A semiconductor laser repair heating device and its usage method

Abstract

The present invention discloses a semiconductor laser repair heating device and a method for using the same, which includes a base. A laser positioning mechanism and a laser heating mechanism are provided on the base, and the laser positioning mechanism is slidably connected to the base; the upper part of the laser positioning mechanism is slidably arranged in the laser heating mechanism, and the upper part of the laser heating mechanism is matched with the upper part of the laser positioning mechanism; an exhaust isolation member for isolating the semiconductor laser from air is arranged in the laser heating mechanism. The present invention has the characteristics of convenient operation, easy implementation and high efficiency. While reducing the labor cost, it improves the production efficiency, is conducive to large-scale production expansion, can significantly improve the economic benefits, and is suitable for industrial popularization and use.

Description

Technical Field

[0001] The present invention belongs to the technical field of optical communication, and particularly relates to a semiconductor laser repair heating device and a using method thereof. Background Art

[0002] In the field of optical communication, the repair of semiconductor lasers is a very important link in the processing of semiconductor laser products. It forms a closed loop in the production process of products, plays a great role in saving production costs and improving products, so it is very important to improve the repair efficiency. In addition, during the repair of semiconductor lasers, it is necessary to disassemble and repair or replace the components soldered on the semiconductor lasers. During the disassembly process, first, the solder needs to be heated. The solder is directly exposed to the air, which is extremely easy to cause oxidation of the solder. After oxidation, it is easy to cause the components to be poorly soldered when welding the components, and even affect the optical performance of the components. Summary of the Invention

[0003] Aiming at the problems of low repair efficiency of semiconductor lasers and oxidation of solder during the repair process, the present invention proposes a semiconductor laser repair heating device and a using method thereof, which solves the problem of low repair efficiency of existing semiconductor lasers.

[0004] In order to solve the above technical problems, the technical solutions adopted by the present invention are as follows:

[0005] A semiconductor laser repair heating device includes a base. A laser positioning mechanism and a laser heating mechanism are provided on the base, and the laser positioning mechanism is slidably connected to the base; the upper part of the laser positioning mechanism is slidably arranged in the laser heating mechanism, and the upper part of the laser heating mechanism is matched with the upper part of the laser positioning mechanism; an exhaust isolation member for isolating the semiconductor laser from the air is provided in the laser heating mechanism.

[0006] The laser positioning mechanism includes a push block. The push block is slidably arranged on the laser heating mechanism. The lower part of the push block is connected to a reset mechanism through a connecting member; the reset mechanism is slidably arranged in the base, and a push rod is provided on the connecting member.

[0007] The reset mechanism includes a spring and a guide rod. A chute is provided in the middle of the base. The guide rod is arranged in the chute. A slider is sleeved on the guide rod. The upper part of the slider is fixedly connected to the connecting member; the spring is sleeved on the guide rod. One end of the spring is fixedly connected to the base, and the other end of the spring is fixedly connected to the slider.

[0008] The laser heating mechanism includes a heating base and a support platform. Both the heating base and the support platform are heat-conducting platforms made of heat-conducting materials, and a heating rod is provided inside the heating base. The support platform is fixedly arranged on the heating base. A stop block is provided on one side of the support platform, a first movable groove is provided on the other side of the support platform, and a plurality of air outlet holes are provided on the support platform. The heating base is arranged on the base, a through hole is provided in the middle of the heating base, and a second movable groove is provided on one side of the through hole. The first movable groove and the second movable groove correspond to each other. The laser positioning mechanism is arranged in the first movable groove and the second movable groove, and the stop block is matched with the upper part of the laser positioning mechanism. The exhaust isolation member is arranged in the through hole, and the exhaust isolation member is matched with the air outlet holes.

[0009] The exhaust isolation member includes a nitrogen inlet pipe. The inlet end of the nitrogen inlet pipe is connected to a nitrogen source through a first valve. The outlet end of the nitrogen inlet pipe is arranged in the through hole, and the outlet end is matched with the air outlet holes.

