Semiconductor packaging structure, product and manufacturing method thereof

Abstract

A semiconductor package structure, product, and manufacturing method thereof, wherein the semiconductor package structure comprises a substrate, a semiconductor sensor, a cover, and a breathable film. The semiconductor sensor is located on the substrate. The cover covers the semiconductor sensor and defines a through hole. The breathable film covers the through hole of the cover and has a first surface. The first surface is hydrophilic.

Description

Technical Field

[0001] The present invention relates to a semiconductor packaging structure, a product and a manufacturing method, and relates to a semiconductor packaging structure including an air-permeable film having a mark, a product having an ink layer formed on an object, and a method for manufacturing a semiconductor packaging structure. Background Art

[0002] An exemplary semiconductor package structure may include a substrate, a microelectromechanical systems (MEMS) sensor located on the substrate, a lid covering the MEMS sensor and having a through-hole, and a gas permeable film covering the through-hole of the lid. For the purpose of identifying the semiconductor package structure, it is necessary to form a mark on the gas permeable film. Therefore, it is necessary to provide a technology for marking such a gas permeable film. Summary of the Invention

[0003] In some embodiments, a semiconductor package structure includes a substrate, a semiconductor sensor, a cover, and a gas-permeable film. The semiconductor sensor is located on the substrate. The cover covers the semiconductor sensor and has a through hole. The gas-permeable film covers the through hole of the cover and has a first surface. The first surface is hydrophilic.

[0004] In some embodiments, a product includes an object and an ink layer. The object has a surface and is made of a hydrophobic material. The ink layer is formed on the surface of the object and has an opening to expose a portion of the surface of the object. The exposed portion of the surface of the object is in the shape of a symbol.

[0005] In some embodiments, a method for manufacturing a semiconductor packaging structure includes: (a) providing a semiconductor packaging device, which includes: a substrate; a semiconductor sensor located on the substrate; a cover covering the semiconductor sensor and having a through hole; and a breathable film covering the through hole of the cover, wherein the breathable film has a first surface; and (b) hydrophilic-modifying the first surface of the breathable film. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Aspects of some embodiments of the present invention are best understood from the following detailed description when read in conjunction with the accompanying drawings.It should be noted that the various structures may not be drawn to scale and that the dimensions of the various structures may be arbitrarily increased or reduced for clarity of discussion.

[0007] Figure 1 Cross-sectional views illustrating examples of semiconductor package structures according to some embodiments of the present invention.

[0008] Figure 2 illustrate Figure 1 A top view of the semiconductor package structure shown in FIG.

[0009] Figure 3 Instructions along the Figure 2 A cross-sectional view taken along line II-II in FIG.

[0010] Figure 4 illustrate Figure 2 A partial magnified view of the area in FIG.

[0011] Figure 5 A top view illustrating an example of a semiconductor package structure according to some embodiments of the present invention.

[0012] Figure 6 Cross-sectional views illustrating examples of products according to some embodiments of the present invention.

[0013] Figure 7 illustrate Figure 6 Top view of the product shown in .

[0014] Figure 8 Cross-sectional views illustrating examples of products according to some embodiments of the present invention.

[0015] Figure 9 illustrate Figure 8 Top view of the product shown in .

[0016] Figure 10 One or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present invention are described.

[0017] Figure 11 One or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present invention are described.

[0018] Figure 12 illustrate Figure 11 Schematic diagram of measurement of the water contact angle on the first surface of the breathable film is shown in FIG.

[0019] Figure 13 One or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present invention are described.

[0020] Figure 14a Description Before hydrophilic modification Figure 11 Possible chemical structures of the first surface of the breathable film are shown in FIG.

[0021] Figure 14b Description during hydrophilic modification Figure 11 Possible chemical structures of the first surface of the breathable film are shown in FIG.

[0022] Figure 14c Description After hydrophilic modification Figure 11 Possible chemical structures of the first surface of the breathable film are shown in FIG.

[0023] Figure 15 illustrate Figure 13 Schematic diagram of measurement of the water contact angle on the first surface of the breathable film is shown in FIG.

[0024] Figure 16 One or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present invention are described.

[0025] Figure 17 One or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present invention are described.

[0026] Figure 18 One or more stages of an example of a method for manufacturing a product according to some embodiments of the present invention are described.

[0027] Figure 19 One or more stages of an example of a method for manufacturing a product according to some embodiments of the present invention are described.

[0028] Figure 20 One or more stages of an example of a method for manufacturing a product according to some embodiments of the present invention are described. DETAILED DESCRIPTION

[0029] Common reference numerals are used throughout the drawings and detailed description to refer to the same or similar components. Embodiments of the present invention will be readily understood from the following detailed description taken in conjunction with the accompanying drawings.

[0030] The following disclosure provides many different embodiments or examples for implementing the different features of the subject matter provided. Specific examples of components and arrangements are described below to illustrate certain aspects of the present invention. Of course, these are merely examples and are not intended to be limiting. For example, in the following description, the formation of a first feature above or on a second feature may include embodiments in which the first feature and the second feature are formed or arranged in direct contact, and may also include embodiments in which additional features may be formed or arranged between the first feature and the second feature so that the first feature and the second feature may not be in direct contact. In addition, the present invention may repeat reference numerals and / or letters in various examples. This repetition is for the purpose of simplicity and clarity and does not, in itself, indicate a relationship between the various embodiments and / or configurations discussed.

