A white light LED chip with isotropic spectrum and synchronous light decay and a manufacturing method thereof

Abstract

The present invention provides a white light LED chip with isotropic spectrum and synchronous light decay and a manufacturing method, comprising: a substrate; a light-emitting film layer arranged on one side of the substrate; a protective layer arranged on the side of the white light LED chip, the protective layer having a reflective effect so that the white light LED chip can emit light from one side; a three-dimensional fluorescent adhesive layer arranged on the light-emitting surface, the thickness of each position of the three-dimensional fluorescent adhesive layer matches the blue light intensity at the corresponding position. In other words, by setting the white light LED chip to emit light from one side, and matching the thickness of each position of the three-dimensional fluorescent adhesive layer with the blue light intensity at the corresponding position, the spectrum of each position in the illuminated area will not be different in space, and the blue light chip and the fluorescent adhesive layer will decay synchronously during long-term use, and their spectrum will not be different in time.

Description

Technical Field

[0001] The present invention relates to the technical field of LED chips, and more specifically to a white light LED chip with isotropic spectrum and synchronous light decay and a manufacturing method thereof. Background Art

[0002] As a lighting source, LED is both energy-saving and environmentally friendly. It has opened a new era of human lighting and is closely related to people's lives.

[0003] Although LED lamps are gradually replacing traditional lighting sources such as incandescent lamps and fluorescent tubes, they still have some other defects.

[0004] Traditional lighting sources such as incandescent lamps and fluorescent lamps have the same spectral spatial distribution, that is, the spectrum at every position in the illuminated area is consistent, and they are isotropic light sources. In addition to the difference in intensity, the shape of the spectrum lines before and after aging is the same, which means that the light decay of each wavelength is synchronized.

[0005] However, there are obvious differences in the spatial distribution of the spectrum of LED lighting. Its spectrum is spatially anisotropic, and there are obvious differences in the spectral shape before and after aging, and its light decay is not synchronized. Summary of the invention

[0006] In view of this, in order to solve the above problems, the present invention provides a white light LED chip with isotropic spectrum and synchronous light decay and a manufacturing method, and the technical solution is as follows:

[0007] A white light LED chip with isotropic spectrum and synchronous light decay, the white light LED chip comprising:

[0008] substrate;

[0009] A light-emitting thin film layer disposed on one side of the substrate;

[0010] A protective layer is arranged on the side of the white light LED chip, and the protective layer has a reflective effect so that the white light LED chip can emit light from a single side;

[0011] A three-dimensional fluorescent glue layer is arranged on the light emitting surface, and the thickness of each position of the three-dimensional fluorescent glue layer matches the intensity of the blue light at the corresponding position.

[0012] Preferably, in the above-mentioned white light LED chip, the substrate is a transparent substrate.

[0013] Preferably, in the above white light LED chip, the light emitting thin film layer and the three-dimensional fluorescent adhesive layer are arranged on both sides of the substrate.

[0014] Preferably, in the above white light LED chip, the white light LED chip further comprises:

[0015] An N-electrode pad and a P-electrode pad are arranged on a side of the light-emitting thin film layer away from the substrate.

[0016] Preferably, in the above white light LED chip, the light emitting thin film layer and the three-dimensional fluorescent glue layer are arranged on the same side of the substrate, and the light emitting thin film layer is located between the three-dimensional fluorescent glue layer and the substrate.

[0017] Preferably, in the above white light LED chip, the white light LED chip further comprises:

[0018] An N-electrode pad and a P-electrode pad are arranged on a side of the light-emitting thin film layer away from the substrate.

[0019] Preferably, in the above-mentioned white light LED chip, the protective layer also partially covers the light-emitting thin film layer, and does not cover the N-electrode pad and the P-electrode pad.

[0020] Preferably, in the above white light LED chip, the thickness of each position of the three-dimensional fluorescent glue layer matches the intensity of the blue light at the corresponding position, including:

[0021] The thickness of each position of the three-dimensional fluorescent glue layer and the intensity of the blue light at that position satisfy: T i =K2*WLD i *E i / (CCT*Ra);

[0022] Among them, T i Indicates the thickness of the three-dimensional fluorescent glue layer at position i of the light emitting surface of the white light LED chip;

[0023] K2 represents the coefficient constant;

[0024] WLD i represents the wavelength of blue light at position i of the light emitting surface of the white light LED chip;

[0025] E i Indicates the blue light intensity at position i of the light emitting surface of the white light LED chip;

[0026] CCT indicates the target color temperature;

[0027] Ra stands for target display index.

