Substrate cleaning device

Abstract

The present invention provides a substrate support device and a substrate cleaning device. The substrate support device (100) of the present invention comprises: a support portion (10), the support portion (10) being used to support a substrate W; a moving portion (50), the moving portion (50) being in contact with the support portion (10) and being used to move the support portion (10) along an axial direction; a fluid tube (60), at least a portion of which is arranged in the moving portion (50) for fluid flow, and when the moving portion (50) is in contact with the support portion (10), an outflow port (61) is covered by the support portion (10); and a detection portion (90), the detection portion (90) detecting the state of the aforementioned fluid.

Description

Technical Field

[0001] The present invention relates to a substrate supporting device for rotatably supporting a substrate, and a substrate cleaning device comprising the substrate supporting device.

[0002] This application claims priority based on Japanese Patent Application No. 2019-071877 filed on April 4, 2019, the entire contents of which are incorporated by reference. Background Art

[0003] In the past, there are known rotary chucks for supporting substrates such as wafers. Japanese Patent Publication No. 2005-19456 discloses a rotary chuck having a rotating shaft and a plurality of clamping members that clamp the wafer and can release the clamping. A linkage ring is provided that rotates with the rotary chuck in a manner that surrounds the rotating shaft and moves up and down in conjunction with the movement of the clamping members, and the height of the linkage ring can be detected by a position sensor. The position sensor outputs a detection signal that continuously changes according to the height of the linkage ring. The output of the position sensor can be digitized, and the state of the clamping member can be determined based on the digitized position information. Summary of the invention

[0004] (Technical problem to be solved by the invention)

[0005] The present invention provides a technology for grasping the state of a support portion by a method different from conventional ones.

[0006] (Methods used to solve technical problems)

[0007] [Concept 1]

[0008] The substrate support device of the present invention may also include:

[0009] A supporting portion, the supporting portion being used to support a substrate;

[0010] a moving portion, the moving portion abutting against the supporting portion and used to move the supporting portion along the axial direction;

[0011] a fluid pipe, at least a portion of which is disposed in the moving portion, through which the fluid flows, and when the moving portion abuts against the supporting portion, the fluid pipe covers the outflow port through the supporting portion; and

[0012] A detection unit detects a state of the fluid.

[0013] [Concept 2]

[0014] As the substrate support device of concept 1 of the present invention,

[0015] The detection unit can also detect the pressure or flow rate of the fluid flowing through the fluid tube.

[0016] [Concept 3]

[0017] As the substrate support device of concept 1 or concept 2 of the present invention,

[0018] There may also be a plurality of support portions.

[0019] A moving part is provided corresponding to each supporting part.

[0020] The fluid pipe is provided at each moving part.

[0021] [Concept 4]

[0022] The substrate support device according to any one of Concepts 1 to 3 of the present invention,

[0023] The fluid may also be a gas.

[0024] [Concept 5]

[0025] The substrate cleaning device of the present invention may also include:

[0026] The substrate supporting device of any one of Concepts 1 to 4 of the present invention; and

[0027] A control unit determines whether the moving unit is in contact with the supporting unit based on the information from the detecting unit.

[0028] [Concept 6]

[0029] As the substrate cleaning device of concept 5 of the present invention,

[0030] A detection unit may be provided on each fluid pipe to detect the pressure or flow rate of the fluid flowing through the fluid pipe.

[0031] The control unit detects abnormality based on the detection results from each detection unit.

[0032] [Concept 7]

[0033] As the substrate cleaning device of concept 6 of the present invention,

[0034] The control unit may determine that an abnormality has occurred when an interval between a time when the control unit determines that a certain moving unit abuts against a certain supporting unit and a time when another moving unit abuts against another supporting unit exceeds a first time.

[0035] [Concept 8]

[0036] As the substrate cleaning device of concept 6 or concept 7 of the present invention,

[0037] The control unit may determine that an abnormality has occurred when an interval between a time when the control unit determines that a certain moving unit has left a certain supporting unit and a time when another moving unit has left another supporting unit exceeds a second time.

[0038] [Concept 9]

[0039] A substrate cleaning device as in any one of Concepts 6 to 8 of the present invention,

[0040] Here, the control unit may determine that an abnormality has occurred when the detection unit does not detect that the moving unit abuts against the supporting unit within a third time from when the moving unit starts to move in the direction toward the supporting unit.

[0041] [Concept 10]

[0042] A substrate cleaning device as in any one of Concepts 6 to 9 of the present invention,

[0043] Here, the control unit may determine that an abnormality has occurred when the detection unit does not detect that the moving unit has separated from the supporting unit within a fourth time period from when the moving unit starts to move in a direction away from the supporting unit.

[0044] [Concept 11]

[0045] A substrate cleaning device as in any one of Concepts 6 to 10 of the present invention,

[0046] There may also be a notification unit for notifying the support unit of information urging cleaning or replacement of the support unit when the control unit determines that an abnormality has occurred.