[0010] A universal adjustment frame is further provided on the base. A nitrogen gas jet head is provided on the universal adjustment frame. The nitrogen gas jet head corresponds to the semiconductor laser, and the gas jetted by the nitrogen gas jet head isolates the semiconductor laser from the air.

[0011] The universal adjustment frame includes at least one group of universal adjustment seats. One side of the universal adjustment seat is connected to the base through a first universal connecting rod, and the other side of the universal adjustment seat is connected to the nitrogen gas jet head through a universal jetting rod.

[0012] The number of groups of the universal adjustment seats is two. Each group of universal adjustment seats includes at least two universal balls. Universal pressing blocks are symmetrically provided on both sides of the two universal balls. Universal holes are provided on both universal pressing blocks. The number of universal holes on each universal pressing block is the same as the number of universal balls. The two universal balls are respectively arranged in the corresponding universal holes of the two universal pressing blocks, and the middle parts of the two universal pressing blocks are connected through an adjusting member. One universal ball of the first group of universal adjustment seats is connected to the first universal connecting rod, and the other universal ball is connected to one universal ball of the second group of universal adjustment seats through a second universal connecting rod. The other universal ball of the second group of universal adjustment seats is connected to a third universal connecting rod, and the third universal connecting rod is connected to the universal jetting rod.

[0013] A sleeve is provided at the lower part of the base. An installation groove is provided in the middle of the sleeve. The base, the laser positioning mechanism and the laser heating mechanism are all arranged in the installation groove. The height of the side wall of the installation groove is not less than the height of the laser heating mechanism, and the base is fixedly connected to the sleeve.

[0014] According to the usage method of the semiconductor laser repair heating device described above, it includes the following steps:

[0015] S1. Push the push rod of the laser positioning mechanism to move the push block of the laser positioning mechanism away from the stop block of the laser heating mechanism, and place the semiconductor laser to be repaired between the push block and the stop block;

[0016] S2. Release the push rod to move the push block towards the stop block until the push block and the stop block clamp the semiconductor laser;

[0017] S3. Adjust the universal adjusting frame so that the nitrogen gas jet head of the universal adjusting frame is directly facing the semiconductor laser;

[0018] S4. Start the nitrogen gas jet head and the exhaust isolation part so that the nitrogen gas ejected from the nitrogen gas inlet pipe of the nitrogen gas jet head and the exhaust isolation part surrounds the semiconductor laser;

[0019] S5. Start the heating rod of the laser heating mechanism to heat the heating seat and the support platform of the laser heating mechanism. After the solder of the semiconductor laser melts, start to repair the semiconductor laser;

[0020] S6. After the semiconductor laser is repaired, turn off the heating rod to stop heating the heating seat and the support platform. After the solder of the semiconductor laser solidifies, push the push rod to remove the semiconductor laser.

[0021] Advantages of the present invention:

[0022] The laser positioning mechanism and the laser heating mechanism cooperate to fix the semiconductor laser to be repaired. The heating seat is provided with a heating rod, and the heating seat and the support platform can conduct heat to the semiconductor laser, thereby melting the solder of the semiconductor laser and facilitating welding repair; the exhaust isolation part and the universal adjusting frame are combined to eject nitrogen gas above and around the semiconductor laser, so that the semiconductor laser is in a completely nitrogen environment to prevent the solder from oxidizing; the present invention has the characteristics of convenient operation, easy implementation and high efficiency, reduces the labor cost while improving the production efficiency, is conducive to large-scale production expansion, can significantly improve the economic benefits, and is suitable for industrial popularization and use. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0024] Figure 1 It is an exploded view of the present invention.

[0025] Figure 2 It is a structural diagram of the present invention.

[0026] Figure 3 This is a connection schematic diagram of the base, laser positioning mechanism, laser heating mechanism, and universal adjustment bracket of the present invention.

