Maintenance tunnels used on capital equipment in semiconductor fabrication and R&D manufacturing facilities

Abstract

The present invention relates to an inspection tunnel used on capital equipment of semiconductor preparation and R&D manufacturing facilities, and provides a system for processing substrates, the system comprising: a wafer conveying assembly configured to convey wafers to and from one or more processing modules, the wafer conveying assembly having at least one wafer conveying module, wherein a lateral side of the at least one wafer conveying module is configured to be coupled to the one or more processing modules; an inspection layer is defined below the wafer conveying assembly, the inspection layer is defined at a height lower than that of a manufacturing facility layer, and the system is placed in the manufacturing facility layer.

Description

[0001] This application is a divisional application of the invention patent application with application number 201610860001.2, application date September 28, 2016, applicant is Rum Research Company, and invention name is "Maintenance tunnel used on capital equipment of semiconductor preparation and R&D manufacturing facilities". Technical Field

[0002] Embodiments of the present invention relate to semiconductor wafer processing equipment and, more particularly, to multi-chamber processing tool systems, apparatus, and related methods. Background Art

[0003] In semiconductor manufacturing facilities (commonly referred to as "fabs"), space is limited and expensive, and cannot be easily increased. Therefore, in order to achieve the highest production efficiency, efficient space utilization is desirable. However, it is also necessary to provide adequate access to the equipment in the fab for maintenance and repair.

[0004] The embodiments of the present invention are produced in this context. Summary of the invention

[0005] Embodiments of the present disclosure provide methods, apparatus, and systems associated with a compact cluster tool architecture. The architecture includes an access tunnel defined below a wafer conveyor assembly, the access tunnel utilizing ground floor space below the fabrication facility floor height. Additionally, the wafer conveyor assembly may include a number of buffers positioned to achieve a compact footprint and provide flexibility for configuring wafer movement through the wafer conveyor assembly.

[0006] According to an embodiment of the present disclosure, a cluster tool system for processing wafers is provided, which includes: a wafer conveying assembly extending along a longitudinal axis of the cluster tool system, the wafer conveying assembly having a front end oriented toward an equipment front end module (EFEM), the wafer conveying assembly having a rear end opposite to the front end; at least two processing modules coupled to the wafer conveying assembly along a first lateral side of the wafer conveying assembly, the wafer conveying assembly being configured to convey wafers to and from the at least two processing modules coupled along the first lateral side; at least one wafer conveying assembly coupled to the wafer conveying assembly along a second lateral side of the wafer conveying assembly two processing modules, the wafer conveying assembly being configured to convey wafers to and from the at least two processing modules coupled along the second lateral side; an inspection tunnel defined below the wafer conveying assembly, the inspection tunnel extending from the front end to the rear end of the wafer conveying assembly along the longitudinal axis of the cluster tool system, the inspection tunnel having a vertical dimension defined between a bottom surface of the wafer conveying assembly and an inspection layer positioned below the wafer conveying assembly, the inspection layer being defined at a height lower than the height of the manufacturing facility layer in which the cluster tool system is placed.

[0007] In some embodiments, the wafer conveying assembly includes at least two wafer conveying modules coupled to each other along the longitudinal axis, wherein each of the wafer conveying modules is coupled to one of the processing modules coupled along the first lateral side of the wafer conveying assembly, and wherein each of the wafer conveying modules is coupled to one of the processing modules coupled along the second lateral side of the wafer conveying assembly.

[0008] In some embodiments, the cluster tool system further includes: at least two processing module frames, which are configured to support the at least two processing modules coupled along the first lateral side of the wafer conveying assembly and are further configured to be placed on the manufacturing facility layer; at least two processing module frames, which are configured to support the at least two processing modules coupled along the second lateral side of the wafer conveying assembly and are further configured to be placed on the manufacturing facility layer.

[0009] In some embodiments, a stair arrangement is defined at a rear end of the maintenance tunnel, the rear end of the maintenance tunnel being defined substantially below the rear end of the wafer conveying assembly, the stair arrangement being configured to define a path from the manufacturing facility level down to the maintenance level.

[0010] In some embodiments, the height of the access level is approximately 1 foot (30.5 centimeters) to 2 feet (61 centimeters) below the height of the fab level.

[0011] In some embodiments, the front side of the wafer transport assembly is configured to connect to a load lock that controls access to and from the EFEM, wherein a front end of the access tunnel extends substantially to the EFEM.

[0012] In some embodiments, the access tunnel has a height of approximately 6 feet (183 centimeters) to 8 feet (242 centimeters).

[0013] In some embodiments, a first lateral side of the access tunnel provides access to the process modules coupled along the first lateral side of the wafer conveyor assembly, and a second lateral side of the access tunnel provides access to the process modules coupled along the second lateral side of the wafer conveyor assembly.

[0014] In some embodiments, the first lateral side of the maintenance tunnel provides access to one or more gas boxes of the processing module defined for coupling along the first lateral side of the wafer conveying assembly, and the second lateral side of the maintenance tunnel provides access to one or more gas boxes of the processing module defined for coupling along the second lateral side of the wafer conveying assembly.

[0015] In some embodiments, the maintenance tunnel complies with the SEMI E72 standard.

[0016] According to an embodiment of the present disclosure, a cluster tool system for processing wafers is provided, which includes: a wafer conveying assembly extending along the longitudinal axis of the cluster tool system, the wafer conveying assembly having a front end oriented toward an equipment front end module (EFEM), and the wafer conveying assembly having a rear end opposite to the front end; at least two processing modules coupled to the wafer conveying assembly along a first lateral side of the wafer conveying assembly, the wafer conveying assembly being configured to convey wafers to and from the at least two processing modules coupled along the first lateral side; at least two processing modules coupled to the wafer conveying assembly along a second lateral side of the wafer conveying assembly, the wafer conveying assembly being configured to convey wafers to and from the at least two processing modules coupled along the second lateral side; an inspection tunnel defined below the wafer conveying assembly, the inspection tunnel extending from the front end to the rear end of the wafer conveying assembly along the longitudinal axis of the cluster tool system, the inspection tunnel having a vertical dimension, the vertical dimension A straight dimension is defined between a bottom surface of the wafer conveying assembly and an inspection layer positioned below the wafer conveying assembly, the inspection layer being defined at a height lower than a height of a manufacturing facility layer in which the cluster tool system is placed, wherein the height of the inspection layer is approximately 1 foot (30 cm) to 2 feet (60 cm) below the height of the manufacturing facility layer; at least two processing module frames, which are configured to support the at least two processing modules coupled along the first lateral side of the wafer conveying assembly and are further configured to rest on the manufacturing facility layer; at least two processing module frames, which are configured to support the at least two processing modules coupled along the second lateral side of the wafer conveying assembly and are further configured to rest on the manufacturing facility layer; wherein the height of the inspection tunnel is defined by the height of the inspection layer and the height of the processing module frames, and the height of the inspection tunnel is approximately 6 feet (180 cm) to 8 feet (240 cm).

[0017] In some embodiments, the wafer conveying assembly includes at least two wafer conveying modules coupled to each other along the longitudinal axis, wherein each of the wafer conveying modules is coupled to one of the processing modules coupled along the first lateral side of the wafer conveying assembly, and wherein each of the wafer conveying modules is coupled to one of the processing modules coupled along the second lateral side of the wafer conveying assembly.

[0018] In some embodiments, a stair arrangement is defined at a rear end of the maintenance tunnel, the rear end of the maintenance tunnel being defined substantially below the rear end of the wafer conveying assembly, the stair arrangement being configured to define a path from the manufacturing facility level down to the maintenance level.

[0019] In some embodiments, the front side of the wafer transport assembly is configured to connect to a load lock that controls access to and from the EFEM, wherein a front end of the access tunnel extends substantially to the EFEM.

[0020] In some embodiments, a first lateral side of the access tunnel provides access to the process modules coupled along the first lateral side of the wafer conveyor assembly, and a second lateral side of the access tunnel provides access to the process modules coupled along the second lateral side of the wafer conveyor assembly.

[0021] In some embodiments, the first lateral side of the maintenance tunnel provides access to one or more gas boxes of the processing module defined for coupling along the first lateral side of the wafer conveying assembly, and the second lateral side of the maintenance tunnel provides access to one or more gas boxes of the processing module defined for coupling along the second lateral side of the wafer conveying assembly.

[0022] In some embodiments, the maintenance tunnel complies with the SEMI E72 standard.

[0023] According to an embodiment of the present disclosure, a wafer conveying assembly is provided, which includes: a first wafer conveying module; a second wafer conveying module; a buffer module, which is coupled between the first and second wafer conveying modules, so that the first wafer conveying module, the second wafer conveying module, and the buffer module are aligned in a single direction axis, the buffer module having a first buffer stack and a second buffer stack, wherein the first buffer stack is placed at a first side end of the buffer module disposed on a first side of the single direction axis, and wherein the second buffer stack is placed at a second side end of the buffer module disposed on a second side of the single direction axis; wherein the first side of the first wafer conveying module disposed on the first side of the single direction axis is configured to be coupled to a first processing module; wherein the first side of the first wafer conveying module disposed on the first side of the single direction axis is configured to be coupled to a first processing module; The first side of the second wafer conveying module on the first side is configured to be coupled to the second processing module; wherein the first side end of the buffer module defines a first side protrusion nested between the first and second wafer conveying modules and the first and second processing modules; wherein the second side of the first wafer conveying module disposed on the second side of the single direction axis is configured to be coupled to the third processing module; wherein the second side of the second wafer conveying module disposed on the second side of the single direction axis is configured to be coupled to the fourth processing module; wherein the second side end of the buffer module defines a second side protrusion nested between the first and second wafer conveying modules and the third and fourth processing modules; wherein the first wafer conveying module, the second wafer conveying module, and the buffer module are configured to define a continuous controlled environment.

[0024] In some embodiments, the wafer conveying assembly is configured to define a conveying path for the wafer from one of the first or third processing modules to a first wafer conveying module, a conveying path to one of the first or second buffer stacks, a conveying path to a second wafer conveying module, and a conveying path to one of the second or fourth processing modules.

[0025] In some embodiments, each of the first and second buffer stacks is configured to store approximately 5 to 10 wafers.

[0026] In some embodiments, the controlled environment is defined by a vacuum controlled environment.

[0027] In some embodiments, the first and second buffer stacks define a plurality of wafer storage slots, wherein at least one of the wafer storage slots is configured to store cover wafers in a controlled environment defined by the wafer transport assembly.

[0028] In some embodiments, the chip conveying assembly also includes: a second buffer module coupled to the second conveying module and aligned along a single direction axis, the second buffer module having a third buffer stack placed at a first side end of the second buffer module arranged on a first side of the single direction axis, and the second buffer module having a fourth buffer stack placed at a second side end of the second buffer module arranged on a second side of the single direction axis.

