Electronic device

Abstract

An electronic device including a display module having an active area including at least one pixel and a module aperture and an inactive area adjacent to the active area and not including a pixel is disclosed. A window is disposed on the display module. A functional layer is disposed between the display module and the window. The functional layer includes a first opening defined therethrough that is superimposed with the module aperture. A light-blocking layer is disposed on at least one of an upper surface and a lower surface of the functional layer and positioned adjacent to the first opening. An electronic module is disposed in an opening formed by at least one of the module aperture and the first opening.

Description

[0001] This application claims priority to Korean Patent Application No. 10-2019-0022605, filed on February 26, 2019, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. TECHNICAL FIELD

[0002] The present disclosure relates to an electronic device. More particularly, the present disclosure relates to an electronic device that prevents light leakage from occurring. BACKGROUND

[0003] Portable electronic devices have become very popular in recent years and provide an increasingly diverse range of functions. Many users prefer electronic devices having a relatively wide display area and a relatively narrow bezel area.

[0004] Various types of electronic devices have been developed to reduce the bezel area. For example, some electronic devices omit the bezel area. These devices can include a camera and a sensor that are both superimposed with the display area. The camera and the sensor superimposed with the display area can be disposed in a hole provided in the device. However, these electronic devices frequently experience light leakage in the area around the hole, which results in a reduction in display quality. SUMMARY

[0005] The present disclosure provides an electronic device capable of preventing light leakage from occurring around a hole defined in a display area.

[0006] Exemplary embodiments of the inventive concept provide an electronic device including a display module having an active area and a non-active area adjacent to the active area. Pixels are disposed in the active area and not disposed in the non-active area. The active area includes a module hole. A window is disposed on the display module. A functional layer is disposed between the display module and the window. The functional layer includes a first opening defined therethrough superimposed with the module hole. A light-blocking layer is disposed on at least one of an upper surface and a lower surface of the functional layer and positioned adjacent to the first opening. An electronic module is disposed in an opening formed by at least one of the module hole and the first opening.

[0007] Exemplary embodiments of the inventive concept also provide an electronic device including a display module having an active area and a non-active area adjacent to the active area. Pixels are disposed in the active area and not disposed in the non-active area. The active area includes a module hole. A window is disposed on the display module. A window black matrix is disposed on a lower surface of a peripheral area of the window. The peripheral area is superimposed with an area of the display module adjacent to the module hole. A light-blocking layer is disposed between the display module and the window black matrix. An electronic module is disposed in an opening formed by the module hole.

[0008] Exemplary embodiments of the inventive concept also provide an electronic device including a display module having an effective area and a non-effective area adjacent to the effective area. At least one pixel is disposed in the effective area and not disposed in the non-effective area. The effective area includes a module hole. An electronic module is disposed in an opening formed by the module hole. A window is disposed on the display module. The effective area includes a first area defined adjacent to the module hole and a second area surrounding the first area. The at least one pixel is not disposed in the first area and the at least one pixel is disposed in the second area. The display module includes a lower display substrate including a base layer, a circuit device layer, and a display device layer. An encapsulation substrate faces the lower display substrate. A light-blocking sealing member is configured to bond the lower display substrate and the encapsulation substrate in the first area and includes a light-blocking material.

[0009] According to exemplary embodiments, since the light-blocking layer is formed on the functional layer disposed between the window and the display module in overlay with the peripheral area of the module hole, a light leakage phenomenon in which light leaked from the peripheral area of the module hole is viewed from the outside by a user can be prevented. BRIEF DESCRIPTION OF DRAWINGS

[0010] The above and other advantages of the present disclosure will become readily apparent by reference to the following detailed description when considered in connection with the accompanying drawings wherein:

[0011] FIG. 1A is a perspective view illustrating an electronic device according to an exemplary embodiment of the present disclosure;

[0012] FIG. 1B is an exploded perspective view illustrating an electronic device according to an exemplary embodiment of the present disclosure;

[0013] FIG. 2 is a block diagram illustrating an electronic device according to an exemplary embodiment of the present disclosure;

[0014] FIG. 3 is a plan view illustrating a display panel according to an exemplary embodiment of the present disclosure;

[0015] FIG. 4 is a plan view illustrating FIG. 3 a region XX' of FIG. 8;

[0016] FIG. 5 is a plan view illustrating an input sensing layer according to an exemplary embodiment of the present disclosure;

[0017] FIG. 6 is an exploded perspective view illustrating a module area and a module hole of an electronic device according to an exemplary embodiment of the present disclosure;

[0018] FIG. 7 is a cross-sectional view taken along line I-I' of FIG. 6 FIG. 8;

[0019] FIG. 8 is a cross-sectional view illustrating a module area and a module hole of an electronic device according to another exemplary embodiment of the present disclosure;

[0020] FIG. 9 is an exploded enlarged perspective view illustrating a module area of an electronic device according to another exemplary embodiment of the present disclosure;

[0021] FIG. 10 is a cross-sectional view taken along line II-II' of FIG. 9 ;

[0022] FIG. 11 is an exploded enlarged perspective view illustrating a module area of an electronic device according to another exemplary embodiment of the present disclosure;

[0023] FIG. 12 is a cross-sectional view taken along line III-III' of FIG. 11 ;

[0024] FIG. 13 is a cross-sectional view illustrating an effective area of a display panel according to an exemplary embodiment of the present disclosure;

[0025] FIG. 14 is a cross-sectional view illustrating a module area of an electronic device according to an exemplary embodiment of the present disclosure; and

[0026] FIG. 15 is a cross-sectional view illustrating a module area of an electronic device according to another exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0027] In the present disclosure, it will be understood that when an element or layer is referred to as being "on" another element or layer, "connected to" or "coupled to" another element or layer, it can be directly on, connected or coupled to the other element or layer, or intervening elements or layers can be present.

[0028] Like reference numerals refer to like elements throughout the specification. In the drawings, the thickness, proportions and dimensions of components can be exaggerated for effective description of the technical content.

[0029] As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0030] It will be understood that, although the terms first, second, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present disclosure. As used herein, unless the context clearly indicates otherwise, the singular forms "a," "an," and "the" are intended to include the plural forms as well.

[0031] For ease of description, spatially relative terms, such as "below", "under", "lower", "above", "upper", and the like, can be used herein for describing an element's or feature's relationship to another element or feature as illustrated in the figures.

[0032] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0033] It will be further understood that the terms "comprises" and / or "comprising", when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0034] In the specification, the same reference numbers refer to the same elements. For example, in the following, the center area CA of the module area MA and the center area CA1 of the module area MA1 having the same reference numbers can be the same element, and the peripheral area PA of the module area MA and the peripheral area PA1 of the module area MA1 can be the same element.

[0035] Hereinafter, the present disclosure will be explained in detail with reference to the accompanying drawings.

[0036] FIG. 1A is a perspective view illustrating an electronic device EA according to an exemplary embodiment of the present disclosure. FIG. 1B is an exploded perspective view illustrating an electronic device EA according to an exemplary embodiment of the present disclosure. FIG. 2 is a block diagram illustrating an electronic device EA according to an exemplary embodiment of the present disclosure.

[0037] Referring to FIG. 1A , FIG. 1B and FIG. 2 , the electronic device EA can be activated to display an image in response to an electrical signal. In an exemplary embodiment, the electronic device EA can be a smartphone, a tablet computer, a notebook computer, a television, or the like. In the present exemplary embodiment, a smartphone will be described as a representative example of the electronic device EA.

[0038] The electronic device EA can display an image IM in a third direction DR3 facing a user through a display surface FS defined in a first direction DR1 and a second direction DR2. The display surface FS through which the image IM is displayed can correspond to a front surface (e.g., a top surface of the electronic device EA in the third direction DR3) of the electronic device EA and a front surface (e.g., a top surface of the window WM in the third direction DR3) of the window WM. Hereinafter, the display surface FS and the front surface of the electronic device EA and the front surface of the window WM are given the same reference numeral. The image IM can include one or more still images, full-motion videos, and combinations thereof. FIG. 1A A clock window and an application icon are shown as representative examples of the image IM. However, the image IM displayed by the electronic device EA is not limited to these representative examples.

