A gas ionization cooling mechanism

Abstract

The present invention relates to the technical field of coating equipment, and in particular to a gas ionization cooling mechanism, which includes an assembly base, a positive electrode carrier, a negative electrode carrier, a gas cavity base, and a cooling component. The cooling component is installed at the lower part of the negative electrode carrier. An electric field is generated between the positive electrode carrier and the negative electrode carrier. The gas cavity base is arranged between the positive electrode carrier and the negative electrode carrier so that the gas cavity base is located in the electric field. The gas cavity base is provided with an ion generation cavity and a plurality of ion emission through holes communicating with the ion generation cavity. This mechanism can generate a large number of ions, which are used as bombarding particles in the sputtering coating process. During the gas discharge process, the negative electrode carrier is in a super-high temperature state. A flowing coolant is introduced into the cooling component to effectively and quickly cool the negative electrode carrier and the gas cavity base, and extend the service life of each component.

Description

Technical Field

[0001] The present invention relates to the technical field of coating equipment, and in particular to a gas ionization cooling mechanism. Background Art

[0002] Sputtering coating technology is to bombard the surface of a target with ions. The phenomenon that atoms of the target are ejected is called sputtering. The atoms generated by sputtering are deposited on the surface of the substrate to form a film, which is called sputtering coating. Usually, gas discharge is used to generate gas ionization. The positive ions bombard the cathode target at high speed under the action of an electric field, ejecting atoms or molecules of the cathode target and flying towards the surface of the substrate to be coated for deposition to form a thin film. "Sputtering" refers to the phenomenon that energetic particles bombard the surface of a solid (target), causing solid atoms or molecules to eject from the surface. Most of the ejected particles are in the atomic state and are often called sputtered atoms.

[0003] The sputtering particles used to bombard the target can be electrons, ions or neutral particles. Since ions are easy to accelerate under an electric field to obtain the required kinetic energy, ions are mostly used as the bombardment particles. However, in the process of generating a large number of ions, the entire ion generation mechanism is in a high-temperature state, which is easily burned out, and the service life of the components is short, unable to meet the needs of modern production. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a gas ionization cooling mechanism that can generate a large number of ions as the bombardment particles in the sputtering coating process, and can also achieve a cooling effect and extend the service life of each component.

[0005] To solve the above technical problems, the present invention adopts the following technical solutions:

[0006] A gas ionization cooling mechanism includes an assembly base, a positive electrode carrier, a negative electrode carrier, a gas chamber base and a cooling component. The negative electrode carrier is installed on the upper part of the assembly base, and the cooling component is installed on the lower part of the negative electrode carrier for cooling the negative electrode carrier. An electric field is generated between the positive electrode carrier and the negative electrode carrier. The gas chamber base is arranged between the positive electrode carrier and the negative electrode carrier so that the gas chamber base is located in the electric field. The gas chamber base is provided with an ion generation chamber and a plurality of ion emission through holes communicating with the ion generation chamber.

[0007] Further, the cooling component includes a cooling support, a liquid inlet nozzle and a liquid outlet nozzle. The cooling support is installed on the lower part of the negative electrode carrier. The cooling support and the negative electrode carrier enclose a coolant chamber. The liquid inlet nozzle and the liquid outlet nozzle are respectively installed at both ends of the cooling support, and the liquid inlet nozzle and the liquid outlet nozzle communicate with the coolant chamber.

[0008] Further, a first sealing ring is installed between the cooling support and the negative electrode carrier to seal the gap between the cooling support and the negative electrode carrier.

[0009] Furthermore, an inflation nozzle is installed on the negative electrode carrier, and the inflation nozzle communicates with the ion generation chamber.

[0010] Furthermore, an electrode terminal is installed on the positive electrode carrier for connecting to the positive electrode of the power supply, and the negative electrode carrier is connected to the negative electrode of the power supply to provide an electric field for the ion generation chamber.

[0011] Furthermore, the gas ionization cooling mechanism further includes a cooling shroud. An installation hole is provided in the middle of the cooling shroud for installing the gas chamber base member.

[0012] Furthermore, a liquid injection rod is provided at the lower part of the cooling shroud. The liquid injection rod is provided with a liquid inlet channel and a liquid outlet channel. A cooling ring groove is provided at the upper part of the cooling shroud. Both the liquid inlet channel and the liquid outlet channel communicate with the cooling ring groove. The coolant flows through the liquid inlet channel, the cooling ring groove, and the liquid outlet channel in sequence to cool the gas chamber base member.