[0027] Figure 4 This is a structural schematic diagram of the universal adjustment bracket.

[0028] Figure 5 This is a structural schematic diagram of the base.

[0029] Figure 6 This is a structural schematic diagram of the support platform.

[0030] In the figure, 1 is a sleeve, 2 is a base, 2-1 is a first threaded hole, 2-2 is a second threaded hole, 2-3 is a column fixing hole, 2-4 is a chute, 2-5 is a guide rod insertion hole, 3 is a hexagon bolt, 4 is a tightening bolt, 5 is a slider, 6 is a guide rod, 7 is a push rod, 8 is a nitrogen inlet pipe, 9 is a column, 10 is a heating rod, 11 is a heating base, 11-1 is a second movable groove, 11-2 is a through hole, 12 is a support platform, 12-1 is an air outlet hole, 12-2 is a first movable groove, 12-3 is a stop block fixing hole, 13 is a stop block, 14 is a connecting bolt, 15 is a push block, 16 is a support block, 17 is a connecting block, 18 is a fixing bolt, 19 is a universal adjustment bracket, 19-1 is a first universal connecting rod, 19-2 is a universal pressing block, 19-3 is a universal ball, 19-4 is a universal hole, 19-5 is a second universal connecting rod, 19-6 is a third universal connecting rod, 19-7 is a universal air jet rod, 19-8 is a nitrogen air jet head, 20 is a mounting groove, and 21 is a groove. Detailed implementation manners

[0031] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0032] Embodiment 1: A semiconductor laser repair heating device, as Figure 1 shown, includes a base 2. A chute 2-4 is provided in the middle of the base 2. A laser positioning mechanism is slidably provided in the chute 2-4, and the upper part of the laser positioning mechanism is arranged in the laser heating mechanism; as Figure 5As shown, column fixing holes 2-3 are symmetrically arranged on the left and right sides of the sliding groove 2-4, and columns 9 are fixedly arranged in the two column fixing holes 2-3; the laser heating mechanism is fixedly arranged on the base 2 through the two columns 9, and the upper part of the laser heating mechanism is matched with the upper part of the laser positioning mechanism. When the laser positioning mechanism slides along the sliding groove 2-4, the upper part of the laser positioning mechanism slides synchronously along the upper surface of the laser heating mechanism to fix the semiconductor laser to be repaired placed on the laser heating mechanism; an exhaust isolation member that isolates the semiconductor laser from the air is arranged in the laser heating mechanism to prevent the solder from oxidizing during the repair of the semiconductor laser.

[0033] The laser positioning mechanism includes a push block 15, the push block 15 is slidably arranged on the laser heating mechanism, and the lower part of the push block 15 is connected to the reset mechanism through a connecting member; the reset mechanism is slidably arranged in the sliding groove 2-4, and a push rod 7 is arranged on the connecting member. Pushing the push rod 7 can drive the movement of the reset mechanism, and the movement of the reset mechanism can drive the synchronous movement of the connecting member and the push block 15. After the semiconductor laser is placed, slowly release the push rod 7, and the push block 15 moves back under the driving action of the reset mechanism, thereby realizing the fixation of the semiconductor laser.

