Chip resistor heat dissipation structure

Abstract

The utility model discloses a chip resistor heat dissipation structure, which comprises a resistor main body structure, a first electrode structure and a second electrode structure, the first electrode structure and the second electrode structure are respectively arranged at two ends of the resistor main body structure, and the resistor main body structure comprises a ceramic substrate, a resistor layer, an inner protection layer and an outer protection layer, the resistance layer is arranged on one side of the upper end of the ceramic substrate, the inner protection layer is arranged on the outer side of the resistance layer, the outer protection layer is arranged on the outer side of the inner protection layer, a first reinforcing block is arranged in the middle of the interior of the ceramic substrate, and second reinforcing blocks are symmetrically arranged on the two sides of the first reinforcing block in the ceramic substrate. Compared with the prior art, the ceramic substrate has the advantages that the circulation grooves and the heat dissipation openings are additionally formed in the ceramic substrate, the heat dissipation speed of the ceramic substrate can be increased, meanwhile, the first reinforcing blocks and the second reinforcing blocks are additionally arranged, and therefore the stability of the structure of the ceramic substrate is guaranteed while internal heat dissipation of the ceramic substrate is not affected.

Description

Technical Field

[0001] The utility model relates to the technical field of chip resistors, in particular to a chip resistor heat dissipation structure. Background Art

[0002] Chip resistors have the advantages of small size, light weight, high installation density, strong shock resistance, strong anti-interference ability, good high-frequency characteristics, etc. They are widely used in computers, mobile phones, electronic dictionaries, medical electronic products, camcorders, electronic electric meters and VCD players. Chip components can be divided into three categories according to their shapes: rectangular, cylindrical and special-shaped. According to their types, they can be divided into resistors, capacitors, inductors, transistors and small integrated circuits.

[0003] The heat generated by the chip resistors on the current market is determined by the power and the materials used. Of course, resistors using good heat dissipation materials have better heat dissipation effects and more stable performance, but their production costs are expensive. If ordinary heat dissipation materials are used, when they are used in high-power circuits, they are prone to overall heat accumulation and unstable circuit performance due to the heating of the resistors. Therefore, a chip resistor heat dissipation structure is provided to solve the above problems. Utility Model Content

[0004] In order to solve the problems raised in the above background technology, the technical solution adopted by the utility model to solve the technical problems is: a chip resistor heat dissipation structure, which includes: a resistor main body structure, a first electrode structure and a second electrode structure, the first electrode structure and the second electrode structure are respectively arranged at both ends of the resistor main body structure, the resistor main body structure includes a ceramic substrate, a resistor layer, an inner protective layer, and an outer protective layer, the resistor layer is arranged on one side of the upper end of the ceramic substrate, the inner protective layer is arranged on the outside of the resistor layer, and the outer protective layer is arranged on the outside of the inner protective layer, a first reinforcement block is arranged in the middle of the ceramic substrate, and second reinforcement blocks are symmetrically arranged on both sides of the first reinforcement block inside the ceramic substrate, the ceramic substrate is provided with a heat dissipation port, and a flow groove is arranged inside the ceramic substrate between the first reinforcement block and the second reinforcement block.

[0005] As a preferred technical solution of the utility model, two first reinforcement blocks are provided, the first reinforcement blocks are of triangular structure, and the heat dissipation port is connected with the circulation groove.

[0006] As a preferred technical solution of the present utility model, the second reinforcement block is a diamond-shaped structure, and the second reinforcement block has the same height as the first reinforcement block.

[0007] As a preferred technical solution of the utility model, the first electrode structure includes a first internal electrode, a first edge electrode, and a first external electrode. The first internal electrode is arranged at one end of the ceramic substrate, the outer side of the first internal electrode is connected to the first edge electrode, and the outer side of the first edge electrode is connected to the first external electrode.

[0008] As a preferred technical solution of the present utility model, the second electrode structure includes a second internal electrode, a second edge electrode, and a second external electrode. The second internal electrode is arranged at two ends of the ceramic substrate, the outer side of the second internal electrode is connected to the second edge electrode, and the outer side of the second edge electrode is connected to the second external electrode.

[0009] As a preferred technical solution of the present utility model, the first internal electrode and the second internal electrode are both made of silver-palladium material, the first edge electrode and the second edge electrode are both made of nickel-chromium material, and the first external electrode and the second external electrode are both made of silver-palladium material.