[0028] Preferably, in the above white light LED chip, the white light LED chip further comprises:

[0029] A silica gel layer is arranged between the three-dimensional fluorescent glue layer and the light emitting surface.

[0030] Preferably, in the above white light LED chip, the three-dimensional fluorescent glue layer comprises:

[0031] A red-pink fluorescent adhesive layer, a yellow-pink fluorescent adhesive layer and a green-pink fluorescent adhesive layer.

[0032] Preferably, in the above white light LED chip, the red-pink fluorescent glue layer, the yellow-pink fluorescent glue layer and the green-pink fluorescent glue layer are sequentially arranged on the light emitting surface, and the red-pink fluorescent glue layer is arranged adjacent to the light emitting surface.

[0033] A method for manufacturing a white light LED chip with isotropic spectrum and synchronous light decay, the manufacturing method comprising:

[0034] providing a substrate;

[0035] forming a light-emitting thin film layer on one side of the substrate;

[0036] A protective layer is formed on the side of the white light LED chip, wherein the protective layer has a reflective effect so that the white light LED chip can emit light from a single side;

[0037] A three-dimensional fluorescent glue layer is formed on the light emitting surface, and the thickness of each position of the three-dimensional fluorescent glue layer matches the intensity of the blue light at the corresponding position.

[0038] Preferably, in the above manufacturing method, forming a three-dimensional fluorescent glue layer on the light emitting surface comprises:

[0039] forming a fluorescent glue layer on the light emitting surface;

[0040] The fluorescent glue layer is three-dimensionally micro-carved by adopting a three-dimensional micro-carving technology to form the three-dimensional fluorescent glue layer, and the thickness of each position of the three-dimensional fluorescent glue layer matches the intensity of the blue light at the corresponding position.

[0041] Preferably, in the above manufacturing method, the thickness of each position of the three-dimensional fluorescent glue layer matches the intensity of the blue light at the corresponding position, including:

[0042] The thickness of each position of the three-dimensional fluorescent glue layer and the intensity of the blue light at that position satisfy: T i =K2*WLD i *E i / (CCT*Ra);

[0043] Among them, T i Indicates the thickness of the three-dimensional fluorescent glue layer at position i of the light emitting surface of the white light LED chip;

[0044] K2 represents the coefficient constant;

[0045] WLD i represents the wavelength of blue light at position i of the light emitting surface of the white light LED chip;

[0046] Ei Indicates the blue light intensity at position i of the light emitting surface of the white light LED chip;

[0047] CCT indicates the target color temperature;

[0048] Ra stands for target display index.

[0049] Compared with the prior art, the present invention has the following beneficial effects:

[0050] The present invention provides a white light LED chip with isotropic spectrum and synchronous light decay, comprising: a substrate; a luminescent film layer arranged on one side of the substrate; a protective layer arranged on the side of the white light LED chip, the protective layer having a reflective effect so that the white light LED chip can emit light from one side; and a three-dimensional fluorescent glue layer arranged on the light emitting surface, the thickness of each position of the three-dimensional fluorescent glue layer matching the blue light intensity at the corresponding position.

[0051] That is to say, by setting the white light LED chip to emit light on one side, and matching the thickness of each position of the three-dimensional fluorescent glue layer with the blue light intensity at the corresponding position, the spectrum of each position in the illuminated area will not be spatially different, and the blue light chip and the fluorescent glue layer will decay synchronously during long-term use, and their spectra will not be different in time. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0053] Figure 1 A schematic diagram of the structure of a white light LED chip with isotropic spectrum and synchronous light decay provided by an embodiment of the present invention;

[0054] Figure 2 A schematic diagram of the structure of another white light LED chip with isotropic spectrum and synchronous light decay provided by an embodiment of the present invention;

[0055] Figure 3 A schematic diagram of the structure of another white light LED chip with isotropic spectrum and synchronous light decay provided by an embodiment of the present invention;

[0056] Figure 4 A schematic diagram of the structure of another white light LED chip with isotropic spectrum and synchronous light decay provided by an embodiment of the present invention;

[0057] Figure 5A schematic diagram of the structure of another white light LED chip with isotropic spectrum and synchronous light decay provided by an embodiment of the present invention;

[0058] Figure 6 A schematic diagram of the structure of another white light LED chip with isotropic spectrum and synchronous light decay provided by an embodiment of the present invention;

[0059] Figure 7 A schematic diagram of the structure of another white light LED chip with isotropic spectrum and synchronous light decay provided by an embodiment of the present invention;

