Composite electronic components and electronic circuits

Abstract

The present invention can reduce the reflection of common mode noise to the differential transmission line and can suppress the reduction of the transmission characteristics of the differential signal. The composite electronic component has: a main body including multiple insulating layers, a first input terminal, a second input terminal, a first output terminal, a second output terminal, a ground terminal, a first filter, a second filter, and a resistance pattern connected between the second filter and the ground terminal, the first filter has a first coil pattern connected between the first input terminal and the first output terminal, and a second coil pattern connected between the second input terminal and the second output terminal, the first coil pattern and the second coil pattern constitute a common mode filter, the second filter has a third coil pattern connected between the first input terminal and the ground terminal, and a fourth coil pattern connected between the second input terminal and the ground terminal, the third coil pattern and the fourth coil pattern constitute a differential mode filter, and the resistance pattern is located on an insulating layer different from the first coil pattern to the fourth coil pattern.

Description

Technical Field

[0001] The present invention relates to a composite electronic component and an electronic circuit. Background Art

[0002] Conventionally, a composite electronic component has a structure described in Japanese Patent No. 4312187 (Patent Document 1). The composite electronic component includes a common mode filter electrically connected in series between an input terminal and an output terminal, and a differential mode filter electrically connected in series between an input terminal and a ground terminal on the input terminal side of the common mode filter.

[0003] Patent Document 1: Japanese Patent No. 4312187

[0004] However, in the above-mentioned conventional composite electronic component, an attempt was made to provide a shunt line connected to a ground electrode via a differential mode filter and a ground terminal for a differential transmission line composed of a pair of signal lines in which a common mode filter is inserted, so that the common mode noise reflected by the common mode filter is not returned to the differential transmission line but introduced into the shunt line, thereby suppressing the influence of the common mode noise on the peripheral circuit via the differential transmission line.

[0005] However, the inventors of the present application have found that in the above-mentioned composite electronic component, the ground terminal as the terminal of the differential mode filter is directly connected to the ground electrode, and the characteristic impedance of the shunt line observed from the common mode noise does not match the characteristic impedance of the differential transmission line. Therefore, the common mode noise reflected by the common mode filter is not sufficiently guided to the shunt line, and the improvement of the influence on the peripheral circuit caused by the reflection of the above-mentioned common mode noise is limited.

[0006] In addition, although not mentioned in Patent Document 1, in the above-mentioned composite electronic component, the impedance of the differential mode filter also becomes smaller in the low-frequency range, so the low-frequency component of the differential signal input from the input terminal also flows into the shunt line side, and the transmission characteristics of the differential signal are reduced. Summary of the invention

[0007] Therefore, the present disclosure aims to provide a composite electronic component and an electronic circuit capable of reducing reflection of common mode noise on a differential transmission line and suppressing degradation of transmission characteristics of differential signals.

[0008] In order to solve the above-mentioned problems, a composite electronic component as one embodiment of the present disclosure includes:

[0009] A main body, formed by stacking a plurality of insulating layers in a stacking direction;

[0010] A first input terminal, a second input terminal, a first output terminal, a second output terminal and a ground terminal are arranged on the main body;

[0011] A first filter is disposed in the main body and is electrically connected in series between the first input terminal and the first output terminal and between the second input terminal and the second output terminal;

[0012] A second filter is disposed in the main body and is electrically connected in series between the first input terminal and the ground terminal and between the second input terminal and the ground terminal; and

[0013] a resistance pattern, disposed in the main body, and electrically connected in series between the second filter and the ground terminal,

[0014] The first filter has:

[0015] A first coil pattern electrically connected in series between the first input terminal and the first output terminal; and

[0016] The second coil pattern is electrically connected in series between the second input terminal and the second output terminal.

[0017] The first coil pattern and the second coil pattern constitute a common mode filter.

[0018] The second filter has:

[0019] a third coil pattern electrically connected in series between the first input terminal and the ground terminal; and

[0020] The fourth coil pattern is connected between the second input terminal and the ground terminal.

[0021] The third coil pattern and the fourth coil pattern constitute a differential mode filter.

[0022] The resistance pattern is located on the insulating layer different from the first coil pattern, the second coil pattern, the third coil pattern, and the fourth coil pattern.

[0023] According to the above method, the characteristic impedance of the shunt line can be adjusted by electrically connecting the resistor pattern in series between the second filter and the ground terminal. Therefore, for common mode noise, the characteristic impedance of the shunt line and the characteristic impedance of the differential transmission line are matched, so that the common mode noise can be fully guided to the shunt line.

[0024] In addition, according to the above method, since for the differential signal, the characteristic impedance of the shunt line deviates from the characteristic impedance of the differential transmission line by having a resistance pattern on the shunt line, even if the impedance of the second filter is reduced in the low-frequency range, the low-frequency component of the differential signal is difficult to transmit to the shunt line side, and the reduction in the transmission characteristics of the differential signal in the composite electronic component can be suppressed.

[0025] Furthermore, according to the above aspect, the common mode noise is dissipated by heat in the resistor pattern, and the noise itself can be removed.

[0026] In addition, since the resistance pattern is located on an insulating layer different from the first coil pattern, the second coil pattern, the third coil pattern and the fourth coil pattern, the resistance pattern can be set using a structure, material, and process different from those of the first coil pattern, the second coil pattern, the third coil pattern and the fourth coil pattern. For example, the resistivity of the resistance pattern can be increased independently of the coil pattern, thereby improving the design freedom of the composite electronic component.

[0027] In one embodiment of the composite electronic component,

[0028] The first coil pattern and the second coil pattern are located on different insulating layers.

[0029] When viewed from one side of the stacking direction,

[0030] The area enclosed by the first coil pattern at least partially overlaps with the area enclosed by the second coil pattern, and,

[0031] A winding direction of the first coil pattern from the first input terminal toward the first output terminal is the same as a winding direction of the second coil pattern from the second input terminal toward the second output terminal.