[0039] In the present exemplary embodiment, a front (or upper) surface and a rear (or lower) surface of each member are defined with respect to a direction along which the image IM is displayed. The front surface and the rear surface face each other in the third direction DR3, and a normal direction of each of the front surface and the rear surface is substantially parallel to the third direction DR3. Directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 face each other. Thus, the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 can be changed to other directions other than the directions shown in the exemplary embodiment.

[0040] As shown in FIG. 1B , the electronic device EA includes a window WM, a display module 200, a driving circuit unit 300, a housing 400, and an electronic module 500. In the present exemplary embodiment, the window WM and the housing 400 are combined with each other to define an inside and an outside of the electronic device EA.

[0041] The window WM includes an optically transparent insulating material. For example, in an exemplary embodiment, the window WM can include glass, plastic, or a combination thereof. The window WM has a single layer or a multi-layer structure. For example, the window WM having a multi-layer structure includes a plurality of plastic films attached to each other by an adhesive, or includes a glass substrate and a plastic film attached to the glass substrate by an adhesive.

[0042] The window WM can be divided into a transmissive area TA and a bezel area BZA when viewed in a plan view. In the disclosure, the expression "when viewed in a plan view" can mean a state of viewing in the third direction DR3. In addition, the expression "thickness direction" can mean the third direction DR3.

[0043] The transmissive area TA can be an optically transparent area. The bezel area BZA can be an area having a relatively low light transmittance than the transmissive area TA. The bezel area BZA can be disposed adjacent to the transmissive area TA and can surround the transmissive area TA. The bezel area BZA can define a shape of the transmissive area TA.

[0044] The bezel area BZA can have a predetermined color. The bezel area BZA can cover the non-active area NAA of the display module 200 to prevent the non-active area NAA from being viewed from the outside by a user. However, in other exemplary embodiments of the disclosure, the window WM can omit the bezel area BZA.

[0045] In exemplary embodiments of the disclosure, the window WM includes a module area MA. The module area MA can be superposed (e.g., in the third direction DR3) with the electronic module 500 described later. The electronic device EA can receive an external signal for input into the electronic module 500 through the module area MA, or can transmit a signal output from the electronic module 500 to the outside (e.g., to an external device). According to exemplary embodiments of the disclosure, the module area MA can be disposed within the transmissive area TA. Thus, since the module area MA is moved from the bezel area BZA to the transmissive area TA, the width of the bezel area BZA can be reduced.

[0046] FIG. 1B One module area MA is illustrated. However, exemplary embodiments of the disclosure are not limited thereto. For example, the electronic device EA can include a plurality of module areas MA. In addition, in exemplary embodiments illustrated in FIG. 1B In exemplary embodiments illustrated in FIG. 10, the module area MA is positioned in the upper left end of the transmissive area TA. However, exemplary embodiments of the disclosure are not limited thereto. For example, the module area MA can be positioned in various other areas of the transmissive area TA, such as the upper right end of the transmissive area TA, the center of the transmissive area TA, the lower left end of the transmissive area TA, the lower right end of the transmissive area TA, etc.

[0047] As described above, the electronic device EA can include the window WM including the transmissive area TA and the bezel area BZA. The electronic device EA can include the module area MA in the transmissive area TA. The electronic device EA can include the electronic module 500 in the module area MA. FIG. 1BAs illustrated in FIG. 1, the display module 200 can be disposed under the window WM. In the disclosure, the term "under" can mean a direction opposite to a direction (e.g., the third direction DR3) along which the display module 200 displays the image IM. The display module 200 can display the image IM and can sense the external input TC. The display module 200 can include a front surface IS (e.g., a top surface of the display module 200 in the third direction DR3) including the active area AA and the non-active area NAA. The active area AA can be activated in response to an electrical signal.

[0048] In the disclosure, the active area AA of the display module 200 can be an area in which the image IM is displayed and the external input TC is sensed. The transmissive area TA of the window WM can overlap (e.g., overlap in the third direction DR3) the active area AA. For example, the transmissive area TA can overlap at least a portion or an entire surface of the active area AA. Accordingly, a user can view the image IM through the transmissive area TA, or can input the external input TC through the transmissive area TA.

[0049] The bezel area BZA of the window WM can overlap (e.g., overlap in the third direction DR3) the non-active area NAA of the display module 200. Accordingly, the non-active area NAA can be covered by the bezel area BZA. The non-active area NAA can be disposed adjacent to the active area AA. For example, the non-active area NAA can be disposed on a periphery of the active area AA. The non-active area NAA can surround the active area AA and define a shape of the active area AA. The driving circuit unit 300 or the driving line can be disposed in the non-active area NAA to drive the active area AA.

[0050] In the present exemplary embodiment, the display module 200 has a flat shape in the active area AA and the non-active area NAA. However, exemplary embodiments of the disclosure are not limited thereto. For example, the display module 200 can be partially bent in the non-active area NAA. In this embodiment, the display module 200 can be bent in the non-active area NAA toward the rear surface of the electronic device EA. The bent portion of the display module 200 can overlap (e.g., overlap in the third direction DR3) the active area AA and can be disposed under the active area AA. In this embodiment, the bezel area BZA of the window WM can not overlap the bent portion of the display module 200, and an area of the bezel area BZA can be reduced in the display surface FS of the electronic device EA. In another exemplary embodiment, the display module 200 can have a partially bent shape in the active area AA. In another exemplary embodiment, the display module 200 can omit the non-active area NAA.

[0051] The display module 200 includes the display panel 210 and the input sensing layer 220.

[0052] The display panel 210 can be configured to substantially generate an image IM. The display panel 210 can display the generated image IM through the front surface IS. A user can view the image IM from the outside through the transmissive area TA of the window WM.

[0053] The input sensing layer 220 senses an external input TC provided from the outside. For example, the input sensing layer 220 can sense the external input TC provided through the window WM. The external input TC can be a user input. The user input can include various forms of external inputs such as a part of a user's body, light, heat, a pen, pressure, etc. In FIG. 1A In the exemplary embodiment shown in FIG. 1, the external input TC is shown as a touch operation applied via the display surface FS of the electronic device EA using a user's hand. However, the exemplary embodiments of the present disclosure are not limited thereto. As described above, the external input TC can be provided in various forms, and the electronic device EA can sense the external input TC applied to the electronic device EA according to the structure of the electronic device EA.

[0054] The driving circuit unit 300 can be electrically connected to the display panel 210 and the input sensing layer 220. The driving circuit unit 300 can include a main circuit board MB, a first flexible film CF1, and a second flexible film CF2.

[0055] The first flexible film CF1 is electrically connected to the display panel 210. The first flexible film CF1 connects the display panel 210 and the main circuit board MB. The first flexible film CF1 is connected to a pad (or referred to as a "land") disposed in the non-active area NAA of the display panel 210 (e.g., a display pad). The first flexible film CF1 provides an electrical signal to the display panel 210 to drive the display panel 210. The electrical signal is generated by the first flexible film CF1 or the main circuit board MB.

[0056] The second flexible film CF2 is electrically connected to the input sensing layer 220. The second flexible film CF2 connects the input sensing layer 220 and the main circuit board MB. The second flexible film CF2 is connected to a pad disposed in the non-active area NAA of the input sensing layer 220 (e.g., a sensing pad). The second flexible film CF2 provides an electrical signal to the input sensing layer 220 to drive the input sensing layer 220. The electrical signal is generated by the second flexible film CF2 or the main circuit board MB.