[0031] An exemplary semiconductor package structure may include a substrate, a MEMS sensor, a cover, and an expanded polytetrafluoroethene (ePTFE) film. The MEMS sensor is located on the substrate. The cover covers the MEMS sensor and the substrate and has a through hole above the MEMS sensor. The ePTFE film covers the through hole of the cover. The ePTFE film is breathable and hydrophobic, so it can protect the MEMS sensor from dust and moisture. The thickness of the ePTFE film can be about 20 μm. For the purpose of identifying the semiconductor package structure, it is necessary to form a mark on the ePTFE film. The size of the semiconductor package structure is very small, for example, about 1 mm*1 mm, about 2 mm*2.5 mm, about 3 mm*3 mm, or about 5 mm*5 mm. Therefore, the marking area on the ePTFE film may be correspondingly very small, for example, about 0.4 mm*1.6 mm. In addition, at least four to six letters need to be formed in the marking area. Therefore, it is difficult to form clear and recognizable markings (eg, four to six letters) on the ePTFE film in the marking area.

[0032] In an exemplary process, a laser source is used to remove portions of the ePTFE film to create a mark on the ePTFE film. However, because the ePTFE film is white and only 20 μm thick, it is light-transmissive. Therefore, the laser beam can easily pass through the ePTFE film. In other words, the ePTFE film has relatively low light absorption. Due to the poor light absorption of the ePTFE film, the laser source may not be able to effectively leave a clear mark on the ePTFE film without damaging it.

[0033] In another exemplary process, positive printing of a mark on an ePTFE membrane is performed using a heat-curable ink. However, because the ePTFE membrane is hydrophobic, the printed mark (i.e., the cured ink) may shrink during printing and heat curing. Consequently, the mark may remain unclear. Furthermore, because printing accuracy is relatively low, the mark may not be precisely positioned within the marking area on the ePTFE membrane.

[0034] In another exemplary process, UV-curable ink is used for printing the markings on the ePTFE film. UV-curable ink can be cured immediately by a UV source during printing, thereby reducing shrinkage of the printed markings (i.e., the cured ink). However, due to the hydrophobicity of the ePTFE film, the resolution of the markings may be low. The minimum size of letters formed using this process is approximately 1 mm by 0.6 mm. Due to the poor resolution, smaller letters, such as approximately 0.8 mm by 0.5 mm, may not be clear.

[0035] In another exemplary process, an ink layer formed from UV-curable ink is initially formed over the entire surface of an ePTFE membrane. Subsequently, a laser source is used to remove portions of the ink layer, thereby forming a mark (i.e., an opening or through-hole) in the ePTFE membrane. However, due to the hydrophobicity of the ePTFE membrane, the bond strength between the ink layer and the ePTFE membrane is relatively low. Consequently, due to thermal effects during laser marking, the ink layer may peel off at its edges. Such peeled portions of the ink layer may also be removed by the laser source, thereby rendering the mark unclear.

[0036] Thus, at least some embodiments of the present invention provide semiconductor package structures comprising a breathable film having clear markings presented thereon.At least some embodiments of the present invention further provide techniques for fabricating semiconductor package structures.

[0037] Additionally, at least some embodiments of the present invention provide products having legible markings present thereon.At least some embodiments of the present invention further provide techniques for manufacturing products.

[0038] Figure 1 A cross-sectional view of a semiconductor package structure 1 according to some embodiments of the present invention is illustrated. Figure 2 illustrate Figure 1 The top view of the semiconductor package structure 1 is shown in FIG. Figure 1 It is along Figure 2 A cross-sectional view taken along line II in FIG. Figure 3 Description Figure 2 Another cross-sectional view of the semiconductor package structure 1 taken along line II-II in FIG. Figure 4 illustrate Figure 2 A semiconductor package structure 1 may include a substrate 2, a semiconductor sensor 3, a cover 4, an adhesive layer 5, a gas permeable film 6, and an ink layer 7.

[0039] The substrate 2 may be any type and material and is not limited in the present invention. For example, the substrate 2 may include styrene-butadiene-styrene (SBS). In one embodiment, the substrate 2 may include a circuit layer adjacent to its top surface.

[0040] Semiconductor sensor 3 is located on and attached to the top surface of substrate 2. In one embodiment, semiconductor sensor 3 can be electrically connected to the circuit layer of substrate 2. Semiconductor sensor 3 can be a pressure sensor for sensing air pressure. In some embodiments, semiconductor sensor 3 can be a MEMS sensor, for example, a MEMS pressure sensor.