[0032] According to the above embodiment, since the area surrounded by the first coil pattern and the area surrounded by the second coil pattern at least partially overlap, the magnetic coupling between the first coil pattern and the second coil pattern can be further enhanced, and the effect of removing common mode noise is further improved.

[0033] In addition, since the area surrounded by the first coil pattern and the area surrounded by the second coil pattern at least partially overlap, the mounting area can be reduced. In addition, since the first coil pattern and the second coil pattern are located on different insulating layers, the insulation between the first coil pattern and the second coil pattern that generate a potential difference due to the flow of a differential signal can be improved.

[0034] In one embodiment of the composite electronic component,

[0035] The third coil pattern and the fourth coil pattern are located on different insulating layers.

[0036] When viewed from one side of the stacking direction,

[0037] The area enclosed by the third coil pattern at least partially overlaps with the area enclosed by the fourth coil pattern, and,

[0038] A winding direction of the third coil pattern from the first input terminal toward the ground terminal is opposite to a winding direction of the fourth coil pattern from the second input terminal toward the ground terminal.

[0039] According to the above embodiment, since the area surrounded by the third coil pattern and the area surrounded by the fourth coil pattern at least partially overlap, the magnetic coupling between the third coil pattern and the fourth coil pattern can be further enhanced, and the effect of transmission suppression of the differential signal is further improved. In addition, since the area surrounded by the third coil pattern and the area surrounded by the fourth coil pattern at least partially overlap, the installation area can be reduced.

[0040] In one embodiment of the composite electronic component,

[0041] The above resistance pattern has:

[0042] a first resistance pattern electrically connected in series between the third coil pattern and the ground terminal; and

[0043] The second resistance pattern is electrically connected in series between the fourth coil pattern and the ground terminal.

[0044] According to the above embodiment, since the resistor pattern includes the first resistor pattern and the second resistor pattern, a potential neutralization point where the differential signal has the same potential is not generated between the first input terminal and the second input terminal and the resistor pattern, and the transmission characteristics of the differential signal are further improved. In addition, according to the above, according to the difference in the way common mode noise and differential signal pass through the first resistor pattern and the second resistor pattern, the characteristic impedance of the shunt line for common mode noise and the characteristic impedance of the shunt line for differential signal can be easily adjusted.

[0045] In one embodiment of the composite electronic component, the first resistance pattern and the second resistance pattern are located on the same insulating layer.

[0046] According to the above embodiment, since the first resistance pattern and the second resistance pattern are located on the same insulating layer, it is possible to achieve a low-profile composite electronic component.

[0047] In one embodiment of the composite electronic component, the first coil pattern and the third coil pattern are located on the same insulating layer, and the second coil pattern and the fourth coil pattern are located on the same insulating layer.

[0048] According to the above embodiment, since the number of insulating layers can be reduced, the composite electronic component can be made low-profile, surface irregularities associated with multilayering can be reduced, strength and reliability can be improved, and the composite electronic component can be easily manufactured.

[0049] In one embodiment of the composite electronic component,

[0050] The above ground terminal has:

[0051] A first ground terminal electrically connected to the first resistance pattern; and

[0052] The second ground terminal is electrically connected to the second resistance pattern.

[0053] According to the above embodiment, since the ground terminal includes the first ground terminal and the second ground terminal, the generation of a potential neutralization point where the differential signals have the same potential can be suppressed on the shunt line side in the composite electronic component, thereby further improving the transmission characteristics of the differential signals.

[0054] In one embodiment of the composite electronic component, the resistance pattern has a meandering shape that meanders on the insulating layer.

[0055] According to the above embodiment, the line length of the resistance pattern can be extended, and the resistance value of the resistance pattern can be increased.

[0056] In one embodiment of the composite electronic component, the thickness of the resistance pattern is thinner than the thickness of each of the first to fourth coil patterns.

[0057] According to the above embodiment, the thickness of the resistance pattern can be reduced, and the resistance value of the resistance pattern can be increased.

[0058] In one embodiment of the electronic circuit, the electronic circuit includes:

[0059] The above composite electronic component;

[0060] a ground electrode electrically connected to the ground terminal of the composite electronic component; and

[0061] The capacitor is electrically connected in series between the ground terminal and the ground electrode of the composite electronic component.

[0062] According to the above embodiment, since the capacitor is inserted into the shunt line, the low-frequency component of the differential signal is less likely to be transmitted to the shunt line side, and the degradation of the transmission characteristics of the differential signal in the composite electronic component can be further suppressed.

[0063] According to the composite electronic component and the electronic circuit which are one embodiment of the present disclosure, it is possible to reduce reflection of common mode noise on a differential transmission line and suppress degradation of the transmission characteristics of a differential signal. BRIEF DESCRIPTION OF THE DRAWINGS

[0064] Figure 1 It is a perspective view showing a first embodiment of a composite electronic component.

[0065] Figure 2 It is an equivalent circuit diagram of complex electronic components and electronic circuits.

[0066] Figure 3A This is a partially exploded top view of a composite electronic component.

[0067] Figure 3B This is a partially exploded top view of a composite electronic component.

[0068] Figure 3C This is a partially exploded top view of a composite electronic component.

[0069] Figure 3D This is a partially exploded top view of a composite electronic component.

[0070] Figure 3E This is a partially exploded top view of a composite electronic component.

[0071] Figure 4 This is an equivalent circuit diagram showing a second embodiment of a composite electronic component and an electronic circuit. DETAILED DESCRIPTION

[0072] Hereinafter, a composite electronic component and an electronic circuit as one embodiment of the present disclosure will be described in detail by way of the illustrated embodiments. In addition, the drawings include some schematic structures and may not reflect actual dimensions and ratios.

[0073] (First Embodiment)

[0074] Figure 1 It is a perspective view showing a first embodiment of a composite electronic component. Figure 2 It is the equivalent circuit diagram of a composite electronic component. Figure 1 and Figure 2 As shown, the composite electronic component 1 includes a body 10 , a first input terminal 51 , a second input terminal 52 , a first output terminal 61 , a second output terminal 62 , a first ground terminal 71 , a second ground terminal 72 , a first filter 101 , a second filter 102 , a first resistor pattern 31 , and a second resistor pattern 32 .