[0034] As Figure 3 shown, the reset mechanism includes a spring and a guide rod 6. The guide rod 6 is fixedly arranged in the sliding groove 2-4. A guide rod insertion hole 2-5 is arranged on one side of the sliding groove 2-4 to facilitate the insertion of the guide rod 6. After the guide rod 6 is inserted, the guide rod 6 is fixed; the guide rod 6 is provided with a slider 5, and the upper part of the slider 5 is fixedly connected to the connecting member; the spring is sleeved on the guide rod 6, one end of the spring is fixedly connected to the side wall of the sliding groove 2-4, and the other end of the spring is fixedly connected to the slider 5. As Figure 3 shown, the spring can be arranged on both the left and right sides of the slider 5. When the spring is arranged on the left side of the slider 5, pushing the push rod 7 compresses the spring. When the spring is arranged on the right side of the slider 5, pushing the push rod 7 stretches the spring; after releasing the push rod 7, the spring returns to its normal state and drives the synchronous and same-direction movement of the slider, the connecting member, and the push block. The connecting member includes a support block 16 and a connecting block 17. The upper part of the support block 16 is fixedly connected to the lower part of the push block 15. The lower part of the support block 16 is fixedly connected to the connecting block 17 through a fixing bolt 18, and the connecting block 17 is fixedly connected to the slider 5 through a connecting bolt 14; the push rod 7 is fixedly arranged on the connecting block 17. Pushing the push rod 7 can drive the movement of the slider 5, and then apply a thrust to the spring to cause the spring to deform.

[0035] As Figure 2As shown, the laser heating mechanism includes a heating base 11 and a support platform 12. Both the heating base 11 and the support platform 12 are heat-conducting platforms made of heat-conducting materials. In this embodiment, the heat-conducting material is Kovar4j29 material. A heating rod 10 is provided in the heating base 11. The heating rod 10 is connected to a power source. After the heating rod 10 is heated, heat is transferred through the heating base 11 and the support platform 12, thereby heating the semiconductor laser placed on the support platform 12 to melt the solder, facilitating the repair or replacement of components. The support platform 12 is fixedly arranged on the heating base 11. As Figure 6 shown, at least four block fixing holes 12-3 are provided on one side of the support platform 12, and a first movable groove 12-2 is provided on the other side of the support platform 12. Two block fixing holes 12-3 are symmetrically arranged in a group with respect to the extension line of the center line of the first movable groove 12-2. Fastening bolts are provided in the block fixing holes 12-3. Blocks 13 are provided at the lower parts of the fastening bolts. Moving grooves are symmetrically provided on the blocks 13. The moving grooves are correspondingly arranged with the block fixing holes 12-3 and are parallel to the first movable groove 12-2. By adjusting the fastening bolts, the positions of the blocks 13 on the support platform 12 can be adjusted, thereby fixing semiconductor lasers of different sizes. The heating base 11 is fixedly arranged on two columns 9. A second movable groove 11-1 is provided on one side of the heating base 11, and the first movable groove 12-2 and the second movable groove 11-1 correspond to each other, facilitating the sliding of the support block 16 in the first movable groove 12-2 and the second movable groove 11-1. When the support block 16 slides, the push block 15 slides synchronously along the upper surface of the support platform 12. The blocks 13 cooperate with the push block 15 to fix the semiconductor laser placed between the blocks 13 and the push block 15. A plurality of air outlet holes 12-1 are also provided on the support platform 12. The air outlet holes 12-1 are arranged around the blocks 13 and the push block 15. A through hole 11-2 is provided in the middle of the heating base 11. An exhaust isolation member is arranged in the through hole 11-2, and the exhaust isolation member cooperates with the air outlet holes 12-1 so that the gas discharged from the exhaust isolation member comes out from the air outlet holes 12-1 and surrounds the semiconductor laser.

[0036] The exhaust isolation member includes a nitrogen inlet pipe 8. The inlet end of the nitrogen inlet pipe 8 is connected to a nitrogen source through a first valve. The outlet end of the nitrogen inlet pipe 8 is arranged in the through hole 11-2 and the outlet end cooperates with the air outlet holes 12-1. When the first valve is opened, nitrogen is discharged through the nitrogen inlet pipe 8. Then the nitrogen is discharged from the air outlet holes 12-1 and surrounds the semiconductor laser to protect the semiconductor laser and prevent the solder from oxidizing during the welding process.