[0060] Figure 8 A schematic diagram of the structure of another white light LED chip with isotropic spectrum and synchronous light decay provided by an embodiment of the present invention;

[0061] Fig. 9 A schematic diagram of the structure of another white light LED chip with isotropic spectrum and synchronous light decay provided by an embodiment of the present invention;

[0062] Fig.10 A schematic diagram of the structure of another white light LED chip with isotropic spectrum and synchronous light decay provided by an embodiment of the present invention;

[0063] Fig.11 A schematic flow chart of a method for manufacturing a white light LED chip with isotropic spectrum and synchronous light decay provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0064] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0065] At present, the way to realize LED lamps is to first encapsulate LED blue light chips and phosphors into LED white light lamp beads or modules, and then combine the lamp beads or modules with secondary optical components, heat dissipation components and power supplies to form lamps.

[0066] At present, due to the limitations of existing technologies, the problem of isotropic spectrum and synchronous light decay cannot be solved when LEDs are packaged into lamp beads or modules. This problem cannot be solved when secondary optical components are added to form lamps.

[0067] LED white light lamp beads or modules are composed of blue light chips, phosphors and bracket packages. The packaging forms currently widely used in lighting are divided into two types: with bowl cups and without bowl cups.

[0068] The packaging forms with or similar to bowls and cups include imitation lumen, TOP and COB packaging. This packaging form is to put fluorescent glue in the bowl cup with the blue light chip fixed to obtain white light LED.

[0069] The packaging forms without bowl cups include the packaging form of spraying phosphor and the packaging form of directly encapsulating white light chips with direct coating of phosphor.

[0070] However, no matter which packaging form is used, it is impossible to achieve isotropic spectrum and synchronous light attenuation in principle.

[0071] Based on the three different structures of blue light chips, ipsilateral, flip-chip and vertical, no matter which structure the blue light chip is, it is an anisotropic light source, and the blue light intensity in each direction is different. The substrates of ipsilateral structure chips and flip-chip structure chips are transparent, and there are five sides that emit blue light. Among them, the flip-chip chip with silicon carbide substrate has more light-emitting surfaces, so its light intensity anisotropy is the most obvious; the thin-film chip with vertical structure, although only one side emits light, its light intensity in each direction is still different.

[0072] For white light LEDs that use dot phosphor glue packaging, due to the unreasonable structural relationship between the phosphor and the chip, the phosphors in different areas are excited by blue light of different densities, so that different areas emit yellow light of different intensities and scatter blue light of different intensities, making the spectrum of the white light LED inconsistent in all directions.

[0073] However, the current white light LED packaging has the lowest manufacturing cost and the largest market size, especially in indoor lighting. When using traditional light sources for lighting, people will not feel the difference in color of the same object at different locations in the lighting area, but when using LED light sources for lighting, people will feel the difference in color. The fundamental reason is that white light LEDs have not solved the problem of isotropic spectrum.

[0074] Furthermore, in recent years, the LED packaging method combining phosphor spraying and molding lens has become a hot topic in research and industry.

[0075] Flip-chip, same-side and vertical structure chips can all be used in this packaging form, among which flip-chip chips are the most common.

[0076] The process of spraying phosphor can improve the isotropic performance of white light LED to a certain extent, because the distribution shape of phosphor can basically adapt to the shape of chip.

[0077] However, when spraying phosphor, a diluent must be added to the phosphor glue to achieve the phosphor spraying effect. Since the fluidity of the phosphor glue is too strong, this directly causes the phosphor at the edge of the top surface of the chip to become thinner due to loss, and the phosphor at the root of the chip to become thicker.

[0078] When using the phosphor spraying method, even a vertical structure chip with single-sided light output cannot achieve an isotropic spectrum due to the loss of phosphor glue at the top edge; for a flip-chip structure chip, not only can the top edge not achieve equal density excitation of phosphor by blue light, but the side with less light output has the most phosphor, which makes it more difficult to achieve isotropic spectrum of white light LED. Therefore, the packaging method of spraying phosphor still cannot solve the isotropic spectrum problem of white light LED.

[0079] Furthermore, the current method for achieving relatively good isotropic performance of white light LEDs is to first directly coat the surface of a thin-film chip that emits light on only one side with phosphor to make it into a white light chip, and then package it into an LED lamp bead.

