A kind of solar skin and preparation method thereof

Abstract

The present invention provides a solar skin and a preparation method thereof, which relates to the field of solar energy technology and solves the technical problem that the solar cell components in the prior art adopt assembled, pasted and embedded installation methods, which are not easy to be effectively combined with the surface of the vehicle body and are easy to affect the appearance of the vehicle body. The solar skin includes a protective plate layer, a first interlayer layer, a first barrier layer, a second interlayer layer, a solar chip layer, a third interlayer layer, a second barrier layer, a fourth interlayer layer and a backplane layer which are laminated and composited in sequence. The solar chip layer is built-in and packaged between the second interlayer layer and the third interlayer layer. The present invention can directly replace the original cover plate of the vehicle body, which can perfectly fit the design of the whole vehicle without affecting the appearance of the vehicle. It is attached to the surface of the vehicle body as an external component and does not affect the reliability of the vehicle body structure. The present invention also provides two preparation methods of solar skin. The present invention is used to make the use of solar chips more convenient.

Description

Technical Field

[0001] The invention relates to the field of solar energy technology, and in particular to solar skin and a preparation method thereof. Background Art

[0002] Solar cells, also known as solar chips or photovoltaic cells, are thin sheets of optoelectronic semiconductors that use sunlight to generate electricity directly.

[0003] At present, automotive solar cell modules generally adopt assembled, pasted and embedded application solutions. Assembled automotive solar cell modules are mechanically and physically connected to the car body, which is low-cost and easy to construct, but it will affect the appearance and reliability of the car body design. Pasted automotive solar cell modules are directly pasted on the application surface of the car body with polymer weather-resistant structural adhesive. They are easy to construct and light in weight. They can meet the requirements of single-curved surface shape of the car body to a certain extent, but they cannot meet the requirements of complex design of hyperbolic and multi-curved surfaces. Embedded automotive solar cell modules generally use glass-based components, such as car sunroofs, to embed and encapsulate solar cells inside the components to form automotive photovoltaic applications with power generation functions. This design has excellent appearance, but high cost investment, and is limited by the function of the surface area of ​​the car body, and cannot be flexibly applied.

[0004] Therefore, how to solve the technical problem that solar cell modules in the prior art are not easily effectively combined with the vehicle surface and easily affect the appearance of the vehicle body by using assembled, pasted and embedded installation methods has become an important technical problem that people in this field need to solve. Summary of the invention

[0005] The purpose of the present invention is to provide a solar skin and a preparation method thereof, which solves the technical problem that the solar cell components in the prior art adopt assembly, adhesive and embedded installation methods, which are not easy to be effectively combined with the surface of the vehicle body and easily affect the appearance of the vehicle body. The preferred technical solutions among the many technical solutions provided by the present invention can produce many technical effects as described below.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] The solar skin provided by the present invention comprises: a protective plate layer, a first interlayer layer, a first barrier layer, a second interlayer layer, a solar chip layer, a third interlayer layer, a second barrier layer, a fourth interlayer layer and a backplane layer which are laminated and composited in sequence from top to bottom, and the solar chip layer is internally wrapped between the second interlayer layer and the third interlayer layer.

[0008] Preferably, the material of the protective plate layer is a highly light-transmitting and highly weather-resistant material.

[0009] Preferably, the back plate layer is made of a hard and highly weather-resistant material.

[0010] Preferably, a junction box electrically connected to the solar chip layer is included.

[0011] The present invention provides a method for preparing solar skin, comprising:

[0012] Step 1: Arrange the solar chip layer, interconnect the solar chips into preset required specifications to form a string, and arrange the positive and negative lead wires on the string to form a chip module;

[0013] Step 2: Perform the first laying, and lay the second barrier layer, the third interlayer film layer, the chip module, the second interlayer film layer and the first barrier layer in sequence from bottom to top;

[0014] Step 3: Perform the first vacuum hot pressing, send the whole module after the first laying into the laminator, form sub-strings after the first vacuum hot pressing, and pre-lay high-temperature cloth on the upper and lower parts of the whole module before hot pressing;

[0015] The parameters of the laminator for the first vacuum hot pressing are as follows: the temperature is 140°C to 180°C, and the vacuuming time is 1 minute to 10 minutes;

[0016] The pressure value of the first stage is -90KPa to -60KPa, and the time value is 30 seconds to 300 seconds;

[0017] The pressure value of the second stage is -60KPa to -20KPa, and the time value is 30 seconds to 300 seconds;

[0018] The pressure value of the third stage is -20KPa~0KPa, and the time value is 600 seconds~5400 seconds;

