A high performance gain chip packaging device

Abstract

This invention discloses a high-performance gain chip packaging device, including a heat sink mounting base. Both ends of the heat sink mounting base are fixed with limit frames, and the heat sink mounting base has a mounting slot for chip mounting. Each of the two limit frames is equipped with an auxiliary mounting device to facilitate the mounting of thermally conductive materials on the outside of the chip. This invention utilizes the auxiliary mounting device to effectively press the thermally conductive materials mounted on both sides of the chip, allowing the thermally conductive materials to better adhere to the outside of the chip, improving thermal conductivity. Simultaneously, it can also slightly adjust the angle of the transparent thermally conductive material adhered to the chip surface, avoiding deviations in the mounting angle.

Description

Technical Field

[0001] The invention relates to the technical field of gain chip packaging, in particular to a high-performance gain chip packaging device. Background Art

[0002] Vertical Cavity Surface Emitting Laser (VCSEL) chip, also known as VCSEL chip, is a laser emitting chip based on gallium arsenide semiconductor material. It has the advantages of small size, circular output spot, single longitudinal mode output, small threshold current, low price, easy integration into large area array, etc. It is widely used in optical communication, optical interconnection, optical storage and other fields.

[0003] When the existing gain chip is used, due to the use of optical pumping working mode, the gain chip will generate a lot of redundant heat during operation. This heat causes the temperature of the gain chip to rise, the gain spectrum to drift, and even seriously causes the device to fail to emit light normally. In order to solve this problem, thermal conductive material is usually attached to the outside of the chip for chip heat dissipation, and transparent thermal conductive material is attached to the front of the chip for heat dissipation. However, due to the angle deviation problem when the transparent thermal conductive material attached to the front is installed, the light output angle is affected. For this reason, we propose a high-performance gain chip packaging device. Summary of the invention

[0004] The object of the present invention is to provide a high-performance gain chip packaging device which facilitates the installation of heat-conducting materials during gain chip packaging, so as to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a high-performance gain chip packaging device, including a heat sink mounting seat, wherein limit frames are fixed at both ends of the heat sink mounting seat, and an installation groove for chip installation is opened in the heat sink mounting seat, and auxiliary installation devices for facilitating the installation of thermal conductive materials on the outside of the chip are installed in the two limit frames.

[0006] Preferably, the auxiliary installation device includes an adjusting rod, both ends of the adjusting rod are slidably sleeved with mounting plates, and the mounting plates are respectively fixed on both sides of the inner wall of the limit frame, a pressing plate is provided at the bottom of the adjusting rod, and two connecting arms are provided between the adjusting rod and the pressing plate, a U-shaped frame is provided at the top of the adjusting rod, and two adjusting arms are provided between the adjusting rod and the U-shaped frame. The auxiliary installation device effectively assists the installation of the thermal conductive material, thereby facilitating the fitting adjustment of the chip.

[0007] Preferably, the connecting arm includes a limiting ring, which is fixed to the outside of one end of the adjusting rod, and a limiting sleeve is fixed to the outside of the limiting ring, and a first connecting frame is fixed at the bottom of the limiting sleeve and the position of the limiting sleeve on the surface of the pressing plate, and a first connecting plate is provided between the two first connecting frames, and both ends of the first connecting plate are rotatably connected to the two first connecting frames through a rotating shaft, and the pressing plate is pressed through the connecting arm, thereby effectively pressing the installed thermal conductive material, so that it can better fit the chip under the condition of the flexibility of the material itself.

[0008] Preferably, the adjusting arm includes an adjusting cap, which is threadedly sleeved on the outside of one end of the adjusting rod, and a second connecting frame is fixed to the top of the adjusting cap and the bottom of the U-shaped frame, a second connecting plate is provided between the two second connecting frames, and both ends of the second connecting plate are rotatably connected to the two second connecting frames through a rotating shaft, and the distance between the U-shaped frame and the adjusting rod is adjusted by the adjusting arm, thereby meeting the adjustment of the angle of the transparent thermal conductive material.

[0009] Preferably, the adjusting rod comprises a moving rod and a moving sleeve, the outer ends of the moving rod and the moving sleeve are respectively fixed with two limit rings, and the outer sides of the moving rod and the moving sleeve are respectively threadedly connected with two adjusting caps, one end of the moving rod is slidably inserted into the moving sleeve, and the outer end of the moving rod is rotatably sleeved with a rotating sleeve through a bearing, a limiting groove is opened in the moving sleeve, and a limiting strip slidably connected to the limiting groove is fixed to the outer side of the moving rod, an adjusting spring is installed in the moving sleeve, and two ends of the adjusting spring are respectively fixed to the moving rod and the inner wall of the moving sleeve, the moving rod is moved in the moving sleeve by the adjusting spring in the adjusting sleeve, and the limiting strip is slidably connected with the limiting groove, so that when the moving sleeve rotates, the moving rod is driven to rotate.

