An anti-interference structure suitable for SMT components
By using an inclined surface fixture to support part A during SMT processing, a horizontal gap is maintained between part B and the metal part, solving the interference problem during the lowering process of part B and achieving damage-free placement of the part.
Patent Information
- Application Number
- CN202010697378.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2020-07-20
- Publication Date
- 2025-09-05
- Estimated Expiration
- 2040-07-20
AI Technical Summary
During the SMT processing, when part B descends vertically to the welding area of part A, it is easy to interfere with the metal parts, causing damage to the parts.
An inclined surface fixture is used to support part A and maintain the horizontal gap between part B and the metal part during the descent of the SMT nozzle. The inclined surface design avoids interference.
It effectively avoids the interference between part B and the metal part, ensures the integrity of parts A and B during the punching process, and has a simple structure and is easy to operate.
Smart Images

Figure CN111787784B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of SMT of electronic products, and in particular to an anti-interference structure suitable for SMT component mounting. Background Art
[0002] Please refer to Figure 1 Part A22 has a protruding metal piece 23 that is horizontally aligned with the soldering area of part A22. When using existing SMT processing techniques to mount part A22, the SMT nozzle 1 picks up part B21 and places it on the soldering area of part A22. Specifically, part A22 is placed on an existing jig 3, whose support surface 31 is horizontal. When the SMT nozzle 1 picks up part B21 and vertically descends to the soldering area of part A22, part B21 is likely to interfere with the metal piece 23, causing damage to both the metal piece 23 and part B21. Summary of the Invention
[0003] The purpose of the present invention is to provide an anti-interference structure suitable for SMT parts, which solves the technical problem that when the SMT nozzle picks up part B and descends vertically to the welding area of part A, part B may interfere with the metal part.
[0004] In order to solve the above problems, the present invention provides an anti-interference structure suitable for SMT parts, including part A, part B, an SMT nozzle and a fixture. Part A is provided with a welding area and a metal part at intervals. The metal part is protruded on part A and moves horizontally toward the welding area.
[0005] The jig is provided with an inclined surface for supporting the part A;
[0006] When punching, the part A is placed on the inclined surface, and the part B is located on the SMT nozzle and above the part A; as the SMT nozzle descends in the vertical direction, there is always a gap between the metal part and the part B in the horizontal direction.
[0007] Preferably, the jig is provided with a receiving groove, the bottom surface of the receiving groove is an inclined surface for supporting the part A. When the part A is placed in this receiving groove, the height of the inclined surface where the metal part is located is lower than the height of the inclined surface where the welding area is located.
[0008] Preferably, the component A comprises a circuit main board, and the metal piece and the welding area are arranged on the circuit main board at intervals and are both electrically connected to the circuit main board;
[0009] The metal member includes a first metal segment and a second metal segment arranged vertically, wherein the first metal segment is fixedly mounted on the circuit board, and the second metal segment is arranged above the first metal segment via a transition metal segment, and the second metal segment is closer to the welding area in the horizontal direction than the first metal segment;
[0010] During punching, the circuit board is placed on the inclined surface, the part B is located on the SMT nozzle, and there is a gap between the connection between the second metal segment and the transition metal segment and the part B in the horizontal direction.
[0011] Preferably, the transition metal segment is arranged horizontally.
[0012] Preferably, the part A is an injection molded part inlaid with a metal part.
[0013] Preferably, the part A is a PCB or FPC assembly.
[0014] Preferably, the component B is a PCB or FPC assembly.
[0015] Preferably, the size of the part A is larger than that of the part B.
[0016] Preferably, the finished product formed after the part B is welded to the part A is an antenna component.
[0017] Preferably, the antenna component is used on an electronic wearable device.
