Multi-station squaring equipment and its cutting method

Abstract

The present application discloses a multi-station squaring device and its cutting method, belonging to the technical field of silicon rod processing. It includes at least two silicon rod bearing platforms for bearing single-crystal silicon rods placed vertically, and each of the silicon rod bearing platforms has a rotating mechanism; and a wire cutting device is arranged above the at least two silicon rod bearing platforms, including a plurality of cutting wheels and a cutting wire that forms a cutting line segment or two mutually parallel cutting line segments around the plurality of cutting wheels. Through the multi-station squaring device and its cutting method of the present application, the squaring operation of multiple silicon rods can be completed simultaneously, and the cross-section of the silicon rod is rectangular after squaring treatment, and the squared silicon rod as a whole is a cuboid with four side skins, which can improve the cutting operation efficiency of silicon rod squaring, increase the cross-sectional area of the squared silicon rod while reducing the overall cost and risk of silicon rod squaring.

Description

Technical Field

[0001] The present application relates to the technical field of silicon rod processing, and in particular to a multi-station squaring device and a cutting method thereof. Background Art

[0002] At present, with the society's emphasis on and openness to the use of green renewable energy, the photovoltaic solar power generation field is gaining more and more attention and development. In the photovoltaic power generation field, the usual crystalline silicon solar cells are made on high-quality silicon wafers, which are cut from pulled or cast silicon ingots by multi-wire saws.

[0003] Traditional single crystal silicon rod squaring machines use a "well"-shaped cutting method to square single crystal silicon rods, making the squared silicon rods rectangular in shape. The silicon rods are then ground, rounded, and polished, and finally a multi-wire slicer is used to slice the squared silicon rods along the length direction to obtain the required silicon wafers. In this way, a large amount of raw materials will be wasted in the surface grinding operation of the rectangular silicon rods, and the surface area of ​​the obtained silicon wafers is small. In addition, this cutting method has many wire wheels and complex wiring.

[0004] In addition, in order to improve work efficiency, many squaring devices can cut multiple silicon rods at the same time. However, the existing squaring devices that cut multiple silicon rods at the same time either use one silicon rod cutting device to perform squaring operations on multiple silicon rods to be cut. Due to the large number of single crystal silicon rods to be cut, the spacing between the cutting wheels becomes larger and larger, resulting in low efficiency, large deviation between the cross-section and the center line, and edge collapse. Alternatively, a structural design that can complete the squaring of multiple silicon rods at one time is adopted. However, due to the large number of silicon rods, the cutting wire in the cutting mechanism of this silicon rod squaring machine needs to pass through many wire wheels when arranging the wiring, which causes large energy loss during operation and reduces the cutting efficiency. In order to ensure the cutting effect, the feeding speed of the cutting mechanism is usually very slow, so the overall cutting efficiency is actually not high. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the related technologies, the purpose of the present application is to disclose a multi-station squaring device and a cutting method thereof.

[0006] To achieve the above-mentioned purpose and other purposes, the first aspect of the present application discloses a multi-station squaring equipment, comprising: at least two silicon rod supporting platforms for carrying vertically placed single crystal silicon rods, each of the silicon rod supporting platforms having a rotating mechanism; and a wire cutting device, arranged above the at least two silicon rod supporting platforms, comprising a plurality of cutting wheels and a cutting line formed around the plurality of cutting wheels with a cutting line segment or two cutting line segments parallel to each other; wherein, during the squaring operation, the wire cutting device is driven to descend, and the one cutting line segment or the two cutting line segments simultaneously perform side cutting in a first direction on the plurality of single crystal silicon rods carried by the plurality of silicon rod supporting platforms along their length direction; thereafter, the silicon rod supporting platforms are driven by the rotating mechanism to convert the single crystal silicon rod to the surface to be cut, and the wire cutting device is driven to descend, and the one cutting line segment or the two cutting line segments simultaneously perform side cutting in a second direction on the plurality of single crystal silicon rods carried by the plurality of silicon rod supporting platforms along their length direction.

[0007] In certain embodiments of the first aspect of the present application, in the squaring operation, the intersection of a cutting line when the wire cutting device cuts the first direction side of the single crystal silicon rod and a cutting line when the wire cutting device cuts the second direction side of the single crystal silicon rod is located within the cross section of the single crystal silicon rod.

[0008] In certain embodiments of the first aspect of the present application, the at least two silicon rod supporting platforms may be arranged on a silicon rod workbench, and the silicon rod workbench is provided with a workbench conversion mechanism for driving the silicon rod workbench to perform a conversion movement so that the silicon rod supporting platforms on the silicon rod workbench can be converted between the loading and unloading area and the cutting area.

[0009] In certain embodiments of the first aspect of the present application, the workbench conversion mechanism is a rotating mechanism, which includes: a rotating shaft, axially connected to the silicon rod workbench; and a rotating drive unit, whose power output shaft is axially connected to the rotating shaft, for driving the rotating shaft to rotate to drive the silicon rod workbench to rotate.

[0010] In certain embodiments of the first aspect of the present application, the workbench conversion mechanism is a translation mechanism, which includes: a translation guide rail laid on a workpiece processing table; a slider provided at the bottom of the silicon rod workbench; and a translation drive unit for driving the silicon rod workbench to move along the translation guide rail.

[0011] In certain embodiments of the first aspect of the present application, the multi-station squaring equipment further includes a silicon rod loading and unloading device disposed adjacent to the silicon rod supporting platform.

[0012] In certain embodiments of the first aspect of the present application, a skin edge supporting mechanism is provided around the silicon rod supporting platform for supporting the skin edge formed after the single crystal silicon rod is cut.

[0013] In certain embodiments of the first aspect of the present application, the edge skin supporting mechanism includes: a movable supporting member; and a locking control member for controlling the movable supporting member to be in a locked state when the movable supporting member abuts against the bottom of the single crystal silicon rod.

[0014] In certain embodiments of the first aspect of the present application, the multi-station squaring equipment further includes a side cut unloading device for unloading the side cuts formed after cutting by the wire cutting device.

[0015] In certain embodiments of the first aspect of the present application, the edge skin unloading device includes: an edge skin lifting mechanism, which is used to lift the edge skin so that the top end of the edge skin protrudes from the cut silicon rod.

[0016] In certain embodiments of the first aspect of the present application, the edge skin unloading device also includes: a clamping and transferring unit, which is arranged above the at least two silicon rod supporting platforms, and is used to clamp the top of the edge skin and pull up the edge skin to separate from the squared single crystal silicon rod and transfer the edge skin to the edge skin unloading area.

[0017] In certain embodiments of the first aspect of the present application, the clamping and transporting unit includes a skin edge clamping mechanism, and the skin edge clamping mechanism includes: a clamping movement mechanism that provides movement in at least one direction; and at least one clamping component that can be raised and lowered.

[0018] In certain embodiments of the first aspect of the present application, the clamping assembly includes: a cover body, used to cover the edge skin; and a retractable clamping member, arranged inside the cover body; a clamping space for clamping the edge skin is formed between the clamping member and the cover body.

[0019] In certain embodiments of the first aspect of the present application, the clamping assembly includes: an arc-shaped plate; and a retractable clamping member, wherein a clamping space for clamping the edge skin is formed between the clamping member and the arc-shaped plate.

[0020] In certain embodiments of the first aspect of the present application, the wire cutting device includes at least two cutting wheel groups corresponding to the number of silicon rod supporting platforms, each cutting wheel group includes a pair of cutting wheels or two pairs of cutting wheels, and a cutting line segment is formed between the two cutting wheels in any pair of cutting wheels; a transition wheel is provided between two adjacent cutting wheel groups, and the wire groove of the transition wheel is in the same plane as the wire groove of the cutting wheel in the cutting wheel group.

[0021] In certain embodiments of the first aspect of the present application, the cutting wheel includes a first wire groove and a second wire groove for winding the cutting wire, and the cutting wheel moves the cutting wire from the first wire groove to the second wire groove through an automatic groove changing mechanism.

[0022] In certain embodiments of the first aspect of the present application, the automatic slot changing mechanism includes: a cutting wheel, including a first wire slot and a second wire slot for winding a cutting wire; a slot changing cylinder, linked to the cutting wheel, for driving the cutting wheel to move along its axial direction to move the cutting wire from the first wire slot to the second wire slot, including a cylinder body, and a first guide rail and a second guide rail that are connected to each other and are opened on the cylinder body, and the height difference between the first guide rail and the second guide rail corresponds to the slot distance between the first wire slot and the second wire slot; a positioning member, which can be relatively slidably arranged in the first guide rail or the second guide rail, and is used to slide in the first guide rail or the second guide rail when the slot changing cylinder moves along the axial direction to drive the slot changing cylinder to rotate, so as to force the cutting wire on the cutting wheel to switch from the first wire slot to the second wire slot.

[0023] In certain embodiments of the first aspect of the present application, the multi-station squaring equipment further includes a silicon rod pressing device, and the silicon rod pressing device and the wire cutting device share the same guide rail.

[0024] In certain embodiments of the first aspect of the present application, the silicon rod pressing device is provided with a guide rail locking unit.

[0025] The second aspect of the present application discloses a multi-station cutting method applied to a multi-station squaring device, the multi-station squaring device comprises at least two silicon rod carriers and a wire cutting device, the silicon rod carriers have a rotating mechanism, the wire cutting device comprises a cutting line segment or two cutting line segments parallel to each other, the multi-station cutting method comprises the following steps: placing a single crystal silicon rod vertically on the silicon rod carrier; driving the wire cutting device to descend, and using one or two cutting line segments in the wire cutting device to simultaneously perform side cutting in a first direction along the length direction of the single crystal silicon rods carried by the at least two silicon rod carriers; driving the wire cutting device to rise, and using the rotating mechanism to drive the silicon rod carriers to allow the single crystal silicon rod to convert the surface to be cut; driving the wire cutting device to descend, and using one or two cutting line segments to simultaneously perform side cutting in a second direction along the length direction of the single crystal silicon rods carried by the at least two silicon rod carriers.

[0026] The present application discloses a multi-station squaring device and a cutting method thereof, which have the beneficial effect that the multi-station squaring device and a cutting method thereof can simultaneously complete the squaring operation of multiple silicon rods, and make the cross-section of the silicon rods after the squaring process rectangular, while the squared silicon rods are rectangular as a whole and have four side skins, which can improve the efficiency of the silicon rod squaring cutting operation, increase the cross-sectional area of ​​the squared silicon rods, and reduce the overall cost and risk of squaring the silicon rods. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1aThe schematic diagram shows the cross section of the silicon rod to be cut, which is a rectangular parallelepiped after being cut using a tic-tac-toe cutting method.

[0028] Figure 1b The schematic diagram shows the cross section of the silicon rod to be cut into a rectangular shape after being cut in a tic-tac-toe cutting manner.

[0029] Figure 2 Shown is a schematic diagram of the overall structure of the multi-station prescription equipment in one embodiment of the present application.

[0030] Figure 3 It shows a schematic diagram of a multi-station square cutting device in the present application in which the workbench conversion mechanism is a rotating mechanism in one embodiment.

[0031] Figure 4a The diagram shows a state diagram of a multi-station square-cutting device in one embodiment of the present application in which the workbench conversion mechanism is a translation mechanism.

[0032] Figure 4b It is a schematic diagram showing another state of the multi-station square cutting equipment in one embodiment of the present application in which the workbench conversion mechanism is a translation mechanism.

[0033] Figure 5 Shown is a schematic structural diagram of a silicon rod loading and unloading device in one embodiment of the multi-station square cutting equipment of the present application.

[0034] Figure 6 Display as Figure 5 Top view of the .