[0041] The cover 4 is located on the top surface of the substrate 2 and covers the semiconductor sensor 3. The cover 4 may include a ring portion 41 and a covering portion 42. The ring portion 41 is located on the substrate 2 and surrounds the semiconductor sensor 3. The covering portion 42 is located on the ring portion 41 and covers the semiconductor sensor 3. In some embodiments, the ring portion 41 and the covering portion 42 can be integrally formed into a monolithic structure. In some embodiments, the ring portion 41 and the covering portion 42 can be made of steel, for example, stainless steel. In some embodiments, the ring portion 41 can be made of liquid crystal polymer (LCP). The cover 4 has a through hole 40 corresponding to at least a portion of the semiconductor sensor 3, for example, the sensing area of ​​the semiconductor sensor 3. In one embodiment, the through hole 40 is located directly above the sensing area of ​​the semiconductor sensor 3, so that the semiconductor sensor 3 can easily sense air pressure. For example, the through hole 40 is defined by the covering portion 42 of the cover 4, and the through hole 40 extends through the covering portion 42 of the cover 4. In some embodiments, the area of ​​the covering portion 42 can be about 2 mm*2.5 mm from a top view. The diameter of the through hole 40 can be about 100 μm to about 400 μm from a top view. In some embodiments, the cover 4 can have more than one through hole 40 .

[0042] The adhesive layer 5 is located on the cover 4, for example, on the covering portion 42 of the cover 4. The adhesive layer 5 may also have through holes 50 corresponding to the through holes 40 of the cover 4. The adhesive layer 5 may be cured from a silicone adhesive.

[0043] The breathable film 6 is located on the adhesive layer 5 and is bonded to the cover 4 through the adhesive layer 5. The breathable film 6 covers the through-hole 40 of the cover 4. Therefore, the breathable film 6 can protect the semiconductor sensor 3 from dust and moisture and does not affect the air flow. The breathable film 6 has a first surface 61 and a second surface 62 opposite to the first surface 61. The second surface 62 faces the cover 4. The first surface 61 is hydrophilic. For example, the first surface 61 of the breathable film 6 has a water contact angle of less than 90 degrees, for example, less than 80 degrees, less than 70 degrees or less than 60 degrees. The thickness of the breathable film 6 can be about 20 μm.

[0044] In some embodiments, the breathable film 6 is made of a hydrophobic material, and the first surface 61 of the breathable film 6 is hydrophilically modified (i.e., modified by a hydrophilic modification process). For example, the breathable film 6 can be made of a hydrophobic fluoropolymer, such as polytetrafluoroethene (PTFE), expanded PTFE (ePTFE), polychlorotrifluoroethylene (PCTFE), perfluoroalkoxy (PFA), or tetrafluoroethylene-perfluoropropylene (FEP). The first surface 61 of the breathable film 6 has a hydrophilic functional group. For example, the hydrophilic functional group includes a C=O bond. The water contact angle of the hydrophobic fluoropolymer can be greater than 90 degrees, for example, greater than 100 degrees, greater than 110 degrees, or greater than 120 degrees. Hydrophilic modification (or hydrophilic surface treatment) such as plasma etching or sodium etching may be performed on the first surface 61 of the breathable film 6 to render the first surface 61 hydrophilic. The second surface 62 of the breathable film 6 may remain hydrophobic after such hydrophilic modification on the first surface 61. For example, the water contact angle of the first surface 61 may be approximately 116 degrees before the hydrophilic modification, and may be approximately 65 degrees after the hydrophilic modification. However, in some embodiments, the second surface 62 may also be hydrophilic to enhance its bonding strength with the adhesive layer 5.

[0045] The ink layer 7 is located on and covers the breathable film 6. The ink layer 7 is formed on the first surface 61 of the breathable film 6, for example, on the C=O bond. For example, the ink layer 7 contacts and adheres to the first surface 61 of the breathable film 6. In some embodiments, the ink layer 7 is formed of a UV-curable ink. For example, the UV-curable ink may be "ECO-UV" produced by Roland DGA. Because the first surface 61 of the breathable film 6 is hydrophilic, the ink layer 7 can be tightly bonded to the first surface 61 of the breathable film 6. For identification purposes, the optical properties of the ink layer 7 can be different from those of the breathable film 6. For example, the color of the ink layer 7 can be different from the color of the breathable film 6.

[0046] The ink layer 7 has at least one opening to expose at least a portion of the first surface 61 of the breathable membrane 6. For example, the ink layer 7 has a first opening 74 and a second opening 76. The first opening 74 extends through the ink layer 7 and exposes a first portion 64 of the first surface 61 of the breathable membrane 6 corresponding to the through-hole 40 of the cover 4. In one embodiment, the first opening 74 may be a circle corresponding to the through-hole 40 of the cover 4. The diameter of the first opening 74 of the ink layer 7 may be larger than the diameter of the through-hole 40 of the cover 4. For example, the diameter of the first opening 74 of the ink layer 7 may be approximately 500 μm.

