A switching power supply with high efficiency heat conduction performance
By using a combination of graphene strips and thermal mesh plates in the switching power supply, combining liquid-cooled heat-smoothing plates and air-guiding channels, the problem of poor heat dissipation performance in the existing technology is solved, efficient heat conduction and heat dissipation are achieved, and the improvement of The operational stability and efficiency of the equipment.
Patent Information
- Application Number
- CN202010666345.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2020-07-10
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2040-07-10
AI Technical Summary
Due to poor heat dissipation performance of existing switching power supplies, the heat inside the power housing cannot be effectively transferred, affecting the normal operation of the equipment.
The combination of graphene strips and thermal mesh plates is used, combined with liquid-cooled heat homogenization plates and air-guiding channels, to achieve efficient heat conduction and heat dissipation. Graphene strips are interspersed on the shell, the thermally conductive mesh plate transmits heat and protects, and the liquid-cooled heat-smooth plate is cooled through the vacuum sealing cavity and microporous structure, and heat is taken away through the air-guiding channel.
It improves the heat dissipation performance of the switching power supply, ensures rapid heat release, and enhances the operating stability and efficiency of the equipment.
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Figure CN111787767B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of power supply devices, and in particular to a switching power supply with high-efficiency heat conduction performance. Background Art
[0002] A switching power supply is a high-frequency power conversion device and a type of power supply. Its function is to convert a voltage level into the voltage or current required by the user through different forms of architecture.
[0003] Existing switching power supplies generally dissipate heat by opening holes or setting heat sinks. As the temperature inside the shell continues to rise, the heat inside the power supply shell cannot be well transferred out due to the poor heat dissipation performance of the existing heat dissipation structure, which seriously affects the normal operation of the switching power supply. Summary of the invention
[0004] In order to solve the above technical defects, the technical solution adopted by the present invention is to provide a switching power supply with high-efficiency thermal conductivity, including a shell, a switching power supply body is arranged in the shell, a first positioning groove is arranged on the top of the shell, and a plurality of mounting holes arranged in a matrix are arranged at intervals on the first positioning groove, and a graphene strip is inserted and fixed on each row of the mounting holes, and the graphene strips are staggered and inserted on the shell up and down, and a heat-conducting mesh plate is installed on the graphene strip, and the heat-conducting mesh plate is cooperated and arranged in the first positioning groove, and heat dissipation holes are respectively provided on both sides of the shell.
[0005] Furthermore, a plurality of air guiding channels are provided on the top of the shell, and the air guiding channels are interconnected through the first positioning grooves.
[0006] Furthermore, a second positioning groove is provided on the end face of the shell, and a liquid-cooled heat spreader is installed in the second positioning groove. The liquid-cooled heat spreader includes a heat-absorbing substrate, a heat-conducting plate, a condensing plate and a top plate arranged in sequence. The heat-absorbing substrate is connected to the top plate to form a vacuum sealed cavity, and the vacuum sealed cavity is filled with cooling liquid. The heat-conducting plate and the condensing plate are provided with interconnected microporous structures.
[0007] Furthermore, a protective plate is provided outside the liquid-cooled heat sink, a vent hole is provided on the protective plate, and the protective plate is cooperated with the second positioning groove.
[0008] Furthermore, the first positioning groove is a square groove, and the air guide channel is arranged between the square groove and the outer edge of the top of the shell in the horizontal direction and the vertical direction respectively.
[0009] Furthermore, a plurality of heat sinks arranged at intervals are provided on the surface of the shell.
[0010] Furthermore, the air guiding channels at both ends of the first positioning groove are arranged corresponding to the mounting holes.
[0011] Compared with the prior art, the beneficial effects of the technical solution of the present invention are as follows:
[0012] 1. The present invention provides a switching power supply with high-efficiency thermal conductivity. By inserting and fixing a plurality of graphene strips on the first positioning groove and installing a thermally conductive mesh plate on the graphene strips, the heat released by the heat source in the switching power supply is quickly transferred to the thermally conductive mesh plate through the graphene strips without affecting the strength of the shell, and then released to the external environment. The thermally conductive mesh plate is used to protect the graphene strips, and the heat dissipation performance is good.