[0057] The main circuit board MB can include various driving circuits that drive the display module 200. The main circuit board MB can also include a connector for power supply. The first flexible film CF1 and the second flexible film CF2 can be connected to the main circuit board MB. According to an exemplary embodiment of the present disclosure, the display module 200 can be controlled by using one main circuit board MB. However, in other exemplary embodiments, the main circuit board MB can include a plurality of circuit boards. For example, the display panel 210 and the input sensing layer 220 can be connected to different main circuit boards from each other, and one of the first flexible film CF1 and the second flexible film CF2 can not be connected to the main circuit board MB.

[0058] In an exemplary embodiment of the present disclosure, an area of the display module 200 that overlaps (e.g., overlaps in the third direction DR3) the module area MA of the window WM can have a relatively high transmittance than the active area AA that does not overlap the module area MA. For example, at least some of the components of the display panel 210 and the components of the input sensing layer 220 can be omitted in the area. Accordingly, the electronic module 500 disposed to overlap the module area MA can easily transmit and / or receive a signal through the module area MA.

[0059] FIG. 1B A structure in which a predetermined hole MH (hereinafter, referred to as a "module hole") is defined in an area of the display module 200 that overlaps (e.g., overlaps in the third direction DR3) the module area MA is illustrated. The module hole MH is defined in the active area AA to penetrate the display module 200. The module hole MH penetrates the display panel 210 and the input sensing layer 220. The module hole MH can be defined by the absence of the components of the display panel 210 and the components of the input sensing layer 220 in the area that overlaps (e.g., overlaps in the third direction DR3) the module area MA. Since the module hole MH is defined in the active area AA of the display module 200, the module area MA of the window WM can be disposed in the transmissive area TA.

[0060] When viewed in a plan view, the electronic module 500 can overlap the module hole MH and the module area MA. The electronic module 500 can be disposed under the display module 200, and at least a portion of the electronic module 500 can be accommodated in the module hole MH. The electronic module 500 can receive an external input TC provided through the module area MA or can provide an output through the module area MA.

[0061] The housing 400 is coupled to the window WM. The housing 400 is coupled to the window WM to form an outer surface of a defined internal space of the electronic apparatus EA. The display module 200 and the electronic module 500 can be positioned within the internal space.

[0062] The housing 400 can include a material having relatively high rigidity. For example, in an exemplary embodiment, the housing 400 can include a plurality of frames and / or plates including glass, plastic, metal, or a combination thereof. The housing 400 can stably protect components of the electronic apparatus EA positioned within the internal space from external impact.

[0063] Referring to FIG. 2 The electronic apparatus EA includes a display module 200, a power module PM, a first electronic module EM1, and a second electronic module EM2. The display module 200, the power module PM, the first electronic module EM1, and the second electronic module EM2 are electrically connected to each other.

[0064] The power module PM supplies power sufficient for overall operation of the electronic apparatus EA. The power module PM includes a conventional battery module.

[0065] The first electronic module EM1 and the second electronic module EM2 include various functional modules to operate the electronic apparatus EA.

[0066] The first electronic module EM1 is directly mounted on a mother board electrically connected to the display module 200, or is electrically connected to the mother board through a connector (not shown) after being mounted on a separate board.

[0067] The first electronic module EM1 includes a control module CM, a wireless communication module TM, an image input module IIM, an audio input module AIM, a memory MM, and an external interface IF. Some modules are electrically connected to the mother board through a flexible printed circuit board without being mounted on the mother board.

[0068] The control module CM controls overall operation of the electronic apparatus EA. In an exemplary embodiment, the control module CM can be a microprocessor. However, exemplary embodiments are not limited thereto. For example, the control module CM causes the display module 200 to activate or deactivate. The control module CM controls other modules such as the image input module IIM or the audio input module AIM based on a touch signal provided from the display module 200.

[0069] The wireless communication module TM can transmit / receive a wireless signal to / from another terminal by using a Bluetooth or Wi-Fi line. The wireless communication module TM can transmit / receive a voice signal by using a conventional communication line. The wireless communication module TM can include a transmitter TM1 that modulates a signal to be transmitted and transmits the modulated signal, and a receiver TM2 that demodulates a signal applied thereto.

[0070] The image input module IIM processes an image signal and converts the image signal into image data that can be displayed through the display module 200. The audio input module AIM receives an external audio signal through a microphone in a recording mode and a voice recognition mode, and converts the audio signal into electric voice data.

[0071] The external interface IF serves as an interface between the control module CM and external devices such as an external charger, a wired / wireless data port, and a card slot (e.g., a slot for a memory card and a SIM / UIM card).

[0072] The second electronic module EM2 includes an audio output module AOM, a light emission module LM, a light reception module LRM, and a camera module CMM. The components of the second electronic module EM2 are directly mounted on the mother board, electrically connected to the display module 200 through a connector after being mounted on a separate substrate, or electrically connected to the first electronic module EM1.

[0073] The audio output module AOM converts and outputs audio data provided from the wireless communication module TM or audio data stored in the memory MM to a speaker or an external device.

[0074] The light emission module LM can generate and emit light. For example, in an exemplary embodiment, the light emission module LM can emit infrared light. The light emission module LM can include a light emitting diode (LED) device. The light reception module LRM can sense infrared light. The light reception module LRM can be activated when infrared light equal to or greater than a predetermined level is sensed. The light reception module LRM can include a complementary metal-oxide-semiconductor (CMOS) sensor. Infrared light generated by the light emission module LM can be incident into the light reception module LRM after being output from the light emission module LM and reflected by an external object such as a user's finger or face. The camera module CMM can take an external image.

[0075] In an exemplary embodiment, the electronic module 500 can include at least one of the components of the first electronic module EM1 and the second electronic module EM2. For example, the electronic module 500 can include at least one of an audio output module AOM, a light emission module LM, a light reception module LRM, a camera module CMM, and a thermal sensing module. The electronic module 500 can sense an external object provided through the module area MA, or can provide an external sound signal such as voice or light such as infrared light. In addition, the electronic module 500 can include a plurality of modules, however, it should not be limited to a specific embodiment.

[0076] FIG. 3 is a plan view showing the display panel 210 according to an exemplary embodiment of the present disclosure, FIG. 4 is an enlarged plan view showing the area XX' shown in FIG. 3 is an enlarged plan view showing the area XX' shown in

[0077] Referring to FIG. 3 and FIG. 4 The display panel 210 includes a base layer BL, a plurality of pixels PX, a plurality of signal lines GL, DL, and PL, and a plurality of display pads PDD.

[0078] An active area AA of the display panel 210 is an area in which an image IM is displayed, and a non-active area NAA is an area in which a driving circuit unit 300 or a driving line is disposed. FIG. 3 The active area AA and the non-active area NAA of the display panel 210 are illustrated. The pixels PX are disposed in the active area AA.

[0079] The base layer BL can be a stacked structure. For example, the base layer BL can include a silicon substrate, a plastic substrate, a glass substrate, an insulating film, or a plurality of insulating layers.

[0080] The active area AA can include a first area AR1 and a second area AR2. When viewed in a plan view, the second area AR2 can surround the first area AR1. The second area AR2 can be a display area in which an image IM is displayed, and can be surrounded by the non-active area NAA. The pixels PX can be disposed on the base layer BL to correspond to the second area AR2.

[0081] At least a portion of the first area AR1 can overlap a module area MA of the window WM when viewed in a plan view. A module hole MH can be defined within the first area AR1. For example, the module hole MH can be defined by partially or entirely removing components of the display panel 210, and can be disposed to overlap the module area MA of the window WM. The first area AR1 can also include a portion of the active area AA that directly surrounds the module hole MH when viewed in a plan view.

[0082] The pixels PX that provide an image can not be disposed on the first area AR1 of the base layer BL. Accordingly, the first area AR1 can be defined as a non-display area within the active area AA. The pixels PX can be disposed on the second area AR2 of the base layer BL. Accordingly, the second area AR2 can be defined as a display area in the active area AA.