[0047] The second opening 76 extends through the ink layer 7 and exposes the second portion 66 of the first surface 61 of the breathable film 6. The second opening 76 has the shape of a symbol, for example, a sign, a letter, or a character. Because the color of the ink layer 7 can be different from the color of the breathable film 6 (for example, the ink layer 7 is black and the breathable film 6 is white), the exposed second portion 66 of the first surface 61 of the breathable film 6 also appears in the shape of a symbol. The second portion 66 of the first surface 61 of the breathable film 6 exposed from the second opening 76 of the ink layer 7 can be identified as a mark on the breathable film 6. In some embodiments, as Figure 2 As shown in FIG, the shape of the opening 76 can be an English letter. In other embodiments, the shape of the opening 76 can be a geometric shape, a number, or a letter or character in another language. In some embodiments, the size of the symbol can be equal to or less than about 0.4 mm*0.3 mm (for example, for Figure 2However, in other embodiments, the size of the symbol may be about 0.175mm*0.11mm, about 0.255mm*0.18mm, about 0.275mm*0.18mm, about 0.325mm*0.2mm, about 0.4mm*0.3mm, about 0.8mm*0.5mm, or about 1.5mm*1mm. Figure 4 As shown in , the line width "W" of the symbol may be about 20 μm to about 50 μm.

[0048] For example, the ink layer 7 has a marking area 78, and the second opening 76 is located within the marking area 78. The size of the marking area 78 may be approximately equal to or less than approximately 0.4 mm by 1.6 mm, for example, approximately 0.255 mm by 1.02 mm, approximately 0.275 mm by 1.02 mm, or approximately 0.4 mm by 1.6 mm. In some embodiments, the ink layer 7 may have a plurality of second openings 76 in the shape of symbols. In one embodiment, the ink layer 7 has four to six, or even a greater number of second openings 76 in the marking area 78. For example, for four symbols having a size of approximately 0.275 mm by 0.18 mm, the size of the marking area 78 may be approximately 0.275 mm by 1.02 mm, and for four symbols having a size of approximately 0.4 mm by 0.3 mm, the size of the marking area 78 may be approximately 0.4 mm by 1.6 mm. In some embodiments, the marking area 78 includes the entire area of ​​the ink layer 7, but does not include the first opening 74.

[0049] like Figure 2 and Figure 3 As shown in FIG, the ink layer 7 may further have a third opening 77 extending through the ink layer 7 and exposing the third portion 67 of the first surface 61 of the breathable membrane 6. The third opening 77 may surround the first opening 74 and the second opening 76. The third opening 77 may be used for positioning the semiconductor package structure 1.

[0050] In some embodiments, the first opening 74, the second opening 76, and the third opening 77 can be formed by laser marking, i.e., by removing portions of the ink layer 7 using a laser source. Because the ink layer 7 is tightly bonded to the first surface 61 of the breathable film 6, the ink layer 7 may not peel off during laser marking. Therefore, the symbol has good resolution and is therefore clear. For example, Figure 4 As shown in , the symbol "A" may include two segments separated by a gap "G", and the width of the gap "G" is smaller than the line width "W" of one of the segments. Figure 4In the example, the width of the gap "G" is smaller than the line width "W" of the segment, and therefore, the segment of the letter "A" is defined as a continuous line, and the letter "A" is determined to be clear or qualified. In the comparative example, if the width of the gap "G" is larger than the line width "W" of the segment, the segment of the letter "A" is defined as a dotted line, and the letter "A" is determined to be unclear or unqualified.

[0051] Figure 5 A top view of a semiconductor package structure 1a according to some embodiments of the present invention is shown. The semiconductor package structure 1a is similar to Figures 1 to 4 , except that the size of the symbol (the shape of the second opening 76a or the second portion 66a) in the semiconductor package structure 1a is smaller than the size of the symbol (the shape of the second opening 76 or the second portion 66) in the semiconductor package structure 1. Therefore, more than four symbols can be present within the marking area 78a in the semiconductor package structure 1a.

[0052] The present invention further provides a product having legible indicia presented thereon. Figure 6 A cross-sectional view illustrating an example of a product 8 according to some embodiments of the present invention. Figure 7 illustrate Figure 6 The top view of the product 8 is shown in FIG. Figure 6 It is along Figure 7 The product 8 includes an object 60 and an ink layer 70.

[0053] The object 60 has a surface 601 and is made of a hydrophobic material. The object 60 may be a component of a semiconductor package structure, for example, the gas permeable film 6 of the semiconductor package structure 1 described above. Figure 6 As shown in , object 60 can be in the form of a film. However, this is not to be construed as limiting. In some embodiments, object 60 is made of a hydrophobic fluoropolymer, and surface 601 of object 60 is hydrophilically modified (e.g., by plasma etching or sodium etching). For example, surface 601 of object 60 has hydrophilic functional groups. The hydrophilic functional groups include C=O bonds. The material of object 60 can be similar to the material of breathable film 6 of semiconductor package structure 1 described above.

[0054] The ink layer 70 is bonded to the surface 601 of the object 60 and has an opening 706 to expose a portion 606 of the surface 601 of the object 60. For example, the ink layer 70 is formed on the surface 601 of the object 60, for example, on the C=O bond. The exposed portion 606 of the surface 601 of the object 60 is in the shape of a symbol, for example, a sign, letter, or character. In some embodiments, as Figure 7As shown in FIG, the shape of the exposed portion 606 can be an English letter. In other embodiments, the shape of the exposed portion 606 can be a geometric shape, a number, or a letter or character in another language. In some embodiments, the size of the symbol is equal to or less than about 0.4 mm*0.3 mm (for example, for Figure 7 Each of the letters shown in ). The line width of the symbol is about 20 μm to about 50 μm. Figure 7 , ink layer 70 and opening 706 are located within marking area 708 and do not extend across the entire surface 601 of object 60. Therefore, portions 609 of surface 601 of object 60 that are not covered by ink layer 70 may retain their original properties. In some embodiments, portion 609 of surface 601 of object 60 may not be hydrophilically modified and may retain its original hydrophobicity.