[0029] In some embodiments, the first side end of the second buffer module defines a third side protrusion, and wherein the second side end of the second buffer module defines a fourth side protrusion.

[0030] In some embodiments, the wafer conveying assembly further includes: a third wafer conveying module coupled to the second buffer module and aligned along a single direction axis, wherein a first side of the third wafer conveying module disposed on a first side of the single direction axis is configured to be coupled to a fifth processing module, and wherein a second side of the third wafer conveying module disposed on a second side of the single direction axis is configured to be coupled to a sixth processing module.

[0031] In some embodiments, the third side projection is nested between the second and third wafer conveying modules and the second and fifth processing modules; and wherein the fourth side projection is nested between the second and third wafer conveying modules and the fourth and sixth processing modules.

[0032] In some embodiments, the wafer conveyor assembly is defined above a service tunnel extending from a front end of the wafer conveyor assembly to a back end of the wafer conveyor assembly.

[0033] According to an embodiment of the present disclosure, a wafer conveying assembly is provided, which includes: a housing; a first wafer conveying robot arranged in the housing; a second wafer conveying robot arranged in the housing; a first and a second buffer stack arranged in the housing, wherein the first and the second buffer stack are placed between the first and the second wafer conveying robots; wherein the first interface is defined along the first side of the housing and is configured to be coupled to the first processing module; wherein the second interface is defined along the first side of the housing and is configured to be coupled to the second processing module; wherein the first side protrusion is defined along the first side of the housing between the first and the second interfaces, the first side protrusion defines a position for the first buffer stack and is nested between the first and the second wafer conveying robots and the first and the second processing modules; wherein the third interface is defined along the second side of the housing and is configured to be coupled to the third processing module; wherein the fourth interface is defined along the second side of the housing and is configured to be coupled to the fourth processing module; wherein the second side protrusion is defined along the second side of the housing between the third and the fourth interfaces, the second side protrusion defines a position for the second buffer stack and is nested between the first and the second wafer conveying robots and the third and the fourth processing modules; wherein the wafer conveying assembly defines a continuous controlled environment.

[0034] In some embodiments, the wafer conveying assembly is configured to define a conveying path for the wafer from one of the first or third processing modules to a first wafer conveying robot, a conveying path to one of the first or second buffer stacks, a conveying path to a second wafer conveying robot, and a conveying path to one of the second or fourth processing modules.

[0035] In some embodiments, the wafer transport assembly further comprises: a connector for coupling to a vacuum source, wherein the continuous controlled environment is defined by a vacuum controlled environment.

[0036] In some embodiments, an upper portion of a first buffer stack defines a first plurality of wafer storage slots, the upper portion of the first buffer stack having one or more separators defined between each of the first plurality of wafer storage slots; and wherein a lower portion of the first buffer stack defines a second plurality of wafer storage slots, the lower portion of the first buffer stack not having separators defined between each of the second plurality of wafer storage slots.

[0037] In some embodiments, the lower portion of the first buffer stack is configured to store one or more cover wafers or seasoning wafers.

[0038] In some embodiments, each of the first and second buffer stacks is configured to store approximately 5 to 10 wafers.

[0039] In some embodiments, the wafer conveyor assembly is defined above a service tunnel extending from a front end of the wafer conveyor assembly to a back end of the wafer conveyor assembly.

[0040] According to an embodiment of the present disclosure, a loading lock assembly is provided, which includes: a first loading lock configured for connection between an equipment front end module (EFEM) and a wafer conveying module, the EFEM being maintained under laboratory environmental conditions, the wafer conveying module being maintained under a vacuum state, the wafer conveying module being a part of the wafer conveying assembly, the wafer conveying assembly being configured to transfer wafers to and from one or more processing modules connected to the wafer conveying assembly; a second loading lock disposed above the first loading lock, the second loading lock being configured for connection between the EFEM and the wafer conveying module; a post-processing module disposed above the second loading lock, the post-processing module being configured to perform post-processing operations on processed wafers, the processed wafers having been processed in at least one processing module connected to the wafer conveying assembly, the post-processing module being configured to be connected to the wafer conveying module.

[0041] In some embodiments, the post-processing module is stacked above a second load lock, and wherein the second load lock is stacked above the first load lock.

[0042] In some embodiments, a first load lock is configured to move a wafer from the EFEM into a wafer transport module; wherein the second load lock is configured to move a wafer from the wafer transport module to the EFEM.

[0043] In some embodiments, the post-processing module is configured to perform a stripping process or a passivation process on the processed wafer.

[0044] In some embodiments, the loading lock assembly further includes: a third loading lock arranged adjacent to the first loading lock, the third loading lock being configured for connection between the EFEM and the wafer conveying module; a fourth loading lock arranged above the third loading lock and adjacent to the second loading lock, the fourth loading lock being configured for connection between the EFEM and the wafer conveying module; and a second post-processing module disposed above the fourth loading lock, the second post-processing module being configured for performing post-processing operations on the processed wafer, the second post-processing module being configured for connection to the wafer conveying module.

[0045] In some embodiments, the second post-processing module is stacked above a fourth load lock, and wherein the fourth load lock is stacked above the third load lock.

[0046] In some embodiments, the first and second load locks are configured to move wafers from the EFEM into a wafer transport module; wherein the third and fourth load locks are configured to move wafers from the wafer transport module into the EFEM.

[0047] According to an embodiment of the present disclosure, a system is provided, which includes: an equipment front end module (EFEM); a wafer conveying assembly, the wafer conveying assembly including a wafer conveying module configured to be connected to a first processing module and a second processing module, the wafer conveying module including a robot for moving wafers between the first and second processing modules; a first loading lock and a second loading lock connected between the EFEM and a front side of the wafer conveying module, the first and second loading locks being configured to move wafers from the EFEM to the wafer conveying module; a third loading lock and a fourth loading lock connected between the EFEM and the front side of the wafer conveying module, the third and fourth loading locks being configured to move wafers from the wafer conveying module to the EFEM.

[0048] In some embodiments, the first and second load locks are positioned in a stacked configuration; wherein the third and fourth load locks are positioned in the stacked configuration adjacent to the first and second load locks.

[0049] In some embodiments, the system also includes: a first post-processing module connected to the front side of the wafer conveying module, the first post-processing module being configured to perform post-processing operations on the processed wafer; and a second post-processing module connected to the front side of the wafer conveying module, the second post-processing module being configured to perform post-processing operations on the processed wafer.

[0050] In some embodiments, the first or second processing module is configured to perform an etching operation, and wherein the first or second post-processing module is configured to perform a stripping operation after performing the etching operation.

[0051] In some embodiments, the robot is configured to transfer the wafer from a first loading lock to a first processing module to perform an etching operation, then transfer the wafer from the first processing module to a first post-processing module to perform a stripping operation, and then transfer the wafer from the first post-processing module to a third loading lock to exit the wafer transfer assembly.

[0052] According to an embodiment of the present disclosure, a method for processing a wafer is provided, which includes: transporting the wafer from an equipment front end module (EFEM) into a wafer conveying assembly through a first loading lock, wherein the first loading lock is connected between the EFEM and the wafer conveying assembly; moving the wafer into a processing module configured to perform a processing operation on the wafer, wherein the processing module is connected to the wafer conveying assembly; after performing the processing operation, moving the wafer into a post-processing module configured to perform a post-processing operation on the wafer, wherein the post-processing module is connected to the wafer conveying assembly and is arranged in a vertical stacking structure with the first loading lock; after performing the post-processing operation, moving the wafer from the post-processing module to the EFEM through a second loading lock connected to the wafer conveying assembly, wherein the second loading lock is connected between the EFEM and the wafer conveying assembly.

[0053] In some embodiments, the processing operation is an etching operation, and wherein the post-processing operation is a stripping operation.

[0054] In some embodiments, the second load lock is arranged in a vertical stacked configuration with the first load lock.

[0055] In some embodiments, a second load lock is positioned adjacent to a vertical stack defined by the first load lock and the passivation module.

[0056] Specifically, some aspects of the present invention can be described as follows:

[0057] 1. A cluster tool system for processing a wafer, comprising:

[0058] a wafer conveyor assembly extending along a longitudinal axis of the cluster tool system, the wafer conveyor assembly having a front end oriented toward an equipment front end module (EFEM), the wafer conveyor assembly having a rear end opposite the front end;

[0059] at least two process modules coupled to the wafer conveyor assembly along a first lateral side of the wafer conveyor assembly, the wafer conveyor assembly being configured to convey wafers to and from the at least two process modules coupled along the first lateral side;

[0060] at least two process modules coupled to the wafer conveyor assembly along a second lateral side of the wafer conveyor assembly, the wafer conveyor assembly being configured to convey wafers to and from the at least two process modules coupled along the second lateral side;

[0061] An inspection tunnel is defined below the wafer conveying assembly, the inspection tunnel extending along the longitudinal axis of the cluster tool system from the front end to the rear end of the wafer conveying assembly, the inspection tunnel having a vertical dimension, the vertical dimension being defined between a bottom surface of the wafer conveying assembly and an inspection layer positioned below the wafer conveying assembly, the inspection layer being defined at a height lower than the height of the manufacturing facility layer in which the cluster tool system is placed.

[0062] 2. A cluster tool system according to claim 1, wherein the wafer conveying assembly includes at least two wafer conveying modules coupled to each other along the longitudinal axis, wherein each of the wafer conveying modules is coupled to one of the processing modules coupled along the first lateral side of the wafer conveying assembly, and wherein each of the wafer conveying modules is coupled to one of the processing modules coupled along the second lateral side of the wafer conveying assembly.

[0063] 3. The cluster tool system according to clause 1, further comprising:

[0064] at least two process module frames configured to support the at least two process modules coupled along the first lateral side of the wafer transport assembly and further configured to rest on the fabrication facility level;

[0065] At least two process module frames are configured to support the at least two process modules coupled along the second lateral side of the wafer transport assembly and are further configured to rest on the fabrication facility level.

[0066] 4. A cluster tool system according to claim 1, wherein a step device is defined at the rear end of the maintenance tunnel, the rear end of the maintenance tunnel is substantially defined below the rear end of the wafer conveying assembly, and the step device is configured to define a path from the manufacturing facility level downward to the maintenance level.

[0067] 5. The cluster tool system of clause 1, wherein the height of the access level is approximately 1 foot (30.5 centimeters) to 2 feet (61 centimeters) below the height of the manufacturing facility level.