[0080] Thin-film chips are devices that emit light from a single side. The isotropic spectral performance of white light chips made of them and directly coated with phosphor can be improved to a certain extent; however, since the phosphor direct coating layer has a certain thickness, the excitation density of the blue light-excited phosphor at a larger light output angle will be different from that in the middle of the table, resulting in the direct-coated chip detecting at a large angle. Its white spectrum will still be different from the white spectrum detected from the front, and the smaller the chip size, the more obvious the difference, which also shows that the direct-coated white light chip has not completely solved the isotropic spectral problem.

[0081] From the above description, we can know that LED white light sources emit different spectra in different directions in space, and the light decay of phosphor and blue light chip is not synchronized in time, resulting in that people will not feel the difference in color of the same object at different positions in the LED lighting area, but will feel the difference in color when other LED light sources are used for lighting.

[0082] Based on the above problems, the present application is created to provide a white light LED with isotropic spectrum and synchronous light decay, which perfectly solves the technical problems existing in the prior art.

[0083] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0084] refer to Figure 1 , Figure 1 A schematic diagram of the structure of a white light LED chip with isotropic spectrum and synchronous light decay provided by an embodiment of the present invention.

[0085] The white light LED chip comprises:

[0086] Base 11;

[0087] A light-emitting thin film layer 12 disposed on one side of the substrate 11;

[0088] A protective layer 13 is provided on the side of the white light LED chip, wherein the protective layer 13 has a reflective effect so that the white light LED chip can emit light from a single side;

[0089] The three-dimensional fluorescent glue layer 14 is arranged on the light emitting surface, and the thickness of each position of the three-dimensional fluorescent glue layer 14 matches the intensity of the blue light at the corresponding position.

[0090] In this embodiment, the white light LED chip is set to emit light on one side, and the thickness of each position of the three-dimensional fluorescent glue layer 14 is matched with the blue light intensity at the corresponding position, so that the spectrum of each position in the illuminated area will not be spatially different, and during long-term use, the blue light chip and the fluorescent glue layer will decay synchronously, and their spectra will not be different in time.

[0091] It should be noted that, since the positions of the light-emitting film layer 12 and the three-dimensional fluorescent glue layer 14 are uncertain, Figure 1 The structure of a white light LED chip is only described as an example, and its specific structure is described in detail in the following embodiments.

[0092] Further, based on the above embodiments of the present invention, refer to Figure 2 , Figure 2 A schematic diagram of the structure of another white light LED chip with isotropic spectrum and synchronous light decay provided by an embodiment of the present invention.

[0093] Take the flip-chip structure as an example:

[0094] The substrate 11 is a transparent substrate.

[0095] The light-emitting film layer 12 and the three-dimensional fluorescent glue layer 14 are arranged on both sides of the substrate 11. Moreover, the side where the three-dimensional fluorescent glue layer 14 is located is the light-emitting surface of the white light LED chip.

[0096] The white light LED chip further comprises:

[0097] An N-electrode pad 16 and a P-electrode pad 15 are disposed on a side of the light-emitting thin film layer 12 away from the substrate 11 .

[0098] There is an insulating region between the N-electrode pad 16 and the P-electrode pad 15 .

[0099] In this embodiment, the protective layer 13 is used to make the flip-chip white light LED chip emit light from a single side, and the thickness of each position of the three-dimensional fluorescent glue layer 14 and the intensity of the blue light at the position satisfy: Ti =K2*WLD i *E i / (CCT*Ra);

[0100] Among them, T i Indicates the thickness of the three-dimensional fluorescent glue layer at position i of the light emitting surface of the white light LED chip;

[0101] K2 represents the coefficient constant (usually obtained by experiment);

[0102] WLD i represents the wavelength of blue light at position i of the light emitting surface of the white light LED chip;

[0103] E i Indicates the blue light intensity at position i of the light emitting surface of the white light LED chip;

[0104] CCT indicates the target color temperature;

[0105] Ra stands for target display index.

[0106] Thus, a flip-chip white light LED chip with isotropic spectrum and synchronous light decay is formed.

[0107] Further, based on the above embodiments of the present invention, refer to Figure 3 , Figure 3 A schematic diagram of the structure of another white light LED chip with isotropic spectrum and synchronous light decay provided by an embodiment of the present invention.

[0108] The flip-chip white light LED chip with isotropic spectrum and synchronous light decay also includes:

[0109] A silicone layer 17 is disposed between the three-dimensional fluorescent glue layer 14 and the light emitting surface.

[0110] In this embodiment, since the white light LED chip generates heat during operation, the three-dimensional fluorescent glue layer 14 is not directly heated by providing the silicone layer 17 , thereby effectively reducing the aging degree of the three-dimensional fluorescent glue layer 14 .