[0055] Figure 8 A cross-sectional view illustrating an example of a product 8a according to some embodiments of the present invention. Figure 9 illustrate Figure 8 The top view of the product 8a is shown in FIG. Figure 8 It is along Figure 9 The cross-sectional view taken along line IV-IV in FIG. Product 8a is similar to Figure 6 and 7 The product 8 shown in FIG is different in that the ink layer 70a occupies the entire surface 601 of the object 60. In other words, the marking area 708a covers the entire surface 601 of the object 60.

[0056] Figures 10 to 17 A method for manufacturing a semiconductor package structure according to some embodiments of the present invention is described. In some embodiments, the method is used to manufacture a semiconductor package structure. Figures 1 to 4 The semiconductor package structure 1 is shown in FIG.

[0057] refer to Figure 10 , providing a substrate 2. Substrate 2 can be a substrate of any type and material and is not limited in the present invention. In one embodiment, substrate 2 can include a circuit layer adjacent to its top surface. Subsequently, a semiconductor sensor 3 is placed on and attached to the top surface of substrate 2. Semiconductor sensor 3 can be a pressure sensor for sensing air pressure. In some embodiments, semiconductor sensor 3 can be a MEMS sensor, for example, a MEMS pressure sensor.

[0058] refer to Figure 11, a cover 4 is placed on the substrate 2 to cover the semiconductor sensor 3. The cover 4 may include an annular portion 41 and a covering portion 42. The annular portion 41 is located on the substrate 2 and surrounds the semiconductor sensor 3. The covering portion 42 is located on the annular portion 41 and covers the semiconductor sensor 3. In some embodiments, the annular portion 41 and the covering portion 42 may be integrally formed as a monolithic structure. The cover 4 has a through hole 40 corresponding to at least a portion of the semiconductor sensor 3, for example, the sensing area of ​​the semiconductor sensor 3. In one embodiment, the through hole 40 is located directly above the sensing area of ​​the semiconductor sensor 3, so that the semiconductor sensor 3 can easily sense the air pressure. For example, the through hole 40 is defined by the covering portion 42 of the cover 4, and the through hole 40 extends through the covering portion 42 of the cover 4. Subsequently, a breathable film 6 is placed to cover the cover 4 to cover the through hole 40 of the cover 4. The breathable film 6 may be bonded to the cover 4 by an adhesive layer 5. For example, the adhesive layer 5 is located on the cover 4, for example, on the covering portion 42 of the cover 4. The adhesive layer 5 can be formed by curing a silicone adhesive. The adhesive layer 5 can also have a through hole 50 corresponding to the through hole 40 of the cover 4. The breathable film 6 is located on the adhesive layer 5 and covers the through hole 40 of the cover 4. The breathable film 6 has a first surface 61 and a second surface 62 opposite to the first surface 61. The second surface 62 faces the cover 4. The breathable film 6 can be made of a hydrophobic material. That is, Figure 11 At the stage shown in FIG, both the first surface 61 and the second surface 62 of the breathable membrane 6 are hydrophobic. For example, the first surface 61 may have a water contact angle greater than 90 degrees.

[0059] Figure 12 illustrate Figure 11 Schematic diagram of measurement of water contact angle on the first surface 61 of the breathable film 6 shown in FIG. Figure 12 , place the water droplet 90 Figure 11 . In some embodiments, the contact angle θ1 of the water droplet 90 with the first surface 61 of the breathable film 6 can be about 116 degrees.

[0060] refer to Figure 13 , then modifying the first surface 61 of the breathable film 6. The first surface 61 of the breathable film 6 can be modified by a hydrophilic modification process, such as plasma etching or sodium etching. For example, the first surface 61 of the breathable film 6 can be modified by breaking the CC bonds and / or CF bonds of the first surface 61 of the breathable film 6. The CC bonds and / or CF bonds can be broken by plasma etching or sodium etching. For example, Figure 13 As shown in FIG, the first surface 61 of the breathable membrane 6 is modified by plasma 91.

[0061] Figure 14a 、 14b 14 and 14c illustrate the possible chemical structures of the first surface 61 of the breathable film 6 before, during and after the hydrophilic modification process, respectively. While not wishing to be bound by any theory, it is believed that the mechanism of the hydrophilic modification process can be briefly described as follows.

[0062] refer to Figure 14a , the first surface 61 is smooth and contains CF bonds and / or CC bonds. Accordingly, the first surface 61 is hydrophobic. Figure 14b During the plasma etching, the CF bonds and / or CC bonds are broken by the plasma 91 and the first surface 61 becomes rough. Figure 14c The broken C-bonds can react with oxygen in the air to form C=O bonds. Accordingly, the surface 61 becomes hydrophilic. For example, the first surface 61 can have a water contact angle of less than 90 degrees.