[0019] Step 4: perform the second laying, and lay the protective plate layer, the first interlayer layer, the substring, the fourth interlayer layer and the backing plate layer in order from bottom to top;

[0020] Step 5: Perform vacuum hot pressing for the second time, send the overall module after the second laying into the laminating machine, and pre-lay high-temperature cloth on the upper and lower parts of the overall module before hot pressing;

[0021] The laminator parameters for the second vacuum hot pressing are: temperature value is 100°C to 140°C, and vacuuming time is 1 minute to 10 minutes;

[0022] The pressure value of the first stage is -90KPa to -60KPa, and the time value is 30 seconds to 600 seconds;

[0023] The pressure value of the second stage is -60KPa to -30KPa, and the time value is 30 seconds to 300 seconds;

[0024] The pressure value of the third stage is -30KPa~0KPa, and the time value is 600 seconds~5400 seconds;

[0025] Step six, cooling;

[0026] Step seven, after cooling, the whole module is subjected to appearance inspection, trimming process, IV test and insulation withstand voltage test, and the junction box is assembled.

[0027] Preferably, the laminator parameters for the first vacuum hot pressing are:

[0028] The temperature is 150℃~160℃, and the vacuuming time is 3 minutes~7 minutes;

[0029] The pressure value of the first stage is -80KPa to -70KPa, and the time value is 30 seconds to 180 seconds;

[0030] The pressure value of the second stage is -50KPa to -30KPa, and the time value is 30 seconds to 180 seconds;

[0031] The pressure value of the third stage is -10KPa~0KPa, and the time value is 900 seconds~2400 seconds.

[0032] Preferably, the laminator parameters for the second vacuum hot pressing are:

[0033] The temperature is 110℃~130℃, and the vacuuming time is 3 minutes~7 minutes;

[0034] The pressure value of the first stage is -80KPa to -70KPa, and the time value is 30 seconds to 300 seconds;

[0035] The pressure value of the second stage is -50KPa to -40KPa, and the time value is 30 seconds to 180 seconds;

[0036] The pressure value of the third stage is -20KPa~0KPa, and the time value is 1800 seconds~3600 seconds.

[0037] The present invention also provides another method for preparing solar skin, comprising:

[0038] Step 1: Arrange the solar chip layer, interconnect the solar chips into preset required specifications to form a string, and arrange the positive and negative lead wires on the string to form a chip module;

[0039] Step 2, performing the first laying, laying the second barrier layer, the third interlayer film layer, the chip module, the second interlayer film layer and the first barrier layer in sequence from bottom to top;

[0040] Step 3: Perform the first vacuum hot pressing, send the whole module after the first laying into the laminator, open the upper layer of the vacuum bag of the laminator, stack the laminated parts on the lower mesh cloth, close the upper layer of the vacuum bag and press the edge of the vacuum bag to form a closed space in the vacuum bag, connect the external vacuum tube and perform vacuum cold pumping on the closed space in the vacuum bag, wherein the furnace temperature parameters are set as follows:

[0041] The temperature value of the first stage is 80℃~110℃, and the time value is 5 minutes to 30 minutes;

[0042] The temperature of the second stage is 110°C to 140°C, and the time is 5 minutes to 30 minutes;

[0043] The temperature value of the third stage is 140℃~150℃, and the time value is 5 minutes~30 minutes;

[0044] The temperature value of the fourth stage is 150°C to 170°C, and the time value is 5 minutes to 90 minutes;

[0045] After confirming that the vacuum degree in the vacuum bag reaches the pressure value of -90KPa to -100KPa, disconnect the external vacuum tube, send the laminated table into the heating chamber and connect the internal vacuum tube for vacuum hot pressing, then take out the laminated table and send it to the cooling area for cooling to form a sub-string, take out the sub-string from the vacuum bag and transport it to the appearance inspection table for quality inspection;

[0046] Step 4: perform the second laying, and lay the protective plate layer, the first interlayer layer, the substring, the fourth interlayer layer and the backing plate layer in order from bottom to top;

[0047] Step 5: Perform vacuum hot pressing for the second time, send the whole module after the second laying into the laminator, open the upper layer of the vacuum bag of the laminator, stack the laminated parts on the lower mesh cloth, close the upper layer of the vacuum bag and press the edge of the vacuum bag to form a closed space in the vacuum bag, connect the external vacuum tube and perform vacuum cold extraction on the closed space in the vacuum bag, wherein the furnace temperature parameters are set as follows:

[0048] The temperature value of the first stage is 70℃~90℃, and the time value is 5 minutes to 30 minutes;

[0049] The temperature value of the second stage is 90℃~100℃, and the time value is 5 minutes~30 minutes;