[0010] As a preferred technical solution of the utility model, the inner protective layer is epoxy resin, and the outer protective layer is a resistor mark shell.

[0011] As a preferred technical solution of the utility model, insulating protective plates are provided on both the front and rear sides of the ceramic substrate, a hollow opening is provided on the side of the insulating protective plate facing the heat dissipation port, and a dustproof net is provided inside the hollow opening.

[0012] As a preferred technical solution of the present utility model, the first reinforcement block, the second reinforcement block and the ceramic substrate are an integrally formed ceramic structure.

[0013] The utility model has the following advantages: adding flow grooves and heat dissipation ports to the ceramic substrate can increase the heat dissipation speed of the ceramic substrate, and adding a first reinforcement block and a second reinforcement block simultaneously ensures the stability of the ceramic substrate structure itself without affecting the internal heat dissipation of the ceramic substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural schematic diagram of a preferred embodiment of the utility model;

[0015] Figure 2 It is a partial cross-sectional structural schematic diagram of a preferred embodiment of the utility model;

[0016] Figure 3 It is a schematic diagram of the internal structure of a ceramic substrate in a cross-section according to a preferred embodiment of the utility model.

[0017] Explanation of the accompanying drawings: 1. Ceramic substrate; 101. First reinforcement block; 102. Second reinforcement block; 103. Heat dissipation port; 104. Flow slot; 2. Resistance layer; 3. Inner protective layer; 4. Outer protective layer; 5. First internal electrode; 6. First edge electrode; 7. First external electrode; 8. Second internal electrode; 9. Second edge electrode; 10. Second external electrode; 11. Insulating protective plate; 1101. Dust screen. DETAILED DESCRIPTION

[0018] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0019] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0020] The utility model will be further described below in conjunction with the accompanying drawings.

[0021] Please refer to Figure 1-Figure 3 The utility model discloses a heat dissipation structure of a patch resistor, comprising: a resistor main body structure, a first electrode structure and a second electrode structure, the first electrode structure and the second electrode structure are respectively arranged at two ends of the resistor main body structure, the resistor main body structure comprises a ceramic substrate 1, a resistor layer 2, an inner protective layer 3, and an outer protective layer 4, the resistor layer 2 is arranged on one side of the upper end of the ceramic substrate 1, the inner protective layer 3 is arranged on the outer side of the resistor layer 2, and the outer protective layer 4 is arranged on the outer side of the inner protective layer 3, a first reinforcement block 101 is arranged in the middle of the ceramic substrate 1, and second reinforcement blocks 102 are symmetrically arranged on both sides of the first reinforcement block 101 inside the ceramic substrate 1, a heat dissipation port 103 is opened in the ceramic substrate 1, and a flow groove 104 is arranged between the first reinforcement block 101 and the second reinforcement block 102 inside the ceramic substrate 1.

[0022] Combination Figure 3 As shown, there are two first reinforcement blocks 101, the first reinforcement block 101 is a triangular structure, so that heat can flow along the flow slot 104, the heat dissipation port 103 is connected to the flow slot 104, the second reinforcement block 102 is a diamond structure, and the second reinforcement block 102 has the same height as the first reinforcement block 101. The first reinforcement block 101 and the second reinforcement block 102 can ensure the stability of the structure of the ceramic substrate 1 itself without affecting the internal heat dissipation of the ceramic substrate 1. Figure 2 As shown, the first electrode structure includes a first internal electrode 5, a first edge electrode 6, and a first external electrode 7. The first internal electrode 5 is arranged at one end of the ceramic substrate 1, and the outer side of the first internal electrode 5 is connected to the first edge electrode 6, and the outer side of the first edge electrode 6 is connected to the first external electrode 7. The second electrode structure includes a second internal electrode 8, a second edge electrode 9, and a second external electrode 10. The second internal electrode 8 is arranged at two ends of the ceramic substrate 1, and the outer side of the second internal electrode 8 is connected to the second edge electrode 9, and the outer side of the second edge electrode 9 is connected to the second external electrode 10.