[0063] Figure 15 illustrate Figure 13 Schematic diagram of measurement of water contact angle on the first surface 61 of the breathable film 6 shown in FIG. Figure 15 , place the water droplet 90 Figure 13 . In some embodiments, the contact angle θ2 of the water droplet 90 with the first surface 61 of the breathable film 6 can be about 65 degrees.

[0064] refer to Figure 16 An ink layer 7 is applied to the first surface 61 of the breathable film 6. Specifically, the ink layer 7 is formed on the first surface 61 of the breathable film 6, for example, at the C=O bonds. For example, a printing structure 92 is used to apply an ink material 7'. The ink material 7' is sprayed onto the first surface 61 of the breathable film 6 via nozzles 93 of the printing structure 92. Immediately after spraying, the ink material 7' is cured by a UV source 95 adjacent to the nozzles 93 of the printing structure 92, thereby forming the ink layer 7. The ink layer 7 can cover the entire first surface 61 of the breathable film 6. Because the first surface 61 of the breathable film 6 is hydrophilic, the ink layer 7 can be tightly bonded to the first surface 61 of the breathable film 6. Furthermore, because the ink layer 7 is cured immediately after spraying, the risk of shrinkage of the ink layer 7 is reduced. For identification purposes, the optical properties of the ink layer 7 can differ from those of the breathable film 6. For example, the color of the ink layer 7 can differ from that of the breathable film 6.

[0065] refer to Figure 17 , by removing at least a portion of the ink layer 7 using, for example, a laser source 98 to expose at least a portion of the first surface 61 of the breathable film 6. Figure 17 As shown in FIG, a laser source 98 is focused by a focusing lens 97. For example, a portion of the ink layer 7 is removed by the laser source 98, thereby forming a Figure 2 The first opening 74, the second opening 76 and the third opening 77 are shown in FIG.

[0066] A first opening 74 extends through the ink layer 7 and exposes a first portion 64 of the first surface 61 of the breathable film 6 corresponding to the through-hole 40 of the cover 4. In one embodiment, the first opening 74 may be a circle corresponding to the through-hole 40 of the cover 4. The diameter of the first opening 74 of the ink layer 7 may be larger than the diameter of the through-hole 40 of the cover 4. A second opening 76 extends through the ink layer 7 and exposes a second portion 66 of the first surface 61 of the breathable film 6. The second opening 76 has the shape of a symbol, such as a sign or character. Because the color of the ink layer 7 can be different from the color of the breathable film 6 (for example, the ink layer 7 is black and the breathable film 6 is white), the second portion 66 of the first surface 61 of the breathable film 6 also appears in the shape of a symbol. The second portion 66 of the first surface 61 of the breathable film 6 exposed through the second opening 76 of the ink layer 7 can be identified as a marking on the breathable film 6. A third opening 77 extends through the ink layer 7 and exposes a third portion 67 of the first surface 61 of the breathable film 6. The third opening 77 may surround the first opening 74 and the second opening 76. The third opening 77 may be used for positioning the semiconductor package structure 1 .

[0067] Since the ink layer 7 is tightly bonded to the first surface 61 of the breathable film 6, the ink layer 7 may not be peeled off when forming the second opening 76 using the laser source 98. Therefore, the symbol has good resolution and is therefore clear.

[0068] Subsequently, the substrate 2, the cover 4, the adhesive layer 5, the breathable film 6 and the ink layer 7 may be subjected to a singulation process, thereby forming a Figures 1 to 4 In some embodiments, the separation process can be performed in the semiconductor package structure 1 shown in FIG. Figure 11 The process is carried out after the stages shown in FIG, and the individual units can be subjected to Figures 13 to 17 In some embodiments, the first surface 61 of the breathable film 6 may be subjected to a hydrophilic modification process before the breathable film 6 is placed on the adhesive layer 5. In addition, the second surface 62 may also be hydrophilic.

[0069] Figures 18 to 20 Methods for manufacturing a product according to some embodiments of the present invention are described. In some embodiments, the method is for manufacturing Figure 6 and 7 The product shown in 8.

[0070] refer to Figure 18 , providing an object 60. The object 60 has a surface 601 and is made of a hydrophobic material. Accordingly, the surface 601 of the object 60 may be initially hydrophobic. The object 60 may be a component of a semiconductor package structure, for example, the gas permeable film 6 of the semiconductor package structure 1 described above. Figure 18 As shown in , object 60 can be in the form of a film. However, it is not to be considered as limiting. In some embodiments, object 60 is made of a hydrophobic fluoropolymer.

[0071] Then, the surface 601 of the object 60 is hydrophilically modified. For example, the surface 601 of the object 60 can be modified by a hydrophilic modification process, such as plasma etching or sodium etching. Figure 18 As shown in FIG, the surface 601 of the object 60 is modified by the plasma 91 and thus becomes hydrophilic. The hydrophilic modification process may be performed on the entire surface 601 of the object 60. Alternatively, the hydrophilic modification process may be performed on only a portion of the surface 601 of the object 60 that may be covered by the ink layer 70, such as Figure 19 As shown in .

