Display panel and display device

Abstract

The present invention relates to the field of display technology, and proposes a display panel and a display device. In the binding area, the display panel includes a protective layer; an organic layer is arranged on the protective layer; a first binding pin is arranged on the organic layer; a flexible circuit board is arranged on the first binding pin, and the flexible circuit board includes a substrate, a second binding pin arranged under the substrate, and an insulating layer, and the second binding pin is connected to the first binding pin; a side of the end of the insulating layer close to the second binding pin away from the substrate abuts against a side of the end of the organic layer away from the first binding pin away from the protective layer, the thickness of the insulating layer is greater than the sum of the thickness of the first binding pin and the thickness of the second binding pin, and the thickness of the end of the protective layer away from the display area is less than the thickness of the rest of the protective layer, so that after the insulating layer abuts against the organic layer, the organic layer and the protective layer can bend. The display panel will not produce a short circuit phenomenon, and can also prevent the first binding pin from peeling off the organic layer.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a display device including the display panel. Background Art

[0002] At present, in the production process of display panels, the cutting of display panels is carried out by laser cutting, such as CO 2 Laser and Fento laser. During the cutting process, the cutting edge will form a layer of conductive carbide on the edge of the panel due to the carbonization of PI (Polyimide) due to heat.

[0003] After the display panel is bound to the circuit board, the carbide will come into contact with the circuit board and cause a short circuit; it will also cause the binding pins of the display panel to peel off the display panel, resulting in poor contact, thereby affecting the display effect.

[0004] Therefore, it is necessary to research a new display panel and a display device including the display panel.

[0005] The above information disclosed in the Background section is only for enhancement of understanding of the background of the present disclosure and therefore it may include information that does not constitute the prior art that is already known to one of ordinary skill in the art. Summary of the invention

[0006] The object of the present invention is to overcome the above-mentioned shortcomings of the prior art such as easy short circuit and poor contact, and to provide a display panel that is not prone to short circuit and poor contact and a display device including the display panel.

[0007] Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

[0008] According to one aspect of the present disclosure, a display panel is provided, comprising a display area and a binding area located around the display area, wherein the display panel comprises:

[0009] Protective layer;

[0010] an organic layer, disposed on the protective layer;

[0011] A first binding pin is provided on a side of the organic layer away from the protective layer;

[0012] A flexible circuit board is arranged on a side of the first binding pin away from the protective layer, the flexible circuit board comprises a substrate, and a second binding pin and an insulating layer arranged on a side of the substrate close to the first binding pin, the second binding pin being bound and connected to the first binding pin;

[0013] Among them, a side of the end of the insulating layer close to the second binding pin away from the substrate abuts against a side of the end of the organic layer away from the first binding pin away from the protective layer, the thickness of the insulating layer is greater than the sum of the thickness of the first binding pin and the thickness of the second binding pin, and the thickness of the end of the protective layer away from the first binding pin is less than the thickness of the rest of the protective layer, so that after the insulating layer abuts against the organic layer, the organic layer and the protective layer can bend.

[0014] In an exemplary embodiment of the present disclosure, a surface of the protective layer away from the organic layer is configured as a stepped surface.

[0015] In an exemplary embodiment of the present disclosure, the step surface includes a step.

[0016] In an exemplary embodiment of the present disclosure, the height of the step is greater than or equal to the difference between the thickness of the insulating layer and the sum of the thickness of the first binding pin and the thickness of the second binding pin.

[0017] In an exemplary embodiment of the present disclosure, the width of the step is greater than or equal to the width of the insulating layer abutting against the organic layer, and less than or equal to the distance between the edge of the first binding pin away from the display area and the edge of the protective layer away from the display area.

[0018] In an exemplary embodiment of the present disclosure, the width of the insulating layer abutting against the organic layer is greater than the width of carbide sputtering formed when the organic layer is cut by laser.

[0019] In an exemplary embodiment of the present disclosure, the width of carbide sputtering formed when the organic layer is laser cut is greater than or equal to 20 micrometers and less than or equal to 100 micrometers.

[0020] In an exemplary embodiment of the present disclosure, an end portion of a surface of the protective layer away from the organic layer and away from the display area is configured as an inclined surface.