[0068] 6. The cluster tool system of clause 1, wherein a front side of the wafer transport assembly is configured to connect to a load lock that controls access to and from the EFEM, wherein a front end of the access tunnel extends substantially to the EFEM.

[0069] 7. The cluster tool system of clause 1, wherein the access tunnel has a height of approximately 6 feet (183 centimeters) to 8 feet (242 centimeters).

[0070] 8. A cluster tool system according to claim 1, wherein a first lateral side of the maintenance tunnel provides access to the processing module coupled along the first lateral side of the wafer conveying assembly, and a second lateral side of the maintenance tunnel provides access to the processing module coupled along the second lateral side of the wafer conveying assembly.

[0071] 9. A cluster tool system according to claim 8, wherein the first lateral side of the maintenance tunnel provides access to one or more gas boxes of the processing module defined for coupling along the first lateral side of the chip conveying assembly, and the second lateral side of the maintenance tunnel provides access to one or more gas boxes of the processing module defined for coupling along the second lateral side of the chip conveying assembly.

[0072] 10. The cluster tool system of clause 1, wherein the maintenance tunnel complies with SEMI E72 standard.

[0073] 11. A cluster tool system for processing a wafer, comprising:

[0074] a wafer conveyor assembly extending along a longitudinal axis of the cluster tool system, the wafer conveyor assembly having a front end oriented toward an equipment front end module (EFEM), the wafer conveyor assembly having a rear end opposite the front end;

[0075] at least two process modules coupled to the wafer conveyor assembly along a first lateral side of the wafer conveyor assembly, the wafer conveyor assembly being configured to convey wafers to and from the at least two process modules coupled along the first lateral side;

[0076] at least two process modules coupled to the wafer conveyor assembly along a second lateral side of the wafer conveyor assembly, the wafer conveyor assembly being configured to convey wafers to and from the at least two process modules coupled along the second lateral side;

[0077] an access tunnel defined below the wafer conveyor assembly, the access tunnel extending along the longitudinal axis of the cluster tool system from the front end to the back end of the wafer conveyor assembly, the access tunnel having a vertical dimension defined between a bottom surface of the wafer conveyor assembly and an access level positioned below the wafer conveyor assembly, the access level being defined at an elevation less than an elevation of a fabrication facility level in which the cluster tool system is disposed, wherein the elevation of the access level is approximately 1 foot (30 centimeters) to 2 feet (60 centimeters) below an elevation of the fabrication facility level;

[0078] at least two process module frames configured to support the at least two process modules coupled along the first lateral side of the wafer transport assembly and further configured to rest on the fabrication facility level;

[0079] at least two process module frames configured to support the at least two process modules coupled along the second lateral side of the wafer transport assembly and further configured to rest on the fabrication facility level;

[0080] Wherein, the height of the maintenance tunnel is defined by the height of the maintenance layer and the height of the processing module frame, and the height of the maintenance tunnel is approximately 6 feet (180 cm) to 8 feet (240 cm).

[0081] 12. A cluster tool system according to claim 11, wherein the wafer conveying assembly includes at least two wafer conveying modules coupled to each other along the longitudinal axis, wherein each of the wafer conveying modules is coupled to one of the processing modules coupled along the first lateral side of the wafer conveying assembly, and wherein each of the wafer conveying modules is coupled to one of the processing modules coupled along the second lateral side of the wafer conveying assembly.

[0082] 13. A cluster tool system according to claim 11, wherein a step device is defined at the rear end of the maintenance tunnel, the rear end of the maintenance tunnel is substantially defined below the rear end of the wafer conveying assembly, and the step device is configured to define a path from the manufacturing facility level down to the maintenance level.

[0083] 14. The cluster tool system of clause 11, wherein a front side of the wafer transport assembly is configured to connect to a load lock that controls access to and from the EFEM, wherein a front end of the access tunnel extends substantially to the EFEM.

[0084] 15. A cluster tool system according to claim 11, wherein a first lateral side of the maintenance tunnel provides access to the processing module coupled along the first lateral side of the wafer conveying assembly, and a second lateral side of the maintenance tunnel provides access to the processing module coupled along the second lateral side of the wafer conveying assembly.

[0085] 16. A cluster tool system according to claim 15, wherein the first lateral side of the maintenance tunnel provides access to one or more gas boxes of the processing module defined for coupling along the first lateral side of the chip conveying assembly, and the second lateral side of the maintenance tunnel provides access to one or more gas boxes of the processing module defined for coupling along the second lateral side of the chip conveying assembly.

[0086] 17. The cluster tool system of clause 11, wherein the maintenance tunnel complies with SEMI E72 standard. BRIEF DESCRIPTION OF THE DRAWINGS

[0087] Figure 1A A cross-section of a portion of a cluster tool for processing wafers according to an embodiment of the present disclosure is conceptually illustrated.

[0088] Figure 1B A perspective view of a cluster tool system is shown according to an embodiment of the present disclosure.

[0089] Figure 1C A perspective view of a cluster tool system is shown according to an embodiment of the present disclosure.

[0090] Figure 1D A cross-sectional view of a cluster tool system is shown in accordance with an embodiment of the present disclosure.

[0091] Figure 1E A cross-section of a portion of a cluster tool for processing wafers according to an embodiment of the present disclosure is conceptually illustrated.

[0092] Figure 1F A cross-sectional view of a cluster tool for processing wafers according to an embodiment of the present disclosure is shown.

[0093] Figure 2 A top view of a cluster tool system according to an embodiment of the present disclosure is shown, with conceptual cross-sections of various pieces of equipment of the system being shown.

[0094] Figure 3A is a perspective view of a wafer transport assembly according to an embodiment of the present disclosure.

[0095] Figure 3B Shows Figure 3A A perspective view of a wafer conveyor assembly according to an embodiment of the present disclosure without a cover plate installed to provide a view of the interior of the wafer conveyor assembly.

[0096] Figure 4A A perspective view of a wafer transport module according to an embodiment of the present disclosure is shown.

[0097] Figure 4B A perspective view of a wafer transport module 102 with a buffer module 410 connected thereto is shown in accordance with an embodiment of the present disclosure.

[0098] Figure 5 A cross-sectional view of a buffer stack 500 is conceptually shown in accordance with an embodiment of the present disclosure.

[0099] Figure 6A cross-sectional view of a portion of a buffer module showing a buffer stack is shown according to an embodiment of the present disclosure.

[0100] Figure 7 A cluster tool system according to an embodiment of the present disclosure is shown highlighting the orientation of the wafer as it moves through the various components of the system.

[0101] Figure 8 Shown is a cross-sectional view of a portion of a cluster tool system according to an embodiment of the present disclosure.

[0102] Fig. 9 The structure of a load lock and an integrated post-processing module according to an embodiment of the present disclosure is conceptually illustrated.

[0103] Fig.10 A control module for controlling the system of the present disclosure is shown. DETAILED DESCRIPTION

[0104] Embodiments of the present disclosure provide methods, apparatus, and systems associated with a cluster tool architecture that implements a compact design with a SEMI-compliant access space in the form of an inspection tunnel defined below a wafer conveyor assembly. The wafer conveyor assembly may also include a number of buffers that are maintained in the same controlled environment (e.g., vacuum conditions) as the rest of the wafer conveyor assembly and provide great flexibility for configuring wafer movement through the wafer conveyor assembly. It should be understood that embodiments of the present invention may be implemented in a variety of ways, such as processes, apparatuses, systems, equipment, materials, or methods. Several embodiments are described below.

[0105] Figure 1A Conceptually shows a cross section of a part of a cluster tool for processing wafers according to an embodiment of the present disclosure. In the illustrated embodiment, a manufacturing facility layer 116 is shown, on which equipment can be placed. The manufacturing facility layer 116 is defined as a high-rise above the bottom layer 120 supported below. The manufacturing facility layer 116 can be defined by a series of bricks, and the bricks can be perforated to allow airflow to pass through the bricks to remove particles from the fab environment. The bricks are supported by pillars 118 above the bottom layer 120. In some embodiments, the distance between the manufacturing facility layer and the bottom layer 120 is approximately 2 feet (approximately 60 centimeters). In some embodiments, the distance between the manufacturing facility layer and the bottom layer 120 is in the range of approximately 1.5 to 2.5 feet (approximately 45 to 75 centimeters). In some embodiments, the distance between the manufacturing facility layer 116 and the bottom layer 120 is in the range of approximately 1 to 4 feet (approximately 0.3 to 1.2 meters).

[0106] In some embodiments, the bottom layer 120 is defined by a concrete waffle slab. The bottom layer space 121 defined between the manufacturing facility layer 116 and the bottom layer 120 can be used for the passage of various facility lines, such as process gas lines, vacuum lines, electrical / RF lines / feeds, data cables, liquid supply lines, etc. It should be understood that the passage of such lines can be along the bottom layer 120, and can also extend through the bottom layer 120 to the lower layer, allowing connection to support equipment located above the lower layer.

[0107] The process modules 100 and 106 are placed at an elevated height above the manufacturing facility level 116. More specifically, in the illustrated embodiment, the process modules 100 and 106 are supported by process module frames 108 and 110, respectively. Each process module frame is configured to lift its respective process module, thereby providing a lower level space below the process module to accommodate various facilities and equipment required for the operation of the process module. By placing the facilities below the process modules, the horizontal space required for operation is retained, which allows the process modules to be placed closer to each other within a given cluster tool system, thereby also allowing adjacent cluster tool systems to be placed closer to each other.

[0108] In some embodiments, the space below the process module defined by the process module frame is configured to have a minimum height in order to accommodate an RF feed source having a predetermined vertical length extending downward from the process module. The RF feed source structure can be connected to a chuck configured to move up and down within the chamber of the process module, thereby also moving the RF feed source structure up and down, so the process module frame is configured to provide sufficient height to accommodate such vertical movement.

[0109] As process modules and cluster tool systems are arranged more closely together, access space becomes more limited relative to the number of equipment pieces and cluster tool systems within a given area of ​​a manufacturing facility. This can be problematic because limited access to equipment makes servicing or repair operations more difficult to perform and may require additional steps to gain necessary access to equipment, such as disassembling or moving parts or all of the equipment. These additional steps can increase downtime, thereby reducing some of the yield benefits that might otherwise be achieved through a compactly designed architecture.