[0111] Further, based on the above embodiments of the present invention, refer to Figure 4 , Figure 4 A schematic diagram of the structure of another white light LED chip with isotropic spectrum and synchronous light decay provided by an embodiment of the present invention.

[0112] In the flip-chip white light LED chip with isotropic spectrum and synchronous light decay, the three-dimensional fluorescent glue layer 14 includes:

[0113] A red fluorescent glue layer 141 , a yellow fluorescent glue layer 142 and a green fluorescent glue layer 143 .

[0114] The red-pink fluorescent glue layer 141 , the yellow-pink fluorescent glue layer 142 , and the green-pink fluorescent glue layer 143 are sequentially arranged on the light emitting surface, and the red-pink fluorescent glue layer 141 is arranged adjacent to the light emitting surface.

[0115] In this embodiment, if the red-pink fluorescent light, the yellow-pink fluorescent light and the green-pink fluorescent light are mixed and arranged in the same layer, the light attenuation problem may occur because the individual excitation lights may affect each other.

[0116] Therefore, dividing the three-dimensional fluorescent glue layer 14 into a red-pink fluorescent glue layer 141, a yellow-pink fluorescent glue layer 142 and a green-pink fluorescent glue layer 143, and stacking them in a preset order can solve the above problem and further improve the display effect of the white light LED chip.

[0117] Further, based on the above embodiments of the present invention, refer to Figure 5 , Figure 5 A schematic diagram of the structure of another white light LED chip with isotropic spectrum and synchronous light decay provided by an embodiment of the present invention.

[0118] Take the same-side structure as an example:

[0119] The luminescent film layer 12 and the three-dimensional fluorescent glue layer 14 are arranged on the same side of the substrate 11, and the luminescent film layer 12 is located between the three-dimensional fluorescent glue layer 14 and the substrate 11. The side where the three-dimensional fluorescent glue layer 14 is located is the light emitting surface of the white light LED chip.

[0120] The white light LED chip further comprises:

[0121] An N-electrode pad 16 and a P-electrode pad 15 are disposed on a side of the light-emitting thin film layer 12 away from the substrate 11 .

[0122] The protection layer 13 also partially covers the light-emitting thin film layer 12 , and does not cover the N-electrode pad 16 and the P-electrode pad 15 .

[0123] In this embodiment, the protective layer 13 partially covers the light-emitting film layer 12, and does not cover the N-electrode pad 16 and the P-electrode pad 15, thereby defining the setting area of ​​the three-dimensional fluorescent glue layer 14, which is also the light-emitting area, so that the flip-chip white light LED chip forms a single-sided light emission, and the thickness of each position of the three-dimensional fluorescent glue layer 14 and the blue light intensity at the position satisfy: T i =K2*WLD i *E i / (CCT*Ra);

[0124] Among them, T i Indicates the thickness of the three-dimensional fluorescent glue layer at position i of the light emitting surface of the white light LED chip;

[0125] K2 represents the coefficient constant (usually obtained by experiment);

[0126] WLD i represents the wavelength of blue light at position i of the light emitting surface of the white light LED chip;

[0127] E i Indicates the blue light intensity at position i of the light emitting surface of the white light LED chip;

[0128] CCT indicates the target color temperature;

[0129] Ra stands for target display index.

[0130] Thus, a white light LED chip with isotropic spectrum and synchronous light decay and same-side structure is formed.

[0131] Further, based on the above embodiments of the present invention, refer to Figure 6 , Figure 6 A schematic diagram of the structure of another white light LED chip with isotropic spectrum and synchronous light decay provided by an embodiment of the present invention.

[0132] The white light LED chip with isotropic spectrum and synchronous light decay on the same side structure also includes:

[0133] A silicone layer 17 is disposed between the three-dimensional fluorescent glue layer 14 and the light emitting surface.

[0134] The silicone layer 17 is disposed between the three-dimensional fluorescent glue layer 14 and the light-emitting film layer 12 .

[0135] In this embodiment, since the white light LED chip generates heat during operation, the three-dimensional fluorescent glue layer 14 is not directly heated by providing the silicone layer 17 , thereby effectively reducing the aging degree of the three-dimensional fluorescent glue layer 14 .

[0136] Further, based on the above embodiments of the present invention, refer to Figure 7 , Figure 7 A schematic diagram of the structure of another white light LED chip with isotropic spectrum and synchronous light decay provided by an embodiment of the present invention.

[0137] In the white light LED chip with isotropic spectrum and synchronous light decay on the same side, the three-dimensional fluorescent glue layer 14 includes:

[0138] A red fluorescent glue layer 141 , a yellow fluorescent glue layer 142 and a green fluorescent glue layer 143 .