[0050] The temperature value of the third stage is 100℃~110℃, and the time value is 5 minutes~30 minutes;

[0051] The temperature value of the fourth stage is 110°C to 140°C, and the time value is 5 minutes to 90 minutes;

[0052] After confirming that the vacuum degree in the vacuum bag reaches the pressure value of -95KPa, disconnect the external vacuum tube, send the laminated table into the heating chamber and connect the internal vacuum tube for vacuum hot pressing, then take out the laminated table and send it to the cooling area for cooling, take out the cooled whole assembly from the vacuum bag and transport it to the appearance inspection table for quality inspection;

[0053] Step six, trimming, IV test, insulation withstand voltage test and junction box assembly of the whole assembly.

[0054] Preferably, when performing the first vacuum hot pressing, the furnace temperature parameters are set to:

[0055] The temperature value of the first stage is 100°C and the time value is 5 to 10 minutes;

[0056] The temperature value of the second stage is 130°C, and the time value is 5 minutes to 10 minutes;

[0057] The temperature value of the third stage is 150°C, and the time value is 5 minutes to 10 minutes;

[0058] The temperature value of the fourth stage is 160° C., and the time value is 10 minutes to 70 minutes.

[0059] Preferably, during the second vacuum hot pressing, the furnace temperature parameters are set as follows:

[0060] The temperature value of the first stage is 80°C, and the time value is 5 minutes to 10 minutes;

[0061] The temperature value of the second stage is 100°C and the time value is 5 minutes to 10 minutes;

[0062] The temperature value of the third stage is 105°C, and the time value is 5 minutes to 10 minutes;

[0063] The temperature value of the fourth stage is 110° C. to 130° C., and the time value is 10 minutes to 70 minutes.

[0064] Compared with the prior art, the present invention has the following beneficial effects:

[0065] (1) In the present invention, the protective plate layer, the first interlayer layer, the first barrier layer, the second interlayer layer, the solar chip layer, the third interlayer layer, the second barrier layer, the fourth interlayer layer and the backplane layer are laminated and compounded in sequence from top to bottom so that they can form a solid whole, and the solar chip layer is firmly bonded and embedded between the second interlayer layer and the third interlayer layer to avoid damage from foreign objects, which greatly improves the integrity and weather resistance of the component. The laminated whole can directly replace the existing cover plate of the vehicle body, which can perfectly fit the design of the whole vehicle without affecting the appearance of the vehicle. It is attached to the surface of the vehicle body as an external component and does not affect the reliability of the vehicle body structure. At the same time, the present invention has strong adaptability and can be flexibly applied to any position on the surface of the vehicle body;

[0066] (2) In the present invention, the protective plate layer as the outer surface can withstand scratches and is used to protect the solar chip layer inside it. While ensuring that the solar chip layer inside it can work efficiently, it can also meet the surface mechanical performance requirements of various parts of the automobile surface and improve its service life;

[0067] (3) In the present invention, the back panel layer, as the outermost structure of the back, can cover the internal component structure of the automobile body and be fixedly connected to the automobile body, and can support and protect the solar chip layer while preventing it from being damaged by external objects. The back panel layer is made of highly weather-resistant material to increase its overall service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0068] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0069] Figure 1 Schematic diagram of the overall structure of the solar skin provided by an embodiment of the present invention.

[0070] In the figure, 1 is the protective plate layer; 2 is the first interlayer layer; 3 is the first barrier layer; 4 is the second interlayer layer; 5 is the solar chip layer; 6 is the third interlayer layer; 7 is the second barrier layer; 8 is the fourth interlayer layer; 9 is the back plate layer; and 10 is the junction box. DETAILED DESCRIPTION

[0071] To make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be described in detail below. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other implementation methods obtained by ordinary technicians in this field without creative work belong to the scope of protection of the present invention.

[0072] The purpose of the present invention is to provide a solar skin and a preparation method thereof, which solves the technical problem that solar cell components in the prior art adopt assembled, pasted and embedded installation methods, which are difficult to be effectively combined with the surface of the vehicle body and easily affect the appearance of the vehicle body.

[0073] The following is an explanation of the embodiments with reference to the accompanying drawings. In addition, the embodiments shown below do not limit the invention described in the claims. In addition, the entire contents of the configurations shown in the following embodiments are not limited to the solutions required as the invention described in the claims.