[0075] The composite electronic component 1 is electrically connected to wiring of a circuit board (not shown) via input terminals 51, 52, output terminals 61, 62, and ground terminals 71, 72. The composite electronic component 1 is preferably used to remove common mode noise on a differential transmission line for transmitting digital signals, and is used in electronic devices such as personal computers, DVD players, digital cameras, TVs, mobile phones, automotive electronics, and medical / industrial machinery.

[0076] The first filter 101 is electrically connected between the first input terminal 51 and the first output terminal 61, and between the second input terminal 52 and the second output terminal 62. The second filter 102 is electrically connected between the first input terminal 51 and the first ground terminal 71, and between the second input terminal 52 and the second ground terminal 72 on the first input terminal 51 and the second input terminal 52 side of the first filter 101. The first resistor pattern 31 is electrically connected between the second filter 102 and the first ground terminal 71. The second resistor pattern 32 is electrically connected between the second filter 102 and the second ground terminal 72. The resistance values ​​of the first resistor pattern 31 and the second resistor pattern 32 are preferably 50Ω, respectively.

[0077] The first filter 101 includes a first coil pattern 21 connected to the first input terminal 51 and the first output terminal 61, and a second coil pattern 22 connected to the second input terminal 52 and the second output terminal 62. Inside the body 10, the direction in which the first coil pattern 21 is wound from the first input terminal 51 toward the first output terminal 61 and the direction in which the second coil pattern 22 is wound from the second input terminal 52 toward the second output terminal 62 are the same direction.

[0078] like Figure 2 As shown, if a signal of opposite phase to each of the first input terminal 51 and the second input terminal 52, i.e., a differential signal, is input, the magnetic flux generated in the first coil pattern 21 and the second coil pattern 22 cancel each other out. As a result, the impedance of the first filter 101 for the differential signal is reduced, and the differential signal can pass through the first filter 101. On the other hand, if a signal of the same phase as each of the first input terminal 51 and the second input terminal 52, i.e., common mode noise, is input, the magnetic flux generated in the first coil pattern 21 and the second coil pattern 22 are mutually enhanced. As a result, the impedance of the first filter 101 for the common mode noise is increased, and the common mode noise is suppressed from passing through the first filter 101. Therefore, the first filter 101 is a common mode filter composed of the first coil pattern 21 and the second coil pattern 22.

[0079] The second filter 102 has a third coil pattern 23 connected to the first input terminal 51 and the first ground terminal 71, and a fourth coil pattern 24 connected to the second input terminal 52 and the second ground terminal 72. In addition, the second filter 102 is connected to the first input terminal and the second input terminal at a stage earlier than the first filter 101 (on the first input terminal 51 and the second input terminal 52 side). Specifically, the wiring from the first input terminal 51 toward the first coil pattern 21 is branched in the middle and connected to the coil pattern 23, and the wiring from the second input terminal 52 toward the second coil pattern 22 is branched in the middle and connected to the coil pattern 24.

[0080] Thus, a differential transmission line composed of a pair of signal lines inserted into the first filter 101 as a common mode filter can be provided with a shunt line connected to the first ground electrode 83 and the second ground electrode 84 via the second filter 102 and the first ground terminal 71 and the second ground terminal 72. Inside the body 10, the winding direction from the first input terminal 51 of the third coil pattern 23 toward the first ground terminal 71 is opposite to the winding direction from the second input terminal 52 of the fourth coil pattern 24 toward the second ground terminal 72.

[0081] like Figure 2 As shown, if a signal of opposite phase to each of the first input terminal 51 and the second input terminal 52, i.e., a differential signal, is input, the magnetic flux generated in the third coil pattern 23 and the fourth coil pattern 24 mutually enhance each other. As a result, the impedance of the second filter 102 for the differential signal increases, and the differential signal is suppressed from passing through the second filter 102. On the other hand, if a signal of the same phase as each of the first input terminal 51 and the second input terminal 52, i.e., common mode noise, is input, the magnetic flux generated in the third coil pattern 23 and the fourth coil pattern 24 mutually cancel each other. As a result, the impedance of the second filter 102 for the common mode noise is reduced, and the common mode noise can pass through the second filter 102. Therefore, the second filter 102 is a differential mode filter composed of the third coil pattern 23 and the fourth coil pattern 24.

[0082] According to the composite electronic component 1, the characteristic impedance of the shunt line including the second filter 102 and the first and second resistor patterns 31 and 32 can be adjusted by electrically connecting the first and second resistor patterns 31 and 32 in series between the second filter 102 and the ground terminals 71 and 72. Therefore, with respect to common mode noise, the common mode noise can be sufficiently guided to the shunt line by matching the characteristic impedance of the shunt line and the characteristic impedance (e.g., 50Ω) of the differential transmission line.

[0083] In addition, according to the composite electronic component 1, for the differential signal, by having a first resistor pattern 31 and a second resistor pattern 32 on the shunt line, the characteristic impedance of the shunt line deviates from the characteristic impedance of the differential transmission line (for example, 50Ω), so even if the impedance of the second filter 102 is reduced in the low-frequency range, the low-frequency component of the differential signal is difficult to transmit to the shunt line side, and the reduction in the transmission characteristics of the differential signal in the composite electronic component can be suppressed.

[0084] Furthermore, according to the composite electronic component 1 , the common mode noise is thermally dissipated by the first resistance pattern 31 and the second resistance pattern 32 , and the noise itself can be removed.

[0085] In addition, in the composite electronic component 1, since the first resistor pattern 31 and the second resistor pattern 32 are provided as resistor patterns, a potential neutralization point (a connection portion of a pair of signal lines) where the differential signal becomes the same potential and disappears is not generated between the first input terminal 51 and the second input terminal 52 and the first resistor pattern 31 and the second resistor pattern 32, and the transmission characteristics of the differential signal are further improved. In addition, according to the above structure, the synthetic impedance of the first resistor pattern 31 and the second resistor pattern 32 in the shunt line can be changed according to the difference in the way common mode noise and differential signal pass through the first resistor pattern 31 and the second resistor pattern 32, and the characteristic impedance of the shunt line for common mode noise and the characteristic impedance of the shunt line for differential signal can be easily adjusted.