[0139] The red-pink fluorescent glue layer 141 , the yellow-pink fluorescent glue layer 142 , and the green-pink fluorescent glue layer 143 are sequentially arranged on the light-emitting surface, and the red-pink fluorescent glue layer 141 is arranged adjacent to the light-emitting surface.

[0140] In this embodiment, if the red-pink fluorescent light, the yellow-pink fluorescent light and the green-pink fluorescent light are mixed and arranged in the same layer, the light attenuation problem may occur because the individual excitation lights may affect each other.

[0141] Therefore, dividing the three-dimensional fluorescent glue layer 14 into a red-pink fluorescent glue layer 141, a yellow-pink fluorescent glue layer 142 and a green-pink fluorescent glue layer 143, and stacking them in a preset order can solve the above problem and further improve the display effect of the white light LED chip.

[0142] Further, based on the above embodiments of the present invention, refer to Figure 8 , Figure 8 A schematic diagram of the structure of another white light LED chip with isotropic spectrum and synchronous light decay provided by an embodiment of the present invention.

[0143] Take the vertical structure as an example:

[0144] The luminescent film layer 12 and the three-dimensional fluorescent glue layer 14 are arranged on the same side of the substrate 11, and the luminescent film layer 12 is located between the three-dimensional fluorescent glue layer 14 and the substrate 11. The side where the three-dimensional fluorescent glue layer 14 is located is the light emitting surface of the white light LED chip.

[0145] In this embodiment, since the vertical structure LED chip itself emits light from a single side, the protective layer mainly plays a protective role in the vertical structure white light LED chip.

[0146] On the light-emitting side, the thickness of each position of the three-dimensional fluorescent glue layer 14 and the intensity of the blue light at that position satisfy: T i =K2*WLD i *E i / (CCT*Ra);

[0147] Among them, T i Indicates the thickness of the three-dimensional fluorescent glue layer at position i of the light emitting surface of the white light LED chip;

[0148] K2 represents the coefficient constant (usually obtained by experiment);

[0149] WLD i represents the wavelength of blue light at position i of the light emitting surface of the white light LED chip;

[0150] E i Indicates the blue light intensity at position i of the light emitting surface of the white light LED chip;

[0151] CCT indicates the target color temperature;

[0152] Ra stands for target display index.

[0153] Thus, a vertically structured white light LED chip with isotropic spectrum and synchronous light decay is formed.

[0154] Further, based on the above embodiments of the present invention, refer to Fig. 9 , Fig. 9 A schematic diagram of the structure of another white light LED chip with isotropic spectrum and synchronous light decay provided by an embodiment of the present invention.

[0155] The vertical structure white light LED chip with isotropic spectrum and synchronous light decay also includes:

[0156] A silicone layer 17 is disposed between the three-dimensional fluorescent glue layer 14 and the light emitting surface.

[0157] The silicone layer 17 is disposed between the three-dimensional fluorescent glue layer 14 and the light-emitting film layer 12 .

[0158] In this embodiment, since the white light LED chip generates heat during operation, the three-dimensional fluorescent glue layer 14 is not directly heated by providing the silicone layer 17 , thereby effectively reducing the aging degree of the three-dimensional fluorescent glue layer 14 .

[0159] Further, based on the above embodiments of the present invention, refer to Fig.10 , Fig.10 A schematic diagram of the structure of another white light LED chip with isotropic spectrum and synchronous light decay provided by an embodiment of the present invention.

[0160] In the vertical structure white light LED chip with isotropic spectrum and synchronous light decay, the three-dimensional fluorescent glue layer 14 includes:

[0161] A red fluorescent glue layer 141 , a yellow fluorescent glue layer 142 and a green fluorescent glue layer 143 .

[0162] The red-pink fluorescent glue layer 141 , the yellow-pink fluorescent glue layer 142 , and the green-pink fluorescent glue layer 143 are sequentially arranged on the light-emitting surface, and the red-pink fluorescent glue layer 141 is arranged adjacent to the light-emitting surface.

[0163] In this embodiment, if the red-pink fluorescent light, the yellow-pink fluorescent light and the green-pink fluorescent light are mixed and arranged in the same layer, the light attenuation problem may occur because the individual excitation lights may affect each other.

[0164] Therefore, dividing the three-dimensional fluorescent glue layer 14 into a red-pink fluorescent glue layer 141, a yellow-pink fluorescent glue layer 142 and a green-pink fluorescent glue layer 143, and stacking them in a preset order can solve the above problem and further improve the display effect of the white light LED chip.