[0021] In an exemplary embodiment of the present disclosure, a surface of the protective layer away from the organic layer is configured as a step surface, the step surface includes a step, and one or both of the two connecting surfaces of the step are configured as an inclined surface.

[0022] According to one aspect of the present disclosure, a display device is provided, comprising: a display panel as described in any one of the above.

[0023] It can be seen from the above technical solution that the present invention has at least one of the following advantages and positive effects:

[0024] In the display panel of the present invention, the side of the end of the insulating layer close to the second binding pin away from the substrate abuts against the side of the end of the organic layer away from the first binding pin away from the protective layer, so that the insulating layer covers the cut edge of the organic layer, and the carbide formed by cutting the organic layer will not contact the circuit board, and will not cause a short circuit. The thickness of the end of the protective layer away from the display area is less than the thickness of the rest of the protective layer, so that the strength of the structure formed by the protective layer and the organic layer is reduced, so that after the insulating layer and the organic layer abut, the organic layer and the protective layer can bend under the squeezing force of the insulating layer, thereby preventing the first binding pin from peeling off the organic layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above and other features and advantages of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings.

[0026] Figure 1 It is a schematic diagram of a structure in which a display panel has poor contact in the related art;

[0027] Figure 2 It is a schematic diagram of a structure in which a short circuit occurs in a display panel in the related art;

[0028] Figure 3 yes Figure 2 Schematic diagram of the structure of the flexible circuit board after bending;

[0029] Figure 4 is a schematic structural diagram of an exemplary embodiment of a display panel of the present invention;

[0030] Figure 5 yes Figure 4 A schematic diagram of the size relationship structure when the display panel is not bound;

[0031] Figure 6-Figure 9 Schematic diagrams of other exemplary embodiments of the protection layer.

[0032] The main components in the figure are described as follows:

[0033] 1. Protective layer;

[0034] 2. Organic layer; 21. Carbide;

[0035] 3. First binding pin; 4. Substrate; 5. Second binding pin; 6. Insulation layer; 7. Backplane. DETAILED DESCRIPTION

[0036] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present invention will be comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed description will be omitted.

[0037] Reference Figure 1 The schematic diagram of the structure of the display panel in the related art shown in the figure shows that the display panel has poor contact. In the related art, the flexible circuit board includes a substrate 4, a metal conductive layer arranged on the substrate 4, and an insulating layer 6 arranged on the metal conductive layer. Part of the metal conductive layer is not covered by the insulating layer 6 to form an exposed metal trace. A second binding pin 5 is arranged at the end of the metal trace. After the second binding pin 5 is bound to the first binding pin 3, the insulating layer 6 covers the organic layer 2. Since the thickness of the insulating layer 6 is greater than the sum of the thickness of the first binding pin 3 and the thickness of the second binding pin 5, under the support of the insulating layer 6, it is easy to cause the first binding pin 3 to peel off the organic layer 2, resulting in poor contact, thereby affecting the display effect.

[0038] Reference Figure 2 and Figure 3 A structural schematic diagram of a short circuit in a display panel in the related art shown in the figure, in the related art, after the second binding pin 5 is bound to the first binding pin 3, the insulating layer 6 does not cover the organic layer 2, but is at a certain distance from the edge of the organic layer 2, and the first binding pin 3 will not be peeled off the organic layer 2 due to the thickness of the insulating layer 6 being greater than the sum of the thickness of the first binding pin 3 and the thickness of the second binding pin 5; however, after the flexible circuit board is bent, the exposed metal traces on the flexible circuit board will contact the carbide 21 generated by cutting the organic layer 2, thereby causing a short circuit in the metal traces and causing a burn problem; the carbide 21 can be removed manually, but it causes a waste of manpower and material resources and is inefficient.