[0086] In addition, in the composite electronic component 1, since the first ground terminal 71 and the second ground terminal 72 are provided as ground terminals in addition to the first resistor pattern 31 and the second resistor pattern 32, a potential neutralization point where the differential signal becomes the same potential and disappears is not generated on the shunt line side in the composite electronic component 1, and the transmission characteristics of the differential signal are further improved. In addition, the above structure has a better transmission characteristic of the differential signal than the case where the ground terminal sides of the first resistor pattern 31 and the second resistor pattern 32 are connected to one ground terminal.

[0087] Figure 3A to Figure 3E FIG. 1 is a partially exploded top view of the composite electronic component 1. Figure 1 , Figure 2 ,as well as Figure 3A to Figure 3E As shown, the main body 10 includes an insulator 11, a first substrate 12 disposed on the lower surface of the insulator 11, and a second substrate 13 disposed on the upper surface of the insulator 11. The second substrate 13 is attached to the upper surface of the insulator 11 via an adhesive 14. The main body 10 is formed in a substantially rectangular parallelepiped shape. Figure 1 In the embodiment, the stacking direction A is set as the up-down direction. Figure 3A to Figure 3EThe layers are shown in order from the lower layer to the upper layer along the stacking direction A. The stacking direction A merely indicates the order of the steps, and the top and bottom of the composite electronic component 1 may be reversed.

[0088] The insulator 11 includes a plurality of insulating layers 11a to 11e, and the plurality of insulating layers 11a to 11e are stacked in a stacking direction A. In other words, the first to fifth insulating layers 11a to 11e are stacked in order from the bottom to the top in the stacking direction A.

[0089] The insulating layers 11a to 11e are made of an insulating material mainly composed of, for example, resin, ferrite, glass, etc. In addition, due to thermal curing or baking of the insulator 11, interfaces between the plurality of insulating layers 11a to 11e may not be clear.

[0090] The first substrate 12 and the second substrate 13 are supporting materials of the insulator 11, for example, ferrite substrates. The ferrite material used for the first substrate 12 and the second substrate 13 can be a magnetic body or a non-magnetic body. In addition, the first substrate 12 and the second substrate 13 can also be a material other than ferrite, such as alumina, glass, etc.

[0091] The first input terminal 51, the second input terminal 52, the first output terminal 61, the second output terminal 62, the first ground terminal 71, and the second ground terminal 72 are made of a conductive material such as Ag, Cu, Au, or an alloy containing them as a main component. The first input terminal 51, the second input terminal 52, the first output terminal 61, and the second output terminal 62 are respectively embedded in the corners of the main body 10 along the stacking direction A. The first ground terminal 71 and the second ground terminal 72 are respectively embedded in the side surfaces between the corners of the main body 10 along the stacking direction A.

[0092] The first input terminal 51 and the second input terminal 52 are opposed to one side direction which is the short side direction of the main surface orthogonal to the stacking direction A of the main body 10, the first output terminal 61 and the second output terminal 62 are opposed to one side direction of the main body 10, and the first ground terminal 71 and the second ground terminal 72 are opposed to one side direction of the main body 10. The first input terminal 51 and the first output terminal 61 are opposed to the other side direction which is the long side direction of the main surface of the main body 10, and the second input terminal 52 and the second output terminal 62 are opposed to the other side direction of the main body 10. The first ground terminal 71 is located between the first input terminal 51 and the first output terminal 61, and the second ground terminal 72 is located between the second input terminal 52 and the second output terminal 62.

[0093] The first input terminal 51 and the second input terminal 52 respectively include first portions 51a and 52a provided on the insulator 11, and second portions 51b and 52b provided on the first substrate 12 and connected to the first portions 51a and 52a. The first output terminal 61 and the second output terminal 62 respectively include first portions 61a and 62a provided on the insulator 11, and second portions 61b and 62b provided on the first substrate 12 and connected to the first portions 61a and 62a. The first grounding terminal 71 and the second grounding terminal 72 respectively include first portions 71a and 72a provided on the insulator 11, and second portions 71b and 72b provided on the first substrate 12 and connected to the first portions 71a and 72a.

[0094] The first filter 101, the second filter 102, and the first resistor pattern 31 and the second resistor pattern 32 are provided in the main body 10 (insulator 11). The first coil pattern 21 and the second coil pattern 22 are provided on mutually different insulating layers 11b to 11e. The third coil pattern 23 and the fourth coil pattern 24 are provided on mutually different insulating layers 11b to 11e. The first resistor pattern 31 and the second resistor pattern 32 are provided on an insulating layer 11a different from the first coil pattern 21, the second coil pattern 22, the third coil pattern 23, and the fourth coil pattern 24. In this way, since the first resistor pattern 31 and the second resistor pattern 32 are provided on an insulating layer 11a different from the first coil pattern 21, the second coil pattern 22, the third coil pattern 23, and the fourth coil pattern 24, the resistor patterns 31 and 32 can be provided by a different structure, material, and process from the coil patterns 21 to 24. For example, the resistivity of the first resistor pattern 31 and the second resistor pattern 32 can be increased independently from the coil patterns 21 to 24, and the degree of freedom in design of the composite electronic component 1 is improved.

[0095] The first coil pattern 21 and the third coil pattern 23 are located on the same insulating layer 11c, 11e. The second coil pattern 22 and the fourth coil pattern 24 are located on the same insulating layer 11b, 11d. Thus, the composite electronic component 1 can be made low-profile. In addition, since the thickness of the insulator 11 can be thinned, the distance between the first substrate 12 and the second substrate 13 can be shortened. As a result, when the first substrate 12 and the second substrate 13 are set as magnetic bodies, the L value can be increased. In addition, the first coil pattern 21, the second coil pattern 22, the third coil pattern 23, and the fourth coil pattern 24 can also be located on different insulating layers.