[0110] To address these issues, according to an embodiment of the present disclosure, an inspection tunnel 124 is provided in the space below the wafer conveying module (including the wafer conveying module 102) of the cluster tool. The inspection tunnel 124 is further defined by an inspection layer 122 below the wafer conveying module 102. The inspection layer 122 is a lower layer relative to the manufacturing facility layer 116, and is defined at a height lower than the height of the manufacturing facility layer but higher than the bottom layer 120. The inspection layer 122 thus utilizes the bottom layer space that would otherwise exist between the manufacturing facility layer 116 and the bottom layer 120, and utilizes this space to provide additional height for the inspection tunnel 124. The inspection tunnel 124 is therefore defined between the wafer conveying module 102 and the inspection layer 122, and has a height H1 sufficient for a person of average height (about 5 to 6 feet (about 150 to 180 centimeters) high) to stand up. In some embodiments, the height H1 is in the range of about 2 to 8 feet (about 0.6 to 2.4 meters). In some embodiments, height H1 is in the range of about 5.5 to 7.5 feet (about 1.7 to 2.3 meters). In some embodiments, height H1 is about 7 feet (about 2.1 meters).

[0111] It should be appreciated that the access tunnel 124 and cluster tool architecture defined in accordance with embodiments of the present disclosure conform to the SEMI (Semiconductor Equipment and Materials International) E72 standard governing the spatial requirements of semiconductor manufacturing equipment.

[0112] In the illustrated embodiment, for completeness of the present disclosure, a robot actuator 104 is shown as part of the wafer transport module 102. The robot actuator 104 as shown is conceived as a generally cylindrical structure extending downwardly from the body of the wafer transport module 102. In the vicinity of the robot actuator 104 (in front of, behind, and to the sides of the robot actuator), the height of the maintenance tunnel space extends from the maintenance level 122 to the bottom surface of the wafer transport module 102, which provides a height H1 sufficient for a person of average height to stand unhindered.

[0113] The maintenance tunnel 124 is defined between the process modules 100 and 106, and also between the process module frames 108 and 110. In some embodiments, the gas boxes 112 and 114 that service the process modules 100 and 106, respectively, are placed along the sides of the maintenance tunnel 124. The maintenance tunnel 124 can therefore have a width W1. According to some embodiments, the width W1 is in the range of about 2 to 6 feet (about 0.6 to 1.8 meters). In some embodiments, the width W1 is in the range of about 2.5 to 4 feet (about 0.7 to 1.3 meters). In some embodiments, the width W1 is in the range of about 3 to 3.5 feet (about 0.9 to 1.1 meters). The inwardly facing portion of the process module frame defines the side walls of the maintenance tunnel.

[0114] The inspection tunnel 124 provides access from the interior area of ​​the cluster tool system to the equipment of the cluster tool system. Such access is important because the processing modules and other equipment of the cluster tool system are placed very close to each other to reduce the footprint of the system. More specifically, the inspection tunnel 124 provides access to the bottom surface of the wafer conveyor module 102, and to the interior-facing sides of the processing modules 100 and 106. The gas boxes 112 and 114 provide access to the gas pipelines for servicing the processing modules 100 and 106, respectively. The gas boxes 112 and 114 are defined along the side walls of the inspection tunnel, and they can also be entered from the inspection tunnel 124.

[0115] The internal height H1 of the maintenance tunnel is defined by the vertical dimensions of the various components of the system, including the depth D1 of the maintenance layer 122 below the level of the manufacturing facility layer 116, and the height H2 at which the processing module frames 108 and 110 are configured to raise the processing modules 100 and 106. The available depth for the maintenance layer depends on the height of the manufacturing facility layer above the bottom layer, i.e., the height H1. Therefore, in various embodiments, the depth D1 of the maintenance layer can be in the range of 0 to H1. In some embodiments, the depth D1 is in the range of approximately 0 to 4 feet (approximately 0 to 60 centimeters). In some embodiments, the depth D1 is in the range of approximately 1 to 2 feet (approximately 30 to 60 centimeters). In some embodiments, the depth D1 is in the range of approximately 1.5 to 1.8 feet (approximately 45 to 55 centimeters).

[0116] In some embodiments, the height H2 of the processing module frame is in the range of about 2 to 6 feet (about 0.6 to 1.8 meters). In some embodiments, the height H2 is in the range of about 3 to 6 feet (about 0.9 to 1.8 meters). In some embodiments, the height H2 is in the range of about 2.5 to 4.5 feet (about 0.8 meters to 1.4 meters). In some embodiments, the maintenance tunnel 124 is defined below the wafer conveying assembly defined by one or more wafer conveying modules (such as wafer conveying module 102). In some embodiments, the maintenance tunnel extends longitudinally from the front end defined by the equipment front end module (EFEM) to the rear end defined by the rear side of the rearmost wafer conveying module. The maintenance level 122 of the maintenance tunnel 124 can be conceptually understood as defining a maintenance pit located below the wafer conveying assembly to provide sufficient vertical height to allow personnel to stand unobstructed in the maintenance pit.

[0117] The entrance to the maintenance tunnel 124 is provided by the rear end of the maintenance tunnel opening toward the manufacturing facility level. In order to provide an entrance and exit from the maintenance tunnel 124, stairs or sets of steps / stairs can be placed at the rear end of the maintenance tunnel 124, and the stairs or sets of steps / stairs define a path from the maintenance level 122 upward to the manufacturing facility level 116. In some implementations, a foldable ladder can be provided, which defines the ladder when unfolded, but can also be folded up when not in use. In this way, the ladder for entering / exiting is provided when needed, and can be put away when not needed, so that the maintenance level space is not occupied to meet the requirements of the standard maintenance level space. In some implementations, when the ladder is folded up, the ladder can be configured to block the entrance to the maintenance tunnel, which improves the safety of the system and prevents personnel from accidentally falling into the maintenance tunnel.

[0118] Figure 1B A perspective view of a cluster tool system according to an embodiment of the present disclosure is shown. In the illustrated embodiment, a rear end opening of the maintenance tunnel 124 is visible. As shown, the maintenance tunnel 124 is defined below the wafer conveyor assembly 209 and extends from a front end of the wafer conveyor assembly 209 positioned toward the EFEM 200 to a rear end of the wafer conveyor assembly 209 opposite the front end.

[0119] Figure 1C A perspective view of a cluster tool system according to an embodiment of the present disclosure is shown. In the illustrated embodiment, a fab level and an auxiliary fab level are shown, as well as support equipment for operating process modules placed at the auxiliary fab level. A front end 128 of the access tunnel 124 is visible in the illustrated embodiment. As shown, the front end 128 of the access tunnel 124 can extend to the EFEM 200 according to an embodiment of the present disclosure.

[0120] Figure 1D A cross-sectional view of a cluster tool system according to an embodiment of the present disclosure is shown. The illustrated embodiment again illustrates the relationship between the fab level and the auxiliary fab level. The illustrated person is shown approximately to scale, showing the available space for personnel operations in the maintenance tunnel 124.

[0121] Figure 1E A cross-section of a portion of a cluster tool for processing wafers according to an embodiment of the present disclosure is conceptually illustrated. Figure 1EIn some embodiments, the floor of the maintenance tunnel 124 is defined at the level of the manufacturing facility level 116. In some embodiments, the floor of the maintenance tunnel 124 may be defined by the manufacturing facility level 116. In other embodiments, the floor of the maintenance tunnel 124 when defined at the level of the manufacturing facility level 116 may have a different structure than the structure of the manufacturing facility level 116. It should be understood that the height H2 of the process module frames 108 and 110 is different from the height H2 of the process module frames 108 and 110. Figure 1A Compared with the implementation in , it is higher. Figure 1E In the illustrated embodiment, wherein the floor of the access tunnel 124 is defined at the level of the fabrication facility level 116, the height H2 of the process module frame is generally in the range of about 2 to 6 feet (about 0.6 to 1.8 meters). In some embodiments, the height H2 is in the range of about 4.5 to 6.5 feet (about 1.4 to 2 meters). In some embodiments, the height H2 is in the range of about 4 to 7 feet (about 1.2 to 2.1 meters).

[0122] Figure 1F A cross-sectional view (a vertical cross-sectional view along a longitudinal axis from front to back) of a cluster tool for processing wafers according to an embodiment of the present disclosure is shown. The interior of the maintenance tunnel 124 is thus shown in the figure shown. Gas boxes 114, 134 and 136 provide access to gas pipelines that supply process modules 106, 214, and 220, respectively. The gas box is positioned above a clean exhaust duct 132, which exhausts air from the fab. In the illustrated embodiment, the side cover of the exhaust duct 132 is removed. The gas box includes perforations 137 to allow air to flow from the fab through the perforations 137 and into the exhaust duct 132. The dashed arrows in the figure illustrate the direction of the gas flow, which enters the exhaust duct through the gas box so as to ultimately flow to the bottom layer of the fab and be removed through the bottom layer of the fab.

[0123] Additionally, in some embodiments, the gas line 138 is positioned inside the exhaust duct 132. By having the gas line run through the exhaust duct, space is conserved in the fab, which allows the exhaust duct to provide additional functionality. Furthermore, by arranging the gas line in the exhaust duct, the potential for contamination in the fab due to leaks in the gas line is minimized, since any leaking gaseous material is immediately exhausted through the exhaust duct. Because the risk of contamination is minimized, it may be feasible to use lower grade gas line materials than would be available for a gas line placed outside the exhaust duct, thereby reducing costs.

[0124] Figure 2A top view of a cluster tool system according to an embodiment of the present disclosure is shown, which shows a conceptual cross-sectional view of various equipment pieces of the system. The front of the cluster tool system is defined by an equipment front end module (EFEM) 200, which includes a plurality of loading ports 202a, 202b, 202c and 202d for receiving a plurality of wafer transport containers 204a, 204, 204c and 204d, respectively. In some embodiments, the wafer transport containers are front opening unified containers (FOUP's). The EFEM 200 may further include buffer stations 206a, 206b and 206c. The EFEM 200 and its buffer stations 206a, 206b and 206c may be operated under controlled environmental conditions or under atmospheric conditions.

[0125] Attached to the rear end of the EFEM 200 is a load lock 208 that defines a passageway into a wafer transport assembly 209. The wafer transport assembly is defined by a plurality of wafer transport modules 102, 212, and 218 connected in series and extending rearwardly from the load lock 208. Each wafer transport module controls entry and exit to adjacent process modules. For example, the wafer transport module 102 is configured to move wafers into or out of adjacent process modules 100 and 106. The wafer transport module 212 is configured to move wafers into or out of adjacent process modules 210 and 214. The wafer transport module 218 is configured to move wafers into or out of adjacent process modules 216 and 220.

[0126] Each wafer transport module includes a robot (automatic wafer handler) configured to engage and lift the wafer and transport the wafer. In the illustrated embodiment, the wafer transport modules 102, 212 and 218 include robots 222, 224 and 226, respectively. The robots may have an end effector configured to engage with the wafer. Thus, the robots of the wafer transport modules are configured to move the wafer within the wafer transport assembly 209 and further move the wafer into or out of an adjacent processing module.