[0083] According to the present disclosure, the non-display area AR1 can be disposed to be surrounded by the display area AR2 when viewed in a plan view. As FIG. 1B indicated in the above, the non-display area AR1 can overlap the module area MA of the window WM. Accordingly, the first area AR1 can eliminate the need for a separate area outside the active area AA for providing a module area. Accordingly, an area for a module outside the active area AA can be omitted in the electronic device EA, and the sizes of the non-active area NAA and the bezel area BZA can be reduced.

[0084] Various signal lines are connected to the pixels PX to apply electrical signals to the pixels PX. For example, in the exemplary embodiment shown in FIG. 1, the signal lines included in the display panel 210 are a scan line GL, a data line DL, and a power line PL. However, exemplary embodiments of the present disclosure are not limited thereto. In other exemplary embodiments, the signal lines can further include at least one of an initialization voltage line, a light emission control line, and the like. The signal lines GL, DL, and PL can be disposed on the second area AR2 of the base layer BL. FIG. 3

[0085] In the exemplary embodiment shown in FIG. 1, the equivalent circuit diagram of one of the pixels PX is enlarged and shown as a representative example. The pixel PX can include a first transistor TR1, a capacitor CP, a second transistor TR2, and a light emitting device OLED. The first transistor TR1 can be a switching device that controls the turn-on / off of the pixel PX. The first transistor TR1 can transmit or block a data signal applied thereto through a data line DL in response to a scan signal applied thereto through a scan line GL. FIG. 3

[0086] The capacitor CP is connected to the first transistor TR1 and the power line PL. The capacitor CP is charged with a charge corresponding to a potential difference between the data signal supplied from the first transistor TR1 and a power signal (hereinafter, referred to as a "first power signal") applied to the power line PL.

[0087] The second transistor TR2 is connected to the first transistor TR1, the capacitor CP, and the light emitting device OLED. The second transistor TR2 controls a driving current flowing through the light emitting device OLED in response to an amount of the charge charged in the capacitor CP. The turn-on time of the second transistor TR2 is determined by the amount of the charge charged in the capacitor CP. The second transistor TR2 applies the first power signal supplied through the power line PL to the light emitting device OLED during its turn-on period.

[0088] The light emitting device OLED can generate light in response to an electrical signal or can control the amount of generated light. In an exemplary embodiment, the light emitting device OLED can include an organic light emitting device or a quantum dot light emitting device.

[0089] ​​The light emitting device OLED is connected to the power terminal VSS to receive a power signal (hereinafter, referred to as a "second power signal") different from the first power signal provided through the power line PL. A driving current corresponding to a difference between the electrical signal provided from the second transistor TR2 and the second power signal flows through the light emitting device OLED. The light emitting device OLED generates light corresponding to the driving current. However, the above-described light emitting device OLED is merely exemplary. The pixel PX can include electronic devices having various different configurations and arrangements compared to the described exemplary embodiment, and should not be particularly limited.

[0090] The display pad PDD can include a first pad D1 and a second pad D2. The first pad D1 can include a plurality of first pads, and the first pad D1 can be connected to the data line DL. The second pad D2 can be electrically connected to the power line PL. The display panel 210 can apply an electrical signal provided thereto from the outside to the pixel PX through the display pad PDD. The display pad PDD can also include additional pads for receiving other electrical signals in addition to the first pad D1 and the second pad D2, and the display pad PDD should not be limited to FIG. 3 the exemplary embodiment shown in FIG. 11.

[0091] FIG. 5 is a plan view showing an input sensing layer 220 according to an exemplary embodiment of the disclosure.

[0092] Referring to FIG. 5 , the input sensing layer 220 can be disposed on the display panel 210. For example, in an exemplary embodiment, the input sensing layer 220 can be directly disposed on the display panel 210, or can be bonded to the display panel 210 through an adhesive member. The input sensing layer 220 can be formed on the display panel 210 through a continuous process after the display panel 210 is formed.

[0093] In an exemplary embodiment, the input sensing layer 220 can include first and second sensing electrodes TE1 and TE2, a plurality of sensing lines TL1, TL2, and TL3, and a plurality of sensing pads PDT. However, other exemplary embodiments can have different numbers and arrangements of the sensing electrodes TE1 and TE2, the sensing lines TL1 and TL2, and the sensing pads PDT. Therefore, exemplary embodiments of the disclosure are not limited thereto.

[0094] The first and second sensing electrodes TE1 and TE2 are disposed in the active area AA. For example, as shown in the exemplary embodiment of FIG. 11, the first and second sensing electrodes TE1 and TE2 are arranged in an array of rows and columns, the first and second sensing electrodes TE1 and TE2 being alternated in adjacent columns. FIG. 5 The input sensing layer 220 can obtain information about an external input TC (refer to FIG. 1) based on a change in capacitance between the first and second sensing electrodes TE1 and TE2.FIG. 1A information of the first sensing electrode TE1.

[0095] The first sensing electrode TE1 includes first sensing patterns SP1 and first connection patterns BP1. At least one first connection pattern BP1 is connected to two first sensing patterns SP1 positioned adjacent to each other. The second sensing electrode TE2 includes second sensing patterns SP2 and second connection patterns BP2. At least one second connection pattern BP2 is connected to two second sensing patterns SP2 adjacent to each other.

[0096] The sensing lines are mainly disposed in the non-active area NAA. In FIG. 5 In an exemplary embodiment shown in FIG. 1, the sensing lines include a first sensing line TL1, a second sensing line TL2, and a third sensing line TL3.

[0097] The first sensing line TL1 is connected to the first sensing electrode TE1. The second sensing line TL2 is connected to a first end of the second sensing electrode TE2. The third sensing line TL3 is connected to a second end of the second sensing electrode TE2. The first end of the second sensing electrode TE2 is opposite to the second end of the second sensing electrode TE2. For example, the first end of the second sensing electrode TE2 can be spaced apart from the second end of the second sensing electrode TE2 in the second direction DR2.

[0098] According to the present disclosure, the second sensing electrode TE2 is connected to the second sensing line TL2 and the third sensing line TL3. Accordingly, it is possible to uniformly maintain the sensitivity of the area for the second sensing electrode TE2, which has a length longer than that of the first sensing electrode TE1. However, exemplary embodiments of the present inventive concept are not limited to this particular configuration. For example, in other exemplary embodiments, the third sensing line TL3 can be omitted.

[0099] The sensing pads PDT are disposed in the non-active area NAA. In FIG. 5 In an exemplary embodiment shown in FIG. 1, the sensing pads PDT include a first sensing pad T1, a second sensing pad T2, and a third sensing pad T3. However, exemplary embodiments of the present disclosure are not limited thereto. The first sensing pad T1 is connected to the first sensing line TL1 and electrically connected to the first sensing electrode TE1. The second sensing pad T2 is connected to the second sensing line TL2, and the third sensing pad T3 is connected to the third sensing line TL3. Accordingly, the second sensing pad T2 and the third sensing pad T3 are electrically connected to the second sensing electrode TE2.

[0100] Some components of the input sensing layer 220 can be removed from the area overlapped with the module area MA (e.g., overlapped in the third direction DR3) of the window WM. For example, a portion of the first sensing electrode TE1 and a portion of the second sensing electrode TE2 can not be disposed in the area overlapped with the module area MA. In the present exemplary embodiment, the first sensing electrode TE1 can cause the portion of the first sensing pattern SP1 overlapped with the module area MA to be removed, and the second sensing electrode TE2 can cause the portion of the second sensing pattern SP2 overlapped with the module area MA to be removed.

[0101] According to the present disclosure, since the sensing electrodes TE1 and TE2 are removed in the area overlapped with the module area MA, the electronic module 500 (refer to FIG. 1B ) can be prevented from being covered by the first sensing electrode TE1 or the second sensing electrode TE2. Accordingly, the sensing sensitivity of the electronic module 500 can be improved.