[0096] The first coil pattern 21 includes a first coil conductor layer 121 and a second coil conductor layer 122. The first coil conductor layer 121 and the second coil conductor layer 122 are respectively in a planar spiral shape wound on a plane. The number of windings of the first coil conductor layer 121 and the second coil conductor layer 122 is more than one turn, but may be less than one turn. The first coil conductor layer 121 is provided on the third insulating layer 11c, and the second coil conductor layer 122 is provided on the fifth insulating layer 11e, and the first coil conductor layer 121 and the second coil conductor layer 122 are arranged in the stacking direction A.

[0097] A first lead conductor 41 is provided on the same plane as the first coil conductor layer 121 (on the same third insulating layer 11c). The first lead conductor 41 is led out from the outer peripheral end of the first coil conductor layer 121 to the outside and is connected to the first portion 61a of the first output terminal 61. The outer peripheral end refers to the portion deviating from the spiral shape of the first coil conductor layer 121, and the first lead conductor 41 refers to the portion below the outer peripheral end. The first lead conductor 41 and the first coil conductor layer 121 are formed integrally. The inner peripheral end of the first coil conductor layer 121 is connected to the first connection conductor 91 provided along the stacking direction A in the main body 10 (insulator 11).

[0098] The second lead conductor 42 is provided on the same plane as the second coil conductor layer 122 (on the same fifth insulating layer 11e). The second lead conductor 42 is led out from the outer peripheral end of the second coil conductor layer 122 to the outside and is connected to the first portion 51a of the first input terminal 51. The inner peripheral end of the second coil conductor layer 122 is connected to the first connection conductor 91.

[0099] Therefore, the first coil conductor layer 121 and the second coil conductor layer 122 are electrically connected in series between the first input terminal 51 and the first output terminal 61 .

[0100] The second coil pattern 22 is similar to the first coil pattern 21, and includes a first coil conductor layer 221 and a second coil conductor layer 222. The first coil conductor layer 221 is provided on the second insulating layer 11b, and the second coil conductor layer 222 is provided on the fourth insulating layer 11d.

[0101] A third lead conductor 43 is provided on the same plane as the first coil conductor layer 221 (on the same second insulating layer 11b). The third lead conductor 43 is led out from the outer peripheral end of the first coil conductor layer 221 to the outside and is connected to the first portion 62a of the second output terminal 62. The inner peripheral end of the first coil conductor layer 221 is connected to the second connection conductor 92 provided along the stacking direction A in the main body 10 (insulator 11).

[0102] A fourth lead conductor 44 is provided on the same plane as the second coil conductor layer 222 (on the same fourth insulating layer 11d). The fourth lead conductor 44 is led out from the outer peripheral end of the second coil conductor layer 222 to the outside and is connected to the first portion 52a of the second input terminal 52. The inner peripheral end of the second coil conductor layer 222 is connected to the second connection conductor 92.

[0103] Therefore, the first coil conductor layer 221 and the second coil conductor layer 222 are electrically connected in series between the second input terminal 52 and the second output terminal 62 .

[0104] The third coil pattern 23 is similar to the first coil pattern 21, and includes a first coil conductor layer 321 and a second coil conductor layer 322. The first coil conductor layer 321 is provided on the third insulating layer 11c, and the second coil conductor layer 322 is provided on the fifth insulating layer 11e.

[0105] A fifth lead conductor 45 is provided on the same plane as the first coil conductor layer 321 (on the same third insulating layer 11c). The fifth lead conductor 45 is led out from the outer peripheral end of the first coil conductor layer 321 to the outside and is connected to the third connection conductor 93 provided in the main body 10 (insulator 11) along the stacking direction A. The inner peripheral end of the first coil conductor layer 321 is connected to the fourth connection conductor 94 provided in the main body 10 (insulator 11) along the stacking direction A.

[0106] The outer peripheral end of the second coil conductor layer 322 is connected to the first portion 51 a of the first input terminal 51 via the second lead conductor 42 . The inner peripheral end of the second coil conductor layer 322 is connected to the fourth connection conductor 94 .

[0107] Therefore, the first coil conductor layer 321 and the second coil conductor layer 322 are electrically connected in series between the third connection conductor 93 and the first input terminal 51 .

[0108] The fourth coil pattern 24 is similar to the first coil pattern 21, and includes a first coil conductor layer 421 and a second coil conductor layer 422. The first coil conductor layer 421 is provided on the second insulating layer 11b, and the second coil conductor layer 422 is provided on the fourth insulating layer 11d.

[0109] A sixth lead conductor 46 is provided on the same plane as the first coil conductor layer 421 (on the same second insulating layer 11b). The sixth lead conductor 46 is led out from the outer peripheral end of the first coil conductor layer 421 to the outside and is connected to the fifth connection conductor 95 provided in the main body 10 (insulator 11) along the stacking direction A. The inner peripheral end of the first coil conductor layer 421 is connected to the sixth connection conductor 96 provided in the main body 10 (insulator 11) along the stacking direction A.

[0110] The outer peripheral end of the second coil conductor layer 422 is connected to the first portion 52 a of the second input terminal 52 via the fourth lead conductor 44 . The inner peripheral end of the second coil conductor layer 422 is connected to the sixth connection conductor 96 .

[0111] Therefore, the first coil conductor layer 421 and the second coil conductor layer 422 are electrically connected in series between the fifth connecting conductor 95 and the second input terminal 52 .

[0112] The first resistor pattern 31 and the second resistor pattern 32 are located on the same first insulating layer 11a. Thus, the composite electronic component 1 can be made low-profile. In addition, since the thickness of the insulator 11 can be reduced, the distance between the first substrate 12 and the second substrate 13 can be shortened. As a result, when the first substrate 12 and the second substrate 13 are set as magnetic bodies, the L value can be increased. In addition, the first resistor pattern 31 and the second resistor pattern 32 can also be located on different insulating layers.