[0035] Figure 7 Shown is a cross-sectional view of a first clamp of a silicon rod loading and unloading device in one embodiment of the multi-station square cutting equipment of the present application.

[0036] Figure 8 Shown is a schematic diagram of the first driving structure of the multi-station square-cutting device of the present application in one embodiment.

[0037] Fig. 9 It shows a schematic diagram of the structure in which each cutting wheel group in the wire cutting device of one embodiment of the multi-station squaring device of the present application has a pair of cutting wheels.

[0038] Fig.10 It shows a schematic diagram of the structure in which each cutting wheel group of the wire cutting device in one embodiment of the multi-station squaring equipment of the present application has two pairs of cutting wheels.

[0039] Fig.11 Display as Fig.10 Schematic diagram of the side structure.

[0040] Fig.12It shows a schematic diagram of the guide wheel winding when each cutting wheel group in the wire cutting device of one embodiment of the multi-station squaring equipment of the present application has two pairs of cutting wheels.

[0041] Fig.13 It shows a schematic structural diagram of an automatic slot changing mechanism in one embodiment of the multi-station square cutting equipment of the present application, in which the automatic slot changing mechanism is arranged on a wire cutting device.

[0042] Fig.14 Shown is a schematic cross-sectional structure diagram of an automatic slot changing mechanism in one embodiment of the multi-station square cutting equipment of the present application.

[0043] Fig.15 Display as Fig.14 A partial enlarged view of part B.

[0044] Figures 16a to 16d Shown is a structural schematic diagram of the movement process of the automatic slot changing mechanism of the multi-station square cutting equipment of the present application.

[0045] Fig.17 Shown is a schematic structural diagram of a silicon rod pressing device in one embodiment of the multi-station square cutting equipment of the present application.

[0046] Fig.18 Shown is a schematic diagram of the structure of the edge skin supporting mechanism in one embodiment of the multi-station square cutting equipment of the present application.

[0047] Fig.19 Shown is a schematic diagram of the structure of the edge skin lifting mechanism in one embodiment of the multi-station square cutting equipment of the present application.

[0048] Fig. 20 Display as Figure 3 A partial enlarged view of part A.

[0049] Fig.21 Shown is a schematic diagram of the external structure of the edge clamping mechanism of the multi-station square cutting equipment in one embodiment of the present application.

[0050] Fig. 22 Shown is a schematic cross-sectional structure diagram of a clamping assembly in one embodiment of the multi-station square cutting device of the present application.

[0051] Fig.23 Shown is a flow chart of a multi-station cutting method in one embodiment of the present application. DETAILED DESCRIPTION

[0052] The following is an explanation of the implementation of the present application by means of specific embodiments. People familiar with the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification.

[0053] In the following description, with reference to the accompanying drawings, several embodiments of the present application are described. It should be understood that other embodiments may also be used, and mechanical composition, structure, electrical and operational changes may be made without departing from the spirit and scope of the present application. The following detailed description should not be considered restrictive, and the scope of the embodiments of the present application is limited only by the claims of the published patents. The terms used here are only to describe specific embodiments and are not intended to limit the present application. Spatially related terms, such as "upper", "lower", "left", "right", "below", "below", "lower", "above", "upper", etc., may be used in the text to facilitate the description of the relationship between an element or feature shown in the figure and another element or feature.

[0054] Although in some instances the terms first, second, etc. are used in this article to describe various elements or parameters, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one or parameter from another or parameter. For example, the first wire groove can be referred to as the second wire groove, and similarly, the second wire groove can be referred to as the first wire groove without departing from the scope of the various described embodiments. The first wire groove and the second wire groove are both describing a wire groove, but unless the context clearly indicates otherwise, they are not the same wire groove. Similar situations also include the first guide rail and the second guide rail, or the first direction and the second direction.

[0055] Furthermore, as used in this article, the singular forms "one", "an" and "the" are intended to include plural forms as well, unless there is an indication to the contrary in the context. It should be further understood that the terms "comprise", "include" indicate the presence of the described features, steps, operations, elements, components, projects, kinds, and / or groups, but do not exclude the presence, occurrence or addition of one or more other features, steps, operations, elements, components, projects, kinds, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or mean any one or any combination. Therefore, "A, B or C" or "A, B and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C". Exceptions to this definition will only occur when the combination of elements, functions, steps or operations is inherently mutually exclusive in some way.

[0056] Existing single crystal silicon rods are generally cylindrical in structure. The silicon rods are squared by silicon rod square equipment. Please refer to Figure 1a and Figure 1b , Figure 1a The schematic diagram of the cross section of the silicon rod to be cut is a rectangular parallelepiped after being cut in a tic-tac-toe cutting manner; Figure 1bThe schematic diagram of the cross section of the silicon rod to be cut is a rectangular parallelepiped after being cut by the tic-tac-toe cutting method. As shown in the figure, in the existing silicon rod squaring equipment, most of them use the tic-tac-toe cutting method to square the silicon rod into a rectangular parallelepiped (including four vertical sections and a chamfered surface between two adjacent vertical sections, as shown in FIG. Figure 1a As shown in the figure, the subsequent grinding of the squared silicon rod will consume a large amount of material, and the silicon wafers obtained by slicing the squared and ground silicon rods have a small surface area and low power generation efficiency.

[0057] In view of this, in order to increase the effective use area of ​​the silicon wafer, it is expected to increase the cross-sectional area of ​​the squared silicon rod while keeping the cutting spacing unchanged. Therefore, in the present application, the cross-sectional circular area of ​​the silicon rod to be cut is increased, so that the silicon rod to be cut is a rectangular parallelepiped after being squared (including only four vertical sections without chamfered surfaces, such as Figure 1b As shown in the figure, in the subsequent grinding operation, only a small amount of grinding is required on the right angles between the four vertical sections of the rectangular silicon rod that has been squared. In this way, the material loss due to grinding is greatly reduced and the surface area of ​​the silicon wafer obtained after slicing the silicon rod that has been squared and ground is larger.

[0058] It should be noted that, if the conventional silicon rod squaring device with a tic-tac-toe wire cutting device having four cutting line segments is still used to square the silicon rod to be cut, eight edge skins will be formed on the cutting surface corresponding to the silicon rod to be cut during the squaring operation, including four large edge skins 10 and four small edge skins 11 (in the form of Figure 1b As shown in the figure, the four small side skins 11 will mislead the cutting line during the cutting process, causing the cutting line to go astray and the cutting surface to be uneven. On the other hand, the four small side skins are prone to tipping over due to the small supporting bottom surface, which can easily cause problems such as edge collapse. Therefore, it is necessary for those skilled in the art to develop a multi-station squaring device and a silicon rod squaring method, so that the silicon rod is rectangular after squaring without increasing the number of side skins (that is, the number of side skins is still four), so as to improve the cutting efficiency of the silicon rod squaring, increase the cross-sectional area of ​​the squared silicon rod, and reduce the overall cost and risk of squaring the silicon rod.

[0059] The present application discloses a multi-station squaring device for squaring single crystal silicon rods (also referred to as silicon rods in the present application) with circular cross-sections, comprising at least two silicon rod support platforms and a wire cutting device.

[0060] The at least two silicon rod supporting platforms are used to support vertically placed single crystal silicon rods, and each of the silicon rod supporting platforms has a rotating mechanism.

[0061] The wire cutting device is arranged above the at least two silicon rod supporting platforms, and comprises a plurality of cutting wheels and cutting wires. The cutting wires are wound around the plurality of cutting wheels to form a cutting line segment or two cutting line segments parallel to each other.

[0062] Wherein, during the squaring operation, the wire cutting device is driven to descend, and the one or two cutting line segments simultaneously cut the multiple single crystal silicon rods carried by the multiple silicon rod carriers in the first direction along their length direction; then, the silicon rod carrier is driven by the rotating mechanism to change the surface to be cut of the single crystal silicon rod, and the wire cutting device is driven to descend, and the one or two cutting line segments simultaneously cut the multiple single crystal silicon rods carried by the multiple silicon rod carriers in the second direction along their length direction. During the squaring operation, the intersection of the cutting line when the wire cutting device cuts the first direction side of the single crystal silicon rod and the cutting line when the wire cutting device cuts the second direction side of the single crystal silicon rod is located within the cross section of the single crystal silicon rod.

[0063] The multi-station squaring equipment of the present application is applied to the squaring and cutting operation of silicon rods. The multi-station squaring equipment of the present application can complete the squaring operation of multiple silicon rods at the same time, and make the cross section of the silicon rods rectangular after the squaring process, while the squared silicon rods are rectangular as a whole (including only four vertical sections) and the number of edge skins formed is four, which can improve the efficiency of the squaring and cutting operation of silicon rods, increase the cross-sectional area of ​​the squared silicon rods, and reduce the overall cost and risk of squaring the silicon rods.

[0064] In the following embodiments, Figures 2 to 22 The multi-station prescription equipment of the present application is described in detail.

[0065] See also Figure 2 , shown is a schematic diagram of the overall structure of the multi-station square cutting equipment of the present application in one embodiment. As shown in the figure, the multi-station square cutting equipment also includes a machine base 20. The machine base 20 is configured as the main component of the multi-station square cutting equipment of the present application, and is used to provide a square cutting operation platform. Preferably, the machine base 20 is larger in size and weight to provide a larger installation surface and a more solid stability of the whole machine.

[0066] The at least two silicon rod carriers 21 are used to carry vertically placed silicon rods, and each of the silicon rod carriers 21 has a rotating mechanism 210, and the rotating mechanism 210 is used to drive the silicon rods placed on the silicon rod carrier 21 to rotate to adjust the surface to be cut. In an exemplary embodiment, the rotating mechanism 210 is configured as a rotating turntable located at the bottom of the silicon rod carrier 21, and the rotating turntable is controlled by a driving device (not shown in the figure), and the driving device can be, for example, a servo motor that drives the rotating turntable to rotate, but is not limited to this. In an optional embodiment, the rotating mechanism 210 can adopt a lifting design, that is, the rotating turntable at the bottom of the silicon rod carrier 21 can be controlled to perform a telescopic action to drive the silicon rod carrier 21 to move up and down, thereby adjusting the height of the silicon rod to be cut on the silicon rod carrier 21.

[0067] In order to better protect the silicon rods to be cut on the silicon rod supporting platform, in an exemplary embodiment, a buffer pad is fixed on the supporting surface of each silicon rod supporting platform 21 (the supporting surface is the upper surface of the silicon rod supporting platform for supporting the silicon rods to be cut), so that the buffer pad is located between the silicon rod supporting platform 21 and the silicon rods to be cut when the silicon rods to be cut are placed.

[0068] In one embodiment, see Figure 2 The at least two silicon rod supporting platforms 21 are directly disposed on the machine base and are sequentially arranged in a straight line in the cutting area. When the at least two silicon rod supporting platforms 21 support the silicon rods to be cut, the centers of the supported silicon rods to be cut are located on the same straight line (as shown in FIG. Figure 2 As shown), it is easy to understand that the cutting area is the area where the squaring equipment performs silicon rod cutting. Specifically, the cutting area is, for example, the area below the cutting device in the multi-station squaring equipment.

[0069] In practical applications, in order to improve work efficiency, the cutting equipment can perform cutting and loading and unloading work at the same time. Figure 3 , showing a schematic diagram of a multi-station squaring device of the present application in one embodiment in which the worktable conversion mechanism is a rotating mechanism. As shown in the figure, in one embodiment, the at least two silicon rod supporting platforms 21 can be arranged on a silicon rod working platform 22, and the silicon rod working platform 22 is provided with a worktable conversion mechanism 220, which is used to drive the silicon rod working platform 21 to perform a conversion movement so that the silicon rod supporting platform on the silicon rod working platform 21 can be converted between the loading and unloading area and the cutting area. It is easy to understand that the loading and unloading area is the area where loading and unloading are performed in the multi-station squaring device, specifically, for example, the areas corresponding to both sides of the silicon rod working platform in the multi-station squaring device, and the cutting area is the area where the silicon rods to be cut are cut on the multi-station squaring device, specifically, for example, the area below the cutting device in the multi-station squaring device.