[0102] FIG. 6 is an exploded perspective view illustrating a module area MA and a module hole MH of an electronic device EA according to an exemplary embodiment of the present disclosure, FIG. 7 is a cross-sectional view taken along the line I-I' illustrated in FIG. 6 .

[0103] Referring to FIG. 6 and FIG. 7 , the window WM provides a front surface of the electronic device EA (e.g., a top surface of the electronic device EA in the third direction DR3). The window WM is disposed on the entire surface of the display module 200 (e.g., in a plane defined by the first direction DR1 and the second direction DR2) to protect the display module 200. In an exemplary embodiment, the window WM can include a glass substrate, a sapphire substrate, a plastic film, etc.

[0104] The window WM can include a transparent material and provide a transmissive area TA and a bezel area BZA of the electronic device EA. According to the present exemplary embodiment, the transmissive area TA of the window WM can be an area overlapped with the active area AA of the display panel 210. For example, the transmissive area TA can be partially overlapped with the active area AA or overlapped with the entire portion of the active area AA. A user can view an image IM displayed through the active area AA of the display panel 210 from the outside through the transmissive area TA.

[0105] The window WM can further include a bezel layer BZ. The bezel layer BZ can define a bezel area BZA. For example, in the present exemplary embodiment, an area in which the bezel layer BZ is disposed on the window WM can be defined as the bezel area BZA, and an area that is exposed and not covered by the bezel layer BZ can be the transmissive area TA. The bezel layer BZ can include a colorless (non-colored) layer and a pattern layer that provides a predetermined pattern. The pattern layer can provide a pattern called a hair line. The colorless layer can include an organic mixture including a black pigment or dye. In an exemplary embodiment, the bezel layer BZ can be formed by a deposition, printing, or coating method.

[0106] The window WM can further include a window black matrix WBM. In an exemplary embodiment, the window black matrix WBM can be printed on a rear surface (e.g., a bottom surface of the window WM in the third direction DR3) of the window WM. The window black matrix WBM can be printed in a color having high light-shielding properties. In an exemplary embodiment, the window black matrix WBM can include an organic mixture including a black pigment or dye. However, the window black matrix WBM can be any material having high light-shielding properties.

[0107] The window black matrix WBM can be positioned within the module area MA of the window WM and can not overlap (e.g., overlap in the third direction DR3) the module hole MH. For example, the window black matrix WBM can be positioned within the peripheral area PA of the module area MA that overlaps a portion of the display module 200 surrounding the module hole MH. The window black matrix WBM prevents light passing through the module hole MH from leaking in the peripheral area of the module hole MH and prevents light passing through the module hole MH from being viewed by a user through the transmissive area TA of the window WM.

[0108] According to an exemplary embodiment of the present disclosure, the module area MA of the window WM can include a peripheral area PA and a central area CA that overlaps (e.g., overlaps in the third direction DR3) the module hole MH. The window black matrix WBM is disposed in the peripheral area PA. The window black matrix WBM can be disposed in the peripheral area PA to prevent a light leakage phenomenon in which light leaks from the peripheral area PA.

[0109] A glare prevention layer can be further disposed between the window black matrix WBM and the window WM or between the window black matrix WBM and the display module 200. The glare prevention layer can be disposed in the peripheral area PA of the module area MA or in an area overlapping the peripheral area PA to prevent a glare phenomenon due to light leaking from the peripheral area PA.

[0110] The electronic device EA can include one or more functional layers FL disposed between the window WM and the display module 200. For example, in the present exemplary embodiment, the functional layer FL can be disposed between the window black matrix WBM and the display module 200. The functional layer FL can include an organic layer including a black pigment or dye. The functional layer FL can be formed by a deposition, printing, or coating method. FIG. 7In the exemplary embodiment of FIG. 1, the functional layer FL can be an anti-reflection layer that shields reflection of external light. The anti-reflection layer can prevent external light incident through the display surface FS of the electronic device EA from being viewed from the outside by a user after being reflected by the elements of the display module 200. The anti-reflection layer can include a polarizing film and / or a retardation film. The number of retardation films and the phase retardation length (e.g., λ / 4 or λ / 2) of the retardation films can vary. For example, the number of retardation films and the phase retardation length can be determined according to the operating principle of the anti-reflection layer.

[0111] The window WM and the functional layer FL can be attached to each other through the first adhesive layer AL1. The first adhesive layer AL1 can be optically transparent. The first adhesive layer AL1 can be an adhesive layer manufactured by applying a liquid adhesive material and curing the liquid adhesive material or an adhesive sheet manufactured separately. For example, the first adhesive layer AL1 can be a pressure sensitive adhesive (PSA), an optically clear adhesive (OCA), or an optically clear resin (OCR).

[0112] The first opening OP1 can be defined to pass through the first adhesive layer AL1 to be superposed (e.g., superposed in the third direction DR3) with the module hole MH. For example, the first opening OP1 can be formed to pass through the first adhesive layer AL1 and can be superposed with the central area CA of the module area MA. The first opening OP1 can have a size substantially the same as the size of the module hole MH of the display module 200. As an example, the diameter of the first opening OP1 can be substantially the same as the diameter of the module hole MH. The electronic module 500 can be disposed within the space provided by the first opening OP1 in conjunction with the space provided by the module hole MH of the display module 200.

[0113] The functional layer FL can be fixed to the rear surface of the window WM through the first adhesive layer AL1. The second opening OP2 can be defined to pass through the functional layer FL to be superposed (e.g., superposed in the third direction DR3) with the module hole MH. The second opening OP2 can be formed to pass through the functional layer FL and can be superposed with the central area CA of the module area MA. The second opening OP2 can have a size substantially the same as the size of the module hole MH. As an example, the diameter of the second opening OP2 can be substantially the same as the diameter of the module hole MH. The electronic module 500 can be disposed within the space provided by the second opening OP2 in conjunction with the space provided by the first opening OP1 and the module hole MH of the display module 200.

[0114] The functional layer FL can be attached to the upper surface (e.g., the upper surface in the third direction DR3) of the display module 200 through the second adhesive layer AL2 disposed on the upper surface of the display module 200. The second adhesive layer AL2 can be optically transparent. The second adhesive layer AL2 can be an adhesive layer manufactured by coating a liquid adhesive material and curing the liquid adhesive material or an adhesive sheet manufactured separately. For example, in an exemplary embodiment, the second adhesive layer AL2 can be a pressure sensitive adhesive (PSA), an optically clear adhesive (OCA), or an optically clear resin (OCR).

[0115] The third opening OP3 can be defined to pass through the second adhesive layer AL2 to be superposed (e.g., superposed in the third direction DR3) with the module hole MH. The third opening OP3 can be formed through the second adhesive layer AL2 and can be superposed with the central area CA of the module area MA. The third opening OP3 can have a size substantially the same as the size of the module hole MH of the display module 200. As an example, the diameter of the third opening OP3 can be substantially the same as the diameter of the module hole MH. The electronic module 500 can be disposed within the space provided by the third opening OP3 along with the spaces provided by the first opening OP1 and the second opening OP2 and the module hole MH of the display module 200.

[0116] The module hole MH can be formed through the display module 200. The module hole MH can be superposed (e.g., superposed in the third direction DR3) with the first opening OP1 to the third opening OP3 and superposed (e.g., superposed in the third direction DR3) with the central area CA of the module area MA. The module hole MH can provide a space in which the electronic module 500 is disposed along with the first opening OP1 to the third opening OP3. Accordingly, the electronic module 500 can be inserted into the space and can be stably fixed therein.

[0117] In FIG. 7 the first opening OP1 to the third opening OP3 and the module hole MH have substantially the same sizes as each other. However, exemplary embodiments of the present disclosure are not limited thereto. For example, the first opening OP1 to the third opening OP3 can have sizes (such as diameters defined in the first direction DR1 and / or the second direction DR2) greater than the size of the module hole MH. In an exemplary embodiment, the diameters of the first opening OP1 to the third opening OP3 can be designed to increase as the distance of the respective openings to the module hole MH increases in the third direction DR3. However, in another exemplary embodiment, the diameters of the first opening OP1 to the third opening OP3 can decrease as the distance of the respective openings to the module hole MH increases in the third direction DR3.