[0010] Preferably, two limit blocks are fixed to the tail end of the movable sleeve and the outside of the rotating sleeve, and a connecting shell is fixed to the outside of the mounting plate. The connecting shell has two entrances that are compatible with the limit blocks. The outer ends of the movable sleeve and the movable rod are engraved with cross grooves, and the limit blocks are inserted into the connecting shell to limit the movable sleeve and the movable rod, so that they can be installed between the two mounting plates.

[0011] Preferably, a clamping assembly for installing transparent thermally conductive material is provided in the U-shaped frame, and the clamping assembly includes a clamping plate, two movable grooves are formed at both ends of the clamping plate, and sliding columns are fixed in the movable grooves, and movable blocks are slidably sleeved on the outer sides of the sliding columns, and a connecting strip is rotatably connected to the top of the movable block through a rotating shaft, and the other end of the connecting strip is rotatably connected to the top of the U-shaped frame through a rotating shaft, a clamping spring is sleeved on the outer side of the sliding column, and both ends of the clamping spring are respectively in contact with one side of the movable block and the inner wall of the movable groove, so that the clamping and positioning of the transparent thermally conductive material attached to the front side of the chip is achieved through the clamping assembly frame.

[0012] Preferably, the outer side of the clamping plate is chamfered, and inclined plates are fixed at both ends of the pressing plate, and the inclined plates facilitate the pouring of the heat-conducting material.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] The present invention utilizes an auxiliary installation device to effectively press the thermally conductive materials installed on both sides of the chip, so that the thermally conductive materials can better fit with the outside of the chip and improve the thermal conductivity. At the same time, the transparent thermally conductive material attached to the surface of the chip can be slightly adjusted in angle to avoid deviation in the installation angle. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the structure after the gain chip of the present invention is installed;

[0016] Figure 2 It is a schematic diagram of the overall appearance structure of the present invention;

[0017] Figure 3 This is a schematic diagram of the structure of the auxiliary installation device of the present invention;

[0018] Figure 4 It is a partial structural schematic diagram of the auxiliary installation device of the present invention;

[0019] Figure 5 It is a schematic diagram of a partial cross-sectional structure of a connecting arm of the present invention;

[0020] Figure 6 This is a front view of the auxiliary installation device of the present invention;

[0021] Figure 7 It is a schematic diagram of the partial structure of the clamping assembly of the present invention;

[0022] Figure 8 It is a schematic diagram of the structure of the adjusting rod of the present invention;

[0023] Fig. 9 It is a cross-sectional view of the connection between the limiting groove and the limiting strip of the present invention.

[0024] In the figure: 1-heat sink mounting seat; 2-limiting frame; 3-mounting groove; 4-auxiliary mounting device; 5-adjusting rod; 6-mounting plate; 7-pressing plate; 8-connecting arm; 9-U-shaped frame; 10-adjusting arm; 11-limiting ring; 12-limiting sleeve; 13-first connecting frame; 14-first connecting plate; 15-adjusting cap; 16-second connecting frame; 17-second connecting plate; 18-moving rod; 19-moving sleeve; 20-rotating sleeve; 21-limiting groove; 22-limiting strip; 23-adjusting spring; 24-limiting block; 25-connecting shell; 26-entrance; 27-cross groove; 28-clamping assembly; 29-clamping plate; 30-moving groove; 31-sliding column; 32-moving block; 33-connecting strip; 34-inclined plate; 35-clamping spring. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] See also Figure 1-9 A high-performance gain chip packaging device shown in the figure includes a heat sink mounting seat 1, and limiting frames 2 are fixed at both ends of the heat sink mounting seat 1, and a mounting groove 3 for chip mounting is opened in the heat sink mounting seat 1. The design of the limiting frame 2 and the mounting groove 3 facilitates the installation and limiting of the gain chip. The two limiting frames 2 are both equipped with auxiliary mounting devices 4 for facilitating the installation of thermal conductive materials on the outside of the chip.