[0047] (Effects of the Invention)

[0048] The present invention adopts a mode in which a fluid tube is provided that covers the outflow port through the supporting part when the moving part abuts against the supporting part, and a detection part that detects the state of the fluid flowing through the fluid tube. Whether the moving part abuts against the supporting part can be determined by the state of the fluid, and the state of the supporting part can be determined. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 It is a schematic side cross-sectional view showing the structure of the substrate cleaning apparatus used in the embodiment of the present invention, and is a schematic side cross-sectional view showing a mode in which the support portion is in a lower position.

[0050] Figure 2 It is a schematic side cross-sectional view showing the structure of the substrate cleaning apparatus used in the embodiment of the present invention, and is a schematic side cross-sectional view showing a mode in which the support portion is in an upper position.

[0051] Figure 3This is a plan view of a support portion and a substrate used in the embodiment of the present invention as seen from above.

[0052] Figure 4 This is a side cross-sectional view of a support portion used in the embodiment of the present invention.

[0053] Figure 5 is a diagram showing the relationship between the moving part and the supporting part used in the embodiment of the present invention, and Figure 5 (a) is a side cross-sectional view showing a mode in which the moving part and the supporting part are located at a first position (lower position), Figure 5 (b) is a side cross-sectional view showing a mode in which the top surface of the moving part abuts against the bottom surface of the supporting part, Figure 5 (c) is a side cross-sectional view showing a mode in which the moving part and the supporting part are located at the second position (upper position), Figure 5 (d) is a side cross-sectional view showing a mode in which an abnormality occurs in which the support portion is located at the second position (upper position) although the moving portion is located at the first position (lower position).

[0054] Figure 6 The diagram shows a detection unit, an adjustment unit, an opening and closing unit, etc. used in the embodiment of the present invention, and is a diagram showing a mode in which a moving unit is separated from a supporting unit.

[0055] Figure 7 The diagram shows a detection unit, an adjustment unit, an opening and closing unit, etc. used in the embodiment of the present invention, and is a diagram showing a mode in which a moving unit and a supporting unit abut against each other.

[0056] Figure 8 It is a schematic plan view showing the overall structure of a substrate processing apparatus including a substrate cleaning apparatus according to an embodiment of the present invention.

[0057] Fig. 9 (a) is a perspective view showing a support portion, a base, a moving portion, and a connecting portion used in an embodiment of the present invention, Fig. 9 (b) is a perspective view showing a moving part and a connecting part used in an embodiment of the present invention.

[0058] Explanation of symbols

[0059] 10: Supporting part

[0060] 50: Mobile Department

[0061] 60: Fluid pipe

[0062] 61: Outflow

[0063] 81: Adjustment Department

[0064] 82: Opening and closing part

[0065] 90: Inspection Department

[0066] 91: Pressure detection unit

[0067] 92: Flow detection unit

[0068] 100: Substrate support device

[0069] 110: Elastic member

[0070] 120: Abutment

[0071] 130: Fluid supply unit

[0072] 131: First Magnet

[0073] 132: Second magnet

[0074] 133: The third magnet

[0075] 150: Control Department

[0076] 170: Notification Department

[0077] 190: Mobile connection

[0078] 200: Cleaning components

[0079] 250: Cleaning fluid supply unit

[0080] 310: Rack

[0081] 312: Loading port

[0082] 314a~314d:Grinding unit

[0083] 316: First cleaning unit

[0084] 318: Second cleaning unit

[0085] 320: Drying unit

[0086] 322: First Transport Robot

[0087] 324: Transport unit

[0088] 326: Second transport robot

[0089] 328: The third transport robot

[0090] W: substrate DETAILED DESCRIPTION

[0091] "constitute"

[0092] An embodiment of a substrate processing apparatus including a substrate cleaning apparatus and the like will be described.

[0093] like Figure 8As shown, the substrate processing apparatus of this embodiment has: a substantially rectangular frame 310; and a loading port 312 for loading and storing a plurality of substrates W. The loading port 312 is arranged adjacent to the frame 310. The loading port 312 can carry an open cassette, a SMIF (Standard Mechanical Interface) box, or a FOUP (Front Opening Unified Pod). The SMIF box and the FOUP are closed containers that store substrate cassettes inside and can maintain an environment independent of the external space by covering with a partition wall. The substrate W can be, for example, a semiconductor wafer.

[0094] The rack 310 contains a plurality of ( Figure 8 The illustrated mode includes four polishing units 314a to 314d, a first cleaning unit 316 and a second cleaning unit 318 for cleaning the polished substrate W, and a drying unit 320 for drying the cleaned substrate W. The polishing units 314a to 314d are arranged along the length direction of the substrate processing apparatus, and the cleaning units 316, 318 and the drying unit 320 are also arranged along the length direction of the substrate processing apparatus. According to the substrate processing apparatus of this embodiment, various substrates W can be polished in the manufacturing process of semiconductor wafers with a diameter of 300 mm or 450 mm, flat panels, image sensors such as CMOS (Complementary Metal Oxide Semiconductor) and CCD (Charge Coupled Device), and magnetic films in MRAM (Magnetoresistive Random Access Memory). In addition, the substrate processing apparatus of other embodiments may be an apparatus that performs cleaning and drying of the substrate W without providing a polishing unit for polishing the substrate W in the frame 310.

