to distinguish elements with similar attributes, and do not mean that the elements described in this way must follow a given order, or time, space, level or other limitations.

[0058] As used herein, unless otherwise specified, “plurality” or “several” means two or more.

[0059] In this document, the terms "comprises," "comprising," or any other variations thereof, are intended to cover a non-exclusive inclusion of elements other than those listed and may also include additional elements not expressly listed.

[0060] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A method for manufacturing a conductive film, the conductive film comprising a substrate, a structural layer and a conductive layer, characterized in that: The method comprises: forming a plurality of grooves of the same depth in the structural layer; forming a first conductive layer having a first pattern in the plurality of grooves; forming an insulating layer having a second pattern in the plurality of grooves; forming a second conductive layer having a third pattern on the insulating layer; Among them, the first figure is different from the third figure, but the third figure has a part of the same figure as the first figure; the third figure is at least the same as a part of the second figure; the second figure is the same as the figure formed by the multiple grooves.

2. The method for manufacturing a conductive film according to claim 1, wherein: The step of forming the plurality of grooves includes: coating a layer of UV light-curing glue on the substrate, using a mold to perform a stamping on the UV light-curing glue, and after curing, forming the plurality of grooves, and the UV light-curing glue forms the structural layer.

3. The method for manufacturing a conductive film according to claim 1, wherein: The steps of forming the first conductive layer include: filling the conductive material into the plurality of grooves by scraping according to the thickness of the first conductive layer, and curing to form a first conductive circuit; etching away part of the first conductive circuit according to the first pattern to form the first conductive layer.

4. The method for manufacturing a conductive film according to claim 1, wherein: The step of forming the insulating layer includes: filling the insulating material into the multiple grooves by scraping according to the thickness of the insulating layer, and curing to form the insulating layer, wherein the surface of the insulating layer is flat and covers the first conductive layer and the bottoms of the multiple grooves not covered by the first conductive layer.

5. The method for manufacturing a conductive film according to claim 1, wherein: The step of forming the second conductive layer includes: filling the conductive material in the plurality of grooves on the insulating layer by scraping according to the thickness of the second conductive layer, and curing to form a second conductive circuit; etching away part of the second conductive circuit according to the third pattern to form the second conductive layer.

6. A conductive film, characterized in that: It includes a substrate, a structural layer, a first conductive layer, a second conductive layer and an insulating layer, wherein the structural layer is arranged on the substrate, the structural layer is provided with a plurality of grooves of the same depth, the first conductive layer, the second conductive layer and the insulating layer are arranged in the plurality of grooves, wherein the pattern of the first conductive layer is different from the pattern of the second conductive layer, the pattern of the second conductive layer is at least the same as part of the pattern of the insulating layer, the second conductive layer partially overlaps with the first conductive layer, and the insulating layer is between the overlapping parts; the pattern of the insulating layer is the same as the pattern formed by the plurality of grooves.

7. The conductive film according to claim 6, wherein: The groove has a depth of 8-30 um and a width of 1-20 um.

8. The conductive film according to claim 6, wherein: The thickness of the first conductive layer and the second conductive layer are both 1-10 um, and the width of both is equal to the width of the groove.

9. The conductive film according to claim 6, wherein: The thickness of the insulating layer is 2-15 um, and the width of the insulating layer is equal to the width of the groove.

10. The conductive film according to any one of claims 6 to 9, characterized in that: It also includes a protection layer arranged on the outermost conductive layer, wherein the pattern of the protection layer is the same as the pattern formed by the plurality of grooves.

11. The conductive film according to claim 10, wherein: The thickness of the protection layer is 2-10 um, and the width thereof is equal to the width of the groove.

Images