[0070] In this embodiment, the silicon rod worktable 22 is arranged on the machine base 20 and is arranged as at least one. Each silicon rod worktable 22 is provided with at least two silicon rod supporting platforms 21. At least one silicon rod supporting platform 21 on each silicon rod worktable 22 is located in the cutting area, and at least one silicon rod supporting platform 21 is located in the loading and unloading area. The silicon rod supporting platforms 21 located in the cutting area on each silicon rod worktable 22 are arranged in sequence in a straight line. In this way, when each silicon rod supporting platform 21 located in the cutting area supports the silicon rods to be cut, the centers of the supported silicon rods to be cut are located on the same straight line. In an exemplary embodiment, see Figure 3 Two silicon rod worktables 22 are arranged on the machine base, and four silicon rod supporting platforms 21 are arranged on each silicon rod worktable 22. Two silicon rod supporting platforms 21 on each silicon rod worktable 22 are located in the cutting area, and the other two silicon rod supporting platforms 21 are located in the loading and unloading area. The four silicon rod supporting platforms 21 located in the cutting area on the two silicon rod worktables 22 are arranged in sequence in a straight line, but this is not limited to this. In other exemplary embodiments, the silicon rod worktable 22 can also be set to one or more than two.

[0071] In an exemplary embodiment, see Figure 3As shown in the figure, the workbench conversion mechanism 220 is a rotating mechanism, and the rotating mechanism includes a rotating shaft 2200 and a rotating drive unit (not shown). The rotating shaft 2200 is axially connected to the silicon rod workbench 22, and the power output shaft of the rotating drive unit is axially connected to the rotating shaft 2200, which is used to drive the rotating shaft 2200 to rotate so as to drive the silicon rod workbench 22 to rotate. In this embodiment, the rotating shaft 2200 is arranged in the central area of ​​the bottom of the silicon rod workbench 22 and is connected to the machine base 20. The silicon rod support platform 21 located in the cutting area and the silicon rod support platform 21 located in the loading and unloading area are centrally symmetrical with respect to the rotating shaft 2200, so that the silicon rod support platform 21 located on the silicon rod workbench 22 can be switched between the cutting area and the loading and unloading area by driving the silicon rod workbench 22 to rotate. It should be noted that in the embodiment where the workbench conversion mechanism 220 is configured as a rotating mechanism, loading and unloading is performed on one side of the multi-station squaring equipment. In actual operation, the silicon rods need to be converted between the cutting area and the loading and unloading area. First, the driving unit (such as a common driving motor) is rotated to drive the rotating shaft 2200 to drive the silicon rod workbench 22 to rotate (for example, rotate 180°), so that the silicon rod supporting platform 21 originally located in the cutting area is transferred to the loading and unloading area for unloading and loading new materials, and the silicon rod supporting platform 21 originally located in the loading and unloading area is transferred to the cutting area for cutting. Such a cycle enables the multi-station squaring equipment of the present application to perform cutting and loading and unloading work at the same time, thereby improving work efficiency. In other embodiments, the rotating mechanism for driving the silicon rod worktable to rotate may also be implemented in other ways. For example, the rotating mechanism may also be implemented in a gear transmission manner. Specifically, a transmission wheel is provided at the bottom of the silicon rod worktable, and a driving wheel meshing with the transmission wheel is provided on the machine base 20. The driving wheel is controlled by a rotating drive motor. The driving motor drives the driving wheel to rotate to drive the driven wheel to rotate, so that the silicon rod worktable 22 follows the driven wheel to rotate to drive the silicon rod supporting platform 21 to switch between the loading and unloading area and the cutting area.

[0072] In another exemplary embodiment, see Figure 4a and Figure 4b , Figure 4a The diagram shows a state diagram of a multi-station square-cutting device in one embodiment of the present application in which the workbench conversion mechanism is a translation mechanism; Figure 4bThe diagram shows another state of the multi-station square-cutting device of the present application in one embodiment where the worktable conversion mechanism is a translation mechanism. As shown in the figure, the worktable conversion mechanism 220 is a translation mechanism, and the translation mechanism includes a translation guide rail 2201, a slider 2202, and a translation drive unit (not shown). The translation guide rail 2201 is laid on the machine base 20, the slider 2202 is arranged at the bottom of the silicon rod worktable 22 and is adapted to the translation guide rail 2201 to provide translation guidance for the silicon rod worktable 22, and the translation drive unit is used to drive the silicon rod worktable 22 to move along the translation guide rail 2201 (in a manner as shown in FIG. 1 ). Figure 4a and Figure 4b The silicon rod carrier 21 on the silicon rod workbench 22 is switched between the cutting area and the loading and unloading area. The translation drive unit adopts a cylinder assembly or a screw assembly driven by a motor. It should be noted that in the embodiment where the workbench conversion mechanism 220 is a translation mechanism, the loading and unloading is performed on both sides of the multi-station square cutting equipment. In actual operation, the silicon rods carried by the silicon rod carrier 21 in the cutting area on the silicon rod workbench are cut, and at the same time, the silicon rod carrier 21 in the loading and unloading area on one side has been loaded with the silicon rods to be cut (as shown in the figure). Figure 4a The translation driving unit drives the silicon rod workbench 22 along the slide rail X direction (in a state as shown in FIG. Figure 4a The silicon rod carrier 21 located in the cutting area carries the cut silicon rods and moves to the loading and unloading area on the other side for unloading and loading the silicon rods to be cut. At the same time, the silicon rod carrier 21 located in the loading and unloading area on one side carries the silicon rods to be cut and moves to the cutting area for cutting the silicon rods to be cut (as shown in the figure). Figure 4b Then the translation drive unit drives the silicon rod workbench 22 to retreat along the slide rail (as shown in FIG. Figure 4b The silicon rod carrier 21 loaded with the silicon rods to be cut on the other side returns to the cutting area for cutting, and the silicon rod carrier 21 that has completed the cutting in the cutting area returns to the loading and unloading area on one side to continue unloading and loading the silicon rods to be cut (shown as position 4a in the figure). This reciprocating process enables the multi-station square-cutting equipment of the present application to perform cutting and loading and unloading at the same time, and the work efficiency is significantly improved. In other embodiments, the translation mechanism may also be a gear transmission method. Specifically, the translation mechanism includes a translation rack and a rotating gear driven by a motor and adapted to the translation rack. The translation rack is arranged at the bottom of the silicon rod workbench, and may be, for example, at least one rack with a certain length. In order to make the silicon rod workbench move smoothly, each rack is adapted to at least two rotating gears arranged at intervals. The motor drives the rotating gear to rotate and drive the silicon rod workbench to move so that the silicon rod carrier located on the silicon rod workbench switches between the cutting area and the loading and unloading area.

[0073] It should be added that, in order to facilitate the loading and unloading of silicon rods, the multi-station square opening equipment of the present application also includes a silicon rod loading and unloading device, which is adjacent to the silicon rod bearing platform. Furthermore, the silicon rod loading and unloading device is arranged on one side or two opposite sides of the silicon rod workbench, and is used to load the silicon rods to be cut located in the storage area onto the silicon rod bearing platform located in the loading area on the silicon rod workbench so that the silicon rod workbench can send the silicon rods to be cut to the cutting area for cutting, and to transfer the cut silicon rods transferred from the cutting area to the loading and unloading area by the silicon rod workbench to the storage area for unloading the cut silicon rods. In one embodiment, the silicon rod loading and unloading device is arranged on one side of the silicon rod workbench, and the workbench conversion mechanism of the silicon rod workbench is the rotating mechanism as described above, and the silicon rods are loaded and unloaded on one side of the silicon rod workbench; in another embodiment, the silicon rod loading and unloading device is arranged on both sides of the silicon rod workbench, and the workbench conversion mechanism of the silicon rod workbench is the translation mechanism as described above, and the silicon rods are loaded and unloaded on both sides of the silicon rod workbench. It is easy to understand that the storage area is an area adjacent to the multi-station squaring equipment and is used to place or store the silicon rods to be cut and the cut silicon rods.

[0074] See also Figures 5 to 7 , Figure 5 It is a schematic structural diagram of a silicon rod loading and unloading device in one embodiment of the multi-station square cutting equipment of the present application; Figure 6 Display as Figure 5 A top view of Figure 7 The cross-sectional view of the first clamp of the silicon rod loading and unloading device in one embodiment of the multi-station square opening device of the present application is shown. As shown in the figure, the silicon rod loading and unloading device 23 is arranged on a bottom mounting structure, and the bottom mounting structure is protruded from the machine base. The silicon rod unloading device 23 includes a reversing carrier 230, a first clamp, and a second clamp. The reversing carrier 230 is used for reversing movement. The first clamp and the second clamp are arranged on the reversing carrier 230. By driving the reversing carrier to perform reversing movement, the first clamp and the second clamp arranged on the reversing carrier 230 can be switched between the storage area and the loading and unloading area to transport and clamp the cut silicon rods and the silicon rods to be cut.

[0075] The reversing carrier 230 is arranged on the bottom mounting structure and can perform reversing movement relative to the bottom mounting structure. In one embodiment, the reversing carrier 230 realizes the reversing movement through a reversing mechanism. The reversing mechanism may include a rotating shaft and a reversing motor, and the reversing carrier 230 is connected to the bottom mounting structure thereunder through the rotating shaft. When the turning movement is implemented, the reversing motor is started to drive the rotating shaft to rotate to drive the reversing carrier 230 to rotate to realize the reversing movement. The aforementioned driving rotating shaft rotation can be designed as a unidirectional rotation or a bidirectional rotation, and the unidirectional rotation can be, for example, a clockwise rotation or a counterclockwise rotation, and the bidirectional rotation can be, for example, a clockwise rotation and a counterclockwise rotation. In addition, the angle of rotation of the driving rotating shaft can be set according to the actual structure of the silicon rod loading and unloading device 23, wherein the actual structure of the silicon rod loading and unloading device can be, for example, the angle of rotation of the driving rotating shaft can be set according to the positional relationship between the storage area and the loading and unloading area or the structure of the reversing carrier 230. The central position of the reversing base in the reversing carrier 230 is connected to the rotating shaft. Generally, the shape of the reversing base can be a disc structure, but it is not limited to this. It can also be a square disc or an elliptical disc. The first clamp is set in the first clamp area of ​​the reversing carrier 230 to clamp the silicon rod to be cut, and the second clamp is set in the second clamp area of ​​the reversing carrier 230 to clamp the cut silicon rod. In an embodiment, the first clamp area and the second clamp area can be set according to the actual device structure. For example, the first clamp area and the second clamp area are two back-to-back locations in the reversing carrier 230. Furthermore, the first clamp area and the second clamp area can differ by 180°, so that the storage area and the loading and unloading area are connected in a straight line (of course, it can also be understood that the storage area and the loading and unloading area are connected in a straight line and are respectively located on opposite sides of the reversing carrier 230. Therefore, the first clamp area for setting the first clamp and the second clamp area for setting the second clamp in the reversing carrier 230 can differ by 180°). In this way, after the reversing carrier 230 is rotated 180°, the first clamp and the second clamp can be interchanged. However, in actual applications, the setting relationship between the first clamp area and the second clamp area or the loading and unloading stations and the operating stations does not need to be so demanding. The first clamp area and the second clamp area can also differ by 90°, for example. Even, the first clamp area and the second clamp area can differ by any position within a suitable range, as long as it is ensured that no unnecessary interference will occur between the first clamp area and the second clamp area.