[0027] The auxiliary installation device 4 includes an adjusting rod 5, both ends of which are slidably sleeved with mounting plates 6, and the mounting plates 6 are respectively fixed on both sides of the inner wall of the limiting frame 2, and a pressing plate 7 is provided at the bottom of the adjusting rod 5, wherein inclined plates 34 are fixed at both ends of the pressing plate 7, and the existence of the inclined plate 34 makes it more convenient to insert the thermal conductive material, and two connecting arms 8 are provided between the adjusting rod 5 and the pressing plate 7, and a U-shaped frame 9 is provided at the top of the adjusting rod 5, and two adjusting arms 10 are provided between the adjusting rod 5 and the U-shaped frame 9;

[0028] The connecting arm 8 includes a limiting ring 11, which is fixed to the outside of one end of the adjusting rod 5, and a limiting sleeve 12 is fixed to the outside of the limiting ring 11, and a first connecting frame 13 is fixed to the bottom of the limiting sleeve 12 and the position of the limiting sleeve 12 on the surface of the pressing plate 7, and a first connecting plate 14 is provided between the two first connecting frames 13, and both ends of the first connecting plate 14 are rotatably connected to the two first connecting frames 13 through a rotating shaft;

[0029] The adjusting arm 10 includes an adjusting cap 15, which is threadedly sleeved on the outer side of one end of the adjusting rod 5, and a second connecting frame 16 is fixed to the top of the adjusting cap 15 and the bottom of the U-shaped frame 9, and a second connecting plate 17 is provided between the two second connecting frames 16, and both ends of the second connecting plate 17 are rotatably connected to the two second connecting frames 16 through a rotating shaft, and the two adjusting caps 15 have opposite internal threads, so that they can move in opposite directions when rotating in the same direction;

[0030] The adjusting rod 5 includes a moving rod 18 and a moving sleeve 19, the outer ends of the moving rod 18 and the moving sleeve 19 are respectively fixed to two limiting rings 11, and the outer sides of the moving rod 18 and the moving sleeve 19 are respectively threadedly connected to two adjusting caps 15, one end of the moving rod 18 is slidably inserted into the moving sleeve 19, and the outer end of the moving rod 18 is connected to the rotating sleeve 20 through a bearing rotating sleeve 20, a limiting groove 21 is opened in the moving sleeve 19, and a limiting strip 22 slidably connected to the limiting groove 21 is fixed to the outer side of the moving rod 18, an adjusting spring 23 is installed in the moving sleeve 19, and the two ends of the adjusting spring 23 are respectively fixed to the inner walls of the moving rod 18 and the moving sleeve 19;

[0031] Installation principle of thermal conductive material on both sides of the auxiliary gain chip: insert the thermal conductive material into both sides of the chip. Since the existing thermal conductive material usually adopts thermal conductive and conductive pads, the material itself has flexibility. Therefore, after inserting, we press the movable rod 18 and the movable sleeve 19 to move them toward each other, so that the first connecting plate 14 in the connecting arm 8 rotates, and pushes the pressing plate 7 to move downward, so as to squeeze the thermal conductive material, so that it has a certain deformation and fits better with the chip.

[0032] In addition, two limit blocks 24 are fixed to the rear end of the movable sleeve 19 and the outer side of the rotating sleeve 20, and a connecting shell 25 is fixed to the outer side of the mounting plate 6. The connecting shell 25 has two inlets 26 adapted to the limit blocks 24. The outer ends of the movable sleeve 19 and the movable rod 18 are engraved with cross grooves 27. After the limit blocks 24 are inserted into the connecting shell 25, the personnel can rotate the movable sleeve 19 with the help of a screwdriver to adjust the adjustment arm 10.

[0033] A clamping assembly 28 for installing a transparent heat-conducting material is provided in the U-shaped frame 9, and the clamping assembly 28 includes a clamping plate 29, and two moving grooves 30 are provided at both ends of the clamping plate 29, and sliding columns 31 are fixed in the moving grooves 30, and moving blocks 32 are slidably sleeved on the outer sides of the sliding columns 31, and a connecting strip 33 is rotatably connected to the top of the moving block 32 through a rotating shaft, and the other end of the connecting strip 33 is rotatably connected to the top of the U-shaped frame 9 through a rotating shaft, and a clamping spring 35 is sleeved on the outer side of the sliding column 31, and the two ends of the clamping spring 35 are respectively in contact with one side of the moving block 32 and the inner wall of the moving groove 30, and the moving block 32 is pushed by the clamping spring 35 so that the clamping plate 29 can clamp the transparent heat-conducting material, wherein the outer side of the clamping plate 29 is chamfered to facilitate the insertion of the transparent heat-conducting material;

[0034] Angle adjustment and installation principle of transparent thermal conductive material on the front of auxiliary gain chip: When installing transparent thermal conductive material on the front of gain chip, first insert the two ends of transparent thermal conductive material into two U-shaped frames 9 respectively, and push the moving block 32 to move under the elasticity of the clamping spring 35, so as to clamp and fix the transparent thermal conductive material;

[0035] After pressing the moving rod 18 and the moving sleeve 19 to move them toward each other, the limiting block 24 is passed through the entrance 26 and clamped with the connecting shell 25, and then an external tool screwdriver is used to align the cross slot 27 at the rear end of the moving sleeve 19, and the moving sleeve 19 is twisted. When the limiting strip 22 and the limiting slot 21 cooperate with each other, the rotation of the moving sleeve 19 drives the moving rod 18 to rotate, so that the two adjusting caps 15 move on the moving rod 18 and the moving sleeve 19, so that the second connecting plate 17 can be effectively rotated and adjusted, which is convenient for fine-tuning the U-shaped frame 9, thereby realizing fine-tuning of the angle of the transparent thermal conductive material on the front side of the gain chip.