[0018] Compared with the prior art, the present invention has the following technical effects:
[0019] The present invention provides an inclined surface on the jig for supporting part A. Therefore, when punching, part A is placed on the inclined surface, and part B is located on the SMT nozzle and above part A. As part B descends vertically with the SMT nozzle, there is always a gap in the horizontal direction between the metal part on part A and part B, that is, part B will not interfere with the metal part during the descent process. Part B is placed by the SMT nozzle on the welding area of part A without interference. Therefore, during the punching process, the components on parts A and B will not be damaged. The present invention has a simple structure, is easy to operate, and is easy to implement. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive efforts. In the drawings:
[0021] Figure 1 This is a schematic diagram of the structure that causes interference when part A is manufactured using the existing SMT processing technology;
[0022] Figure 2 A schematic diagram of an anti-interference structure suitable for SMT components provided by a preferred embodiment of the present invention;
[0023] Figure 3 This is a schematic diagram of the structure of the completed part A provided in the preferred embodiment of the present invention;
[0024] Figure 4 A schematic diagram of a specific process for punching part B onto part A provided in a preferred embodiment of the present invention;
[0025] Figure 5 A schematic structural diagram of part A provided in a preferred embodiment of the present invention;
[0026] Figure 6 An exploded view of a finished product provided for a preferred embodiment of the present invention. DETAILED DESCRIPTION
[0027] The following will be combined Figures 1 to 6 The present invention provides an anti-interference structure suitable for SMT components. This embodiment is implemented based on the technical solution of the present invention, and provides a detailed implementation method and specific operation process. However, the protection scope of the present invention is not limited to the following embodiments. Those skilled in the art can modify and polish it without changing the spirit and content of the present invention.
[0028] Please refer to Figures 1 to 6 An anti-interference structure suitable for SMT parts, including a part A22, a part B21, an SMT nozzle 1 and a fixture 3'. The part A22 is provided with a welding area 221 and a metal part 23 at intervals. The metal part 23 is protruded from the part A22 and is close to the welding area 221 in the horizontal direction.
[0029] The fixture 3' is provided with an inclined surface 32 for supporting the part A22;
[0030] When punching, the part A22 is placed on the inclined surface 32, and the part B21 is located on the SMT nozzle 1 and above the part A22; as the part B21 descends along the vertical direction with the SMT nozzle, there is always a gap between the metal part 23 and the part B21 in the horizontal direction, that is, the part B21 will not interfere with the metal part 23 during the descent process, and the part B21 is placed by the SMT nozzle 1 on the welding area 221 of the part A22 without interference.
[0031] Furthermore, the jig 3' is provided with a receiving groove, the bottom surface of which is the inclined surface 32. When the part A22 is placed in the receiving groove, the height of the inclined surface 32 where the metal part 23 is located is lower than the height of the inclined surface 32 where the welding area 221 is located.
[0032] The present invention does not limit how many parts A22 can be placed on a jig 3'. As an embodiment, the jig 3' is provided with an inclined surface 32, that is, the jig 3' is provided with an accommodating groove, and the bottom surface of the accommodating groove is the inclined surface 32 for supporting the part A22.
[0033] As an embodiment, a plurality of inclined surfaces 32 are provided on the jig 3 ′, that is, a plurality of accommodating grooves are provided on the jig 3 , and the bottom surface of each accommodating groove is an inclined surface 32 for supporting the part A22 .
[0034] Please refer to Figure 4 , the specific process sequence for punching part B21 onto part A22 is:
[0035] First, an SMT nozzle 5 sequentially picks up parts A22 from the reel A4 and places the parts A22 on the inclined surfaces 32 of the jig 3'.
[0036] Secondly, solder paste 24 is applied to the soldering area 221 of each component A22 by using a solder paste dispensing device;
[0037] Then, another SMT nozzle 1 picks up the part B21 to be soldered from the reel B6. This SMT nozzle 1 descends vertically above the corresponding part A22 and places the part B21 onto the soldering area 221 of the part A22 where the solder paste 24 has been applied.
[0038] Finally, after each part A22 on the jig 3 ′ has part B21 placed on it, the entire jig 3 ′ is placed in a reflow furnace, and part B21 is welded to the corresponding part A22 by furnace welding to obtain a finished product 2 .