[0076] The first clamp further includes a first clamp mounting member 231 and at least two first clamping members 232, wherein the at least two first clamping members 232 are spaced apart relative to the first clamp mounting member 231, and are used to clamp the silicon rod to be cut. In one embodiment, the silicon rod to be cut located on the silicon rod supporting platform is placed vertically, so the at least two first clamping members 232 are spaced apart vertically relative to the first clamp mounting member 231, that is, the at least two first clamping members 232 are arranged up and down.

[0077] In a specific implementation, any first clamping member 232 further includes: a first clamping arm mounting seat 2320 and at least two first clamping arms 2321, wherein the first clamping arm mounting seat 2320 is arranged on the first fixture mounting member 231, and at least two first clamping arms 2321 are movably arranged on the first clamping arm mounting seat 2320. In view of the circular cross-section of the silicon rod to be cut, in an optional embodiment, the first clamping member 232 is a circular workpiece fixture as a whole, and the first clamping arms 2321 constituting the first clamping member 232 are two symmetrically designed, and a single first clamping arm 2321 is designed to have an arc-shaped clamping surface. Preferably, the arc-shaped clamping surface of a single first clamping arm 2321 should exceed a quarter of the arc, so that the arc-shaped clamping surface of the first clamping member 232 composed of two first clamping arms 2321 should exceed a half of the arc. Of course, a buffer pad can be additionally provided on the arc-shaped clamping surface of the first clamping arm 2321 to avoid damage to the surface of the silicon rod to be cut during the process of clamping the silicon rod to be cut, thereby achieving a good effect of protecting the silicon rod to be cut. Under normal circumstances, when the first clamping arms 2321 in the first clamping member 232 are in the clamped state, the center of the clamping space formed by the two first clamping arms 2321 coincides with the center of the silicon rod to be cut. Therefore, when the first clamping member 232 is used to clamp the silicon rod to be cut placed upright in the storage area, the two first clamping arms 2321 in the first clamping member 232 are contracted, and the arc-shaped clamping surface in the first clamping arm 2321 is pressed against the silicon rod to be cut. During the process of the first clamping arm 2321 contracting and clamping the silicon rod to be cut, the silicon rod to be cut is pushed by the two first clamping arms 2321 on both sides and moves toward the central area of ​​the clamping space until the silicon rod to be cut is clamped by the two first clamping arms 2321 in the first clamping member 232. At this time, the center of the silicon rod to be cut can be located at the center of the clamping space of the first clamping member 232.

[0078] In order to enable the at least two first clamping arms 2321 in the first clamping member 232 to smoothly and firmly clamp single-wafer silicon rods of different sizes, the first clamping member 232 further includes a first clamping arm driving mechanism for driving the at least two first clamping arms 134 to open and close.

[0079] See also Figure 7As shown in the figure, in a specific implementation, the first clamping arm driving mechanism further includes: a first opening and closing gear 2322, a first gear driving member 2323, and a first driving source 2324. The first opening and closing gear 2322 is arranged on the corresponding first clamping arm 2321. The first gear driving member 2323 has a tooth pattern that meshes with the first opening and closing gear 2322 on the first clamping arm 2321. The first driving source 2324 is connected to the first gear driving member 2323 and is used to drive the first gear driving member 2323 to move. In an implementation, the first gear driving member 2323 is a first rack, which is located in the middle of the two first clamping arms 2321. The first rack is provided with tooth patterns corresponding to the first opening and closing gears 2322 on the two first clamping arms 2321 on the two outer sides thereof, respectively facing the first clamping arms 2321 on both sides. The first driving source 2324 can be, for example, a driving motor or a cylinder. Thus, according to the above implementation, in actual application, when the first clamping arm 2321 needs to be clamped, the first rack as the first gear driving member 2323 is driven upward by the driving motor or cylinder as the first driving source 2324, and the first rack drives the first opening and closing gears 2322 meshed on both sides to rotate outward, and the first opening and closing gear 2322 drives the first clamping arm 2321 (the first opening and closing gear 2322 and the first clamping arm 2321 can be connected by a rotating shaft) to lower during the outward rotation to change from a loose state. On the contrary, when the first clamping arm 2321 needs to be released, the first rack as the first gear driving member 2323 is driven downward by the driving motor (or cylinder) as the first driving source 2324, and the first rack drives the first opening and closing gears 2322 meshed on both sides to rotate inwardly, and the first opening and closing gears 2322 drive the first clamping arm 2321 (the first opening and closing gears 2322 and the first clamping arm 2321 can be connected by a rotating shaft) to move upwardly during the inward rotation to change from the clamping state to the release state. Of course, the above is only an embodiment, and is not used to limit the working state of the first clamping member 232. In fact, the above-mentioned "upward", "outward rotation", "lowering", "downward", "inward rotation", "upward", "release" and "clamping" state changes can be changed according to the structure and operation mode of the first clamping arm 2321 and the structure of the first clamping arm driving mechanism.

[0080] As known to those skilled in the art, the silicon rods to be cut are formed by cutting the original long silicon rods, which will inevitably lead to significant size differences between the silicon rods to be cut. Since the first clamp is used to clamp the silicon rods to be cut in an upright state, the impact of the aforementioned size difference on the first clamp is mainly reflected in the length difference of the silicon rods to be cut, which may affect whether the first clamping member 232 in the first clamp can clamp the silicon rods to be cut.

[0081] In order to reduce or even eliminate the risk that the first clamping member 232 may fail to clamp the silicon rod to be cut, the first clamp may have different design schemes.

[0082] In one implementation, the first clamp uses a fixed clamp, that is, as many first clamps 232 as possible are fixedly arranged vertically on the reversing carrier 230, and the distance between two adjacent first clamps 232 among these first clamps 232 is as small as possible, so that these first clamps can cover various specifications and lengths of silicon rods to be cut. For example, if the length of the silicon rod to be cut is longer, more first clamps 232 on the reversing carrier 230 are used to participate in the clamping; if the length of the silicon rod to be cut is shorter, fewer first clamps 232 on the reversing carrier 230 are used to participate in the clamping, for example, several first clamps 232 located at the bottom participate in the clamping, while those first clamps 232 located at the top and higher than the silicon rod to be cut do not participate.

[0083] In other implementations, the first clamp uses a movable clamp, that is, a first clamp 232 is movably arranged vertically on the first clamp area of ​​the reversing carrier 230. Since the first clamp is of movable design, the number of first clamps 232 can be greatly reduced, and generally two or three are sufficient. In this way, the use of movable clamps can cover various specifications and lengths of silicon rods to be cut. For example, if the length of the silicon rod to be cut is longer, the first movable clamp 232 is moved to extend the clamping distance between the two first clamps 232; if the length of the silicon rod to be cut is shorter, the first movable clamp 232 is moved to shorten the clamping distance between the two first clamps 232. In the implementation mode in which the first clamp adopts a movable clamping member, in order to facilitate the smooth and stable up and down movement of the movable clamping member to adjust the position, the first clamp mounting member 231 in the first clamp can be used to guide the first clamping member 232 that is movably arranged. In one achievable mode, the first clamp mounting member 231 can adopt a guide column structure, and the first clamp arm mounting seat 2320 adopts a movable block structure that is sleeved on the guide column structure. Specifically, the guide column structure as the first clamp mounting member 231 includes two guide columns that are vertically arranged and parallel, and the movable block structure as the first clamp arm mounting seat 2320 is provided with two through holes or two clips corresponding to the two guide columns in the guide column structure. If a through hole is adopted, the movable block is sleeved on the guide column and can slide along the guide column. If a clip is adopted, the movable block is clipped on the guide column and can slide along the guide column, wherein, in practical application, the clip can be clipped on at least half of the guide column.

[0084] In order to realize the movement of the first clamping member 232, the first clamping member 232 of the movable design may be provided with a first guide drive mechanism. The first guide drive mechanism may be used to drive the first clamping member 232 of the movable design to move up and down along the first clamp mounting member 231. In one implementation, the first guide drive mechanism may, for example, include: a first guide screw 2325 and a first guide motor 2326, wherein the first guide screw 2325 is vertically arranged, one end of the first guide screw 2325 is connected to the first clamp arm mounting seat 2320, and the other end of the first guide screw 2325 is connected to the first guide motor 2326, and the first guide motor 2326 may be arranged on the top of the reversing carrier 230, but is not limited thereto.

[0085] In another optional embodiment, both first clamping members 232 are of movable design, so that in actual application, the clamping distance between them can be adjusted by moving the two first clamping members 232 of movable design. Since the first clamping members 232 are of movable design, at least one of the two first clamping members 232 needs to be provided with a first guide drive mechanism for driving the two first clamping members 232 to move along the first fixture mounting member 231. Compared with the previous optional embodiment, in this optional embodiment, since both first clamping members 232 in the first fixture are of movable design, there will be a situation where the first guide drive mechanism is provided on one of the two first clamping members 232 or on both first clamping members 232.

[0086] Now, take the example of a case where the first guide drive mechanism is set in the upper first clamping member 232 among the two first clamping members 232. In this case, on the one hand, the first clamping arm mounting seat 2320 and the first clamp mounting member 231 in the two first clamping members 232 are movably connected, that is, the first clamping arm mounting seat 2320 and the first clamping arm 2321 thereon in any first clamping member 232 move up and down along the first clamp mounting member 231. In addition, the first guide drive mechanism set up includes a first guide screw 2325 and a first guide motor 2326, wherein one end of the first guide screw 2325 is connected to the first clamping arm mounting seat 2320 in the upper first clamping member 232, and the other end of the first guide screw 2325 is connected to the first guide motor 2326. The first guide motor 2326 can be set at the top of the reversing carrier 230. In this way, when it is necessary to adjust the position of the upper first clamping member 232, the first guide motor 2326 drives the first guide screw 2325 to rotate, and during the rotation of the first guide screw 2325, the first clamping member 232 is driven to move up and down along the first clamp mounting member 2311310. For example: the first guide motor 2326 drives the first guide screw 2325 to rotate clockwise, which drives the upper first clamping member 232 to move upward along the first clamp mounting member 231 to move away from the lower first clamping member 232, thereby increasing the clamping distance between the two first clamping members 232; the first guide motor 2326 drives the first guide screw 2325 to rotate in the opposite direction, which drives the upper first clamping member 232 to move downward along the first clamp mounting member 231 to move closer to the lower first clamping member 232, thereby reducing the clamping distance between the two first clamping members 232. In this way, by controlling the first clamping members 232 of movable design, the clamping distance between the two first clamping members 232 can be adjusted, so as to effectively clamp the silicon rods 101 to be cut of different specifications and lengths.