[0095] A first transfer robot 322 is disposed in an area surrounded by the loading port 312, the polishing unit 314a located on the side of the loading port 312, and the drying unit 320. In addition, a transfer unit 324 is disposed in parallel with the polishing units 314a to 314d, the cleaning units 316, 318, and the drying unit 320. The first transfer robot 322 receives the substrate W before polishing from the loading port 312 and delivers it to the transfer unit 324, or receives the substrate W after drying from the drying unit 320.

[0096] A second transfer robot 326 for transferring substrates W between the first cleaning unit 316 and the second cleaning unit 318 is disposed between the first cleaning unit 316 and the second cleaning unit 318, and a third transfer robot 328 for transferring substrates W between the second cleaning unit 318 and the drying unit 320 is disposed between the second cleaning unit 318 and the drying unit 320. Furthermore, a control unit 150 for controlling the operation of each device of the substrate processing apparatus is disposed inside the frame 310. This embodiment is described using a mode in which the control unit 150 is disposed inside the frame 310, but is not limited thereto, and the control unit 150 may be disposed outside the frame 310, or may be remotely disposed. When the control unit 150 is remotely disposed, each device of the substrate processing apparatus is remotely controlled.

[0097] The first cleaning unit 316 may also use a roller cleaning member that extends linearly and includes substantially the entire length of the diameter of the substrate W in the presence of a cleaning liquid, and causes the substrate W to rotate around a parallel central axis, and frictionally cleans the surface of the substrate W. For example, the substrate W may be held horizontally or vertically, rotated, and the roller cleaning member may be brought into contact with the substrate W for cleaning. In addition, the second cleaning unit 318 may also use a pen-shaped cleaning member that frictionally cleans the surface of the substrate W by bringing the contact surface of a cylindrical pen-shaped cleaning member extending in a vertical direction into contact in the presence of a cleaning liquid, causing the pen-shaped cleaning member to rotate and move in one direction. In addition, the drying unit 320 may also use a spin drying unit that sprays IPA vapor from a moving spray nozzle toward the substrate W held horizontally and rotates, and further rotates the substrate W at high speed to dry the substrate W by centrifugal force.

[0098] In addition, the first cleaning unit 316 may not be a roller cleaning device, but may be a pen-shaped cleaning device similar to the second cleaning unit 318, or a two-fluid jet cleaning device that cleans the surface of the substrate W by two-fluid jets. In addition, the second cleaning unit 318 may not be a pen-shaped cleaning device, but may be a roller cleaning device similar to the first cleaning unit 316, or a two-fluid jet cleaning device that cleans the surface of the substrate W by two-fluid jets.

[0099] The cleaning liquid of this embodiment contains a rinse liquid such as pure water (DIW), ammonia hydrogen peroxide (SC1), hydrochloric acid hydrogen peroxide (SC2), sulfuric acid hydrogen peroxide (SPM), sulfuric acid and water, fluoric acid and other chemicals. In this embodiment, unless otherwise specified, the cleaning liquid refers to the rinse liquid, the chemical, or both the rinse liquid and the chemical.

[0100] like Figure 1 and Figure 2As shown, the substrate cleaning device of this embodiment may also include: a substrate supporting device 100 composed of a spindle device and the like that supports the substrate W in a rotatable manner; one or more cleaning components 200 for cleaning the substrate W; and one or more cleaning liquid supply units 250 that supply cleaning liquid to the substrate W. This embodiment is illustrated using a mode in which the in-plane direction of the substrate W is supported in a horizontal direction, but is not limited to this. The in-plane direction of the substrate W may also be a vertical direction or a direction inclined from the horizontal direction. In addition, Figure 1 and Figure 2 A drum cleaning member is shown as an example of the cleaning member 200 .

[0101] like Figure 6 and Figure 7 As shown, the substrate support device 100 may also include: a support portion 10 for rotating the substrate W and supporting the main shaft of the substrate W; a moving portion 50 abutting against the support portion 10 and used to move the support portion 10 along the axial direction; a fluid tube 60 at least part of which is provided in the moving portion 50 for the flow of fluid, and when the moving portion 50 abuts against the support portion 10, the fluid tube 60 covers the flow outlet 61 through the support portion 10; and a detection portion 90 for detecting the state of the fluid. The moving portion 50 is, for example, a loose ring, and may also be composed of bolts, etc. In addition, the so-called "axial direction" is the normal direction of the substrate W, and is Figure 6 and Figure 7 In addition, if Fig. 9 As shown, the moving parts 50 can also be connected to each other via the moving connecting part 190 .

[0102] like Figure 4 As shown, the support portion 10 may also be provided by a base 120. The first magnet 131 is mounted on the base 120, and the first magnet 131 may also be arranged opposite to the side surface of the support portion 10. In addition, the second magnet 132 and the third magnet 133 may also be arranged in the support portion 10 away from each other in the vertical direction. In addition, the second magnet 132 and the third magnet 133 are arranged at positions staggered in the circumferential direction of the support portion 10.