[0074] Reference Figure 1The present invention provides a solar skin, comprising a protective plate layer 1, a first interlayer film layer 2, a first barrier layer 3, a second interlayer film layer 4, a solar chip layer 5, a third interlayer film layer 6, a second barrier layer 7, a fourth interlayer film layer 8 and a backplane layer 9, which are laminated and composited in sequence from top to bottom. The solar chip layer 5 is built between the second interlayer film layer 4 and the third interlayer film layer 6. The solar chip layer 5 can be a thin-film solar cell layer. Preferably, the solar chip layer 5 can be a copper indium selenium thin-film battery layer. In this way, the protective plate layer 1 is used as an outer surface, which can withstand scratches to protect the solar chip layer 5 inside. The first barrier layer 3 and the second barrier layer 7 are respectively arranged on the upper and lower sides of the solar chip layer 5 to block water vapor to avoid water vapor from corroding the inner solar chip layer 5 and improve its weather resistance. The material of the first barrier layer 3 and the second barrier layer 7 can be, but is not limited to, a composite film layer. The solar chip layer 5 is a core power generation component that can generate electricity using light energy, thereby effectively utilizing energy. The first interlayer 2, the second interlayer 4, the third interlayer 6 and the fourth interlayer 8 are used as connecting adhesive layers, which can strongly bond the protective plate layer 1, the first barrier layer 3, the solar chip layer 5, the second barrier layer 7 and the back plate layer 9 during the lamination process, so that they can form a solid whole, and the solar chip layer 5 is firmly bonded and embedded between the second interlayer 4 and the third interlayer 6 to avoid damage from foreign objects, greatly improving the integrity and weather resistance of the component. The back plate layer 9, as the outermost structure of the back, can cover the internal component structure of the automobile body and be fixedly connected to the automobile body. Its connection method can refer to the connection between the external cover plate of the automobile and the body in the prior art. The back plate layer 9 can support and protect its upper components. Compared with the common vehicle cover plates in the prior art, such as the front cover and the roof cover, the present invention laminates and compounds the protective plate layer 1, the first interlayer layer 2, the first barrier layer 3, the second interlayer layer 4, the solar chip layer 5, the third interlayer layer 6, the second barrier layer 7, the fourth interlayer layer 8 and the back plate layer 9 according to the shapes of the corresponding positions into a whole, which can be directly replaced, and can perfectly fit the design of the whole vehicle without affecting the appearance of the vehicle. Moreover, as an external component attached to the surface of the vehicle body, it does not affect the reliability of the vehicle body structure. At the same time, the present invention has strong adaptability and can be flexibly applied to any position on the surface of the vehicle body. The solar cell module can be directly set as an internal component of the vehicle body cover plate, and adopts a thin and reliable plastic appearance material, which not only meets the diversity of the shape of the vehicle external components, but also easily realizes a variety of appearances. At the same time, it ensures the effective conversion and utilization of light energy by the solar chip layer 5, greatly avoiding the waste of energy, and solving the technical problems in the prior art that the solar cell module adopts assembled, pasted and embedded installation methods, which is not easy to be effectively combined with the surface of the vehicle body and is easy to affect the appearance of the vehicle body.

[0075] The materials of the first interlayer 2, the second interlayer 4, the third interlayer 6 and the fourth interlayer 8 can be but are not limited to ethylene-vinyl acetate copolymer (EVA) or polyolefin elastomer (POE). Ethylene-vinyl acetate hot melt adhesive has strong adhesion, good toughness of the adhesive layer, high strength, and can meet the requirements of heat resistance and cold resistance. Polyolefin elastomer hot melt adhesive has the advantages of no odor, low density, high flow coating and good wettability.

[0076] As an optional implementation method of an embodiment of the present invention, the material of the protective plate layer 1 is a highly light-transmitting and highly weather-resistant material, which may be but is not limited to polycarbonate (PC) or polymethyl methacrylate (PMMA). While ensuring that the solar chip layer 5 on its inner side can work efficiently, it can also meet the surface mechanical performance requirements of various parts of the automobile surface and improve its service life.

[0077] As an optional implementation of the embodiment of the present invention, the material of the back plate layer 9 is a hard and highly weather-resistant material, which can support and protect the solar chip layer 5 and prevent damage to it by objects outside it. The back plate layer 9 is made of a highly weather-resistant material to increase the overall service life. The material of the back plate layer 9 can be, but is not limited to, polycarbonate (PC), polymethyl methacrylate (PMMA) or a metal plate. The back plate layer 9 can also be made of composite materials such as carbon fiber boards and glass fiber boards.

[0078] As an optional implementation of the embodiment of the present invention, the present invention includes a junction box 10 electrically connected to the solar chip layer 5 for electrical output of the solar chip layer 5, which can be installed in a front or back manner according to actual needs. The waterproof level of the junction box 10 can meet IP67 or above, while ensuring reliable connection.