[0087] In fact, when both first clamping members 232 are of movable design, the first guide drive mechanism can not only adjust the clamping distance between the two first clamping members 232 to effectively clamp the silicon rods 101 to be cut of different specifications and lengths, but also realize the purpose of lifting and lowering the clamped silicon rods 101 to be cut. After the two first clamping members 232 effectively clamp the silicon rods 101 to be cut, the silicon rods 101 to be cut are lifted and lowered by driving the first clamping members 232 to move up and down. Specifically, still taking the upper first clamping member 232 provided with the first guide drive mechanism as an example, firstly, the upper first clamping member 232 is moved up and down along the first clamp mounting member 231 by the first guide drive mechanism to adjust the clamping distance between the upper first clamping member 232 and the lower first clamping member 232; then, the first clamping arm drive mechanism in each first clamping member 232 is used to drive the corresponding two first clamping arms 2321 to perform a clamping action to smoothly and firmly clamp the silicon rods 101 to be cut; then, the upper first clamping member 232 is again driven by the first guide drive mechanism to move up and down along the first clamp mounting member 231. The first clamping member 232 is driven by the first guide driving mechanism to move upward along the first clamping member 231. At this time, due to the friction force, the clamped silicon rod 101 to be cut and the first clamping member 232 below move upward together. The upward movement of the clamped silicon rod 101 to be cut utilizes the friction force between the upper first clamping member 232 and the silicon rod 101 to be cut, and the upward movement of the first clamping member 232 utilizes the friction force between the silicon rod 101 to be cut and the lower first clamping member 232, thereby achieving the effect of lifting the silicon rod 101 to be cut. The upper first clamping member 232 drives the silicon rod 101 to be cut and the lower first clamping member 232 to move downward under the drive of the first guide driving mechanism, which is also the same process, thereby achieving the effect of lowering the silicon rod 101 to be cut, which will not be repeated here.

[0088] It should be noted that in other variations, for example, a first guide drive mechanism is provided on the lower first clamping member 232 of the two first clamping members 232, and the structure, setting mode and driving working mode of the first guide drive mechanism are similar to those of the first guide drive mechanism of the upper first clamping member 232, for example, the lower first clamping member 232 is driven by the first guide drive mechanism to move up and down along the first clamp mounting member 231 to adjust the clamping distance between the lower first clamping member 232 and the lower first clamping member 232 is driven by the first guide drive mechanism to drive the silicon rod 101 to be cut and the upper first clamping member 232 to move up and down along the first clamp mounting member 231. For another example, if both first clamping members 232 are provided with the first guide drive mechanism, the setting mode and driving working mode of the first guide drive mechanism and the movement mode of the two first clamping members 232 are self-evident and will not be described in detail here.

[0089] In the case where the movable first clamping member 232 moves up and down along the first clamp mounting member 231 to adapt to the silicon rods to be cut of different specifications and lengths for clamping, in addition to the first clamping member 232 adopting a movable structural design and the first clamping member 232 being provided with a first guide drive mechanism, it is necessary to know the specification length of the silicon rod to be cut that is currently required to be clamped. In view of this, the workpiece transfer device in the present application may also include a height detector (not shown in the figure) for measuring the height of the vertically placed silicon rod to be cut, so as to serve as a basis for the subsequent upward or downward movement and movement distance of the movable first clamping member 232 along the first clamp mounting member 231.

[0090] In view of the fact that the second clamp is arranged in the second clamp area and is used to clamp the cut silicon rod, and the cross-section of the cut silicon rod described in the present application is rectangular, the structure of the second clamp is the same as the first clamp structure described above, including a second clamp mounting member 233 and at least two second clamping members 234, and any second clamping member 234 further includes: a second clamping arm mounting seat 2340 and at least two second clamping arms 2341, wherein the second clamping arm mounting seat 2340 is arranged on the second clamp mounting member 233, and at least two second clamping arms 2341 are movably arranged on the second clamping arm mounting seat 2340. The only difference is that the second clamping member of the second clamp is a square workpiece clamp as a whole, and specifically, the second clamping arms 2341 constituting the second clamping member 234 are two symmetrically designed, and a single second clamping arm 2341 is designed to have a single straight clamping surface (see Figure 5 and Figure 6 ), other structures of the second clamp are not described here in detail.

[0091] See also Figure 3 As shown in the figure, the wire cutting device is arranged above the at least two silicon rod supporting platforms 21, and is used to cut the silicon rods to be cut. In one embodiment, the wire cutting device includes a cutting frame 24 and a wire cutting unit 25. The wire cutting unit 25 is supported by the cutting frame 24 above the at least two silicon rod supporting platforms 21, and the cutting frame 24 is fixed on the machine base 20.

[0092] In one embodiment, the cutting frame 24 includes two supporting columns 240 arranged opposite to each other and a mounting frame 241 straddling the two supporting columns on opposite sides. The mounting frame 241 is used to place the wire cutting unit 25 and is driven to rise and fall by a first driving mechanism to perform cutting operations. In order to provide directional guidance for the wire cutting unit 25 to rise and fall, lifting guide rails 242 are arranged on opposite sides of the two supporting columns. A slider (not marked in the figure) matching the lifting guide rail 242 is arranged on the mounting frame 241. The first driving mechanism drives the mounting frame 241 to drive the wire cutting unit 25 to rise and fall along the lifting guide rail 242 to perform cutting operations on the silicon rods to be cut.

[0093] In one embodiment, the first driving mechanism is configured as a cylinder assembly or a screw assembly. Figure 8 , which is a schematic diagram of the first driving structure of the multi-station square opening device of the present application in one embodiment, as shown in the figure, the first driving mechanism is set as a screw assembly, and the screw assembly includes a screw 243 and a motor 244, one end of the screw 243 is connected to the mounting frame 241, and the other end is connected to the motor 244 and driven by the motor 244 to drive the mounting frame 241 to rise and fall. However, it is not limited to this, in other embodiments, the first driving mechanism can also be a cylinder assembly.

[0094] See also Figure 3 As shown in the figure, the wire cutting unit 25 includes a plurality of cutting wheel groups 251 corresponding to the number of silicon rod carriers 21, each cutting wheel group 251 includes a pair of cutting wheels or two pairs of cutting wheels, a cutting line segment is formed between the two cutting wheels in any pair of cutting wheels, a transition wheel 252 is provided between two adjacent cutting wheel groups 251, and the line groove of the transition wheel 252 is in the same plane as the line groove of the cutting wheel in the cutting wheel group 251. In order to be able to perform cutting operations of multiple silicon rods to be cut at the same time, in this embodiment, the number of the plurality of cutting wheel groups 251 is the same as the number of silicon rod carriers 21 located in the cutting area and they correspond to each other one by one, so that in the cutting operation, each cutting wheel group 251 cuts the silicon rods to be cut on the corresponding silicon rod carrier 21.

[0095] In view of the complicated spatial layout of the cutting wheel of the existing wire cutting device, a large number of transition wheels are required to change the direction of the cutting wire, which makes the winding complicated, the open device occupies a large space, and the manufacturing cost is high. Therefore, in one embodiment, Figure 3 As shown, the plurality of cutting wheel assemblies 251 are disposed on the mounting frame 241 in a straight line distribution manner.

[0096] In one case, each cutting wheel group includes a pair of cutting wheels, and the pair of cutting wheels in each cutting wheel group are arranged in sequence on the same side of the mounting frame. Only one transition wheel is provided between a pair of cutting wheels in two adjacent cutting wheel groups to guide the cutting line so that a cutting line segment is formed between the two cutting wheels in each pair of cutting wheels. The line groove of the transition wheel and the line groove of the cutting wheel in its adjacent cutting wheel group are located in the same plane, so that the cutting line segments between the two cutting wheels of each cutting wheel group are located on the same straight line. Preferably, the length of each cutting line segment formed is slightly larger than the diameter of the cross-sectional circle of the silicon rod to be cut.

[0097] See also Fig. 9 , showing a schematic diagram of the structure of a pair of cutting wheels in each cutting wheel group of a wire cutting device in one embodiment of the multi-station square opening device of the present application, taking the wire cutting unit in the figure as an example to explain the winding, the four cutting wheel groups are respectively a first cutting wheel group 251a, a second cutting wheel group 251b, a third cutting wheel group 251c and a fourth cutting wheel group 251d, a first transition wheel 252a is provided between the first cutting wheel group 251a and the second cutting wheel group 251b, a second transition wheel 252b is provided between the second cutting wheel group 251b and the third cutting wheel group 251c, and a third transition wheel 252c is provided between the third cutting wheel group 251c and the fourth cutting wheel group 251d, and a single continuous cutting line is sequentially wound around the first cutting wheel A pair of cutting wheels of group 251a are used to form a first cutting line segment L10 on a pair of cutting wheels of the first cutting wheel group 251a, and then the cutting line is guided by the first transition wheel 252a and then sequentially wound around a pair of cutting wheels of the second cutting wheel group 251b, forming a second cutting line segment L20 on a pair of cutting wheels of the second cutting wheel group 251b, and then the cutting line is guided by the second transition wheel 252b and then sequentially wound around a pair of cutting wheels of the third cutting wheel group 251c, forming a third cutting line segment L30 on a pair of cutting wheels of the third cutting wheel group 251c, and finally the cutting line is guided by the third transition wheel 252c and then sequentially wound around a pair of cutting wheels of the fourth cutting wheel group 251d to form a fourth cutting line segment L40 before exiting. In this case, the wire cutting unit performs a downward cutting and can complete the cutting of one axial section of four silicon rods to be cut at the same time. In completing a squaring operation, it is necessary to execute the cutting process of four axial sections. After each axial section is cut, the silicon rod supporting platform 21 needs to be rotated (90 degrees each time) by the rotating mechanism 210 of the silicon rod supporting platform 21 to adjust the cutting surface of the silicon rod to be cut. It should be noted that in order to ensure that the silicon rod after squaring is a rectangular parallelepiped as a whole, the intersection of the cutting lines when the wire cutting unit performs four single axial sections on the silicon rod is located within the cross-sectional circle of the silicon rod to be cut (including the case where the intersection is located on the circumference of the cross-sectional circle).

[0098] In another case, each cutting wheel group includes two pairs of cutting wheels, and the two pairs of cutting wheels in each cutting wheel group are respectively and sequentially arranged on opposite sides of the mounting frame, and a guide wheel group is also arranged on the mounting frame to change the cutting line so as to guide the cutting line from the cutting wheel on one side of the mounting frame to the cutting wheel on the other side of the mounting frame, and a transition wheel group is provided between two adjacent cutting wheel groups to guide the cutting line, and the transition wheel group includes two transition wheels, one of which guides a pair of cutting wheels in two adjacent cutting wheel groups, and the other transition wheel guides the other pair of cutting wheels in two adjacent cutting wheel groups, so that a cutting line segment is formed between the two cutting wheels in any pair of cutting wheels, and the line groove of the transition wheel on the same side is located in the same plane as the line groove of the cutting wheel so that the cutting line segment between the two cutting wheels on the same side in multiple cutting wheel groups is located on the same straight line, and preferably, the length of each cutting line segment formed is slightly larger than the diameter of the cross-sectional circle of the silicon rod to be cut.