[0039] This exemplary embodiment first provides a display panel, referring to Figure 4The structural schematic diagram of the display panel of the present invention is shown, the display panel may include a display area and a binding area located around the display area, in the binding area the display panel may include a protective layer 1, an organic layer 2, a first binding pin 3 and a flexible circuit board; the organic layer 2 is arranged on the protective layer 1; the first binding pin 3 is arranged on a side of the organic layer 2 away from the protective layer 1; the flexible circuit board is arranged on a side of the first binding pin 3 away from the protective layer 1, the flexible circuit board includes a substrate 4, and a second binding pin 5 and an insulating layer 6 arranged on a side of the substrate 4 close to the first binding pin 3, the second binding pin 3 is arranged on the first binding pin 3, and the second binding pin 3 is arranged on the second binding pin 3. The pin 5 is bound and connected to the first binding pin 3; wherein, a side of the end of the insulating layer 6 close to the second binding pin 5 away from the substrate 4 abuts against a side of the end of the organic layer 2 away from the first binding pin 3 away from the protective layer 1, a thickness H3 of the insulating layer 6 is greater than the sum of the thickness H1 of the first binding pin 3 and the thickness H2 of the second binding pin 5, and a thickness of the end of the protective layer 1 away from the first binding pin 3 is less than the thickness of the rest of the protective layer 1, so that after the insulating layer 6 abuts against the organic layer 2, the organic layer 2 and the protective layer 1 can be bent.

[0040] Reference Figure 4 As shown, in this exemplary embodiment, the material of the protective layer 1 may be PET (Polyethyleneterephthalate, plastic). An organic layer 2 is arranged on the protective layer 1, and the organic layer 2 may be polyimide, transparent polyimide or plastic, etc., and a carbide 21 is formed on the edge of the organic layer 2 due to laser cutting. A backplane 7 formed by an array substrate, a light-emitting layer, a color film substrate, etc. is arranged in the display area of ​​the organic layer 2. A binding area is arranged around the display area of ​​the organic layer 2, and a first binding pin 3 is arranged in the binding area. The first binding pin 3 is located on the side of the organic layer 2 away from the protective layer 1.

[0041] Reference Figure 5 The schematic diagram of the dimensional relationship structure of the display panel of the present invention when it is not bound is shown in the figure. The flexible circuit board in the figure can be moved downward to form Figure 4 ,Right now Figure 5The dimension markings in the figure are the same as the dimension markings after binding. The side of the protective layer 1 away from the organic layer 2 is set as a step surface, and the plane where the protective layer 1 and the organic layer 2 are combined is still a plane, so that the thickness of the end of the protective layer 1 away from the first binding pin 3 is less than the thickness of the rest of the protective layer 3. The thickness of the rest here refers to the thickness in the binding area, which is the same as the thickness of the protective layer 3 in the binding area of ​​the prior art. The step surface can be formed by U-lami process or laser cutting. The U-Lami process is to separate the area to be removed from the protective film 1 separately, and the adhesion is low. The normal film and process are consistent with the normal protective film, that is, a removable protective film can be separately set at the end of the protective film 1 away from the first binding pin 3. The removable protective film has low adhesion. This part can be removed before binding by using the A-Lami process, that is, directly torn off. Make the thickness of the protective film here zero.

[0042] The step surface may include a step, and a step having a height difference is considered to be a step. Specifically, the height H of the step is greater than or equal to the difference between the thickness H3 of the insulating layer 6 and the thickness H1 of the first binding pin 3 and the thickness H2 of the second binding pin 5 (H≥H3-H1-H2). The thickness H1 of the first binding pin 3 refers to the distance between the side of the first binding pin 3 away from the protective layer 1 and the side of the organic layer 2 away from the protective layer 1. In this example embodiment, the first binding pin 3 protrudes from the organic layer 2, so H1 is a positive value; however, in other example embodiments, the first binding pin 3 is recessed in the organic layer 2, and in this case, H1 is a negative value. The width L of the step is greater than or equal to the width L2 of the insulating layer 6 and the organic layer 2 abutting against each other, that is, the width L of the step is greater than or equal to the distance L2 between the edge of the insulating layer 6 close to the second binding pin 5 and the edge of the organic layer 2 away from the first binding pin 3; and the width L of the step is less than or equal to the distance L1 between the edge of the first binding pin 3 away from the display area and the edge of the first protective layer 1 away from the display area (L1≥L≥L2).

[0043] Please continue to refer to Figure 4 As shown, in this example embodiment, the flexible circuit board can be a single-layer COF film, and the flexible circuit board is arranged on the side of the first binding pin 3 away from the protective layer 1. The flexible circuit board can include a substrate 4, a metal conductive layer arranged on the side of the substrate 4 close to the first binding pin 3, and an insulating layer 6 arranged on the side of the metal conductive layer close to the first binding pin 3. The substrate 4 can be an organic material, such as polyimide, plastic, etc. The material of the insulating layer 6 can be epoxy resin. Part of the metal conductive layer is not covered by the insulating layer 6 to form a bare metal trace, and a second binding pin 5 is arranged at the end of the metal trace.