[0037] The base 2 is further provided with a universal adjusting frame 19. The lower part of the universal adjusting frame 19 is fixedly connected to the base 2 through a second threaded hole 2-2 on the side wall of the base 2. The upper part of the universal adjusting frame 19 is provided with a nitrogen gas jet head 19-8. The nitrogen gas jet head 19-8 corresponds to the semiconductor laser, and the nitrogen gas jet head 19-8 is connected to a nitrogen gas source through a second valve to spray nitrogen gas on the semiconductor laser to isolate the semiconductor laser from the air. By rotating the universal adjusting frame, the nitrogen gas jet head 19-8 can be adjusted so that the nitrogen gas jet head 19-8 is always located directly above the semiconductor laser. The nitrogen gas jet head 19-8 and the nitrogen gas inlet pipe 8 work simultaneously, and the gases sprayed by both can fill the surroundings and above of the semiconductor laser with nitrogen gas when diffusing, thereby isolating the semiconductor laser in all directions.

[0038] The universal adjusting frame 19 includes at least one group of universal adjusting seats. One side of the universal adjusting seat is fixedly connected to the base 2 through a first universal connecting rod 19-1, and the other side of the universal adjusting seat is connected to the nitrogen gas jet head 19-8 through a universal jetting rod 19-7. In this embodiment, the number of groups of the universal adjusting seats is two. One side of the first group of universal adjusting seats is threadedly connected to the second threaded hole 2-2 through the first universal connecting rod 19-1. The other side of the first group of universal adjusting seats is connected to one side of the second group of universal adjusting seats through a second universal connecting rod 19-5. The other side of the second group of universal adjusting seats is connected to the universal jetting rod 19-7 through a third universal connecting rod 19-6.

[0039] Such as Figure 4As shown, each set of universal adjusting seats includes at least two universal balls 19-3. In this embodiment, the number of universal balls 19-3 is two. Universal pressing blocks 19-2 are symmetrically arranged on both sides of the two universal balls. Universal holes 19-4 are provided on both universal pressing blocks 19-2. The number of universal holes 19-4 on each universal pressing block 19-2 is the same as the number of universal balls 19-3. The two universal balls 19-3 are respectively arranged in the corresponding universal holes 19-4 of the two universal pressing blocks 19-2. The middle parts of the two universal pressing blocks 19-2 are connected by an adjusting member. By rotating the adjusting member, the distance between the two universal pressing blocks 19-2 can be adjusted, thereby adjusting the friction force between the universal ball 19-3 and the universal pressing block 19-2 to adjust and fix the universal adjusting frame 19; one universal ball 19-3 of the first set of universal adjusting seats is connected to the first universal connecting rod 19-1, and the other universal ball 19-3 is connected to one universal ball 19-3 of the second set of universal adjusting seats through the second universal connecting rod 19-5; the other universal ball 19-3 of the second set of universal adjusting seats is connected to the third universal connecting rod 19-6. By rotating the universal adjusting seat or the universal connecting rod, the distance between the nitrogen gas jet head 19-8 and the semiconductor laser can be adjusted. In addition, the number of universal balls can also be set to three, four, etc. The central points of all universal balls are arranged on the same straight line, and only the two outermost universal balls are used to connect to other structures, and the middle universal balls are only used to connect the two universal pressing blocks.

[0040] A sleeve 1 is provided at the lower part of the base 2. An installation groove 20 is provided in the middle of the sleeve 1. The base 2, the laser positioning mechanism and the laser heating mechanism are all arranged in the installation groove 20. In this embodiment, the base 2 is a circular base. Three first threaded holes 2-1 are evenly provided on the side wall of the circular base, and the angle between two adjacent first threaded holes 2-1 is 120 degrees; a stud is provided in each first threaded hole 2-1. A hexagon bolt 3 and a tightening bolt 4 are provided on the stud. The hexagon bolt 3 is located in the installation groove 20, and the tightening bolt 4 is located outside the installation groove 20. The base 2 is fixedly connected to the sleeve 1 through the tightening bolt 4 and the stud. The height of the side wall of the installation groove 20 is not less than the height of the support platform 12. By providing the sleeve, the heating seat and the support platform can be surrounded to avoid scalding. In addition, a groove 21 is also provided on the side wall of the installation groove. The nitrogen gas inlet pipe and the push rod are both arranged in the groove 21 to avoid interference.