[0079] The present invention provides a method for preparing solar skin, comprising:

[0080] Step 1: Arrange the solar chip layer, interconnect the solar chips into preset specifications to form a string, and arrange the positive and negative lead wires on the string to form a chip module;

[0081] Step 2: Perform the first laying, and lay the second barrier layer, the third interlayer film layer, the chip module, the second interlayer film layer and the first barrier layer from bottom to top in sequence. You can first prepare the chip module, each barrier layer and each interlayer film layer, and then lay each layer in sequence on the laying workbench.

[0082] Step 3: Perform the first vacuum hot pressing, send the whole module after the first laying into the laminator, form sub-strings after the first vacuum hot pressing, and pre-lay high-temperature cloth on the upper and lower parts of the whole module before hot pressing;

[0083] Among them, the laminator parameters for the first vacuum hot pressing are:

[0084] The temperature is 140℃~180℃, and the vacuuming time is 1 minute to 10 minutes;

[0085] The pressure value of the first stage is -90KPa to -60KPa, and the time value is 30 seconds to 300 seconds;

[0086] The pressure value of the second stage is -60KPa to -20KPa, and the time value is 30 seconds to 300 seconds;

[0087] The pressure value of the third stage is -20KPa~0KPa, and the time value is 600 seconds~5400 seconds;

[0088] That is, the second barrier layer, the third interlayer layer, the solar chip layer, the second interlayer layer and the first barrier layer are pre-pressed first, so that each layer can be tightly pressed under appropriate temperature and pressure, and connected firmly, avoiding excessively high or low temperature, which may affect the lamination and bonding performance.

[0089] Step 4, carry out the second laying, lay the protection plate layer, the first interlayer layer, the sub-string, the fourth interlayer layer and the backplane layer from bottom to top in sequence, that is, the protection plate layer, the first interlayer layer, the sub-string, the fourth interlayer layer and the backplane layer are laid on the laying workbench in advance.

[0090] Step 5: Perform vacuum hot pressing for the second time, send the overall module after the second laying into the laminating machine, and pre-lay high-temperature cloth on the upper and lower parts of the overall module before hot pressing;

[0091] The laminator parameters for the second vacuum hot pressing are: temperature value is 100°C to 140°C, and vacuuming time is 1 minute to 10 minutes;

[0092] The pressure value of the first stage is -90KPa to -60KPa, and the time value is 30 seconds to 600 seconds;

[0093] The pressure value of the second stage is -60KPa to -30KPa, and the time value is 30 seconds to 300 seconds;

[0094] The pressure value of the third stage is -30KPa~0KPa, and the time value is 600 seconds~5400 seconds;

[0095] That is, the protective plate layer, the first interlayer layer, the sub-string, the fourth interlayer layer and the backplane layer are pressed together at the appropriate temperature and pressure, which can improve the connectivity between the sub-string and the protective plate layer, the first interlayer layer, the fourth interlayer layer and the backplane layer, as well as between the layers in the sub-string. Moreover, through two vacuum hot pressing processes with the temperature and pressure adapted to the corresponding materials, the bonding performance of each layer is better and the service life is longer.

[0096] Step six, cooling, that is, after the second vacuum hot pressing is completed, the whole module can be sent to the cold press for pressure-maintaining cooling until the surface temperature of the whole module drops to 60°C. ;

[0097] Step 7: After cooling, the whole module is subjected to appearance inspection, trimming process, IV test and insulation withstand voltage test, and the junction box is assembled. The whole module can be sent to the appearance inspection process for quality inspection. In the trimming process, a hot cutter can be used to remove the overflow glue on the edge of the whole module. IV test is a common process in the production process of solar cell production components. Insulation withstand voltage test is a technical means to inspect and evaluate the insulation withstand voltage capability of electrical equipment. It is similar to the existing technology and will not be repeated here.

[0098] Furthermore, the laminator parameters for the first vacuum hot pressing are:

[0099] The temperature is 150℃~160℃, and the vacuuming time is 3 minutes~7 minutes;

[0100] The pressure value of the first stage is -80KPa to -70KPa, and the time value is 30 seconds to 180 seconds;

[0101] The pressure value of the second stage is -50KPa to -30KPa, and the time value is 30 seconds to 180 seconds;

[0102] The pressure value of the third stage is -10KPa~0KPa, and the time value is 900 seconds~2400 seconds.

[0103] Furthermore, the laminator parameters for the second vacuum hot pressing are:

[0104] The temperature is 110℃~130℃, and the vacuuming time is 3 minutes~7 minutes;

[0105] The pressure value of the first stage is -80KPa to -70KPa, and the time value is 30 seconds to 300 seconds;

[0106] The pressure value of the second stage is -50KPa to -40KPa, and the time value is 30 seconds to 180 seconds;

[0107] The pressure value of the third stage is -20KPa~0KPa, and the time value is 1800 seconds~3600 seconds.