[0103] In this mode, when the support portion 10 is in the first position (lower position), the first magnet 131 and the second magnet 132 are opposite to each other, and an attractive force acts between the first magnet 131 and the second magnet 132, and the support portion 10 becomes a clamping position for holding the substrate W (refer to Figure 1 ). Since the second magnet 132 and the third magnet 133 are arranged at positions staggered in the circumferential direction of the support portion 10, when the support portion 10 is located at the second position (upper position), a rotational force is applied to the support portion as the support portion moves. As a result, the substrate W is released from the gripping position (see Figure 2). Therefore, by moving the support part 10 along the normal direction (up and down direction) of the substrate W, the support part 10 can hold or release the substrate W. In addition, the mechanism is described in detail in Japanese Patent Publication No. 2009-295751, and the entire contents of Japanese Patent Publication No. 2009-295751 are incorporated into this application by reference.

[0104] The detection unit 90 can also detect the pressure and / or flow rate of the fluid flowing through the fluid tube 60. When the detection unit 90 detects the pressure of the fluid flowing through the fluid tube 60, the detection unit 90 includes a pressure detection unit 91 such as a pressure sensor or a pressure gauge (see Figure 6 and Figure 7 When the detection unit 90 detects the flow rate of the fluid flowing through the fluid pipe 60, the detection unit 90 includes a flow rate detection unit 92 such as a flow meter.

[0105] The fluid may also be a compressed fluid to which pressure is applied. In addition, the fluid may also be a gas or a liquid. However, when a liquid is used, there is a risk that the substrate W is contaminated by the liquid, so from this point of view, a mode using gas is preferred. For example, air, nitrogen, etc. may be used as the gas. For example, pure water, IPA, etc. may be used as the liquid. In addition, when a gas is used as the fluid, it is also expected that the pressure difference and the flow difference can be easily detected, and the detection sensitivity can be improved.

[0106] The fluid is supplied from the fluid supply unit 130 (see Figure 6 and Figure 7 ). The fluid may be supplied from the fluid supply unit 130 at any time, or the control unit 150 may control the fluid supply to start before the specified time when the movement starts through the moving unit 50. In the case of adopting a mode in which the fluid is supplied from the fluid supply unit 130 at any time, liquids such as cleaning fluids can be prevented from entering the fluid tube 60. In addition, in the case of adopting a mode in which the fluid is supplied before the specified time when the movement starts through the moving unit 50, the amount of fluid supplied can be reduced, and a power saving effect can also be expected. In the case of adopting a mode in which the fluid is supplied before the specified time when the movement starts through the moving unit 50, it is assumed that liquids such as cleaning fluids will enter the fluid tube 60, and the first pressure of the fluid at the moment when the fluid is supplied from the fluid supply unit 130 may be greater than the second pressure at the moment when the fluid flows continuously after the fluid is supplied. As an example, the first pressure may be 1.5 to 4 times the second pressure. By adopting this mode, liquids such as cleaning fluids entering the fluid tube 60 can be discharged to the outside, and then the fluid can be continuously supplied (supplied at the second pressure).

[0107] like Figure 6 and Figure 7As shown, a regulating part 81 called a flow regulating valve or a pressure regulating valve for regulating the fluid flow rate may be provided in the fluid pipe 60, and an opening and closing part 82 called an opening and closing valve for opening / closing the fluid supply may be provided. In addition, the flow rate of the fluid may also be regulated in the opening and closing part 82.

[0108] Alternatively, a plurality of support portions 10 may be provided, a moving portion 50 may be provided corresponding to each support portion 10 , and a fluid pipe 60 may be provided in each moving portion 50 . Figure 3 The illustrated mode is provided with four supporting parts 10 , but the moving parts 50 may be respectively provided corresponding to the four supporting parts 10 , and the fluid pipe 60 may be provided inside each moving part 50 .

[0109] The control unit 150 (see Figure 8 ) can also determine whether the moving part 50 is in contact with the supporting part 10 based on the information from the detection part 90.

[0110] The detection unit 90 may be provided in each fluid tube 60, and the control unit 150 detects an abnormality by comparing the detection results from each detection unit 90. For example, when the fluid pressure or flow rate in a certain fluid tube 60 is greater than the average value of the fluid pressure or flow rate in other fluid tubes 60 and exceeds the first pressure critical value or the first flow critical value, or is smaller than the second pressure critical value or the second flow critical value, the control unit 150 determines that an abnormality exists.

[0111] When the control unit 150 determines that the time when a certain moving unit 50 abuts against a certain support unit 10 and the time when another moving unit 50 abuts against another support unit 10 exceed the first relative reference time, the control unit 150 may also determine that an abnormality has occurred. In addition, when the time when a certain moving unit 50 abuts against a certain support unit 10 and the average time when other moving units 50 abut against the support unit 10 exceed the first average reference time, the control unit 150 may also determine that an abnormality has occurred. The first relative reference time or the first average reference time is also referred to as the first time in this application.