[0118] FIG. 8is a cross-sectional view showing a module area MA and a module hole MH of an electronic device EA according to another exemplary embodiment of the disclosure.

[0119] Referring to FIG. 8 , the second opening OP2 can be defined to pass through the functional layer FL to be superposed (e.g., superposed in the third direction DR3) with the module hole MH. The first light blocking layer LBL1 and the second light blocking layer LBL2 can be disposed in the peripheral area adjacent to the second opening OP2. The first light blocking layer LBL1 can be disposed on the upper surface (e.g., the upper surface in the third direction DR3) of the functional layer FL and can be superposed (such as superposed in the third direction DR3) with the peripheral area PA of the module area MA. The second light blocking layer LBL2 can be disposed on the lower surface (e.g., the lower surface in the third direction DR3) of the functional layer FL and can be superposed (such as superposed in the third direction DR3) with the peripheral area PA of the module area MA.

[0120] As an example, the first light blocking layer LBL1 and the second light blocking layer LBL2 can be black matrix layers formed on the upper surface and the lower surface of the functional layer FL, respectively. In an exemplary embodiment, the first light blocking layer LBL1 and the second light blocking layer LBL2 can be formed on the upper surface and the lower surface of the functional layer FL, respectively, by a printing, deposition, or coating method. The first light blocking layer LBL1 and the second light blocking layer LBL2 can include an organic material or a metallic material having light blocking properties. The first light blocking layer LBL1 and the second light blocking layer LBL2 can have a circular ring shape and can have a size (e.g., a diameter in the first direction DR1 and / or the second direction DR2) smaller than that of the window black matrix WBM. For example, as shown in FIG. 8 , the first light blocking layer LBL1 and the second light blocking layer LBL2 have a width W1 (e.g., a length in the second direction DR2) smaller than a width W2 (e.g., a length in the second direction DR2) of the window black matrix WBM.

[0121] In the present exemplary embodiment, the first light blocking layer LBL1 and the second light blocking layer LBL2 have a size smaller than that of the window black matrix WBM, however, they should not be limited to or by this. For example, the first light blocking layer LBL1 and the second light blocking layer LBL2 can have substantially the same size as that of the window black matrix WBM. In another exemplary embodiment, one of the first light blocking layer LBL1 and the second light blocking layer LBL2 can have substantially the same size as that of the window black matrix WBM, and the other of the first light blocking layer LBL1 and the second light blocking layer LBL2 can have a size smaller than that of the window black matrix WBM.

[0122] In an exemplary embodiment, an anti-glare layer can be disposed adjacent to one of the first light blocking layer LBL1 and the second light blocking layer LBL2.

[0123] In another exemplary embodiment, the electronic device EA can include an antiglare layer on a lower surface of the functional layer FL.

[0124] FIG. 9 is an exploded perspective view showing a module area MA and a module hole MH of an electronic device EA according to another exemplary embodiment of the present disclosure, FIG. 10 is a cross-sectional view taken along FIG. 9 line II-II' shown in FIG.

[0125] Referring to FIG. 9 and FIG. 10 The window WM can further include a window black matrix WBM disposed in the module area MA. The window black matrix WBM can be printed on a rear surface (e.g., a bottom surface in the third direction DR3) of the window WM in the peripheral area PA. The window black matrix WBM can be printed in a color having a high light-shielding property. The window black matrix WBM can be any material having a high light-shielding property.

[0126] The second adhesive layer AL2, the functional layer FL, and the first adhesive layer AL1 can be sequentially stacked between the window WM and the display module 200 in the third direction DR3. The first opening OP1 is defined through the first adhesive layer AL1 to overlap the module hole MH, the second opening OP2 is defined through the functional layer FL, and the third opening OP3 is defined through the second adhesive layer AL2. The first opening OP1 to the third opening OP3 have a size (e.g., a length in the first direction DR1 and / or the second direction DR2) greater than that of the module hole MH. For example, a diameter of the first opening OP1 to the third opening OP3 is greater than that of the module hole MH. The first opening OP1 to the third opening OP3 overlap (e.g., in the third direction DR3) the peripheral area PA of the module area MA. The first opening OP1 to the third opening OP3 provide, together with the module hole MH of the display module 200, a space in which the electronic module 500 is disposed.

[0127] A light-blocking layer BIL can be disposed inside the first opening OP1 to the third opening OP3. The light-blocking layer BIL can overlap (e.g., in the third direction DR3) the peripheral area PA of the module area MA. As an example, in an exemplary embodiment, the light-blocking layer BIL can be formed on an upper surface of the display module 200 exposed through the first opening OP1 to the third opening OP3 by an inkjet method. The light-blocking layer BIL can include an organic mixture including a black dye or pigment. The light-blocking layer BIL and the window black matrix WBM can have a donut shape, and the light-blocking layer BIL can have a size smaller than that of the window black matrix WBM. For example, a width W4 of the light-blocking layer BIL in the second direction DR2 can be smaller than a width W3 of the window black matrix WBM in the second direction DR2.

[0128] In FIG. 9 and FIG. 10 In exemplary embodiments shown in FIGS. 1 and 2, the light-blocking layer BIL has a size (e.g., a diameter in the first direction DR1 and / or the second direction DR2) that is smaller than a size of the window black matrix WBM. However, exemplary embodiments of the present disclosure are not limited thereto. For example, the light-blocking layer BIL can have a size that is substantially the same as a size of the window black matrix WBM. In certain embodiments, the light-blocking layer BIL can have a size that is larger than a size of the window black matrix WBM.

[0129] The light-blocking layer BIL can be formed on the first area AR1 defined around the module hole MH of the display module 200. In exemplary embodiments, in a state in which the functional layer FL is attached to the upper surface of the display module 200 by the second adhesive layer AL2, the light-blocking layer BIL can be formed by jetting ink on the upper surface of the display module 200. In another exemplary embodiment, the light-blocking layer BIL can be formed by jetting ink on the upper surface of the display module 200 corresponding to the first area AR1 of the display module 200, and then the functional layer FL can be attached to the display module 200 by the second adhesive layer AL2 subsequently.

[0130] The light-blocking layer BIL is disposed within the first to third openings OP1 to OP3 and between the window black matrix WBM and the display module 200. As shown in FIG. 9 The light-blocking layer BIL is formed to overlap (e.g., overlap in the third direction DR3) with the peripheral area PA of the module area MA. For example, the light-blocking layer BIL can overlap with the first area AR1 of the display module 200. Accordingly, a light leakage phenomenon in which light leaks from the first area AR1 can be prevented. Since the light-blocking layer BIL extends within the inner area of the first to third openings OP1 to OP3, the light-blocking layer BIL has a thickness that is greater than a thickness of the light-blocking layers LBL1 and LBL2 shown in FIG. 8 in FIG. 3. Accordingly, the light-blocking layer BIL can have a higher light-blocking performance than the light-blocking layers LBL1 and LBL2 shown in FIG. 8 in FIG. 3, and as a result, light leakage can be reduced to a greater extent.

[0131] FIG. 11 is an exploded perspective view showing module areas MA1 and MA2 of an electronic device EA2 according to another exemplary embodiment of the present disclosure, FIG. 12 is a cross-sectional view taken along line III-III' shown in FIG. 11 FIG. 3.

[0132] Referring to FIG. 11 and FIG. 12In an electronic device EA2 according to another exemplary embodiment of the disclosure, the window WM can include a first module area MA1 and a second module area MA2. The first module area MA1 of the electronic device EA2 has substantially the same structure as the module area MA illustrated in FIG. 2A, and thus details thereof will be omitted. FIG. 6 to FIG. 10 The second module area MA2 of the electronic device EA2 has substantially the same structure as the module area MA illustrated in FIG. 2B, and thus details thereof will be omitted.