[0113] The first resistance pattern 31 and the second resistance pattern 32 are preferably in a curved shape that meanders on the first insulating layer 11a. Thus, the line length of the resistance patterns 31 and 32 can be extended, and the resistance value of the resistance patterns 31 and 32 can be increased. The thickness of the first resistance pattern 31 and the second resistance pattern 32 is preferably thinner than the thickness of each of the first coil pattern 21 to the fourth coil pattern 24. Thus, the thickness of the resistance patterns 31 and 32 can be reduced, and the resistance value of the resistance patterns 31 and 32 can be increased.

[0114] One end of the first resistor pattern 31 is connected to the first portion 71a of the first ground terminal 71. The other end of the first resistor pattern 31 is connected to the third connection conductor 93. Therefore, the third coil pattern 23 (first coil conductor layer 321, second coil conductor layer 322) and the first resistor pattern 31 are connected in series between the first input terminal 51 and the first ground terminal 71.

[0115] One end of the second resistance pattern 32 is connected to the first portion 72a of the second ground terminal 72. The other end of the second resistance pattern 32 is connected to the fifth connection conductor 95. Therefore, the fourth coil pattern 24 (the first coil conductor layer 421, the second coil conductor layer 422) and the second resistance pattern 32 are connected in series between the second input terminal 52 and the second ground terminal 72.

[0116] like Figure 2As shown, the electronic circuit 5 has the above-mentioned composite electronic component 1, and capacitors 81 and 82 electrically connected to the ground terminals 71 and 72 of the composite electronic component 1. The first capacitor 81 is electrically connected between the first ground terminal 71 and the ground. The second capacitor 82 is electrically connected between the second ground terminal 72 and the ground. The capacitance value of the first capacitor 81 and the second capacitor 82 is preferably 47pF.

[0117] Therefore, in the electronic circuit 5 , since the capacitors 81 and 82 are inserted in the shunt line, the low-frequency component of the differential signal is less likely to be transmitted to the shunt line side, and the degradation of the transmission characteristics of the differential signal in the composite electronic component can be further suppressed.

[0118] Furthermore, since the electronic circuit 5 has the first capacitor 81 and the second capacitor 82, a potential neutralization point where the differential signals become the same potential and disappear is not generated on the shunt line from the composite electronic component 1 to the ground electrode, and the transmission characteristics of the differential signal in the differential transmission line can be further improved.

[0119] (Second Embodiment)

[0120] Figure 4 1 is an equivalent circuit diagram of a second embodiment of a composite electronic component and an electronic circuit. The second embodiment is different from the first embodiment in the number of resistance patterns, ground terminals, and capacitors. The different structures are described below. The other structures are the same as those of the first embodiment, and are marked with the same figure marks as those of the first embodiment and their descriptions are omitted.

[0121] like Figure 4 As shown, in the composite electronic component 1A of the second embodiment, there is a ground terminal 70 and a resistor pattern 30. The portion of the third coil pattern 23 on the ground terminal 70 side is electrically connected to the portion of the fourth coil pattern 24 on the ground terminal 70 side, and the resistor pattern 30 is electrically connected between the connection portion between the third coil pattern 23 and the fourth coil pattern 24 and the ground terminal 70.

[0122] Therefore, since the composite electronic component 1A includes the resistance pattern 30, it is possible to reduce reflection of common mode noise to the differential transmission line and suppress degradation of the transmission characteristics of the differential signal, as in the first embodiment. The resistance value of the resistance pattern 30 is preferably 25Ω.

[0123] In the electronic circuit 5A of the second embodiment, there is a capacitor 80. The capacitor 80 is connected between the ground terminal 70 and the ground electrode 85. Therefore, since the capacitor 80 is inserted in the shunt line of the electronic circuit 5A, the low-frequency component of the differential signal is difficult to be transmitted to the shunt line side, and the reduction of the transmission characteristics of the differential signal in the composite electronic component can be further suppressed. The capacitance value of the capacitor 80 is preferably 47pF.

[0124] (Example)

[0125] Next, an embodiment of a method for manufacturing a composite electronic component will be described.

[0126] First, in order to obtain a desired coil pattern (conductor layer), an internal circuit is formed by alternately stacking insulating layers and conductive layers on a first substrate. In addition, in this embodiment, the process of forming the coil pattern describes a method of using a photolithography technique and a resin-based photosensitive material for an insulating material, but it may also be a conventional stacking method of pattern-printing a conductive paste on a raw sheet, stacking the sheets, and performing compression bonding and firing.

[0127] Specifically, a conductive layer is formed on the upper surface of an insulating layer formed by spin coating, screen printing, crimping of a dry film resist, etc., by a film forming technique such as a thin film forming method such as sputtering or evaporation, or a thick film forming method such as screen printing. The material of the insulating layer is, for example, various resin materials such as polyimide resin, epoxy resin, phenolic resin, and benzocyclobutene resin. The material of the conductive layer is preferably a metal such as Ag, Pb, Cu, Al, or an alloy thereof with excellent conductivity. Considering processability, adhesion, etc., a combination of the material of the insulating layer and the material of the conductive layer is preferably selected. In addition, the conductive layer is not only a coil pattern, but also the first part of the input terminal, the output terminal, and the ground terminal.

[0128] After that, a resist is applied, and exposure, development, and etching are performed to form a first conductive layer by such photolithography technology. Alternatively, a conductive film created by the above-mentioned thin film formation method is used as a power supply film, and a first conductive layer is formed by an electroplating process between the resists patterned by the above-mentioned photolithography technology.

[0129] Afterwards, an insulating layer is formed on the upper layer of the first conductive layer. On the insulating layer, a via hole is processed to connect the first conductive layer and the second conductive layer formed thereon by photolithography technology. On the insulating layer where the via hole is formed, a second conductive layer is formed, and the first conductive layer and the second conductive layer are electrically connected via the via hole (connecting conductor) to form the first part of the coil pattern, input terminal, output terminal, and ground terminal. In addition, the coil pattern, input terminal, output terminal, and ground terminal can also be further formed by multiple conductor layers of more than 3 layers via the via hole. The above-mentioned via hole processing can also be implemented by laser, sandblasting and other methods.