[0013] Furthermore, an insulating component is sleeved outside the liquid injection rod to protect the liquid injection rod.

[0014] Furthermore, the gas ionization cooling mechanism further includes a plurality of magnetic components. The gas chamber base member is provided with a plurality of limiting holes. The plurality of limiting holes are arranged in an annular array to form a limiting hole ring. The plurality of ion emission through holes are arranged in a linear array, and all the plurality of ion emission through holes are located inside the limiting hole ring. The plurality of magnetic components are respectively limited in the plurality of limiting holes.

[0015] Furthermore, a second sealing ring is installed between the gas chamber base member and the negative electrode carrier to seal the gap between the gas chamber base member and the negative electrode carrier.

[0016] Advantages of the present invention: This mechanism can generate a large number of ions, which are used as bombarding particles in the sputtering coating process. During the gas discharge process, the negative electrode carrier is in a super-high temperature state. A flowing coolant is introduced into the cooling component to effectively and quickly cool the negative electrode carrier and the gas chamber base member, thereby prolonging the service life of each component. Description of the Drawings

[0017] Figure 1 It is a three-dimensional structural schematic diagram of the present invention.

[0018] Figure 2 It is a cross-section of the present invention Figure 1 。

[0019] Figure 3 It is a cross-section of the present invention Figure 2 。

[0020] Figure 4 It is a structural schematic diagram of the gas chamber base member, ion emission through holes, limiting holes, and limiting hole ring of the present invention.

[0021] Figure 5Schematic three-dimensional structure diagram of the cooling shroud of the present invention. Detailed implementation manners

[0022] For the convenience of those skilled in the art to understand, the present invention will be further described below in conjunction with embodiments and the accompanying drawings. The content mentioned in the implementation manners does not limit the present invention.

[0023] As Figures 1 to 5 shown, a gas ionization cooling mechanism provided by the present invention includes an assembly base 1, a positive electrode carrier 2, a negative electrode carrier 3, a gas chamber base 4, and a cooling assembly 5. The negative electrode carrier 3 is installed on the upper part of the assembly base 1, and the cooling assembly 5 is installed on the lower part of the negative electrode carrier 3 for cooling the negative electrode carrier 3. An electric field is generated between the positive electrode carrier 2 and the negative electrode carrier 3. The gas chamber base 4 is arranged between the positive electrode carrier 2 and the negative electrode carrier 4 so that the gas chamber base 4 is located in the electric field. The gas chamber base 4 is provided with an ion generation chamber 6 and a plurality of ion emission through holes 7 communicating with the ion generation chamber 6.

[0024] In actual operation, a gas is filled into the ion generation chamber 6. Under the action of the electric field, the gas in the ion generation chamber 6 is broken down, presenting a physical phenomenon of gas discharge, that is, the glow discharge phenomenon. The plasma formed by the gas discharge is a kind of ionized gas, which is an aggregate of ions, electrons, and high-energy atoms, etc. Positive ions and electrons always appear in pairs, and the total number is roughly equal. The whole is quasi-neutral, and it is an ionized state composed of charged particles, called the fourth state of matter - the plasma state. During the sputtering coating process, the gas and the target metal atoms are ionized by high-energy electrons to form a plasma composed of conductive particles such as electrons, gas ions, and metal ions. The plasma moves from the ion emission through holes 7 to the outside and serves as the bombarding particles in the sputtering coating process. During the gas discharge process, the negative electrode carrier 3 is in a super-high temperature state. A flowing coolant is introduced into the cooling assembly 5 to effectively and quickly cool the negative electrode carrier 3 and the gas chamber base 4. The present invention can generate a large number of ions, serve as the bombarding particles in the sputtering coating process, and can also achieve a cooling effect, extending the service life of each component.

[0025] In this embodiment, the cooling assembly 5 includes a cooling support 8, a liquid inlet nozzle 9, and a liquid outlet nozzle 10. The cooling support 8 is installed on the lower part of the negative electrode carrier 3. The cooling support 8 and the negative electrode carrier 3 enclose a coolant chamber 11. The liquid inlet nozzle 9 and the liquid outlet nozzle 10 are respectively installed at both ends of the cooling support 8, and the liquid inlet nozzle 9 and the liquid outlet nozzle 10 communicate with the coolant chamber 11. Specifically, the coolant is introduced into the coolant chamber 11 from the liquid inlet nozzle 9 and directly contacts the negative electrode carrier 3. The coolant in the coolant chamber 11 flows out from the liquid outlet nozzle 10, and the coolant is in a state of real-time flow, so that the negative electrode carrier 3 can be effectively and quickly cooled, extending its service life.