[0127] In the illustrated embodiment, the wafer conveyor assembly 209 is defined by the wafer conveyor modules 102, 212, and 218. The wafer conveyor assembly 209 extends rearwardly from the load lock 208 to the rear side of the rearmost wafer conveyor module 218. As previously noted, an access tunnel 124 is defined beneath the wafer conveyor assembly 209. In some embodiments, the access tunnel 124 extends from a front end of the wafer conveyor assembly 209 (defined by the front end of the wafer conveyor module 102) to a rear end of the wafer conveyor assembly 209 (defined by the rear end of the wafer conveyor module 218). In some embodiments, the access tunnel 124 extends at its front end to the EFEM 200. The access tunnel 124 provides access to the bottom surfaces of the wafer conveyor modules 102, 212, and 218, for example, to service the robots 222, 224, and 226 of the wafer conveyor modules.

[0128] The wafer conveyor assembly 209 also includes gate valves that control the opening between a given wafer conveyor module and an adjacent processing module. In the illustrated implementation, gate valve 228 controls the opening between wafer conveyor module 102 and processing module 100; gate valve 230 controls the opening between wafer conveyor module 102 and processing module 106; gate valve 232 controls the opening between wafer conveyor module 212 and processing module 210; gate valve 234 controls the opening between wafer conveyor module 212 and processing module 214; gate valve 236 controls the opening between wafer conveyor module 218 and processing module 216; and gate valve 238 controls the opening between wafer conveyor module 218 and processing module 220.

[0129] A given gate valve can be opened to allow a wafer to be transported into or out of an adjacent processing module by a corresponding wafer conveying module. The gate valve can be closed to isolate an adjacent processing module, for example, for processing a wafer that has been placed in a processing module or for performing any other operation that requires isolating a processing module from a wafer conveying module. In some embodiments, gate valves 228, 230, 232, 234, 236, and 238 are integrated into the wafer conveying assembly 209. By integrating the gate valve into the wafer conveying assembly 209, the overall footprint of the wafer conveying assembly (compared to a wafer conveying assembly with a non-integrated gate valve) is reduced. The internal environment of the wafer conveying assembly 209 is controlled and can be defined as a vacuum environment or a controlled ambient environment. In some embodiments, the wafer conveying assembly 209 is filled with an inert gas. In various embodiments, the wafer conveying assembly 209 operates under pressure conditions ranging from atmospheric pressure to vacuum conditions. According to some embodiments of the present disclosure, vacuum conditions can be defined as an internal pressure of less than about 760 Torr. According to some embodiments of the present disclosure, vacuum conditions can be defined as an internal pressure of less than about 10 Torr. In some implementations, vacuum conditions can be defined as being between about 1×10 -9 Torr to about 1 Torr.

[0130] Continue to refer Figure 2According to an embodiment of the present disclosure, a plurality of buffer stacks are defined in the wafer conveyor assembly 209. Buffer stacks 240 and 242 are defined between the wafer conveyor modules 102 and 212. Buffer stacks 244 and 246 are defined between the wafer conveyor modules 212 and 218. Buffer stacks 248 and 250 are defined behind the wafer conveyor module 218. It should be understood that the buffer stacks are defined within the wafer conveyor assembly 209, and as such, the buffer stacks share the same controlled environment as the wafer conveyor assembly. This provides advantages over conventional systems because the wafers do not need to exit the controlled environment of the wafer conveyor assembly 209 for storage. Because the wafers can be buffered and stored in the wafer conveyor assembly 209, they are immediately accessible by the wafer conveyor module to be conveyed to a processing module or elsewhere.

[0131] In some embodiments, a given buffer stack is configured to have a capacity for storing approximately 2 to 20 wafers. In some embodiments, a given buffer stack is configured to have a capacity for storing approximately 5 to 15 wafers. In some embodiments, a given buffer stack may have a capacity for storing approximately 5 to 10 wafers. In some embodiments, a given buffer stack may have a capacity for storing approximately 8 wafers. Each buffer stack defines a plurality of storage slots defined in a vertically stacked arrangement. The storage slots may have a separator or partition defined therebetween that separates a given wafer from other wafers in the wafer stack.

[0132] As noted, the buffer stack is placed between adjacent wafer conveying modules. In addition, the buffer stack is placed along the lateral side of the wafer conveying assembly, which enables a compact design of the wafer conveying assembly because the buffer stack is placed to utilize the space between adjacent wafer conveying modules and adjacent processing modules connected to the wafer conveying modules. More specifically, the center axis of the buffer stack is laterally offset from a mid-plane defined by the central rotation axis of the robot of the wafer conveying module. The center axis of a given buffer stack is defined as a vertical axis extending through the center of the wafer stored in the buffer stack. The central rotation axes of the robot are aligned with each other in a front-to-back arrangement defining the mid-plane. A single directional axis 270 can be defined along the mid-plane, extending rearward from the EFEM 200. As discussed further below, a buffer module defining the buffer stack can be provided. The wafer conveying module and the buffer module are aligned in the single directional axis 270.

[0133] Continue to refer Figure 2, the buffer stack 242 is defined in a position between the wafer conveyor modules 102 and 212 and the processing modules 106 and 214. The lateral protrusions 252 of the wafer conveyor assembly 209, which accommodate and define the position of the buffer stack 242, extend laterally beyond the lateral side portions 256 and 254 that interface with the adjacent processing modules 214 and 106, respectively. Additional lateral protrusions of the wafer conveyor assembly accommodate and define the position of additional buffer stacks and are similarly configured relative to their corresponding processing modules. For example, the lateral protrusion 262 is located between the wafer conveyor modules 212 and 218 and the processing modules 214 and 220. The lateral protrusion 262 is configured to define the position of the buffer stack 246.

[0134] In some embodiments, the wafer transport assembly is configured so that the outer edge of the wafer, when placed on the buffer stack, extends laterally at least to a plane defined by the openings of adjacent gate valves. In some embodiments, the outer edge of the wafer, when positioned on the buffer stack, extends laterally beyond such a plane. The further the buffer stacks are laterally positioned, the closer adjacent wafer transport modules can be positioned to each other; however, the wider the wafer transport assembly 209 will become.

[0135] In terms of the architectural concept of the wafer conveyor assembly, the position of the buffer stack is placed laterally outward, which makes the wafer conveyor modules closer to each other. This reduces the overall length of the wafer conveyor assembly from front to back. In some embodiments, for a wafer conveyor assembly with three wafer conveyor modules and four buffer stacks (without the optional buffer stacks 248 and 250), the length of the wafer conveyor assembly from front to back is about 10 to 11 feet (about 3 to 3.3 meters). In some embodiments, for a wafer conveyor assembly with two wafer conveyor modules and two or four buffer stacks, the length of the wafer conveyor assembly from front to back is about 6 to 8 feet (about 1.8 to 2.4 meters).

[0136] In view of the location of the buffer stack, and more specifically, the protruding location of the lateral portion of the wafer transport assembly that accommodates the buffer stack, the corner areas of the process modules closest to the buffer stack are cut away or rounded. Figure 2 For example, the corner region 258 of the process module 106 is cut away to accommodate the protrusion of the lateral side portion 252 of the wafer handling assembly. Similarly, the corner region 260 of the process module 214 is also cut away to accommodate the protrusion of the lateral side portion 252. The corner regions of the additional process modules closest to the buffer stack are similarly configured to accommodate the lateral protrusion of the lateral side portion of the wafer handling assembly defined to accommodate the buffer stack.

[0137] It should be appreciated that the cut-off corner regions of the processing modules allow the processing modules to be located closer to their respective wafer transport modules than would otherwise be possible given the arrangement of buffer stacks in the wafer transport assembly 209. This reduces the lateral space requirements of the cluster tool system, thereby providing more efficient space utilization in the manufacturing facility. Overall, the arrangement of the buffer stacks, the configuration of the lateral sides of the wafer transport assembly, and the cut-off configuration of the corner regions of the processing modules together provide a very compact cluster tool architecture that also provides great flexibility in wafer handling, storage, and transport in a controlled environment.

[0138] Figure 3A is a perspective view of a wafer conveying assembly according to an embodiment of the present disclosure. In the illustrated embodiment, the wafer conveying assembly 209 includes two parts, which are assembled with each other to define the wafer conveying assembly 209 as shown. The first part of the wafer conveying assembly 209 is defined as including the wafer conveying modules 102 and 212, and the buffer stacks 240 and 242 defined between the wafer conveying modules 102 and 212. The first part can be modularly assembled by the wafer conveying modules 102 and 212 in combination with the buffer modules (located between the wafer conveying modules) that define the buffer stacks 240 and 242. It should be understood that the wafer conveying module and the buffer module are aligned along a single directional axis 270. The second part of the wafer conveying assembly 209 is defined as including the wafer conveying module 218 and the buffer stacks 244 and 246 defined between the wafer conveying modules 212 and 218. The second buffer module can be configured to define the buffer stacks 244 and 246, and the wafer conveying module 218 and the second buffer module are aligned along a single directional axis 270. Although in Figure 3A Not shown, but an optional third section may be connected to the rear end of the second section, the third section being a (third) buffer module which defines buffer stacks 248 and 250 and is also aligned along a single directional axis 270 .

[0139] The modular configuration shown and described thus allows the wafer conveyor assembly to be configured to have two or three wafer conveyor modules and to have one, two, or three pairs of buffer stacks. In a basic configuration, the wafer conveyor assembly can be defined to include only the first portion and, therefore, will have two wafer conveyor modules and two buffer stacks. In some implementations, the basic configuration is designed to fit within a SEMI E72 compliant elevator for ease of movement into a manufacturing facility. In another configuration, a buffer module can be added to the basic configuration to add two additional buffer stacks (for a total of four buffer stacks). In another configuration, the second portion described above can be connected to the first portion to define a configuration such as Figure 3AA wafer conveyor assembly is shown having three wafer conveyor modules and four buffer stacks. In yet another configuration, buffer modules may then be added to provide a wafer conveyor assembly having three wafer conveyor modules and six buffer stacks.

[0140] In the illustrated embodiment, a first cover plate 300 defines a top portion of a first portion of the wafer conveyor assembly 209. The first cover plate 300 includes window frames 302 and 304 that enable visual inspection of the interior of the wafer conveyor assembly and can be opened to provide access to the interior. A second cover plate 306 defines a top portion of a second portion of the wafer conveyor assembly 209. The second cover plate 306 also includes a window frame 308 that also enables visual inspection of the interior and can be opened to provide access to the interior.