[0108] To improve production efficiency while ensuring the connection performance of each layer after lamination.

[0109] The present invention also provides another method for preparing solar skin, comprising:

[0110] Step 1: Arrange the solar chip layer, interconnect the solar chips into preset specifications to form a string, and arrange the positive and negative lead wires on the string to form a chip module;

[0111] Step 2: Perform the first laying, and lay the second barrier layer, the third interlayer film layer, the chip module, the second interlayer film layer and the first barrier layer from bottom to top in sequence. You can prepare the chip module, each barrier layer and each interlayer film layer first, and lay them in sequence on the laying workbench. The barrier layer needs to be cleaned before laying.

[0112] Step 3: Perform the first vacuum hot pressing, send the whole module after the first laying into the laminator, open the upper layer of the vacuum bag of the laminator, stack the laminated parts on the lower mesh cloth, close the upper layer of the vacuum bag and press the edge of the vacuum bag to form a closed space in the vacuum bag, connect the external vacuum tube and perform vacuum cold pumping on the closed space in the vacuum bag, wherein the furnace temperature parameters are set as follows:

[0113] The temperature value of the first stage is 80℃~110℃, and the time value is 5 minutes to 30 minutes;

[0114] The temperature of the second stage is 110°C to 140°C, and the time is 5 minutes to 30 minutes;

[0115] The temperature value of the third stage is 140℃~150℃, and the time value is 5 minutes~30 minutes;

[0116] The temperature value of the fourth stage is 150°C to 170°C, and the time value is 5 minutes to 90 minutes;

[0117] After confirming that the vacuum degree in the vacuum bag reaches the pressure value of -90KPa to -100KPa, disconnect the external vacuum tube, send the laminating table into the heating chamber and connect the internal vacuum tube for vacuum hot pressing, that is, close the chamber door of the heating chamber, open the vacuum valve, heating switch, and hot air forced convection fan in sequence to carry out vacuum hot pressing. After the lamination is completed, close the hot air forced convection fan, heating switch, and vacuum valve in sequence. Then take out the laminating table and send it to the cooling area for cooling to form a sub-string, that is, the cooling fan can be turned on during cooling until the surface temperature of the vacuum bag drops to 60°C, open the upper layer of the vacuum bag, take out the sub-string from the vacuum bag and transport it to the appearance inspection table for quality inspection;

[0118] Step 4: perform the second laying, laying the protective plate layer, the first laminated film layer, the sub-string, the fourth laminated film layer and the backing plate layer from bottom to top in sequence, and the protective plate layer can be cleaned in advance before laying;

[0119] Step 5: perform vacuum hot pressing for the second time, send the overall module after the second laying into the laminator, open the upper layer of the vacuum bag of the laminator, stack the laminated parts on the lower mesh cloth, close the upper layer of the vacuum bag and press the edge of the vacuum bag to form a closed space in the vacuum bag, connect the external vacuum tube and perform vacuum cold pumping on the closed space in the vacuum bag to make the vacuum bag adapt to the shape of the overall module and apply pressure to it. It should be noted that the protective plate layer and the back plate layer have a preset shape, and vacuum lamination is performed to make them fit closely with other layers between them. The furnace temperature parameters are set as follows:

[0120] The temperature value of the first stage is 70℃~90℃, and the time value is 5 minutes to 30 minutes;

[0121] The temperature value of the second stage is 90℃~100℃, and the time value is 5 minutes~30 minutes;

[0122] The temperature value of the third stage is 100℃~110℃, and the time value is 5 minutes~30 minutes;

[0123] The temperature value of the fourth stage is 110°C to 140°C, and the time value is 5 minutes to 90 minutes;

[0124] After confirming that the vacuum degree in the vacuum bag reaches the pressure value of -95KPa, disconnect the external vacuum tube, send the laminating table into the heating chamber and connect the internal vacuum tube for vacuum hot pressing, that is, close the chamber door of the heating chamber, open the vacuum valve, heating switch, and hot air forced convection fan in sequence to carry out vacuum hot pressing. After the lamination is completed, close the hot air forced convection fan, heating switch, and vacuum valve in sequence. Then take out the laminating table and send it to the cooling area for cooling. That is, the cooling fan can be turned on during cooling until the surface temperature of the vacuum bag drops to 60℃, open the upper layer of the vacuum bag, take out the cooled overall component from the vacuum bag, and transport it to the appearance inspection table for quality inspection;

[0125] Step six, trimming, IV test, insulation withstand voltage test and junction box assembly of the whole assembly.