[0130] In this way, multiple conductive layers are stacked, and a pair of coupled coils with the same winding direction observed from the stacking direction A and a pair of coupled coils with opposite winding directions observed from the stacking direction A are aligned and formed in an insulator. Further, a resistance pattern is formed on an insulating layer different from the coil pattern. The resistance pattern is formed in the same manner as the formation of the above-mentioned coil pattern, but in order to obtain high resistance, it is preferably thinned by sputtering or evaporation. In addition, in order to thin the layer as described above, it is preferred to form a resistance pattern on the lower layer side of the main body with fewer bumps and depressions caused by the coil pattern, especially on the lowermost layer of the insulator.

[0131] The two coil patterns with the same winding direction overlap at least a portion of the area surrounded by the coil patterns to be magnetically coupled, forming a common mode filter. The common mode filter is a common structure in which the first coil pattern and the second coil pattern are stacked and the coil patterns are opposed and magnetically coupled via an insulating layer.

[0132] In this way, if at least a portion of the areas surrounded by the coil patterns overlap, the magnetic coupling between the coil patterns can be further enhanced, and the effect of removing common mode noise can be further improved. Since the coil patterns can be overlapped in the stacking direction orthogonal to the direction in which the coil patterns are widened, the installation area can be reduced. In addition, by arranging the coil patterns on the same insulating layer, the above-mentioned magnetic coupling can be enhanced and the installation area can be reduced.

[0133] On the other hand, if the coil patterns are not arranged on the same insulating layer but on different insulating layers, the physical distance between the coil patterns can be ensured, and the insulation between the first coil pattern and the second coil pattern that generate a potential difference due to the flow of a differential signal can be improved.

[0134] Furthermore, as described above, when the coil patterns are located on different insulating layers and the regions enclosed by the coil patterns at least partially overlap, the formation of the common mode choke coil requires at least three or more conductor layers and four or more insulating layers.

[0135] Furthermore, when a high inductance is required in the common mode filter, it is preferable that the first substrate or the second substrate is a magnetic substrate, and it is more preferable that both the first substrate and the second substrate are magnetic substrates.

[0136] The two coil patterns with opposite winding directions are magnetically coupled due to the overlap of at least a portion of the area surrounded by the coil patterns, thereby forming a differential mode filter. The differential mode filter is a common structure in which the third coil pattern and the fourth coil pattern are stacked and the coil patterns are opposed and magnetically coupled via an insulating layer. In this case, as in the case described in the common mode filter, it is possible to enhance the magnetic coupling and reduce the installation area. In addition, as described above, when the coil patterns are located on different insulating layers and at least a portion of the areas surrounded by the coil patterns overlap, the formation of the differential mode filter requires at least 3 or more conductor layers and 4 or more insulating layers.

[0137] Furthermore, in a differential mode filter, when a high inductance is required, it is preferable that the first substrate or the second substrate is a magnetic substrate, and it is more preferable that both the first substrate and the second substrate are magnetic substrates.

[0138] Furthermore, the second substrate is attached to the upper surface of the main body via an adhesive. The adhesive is, for example, a thermosetting polyimide resin. In addition, the second substrate is bonded by heating and pressurizing in a vacuum or inert gas, and then releasing the pressure after cooling.

[0139] After the bonding of the second substrate, the second part of the input terminal, the output terminal and the ground terminal that contacts the first part of each of the input terminal, the output terminal and the ground terminal is formed through a cutting process. The second part is formed, for example, by coating a conductive paste containing a material such as Ag, Cu, NiCr, or NiCu, or by a film forming method of sputtering, evaporating these materials, and electroplating. The second part is formed by forming a metal film of Ni, Sn, Sn-Pb, Cu, Au, etc. on the electrode formed in this way, for example, by wet electroplating.

[0140] In addition, the present disclosure is not limited to the above-mentioned embodiment, and design changes can be made within the scope that does not deviate from the gist of the present disclosure. For example, the respective characteristic points of the first embodiment and the second embodiment can be combined.

[0141] In the above embodiment, the coil pattern is composed of two layers of coil conductor layers, but it can also be composed of one layer or more than three layers of coil conductor layers. The resistance pattern is composed of one layer of resistance pattern layer, but it can also be composed of two or more layers of resistance pattern layers. In the above embodiment, the main body has a first substrate and a second substrate, but at least one of the first substrate and the second substrate may not be provided.

[0142] Description of Reference Numerals

[0143] 1, 1A…composite electronic component; 5, 5A…electronic circuit; 10…main body; 11…insulator; 11a~11e…first insulating layer~fifth insulating layer; 21~24…first coil pattern~fourth coil pattern; 30…resistance pattern; 31, 32…first resistance pattern, second resistance pattern; 51, 52…first input terminal, second input terminal; 61, 62…first output terminal, second output terminal; 70…ground terminal; 71, 72…first ground terminal, second ground terminal; 80…capacitor; 81, 82…first capacitor, second capacitor; 101, 102…first filter, second filter.

Claims

1. A composite electronic component comprising: A main body, formed by stacking a plurality of insulating layers in a stacking direction; A first input terminal, a second input terminal, a first output terminal, a second output terminal and a ground terminal are arranged on the main body; A first filter is disposed in the main body and is electrically connected in series between the first input terminal and the first output terminal and between the second input terminal and the second output terminal; A second filter is disposed in the main body and is electrically connected in series between the first input terminal and the ground terminal and between the second input terminal and the ground terminal; and a resistance pattern, disposed in the main body, and electrically connected in series between the second filter and the ground terminal, The first filter has: A first coil pattern electrically connected in series between the first input terminal and the first output terminal; and The second coil pattern is electrically connected in series between the second input terminal and the second output terminal. The first coil pattern and the second coil pattern constitute a common mode filter. The second filter has: a third coil pattern electrically connected in series between the first input terminal and the ground terminal; and The fourth coil pattern is connected between the second input terminal and the ground terminal. The third coil pattern and the fourth coil pattern constitute a differential mode filter. The resistance pattern is located on the insulating layer different from the first coil pattern, the second coil pattern, the third coil pattern, and the fourth coil pattern. The above resistance pattern has: a first resistance pattern electrically connected in series between the third coil pattern and the ground terminal; and The second resistance pattern is electrically connected in series between the fourth coil pattern and the ground terminal. The first resistance pattern and the second resistance pattern are located on the same insulating layer.