[0036] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0037] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-performance gain chip packaging device, comprising a heat sink mounting seat (1), wherein both ends of the heat sink mounting seat (1) are fixed with limit frames (2), and a mounting groove (3) for chip mounting is opened in the heat sink mounting seat (1), characterized in that: The two limiting frames (2) are both provided with auxiliary mounting devices (4) for facilitating the mounting of heat-conducting materials on the outer side of the chip. The auxiliary mounting devices (4) include an adjusting rod (5). Both ends of the adjusting rod (5) are slidably sleeved with mounting plates (6), and the mounting plates (6) are respectively fixed to the two sides of the inner wall of the limiting frame (2). A pressing plate (7) is provided at the bottom of the adjusting rod (5), and two connecting arms (8) are provided between the adjusting rod (5) and the pressing plate (7). A U-shaped frame (9) is provided at the top of the adjusting rod (5), and two adjusting arms (10) are provided between the adjusting rod (5) and the U-shaped frame (9). The U-shaped frame (9) is provided with a transparent heat-conducting material. A clamping assembly (28) is installed, the clamping assembly (28) comprising a clamping plate (29), two moving grooves (30) are formed at both ends of the clamping plate (29), and sliding columns (31) are fixed in the moving grooves (30), and moving blocks (32) are slidably sleeved on the outer sides of the sliding columns (31), and the top of the moving block (32) is rotatably connected to a connecting bar (33) via a rotating shaft, and the other end of the connecting bar (33) is rotatably connected to the top of the U-shaped frame (9) via a rotating shaft, and a clamping spring (35) is sleeved on the outer side of the sliding column (31), and the two ends of the clamping spring (35) are respectively in contact with one side of the moving block (32) and the inner wall of the moving groove (30).

2. A high performance gain chip packaging device according to claim 1, characterized in that: The connecting arm (8) comprises a limiting ring (11), the limiting ring (11) being fixed to the outside of one end of the adjusting rod (5), and a limiting sleeve (12) being fixed to the outside of the limiting ring (11), a first connecting frame (13) being fixed to the bottom of the limiting sleeve (12) and the surface of the pressing plate (7) at a position corresponding to the limiting sleeve (12), a first connecting plate (14) being provided between the two first connecting frames (13), and both ends of the first connecting plate (14) being rotatably connected to the two first connecting frames (13) via a rotating shaft.

3. A high performance gain chip packaging device according to claim 2, characterized in that: The adjusting arm (10) comprises an adjusting cap (15), the adjusting cap (15) being threadedly sleeved on the outer side of one end of the adjusting rod (5), and a second connecting frame (16) being fixed to the top of the adjusting cap (15) and the bottom of the U-shaped frame (9), a second connecting plate (17) being provided between the two second connecting frames (16), and both ends of the second connecting plate (17) being rotatably connected to the two second connecting frames (16) via a rotating shaft.

4. The high performance gain chip packaging device according to claim 3, characterized in that: The adjusting rod (5) comprises a moving rod (18) and a moving sleeve (19); the outer ends of the moving rod (18) and the moving sleeve (19) are respectively fixed to two limiting rings (11); and the outer sides of the moving rod (18) and the moving sleeve (19) are respectively threadedly connected to two adjusting caps (15); one end of the moving rod (18) is slidably inserted into the moving sleeve (19); and the outer end of the moving rod (18) is connected to the rotating sleeve (20) via a bearing rotating sleeve (20); a limiting groove (21) is provided in the moving sleeve (19); and a limiting strip (22) slidably connected to the limiting groove (21) is fixed to the outer side of the moving rod (18); an adjusting spring (23) is installed in the moving sleeve (19); and the two ends of the adjusting spring (23) are respectively fixed to the inner walls of the moving rod (18) and the moving sleeve (19).

5. The high performance gain chip packaging device according to claim 4, characterized in that: Two limit blocks (24) are fixed to the rear end of the movable sleeve (19) and the outer side of the rotating sleeve (20), and a connecting shell (25) is fixed to the outer side of the mounting plate (6). The connecting shell (25) has two inlets (26) adapted to the limit blocks (24), and the outer ends of the movable sleeve (19) and the movable rod (18) are engraved with cross grooves (27).

6. The high performance gain chip packaging device according to claim 5, characterized in that: The outer side of the clamping plate (29) is chamfered, and inclined plates (34) are fixed to both ends of the pressing plate (7).

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