[0165] From the above description, it can be seen that the present application sets the white light LED chip to emit light on one side, and the thickness of each position of the three-dimensional fluorescent glue layer matches the blue light intensity at the corresponding position, so that the spectrum of each position in the illuminated area will not be spatially different, and during long-term use, the blue light chip and the fluorescent glue layer will decay synchronously, and their spectra will not be different in time.

[0166] Moreover, the LED of the present application is a white light chip rather than a white light lamp bead. The white light LED chip is obtained during chip processing rather than obtaining the white light LED lamp bead during packaging, thereby reducing the links in the technical chain of LED lighting sources; white light LED chips can be obtained in batches at the same time during chip processing rather than obtaining the white light LED lamp bead one by one during packaging, thereby significantly improving the production efficiency of white light LEDs; the white light LED chip will not have differences in luminescence and lighting effects due to the diversity of packaging forms, thereby avoiding the different luminescence and lighting effects of the same blue light chip and white light LED chip packaged with phosphor due to different packaging forms.

[0167] Furthermore, the three-dimensional fluorescent adhesive layer on the surface of the white light LED chip of the present application has consistent heat generation, heat dissipation and heat transfer, and the three-dimensional fluorescent adhesive layer will not have the problem of regional uneven light decay during use.

[0168] Furthermore, the red, yellow, and green phosphors of the high-crystal-ratio white light LED chip of the present application are arranged in layers, which can not only reduce the loss of light efficiency due to mutual excitation of multiple phosphors, but also achieve synchronous light decay of multiple phosphors.

[0169] Furthermore, the white light LE chip of the present application is implemented using square chips instead of round chips, which can significantly increase the consistency of light color parameters of the white light LED chip.

[0170] Further, based on all the above embodiments of the present invention, another embodiment of the present invention further provides a method for manufacturing a white light LED chip with isotropic spectrum and synchronous light decay, referring to Fig.11 , Fig.11 A schematic flow chart of a method for manufacturing a white light LED chip with isotropic spectrum and synchronous light decay provided by an embodiment of the present invention.

[0171] The production method comprises:

[0172] S101: providing a substrate.

[0173] S102: forming a light-emitting thin film layer on one side of the substrate.

[0174] S103: forming a protective layer on the side of the white light LED chip, wherein the protective layer has a reflective effect so that the white light LED chip can emit light from a single side.

[0175] S104: forming a three-dimensional fluorescent glue layer on the light emitting surface, wherein the thickness of each position of the three-dimensional fluorescent glue layer matches the intensity of the blue light at the corresponding position.

[0176] Further, based on the above embodiment of the present invention, the step of forming a three-dimensional fluorescent glue layer on the light emitting surface includes:

[0177] forming a fluorescent glue layer on the light emitting surface;

[0178] The fluorescent glue layer is three-dimensionally micro-carved by adopting a three-dimensional micro-carving technology to form the three-dimensional fluorescent glue layer, and the thickness of each position of the three-dimensional fluorescent glue layer matches the intensity of the blue light at the corresponding position.

[0179] Further, based on the above embodiment of the present invention, the thickness of each position of the three-dimensional fluorescent glue layer matches the intensity of the blue light at the corresponding position, including:

[0180] The thickness of each position of the three-dimensional fluorescent glue layer and the intensity of the blue light at that position satisfy: T i =K2*WLD i *E i / (CCT*Ra);

[0181] Among them, T i Indicates the thickness of the three-dimensional fluorescent glue layer at position i of the light emitting surface of the white light LED chip;

[0182] K2 represents the coefficient constant;

[0183] WLD i represents the wavelength of blue light at position i of the light emitting surface of the white light LED chip;

[0184] E i Indicates the blue light intensity at position i of the light emitting surface of the white light LED chip;

[0185] CCT indicates the target color temperature;

[0186] Ra stands for target display index.

[0187] It should be noted that the manufacturing method provided in the embodiment of the present invention has the same principle as the white light LED chip provided in the above embodiment, and will not be described in detail here.

[0188] The above is a detailed introduction to a white light LED chip with isotropic spectrum and synchronous light decay and a manufacturing method provided by the present invention. Specific examples are used in this article to illustrate the principle and implementation method of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for general technicians in this field, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

[0189] It should be noted that each embodiment in this specification is described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part description.