[0112] When the control unit 150 determines that the time when a certain moving unit 50 leaves a certain support unit 10 and the time when another moving unit 50 leaves another support unit 10 exceed the second relative reference time, the control unit 150 may also determine that an abnormality has occurred. In addition, when the time when a certain moving unit 50 leaves a certain support unit 10 and the average time when other moving units 50 leave the support unit 10 exceed the second average reference time, the control unit 150 may also determine that an abnormality has occurred. The second relative reference time or the second average reference time is also referred to as the second time in this application.

[0113] The control unit 150 may also determine that an abnormality has occurred when the detection unit 90 does not detect that the moving unit 50 is in contact with the support unit 10 within a third time after the moving unit 50 starts to move toward the support unit 10 .

[0114] The control unit 150 may also determine that an abnormality has occurred when the detection unit 90 does not detect that the moving unit 50 is separated from the support unit 10 within a fourth time period after the moving unit 50 starts to move in the direction away from the support unit 10 .

[0115] Alternatively, the time when the moving part 50 starts to move toward the support part 10 (e.g., upward movement) may be used as a starting point to measure the time when the moving part 50 contacts the support part 10 by the detection part 90. Alternatively, the time when the moving part 50 starts to move in a direction away from the support part 10 (e.g., downward movement) may be used as a starting point to measure the time when the moving part 50 separates from the support part 10 by the detection part 90.

[0116] A notification unit 170 may also be provided to notify the controller 150 of information urging the cleaning or replacement of the support unit 10 when the controller 150 determines that an abnormality has occurred (see Figure 8 For example, the notification unit 170 may urge the base 120 and the support unit 10 to clean the portions that serve as sliding surfaces.

[0117] Next, mainly use Figure 5 An example of the processing method of this embodiment is described. In the processing method described below, air is used as the fluid, a flow meter is used as the flow detection unit 92, a pressure gauge is used as the pressure detection unit 91, and four support units 10 and four moving units 50 are provided.

[0118] The moving part 50 and the supporting part 10 are located at the first position (lower position). Figure 5 As shown in (a), the top surface (upper surface) of the movable part 50 and the bottom surface (lower surface) of the supporting part 10 are separated. Since the outflow port 61 is not covered by the supporting part 10, the fluid flowing through the fluid tube 60 flows out from the outflow port 61. Therefore, the values ​​in the flow meter and the pressure gauge become constant values. The first position is the holding position of the substrate W and is also the rotation position. In addition, the holding of the substrate W is released at the second position (upper position) described later, and the second position becomes the release position.

[0119] The moving part 50 starts to rise, and the top surface of the moving part 50 abuts against the bottom surface of the supporting part 10 (see Figure 5 As a result, the fluid flowing out of the outlet 61 decreases, the air flow rate measured by the flow meter decreases or becomes zero, and the pressure measured by the pressure gauge increases.

[0120] The control unit 150 monitors the flow value of the flow meter and the pressure value of the pressure gauge, and determines whether the timing (Timing) of the moving unit 50 contacting the support unit 10 is simultaneous. If there is a delay in the timing of the moving unit 50 contacting the support unit 10, for example, it means that the support unit 10 is located at the second position side (for example, the upper position side), or the moving unit 50 is relative to the connecting part 190 (refer to Fig. 9 ) to the first position side (e.g., the lower position side). In addition, when the timing of the moving part 50 contacting the support part 10 is advanced, for example, the position of the support part 10 is moved to the first position side (e.g., the lower position side) due to the loosening of the screw, or the moving part 50 is relative to the connecting part 190 (see Fig. 9 ) to the second position side (for example, the upper position side). When there is a deviation in timing like this, there is a risk of failure in the handover of the substrate W or breakage of the substrate W. At this time, a buffer may also be provided, and it is judged to be normal when the interval between the time when a certain moving part 50 is judged to abut against a certain supporting part 10 and the time when another moving part 50 is judged to abut against another supporting part 10 does not reach the first time (the first relative reference time or the first average reference time). In addition, as long as the interval between the time when a certain moving part 50 is judged to abut against a certain supporting part 10 and the time when another moving part 50 is judged to abut against another supporting part 10 is longer than the first time, the control unit 150 may also judge that an abnormality has occurred.

[0121] When the moving part 50 and the supporting part 10 moved by the moving part 50 move to the second position (upper position) of the receiving position of the substrate W, the supporting part 10 is in the release position, and the supporting part 10 receives the substrate W (see also Figure 4 ). In addition, the time from when the moving part 50 starts to rise to when the support part 10 moves to the second position (upper position) is, for example, about one second. In addition, when the support part 10 has already grasped the substrate W (in Figure 5 When the substrate W is already held in (a) or (b), the substrate W that has been processed is carried out, and the substrate W to be processed is carried in, so that the substrate W is replaced.

[0122] When the support portion 10 receives the substrate W, the moving portion 50 moves toward the first position (lower position), and as a result, the support portion 10 also moves toward the first position (lower position).

[0123] When the movement reaches a certain extent, the top surface of the moving part 50 is separated from the bottom surface of the supporting part 10 (see Figure 5 At this time, the outlet 61 is opened, the air flow rate measured by the flow meter increases, and the pressure measured by the pressure gauge decreases.