[0099] See also Figures 10 to 12 , Fig.10 It shows a schematic diagram of the structure in which each cutting wheel group of the wire cutting device of the multi-station square cutting device in one embodiment of the present application has two pairs of cutting wheels; Fig.11 Display as Fig.10 Schematic diagram of the side structure, Fig.12Shown is a schematic diagram of the guide wheel winding in the case where each cutting wheel group in the wire cutting device of one embodiment of the multi-station square cutting equipment of the present application has two pairs of cutting wheels. The winding is explained by taking the wire cutting device in the figure as an example, which includes four cutting wheel groups. The four cutting wheel groups are respectively the first cutting wheel group 251a, the second cutting wheel group 251b, the third cutting wheel group 251c and the fourth cutting wheel group 251d. A first transition wheel group is provided between the first cutting wheel group 251a and the second cutting wheel group 251b, a second transition wheel group is provided between the second cutting wheel group 251b and the third cutting wheel group 251c, and a third transition wheel group is provided between the third cutting wheel group 251c and the fourth cutting wheel group 251d. In view of the fact that the cutting line is a single continuous cutting line, a guide wheel group 253 is further provided between the two sides of the mounting frame to reverse the cutting line so as to guide the cutting line from the cutting wheel on one side of the mounting frame 241 to the cutting wheel on the other side of the mounting frame 241.The cutting line is wound from one side of the mounting frame, and the cutting line is sequentially wound around a pair of cutting wheels 251a' of the first cutting wheel group 251a, so that a first cutting line segment L11 is formed on the pair of cutting wheels 251a' of the first cutting wheel group 251a, and then the cutting line is guided by a transition wheel 252a' in the first transition wheel group, and then the cutting line is sequentially wound around a pair of cutting wheels 251b' of the second cutting wheel group 251b, and a second cutting line segment L21 is formed on the pair of cutting wheels 251b' of the second cutting wheel group 251b, and then the cutting line is guided by a transition wheel 252b' in the second transition wheel group, and then the cutting line is sequentially wound around a pair of cutting wheels 251c' of the third cutting wheel group 251c, and the cutting line is guided by a transition wheel 252b' in the second transition wheel group, and then the cutting line is sequentially wound around a pair of cutting wheels 251c' of the third cutting wheel group 251c, and the cutting line is guided by a transition wheel 252a ... The cutting line is guided by a transition wheel 252c′ in the third transition wheel group and then sequentially wound around a pair of cutting wheels 251d′ in the fourth cutting wheel group 251d to form a fourth cutting line segment L41. The cutting line then sequentially winds around the guide wheels 253a, 253b, and 253c in the guide wheel group 253 to guide the cutting line from a pair of cutting wheels 251d′ in the fourth cutting wheel group 251d on one side of the mounting frame 241 to another pair of cutting wheels 251d″ in the fourth cutting wheel group 251d on the other side of the mounting frame 241. The cutting line is formed on another pair of cutting wheels 251d″ in the fourth cutting wheel group 251d. After forming the fifth cutting line segment L42, the cutting line is then guided by another transition wheel 252c" in the third transition wheel group and then wound around another pair of cutting wheels 251c" in the third cutting wheel group 251c. After forming the sixth cutting line segment L32 on another pair of cutting wheels 251c" in the third cutting wheel group 251c, the cutting line is guided by another transition wheel 252b" in the second transition wheel group and then wound around another pair of cutting wheels 251b" in the second cutting wheel group 251b. After forming the seventh cutting line segment L22 on another pair of cutting wheels 251b" in the second cutting wheel group 251b, the cutting line is guided by another transition wheel 252a" in the first transition wheel group and then wound around Another pair of cutting wheels 251a″ in the first cutting wheel group 251a forms the eighth cutting line segment L12 on the other pair of cutting wheels 251a″ of the first cutting wheel group 251a, wherein the first cutting line segment L11 and the eighth cutting line segment L12 are two cutting line segments of the first cutting wheel group, the second cutting line segment L21 and the seventh cutting line segment L22 are two cutting line segments of the second cutting wheel group, the third cutting line segment L31 and the sixth cutting line segment L32 are two cutting line segments of the third cutting wheel group, the fourth cutting line segment L41 and the fifth cutting line segment L42 are two cutting line segments of the fourth cutting wheel group, and the two cutting line segments of each cutting wheel group are used for cutting two parallel axial sections of the silicon rod to be cut.In this case, the wire cutting unit can simultaneously complete the cutting of two parallel axis sections of four silicon rods to be cut by performing a downward cutting. In completing a square cutting operation, it is necessary to execute the process of two parallel axis sections twice. After completing the cutting of two parallel axis sections once, the silicon rod support platform is rotated (rotated 90 degrees) by the rotating mechanism of the silicon rod support platform to adjust the cutting surface of the silicon rod to be cut. It should be noted that in order to ensure that the silicon rod after square cutting is in the shape of a rectangular parallelepiped as a whole, the horizontal distance between the wire grooves of the two pairs of cutting wheel groups of the cutting wheel group is less than or equal to the side length of the inscribed square of the cross-sectional circle of the silicon rod to be cut, thereby ensuring that the intersection of the cutting lines when the wire cutting unit performs two horizontal axis sections on the silicon rod is located within the cross-sectional circle of the silicon rod to be cut (including the case where the intersection is located on the circumference of the cross-sectional circle).

[0100] In one embodiment, see Figure 3 As shown in the figure, the wire cutting device also includes a wire take-up drum 255 and a wire pay-off drum 254 arranged on the machine base 20, and the wire take-up drum 255 and the wire pay-off drum 254 are used to take up and pay off the cutting wire during the squaring operation.

[0101] The wire cutting device can be used to square the silicon rod to be cut to form the cut silicon rod and the edge skin. After the wire cutting device is used for a long time, the wire grooves in the cutting wheel where the cutting wire is wound will be worn, affecting the cutting effect. Therefore, the cutting wheel of the wire cutting device is generally provided with multiple wire grooves, and it is necessary to change the grooves to change the cutting wire around other wire grooves of the cutting wheel. At this time, it is necessary to adjust the moving distance of the cutting wheel according to the groove spacing between other wire grooves and the current wire groove.

[0102] In view of this, the multi-station square cutting equipment also includes an automatic slot changing mechanism. Fig.13 and Fig.14 , Fig.13 It is a schematic structural diagram showing that the automatic slot changing mechanism of the multi-station square cutting device in one embodiment of the present application is arranged on the wire cutting device; Fig.14The cross-sectional structure diagram of the automatic slot changing mechanism in one embodiment of the multi-station square cutting device of the present application is shown. As shown in the figure, in the embodiment, the automatic slot changing mechanism 29 includes a cutting wheel 290, a slot changing cylinder 292 and a positioning member 291. The cutting wheel includes a first wire groove and a second wire groove for winding a cutting line. The slot changing cylinder is linked with the cutting wheel 290 to drive the cutting wheel 290 to move along its axial direction so as to move the cutting line from one wire groove to another adjacent wire groove. The slot changing cylinder 292 includes a cylinder body and a positioning member 291. The first guide rail 293 and the second guide rail 294 on the cylinder body are connected to each other, and the height difference between the first guide rail 293 and the second guide rail 294 corresponds to the groove distance between the first wire groove and the second wire groove. The positioning member 291 can be relatively slidably arranged in the first guide rail 293 or the second guide rail 294, and is used to slide in the first guide rail 293 or the second guide rail 294 to drive the groove changing cylinder 292 to rotate when the groove changing cylinder 292 moves axially, so as to force the cutting line on the cutting wheel 290 to switch from the first wire groove to the second wire groove.

[0103] See also Fig.13 , Fig.14 and Fig.15 , Fig.15 Display as Fig.14 A partial enlarged view of part B of the cutting wheel is shown below. The automatic slot changing mechanism is described in detail below using the example of a cutting wheel including two slots.

[0104] The cutting wheel 290 includes a first wire groove and a second wire groove (not shown) for winding the cutting wire. Fig.14 The arrow direction shown in the figure is the front, and the direction opposite to the arrow is the rear. The cutting wire is initially wound around the first wire groove, and the second wire groove is located at the rear side of the first wire groove and adjacent to the first wire groove.

[0105] The groove changing cylinder 292 is linked with the cutting wheel 290, and is used to drive the cutting wheel 290 to move along its axial direction to move the cutting line from one wire groove to another adjacent wire groove. The groove changing cylinder 292 includes a cylinder body and a first guide rail 293 and a second guide rail 294 that are connected to each other and opened on the cylinder body. The height difference between the first guide rail 293 and the second guide rail 294 corresponds to the groove distance between the first wire groove and the second wire groove.

[0106] The positioning member 291 can be relatively slidably arranged in the first guide rail 293 or the second guide rail 294, and is used to slide in the first guide rail 293 or the second guide rail 294 to drive the groove changing cylinder 292 to rotate when the groove changing cylinder 292 moves axially, so as to force the cutting line on the cutting wheel 290 to switch from the first line groove to the second line groove.

[0107] In one embodiment, the slot changing cylinder 292 is disposed on the mounting frame 241 of the aforementioned cutting frame 24, and a positioning shaft (not shown in the figure) is disposed at the front end of the slot changing cylinder 292. The cutting wheel 290 is rotatably disposed on the positioning shaft through a bearing. The slot changing cylinder 292 can drive the cutting wheel 290 to move along its axial direction when it moves along its axial direction to move the cutting line from the first line groove to the second line groove.

[0108] In one embodiment, the slot-changing cylinder 292 is driven by a driving device 295 to move telescopically along its axial direction, and the driving device 295 includes a cylinder assembly or a screw assembly driven by a motor. In this embodiment, the driving device 295 is set as a cylinder assembly, and the cylinder assembly includes a cylinder and a telescopic rod driven by the cylinder to extend and retract. The rear end of the slot-changing cylinder 292 is set on the telescopic rod through a bearing, so that the slot-changing cylinder 292 can be driven by the cylinder assembly to move along its axial direction and can also be rotated by force. However, this is not limited to this. In other embodiments, the driving device 295 can also be a screw assembly driven by a motor. The rear end of the slot-changing cylinder 292 is set on the screw assembly through a bearing. The motor drives the screw assembly to extend or retract so that the slot-changing cylinder 292 moves along its axial direction and can also be rotated by force.

[0109] In order to realize automatic slot changing, the moving distance of the cutting wheel 290 is adjusted each time to be the slot distance between the first slot and the second slot. Therefore, the drop H between the first guide rail 293 and the second guide rail 294 corresponds to the slot distance between the first slot and the second slot. In one embodiment, the first guide rail 293 has a first landing end 2930, and the first landing end 2930 has a first distance from the first slot. The second guide rail 294 has a second landing end 2940, and the second landing end 2940 has a second distance from the second slot. The first distance is equal to the second distance. In this way, the drop H between the first guide rail 293 and the second guide rail 294 is equal to the slot distance between the first slot and the second slot.

[0110] In order to facilitate the guiding of the positioning member 291 to slide relatively from the first landing end 2930 of the first guide rail 293 to the second landing end 2940 of the second guide rail 294 to realize automatic slot changing, in an embodiment, a transition end 296 is provided between the first landing end 2930 and the second landing end 2940 .

[0111] In order to further facilitate the positioning member 291 to quickly slide from the first landing end 2930 to the transition end 296 and then slide from the transition end 296 to the second landing end 2940, an upward section 297 is provided between the first landing end 2930 and the transition end 296 to provide an upward passage for the positioning member 291, and a downward section 298 is provided between the transition end 296 and the second landing end 2940 to provide a downward passage for the positioning member 291. In the embodiment, the upward section 297 is in a contracted state from the first landing end direction to the transition end direction, and the downward section 298 is in a contracted state from the transition end direction to the second landing end direction.

[0112] Preferably, in order to guide the positioning member 291 to slide quickly and accurately through the transition end 296, the transition end 296 has a first channel 2960 connected to the upward section 297, and the transition end 296 has a second channel 2961 connected to the downward section 297, and the width of the first channel 2960 is smaller than the above-mentioned second channel 2961.

[0113] In order to prevent the positioning member 291 from sliding back at the transition end 296, that is, the positioning member 291 cannot smoothly slide along the first channel 2960 of the transition end 296 to the second channel 2961 of the transition end 296 to enter the downward section 298, but enters the upward section 297 from the first channel 2960 of the transition end 296 to return to the first landing end 2930, so that automatic slot changing cannot be achieved. In one embodiment, the transition end 296 is located near the vertex of the cutting wheel 290 in the second channel 2961, which means that the horizontal distance between the first channel 2961 and the cutting wheel 290 is greater than the horizontal distance between the second channel 2961 and the cutting wheel 290, so that the running state of the positioning member 291 sliding from the first channel 2960 to the second channel 2961 is an upward movement with a slope, so that when the slot changing cylinder 292 moves backward along its axial direction, the positioning member 291 slides from the first channel 2960 to the second channel 2961 and drives the slot changing cylinder 292 to rotate to realize the switching of the positioning member from the first guide rail 293 to the second guide rail 294. Similarly, in order to prevent the positioning member 291 from being unable to slide smoothly from the first landing end 2920 to the upward section 297, the projection of the first landing end 2930 away from the vertex of the cutting wheel 290 is located in the upward section 297.