[0041] In this embodiment, the number of heating rods is two, symmetrically arranged on both sides of the through hole. The power of each heating rod is 80W, and the power of 2 is 160W. The highest heating temperature that can be achieved is 400 degrees Celsius, and the working temperature is 300 degrees Celsius.

[0042] Embodiment 2: A method for using a semiconductor laser repair heating device includes the following steps:

[0043] S1. Push the push rod 7 to move the push block 15 away from the stop block 13, and place the semiconductor laser to be repaired between the push block 15 and the stop block 13;

[0044] S2. Slowly release the push rod 7. The push block 15, the support block 16, the connecting block 17 and the slider 5 move towards the stop block 13 under the reset action of the spring until the push block 15 and the stop block 13 clamp the semiconductor laser;

[0045] S3. Adjust the universal adjustment frame 19 to make the nitrogen gas jet head 19-8 of the universal adjustment frame 19 face the semiconductor laser;

[0046] S4. Open the first valve and the second valve to make the nitrogen gas inlet pipe 8 and the nitrogen gas jet head 19-8 eject nitrogen gas to surround the semiconductor laser;

[0047] S5. Start the heating rod 10 to heat the heating base 11 and the support platform 12. After the solder of the semiconductor laser melts, start to repair the semiconductor laser;

[0048] S6. After the semiconductor laser is repaired, turn off the heating rod 10 to stop heating the heating base 11 and the support platform 12. After the solder of the semiconductor laser solidifies, push the push rod 7 to remove the semiconductor laser.

[0049] The structure of this embodiment is the same as that of Embodiment 1.

[0050] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A semiconductor laser repair heating device, characterized in that, it includes a base (2), on which a laser positioning mechanism and a laser heating mechanism are provided, and the laser positioning mechanism is slidably connected to the base (2); the upper part of the laser positioning mechanism is slidably arranged in the laser heating mechanism, and the upper part of the laser heating mechanism cooperates with the upper part of the laser positioning mechanism; an exhaust isolation member for isolating the semiconductor laser from the air is provided in the laser heating mechanism; the laser heating mechanism includes a heating base (11) and a support platform (12), both the heating base (11) and the support platform (12) are heat-conducting platforms made of heat-conducting materials, and a heating rod (10) is provided in the heating base (11); the support platform (12) is fixedly arranged on the heating base (11), a stop block (13) is provided on one side of the support platform (12), a first movable groove (12-2) is provided on the other side of the support platform (12), and a plurality of air outlet holes (12-1) are provided on the support platform (12); the heating base (11) is arranged on the base (2), a through hole (11-2) is provided in the middle of the heating base (11), and a second movable groove (11-1) is provided on one side of the through hole (11-2); the first movable groove (12-2) corresponds to the second movable groove (11-1), the laser positioning mechanism is arranged in the first movable groove (12-2) and the second movable groove (11-1), and the stop block (13) cooperates with the upper part of the laser positioning mechanism; the exhaust isolation member is arranged in the through hole (11-2), and the exhaust isolation member cooperates with the air outlet holes (12-1); the laser positioning mechanism includes a push block (15), the push block (15) is slidably arranged on the laser heating mechanism, and the lower part of the push block (15) is connected to a reset mechanism through a connecting member; the reset mechanism is slidably arranged in the base (2), and a push rod (7) is provided on the connecting member; a universal adjusting frame (19) is further provided on the base (2), and a nitrogen gas jet head (19-8) is provided on the universal adjusting frame (19), and the nitrogen gas jet head (19-8) corresponds to the semiconductor laser.