[0124] The control unit 150 monitors the flow value of the flow meter and the pressure value of the pressure gauge, and determines whether the timing of the moving unit 50 contacting the support unit 10 is four times simultaneous. In the case where the timing of the moving unit 50 leaving the support unit 10 is delayed, for example, it indicates that the timing of the support unit 10 descending is delayed, and the timing of holding the substrate W is delayed. On the contrary, in the case where the timing of the moving unit 50 leaving the support unit 10 is advanced, for example, it indicates that the timing of the support unit 10 descending is advanced, and the timing of holding the substrate W is advanced. This can confirm the signs of failure in holding the substrate and failure in conveying. At this time, a buffer may also be provided, and it is judged to be normal when the interval between the time when a certain moving unit 50 is judged to leave a certain support unit 10 and the time when another moving unit 50 is judged to leave another support unit 10 does not reach the second time (the second relative reference time or the second average reference time). In addition, the control unit 150 may determine that an abnormality has occurred as long as the interval between a time when a certain moving unit 50 is judged to have left a certain supporting unit 10 and a time when another moving unit 50 is judged to have left another supporting unit 10 is greater than the second time.

[0125] When the control unit 150 determines that an abnormality has occurred, the notification unit 170 may urge the cleaning of the portion that becomes the sliding surface between the base 120 and the support unit 10. In addition, even if an abnormality is not confirmed, when a sign of a failure (described later) is confirmed, the notification unit 170 may urge the cleaning of the portion that becomes the sliding surface between the base 120 and the support unit 10.

[0126] Under normal conditions, it is repeatedly formed Figure 5 (a) → Figure 5 (b) → Figure 5 (c) → Figure 5 In other words, the elastic force generated by the elastic member 110 such as the spring provided in the support portion 10 is Figure 5 The state shown in (c) becomes Figure 5 However, if an abnormality occurs during the movement from the second position to the first position, the Figure 5 In the state (d), the moving part 50 is located at the second position, but the supporting part 10 is still located at the first position. In this case, the timing of the moving part 50 leaving the supporting part 10 is advanced at the abnormal part. When the supporting part 10 slides relative to the base 120, but the sliding force of the supporting part 10 on the base 120 becomes large, the following will occur. Figure 5 (d) status.

[0127] When a support portion 10 becomes as Figure 5In the state (d), since the support portion 10 does not hold the substrate W (loose state), the substrate W may be damaged if the substrate W is rotated in this state. Figure 5 The state (d) can also be detected by detecting that the moving part 50 starts to move toward the supporting part 10 (refer to Figure 5 (a)(b)) and the fact that the timing at which the moving part 50 contacts the supporting part 10 is delayed is used for detection.

[0128] "Effect"

[0129] Next, the effects of this embodiment formed by the above-mentioned configuration will be described, and those not yet described will be mainly described. Even if not described in the "configuration", all the configurations described in the "effect" can be adopted in this invention.

[0130] In the case of adopting a mode in which: when the moving part 50 abuts against the support part 10, the fluid tube 60 that covers the outflow port 61 through the support part 10; and the detection part 90 that detects the state of the fluid flowing through the fluid tube 60 (refer to Figure 6 and Figure 7 ), whether the moving part 50 is in contact with the supporting part 10 can be determined by the state of the fluid, and thus the state of the supporting part 10 can be determined. In addition, according to this mode, there is no need to place a component that generates heat, such as a power source, in the frame (not shown) of the substrate cleaning device. Therefore, there is an advantage that there is no risk of fire due to heat. In particular, when IPA is used as the cleaning fluid, the heat source cannot be placed in the frame due to the risk of fire, but according to this mode, there is an advantage that it can also cope with the case where IPA is used as the cleaning fluid.

[0131] This mode can accurately detect whether the moving part 50 is in contact with the supporting part 10 without being hindered by the splashes of the liquid even when the substrate W is cleaned with a liquid such as a cleaning liquid.

[0132] In addition, although it is difficult to confirm a slight deviation when confirming the actual position mode, since the above-mentioned mode can grasp the relationship between the support part 10 and the moving part 50 through the flow rate and pressure of the fluid, the relationship between the support part 10 and the moving part 50 can be confirmed very accurately.

[0133] When the detection unit 90 detects the pressure of the fluid flowing through the fluid tube 60, it is possible to determine whether the moving unit 50 is in contact with the support unit 10 by the pressure of the fluid. When the detection unit 90 detects the flow rate of the fluid flowing through the fluid tube 60, it is possible to determine whether the moving unit 50 is in contact with the support unit 10 by the flow rate of the fluid.

[0134] When the mode is adopted in which the moving parts 50 are provided corresponding to the respective support parts 10 and the fluid tube 60 is provided in each moving part 50 , it is possible to understand whether each moving part 50 is in contact with the support part 10 .