[0072] refer to Figure 19 Surface 601 of object 60 is coated with ink layer 70. For example, ink material 70' is applied using printing structure 92. Ink material 70' is sprayed onto surface 601 of object 60 via nozzle 93 of printing structure 92. Immediately after spraying, ink material 70' is cured by UV source 95 of printing structure 92 adjacent to nozzle 93, thereby forming ink layer 70 covering surface 601 of object 60. Ink layer 70 may cover a portion of surface 601 of object 60 and may be located within marking area 708. Because surface 601 of object 60 is hydrophilic, ink layer 70 may tightly adhere to surface 601 of object 60. Furthermore, because ink layer 7 cures immediately after spraying, the risk of shrinkage of ink layer 7 may be reduced. Portions 609 of surface 601 of object 60 outside marking area 708 may not be covered by ink layer 70.

[0073] refer to Figure 20 , by removing a portion of the ink layer 7 to expose a portion 606 of the surface 601 of the object 60, for example using a laser source 98. Figure 20 As shown in FIG, a laser source 98 is focused by a focusing lens 97. For example, a portion of the ink layer 7 is removed by the laser source 98, thereby forming a Figure 7 Because the ink layer 7 is tightly bonded to the surface 601 of the object 60, the ink layer 7 may not peel off when the opening 706 is formed using the laser source 98. Therefore, the symbol has good resolution and is therefore clear.

[0074] Unless otherwise specified, spatial descriptors such as "above," "below," "up," "left," "right," "lower," "top," "bottom," "vertical," "horizontal," "side," "above," "below," "upper," "on," "below," etc., are indicated relative to the orientation shown in the figures. It should be understood that the spatial descriptors used herein are for illustrative purposes only, and actual embodiments of the structures described herein may be spatially arranged in any orientation or manner, provided that the advantages of the embodiments of the present invention are not deviated by such arrangements.

[0075] As used herein, the terms "approximately," "substantially," "essentially," and "about" are used to describe and take into account small variations. When used in conjunction with an event or circumstance, the terms can refer to instances where the event or circumstance occurred exactly as well as instances where the event or circumstance occurred very approximately. For example, when used in conjunction with a numerical value, the terms can refer to a range of variation of less than or equal to ±10% of the numerical value, e.g., less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, two values ​​may be considered “substantially” the same or equal if the difference between them is less than or equal to ±10% of the mean of the values ​​(e.g., less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%).

[0076] Two surfaces may be considered coplanar or substantially coplanar if the displacement between the two surfaces is no greater than 5 μm, no greater than 2 μm, no greater than 1 μm, or no greater than 0.5 μm.

[0077] As used herein, the singular terms "a," "an," and "the" may include plural referents unless the context clearly dictates otherwise.

[0078] As used herein, the terms "conductive," "electrically conductive," and "conductivity" refer to the ability to carry an electric current. Conductive materials generally refer to those materials that present little or no resistance to the flow of electric current. One measure of conductivity is Siemens per meter (S / m). Typically, a conductive material is one that has a conductivity greater than approximately 10 4 S / m (e.g., at least 10 5 S / m or at least 10 6The electrical conductivity of a material can sometimes vary with temperature. Unless otherwise specified, the electrical conductivity of a material is measured at room temperature.

[0079] In addition, amounts, ratios, and other numerical values ​​are sometimes presented herein in a range format. It should be understood that this range format is used for convenience and brevity and should be interpreted flexibly to encompass not only the values ​​explicitly stated as range limits, but also all individual values ​​or subranges encompassed within that range, as if each value and subrange were explicitly stated.

[0080] Although the present invention has been described and illustrated with reference to specific embodiments of the present invention, these descriptions and illustrations are not restrictive. Those skilled in the art will understand that various changes may be made and equivalents substituted without departing from the true spirit and scope of the present invention as defined by the appended claims. The illustrations may not necessarily be drawn to scale. Due to manufacturing processes and tolerances, there may be differences between the artistic reproduction of the present invention and the actual device. There may be other embodiments of the present invention that are not specifically described. This description and drawings should be considered illustrative and not restrictive. Modifications may be made to make specific circumstances, materials, compositions of matter, methods or processes suitable for the objectives, spirit and scope of the present invention. All such modifications are intended to be within the scope of the appended claims. Although the methods disclosed herein have been described with reference to specific operations performed in a specific order, it should be understood that these operations can be combined, subdivided or reordered to form equivalent methods without departing from the teachings of the present invention. Accordingly, unless specifically indicated herein, the order and grouping of operations are not limitations of the present invention.