[0141] The wafer conveyor assembly 209 is thus also described as comprising a number of modular components. The modular assembly of the wafer conveyor assembly is convenient for configuration to suit a particular cluster tool setting, and also for servicing and / or replacing individual modules. In addition, the assembly / disassembly of the modules facilitates movement into or out of a given manufacturing facility location. It should be understood that when fully assembled, the various modules of the wafer conveyor assembly 209 together define a housing that defines an interior area that is continuous and maintained as a controlled environment. The housing contains various component parts of the wafer conveyor assembly 209, including the robot and the buffer stack.

[0142] Positioned at the front end of the wafer transport assembly 209 is a load lock module 208. The load lock module 208 controls access to and from the wafer transport assembly 209, facilitating transfer of wafers between the laboratory ambient conditions of the EFEM and the vacuum or controlled ambient conditions of the wafer transport assembly 209. In some implementations, the load lock module 208 is a dual unit, that is, the load lock module 208 includes two separate load lock slots that are independently controlled to allow two separate wafers to be loaded and / or unloaded from the wafer transport assembly 209 simultaneously. The time required to empty the load lock slots (e.g., when a wafer is moved from the ambient conditions of the EFEM into the vacuum conditions of the wafer transport assembly) and / or fill the load lock slots (e.g., when a wafer is moved from the vacuum conditions of the wafer transport assembly into the ambient conditions of the EFEM) is time consuming and can be a limiting factor in the ability of the cluster tool system to process wafers. Therefore, it is desirable to provide more than one load lock slot to allow multiple wafers to enter and / or exit the wafer transport assembly 209 simultaneously.

[0143] Figure 3B Shows Figure 3A2 is a perspective view of a wafer conveyor assembly according to an embodiment of the present disclosure without a cover plate installed to provide a view of the interior of the wafer conveyor assembly. As can be seen, the first portion 310 of the wafer conveyor assembly 209 includes buffer stacks 240 and 242, and the robot 224 (the robot 102 is in Figure 3B The robot 224 includes an end effector 314 configured to engage and support a wafer for handling the wafer by the robot. A second portion 312 of the wafer transport assembly is shown, which includes a buffer stack 244 (buffer stack 246 in Figure 3B ) and the end effector 316 of the manipulator 226.

[0144] Figure 4A A perspective view of a wafer conveying module according to an embodiment of the present disclosure is shown. For ease of description and understanding of the context of the wafer conveying assembly, the wafer conveying module 102 is described. However, it should be understood that the description also applies to the wafer conveying modules 212 and 218 of the wafer conveying assembly 209. The wafer conveying assembly 209 can be defined by modular components that can be assembled or disassembled for ease of configuration and to facilitate repair and replacement of individual components when necessary. In the illustrated embodiment, an internal view of the wafer conveying module 102 is provided, wherein the robot 222 is shown, which includes an end effector 400 configured to engage and support a wafer carried by the robot 222.

[0145] Also visible is a gate valve 230 that controls an opening into the process module 106. The gate valve 230 can be opened for transfer of wafers between the wafer transport module 102 and the process module 106 (e.g., for loading or unloading wafers into or from the process module), or the gate valve 230 can be closed to isolate the process module 106 from the wafer transport module 102 (e.g., during wafer processing). The gate valve 230 is defined along a lateral side 402 of the wafer transport module 102. The lateral side 402 of the wafer transport module 102 is configured for connection to the process module 106. The lateral side 402 of the wafer transport module 102 can further include a sealing mechanism 404 that is configured to form an airtight seal when the process module 106 is connected to the wafer transport module 102. For example, but not limitation, the sealing mechanism 404 can be defined by a gasket, a corresponding groove and slot, and / or any other type of mechanism that can achieve an airtight seal when the process module 106 is connected to the wafer transport module 102.

[0146] Continue to refer to Figure 4A , also shown is a back side 406 (facing away from the EFEM 200) of the wafer transport module 102, which is configured to be connected to a buffer module 410 (at Figure 4B). The back side 406 of the wafer transport module 102 may also include a sealing mechanism 408 configured to provide an airtight seal when the buffer module 410 is connected to the wafer transport module 102.

[0147] In some embodiments, such as for wafer conveyor modules 212 or 218, instead of a buffer module, a rear cover plate can be connected to the rear side of the wafer conveyor module, thereby defining the rear side of the wafer conveyor assembly in such embodiments. The modular assembly thus described provides a system architecture of alternating wafer conveyor modules and buffer modules, which can be continuously assembled or disassembled to define the desired structure of the wafer conveyor assembly.

[0148] Figure 4B 1 shows a perspective view of a wafer delivery module 102 with a buffer module 410 connected thereto according to an embodiment of the present disclosure. Figure 4B The buffer module 410 is connected to the back side 406 of the wafer handling module 102 (not visible in FIG. 1 ), so that an airtight seal is formed between the modules. The back side 412 of the buffer module 410 is further configured for connection to another wafer handling module or a back cover plate. The back side 412 of the buffer module 410 may include a sealing mechanism 414 configured to form an airtight seal with an adjacent wafer handling module or a back cover plate.

[0149] The buffer module 410 defines buffer stacks 240 and 242 that are configured to store a plurality of wafers. The lateral ends of the buffer modules define side protrusions of the wafer conveying assembly described above. The buffer stacks share the same controlled environment defined for the wafer conveying module. This provides advantages because the wafers can be buffered and stored in the controlled environment of the system without having to be transferred outside the system. This helps to limit exposure to possible contaminants and also avoids the circulation of wafers through different environments. For example, wafers that have been processed under vacuum conditions and subsequently subjected to environmental conditions may react with the surrounding gas or be exposed to contaminants or particles. Therefore, the arrangement of the buffer stack within the controlled environment of the wafer conveying system provides a wafer storage location to avoid such potential adverse effects.

[0150] Each buffer stack defines a plurality of wafer storage slots, wherein each wafer storage slot is configured to store a single wafer (e.g., wafer 420). In the illustrated embodiment, the wafer storage slots of the buffer stack 240 are defined by a support arm 416 configured to support the wafer in the buffer stack. In addition, there may be a separator defined to separate the wafer storage slots from each other. It should be understood that in various embodiments, the number and arrangement of the separators and the wafer storage slots (defined by the support arms) can vary. In the illustrated embodiment, the buffer stack 240 is shown, and it has separators 418a, 418b, and 418c that separate four pairs of wafer storage slots. The buffer stack 240 as shown therefore includes a total of eight wafer storage slots. The buffer stack 242 is similarly configured to have eight wafer storage slots, wherein four pairs of wafer storage slots are separated by three separators.

[0151] Figure 5 A cross-sectional view of a buffer stack 500 according to an embodiment of the present disclosure is conceptually shown. The buffer stack 500 includes an upper portion 502 having wafer storage slots separated from each other by physical partitions, and a lower portion 504 having wafer storage slots that are not separated from each other by physical partitions. A given wafer storage slot is defined by a set of support arms 508 configured to support a wafer (e.g., wafer 510) stored in a given wafer storage slot. The wafer storage slots of the upper portion 502 are separated from each other by separators 506a, 506b, and 506c, and the upper portion 502 is separated from the lower portion 504 by separator 506d. The separators define physical partitions between adjacent wafer storage slots.

[0152] In some embodiments, the wafer storage slots in the upper portion 502 may be used to store wafers that may be more sensitive or more susceptible to contamination, while the wafer storage slots in the lower portion 504 may be used to store wafers that are less sensitive or less susceptible to contamination. In some embodiments, the lower portion 504 may be used to store wafers that are reused in the cluster tool system (e.g., cover wafers or seasoning wafers).

[0153] Cover wafers are used to cover the chucks of processing modules during chamber maintenance operations (e.g., in-situ cleaning). In conventional systems, cover wafers are typically stored outside of the wafer conveyor assembly under laboratory ambient conditions. This requires a given cover wafer to enter the wafer conveyor assembly through an airlock each time the cover wafer is to be used, which can be a source of unwanted particles in the system. This can be particularly problematic when cover wafers are used frequently (e.g., each batch). When cover wafers are used, the cover wafers are etched, and repeatedly conveying them in and out of the wafer conveyor assembly through load locks is a source of particles, which may ultimately reduce production or require more frequent maintenance / cleaning. Therefore, it is advantageous to store the cover wafers in the wafer conveyor assembly (e.g., under vacuum conditions) so that the cover wafers are not affected by the pressure cycles generated by moving them in and out of the wafer conveyor assembly, as this will reduce the amount of contaminants entering the system.

[0154] In addition, in some embodiments, the chemicals used for chamber cleaning can be corrosive when exposed to atmosphere / moisture. For example, when using chlorine-based chemicals, a cover wafer stored in a vacuum may have relatively non-volatile chlorides on its surface. However, if the cover wafer is transported out of the wafer transport assembly into the atmosphere, the chlorides can react with moisture in the air and may outgas and cause corrosion. Therefore, by storing the cover wafer in a vacuum in a buffer stack as described, this problem is avoided and the useful life of the cover wafer can be extended.

[0155] It should be understood that the above discussion regarding capping wafers and particle generation / corrosion also applies to seasoning wafers that are utilized to burn out in a chamber. Figure 5 In the embodiment illustrated in the figure, the lower portion of the buffer stack without physical partitions separating the wafer storage slots may be reserved and / or used to store cover wafers or aged process wafers, while the upper portion of the buffer stack (which may have physical partitions separating the individual wafer storage slots) is reserved and / or used to store wafers undergoing processing operations in the cluster tool system. However, it should be understood that in other embodiments, cover or aged process wafers may be stored in any given wafer storage slot (or portion of a wafer storage slot) in a buffer stack having any particular configuration of wafer storage slots and separators.

[0156] In some embodiments, the entire buffer stack may be retained and / or used to store cover / aging process wafers. Figure 2 In some embodiments, buffer stack 248 and / or buffer stack 250 may be configured for storing cover wafers / seasoning wafers, thereby providing a dedicated buffer stack or stacks for this purpose.

[0157] Figure 6A cross-sectional view of a portion of a buffer module showing a buffer stack according to an embodiment of the present disclosure is shown. The buffer stack 600 is similar to Figure 5 610a, 610b, 610c, and 610d, and a lower portion 604 having wafer storage slots 612a, 612b, and 612c. The wafer storage slots 610a-d are separated by separators 606a, 606b, 606c, and 606d, respectively, while the wafer storage slots 612a-c are not separated individually by physical separators. In some embodiments, the wafer storage slots 612a-c of the lower portion 604 are reserved and / or used to store cover wafers, aged process wafers, or any other type of wafers that are reused in a process module.