[0026] In this embodiment, a first sealing ring 12 is installed between the cooling support 8 and the negative electrode carrier 3 to seal the gap between the cooling support 8 and the negative electrode carrier 3. Since the coolant is introduced into the coolant chamber 11, the first sealing ring 12 is used to prevent the coolant from overflowing from the coolant chamber 11, further preventing coolant waste and contamination of other components. Specifically, the number of the first sealing rings 12 is multiple, making the sealing effect more comprehensive.

[0027] In this embodiment, an inflation nozzle 13 is installed on the negative electrode carrier 3, and the inflation nozzle 13 is communicated with the ion generation chamber 6. The inflation nozzle 13 is connected to an external inflation device to supply sufficient gas to the ion generation chamber 6.

[0028] In this embodiment, an electrode terminal 14 is installed on the positive electrode carrier 2 for connecting to the positive pole of an external power supply, and the negative electrode carrier 3 is used to connect to the negative pole of an external power supply, so that an electric field can be generated between the positive electrode carrier 2 and the negative electrode carrier 3 after power connection.

[0029] In this embodiment, the gas ionization cooling mechanism further includes a cooling shroud 15, and an installation hole 16 is provided in the middle of the cooling shroud 15 for installing the gas chamber base member 4. The shape of the installation hole 16 matches the shape of the gas chamber base member 4, and the gas chamber base member 4 is located in the middle of the cooling shroud 15.

[0030] In this embodiment, a liquid injection rod 17 is provided at the lower part of the cooling shroud 15. The liquid injection rod 17 is provided with a liquid inlet channel 18 and a liquid outlet channel 19. A cooling ring groove 20 is provided at the upper part of the cooling shroud 15. Both the liquid inlet channel 18 and the liquid outlet channel 19 are communicated with the cooling ring groove 20. The coolant flows through the liquid inlet channel 18, the cooling ring groove 20 and the liquid outlet channel 19 in sequence to cool the gas chamber base member 4. Specifically, the plane where the cooling ring groove 20 is located is perpendicular to the axial center line of the liquid injection rod 17. The cooling assembly 5 cools the negative electrode carrier 3. Since the gas chamber base member 4 is located on the negative electrode carrier 3, the cooling assembly 5 can cool the lower part of the gas chamber base member 4. The cooling ring groove 20 is used to cool the edge of the gas chamber base member 4. At the same time, cooling the gas chamber base member 4 at multiple places can strengthen the cooling effect and ensure the smooth progress of the process of forming plasma when the gas discharges in the ion generation chamber 6.

[0031] In this embodiment, an insulating component 21 is sleeved outside the liquid injection rod 17 to protect the liquid injection rod 17. Since the liquid injection rod 17 is arranged between the negative electrode carrier 3 and the positive electrode carrier 2 and is easily punctured and burned out, the insulating component 21 can keep the liquid injection rod 17 in an insulated state, effectively protecting the liquid injection rod 17 and extending its service life.

[0032] In this embodiment, the gas ionization cooling mechanism further includes a plurality of magnetic components (not shown in the figure). The gas chamber base member 4 is provided with a plurality of limiting holes 23. The plurality of limiting holes 23 are arranged in an annular array to form a limiting hole ring 25. The shape of the limiting hole ring 25 is as shown in Figure 4 As shown, the plurality of ion emission through holes 7 are arranged in a linear array. The plurality of ion emission through holes 7 are all located inside the limiting hole ring 25. The plurality of magnetic components are respectively limited in the plurality of limiting holes 23. Specifically, the magnetic components are used to control the force of ions emitted from the ion emission through holes 7. By controlling the positional relationship between the magnetic components and the ion emission through holes 7, the magnetic field generated by the magnetic components is used to change the movement direction and trajectory of the ions, so that they can be used as bombarding particles in the sputtering coating process, and the effect of bombarding the target is good, improving the utilization rate of the target.