2. The semiconductor laser repair heating device according to claim 1, characterized in that, the reset mechanism includes a spring and a guide rod (6), a chute (2-4) is provided in the middle of the base (2), the guide rod (6) is arranged in the chute (2-4), a slider (5) is sleeved on the guide rod (6), and the upper part of the slider (5) is fixedly connected to the connecting member; the spring is sleeved on the guide rod (6), one end of the spring is fixedly connected to the base (2), and the other end of the spring is fixedly connected to the slider (5).

3. The semiconductor laser repair heating device according to claim 1, characterized in that, the exhaust isolation member includes a nitrogen gas inlet pipe (8), the inlet end of the nitrogen gas inlet pipe (8) is connected to a nitrogen gas source through a first valve, the outlet end of the nitrogen gas inlet pipe (8) is arranged in the through hole (11-2), and the outlet end cooperates with the air outlet holes (12-1).

4. The semiconductor laser repair heating device according to claim 1, characterized in that, The universal adjusting frame (19) includes at least one set of universal adjusting seats. One side of the universal adjusting seat is connected to the base (2) through a first universal connecting rod (19-1), and the other side of the universal adjusting seat is connected to a nitrogen gas jet head (19-8) through a universal gas jet rod (19-7).

5. The semiconductor laser repair heating device according to claim 4, characterized in that the number of sets of the universal adjusting seats is two, and each set of universal adjusting seats includes at least two universal balls (19-3). Universal pressing blocks (19-2) are symmetrically arranged on both sides of the two universal balls (19-3). Universal holes (19-4) are provided on both of the two universal pressing blocks (19-2). The number of the universal holes (19-4) on each universal pressing block (19-2) is the same as the number of the universal balls (19-3). The two universal balls (19-3) are respectively arranged in the corresponding universal holes (19-4) of the two universal pressing blocks (19-2), and the middle parts of the two universal pressing blocks (19-2) are connected through an adjusting member; One universal ball (19-3) of the first set of universal adjusting seats is connected to the first universal connecting rod (19-1), and the other universal ball (19-3) is connected to one universal ball (19-3) of the second set of universal adjusting seats through a second universal connecting rod (19-5); The other universal ball (19-3) of the second set of universal adjusting seats is connected to a third universal connecting rod (19-6), and the third universal connecting rod (19-6) is connected to the universal gas jet rod (19-7).

6. The semiconductor laser repair heating device according to claim 1, characterized in that a sleeve (1) is provided at the lower part of the base (2). An installation groove (20) is provided in the middle of the sleeve (1). The base (2), the laser positioning mechanism and the laser heating mechanism are all arranged in the installation groove (20). The height of the side wall of the installation groove (20) is not less than the height of the laser heating mechanism, and the base (2) is fixedly connected to the sleeve (1).

7. The using method of the semiconductor laser repair heating device according to claim 4 or 5 or 6, characterized in that it includes the following steps: S1, Push the push rod (7) of the laser positioning mechanism to make the push block (15) of the laser positioning mechanism move away from the stop block (13) of the laser heating mechanism, and place the semiconductor laser to be repaired between the push block (15) and the stop block (13); S2, Release the push rod (7) to make the push block (15) move towards the stop block (13) until the push block (15) and the stop block (13) clamp the semiconductor laser; S3, Adjust the universal adjusting frame (19) to make the nitrogen gas jet head (19-8) of the universal adjusting frame (19) face the semiconductor laser; S4, Start the nitrogen gas jet head (19-8) and the exhaust isolation member to make the nitrogen gas ejected from the nitrogen gas inlet pipe (8) of the nitrogen gas jet head (19-8) and the exhaust isolation member surround the semiconductor laser; S5. Start heating the heating base (11) and the support platform (12) of the laser heating mechanism with the heating rod (10) of the laser heating mechanism. After the solder of the semiconductor laser melts, start repairing the semiconductor laser; S6. After the semiconductor laser is repaired, turn off the heating rod (10) to stop heating the heating base (11) and the support platform (12). After the solder of the semiconductor laser solidifies, push the push rod (7) to remove the semiconductor laser.

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