[0013] 2. By setting up multiple air guide channels, it is convenient for the external air cooling device to quickly take away the heat from the graphene strips and the thermal mesh plate.
[0014] 3. A liquid-cooled heat spreader is arranged on the end face of the shell. Part of the heat in the shell is transferred to the heat-absorbing substrate and the heat-conducting plate. The coolant in the vacuum sealed cavity evaporates due to the heat. The hot air rises and contacts the condensing plate, where it is condensed into liquid for heat dissipation. The liquid flows to the heat-absorbing substrate through the microporous structure, further improving the heat dissipation efficiency. At the same time, the protective plate effectively protects the liquid-cooled heat spreader. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0016] Figure 1 is a three-dimensional diagram of a switching power supply with high-efficiency heat conduction performance provided by an embodiment of the present invention;
[0017] Figure 2 It is a three-dimensional diagram of a switching power supply with high-efficiency heat conduction performance provided by an embodiment of the present invention without a heat-conducting mesh plate;
[0018] Figure 3 It is a three-dimensional diagram of a switching power supply with high-efficiency heat conduction performance provided by an embodiment of the present invention without a heat-conducting mesh plate and a protective plate;
[0019] Figure 4 is a side view of a switching power supply with high-efficiency heat conduction performance provided by an embodiment of the present invention;
[0020] Figure 5 yes Figure 4 AA section view;
[0021] Figure 6It is a half-section view of a switching power supply with high-efficiency heat conduction performance provided by an embodiment of the present invention without a heat-conducting mesh plate;
[0022] Figure 7 Schematic diagram of the structure of the liquid cooling heat sink provided in an embodiment of the present invention.
[0023] Wherein, the accompanying drawings are marked as follows:
[0024] 1. Shell, 1a. First positioning groove, 1b. Mounting hole, 1c. Heat dissipation hole, 1d. Wind guide channel, 1e. Second positioning groove, 2. Graphene strip, 3. Thermal mesh plate, 4. Liquid cooling heat spreader, 41. Heat absorbing substrate, 42. Heat conduction plate, 43. Condensation plate, 44. Top plate, 5. Protective plate, 5a. Vent. DETAILED DESCRIPTION
[0025] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0026] Example 1
[0027] See also Figure 1-Figure 7 As shown, the present invention provides a switching power supply with high-efficiency heat conduction performance, including a shell 1, a switching power supply body is arranged in the shell 1, a first positioning groove 1a is arranged on the top of the shell 1, and a plurality of mounting holes 1b arranged in a matrix are arranged at intervals on the first positioning groove 1a, and a graphene strip 2 is inserted and fixed on each row of mounting holes 1b, and the graphene strips 2 are staggered and arranged on the shell 1 up and down, and a heat-conducting mesh plate 3 is installed on the graphene strip 2, and the heat-conducting mesh plate 3 is cooperated and arranged in the first positioning groove 1a, and heat dissipation holes 1c are respectively provided on both sides of the shell 1.
[0028] By inserting and fixing a plurality of graphene strips 2 on the first positioning groove 1a, and installing a thermally conductive mesh plate 3 on the graphene strips 2, the heat released by the heat source in the switching power supply is quickly transferred to the thermally conductive mesh plate 3 through the graphene strips 2 without affecting the strength of the shell 1, and then released to the external environment. The thermally conductive mesh plate 3 is used to protect the graphene strips 2, and the heat dissipation performance is good.
[0029] Specifically, the first positioning groove 1a is a square groove, and the air guide channel 1d is arranged between the square groove and the outer edge of the top of the shell 1 in the horizontal direction and the vertical direction respectively.
[0030] Specifically, a plurality of heat sinks arranged at intervals are provided on the surface of the housing 1 .
[0031] Preferably, a plurality of air guiding channels 1d are provided on the top of the housing 1, and the air guiding channels 1d are interconnected through the first positioning grooves 1a, so that the external air cooling device can quickly remove the heat from the graphene strips 2 and the heat-conducting mesh plate 3.