[0023] Among them, the first internal electrode 5 and the second internal electrode 8 are both made of silver-palladium material, so as to ensure the conductivity of the electrode end, the first edge electrode 6 and the second edge electrode 9 are both made of nickel-chromium material, and then the electrode end can be protected, the first external electrode 7 and the second external electrode 10 are both made of silver-palladium material, the inner protective layer 3 is epoxy resin, and the outer protective layer 4 is a resistor marking shell. Insulating protective plates 11 are provided on the front and back sides of the ceramic substrate 1. A hollow opening is provided on the side of the insulating protective plate 11 facing the heat dissipation port 103, and a dustproof net 1101 is provided on the inside of the hollow opening. The dustproof net 1101 will no longer affect the heat dissipation and can prevent external dust from entering the interior of the ceramic substrate 1. The first reinforcement block 101, the second reinforcement block 102 and the ceramic substrate 1 are an integrally formed structure.

[0024] Specifically, the heat generated by the chip resistor of the utility model when it is powered on can be dissipated outward through the ceramic substrate 1 itself, while the heat inside the ceramic substrate 1 can flow along the flow groove 104 and flow to the heat dissipation port 103, thereby achieving the purpose of dissipating heat inside the ceramic substrate 1.

[0025] The above are only preferred implementations of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

[0026] Other parts of the present invention not described in detail belong to the prior art and will not be described here.

[0027] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.

Claims

1. A chip resistor heat dissipation structure, comprising: A resistor main body structure, a first electrode structure and a second electrode structure, characterized in that the first electrode structure and the second electrode structure are respectively arranged at two ends of the resistor main body structure, the resistor main body structure comprises a ceramic substrate (1), a resistor layer (2), an inner protective layer (3), and an outer protective layer (4), the resistor layer (2) is arranged on one side of the upper end of the ceramic substrate (1), the inner protective layer (3) is arranged on the outer side of the resistor layer (2), and the outer protective layer (4) is arranged on the outer side of the inner protective layer (3), a first reinforcement block (101) is arranged in the middle of the ceramic substrate (1), and second reinforcement blocks (102) are symmetrically arranged on both sides of the first reinforcement block (101) inside the ceramic substrate (1), the ceramic substrate (1) is provided with a heat dissipation port (103), and a flow groove (104) is arranged inside the ceramic substrate (1) between the first reinforcement block (101) and the second reinforcement block (102).

2. A chip resistor heat dissipation structure as claimed in claim 1, characterized in that: The number of the first reinforcement blocks (101) is two, the first reinforcement blocks (101) are of a triangular structure, and the heat dissipation opening (103) is in communication with the circulation slot (104).

3. A chip resistor heat dissipation structure as claimed in claim 1, characterized in that: The second reinforcement block (102) is a diamond-shaped structure, and the second reinforcement block (102) has the same height as the first reinforcement block (101).

4. A chip resistor heat dissipation structure as claimed in claim 1, characterized in that: The first electrode structure comprises a first internal electrode (5), a first edge electrode (6), and a first external electrode (7); the first internal electrode (5) is arranged at one end of the ceramic substrate (1); the outer side of the first internal electrode (5) is connected to the first edge electrode (6); and the outer side of the first edge electrode (6) is connected to the first external electrode (7).

5. A chip resistor heat dissipation structure as claimed in claim 1, characterized in that: The second electrode structure comprises a second internal electrode (8), a second edge electrode (9), and a second external electrode (10); the second internal electrode (8) is arranged at two ends of the ceramic substrate (1); the outer side of the second internal electrode (8) is connected to the second edge electrode (9); and the outer side of the second edge electrode (9) is connected to the second external electrode (10).

6. A chip resistor heat dissipation structure as claimed in claim 4, characterized in that: The first internal electrode (5) and the second internal electrode (8) are both made of silver-palladium material, the first edge electrode (6) and the second edge electrode (9) are both made of nickel-chromium material, and the first external electrode (7) and the second external electrode (10) are both made of silver-palladium material.

7. A chip resistor heat dissipation structure as claimed in claim 1, characterized in that: The inner protective layer (3) is epoxy resin, and the outer protective layer (4) is a resistor marking shell.

8. A chip resistor heat dissipation structure as claimed in claim 1, characterized in that: Insulating protective plates (11) are provided on both the front and rear sides of the ceramic substrate (1); a hollow opening is provided on the side of the insulating protective plate (11) facing the heat dissipation opening (103); and a dustproof net (1101) is provided inside the hollow opening.

9. A chip resistor heat dissipation structure as claimed in claim 1, characterized in that: The first reinforcement block (101), the second reinforcement block (102) and the ceramic substrate (1) are an integrally formed ceramic structure.

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