[0135] In the case of adopting a mode in which the detection unit 90 is provided in each fluid tube 60 and the control unit 150 detects abnormality by comparing the detection results from each detection unit 90, the presence or absence of abnormality can be relatively detected by comparing a certain moving unit 50 with other moving units 50. The deviation of the detection results of the detection unit 90 refers to the deviation of the timing of holding the substrate W by the support unit 10.

[0136] In the case of a mode in which an abnormality is determined to have occurred when either the time interval between a time when a certain moving part 50 is determined to have abutted against a certain supporting part 10 and the time interval between a time when another moving part 50 is determined to have abutted against another supporting part 10 exceeds a first relative reference time, the presence or absence of an abnormality can be relatively detected by comparing with other moving parts 50 when, for example, a moving part 50 rises and abuts against a supporting part 10. Since the substrate W may be held eccentrically in the case of a deviation in the holding timing, the notification unit 170 (see FIG. 14 ) can also be used to notify the substrate W of the deviation in the case of a deviation exceeding the first relative reference time. Figure 8 ) Please confirm the holding status of substrate W.

[0137] In addition, in the case of a mode in which an abnormality is judged to have occurred when the interval between the time when a certain moving part 50 is judged to abut against a certain supporting part 10 and the average time when other moving parts 50 are judged to abut against the supporting part 10 is longer than the first average reference time, the abnormality can be compared with the average time when the moving part 50 rises and abuts against the supporting part 10 to relatively detect whether there is an abnormality.

[0138] In a mode in which an abnormality is determined to have occurred when either the time interval between a time when a certain moving part 50 is determined to have left a certain supporting part 10 and a time interval between a time when another moving part 50 is determined to have left another supporting part 10 exceeds a second relative reference time, the presence or absence of an abnormality can be relatively detected by comparing with other moving parts 50 when the moving part 50, for example, descends and leaves the supporting part 10.

[0139] In addition, in the case of a mode in which an abnormality is judged to have occurred when the interval between the time when a certain moving part 50 is judged to have left a certain supporting part 10 and the average time when other moving parts 50 are judged to have left the supporting part 10 is longer than the second average reference time, the abnormality can be compared with the average time when the moving part 50 descends and abuts against the supporting part 10, for example, to relatively detect whether there is an abnormality.

[0140] In a mode in which an abnormality is determined to have occurred when the detection unit 90 does not detect that the moving unit 50 has abutted against the supporting unit 10 within a third time since the moving unit 50 started to move in the direction toward the supporting unit 10, a predetermined absolute time can be used as a reference to detect whether there is an abnormality when the moving unit 50, for example, rises and abuts against the supporting unit 10.

[0141] In a mode in which an abnormality is determined to have occurred when the moving part 50 leaves the supporting part 10 within a fourth time after the detection unit 90 fails to detect movement from the moving part 50 in a direction away from the supporting part 10, a predetermined absolute time can be used as a reference to detect whether an abnormality exists when the moving part 50, for example, descends and leaves the supporting part 10.

[0142] In the case of a mode in which the notification unit 170 notifies the user of information urging cleaning or replacement of the support unit 10 when an abnormality is determined to have occurred, the user can be urged to clean or replace the support unit 10, the support unit 10 can be moved normally, and the cleaning efficiency of the substrate W can be improved.

[0143] If it is determined that an abnormality has occurred, the control unit 150 may also control the substrate cleaning device to stop processing. In the event of an abnormality, the substrate W may not be held by the support unit 10 under normal conditions. When the substrate W is not held by the support unit 10 under normal conditions, if the substrate W is rotated by the support unit 10, the substrate W may fly out of the support unit 10 and be damaged. In the case of adopting this mode, such a situation can be prevented from occurring.

[0144] Furthermore, when the control unit 150 detects a sign before an abnormality occurs, the notification unit 170 may notify information urging cleaning or replacement of the support unit 10. In this case, cleaning or replacement of the support unit 10 may be urged before an abnormality occurs, thereby preventing a decrease in the cleaning efficiency of the substrate W. For example, a sign may be a state close to a threshold value but not exceeding the threshold value.

[0145] Regarding the aforementioned first time, for example, a first preparation time shorter than the first time (first relative reference time or first average reference time) (for example, 80% or 90% of the first time) is specified, and when a certain moving part 50 is compared with other moving parts 50, when the timing of the moving part 50 contacting the support part 10 exceeds the first preparation time, it is determined that it is a sign of abnormality. In addition, regarding the aforementioned second time, for example, a second preparation time shorter than the second time (second relative reference time or second average reference time) is specified (for example, 80% or 90% of the second time), and when a certain moving part 50 is compared with other moving parts 50, when the timing of the moving part 50 leaving the support part 10 exceeds the second preparation time, it is determined that it is a sign of abnormality. Regarding the aforementioned third time, for example, a third preparation time shorter than the third time is specified, and when the timing of the moving part 50 contacting the support part 10 exceeds the third preparation time (for example, 95% of the third time) from the time when the moving part 50 starts to move toward the support part 10, it is determined that it is a sign of abnormality. For example, a fourth preparation time shorter than the fourth time (for example, 95% of the fourth time) is specified, and when the moving unit 50 starts to move away from the support unit 10 and exceeds the fourth preparation time, it is determined that the moving unit 50 leaves the support unit 10 as a sign of abnormality.