[0114] The positioning member 291 is fixedly connected to a fixing seat 299, and the fixing seat 299 is connected to the mounting frame 241 of the wire cutting device of the multi-station cutting equipment, and is used to set the positioning member 291 in the first guide rail 293 or the second guide rail 294. In the embodiment, the fixing seat 299 is configured as a cover body that sleeves the groove changing cylinder 292, one end of the positioning member 299 is fixed to the cylinder wall of the groove changing cylinder 292, and the other end extends into the first guide rail 293 or the second guide rail 294. When the groove changing cylinder 292 is driven to move along its axial direction, the positioning member 291 slides in the first guide rail 293 or the second guide rail 294. However, the fixed seat 299 is not limited to this. In other embodiments, the fixed seat 299 can also be configured as a fixed rod placed in the slot changing cylinder 292, one end of the positioning member 291 is connected to the outer wall of the fixed rod, and the other end extends into the first guide rail 293 or the second guide rail 294. When the slot changing cylinder 292 is driven to move along its axial direction, the positioning member 291 slides in the first guide rail 293 or the second guide rail 294.

[0115] See also Figure 16a to Figure 16b , Figures 16a to 16d The schematic diagram of the movement process of the automatic slot changing mechanism of the multi-station square cutting device of the present application is shown. As shown in the figure, the cutting line is initially located in the first line slot of the cutting wheel 290, and correspondingly, the positioning member 291 is located at the first landing end 2930 of the first guide rail 293 (shown as Fig.16a As shown in FIG. 1 , when the automatic slot changing mechanism changes slots, the slot changing cylinder 292 is first driven to move backward along its axial direction ( Fig.16a in the direction of the middle arrow) so that the positioning member 291 enters the upward section 297 from the first landing position 2930 and ascends to the first channel 2960 of the transition end (in the form of Fig.16b Then, the slot changing cylinder 292 is driven to continue to move backward along its axial direction so that the positioning member 291 cooperates with the transition end 296 to force the slot changing cylinder 292 to rotate ( Fig.16b The positioning member 291 slides from the first channel 2960 at the transition end to the second channel 2961 at the transition end (in the direction of the arrow in the middle), thereby Fig.16c Finally, the slot changing cylinder 292 is driven to move forward along its axial direction (as shown in FIG. Fig.16c in the direction of the middle arrow) so that the positioning member 291 enters the descending section 298 from the second channel 2961 at the transition end and slides down to the second landing end 2940 (in the form of Fig.16d As shown), the barrel changing groove 292 is moved forward along its axial direction by the distance of the groove distance between the first wire groove and the second wire groove, so that the cutting line is switched from the first wire groove to the second wire groove.

[0116] It is worth noting that in the above embodiment, the cutting wheel includes two wire grooves, namely the first wire groove and the second wire groove, and the groove changing cylinder has two guide rails, namely the first guide rail and the second guide rail, but the number of wire grooves included in the cutting wheel and the number of guide rails provided in the groove changing cylinder are not limited thereto.

[0117] In other embodiments, the cutting wheel includes three wire grooves. For example, the cutting wheel includes, in addition to the first wire groove and the second wire groove in the above embodiments, a third wire groove, and the third wire groove is adjacent to the rear side of the second wire groove.

[0118] The number of guide rails provided on the slot changing cylinder is consistent with the number of the wire slots, which is set to three. For example, in addition to the first guide rail and the second guide rail in the above-mentioned embodiment, the slot changing cylinder is also provided with a third guide rail, and the third guide rail is connected to the above-mentioned second guide rail, and the height difference between the third guide rail and the second guide rail corresponds to the groove distance between the above-mentioned second wire slot and the third wire slot, that is, the third guide rail has a third landing end, and the third landing end has a third distance from the third wire slot, and the third distance is equal to the above-mentioned second distance.

[0119] In order to facilitate the guide positioning member to slide relatively from the second landing end of the above-mentioned second guide rail to the third landing end of the third guide rail to realize the switching of the cutting line from the above-mentioned second line groove to the third line groove, in an embodiment, there is also a transition end between the above-mentioned second landing end and the third landing end. Similarly, there is an ascending section between the above-mentioned second landing end and the transition end, and the ascending section has a side wall with a first slope. There is a descending section between the transition end and the third landing end, and the descending section has a side wall with a second slope. In an embodiment, the ascending section is in a contracted state from the direction of the second landing end to the direction of the transition end, and the descending section is in a contracted state from the direction of the transition end to the direction of the third landing end.

[0120] In order to guide the positioning member to slide through the transition end quickly and accurately, the transition end has a first channel connected to the upward section and a second channel connected to the downward section, and the width of the first channel is smaller than the second channel.

[0121] In order to prevent the positioning member from sliding back at the transition end, that is, the positioning member cannot smoothly slide along the first channel of the transition end to the second channel of the transition end to enter the downward section, and enter the upward section from the first channel of the transition end to return to the second landing end, so that the cutting line cannot be moved from the second line groove to the third line groove. In one embodiment, the transition end is located in the second channel near the vertex of the cutting wheel, which can be understood as the horizontal distance between the first channel and the cutting wheel is greater than the horizontal distance between the second channel and the cutting wheel so that the operating state of the positioning member sliding from the first channel to the second channel is an upward movement with a slope, so that when the groove changing drum moves backward along its axial direction, the positioning member slides from the first channel of the transition end to the second channel while driving the groove changing drum to rotate to realize the switching of the positioning member from the second guide rail to the third guide rail. Similarly, in order to prevent the positioning member from being unable to slide smoothly to the transition end at the second landing end, the projection of the second landing end away from the vertex of the cutting wheel is located in the first channel.

[0122] But it is not limited to this, in the actual implementation form, the number of wire grooves on the cutting groove can also be 4, 5, and so on, the cutting wheel can also include multiple wire grooves, and the groove changing cylinder can also be provided with multiple guide rails connected to each other corresponding to the number of the wire grooves. Of course, as the number of guide rails increases, the diameter of the groove changing cylinder needs to be increased, which is not elaborated here.

[0123] Generally, due to the large weight of the silicon rod to be cut, it can be placed vertically on the silicon rod support platform with a relatively stable weight. However, in the subsequent silicon rod cutting operation, the silicon rod to be cut will be disturbed, dislocated or even overturned by the pulling effect of the cutting wire in the wire cutting unit. In order to avoid the occurrence of the above-mentioned risks, a silicon rod clamping device capable of lifting and lowering is also provided above the silicon rod support platform in the cutting area. The silicon rod clamping device is mounted on the lifting rail and is located above the wire cutting device, that is, the silicon rod clamping device and the wire cutting device share the same lifting rail, and the silicon rod clamping device is used to clamp the top of the silicon rod to be cut when the wire cutting device cuts the silicon rod to be cut on the silicon rod support platform in the cutting area.

[0124] See also Fig.17, which is a schematic diagram of the structure of a silicon rod clamping device in one embodiment of the multi-station square opening device of the present application, as shown in the figure, the silicon rod clamping device 26 includes a clamping bracket 260 and a clamping unit 261 arranged on the clamping bracket and corresponding to the silicon rod bearing platform 21 located in the cutting area. A slider 262 that cooperates with the lifting guide rail 242 is fixed on the clamping bracket 260. The clamping bracket 260 can be lifted and lowered on the support column 240 of the cutting frame 24 and is located above the wire cutting device through the cooperation of its slider 262 and the lifting guide rail 242. The clamping unit 261 is arranged on the clamping bracket 260 and can be lifted and lowered with the clamping bracket 260 to release or clamp the silicon rod to be cut on the silicon rod bearing platform 21 in the cutting area.

[0125] Affected by the manufacturing process, the heights of the silicon rods to be cut on the silicon rod carrier 21 in the cutting area are not completely consistent, and the pressing unit 261 follows the pressing bracket 260 to descend and cannot ensure that each pressing unit 261 is pressed tightly on the silicon rod to be cut carried by its corresponding silicon rod carrier 21. In view of this, the pressing unit 261 includes a pressing block 2610 and a driving structure that drives the pressing block to move up and down. In one embodiment, the driving structure is configured as a cylinder assembly, and the cylinder assembly includes a cylinder 2611 and a telescopic member 2612 connected to the cylinder, and the pressing block 2610 is arranged at the bottom of the telescopic member 2612 (that is, the telescopic member 2612 faces the surface of the silicon rod carrier 21 in the cutting area), and the cylinder 2611 drives the telescopic member 2612 to move up and down with the pressing block 2610 to release or press the silicon rod to be cut on the silicon rod carrier 21 in the cutting area.

[0126] In view of the fact that the silicon rod carrier 21 has a rotating mechanism 210, the silicon rod to be cut located thereon can be driven to rotate to adjust the surface to be cut. In order to cooperate with the rotating mechanism 210 of the silicon rod carrier 21, in one embodiment, the pressing block 2610 is connected to the driving structure through a rotating shaft (not shown in the figure). Specifically, a bearing (not shown in the figure) is arranged at the bottom of the telescopic member 2612 of the cylinder assembly, and the pressing block 2610 has a rotating shaft adapted to the bearing, and the pressing block 2610 is rotatably mounted on the bearing of the telescopic member 2612 through the rotating shaft. In this way, when the pressing block 2610 presses the silicon rod to be cut, the silicon rod carrier 21 drives the silicon rod to be cut to rotate, and the pressing block 2610 can also rotate in coordination with the silicon rod to be cut.

[0127] In order to better protect the silicon rods to be cut, a buffer pad (not shown) can be set between the pressing block 2610 and the silicon rods to be cut, and the buffer pad is fixed to the pressing surface of the pressing block 2610 (the pressing surface is the lower surface of the pressing block).

[0128] In order to simplify the structure of the multi-station square cutting equipment of the present application and reduce the manufacturing cost of the equipment, in one embodiment, the silicon rod clamping device 26 is attached to the mounting frame 241 for mounting the wire cutting unit by its own gravity and moves up and down along the lifting guide rail 242. The first driving mechanism drives the mounting frame 241 to drive the wire cutting unit 25 to descend along the lifting guide rail 242, and the silicon rod clamping device 26 is attached to the mounting frame 241 and also descends along the lifting guide rail 242 to the top of the silicon rod to be cut carried by the silicon rod supporting platform 21 in the cutting area, and the driving structure in the clamping unit 261 drives the pressing block 2610 to press the corresponding silicon rod to be cut, and the mounting frame 241 will continue to be driven by the first driving mechanism to bring the wire cutting unit 25 down to perform the cutting operation of the silicon rod to be cut. In order to prevent the silicon rod pressing device 26 from continuing to descend following the mounting frame 241 and damaging the silicon rod to be cut, a guide rail locking unit 263 is provided on the pressing bracket 260 of the silicon rod pressing device 26. The guide rail locking unit 263 is used to position the silicon rod pressing device 26 at a predetermined position on the lifting guide rail 242. For example, the predetermined position is that the pressing unit 261 in the silicon rod pressing device 26 is located 0 to 5 cm above the corresponding silicon rod to be cut, but it is not limited to this. As long as the pressing unit 261 is located above the corresponding silicon rod to be cut, the pressing block 2610 in the pressing unit 261 can be pressed against the top surface of the corresponding silicon rod to be cut when it is driven to descend.