2. The composite electronic component according to claim 1, wherein: The first coil pattern and the second coil pattern are located on different insulating layers. When viewed from one side of the stacking direction, The area enclosed by the first coil pattern at least partially overlaps with the area enclosed by the second coil pattern, and, A winding direction of the first coil pattern from the first input terminal toward the first output terminal is the same as a winding direction of the second coil pattern from the second input terminal toward the second output terminal.

3. The composite electronic component according to claim 1 or 2, wherein: The third coil pattern and the fourth coil pattern are located on different insulating layers. When viewed from one side of the stacking direction, The area enclosed by the third coil pattern at least partially overlaps with the area enclosed by the fourth coil pattern, and, A winding direction of the third coil pattern from the first input terminal toward the ground terminal is opposite to a winding direction of the fourth coil pattern from the second input terminal toward the ground terminal.

4. The composite electronic component according to claim 1 or 2, wherein: The first coil pattern and the third coil pattern are located on the same insulating layer, and the second coil pattern and the fourth coil pattern are located on the same insulating layer.

5. The composite electronic component according to claim 1 or 2, wherein: The above ground terminal has: A first ground terminal electrically connected to the first resistance pattern; and The second ground terminal is electrically connected to the second resistance pattern.

6. The composite electronic component according to claim 1 or 2, wherein: The resistance pattern has a meandering shape running on the insulating layer.

7. The composite electronic component according to claim 1 or 2, wherein: The thickness of the resistance pattern is thinner than the thickness of each of the first to fourth coil patterns.

8. A composite electronic component comprising: A main body, formed by stacking a plurality of insulating layers in a stacking direction; A first input terminal, a second input terminal, a first output terminal, a second output terminal and a ground terminal are arranged on the main body; A first filter is disposed in the main body and is electrically connected in series between the first input terminal and the first output terminal and between the second input terminal and the second output terminal; A second filter is disposed in the main body and is electrically connected in series between the first input terminal and the ground terminal and between the second input terminal and the ground terminal; and a resistance pattern, disposed in the main body, and electrically connected in series between the second filter and the ground terminal, The first filter has: A first coil pattern electrically connected in series between the first input terminal and the first output terminal; and The second coil pattern is electrically connected in series between the second input terminal and the second output terminal. The first coil pattern and the second coil pattern constitute a common mode filter. The second filter has: a third coil pattern electrically connected in series between the first input terminal and the ground terminal; and The fourth coil pattern is connected between the second input terminal and the ground terminal. The third coil pattern and the fourth coil pattern constitute a differential mode filter. The resistance pattern is located on the insulating layer different from the first coil pattern, the second coil pattern, the third coil pattern, and the fourth coil pattern. The first coil pattern and the second coil pattern are located on the insulating layers different from each other, and when viewed from one side of the stacking direction, an area surrounded by the first coil pattern and an area surrounded by the second coil pattern at least partially overlap. The third coil pattern and the fourth coil pattern are located on the insulating layers different from each other, and when viewed from one side of the stacking direction, an area surrounded by the third coil pattern at least partially overlaps an area surrounded by the fourth coil pattern. The above resistance pattern has: a first resistance pattern electrically connected in series between the third coil pattern and the ground terminal; and The second resistance pattern is electrically connected in series between the fourth coil pattern and the ground terminal. The first resistor pattern overlaps the first coil pattern and the second coil pattern when viewed from one side of the stacking direction, and has an inner peripheral portion overlapping the inner peripheral portion of the first coil pattern and the inner peripheral portion of the second coil pattern. The second resistor pattern overlaps the third coil pattern and the fourth coil pattern when viewed from one side in the stacking direction, and has an inner peripheral portion overlapping an inner peripheral portion of the third coil pattern and an inner peripheral portion of the fourth coil pattern.

9. The composite electronic component according to claim 8, wherein: When viewed from one side of the stacking direction, A winding direction of the first coil pattern from the first input terminal toward the first output terminal is the same as a winding direction of the second coil pattern from the second input terminal toward the second output terminal.

10. The composite electronic component according to claim 8 or 9, wherein: When viewed from one side of the stacking direction, A winding direction of the third coil pattern from the first input terminal toward the ground terminal is opposite to a winding direction of the fourth coil pattern from the second input terminal toward the ground terminal.

11. The composite electronic component according to claim 8 or 9, wherein: The first resistance pattern and the second resistance pattern are located on the same insulating layer.

12. The composite electronic component according to claim 8 or 9, wherein: The first coil pattern and the third coil pattern are located on the same insulating layer, and the second coil pattern and the fourth coil pattern are located on the same insulating layer.

13. The composite electronic component according to claim 8 or 9, wherein: The above ground terminal has: A first ground terminal electrically connected to the first resistance pattern; and The second ground terminal is electrically connected to the second resistance pattern.

14. The composite electronic component according to claim 8 or 9, wherein: The resistance pattern has a meandering shape running on the insulating layer.

15. The composite electronic component according to claim 8 or 9, wherein: The thickness of the resistance pattern is thinner than the thickness of each of the first to fourth coil patterns.

16. An electronic circuit comprising: The composite electronic component according to any one of claims 1 to 15; a ground electrode electrically connected to the ground terminal of the composite electronic component; and The capacitor is electrically connected in series between the ground terminal and the ground electrode of the composite electronic component.

Images