[0039] In this embodiment, please refer to Figure 5 The part A22 includes a circuit main board 221, and the metal piece 23 and the welding area 221 are arranged on the circuit main board 221 at intervals and are both electrically connected to the circuit main board 221;
[0040] Please refer to Figure 6The metal member 23 includes a first metal segment 233 and a second metal segment 231 arranged vertically. The first metal segment 233 is fixedly mounted on the circuit board 221. The second metal segment 231 is disposed above the first metal segment 233 via a transition metal segment 232. The second metal segment 231 is closer to the welding area 221 in the horizontal direction than the first metal segment 233.
[0041] During punching, the circuit board 221 is placed on the inclined surface 32 , the part B21 is located on the SMT nozzle 1 , and there is a gap in the horizontal direction between the connection between the second metal segment 231 and the transition metal segment 232 and the part B21 .
[0042] Furthermore, the transition metal segment 232 is arranged horizontally.
[0043] For further information, please refer to Figure 5 The part A22 is an injection molded part with a metal part 23, that is, an inner-board metal part 25 and an outer-board metal part 23 are provided on the circuit main board 221. The outer-board metal part 23 is a metal part 23 protruding from the circuit main board 221, and the outer-board metal part 23 and the inner-board metal part 25 are integrally formed.
[0044] The part A22 is a PCB assembly, an FPC assembly or other structural component assembly.
[0045] The part B21 is a PCB or FPC component.
[0046] In this embodiment, the size of the part A22 is larger than that of the part B21, in order to facilitate the placement of the part B21 on the part A22 without causing interference problems.
[0047] The finished product 2 formed by welding part B21 to part A22 is an antenna component. This means that this finished product 2 has antenna functionality and transmits and receives signals through the electrical connection between part B21 and part A22. The present invention does not impose any specific limitations on the use of this finished product 2; for example, it can be used in electronic wearable devices, such as smart watches.
Claims
1. An anti-interference structure suitable for SMT components, characterized in that: The present invention comprises a part A, a part B, an SMT nozzle, and a fixture. Part A is provided with a welding area and a metal part at intervals. Part A comprises a circuit board. The metal part and the welding area are arranged on the circuit board at intervals and are both electrically connected to the circuit board. The metal part is protruded from part A and is horizontally close to the welding area. The metal part comprises a first metal segment and a second metal segment arranged vertically. The first metal segment is fixedly provided on the circuit board. The second metal segment is provided above the first metal segment via a transition metal segment. The second metal segment is horizontally closer to the welding area than the first metal segment. The size of the part A is larger than that of the part B; The jig is provided with an inclined surface for supporting the part A; When punching, the part A is placed on the inclined surface, and the part B is located on the SMT nozzle and above the part A; as the SMT nozzle descends in the vertical direction, there is always a gap between the metal part and the part B in the horizontal direction.
2. The anti-interference structure for SMT components according to claim 1, characterized in that: The jig is provided with a receiving groove, the bottom surface of which is an inclined surface for supporting the part A. When the part A is placed in the receiving groove, the height of the inclined surface where the metal part is located is lower than the height of the inclined surface where the welding area is located.
3. The anti-interference structure adapted for SMT components according to claim 2, characterized in that: During punching, the circuit board is placed on the inclined surface, the part B is located on the SMT nozzle, and there is a gap between the connection between the second metal segment and the transition metal segment and the part B in the horizontal direction.
4. The anti-interference structure adapted for SMT components according to claim 3, characterized in that: The transition metal segment is arranged horizontally.
5. The anti-interference structure for SMT components according to claim 1, characterized in that: Part A is an injection molded part inlaid with a metal part.
6. The anti-interference structure for SMT components according to claim 5, characterized in that: The part A is a PCB or FPC component.
7. The anti-interference structure for SMT components according to claim 1, characterized in that: The part B is a PCB or FPC component.
8. The anti-interference structure for SMT components according to claim 1, characterized in that: The finished product formed after the part B is welded to the part A is an antenna component.
9. The anti-interference structure for SMT components according to claim 8, characterized in that: The antenna component is used on an electronic wearable device.
Citation Information
Patent Citations
Ultrasonic soldering device and method for using the device to weld product
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Anti-interference structure suitable for SMT (Surface Mount Technology) workpiece bonding
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