[0032] Specifically, the air guiding channels 1d at both ends of the first positioning groove 1a are arranged corresponding to the mounting hole 1b.
[0033] Preferably, a second positioning groove 1e is provided on the end face of the shell 1, and a liquid-cooled heat spreader 4 is installed in the second positioning groove 1e. The liquid-cooled heat spreader 4 includes a heat-absorbing substrate 41, a heat-conducting plate 42, a condensing plate 43 and a top plate 44 arranged in sequence. The heat-absorbing substrate 41 is connected to the top plate 44 to form a vacuum sealed cavity, and the vacuum sealed cavity is filled with cooling liquid. The heat-conducting plate 42 and the condensing plate 43 are provided with interconnected microporous structures.
[0034] A liquid-cooled heat spreader 4 is provided on the end face of the shell 1, and part of the heat in the shell 1 is transferred to the heat-absorbing substrate 41 and the heat-conducting plate 42. The cooling liquid in the vacuum sealed cavity evaporates due to the heat, and the hot air rises and contacts the condensation plate 43, where it is condensed into liquid for heat dissipation. The liquid flows to the heat-absorbing substrate 41 through the microporous structure, further improving the heat dissipation efficiency.
[0035] Specifically, a protective plate 5 is provided outside the liquid-cooled heat spreader 4 , and a vent hole 5 a is provided on the protective plate 5 . The protective plate 5 is cooperated with and arranged on the second positioning groove 1 e to effectively protect the liquid-cooled heat spreader 4 .
[0036] The above are only preferred embodiments of the present invention. The protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.
Claims
1. A switching power supply with high-efficiency heat conduction performance, comprising a housing (1), wherein a switching power supply body is arranged in the housing (1), characterized in that: The top of the shell (1) is provided with a first positioning groove (1a), and a plurality of mounting holes (1b) arranged in a matrix are arranged at intervals on the first positioning groove (1a), and a graphene strip (2) is inserted and fixed on each row of the mounting holes (1b), and the graphene strips (2) are staggered and inserted on the shell (1) up and down, and a heat-conducting mesh plate (3) is installed on the graphene strip (2), and the heat-conducting mesh plate (3) is arranged in the first positioning groove (1a), and heat dissipation holes (1c) are respectively provided on both sides of the shell (1).
2. The switching power supply with high efficiency heat conduction performance as claimed in claim 1, characterized in that: A plurality of air guiding channels (1d) are provided on the top of the housing (1), and the air guiding channels (1d) are interconnected via the first positioning grooves (1a).
3. The switching power supply with high efficiency heat conduction performance as claimed in claim 1 or 2, characterized in that: A second positioning groove (1e) is provided on the end surface of the shell (1), and a liquid-cooled heat spreader (4) is installed in the second positioning groove (1e). The liquid-cooled heat spreader (4) comprises a heat-absorbing substrate (41), a heat-conducting plate (42), a condensing plate (43) and a top plate (44) which are arranged in sequence. The heat-absorbing substrate (41) is connected to the top plate (44) to form a vacuum sealed cavity. Cooling liquid is placed in the vacuum sealed cavity. The heat-conducting plate (42) and the condensing plate (43) are provided with interconnected microporous structures.
4. The switching power supply with high efficiency heat conduction performance as claimed in claim 3, characterized in that: The liquid-cooling heat spreader (4) is provided with a protective plate (5) outside, the protective plate (5) is provided with a vent hole (5a), and the protective plate (5) is arranged in cooperation with the second positioning groove (1e).
5. The switching power supply with high efficiency heat conduction performance as claimed in claim 2, characterized in that: The first positioning groove (1a) is a square groove, and the air guide channel (1d) is arranged between the square groove and the outer edge of the top of the shell (1) in the horizontal direction and the vertical direction respectively.
6. The switching power supply with high efficiency heat conduction performance as claimed in claim 1, characterized in that: A plurality of heat sinks arranged at intervals are provided on the surface of the housing (1).
7. The switching power supply with high efficiency heat conduction performance as claimed in claim 2, characterized in that: The air guide channels (1d) at both ends of the first positioning groove (1a) are arranged corresponding to the mounting holes (1b).
Citation Information
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