[0133] The electronic device EA2 can further include a second window black matrix WBM2 disposed in the second module area MA2. The second module area MA2 can include a peripheral area PA2 and a window module hole WMH overlapping (e.g., in the third direction DR3) the second module hole MH2 disposed in the display module 200. The second window black matrix WBM2 can be printed on a rear surface (e.g., a bottom surface of the window WM in the third direction DR3) of the window WM in the peripheral area PA2. The second window black matrix WBM2 can be printed in a color having a high light-shielding property. For example, the second window black matrix WBM2 can include an organic mixture including a black pigment or dye. However, the second window black matrix WBM2 can be any material having a high light-shielding property.

[0134] The second adhesive layer AL2, the functional layer FL, and the first adhesive layer AL1 can be sequentially stacked between the window WM and the display module 200 in the third direction DR3. A fourth opening OP4 is defined through the first adhesive layer AL1, a fifth opening OP5 is defined through the functional layer FL, and a sixth opening OP6 is defined through the second adhesive layer AL2. The fourth opening OP4 to the sixth opening OP6 can overlap (e.g., in the third direction DR3) the second module hole MH2. The fourth opening OP4 to the sixth opening OP6 have substantially the same size as the size of the second module hole MH2 and the window module hole WMH. For example, a diameter (e.g., a diameter in a plane defined in the first direction DR1 and / or the second direction DR2) of the fourth opening OP4 to the sixth opening OP6 is substantially the same as a diameter of the second module hole MH2. The fourth opening OP4 to the sixth opening OP6, together with the second module hole MH2 and the window module hole WMH, provide a space in which the electronic module 600 is disposed. In the present exemplary embodiment, the electronic module 600 disposed in the second module area MA2 is a different type of electronic module from the electronic module 500 disposed in the first module area MA1. For example, the electronic module 600 can be an audio output module AOM (refer to FIG. 2C) that needs to be exposed to the outside through the window module hole WMH. However, exemplary embodiments of the disclosure are not limited thereto. FIG. 2 ) However, exemplary embodiments of the disclosure are not limited thereto.

[0135] A third light-blocking layer LBL3 can be disposed around the fourth opening OP4. The third light-blocking layer LBL3 can overlap (e.g., overlap in the third direction DR3) with the peripheral area PA2 of the second module area MA2. As an example, the third light-blocking layer LBL3 can be a black matrix layer formed on the upper surface of the functional layer FL by a printing, deposition, or coating method. The third light-blocking layer LBL3 can include an organic material or a metallic material having light-blocking properties. The third light-blocking layer LBL3 and the second window black matrix WBM2 can have a circular ring shape, and the third light-blocking layer LBL3 can have a size (e.g., a diameter in the first direction DR1 and / or the second direction DR2) that is smaller than the size of the second window black matrix WBM2. For example, the width W5 of the third light-blocking layer LBL3 in the second direction DR2 can be smaller than the width W6 of the second window black matrix WBM2 in the second direction DR2.

[0136] In the disclosure, a structure in which the third light-blocking layer LBL3 has a size that is smaller than the size of the second window black matrix WBM2 is shown as a representative example. However, exemplary embodiments of the disclosure are not limited thereto. For example, the third light-blocking layer LBL3 can have a size that is substantially the same as the size of the second window black matrix WBM2, or can have a size that is larger than the size of the second window black matrix WBM2.

[0137] A second module hole MH2 can be formed through the display module 200. The second module hole MH2 can overlap (e.g., overlap in the third direction DR3) with the fourth opening OP4 to the sixth opening OP6, and can overlap with the window module hole WMH of the second module area MA2. The electronic module 600 can be disposed in a space formed by the second module hole MH2, the fourth opening OP4 to the sixth opening OP6, and the window module hole WMH. Accordingly, the electronic module 600 can be inserted into the space and can be stably fixed therein.

[0138] In another exemplary embodiment, the fourth opening OP4 to the sixth opening OP6 can have a diameter that accommodates a light-blocking layer (e.g., a circular ring-shaped light-blocking layer). The light-blocking layer is disposed in an inner space of the fourth opening OP4 to the sixth opening OP6, and extends in the third direction DR3 from the fourth opening OP4 to the sixth opening OP6. The electronic module 600 is disposed in the inner space defined by the light-blocking layer.

[0139] FIG. 13 FIG. 1A is a cross-sectional view illustrating an active area AA of a display panel 210 according to an exemplary embodiment of the disclosure, FIG. 14 FIG. 1B is a cross-sectional view illustrating a module area MA of an electronic device EA according to an exemplary embodiment of the disclosure.

[0140] Referring to FIG. 13 and FIG. 14The display panel 210 includes a base layer BL, a circuit device layer DP-CL disposed on the base layer BL, a display device layer DP-OLED disposed on the circuit device layer DP-CL, an encapsulation base EC, and a sealing member SM.

[0141] The base layer BL can include a glass base. The base layer BL can include a base having a constant refractive index in a visible light wavelength range.

[0142] The circuit device layer DP-CL can include a buffer layer BFL as an inorganic layer, a first intermediate inorganic layer CL1 and a second intermediate inorganic layer CL2, and an intermediate organic layer CL3 as an organic layer. FIG. 13 An arrangement relationship of a semiconductor pattern OSP forming a first transistor TR1, a control electrode GE, an input electrode DE, and an output electrode SE is shown. The circuit device layer DP-CL can further include at least one contact hole. For example, in a representative example of FIG. 13 A first contact hole CH1 and a second contact hole CH2 are shown in a representative example of

[0143] The display device layer DP-OLED includes a light emitting device OLED. The display device layer DP-OLED includes an organic light emitting diode as the light emitting device OLED. The display device layer DP-OLED includes a pixel definition layer PDL (e.g., an organic material).

[0144] A first electrode AE is disposed on the intermediate organic layer CL3. The first electrode AE is connected to the output electrode SE through a third contact hole CH3 defined through the intermediate organic layer CL3. An opening OP is defined through the pixel definition layer PDL. At least a portion of the first electrode AE is exposed through the opening OP of the pixel definition layer PDL. The opening OP of the pixel definition layer PDL is referred to as a “light emitting opening” to distinguish it from other openings.

[0145] A display area AR2 of the display panel 210 can include a light emitting area PXA and a non-light emitting area NPXA defined adjacent to the light emitting area PXA. The non-light emitting area NPXA can surround the light emitting area PXA. In the present exemplary embodiment, the light emitting area PXA is defined to correspond to a portion of the first electrode AE exposed through the light emitting opening OP.

[0146] A hole control layer HCL can be commonly disposed in the light emitting area PXA and the non-light emitting area NPXA. The hole control layer HCL can include a hole transport layer and can further include a hole injection layer. A light emitting layer EML can be disposed on the hole control layer HCL. The light emitting layer EML can be disposed in an area corresponding to the light emitting opening OP. The light emitting layer EML can be formed in each pixel after being divided into a plurality of portions. The light emitting layer EML can include an organic material and / or an inorganic material. The light emitting layer EML can generate a predetermined color light.

[0147] An electron control layer ECL can be disposed on the light emitting layer EML. The electron control layer ECL can include an electron transport layer and can further include an electron injection layer. The hole control layer HCL and the electron control layer ECL can be commonly formed in the plurality of pixels using an opening mask. A second electrode CE can be disposed on the electron control layer ECL. The second electrode CE can be commonly disposed in the plurality of pixels.

[0148] A protective layer PIL can be further disposed on the display device layer DP-OLED. The protective layer PIL can protect the second electrode CE of the light emitting device OLED. The protective layer PIL can include an inorganic material such as silicon oxide, silicon nitride, silicon oxynitride, or the like.