[0146] The contents of the above-mentioned embodiments and the drawings are only for explaining an example of the invention described in the claims, and the invention described in the claims is not limited by the contents of the above-mentioned embodiments or the drawings. In addition, the claims described in the application are only an example, and the claims can be appropriately changed according to the description of the specification, drawings, etc. The substrate support device 100 of this embodiment can adopt various modules such as IPA module, PEN module, dual-fluid injection module, etc.

Claims

1. A substrate cleaning device, characterized in that: A substrate support device and a control unit are provided, The substrate support device comprises: A supporting portion, the supporting portion being used to support a substrate; a moving portion, the moving portion abutting against the supporting portion and used to move the supporting portion along the axial direction; a fluid pipe, at least a portion of which is disposed in the moving portion, through which the fluid flows, and when the moving portion abuts against the supporting portion, the fluid pipe covers the outflow port through the supporting portion; as well as a detection unit for detecting a state of the fluid, The control unit determines whether the moving unit is in contact with the supporting unit based on the information from the detecting unit. Each fluid pipe is provided with a detection unit, which detects the pressure or flow rate of the fluid flowing through the fluid pipe. The control unit detects abnormalities based on the detection results from each detection unit. The control unit determines that an abnormality has occurred when an interval between a time when the control unit determines that a certain moving unit abuts against a certain supporting unit and a time when another moving unit abuts against another supporting unit exceeds a first time.

2. A substrate cleaning device, characterized in that: A substrate support device and a control unit are provided, The substrate support device comprises: A supporting portion, the supporting portion being used to support a substrate; a moving portion, the moving portion abutting against the supporting portion and used to move the supporting portion along the axial direction; a fluid pipe, at least a portion of which is disposed in the moving portion, through which the fluid flows, and when the moving portion abuts against the supporting portion, the fluid pipe covers the outflow port through the supporting portion; as well as a detection unit for detecting a state of the fluid, The control unit determines whether the moving unit is in contact with the supporting unit based on the information from the detecting unit. Each fluid pipe is provided with a detection unit, which detects the pressure or flow rate of the fluid flowing through the fluid pipe. The control unit detects abnormalities based on the detection results from each detection unit. The control unit determines that an abnormality has occurred when an interval between a time when the control unit determines that a certain moving unit has separated from a certain supporting unit and a time when another moving unit has separated from another supporting unit exceeds a second time.

3. A substrate cleaning device, characterized in that: A substrate support device and a control unit are provided, The substrate support device comprises: A supporting portion, the supporting portion being used to support a substrate; a moving portion, the moving portion abutting against the supporting portion and used to move the supporting portion along the axial direction; a fluid pipe, at least a portion of which is disposed in the moving portion, through which the fluid flows, and when the moving portion abuts against the supporting portion, the fluid pipe covers the outflow port through the supporting portion; as well as a detection unit for detecting a state of the fluid, The control unit determines whether the moving unit is in contact with the supporting unit based on the information from the detecting unit. Each fluid pipe is provided with a detection unit, which detects the pressure or flow rate of the fluid flowing through the fluid pipe. The control unit detects abnormalities based on the detection results from each detection unit. The control unit determines that an abnormality has occurred when the detection unit does not detect that the moving unit has abutted against the supporting unit within a third time period from when the moving unit starts to move in the direction toward the supporting unit.

4. A substrate cleaning device, characterized in that: A substrate support device and a control unit are provided, The substrate support device comprises: A supporting portion, the supporting portion being used to support a substrate; a moving portion, the moving portion abutting against the supporting portion and used to move the supporting portion along the axial direction; a fluid pipe, at least a portion of which is disposed in the moving portion, through which the fluid flows, and when the moving portion abuts against the supporting portion, the fluid pipe covers the outflow port through the supporting portion; as well as a detection unit for detecting a state of the fluid, The control unit determines whether the moving unit is in contact with the supporting unit based on the information from the detecting unit. Each fluid pipe is provided with a detection unit, which detects the pressure or flow rate of the fluid flowing through the fluid pipe. The control unit detects abnormalities based on the detection results from each detection unit. The control unit determines that an abnormality has occurred when the detection unit does not detect that the moving unit is separated from the support unit within a fourth time period from when the moving unit starts to move in the direction away from the support unit.

5. The substrate cleaning device according to any one of claims 1 to 4, characterized in that: The detection unit detects pressure or flow rate of the fluid flowing through the fluid pipe.

6. The substrate cleaning device according to any one of claims 1 to 4, characterized in that: A plurality of the supporting parts are provided, A moving part is provided corresponding to each supporting part. The fluid pipe is provided at each moving part.

7. The substrate cleaning device according to any one of claims 1 to 4, characterized in that: The fluid is a gas.

8. The substrate cleaning device according to any one of claims 1 to 4, characterized in that: A notification unit is provided for notifying information urging cleaning or replacement of the support unit when the control unit determines that an abnormality has occurred.

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