[0126] By adopting the above steps, it is possible to perform firm lamination even when the solar skin has a large irregular curved surface, so that the shape processing of the solar skin is more flexible.

[0127] Furthermore, during the first vacuum hot pressing, the furnace temperature parameters are set as follows:

[0128] The temperature value of the first stage is 100°C and the time value is 5 to 10 minutes;

[0129] The temperature value of the second stage is 130°C, and the time value is 5 minutes to 10 minutes;

[0130] The temperature value of the third stage is 150°C, and the time value is 5 minutes to 10 minutes;

[0131] The temperature value of the fourth stage is 160° C., and the time value is 10 minutes to 70 minutes.

[0132] Furthermore, during the second vacuum hot pressing, the furnace temperature parameters are set as follows:

[0133] The temperature value of the first stage is 80°C, and the time value is 5 minutes to 10 minutes;

[0134] The temperature value of the second stage is 100°C and the time value is 5 minutes to 10 minutes;

[0135] The temperature value of the third stage is 105°C, and the time value is 5 minutes to 10 minutes;

[0136] The temperature value of the fourth stage is 110° C. to 130° C., and the time value is 10 minutes to 70 minutes, so as to improve the production efficiency under the premise of ensuring the connection performance of each layer after lamination.

[0137] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A solar skin, characterized in that: include: A protective plate layer (1), a first interlayer layer (2), a first barrier layer (3), a second interlayer layer (4), a solar chip layer (5), a third interlayer layer (6), a second barrier layer (7), a fourth interlayer layer (8) and a back plate layer (9) are laminated and composited in sequence from top to bottom, wherein the solar chip layer (5) is internally enclosed between the second interlayer layer (4) and the third interlayer layer (6); the material of the protective plate layer (1) is a material with high light transmittance and high weather resistance; The material of the back plate layer (9) is a hard and highly weather-resistant material; The method for preparing the solar skin comprises: Step 1: Arrange the solar chip layer, interconnect the solar chips into preset required specifications to form a string, and arrange the positive and negative lead wires on the string to form a chip module; Step 2: Perform the first laying, and lay the second barrier layer, the third interlayer film layer, the chip module, the second interlayer film layer and the first barrier layer in sequence from bottom to top; Step 3: Perform the first vacuum hot pressing, send the whole module after the first laying into the laminator, form sub-strings after the first vacuum hot pressing, and pre-lay high-temperature cloth on the upper and lower parts of the whole module before hot pressing; The parameters of the laminator for the first vacuum hot pressing are as follows: the temperature is 140°C to 180°C, and the vacuuming time is 1 minute to 10 minutes; The pressure value of the first stage is -90KPa to -60KPa, and the time value is 30 seconds to 300 seconds; The pressure value of the second stage is -60KPa to -20KPa, and the time value is 30 seconds to 300 seconds; The pressure value of the third stage is -20KPa~0KPa, and the time value is 600 seconds~5400 seconds; Step 4, performing a second laying, laying the protective plate layer, the first interlayer layer, the substring, the fourth interlayer layer and the back plate layer in sequence from bottom to top; Step 5: Perform vacuum hot pressing for the second time, send the overall module after the second laying into the laminating machine, and pre-lay high-temperature cloth on the upper and lower parts of the overall module before hot pressing; The laminator parameters for the second vacuum hot pressing are: temperature value is 100°C to 140°C, and vacuuming time is 1 minute to 10 minutes; The pressure value of the first stage is -90KPa to -60KPa, and the time value is 30 seconds to 600 seconds; The pressure value of the second stage is -60KPa to -30KPa, and the time value is 30 seconds to 300 seconds; The pressure value of the third stage is -30KPa~0KPa, and the time value is 600 seconds~5400 seconds; Step six, cooling; Step seven, after cooling, the whole module is subjected to appearance inspection, trimming process, IV test and insulation withstand voltage test, and the junction box is assembled.

2. The solar skin according to claim 1, characterized in that: It comprises a junction box (10) electrically connected to the solar chip layer (5).

3. The solar skin according to claim 1, characterized in that: The laminator parameters of the first vacuum hot pressing are: The temperature is 150℃~160℃, and the vacuuming time is 3 minutes~7 minutes; The pressure value of the first stage is -80KPa to -70KPa, and the time value is 30 seconds to 180 seconds; The pressure value of the second stage is -50KPa to -30KPa, and the time value is 30 seconds to 180 seconds; The pressure value of the third stage is -10KPa~0KPa, and the time value is 900 seconds~2400 seconds.