[0149] An encapsulation substrate EC can be disposed on the second electrode CE. The encapsulation substrate EC and the second electrode CE can be spaced apart from each other (e.g., spaced apart from each other in the third direction DR3). A gap GP between the encapsulation substrate EC and the second electrode CE can be filled with air or an inert gas. In addition, the gap GP can be filled with a filler such as a silicone-based polymer, an epoxy-based resin, an acrylic-based resin, or the like.

[0150] The encapsulation substrate EC can be transparent. The encapsulation substrate EC can include a glass substrate. The encapsulation substrate EC can include a substrate having a constant refractive index in a visible light wavelength range.

[0151] The stack structure of the base layer BL, the circuit device layer DP-CL, and the display device layer DP-OLED can be defined as a lower display substrate. The sealing member SM can bind the lower display substrate and the encapsulation substrate EC. The sealing member SM can extend along the edge of the encapsulation substrate EC. The sealing member SM can be superposed (e.g., superposed in the third direction DR3) with the non-active area NAA (refer to FIG. 2) of the display panel 210. FIG. 3 ) of the display panel 210.

[0152] As shown in FIG. 14 , the sealing member SM can be superposed with the non-display area AR1 of the display panel 210. Pixels are not formed in the non-display area AR1 of the display panel 210. The non-display area AR1 of the display panel 210 can be superposed with the module area MA of the electronic apparatus EA shown in FIG. 1A .

[0153] The encapsulation substrate EC and the sealing member SM can prevent moisture from entering the lower display substrate. In an exemplary embodiment of the disclosure, the sealing member SM can bind the upper surface (e.g., the upper surface in the third direction DR3) of the base layer BL and the lower surface of the encapsulation substrate EC to each other.

[0154] In an exemplary embodiment, the sealing member SM can include an inorganic adhesive member such as a frit. However, in other exemplary embodiments, the sealing member SM can include an organic adhesive member. In the present exemplary embodiment, since the display panel 210 is completely sealed from the outside, the strength of the display panel 210 can be improved, and defects of the light emitting device OLED can be prevented.

[0155] The display module 200 can further include a fourth light blocking layer LBL4 disposed on the upper surface of the display panel 210 corresponding to the first area AR1 defined around the module hole MH. For example, the fourth light blocking layer LBL4 can be disposed on the upper surface of the encapsulation base EC. As an example, the fourth light blocking layer LBL4 can be a black matrix layer formed on the upper surface of the encapsulation base EC by a printing, deposition, or coating method. The fourth light blocking layer LBL4 can include an organic material or a metallic material having light blocking properties. The fourth light blocking layer LBL4 and the window black matrix WBM can have a circular ring shape, and the fourth light blocking layer LBL4 can have a size (e.g., a diameter in the first direction DR1 and / or the second direction DR2) smaller than that of the window black matrix WBM. For example, the width W7 of the fourth light blocking layer LBL4 in the second direction DR2 can be smaller than the width W8 of the window black matrix WBM in the second direction DR2.

[0156] In the present exemplary embodiment, the fourth light blocking layer LBL4 has a size smaller than that of the window black matrix WBM. However, exemplary embodiments of the present disclosure are not limited thereto. For example, the fourth light blocking layer LBL4 can have a size substantially the same as that of the window black matrix WBM.

[0157] As FIG. 14 shown in FIG. 1A, when the display module 200 includes the fourth light blocking layer LBL4, the light blocking layers LBL1 and LBL2 (refer to FIG. 8 ) can not be disposed on at least one of the upper and lower surfaces of the functional layer FL. However, in another exemplary embodiment, the electronic device can include both the fourth light blocking layer LBL4 and at least one of the light blocking layers LBL1 and LBL2.

[0158] The fourth light blocking layer LBL4 can be formed to overlap a peripheral area of the module hole MH, such as the first area AR1, to prevent light from leaking from the first area AR1.

[0159] FIG. 15 is a cross-sectional view showing a module area MA of an electronic device EA according to another exemplary embodiment of the present disclosure.

[0160] Referring to FIG. 15The display panel 210 can include a light-blocking sealing member BSM overlaid (e.g., overlaid in the third direction DR3) with a non-display area AR1 of the display panel 210. The light-blocking sealing member BSM can be a sealing member having light-blocking properties. The light-blocking sealing member BSM can include an adhesive member and an organic mixture containing a black dye or pigment.

[0161] In an exemplary embodiment, the light-blocking sealing member BSM can be overlaid with a non-active area NAA (refer to FIG. 3 ) of the display panel 210. The light-blocking sealing member BSM can extend from the upper surface of the base layer BL to the lower surface of the encapsulation substrate EC. However, in another exemplary embodiment, the light-blocking sealing member BSM can be disposed in the non-display area AR1 of the display panel 210, and FIG. 14 the sealing member SM shown in

[0162] As shown in FIG. 15 , the light-blocking layer LBL can be disposed on the upper surface of the functional layer FL. However, exemplary embodiments of the present disclosure are not limited thereto. For example, in an exemplary embodiment in which the light-blocking sealing member BSM is included in the display panel 210, the electronic device EA can include a first light-blocking layer LBL1 and a second light-blocking layer LBL2 disposed on the upper surface and the lower surface of the functional layer FL, respectively (refer to FIG. 8 ), and a light-blocking layer BIL sprayed on the upper surface of the display module 200 (refer to FIG. 9 and FIG. 10 ).

[0163] Accordingly, the light-blocking sealing member BSM can prevent leakage of light passing through the module hole MH from the first area AR1 defined around the module hole MH. In addition, since the leaked light is blocked again by the window black matrix WBM and the light-blocking layer LBL, a phenomenon in which the light leaked from the first area AR1 of the module hole MH is viewed from the outside by the user can be prevented.

[0164] Although exemplary embodiments of the present disclosure have been described, it is understood that the present disclosure should not be limited to these exemplary embodiments but various changes and modifications can be made by one ordinarily skilled in the art within the spirit and scope of the present disclosure as claimed. Therefore, the disclosed subject matter should not be limited to any single embodiment described herein.

Claims

1.An electronic device comprising: a display module having an active area in which at least one pixel is disposed and a non-active area adjacent to the active area in which no pixel is disposed, the active area including a module hole; a window disposed on the display module; a functional layer disposed between the display module and the window, the functional layer including a first opening defined therethrough; a first adhesive layer disposed between an upper surface of the functional layer and the window, the first adhesive layer including a second opening defined therethrough; a second adhesive layer disposed on a lower surface of the functional layer, the second adhesive layer including a third opening defined therethrough; a light-blocking layer disposed on at least one of the upper surface and the lower surface of the functional layer and positioned adjacent to the first opening; and an electronic module disposed in an opening formed by at least one of the module hole, the first opening, the second opening, and the third opening, wherein the window includes a window module hole superimposed with the module hole, wherein the first opening, the second opening, and the third opening are superimposed with the module hole, and wherein the electronic module is exposed to the outside through the window module hole. The light-blocking layer includes a first light-blocking layer disposed on the upper surface of the functional layer and positioned adjacent to the first opening. 2.The electronic device of claim 1, wherein, The light-blocking layer further includes a second light-blocking layer disposed on the lower surface of the functional layer and positioned adjacent to the first opening, wherein the lower surface of the functional layer faces the display module. 3.The electronic device of claim 2, wherein, 4.The electronic device of claim 1, further comprising a window black matrix disposed on a lower surface of the window and positioned to be superimposed with the light-blocking layer. The window black matrix has a width greater than a width of the light-blocking layer. 5.The electronic device of claim 4, wherein, The window black matrix is disposed around the window module hole. 6.The electronic device of claim 4, wherein, The active area includes: 7.The electronic device of claim 1, wherein a first area defined adjacent to the module hole; and a second area surrounding the first area, wherein the at least one pixel is not disposed in the first area, and the at least one pixel is disposed in the second area. The light-blocking layer is superimposed with the first area. 8.The electronic device of claim 7, wherein, Diameters of the first opening, the second opening, and the third opening are the same as a diameter of the module hole. 9.The electronic device of claim 1, wherein ​

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