[0044] After the second binding pin 5 of the chip-on-cover film is bound to the first binding pin 3, the side of the end of the insulating layer 6 close to the second binding pin 5 away from the substrate 4 abuts against the side of the end of the organic layer 2 away from the first binding pin 3 away from the protective layer 1, and the width of the abutment between the insulating layer 6 and the organic layer 2 is greater than the width of the sputtering of the carbide 21 formed when the organic layer 2 is laser cut, and the width is approximately 20 microns-50 microns, and the maximum does not exceed 100 microns; the insulating layer 6 covers the cutting edge of the organic layer 2, and the carbide 21 formed by cutting the organic layer 2 will not contact the circuit board, and no short circuit will occur.

[0045] After binding, since the thickness of the insulating layer 6 is greater than the sum of the thickness of the first binding pin 3 and the thickness of the second binding pin 5, and the thickness of the edge of the protective layer 1 is reduced, the strength of the structure formed by the protective layer 1 and the organic layer 2 is reduced, the bending force is small, and the stress released after bending is small, so that after the insulating layer 6 is abutted against the organic layer 2, under the extrusion force of the insulating layer 6, the organic layer 2 and the protective layer 1 can bend, the insulating layer is not compressed, and after the stress is released, the first binding pin 3 will not peel off the organic layer 2, and the display effect will not be affected.

[0046] In some other exemplary embodiments of the present invention, the configuration of the protective layer 1 is not limited to the above description. Figure 6-9 As shown, the end of the side of the protective layer 1 away from the organic layer 2 away from the display area can be set as an inclined surface, and the width of the inclined surface can be greater than the distance L1 between the edge of the first binding pin 3 away from the display area and the edge of the first protective layer 1 away from the display area. The side of the protective layer 1 away from the organic layer 2 can also be set as a step surface, and the step surface can include one step, but the two connecting surfaces of the step surface can both be set as inclined surfaces or one surface can be set as an inclined surface. Of course, the step surface can include multiple steps, and the farther away from the display area, the closer the step is to the organic layer. As long as the organic layer 2 and the protective layer 1 can be bent under the squeezing force of the insulating layer 6, that is, the protective layer 1 is thinned to the point that the force required to bend the organic layer 2 and the protective layer 1 is less than the force required to peel off the first binding pin 3 from the organic layer 2.

[0047] The side of the end of the insulating layer 6 close to the second binding pin 5 that is away from the substrate 4 abuts against the side of the end of the organic layer 2 that is away from the first binding pin 3 that is away from the protective layer 1, so that the insulating layer 6 covers the cut edge of the organic layer 2, and the carbide formed by cutting the organic layer 2 will not contact the circuit board, and no short circuit will occur. The thickness of the end of the protective layer 1 away from the display area is less than the thickness of the rest of the protective layer 1, so that the strength of the structure formed by the protective layer 1 and the organic layer 2 is reduced, so that after the insulating layer 6 abuts against the organic layer 2, the organic layer 2 and the protective layer 1 can bend under the squeezing force of the insulating layer 6, thereby preventing the first binding pin 3 from peeling off the organic layer.

[0048] Furthermore, this exemplary embodiment first provides a display device, which may include any of the above display panels. The specific structure of the display panel has been described in detail above, so it will not be repeated here.

[0049] The specific type of the display device is not particularly limited, and any type of display device commonly used in the field can be used, such as liquid crystal displays, OLED displays, mobile devices such as mobile phones, wearable devices such as watches, VR devices, etc. Technical personnel in this field can make corresponding choices based on the specific purpose of the display device, which will not be repeated here.

[0050] It should be noted that, in addition to the display panel, the display device also includes other necessary components and components, such as a housing, a circuit board, a power cord, etc. Taking the display as an example, technical personnel in this field can make corresponding supplements based on the specific usage requirements of the display device, which will not be repeated here.

[0051] Compared with the prior art, the beneficial effects of the display device provided by the embodiment of the present invention are the same as the beneficial effects of the display panel provided by the above embodiment, which will not be elaborated herein.