4. The solar skin according to claim 1, characterized in that: The laminator parameters for the second vacuum hot pressing are: The temperature is 110℃~130℃, and the vacuuming time is 3 minutes~7 minutes; The pressure value of the first stage is -80KPa to -70KPa, and the time value is 30 seconds to 300 seconds; The pressure value of the second stage is -50KPa to -40KPa, and the time value is 30 seconds to 180 seconds; The pressure value of the third stage is -20KPa~0KPa, and the time value is 1800 seconds~3600 seconds.

5. A method for preparing solar skin, characterized in that: Based on the solar skin according to any one of claims 1 to 4, comprising: Step 1: Arrange the solar chip layer, interconnect the solar chips into preset required specifications to form a string, and arrange the positive and negative lead wires on the string to form a chip module; Step 2: Perform the first laying, and lay the second barrier layer, the third interlayer film layer, the chip module, the second interlayer film layer and the first barrier layer in sequence from bottom to top; Step 3: Perform the first vacuum hot pressing, send the whole module after the first laying into the laminator, open the upper layer of the vacuum bag of the laminator, stack the laminated parts on the lower mesh cloth, close the upper layer of the vacuum bag and press the edge of the vacuum bag to form a closed space in the vacuum bag, connect the external vacuum tube and perform vacuum cold pumping on the closed space in the vacuum bag, wherein the furnace temperature parameters are set as follows: The temperature value of the first stage is 80℃~110℃, and the time value is 5 minutes to 30 minutes; The temperature of the second stage is 110°C to 140°C, and the time is 5 minutes to 30 minutes; The temperature value of the third stage is 140℃~150℃, and the time value is 5 minutes~30 minutes; The temperature value of the fourth stage is 150°C to 170°C, and the time value is 5 minutes to 90 minutes; After confirming that the vacuum degree in the vacuum bag reaches a pressure value of -90KPa to -100KPa, disconnect the external vacuum tube, send the laminated table into the heating chamber and connect the internal vacuum tube for vacuum hot pressing, then take out the laminated table and send it to the cooling area for cooling to form a sub-string, and then take the sub-string out of the vacuum bag and transport it to the appearance inspection table for quality inspection; Step 4, performing a second laying, laying the protective plate layer, the first interlayer layer, the substring, the fourth interlayer layer and the back plate layer in sequence from bottom to top; Step 5: Perform vacuum hot pressing for the second time, send the whole module after the second laying into the laminator, open the upper layer of the vacuum bag of the laminator, stack the laminated parts on the lower mesh cloth, close the upper layer of the vacuum bag and press the edge of the vacuum bag to form a closed space in the vacuum bag, connect the external vacuum tube and perform vacuum cold extraction on the closed space in the vacuum bag, wherein the furnace temperature parameters are set as follows: The temperature value of the first stage is 70℃~90℃, and the time value is 5 minutes to 30 minutes; The temperature value of the second stage is 90℃~100℃, and the time value is 5 minutes~30 minutes; The temperature value of the third stage is 100℃~110℃, and the time value is 5 minutes~30 minutes; The temperature value of the fourth stage is 110°C to 140°C, and the time value is 5 minutes to 90 minutes; After confirming that the vacuum degree in the vacuum bag reaches the pressure value of -95KPa, disconnect the external vacuum tube, send the laminated table into the heating chamber and connect the internal vacuum tube for vacuum hot pressing, then take out the laminated table and send it to the cooling area for cooling, take out the cooled whole assembly from the vacuum bag and transport it to the appearance inspection table for quality inspection; Step six, trimming, IV test, insulation withstand voltage test and junction box assembly of the whole assembly.

6. The method for preparing solar skin according to claim 5, characterized in that: When performing the first vacuum hot pressing, the furnace temperature parameters are set as follows: The temperature value of the first stage is 100°C and the time value is 5 to 10 minutes; The temperature value of the second stage is 130°C, and the time value is 5 minutes to 10 minutes; The temperature value of the third stage is 150°C, and the time value is 5 minutes to 10 minutes; The temperature value of the fourth stage is 160° C., and the time value is 10 minutes to 70 minutes.

7. The method for preparing solar skin according to claim 5, characterized in that: When performing the second vacuum hot pressing, the furnace temperature parameters are set as follows: The temperature value of the first stage is 80°C, and the time value is 5 minutes to 10 minutes; The temperature value of the second stage is 100°C and the time value is 5 minutes to 10 minutes; The temperature value of the third stage is 105°C, and the time value is 5 minutes to 10 minutes; The temperature value of the fourth stage is 110° C. to 130° C., and the time value is 10 minutes to 70 minutes.

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