[0158] The buffer stack 600 also includes a wafer storage slot 615 located below the lower portion 604 and separated from the lower portion 604 by a separator 614. The wafer storage slot 615 includes a wafer orienter 616 capable of supporting and rotating the wafer placed thereon. It should be understood that, according to an embodiment of the present disclosure, when a given wafer is conveyed through the wafer conveying assembly, the rotational direction of the wafer will change. For some processing modules, it may be desirable to place the wafer into the processing module in a specific rotational direction. Therefore, it is useful to have a wafer orienter integrated into the buffer stack to rotate a given wafer so that it will have a specific rotational direction desired by the processing module. In some embodiments, the wafer orienter 616 also includes an actuator 618 extending below the main housing of the buffer module 410. The actuator 618 is configured to drive the rotation of the wafer orienter 616.

[0159] Figure 7 A cluster tool system according to an embodiment of the present disclosure is shown, highlighting the orientation of the wafer as it moves through the various components of the system. The system shown is similar to Figure 2 An embodiment of the present invention includes wafer conveyor modules 102, 212 and 218 and buffer stacks 240, 242, 244 and 246 that collectively define a wafer conveyor assembly.

[0160] In the illustrated embodiment, the buffer stacks are tilted 33 degrees. That is, the center of each buffer stack is offset 33 degrees from a vector defined by the center of an adjacent wafer transport module to the center of another adjacent wafer transport module. For example, if a vector is defined from the center of wafer transport module 102 to the center of wafer transport module 212, the centers of buffer stacks 240 and 242 are each offset 33 degrees from such vector. In the absence of any active rotation of a given wafer within the system, since the buffer stacks are tilted, the rotational direction of the wafer will change as the wafer moves through the buffer stacks, and the rotational direction of the wafer may be different from one process module to the next.

[0161] Continue to refer Figure 7 , a wafer 700 having a notch is additionally shown, the location of the notch being conceptually shown by the point shown at the mark 702. For example, in the illustrated embodiment, the wafer 700 is shown entering the wafer conveyor assembly through the airlock 208, with the wafer 700 at this stage having its notch aligned in the longitudinal direction toward the rear of the wafer conveyor assembly. From this position, when the wafer 700 is moved into the processing module 106 by the wafer conveyor module 102, the wafer is then rotated 90 degrees counterclockwise so that the notch becomes positioned in the lateral direction toward the opening of the processing module 106. In some embodiments, this is the desired orientation for the wafer when the wafer is in the processing module 106, and therefore no additional rotation of the wafer is required, nor is reconfiguration of the processing module required. In subsequent processing in the processing module 106, the wafer 700 can be moved to the buffer stack 242 by the wafer conveyor module 102, which causes the wafer to rotate an additional 57 degrees counterclockwise. It should be appreciated that as the kerf is carried by the wafer transport module 102 and moved between any two of the load lock 208 , the process modules 100 or 106 , and the buffer stacks 240 or 242 , the kerf is oriented toward the center of the wafer transport module 102 .

[0162] If the wafer 700 is moved from the buffer stack 242 to the processing module 214 by the wafer transfer module 212, the wafer 700 is rotated an additional 57 degrees counterclockwise. This means that the cut is offset 114 degrees counterclockwise from the vector defined by the center of the wafer 700 to the center of the wafer transfer module 212. When the desired orientation of the wafer 700 for the processing module 214 may not deviate from the defined vector, then rotation of the wafer 700 may be desirable prior to entering the processing module 214. For example, a wafer orienter integrated into the buffer stack 242 may be configured to rotate the wafer 700 114 degrees in a clockwise direction so that the wafer 700 is aligned in the desired orientation when the wafer is transferred into the processing module 214.

[0163] In a similar manner, if the wafer 700 as shown is moved from the buffer stack 242 into the processing module 210, the wafer 700 is rotated 123 degrees clockwise. This may again result in the wafer orientation being 114 degrees counterclockwise from the desired orientation of the processing module 210. Similarly, the wafer orienter integrated into the buffer stack 242 may be configured to rotate the wafer 700 114 degrees clockwise so that the wafer 700 is aligned in the desired orientation (with the cutout oriented toward the center of the wafer transport module 212) when the wafer is delivered to the processing module 210.

[0164] If the wafer 700 as shown is then moved by the wafer transport module 212 from the processing module 214 to the buffer stack 246, the wafer 700 is rotated 57 degrees clockwise. It should be understood that if the wafer 700 as shown is moved by the wafer transport module 212 from the buffer stack 242 or the processing module 210 to the buffer stack 246, the wafer 700 will achieve the same orientation. If the wafer 700 is then moved by the wafer transport module 218 from the buffer stack 246 to the processing module 220, the wafer 700 will be rotated an additional 57 degrees, which means that the direction of the cut will deviate 132 degrees clockwise from the vector defined by the center of the wafer 700 to the center of the wafer transport module 218. If the wafer 700 is moved by the wafer transport module 218 from the buffer stack 246 to the processing module 216, the wafer 700 will be rotated 123 degrees clockwise, which again means that the direction of the cut will deviate 132 degrees clockwise from the vector defined by the center of the wafer 700 to the center of the wafer transport module 218. A wafer orienter may be included in the buffer stack 246 to rotate the wafer as needed during processing to ensure an optimal rotational orientation when the wafer is delivered to the processing module.

[0165] Although in the foregoing discussion, the buffer stack is described as being tilted at 33 degrees, it should be understood that in other implementations, the buffer stack is tilted at an angle in the range of about 30 to 35 degrees. In still other implementations, the buffer stack is tilted at an angle in the range of about 25 to 40 degrees. The concepts discussed above regarding rotation of wafers during transport in the system apply regardless of the specific angle of tilt of the buffer stack, and the specific orientation of the wafer at any given location in the system will be apparent to those skilled in the art.

[0166] In embodiments of the present disclosure, a wafer transport assembly may include a number of buffer stacks that may be configured for a variety of purposes and that help provide productivity advantages over prior art systems. Buffer stacks may be used to define the path of wafers. For example, in some embodiments, at least some of the wafer storage slots in at least some of the buffer stacks in a given wafer transport assembly are configured so that wafers move only once through a given buffer stack. In some embodiments, the system is configured so that wafers enter a given buffer stack from one side and exit the buffer stack from another side. For example, continuing with reference to Figure 7 , the buffer stack 242 may be configured such that wafers enter from the side of the buffer stack 242 facing the wafer conveyor module 102 (the side facing forward) and exit from the side facing the wafer conveyor module 212 (the side facing backward). In this manner, wafers are moved from the wafer conveyor module 102 to the wafer conveyor module 212 via conveyance in a one-way manner through the buffer stack 242. By moving wafers through the buffer stack in a one-way manner, wafers are not returned to the same buffer stack, and the possibility of cross contamination from different processes is reduced.

[0167] Extended reference Figure 7 Buffer stacks 242 and 246 may be configured such that wafers move through each of them from the forward facing side to the rearward facing side, while buffer stacks 244 and 240 are configured such that wafers move through each of them in the opposite manner from the rearward facing side to the forward facing side. Conceptually, the wafer transport module and buffer stacks thus define a path for wafers to pass through a wafer transport assembly and / or cluster tool system.

[0168] By way of non-limiting example, the path of the wafer can be defined as for the wafer 700 from the load lock 208 to the wafer conveyor module 102, to the buffer stack 242, to the wafer conveyor module 212, to one of the processing modules 210 or 214, to the wafer conveyor module 212, to the buffer stack 240, to the wafer conveyor module 102, to the load lock 208.

[0169] As another example, the path of the wafer can be defined as for the wafer 700 from the load lock 208 to the wafer conveyor module 102, to the buffer stack 242, to the wafer conveyor module 212, to the buffer stack 246, to one of the processing modules 216 or 220, to the wafer conveyor module 218, to the buffer stack 244, to the wafer conveyor module 212, to the buffer stack 240, to the wafer conveyor module 102, to the load lock 208.

[0170] In some embodiments, certain buffer stacks are designated as input buffer stacks for temporarily storing wafers that are to be transported to a processing module for processing, while other buffer stacks are designated as temporarily storing wafers that have been processed and are to be shipped out of the system. For example, in the illustrated embodiment, buffer stacks 242 and 246 may be designated as input buffer stacks, while buffer stacks 240 and 244 may be designated as output buffer stacks. This allows the input path of the wafers to be separately defined from the output path of the wafers, which may help avoid cross contamination and traffic jams.

[0171] The above discussion of the use of paths and buffer stacks is provided by way of non-limiting examples. It should be understood that the buffer stacks of the present invention defined in the same controlled environment (e.g., vacuum) as the wafer transport module can be flexibly deployed and utilized in any suitable manner to achieve efficient storage and movement of wafers through the cluster tool system.

[0172] Figure 8 A cross-sectional view of a portion of a cluster tool system according to an embodiment of the present disclosure is shown. In the illustrated embodiment, a pair of load locks 800 and 802 are arranged in a side-by-side configuration and connected between the wafer delivery module 102 and the EFEM 200. Each of the load locks 800 and 802 can be a dual-slot load lock, each having two slots that can be used for wafer transfer between the EFEM and the wafer delivery module 102. In this configuration, the load locks together provide the ability to carry four wafers simultaneously. In some embodiments, one of the load locks can be used to allow a wafer to enter the wafer delivery assembly, while one of the load locks can be used to allow a wafer to leave the wafer delivery assembly.

[0173] Fig. 9 The structure of a load lock and an integrated post-processing module according to an embodiment of the present disclosure is conceptually illustrated. Load locks 800 and 802 are arranged in a side-by-side configuration. Load lock 800 includes slots 900 and 902, and load lock 802 includes slots 904 and 906, each slot being configured for conveying a wafer into or out of a wafer conveyor assembly.

[0174] In addition, post-processing modules 908 and 910 are stacked vertically with the load locks 800 and 802, respectively. In various embodiments, the post-processing modules can be configured to perform post-processing operations on the processed wafers, such as stripping operations or passivation operations. In the illustrated embodiment, the post-processing modules 908 and 910 are located above the load locks 800 and 802, respectively, but in other embodiments, the post-processing modules 908 and 910 can be located below the load locks 800 and 802, respectively. The post-processing modules 908 and 910 can be configured to perform stripping or passivation operations on the processed wafers before the processed wafers leave the wafer conveyor assembly. The post-processing modules 908 and 910 open to the interior of the wafer conveyor assembly.

[0175] So, for example, refer to Figure 2 In the system, the processed wafers can be placed into one of the post-processing modules via the wafer transport module 102. After the post-processing (such as stripping or passivation) operation is completed, the wafers are removed from the post-processing module via the wafer transport module 102 and placed into a wafer slot of one of the load locks 800 or 802 to be transported out of the wafer transport assembly 209 to the EFEM 200.

[0176] It should be appreciated that embodiments of the present disclosure may be applied to any of a variety of sized substrates, including 200 mm, 300 mm, and 450 mm substrates, as well as substrates of non-standard sizes and shapes, including square substrates.