[0052] The features, structures or characteristics described above may be combined in one or more embodiments in any suitable manner, and if possible, the features discussed in each embodiment are interchangeable. In the above description, many specific details are provided to provide a full understanding of the embodiments of the present invention. However, those skilled in the art will appreciate that the technical solution of the present invention may be practiced without one or more of the specific details, or other methods, components, materials, etc. may be adopted. In other cases, known structures, materials or operations are not shown or described in detail to avoid blurring various aspects of the present invention.

[0053] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of the illustration to another component, these terms are used in this specification only for convenience, such as according to the orientation of the examples described in the drawings. It is understood that if the device of the illustration is turned upside down, the component described as "upper" will become the component "lower". When a structure is "on" other structures, it may mean that the structure is formed integrally on the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure through another structure.

[0054] In this specification, the terms "a", "an", "the" and "said" are used to indicate the presence of one or more elements / components / etc.; the terms "comprising", "including" and "having" are used to express an open-ended inclusion and mean that there may be additional elements / components / etc. in addition to the listed elements / components / etc.; the terms "first", "second" and "third" etc. are used only as labels and are not intended to limit the quantity of their objects.

[0055] It should be understood that the present invention is not limited in its application to the detailed structure and arrangement of the components proposed in this specification. The present invention can have other embodiments and can be implemented and executed in a variety of ways. The aforementioned variations and modifications fall within the scope of the present invention. It should be understood that the present invention disclosed and defined in this specification extends to all alternative combinations of two or more individual features mentioned or evident in the text and / or the drawings. All these different combinations constitute multiple alternative aspects of the present invention. The embodiments described in this specification illustrate the best mode known for implementing the present invention and will enable those skilled in the art to utilize the present invention.

Claims

1. A display panel, comprising a display area and a binding area located around the display area, characterized in that: The display panel in the binding area includes: Protective layer; an organic layer, disposed on the protective layer; A first binding pin is provided on a side of the organic layer away from the protective layer; A flexible circuit board is arranged on a side of the first binding pin away from the protective layer, the flexible circuit board comprises a substrate and a metal conductive layer, and a second binding pin and an insulating layer arranged on a side of the substrate close to the first binding pin, a portion of the metal conductive layer is not covered by the insulating layer to form an exposed metal trace, and the second binding pin is arranged at an end of the metal trace, and the second binding pin is bound and connected to the first binding pin; Among them, a side of the end of the insulating layer close to the second binding pin away from the substrate abuts against a side of the end of the organic layer away from the first binding pin away from the protective layer, the thickness of the insulating layer is greater than the sum of the thickness of the first binding pin and the thickness of the second binding pin, and the thickness of the end of the protective layer away from the first binding pin is less than the thickness of the rest of the protective layer, so that after the insulating layer and the organic layer abut, the organic layer and the protective layer can be bent; the width of the abutment between the insulating layer and the organic layer is greater than the width of carbide sputtering formed when the organic layer is laser cut.

2. The display panel according to claim 1, characterized in that: A surface of the protective layer away from the organic layer is configured as a stepped surface.

3. The display panel according to claim 2, characterized in that: The step surface includes a step.

4. The display panel according to claim 3, characterized in that: The height of the step is greater than or equal to the difference between the thickness of the insulating layer and the sum of the thickness of the first binding pin and the thickness of the second binding pin.

5. The display panel according to claim 3, characterized in that: The width of the step is greater than or equal to the abutment width of the insulating layer and the organic layer, and less than or equal to the distance between an edge of the first binding pin away from the display area and an edge of the protection layer away from the display area.

6. The display panel according to claim 1, characterized in that: The width of the carbide sputtering formed when the organic layer is laser cut is greater than or equal to 20 micrometers and less than or equal to 100 micrometers.

7. The display panel according to claim 1, characterized in that: An end of a surface of the protective layer that is away from the organic layer and away from the display area is configured as an inclined surface.

8. The display panel according to claim 1, characterized in that: A surface of the protective layer away from the organic layer is configured as a step surface, the step surface includes a step, and one or both of the two connecting surfaces of the step are configured as an inclined surface.

9. A display device, characterized in that: include: The display panel according to any one of claims 1 to 8.

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