[0033] In this embodiment, a second sealing ring 24 is installed between the gas chamber base member 4 and the negative electrode carrier 3 to seal the gap between the gas chamber base member 4 and the negative electrode carrier 3 to prevent air leakage.

[0034] All the technical features in this embodiment can be freely combined according to actual needs.

[0035] The above embodiments are preferred implementation solutions of the present invention. In addition, the present invention can also be implemented in other ways. Any obvious replacement without departing from the concept of the technical solution of the present invention is within the protection scope of the present invention.

Claims

1. A gas ionization cooling mechanism, comprising an assembly base body, characterized in that: It further includes a positive electrode carrier, a negative electrode carrier, a gas cavity base member, and a cooling assembly. The negative electrode carrier is installed on the upper part of the assembly base body, and the cooling assembly is installed on the lower part of the negative electrode carrier for cooling the negative electrode carrier. An electric field is generated between the positive electrode carrier and the negative electrode carrier. The gas cavity base member is arranged between the positive electrode carrier and the negative electrode carrier so that the gas cavity base member is located in the electric field. The gas cavity base member is provided with an ion generation cavity and a plurality of ion emission through holes communicating with the ion generation cavity; The cooling assembly includes a cooling support member, a liquid inlet nozzle, and a liquid outlet nozzle. The cooling support member is installed on the lower part of the negative electrode carrier. The cooling support member and the negative electrode carrier enclose to form a coolant cavity. The liquid inlet nozzle and the liquid outlet nozzle are respectively installed at both ends of the cooling support member, and the liquid inlet nozzle and the liquid outlet nozzle communicate with the coolant cavity; The coolant is introduced into the coolant cavity from the liquid inlet nozzle and directly contacts the negative electrode carrier. The coolant in the coolant cavity flows out from the liquid outlet nozzle, and the coolant is in a state of real-time flow; The gas ionization cooling mechanism further includes a cooling shroud. There is an installation hole in the middle of the cooling shroud for installing the gas cavity base member; A liquid injection rod is provided at the lower part of the cooling shroud. The liquid injection rod is provided with a liquid inlet channel and a liquid outlet channel. A cooling ring groove is provided at the upper part of the cooling shroud. The liquid inlet channel and the liquid outlet channel both communicate with the cooling ring groove. The coolant flows through the liquid inlet channel, the cooling ring groove, and the liquid outlet channel in sequence for cooling the gas cavity base member; The plane where the cooling ring groove is located is perpendicular to the axial center line of the liquid injection rod. The cooling assembly cools the negative electrode carrier. The gas cavity base member is located on the negative electrode carrier. The cooling assembly cools the lower part of the gas cavity base member. The cooling ring groove is used to cool the edge of the gas cavity base member; The gas ionization cooling mechanism further includes a plurality of magnetic components. The gas cavity base member is provided with a plurality of limiting holes. The plurality of limiting holes are arranged in a circular array to form a limiting hole ring. The plurality of ion emission through holes are arranged in a linear array, and the plurality of ion emission through holes are all located inside the limiting hole ring. The plurality of magnetic components are respectively limited in the plurality of limiting holes; The magnetic components are used to control the force of ions emitted from the ion emission through holes. By controlling the positional relationship between the magnetic components and the ion emission through holes, the magnetic field generated by the magnetic components is used to change the movement direction and trajectory of the ions so that they serve as bombarding particles in the sputtering coating process.

2. The gas ionization cooling mechanism according to claim 1, characterized in that: A first sealing ring is installed between the cooling support member and the negative electrode carrier to seal the gap between the cooling support member and the negative electrode carrier.

3. A gas ionization cooling mechanism according to claim 1, characterized in that: An air filling nozzle is installed on the negative electrode carrier, and the air filling nozzle communicates with the ion generation cavity.

4. A gas ionization cooling mechanism according to claim 1, characterized in that: An electrode terminal is installed on the positive electrode carrier for connecting to the positive pole of the power supply. The negative electrode carrier is connected to the negative pole of the power supply to provide an electric field for the ion generation cavity.

5. A gas ionization cooling mechanism according to claim 1, characterized in that: An insulating component is sleeved outside the liquid injection rod to protect the liquid injection rod.

6. The gas ionization cooling mechanism according to claim 1, characterized in that: A second sealing ring is installed between the gas cavity base member and the negative electrode carrier to seal the gap between the gas cavity base member and the negative electrode carrier.

Images