[0177] Fig.10 A control module 1000 for controlling the above-described system is shown. For example, the control module 1000 may include a processor, a memory, and one or more interfaces. The control module 1000 may be employed to control devices in the system according to predetermined programming and based in part on sensed values, the devices including any of the above-described components of the cluster tool system, including but not limited to EFEM, load locks, post-processing modules, wafer transport modules, wafer orienters, and processing modules. It should be understood that according to embodiments of the present disclosure, the control module 1000 may control any type of operation in which a given component is defined or capable of performing.

[0178] By way of example only, the control module 1000 may control one or more of the valve 1002, actuator 1004, pump 1006, RF generator 1022, and other devices 1008 based on sensed values, predetermined programming / instructions, and other control parameters. The control module 1000 receives sensed values ​​from, by way of example only, a pressure gauge 1010, a flow meter 1012, a temperature sensor 1014, and / or other sensors 1016.

[0179] With respect to a given process module, the control module 1000 may also be employed to control process conditions during reactant / precursor delivery and plasma processing. The control module 1000 will typically include one or more memory devices and one or more processors.

[0180] Control module 1000 can control the activity of reactant / precursor transport system and plasma treatment device.Control module 1000 executes computer program, and described computer program comprises the instruction set of other parameters for controlling processing timing, transport system temperature, pressure difference across filter, valve position, gas mixture, chamber pressure, chamber temperature, wafer temperature, RF power level, wafer chuck or pedestal position and specific process.Control module 1000 can also monitor pressure difference, and automatically switches gas phase precursor transmission from one or more paths to other one or more paths.Other computer programs stored in memory device associated with control module 1000 can be adopted in some embodiments.

[0181] There will typically be a user interface associated with the control module 1000. The user interface may include a display 1018 (e.g., a display screen, and / or a graphical software display of plant and / or process conditions), and a user input device 1020 (e.g., a pointing device, keyboard, touch screen, microphone, etc.).

[0182] Computer programs for controlling precursor delivery, plasma treatment and other processes in a process sequence can be written in any conventional computer-readable programming language (e.g., assembly language, C, C++, Pascal, Fortran or other languages). The compiled object code or script is executed by a processor to perform the tasks identified in the program.

[0183] Control module parameters relate to process conditions such as, for example, filter pressure differential, process gas composition and flow rate, temperature, pressure, plasma conditions (eg, RF power level and low frequency RF frequency), cooling gas pressure, and chamber wall temperature.

[0184] The system software can be designed or configured in many different ways. For example, various chamber component subroutines or control objects can be written to control the operation of the chamber components required to implement the inventive deposition process. Examples of programs or portions of programs for this purpose include substrate positioning code, process gas control code, pressure control code, heater control code, and plasma control code.

[0185] The substrate positioning program may include program code for controlling chamber components, which are used to load the substrate onto a pedestal or chuck and control the spacing between the substrate and other parts of the chamber (e.g., a gas inlet and / or a target). The process gas control program may include code for controlling gas composition and flow rate and optionally for flowing gas into the chamber to stabilize the pressure in the chamber before deposition. The filter monitoring program includes code for comparing one or more measured differences with one or more predetermined values ​​and / or code for switching paths. The pressure control program may include code for controlling the pressure in the chamber by adjusting, for example, a throttle valve in the exhaust system of the chamber. The heater control program may include code for controlling the current flowing to a heating unit for heating components of a precursor delivery system, substrates, and / or other parts of the system. Alternatively, the heater control program may control the delivery of a heat transfer gas (e.g., helium) to a wafer chuck.

[0186] Examples of sensors that may be monitored during processing include, but are not limited to, mass flow control modules, pressure sensors (such as pressure gauge 1010), and thermocouples located in the transport system, pedestal or chuck (e.g., temperature sensor 1014). Appropriately programmed feedback and control algorithms and data from these sensors may be used to maintain desired process conditions. The foregoing describes the implementation of embodiments of the present invention in single or multiple chamber semiconductor processing tools.

[0187] For the purpose of illustration and description, the foregoing description of the embodiments has been provided. This is not intended to be exhaustive or limit the present invention. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but are interchangeable when applicable and can be used in a selected embodiment, even if not specifically shown or described. The same approach can also be varied in many ways. Such variations should not be considered to be out of the present invention, and all such modifications are intended to be included within the scope of the present invention.

[0188] Although the foregoing embodiments have been described in some detail for the purpose of clear understanding, it is obvious that certain changes and modifications may be implemented within the scope of the appended claims. Therefore, the embodiments of the present invention should be considered illustrative rather than restrictive, and the embodiments are not limited to the details given herein, but may be modified within the scope and equivalent scheme of the claims.

Claims

1. A cluster tool system for processing wafers, comprising: a wafer transport assembly extending along a longitudinal axis of the cluster tool system; at least two process modules coupled to the wafer conveyor assembly along lateral sides of the wafer conveyor assembly, the wafer conveyor assembly being configured to convey wafers to and from the at least two process modules coupled along the lateral sides; An inspection tunnel is defined below the wafer conveyor assembly, the inspection tunnel extending along the longitudinal axis of the cluster tool system, the vertical dimension of the inspection tunnel being defined between a bottom surface of the wafer conveyor assembly and an inspection level positioned below the wafer conveyor assembly.

2. The cluster tool system according to claim 1, wherein: The access level is at a height lower than a level of a fabrication facility level in which the cluster tool system is disposed.

3. The cluster tool system according to claim 2, wherein: The height of the access floor is 1 to 2 feet lower than the height of the manufacturing facility floor.

4. The cluster tool system according to claim 1, wherein: The wafer conveyor assembly includes at least two wafer conveyor modules coupled to each other along a longitudinal axis, wherein each of the wafer conveyor modules is coupled to one of the process modules coupled along a lateral side of the wafer conveyor assembly.

5. The cluster tool system according to claim 4, further comprising: At least two process module frames are configured to support the at least two process modules coupled along the lateral sides of the wafer transport assembly and are further configured to rest on a fabrication facility floor.

6. The cluster tool system according to claim 1, wherein: The wafer conveyor assembly has a front end oriented toward the equipment front end module, and the wafer conveyor assembly has a rear end opposite the front end.

7. The cluster tool system according to claim 6, wherein: The service tunnel extends along the longitudinal axis from a front end of the wafer conveyor assembly to a rear end of the wafer conveyor assembly.

8. A cluster tool system according to claim 6, wherein the front end of the wafer conveying assembly is configured to be connected to a loading lock, which controls the passage to and from the equipment front end module, and wherein the front end of the maintenance tunnel substantially extends to the equipment front end module.

9. A cluster tool system according to claim 6, wherein a step device is defined at the rear end of the maintenance tunnel, the rear end of the maintenance tunnel is basically defined below the rear end of the wafer conveying assembly, and the step device is configured to define a path from the manufacturing facility level downward to the maintenance level.

10. The cluster tool system according to claim 1, wherein: The height of the inspection tunnel is 6 feet to 8 feet.

11. The cluster tool system according to claim 1, wherein: The lateral sides of the access tunnel provide access to the process modules coupled along the lateral sides of the wafer transport assembly.

12. The cluster tool system of claim 11, wherein the lateral sides of the access tunnel provide access to one or more gas boxes of the process modules defined for coupling along the lateral sides of the wafer transport assembly.

13. The cluster tool system according to claim 1, wherein: The maintenance tunnel complies with the SEMI E72 standard.

14. A cluster tool system for processing a wafer, comprising: a wafer transport assembly extending along a longitudinal axis of the cluster tool system; one or more process modules coupled to the wafer conveyor assembly along a first lateral side of the wafer conveyor assembly, the wafer conveyor assembly configured to transport wafers to and from the one or more process modules coupled along the first lateral side; one or more process modules coupled to the wafer conveyor assembly along a second lateral side of the wafer conveyor assembly, the wafer conveyor assembly configured to transport wafers to and from the one or more process modules coupled along the second lateral side; An inspection tunnel is defined below the wafer conveyor assembly, the inspection tunnel extending along the longitudinal axis of the cluster tool system, the vertical dimension of the inspection tunnel being defined between a bottom surface of the wafer conveyor assembly and an inspection level positioned below the wafer conveyor assembly.

15. The cluster tool system according to claim 14, wherein: The wafer conveying assembly has a front end configured to be connected to a load lock, the wafer conveying assembly has a rear end opposite to the front end, and the maintenance tunnel extends from the front end of the wafer conveying assembly to the rear end of the wafer conveying assembly along the longitudinal axis of the cluster tool system.

16. The cluster tool system according to claim 14, wherein: The height of the access floor is defined to be lower than the height of the manufacturing facility floor where the cluster tool system is disposed, wherein the height of the access floor is 1 foot to 2 feet lower than the height of the manufacturing facility floor.

17. The cluster tool system according to claim 16, further comprising: one or more process module frames configured to support the one or more process modules coupled along a first lateral side of the wafer transport assembly and further configured to rest on the fabrication facility level; one or more process module frames configured to support the one or more process modules coupled along a second lateral side of the wafer transport assembly and further configured to rest on a fabrication facility level; The height of the maintenance tunnel is defined by the height of the maintenance layer and the height of the processing module frame, and the height of the maintenance tunnel is 6 feet to 8 feet.

18. A cluster tool system for processing a wafer, comprising: a wafer transport assembly extending along a longitudinal axis of the cluster tool system; one or more process modules coupled to the wafer conveyor assembly along a first side of the wafer conveyor assembly, the wafer conveyor assembly configured to transport wafers to and from the one or more process modules coupled along the first side; one or more process modules coupled to the wafer conveyor assembly along a second side of the wafer conveyor assembly, the wafer conveyor assembly configured to transport wafers to and from the one or more process modules coupled along the second side; An inspection tunnel is defined below the wafer conveyor assembly, the inspection tunnel extending along the longitudinal axis of the cluster tool system, the vertical dimension of the inspection tunnel being defined between a bottom surface of the wafer conveyor assembly and an inspection level positioned below the wafer conveyor assembly.

19. The cluster tool system according to claim 18, wherein: The wafer conveyor assembly has a front end configured for connection to a load lock, the wafer conveyor assembly has a rear end opposite the front end, and the maintenance tunnel runs along the longitudinal axis of the cluster tool system from the front end of the wafer conveyor assembly to the rear end of the wafer conveyor assembly.

20. The cluster tool system according to claim 18, wherein: The height of the access floor is defined to be lower than the height of the manufacturing facility floor where the cluster tool system is disposed, wherein the height of the access floor is 1 foot to 2 feet lower than the height of the manufacturing facility floor.

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