Claims

1. A semiconductor package structure, comprising: substrate; a semiconductor sensor located on the substrate; a cover covering the semiconductor sensor and having a through hole; a breathable film covering the through-hole of the cover and having a first surface and a second surface opposite to the first surface, wherein the breathable film is made of a hydrophobic material, and the first surface of the breathable film is hydrophilically modified, wherein the second surface of the breathable film remains hydrophobic after the hydrophilic modification on the first surface; as well as An ink layer is formed on the first surface of the breathable film and defines at least one opening to expose the breathable film. 2 . The semiconductor package structure according to claim 1 , wherein the entire first surface of the breathable film is hydrophilically modified. 3 . The semiconductor package structure according to claim 1 , wherein the first surface of the gas permeable film is an etched surface. 4 . The semiconductor package structure according to claim 1 , wherein the first surface of the gas permeable film is rougher than the second surface. 5 . The semiconductor package structure according to claim 1 , wherein the breathable film is used to protect the semiconductor sensor and does not affect air flow. The semiconductor package structure according to claim 5 , wherein the breathable film is made of a hydrophobic fluoropolymer. 7 . The semiconductor package structure according to claim 6 , wherein the first surface of the gas permeable film is an etched surface, and wherein the first surface of the gas permeable film is rougher than the second surface of the gas permeable film. 8 . The semiconductor package structure according to claim 1 , wherein the at least one opening of the ink layer exposes at least a portion of the first surface of the breathable film, wherein the exposed at least one portion of the first surface of the breathable film is hydrophilic. 9 . The semiconductor package structure according to claim 1 , wherein the at least one opening of the ink layer comprises a first opening corresponding to the through hole of the cap.

10. The semiconductor package structure according to claim 9, wherein the at least one opening of the ink layer comprises a second opening having a shape of a symbol, wherein the symbol comprises two segments separated by a gap, and a width of the gap is smaller than a line width of one of the segments. The semiconductor package structure according to claim 10 , wherein a size of the symbol is equal to or smaller than 0.4 mm*0.3 mm. 12 . The semiconductor package structure according to claim 1 , wherein the ink layer has a marking area, and a size of the marking area is equal to or smaller than 0.4 mm*1.6 mm. 13 . The semiconductor package structure according to claim 1 , wherein the first surface of the gas permeable film has a hydrophilic functional group. The semiconductor package structure according to claim 13 , wherein the hydrophilic functional group comprises a C═O bond. 15 . The semiconductor package structure according to claim 14 , wherein the ink layer is formed on the C═O bond. 16 . The semiconductor package structure according to claim 1 , further comprising an adhesive layer located on the cover, wherein the breathable film is adhered to the cover via the adhesive layer, and the adhesive layer has a through hole corresponding to the through hole of the cover. 17 . The semiconductor packaging structure according to claim 16 , wherein the through hole of the cover is located within a vertical projection range of the through hole of the adhesive layer, and the through hole of the adhesive layer is located within a vertical projection range of the at least one opening of the ink layer. The semiconductor package structure according to claim 16 , wherein a thickness of the gas permeable film is smaller than a thickness of the adhesive layer. 19 . The semiconductor package structure according to claim 16 , wherein outer sides of the substrate, the cover, the adhesive layer, the breathable film, and the ink layer are flush with each other.

20. The semiconductor package structure according to claim 16, wherein the semiconductor sensor is a MEMS pressure sensor, the semiconductor sensor is located on and attached to the top surface of the substrate, and a vertical projection of the through hole of the cover is located within the range of the semiconductor sensor.

21. The semiconductor packaging structure according to claim 1, wherein the cover comprises a ring-shaped portion and a covering portion, the ring-shaped portion is located on the substrate and surrounds the semiconductor sensor, the covering portion is located on the ring-shaped portion and covers the semiconductor sensor, and the ring-shaped portion and the covering portion are integrally formed into a single structure. 22 . The semiconductor package structure according to claim 21 , wherein the annular portion and the covering portion are made of steel.

23. A method for manufacturing a semiconductor package structure, comprising: (a) Providing a semiconductor package device comprising: a substrate; and a semiconductor sensor located on the substrate; a cover covering the semiconductor sensor and having a through hole; and a gas-permeable film covering the through hole of the cover, wherein the gas-permeable film has a first surface and a second surface opposite to the first surface; (b) hydrophilically modifying the first surface of the breathable film, wherein the second surface of the breathable film remains hydrophobic after the hydrophilic modification on the first surface; (c) coating the first surface of the breathable film with ink; (d) curing the ink to form an ink layer; as well as (e) removing at least a portion of the ink layer to expose the breathable film.

24. The method according to claim 23, wherein step (b) comprises hydrophilically modifying the entire first surface of the breathable film.

25. The method of claim 24, wherein in step (c), the ink coats the entire first surface of the breathable film; and wherein in step (d), the entire ink layer is tightly bonded to the entire first surface of the breathable film.

26. The method according to claim 23, wherein in step (b), the first surface of the breathable film is modified by breaking CC bonds and / or CF bonds. 27 . The method according to claim 26 , wherein breaking the CC bond and / or the CF bond comprises plasma etching or sodium etching, and the first surface of the breathable film becomes roughened.

28. The method of claim 27, wherein the first surface of the breathable film is rougher than the second surface of the breathable film.

29. The method of claim 23, wherein in step (e), the at least one portion of the ink layer is removed by a laser to expose at least one portion of the first surface of the breathable film, wherein the exposed at least one portion of the first surface of the breathable film is hydrophilic.

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