[0190] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device that includes a series of elements is inherent to the elements, or also includes elements inherent to these processes, methods, articles or devices. In the absence of further restrictions, the elements defined by the sentence "including a..." do not exclude the presence of other identical elements in the process, method, article or device that includes the elements.

[0191] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A white light LED chip with isotropic spectrum and synchronous light decay, characterized in that: The white light LED chip comprises: substrate; A light-emitting thin film layer disposed on one side of the substrate; A protective layer is arranged on the side of the white light LED chip, and the protective layer has a reflective effect so that the white light LED chip can emit light from a single side; A three-dimensional fluorescent glue layer is arranged on the light emitting surface, wherein the thickness of each position of the three-dimensional fluorescent glue layer matches the intensity of the blue light at the corresponding position; Wherein, the thickness of each position of the three-dimensional fluorescent glue layer matches the intensity of the blue light at the corresponding position, including: The thickness of each position of the three-dimensional fluorescent glue layer and the intensity of the blue light at that position satisfy: ； in, Indicates the thickness of the three-dimensional fluorescent glue layer at position i of the light emitting surface of the white light LED chip; represents the coefficient constant; represents the wavelength of blue light at position i of the light emitting surface of the white light LED chip; Indicates the blue light intensity at position i of the light emitting surface of the white light LED chip; Indicates the target color temperature; Indicates the target display index; Wherein, the white light LED chip further comprises: A silica gel layer is arranged between the three-dimensional fluorescent glue layer and the light emitting surface.

2. The white light LED chip according to claim 1, characterized in that: The substrate is a transparent substrate.

3. The white light LED chip according to claim 2, characterized in that: The light-emitting film layer and the three-dimensional fluorescent glue layer are arranged on both sides of the substrate.

4. The white light LED chip according to claim 3, characterized in that: The white light LED chip further comprises: An N-electrode pad and a P-electrode pad are arranged on a side of the light-emitting thin film layer away from the substrate.

5. The white light LED chip according to claim 1, characterized in that: The light-emitting film layer and the three-dimensional fluorescent glue layer are arranged on the same side of the substrate, and the light-emitting film layer is located between the three-dimensional fluorescent glue layer and the substrate.

6. The white light LED chip according to claim 5, characterized in that: The white light LED chip further comprises: An N-electrode pad and a P-electrode pad are arranged on a side of the light-emitting thin film layer away from the substrate.

7. The white light LED chip according to claim 6, characterized in that: The protection layer also partially covers the light-emitting thin film layer, and does not cover the N-electrode pad and the P-electrode pad.

8. The white light LED chip according to claim 1, characterized in that: The three-dimensional fluorescent glue layer comprises: A red-pink fluorescent adhesive layer, a yellow-pink fluorescent adhesive layer and a green-pink fluorescent adhesive layer.

9. The white light LED chip according to claim 8, characterized in that: The red-pink fluorescent glue layer, the yellow-pink fluorescent glue layer and the green-pink fluorescent glue layer are sequentially arranged on the light-emitting surface, and the red-pink fluorescent glue layer is arranged adjacent to the light-emitting surface.

10. A method for manufacturing a white light LED chip with isotropic spectrum and synchronous light decay, the manufacturing method comprising: providing a substrate; forming a light-emitting thin film layer on one side of the substrate; A protective layer is formed on the side of the white light LED chip, wherein the protective layer has a reflective effect so that the white light LED chip can emit light from a single side; Forming a three-dimensional fluorescent glue layer on the light emitting surface, wherein the thickness of each position of the three-dimensional fluorescent glue layer matches the intensity of the blue light at the corresponding position; Wherein, the thickness of each position of the three-dimensional fluorescent glue layer matches the intensity of the blue light at the corresponding position, including: The thickness of each position of the three-dimensional fluorescent glue layer and the intensity of the blue light at that position satisfy: ； in, Indicates the thickness of the three-dimensional fluorescent glue layer at position i of the light emitting surface of the white light LED chip; represents the coefficient constant; represents the wavelength of blue light at position i of the light emitting surface of the white light LED chip; Indicates the blue light intensity at position i of the light emitting surface of the white light LED chip; Indicates the target color temperature; Indicates the target display index.

11. The manufacturing method according to claim 10, characterized in that: The step of forming a three-dimensional fluorescent glue layer on the light emitting surface comprises: forming a fluorescent glue layer on the light emitting surface; The fluorescent glue layer is three-dimensionally micro-carved by adopting a three-dimensional micro-carving technology to form the three-dimensional fluorescent glue layer, and the thickness of each position of the three-dimensional fluorescent glue layer matches the intensity of the blue light at the corresponding position.

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