[0129] In one embodiment, the guide rail locking unit 263 adopts a pneumatic guide rail locking device. Specifically, the pneumatic guide rail locking device in this embodiment includes a locking clamp matched with the lifting guide rail 242 and a cylinder driving the locking clamp to move. The locking clamp is arranged on the clamping bracket 260 in the silicon rod clamping device 26. When the silicon rod clamping device 26 and the mounting frame 241 are lowered to a predetermined position, the cylinder drives the locking clamp on the clamping bracket to hold the lifting guide rail 242 and position the silicon rod clamping device 26 at the predetermined position. The clamping unit 261 in the silicon rod clamping device 26 clamps the corresponding silicon rod to be cut, and the mounting frame 241 continues to be driven to drive the wire cutting unit 25 to descend to complete the cutting of the silicon rod to be cut. After completing the cutting operation of the silicon rod to be cut, the mounting frame 241 is driven by the first driving mechanism to drive the wire cutting unit 25 to rise to the position where the silicon rod clamping device 26 is located, and the cylinder drives the locking clamp on the clamping bracket 260 to release the lifting guide rail 242 so that the silicon rod clamping device 26 continues to be attached to the mounting frame 241 and rises.

[0130] In another embodiment, the silicon rod clamping device 26 is mounted on the lifting guide rail 242 and driven by the second driving mechanism to move up and down along the lifting guide rail 242, and the second driving mechanism is configured as a cylinder assembly or a screw assembly driven by a motor. In actual application, when the first driving mechanism drives the mounting frame 241 to carry the wire cutting unit 25 down, and the second driving mechanism drives the silicon rod clamping device 26 to descend to a predetermined position, the second driving mechanism stops driving the silicon rod clamping device 26 so that the silicon rod clamping device 26 is positioned at a predetermined position to clamp the silicon rod to be cut, and the first driving mechanism continues to drive the mounting frame 241 to carry the wire cutting unit 25 down to complete the cutting of the silicon rod to be cut. After the cutting operation of the silicon rod to be cut is completed, the first driving mechanism drives the mounting frame 241 to carry the wire cutting unit 25 up, and the second driving mechanism drives the silicon rod clamping device 26 to rise.

[0131] In addition, in order to achieve complete cutting of the silicon rod to be cut and to avoid damage to the cutting line due to obstruction, in one embodiment, the silicon rod support platform is a table structure with a circular or rectangular cross-section, and the size of the support surface in contact with the silicon rod in the table structure is larger than the cross-section of the squared silicon rod formed after the silicon rod to be cut is squared, so the table structure is provided with a cutting groove for the cutting line segment to enter, and specifically, the table structure is provided with four cutting grooves for the cutting line segment to enter. In this way, when the wire cutting device follows the mounting frame to descend, the cutting line segment formed in the cutting device squares the silicon rod to be cut carried by the silicon rod support platform in the cutting area, and when the cutting line segment reaches the bottom of the silicon rod to be cut, it can continue to descend without hindrance until it penetrates the silicon rod to be cut, thereby achieving complete cutting of the silicon rod to be cut. Of course, the structure of the silicon rod support platform is not limited to this.

[0132] In other embodiments, the silicon rod support platform is a table structure with a rectangular cross-section, and the size of the support surface in contact with the silicon rod in the table structure is slightly smaller than the cross-section of the squared silicon rod formed after the silicon rod to be cut is squared. In this way, the wire cutting unit in the wire cutting device follows the cutting frame to descend relative to the machine base, and the cutting line segment formed in the cutting unit squares the silicon rod to be cut carried by the silicon rod support platform in the cutting area. When the cutting line segment reaches the bottom of the silicon rod to be cut, it can continue to descend without hindrance until it penetrates the silicon rod to be cut, thereby achieving complete cutting of the silicon rod to be cut.

[0133] As described above, the silicon rod support platform is a table structure with a rectangular cross-section, and the size of the support surface in contact with the silicon rod in the table structure is slightly smaller than the cross-section of the squared silicon rod formed after the silicon rod to be cut is squared. In this way, it can be ensured that the cutting line segments in the wire cutting unit can perform square cutting on the silicon rod to be cut carried by the silicon rod support platform located in the cutting area without hindrance. However, such a design also brings about a problem: after the silicon rod to be cut on the silicon rod support platform located in the cutting area completes the square cutting operation, the edge skin formed after cutting may be at risk of falling or overturning due to the lack of corresponding support. Therefore, the multi-station square cutting equipment of the present application also includes an edge skin supporting mechanism, which is used to support the edge skin formed after the silicon rod to be cut is squared.

[0134] The edge skin supporting mechanism disclosed in the present application is arranged around the silicon rod supporting platform. After the wire cutting device cuts the silicon rod to be cut carried by the silicon rod supporting platform in the cutting area, an edge skin will be formed on the cut side. Therefore, in practical applications, an edge skin supporting mechanism is respectively provided on the four sides of the silicon rod supporting platform with a rectangular cross-section table structure to support a corresponding edge skin. The edge skin supporting mechanism disclosed in the present application can support the edge skin formed after the wire cutting device performs a square cutting operation on the silicon rod to be cut, avoid relative displacement between the edge skin and the squared silicon rod, prevent the cutting line segment in the wire cutting device from collapsing when passing through the silicon rod to be cut, and avoid the edge skin from falling and overturning, and the squared silicon rod from being damaged by being touched by the edge skin.

[0135] In one embodiment, see Fig.18 , which is a schematic diagram of the structure of the edge skin supporting mechanism in one embodiment of the multi-station square opening device of the present application, as shown in the figure, the edge skin supporting mechanism 27 includes a supporting member, and the supporting member includes a base 270 connected to one side of the silicon rod support platform 21 and a supporting portion 271 extending upward from the base. In this embodiment, the base 270 is configured as a flat plate structure that matches the side of the silicon rod support platform 21, but it is not limited to this. The base 270 can also be configured as a curved plate structure or other special-shaped structures. The supporting portion 271 is configured as two top columns located on both sides of the base 270. The height of the top column extension is consistent with the height of the bearing surface of the silicon rod support platform 21. In practice, the supporting portion 271 can also be a top plate or a top rod extending upward from the base 270. When the wire cutting device performs square cutting on the silicon rod to be cut on the silicon rod supporting platform 21, the supporting member can support the corresponding edge skin, thereby effectively preventing the cutting wire segment in the wire cutting device from breaking when passing through the silicon rod to be cut, and preventing the edge skin from falling and overturning.

[0136] In another embodiment, the edge skin supporting mechanism includes a movable supporting member and a locking control member. In this embodiment, the movable supporting member includes a movable base connected to one side of the silicon rod supporting platform, a supporting portion extending upward from the movable base, and a power generating structure for providing the supporting portion with up and down movement. In one implementation, the movable base can be, for example, a flat plate structure adapted to the side of the silicon rod supporting platform, but it is not limited thereto. The movable base can also be, for example, a curved plate structure or other special-shaped structures. The supporting portion is at least two top rods extending upward from the movable base, but it is not limited thereto. The supporting portion can also be, for example, a top plate or a top column extending upward from the movable base. The power generating structure includes two supporting legs arranged at the movable base and two springs respectively sleeved on the two supporting legs, but it is not limited thereto. The power generating structure can also adopt structures such as torsion springs and spring sheets. By utilizing the elastic force of the springs, the supporting legs and the connected top rods can move up and down relative to the silicon rod supporting platform. In this embodiment, the locking control member is used to control the movable support member in a locked state when the movable support member abuts against the bottom of the silicon rod to be cut. In one implementation, the locking control member may be, for example, an electromagnetic lock. In the initial state, the push rod protrudes from the bearing surface of the silicon rod bearing platform under the action of the support foot and the spring. When the silicon rod to be cut is placed, the push rod overcomes the elastic force of the spring after being pressed by the silicon rod to be cut and moves downward until the silicon rod to be cut is completely placed on the bearing surface of the silicon rod bearing platform. At this time, the electromagnetic lock as the locking control member is energized and the strong magnetic force generated by the electromagnetism principle tightly adsorbs the movable base in the movable support member, thereby controlling the push rod in a locked state. When the wire cutting device performs square cutting on the silicon rod to be cut carried by the silicon rod supporting platform corresponding to the cutting area in the silicon rod conversion device, the movable supporting member in the locked state can support the corresponding edge skin, which can effectively prevent the cutting wire net in the wire cutting unit from breaking when passing through the silicon rod to be cut, and can also prevent the edge skin from falling and overturning.

[0137] According to the above, after the silicon rod to be cut is squared, a skin will be formed. In order not to hinder the rise of the wire cutting device, the skin needs to be unloaded in time. For the unloading of the skin, the general way of unloading the skin is mostly for the operator to manually separate the skin from the squared silicon rod and move it out of the silicon rod squared equipment. Not only is the efficiency low, but also during the transportation process, the skin will collide with the squared silicon rod and increase the risk of damage to the squared silicon rod. In view of this, the multi-station squared equipment of the present application also includes a skin unloading device, which is used to unload the skin formed after the wire cutting device squares the silicon rod to be cut.

[0138] See also Fig.19, which is a schematic diagram of the structure of the edge skin lifting mechanism in one embodiment of the multi-station square cutting device of the present application, wherein the edge skin unloading device 28 includes an edge skin lifting mechanism 280, which is used to lift the edge skin so that the top of the edge skin 10 protrudes from the cut silicon rod. The edge skin lifting mechanism 280 includes a lifting member 2800 disposed on the mounting frame 241, and the lifting member 2800 is driven by a telescopic member 2801 to perform telescopic movement. After the lifting member 2800 is controlled to perform the extension movement, it supports the bottom of the edge skin 10 to lift the edge skin 10.

[0139] In one embodiment, the lifting member 2800 includes a support plate and a supporting plate, wherein the support plate extends upward from the bottom of the supporting plate, and further, the support plate can be a curved plate adapted to the curved surface of the edge skin 10, and when the support plate is against the edge skin 10, it can fully contact the curved surface of the edge skin 10, and the contact portion of the support plate with the edge skin 10 is of a smooth design or a buffer pad is provided on the inner surface of the support plate that contacts the edge skin 10. The supporting plate is used to support the bottom of the edge skin 10, and further, the supporting plate can be a bow-shaped plate adapted to the bottom surface of the edge skin 10. In other embodiments, the chord edge of the bow-shaped plate serving as the support plate can also be provided with a protrusion to increase the contact area with the bottom surface of the edge skin 10.

[0140] In one embodiment, the telescopic component 2801 may be, for example, a cylinder with a telescopic rod, wherein the telescopic rod may be connected to the support plate in the lifting member 2800 through a connecting structure, and the cylinder may drive the telescopic rod to drive the lifting member 2800 to perform telescopic movement. Here, the telescopic movement of the lifting member 2800 includes the contraction movement of the lifting member 2800 and the extension movement of the lifting member, wherein the contraction movement of the lifting member 2800 specifically refers to the cylinder driving the telescopic rod to contract to drive the lifting member 2800 away from the side skin 10, and the extension movement of the lifting member 2800 specifically refers to the cylinder driving the telescopic rod to extend to drive the lifting member 2800 close to the side skin 10. Of course, the telescopic component 2801 may also be implemented in other ways. For example, the telescopic component 2801 may also be a servo motor with a lead screw, wherein the lead screw is connected to the lifting member, and the lead screw is driven by the servo motor to rotate to drive the connected lifting member 2800 to perform telescopic movement. For example, the lead screw is driven to rotate forward to drive the lifting member 2800 to perform a contraction movement and the lead screw is driven to rotate reversely to drive the lifting member 2800 to perform an extension movement, or the lead screw is driven to rotate forward to drive the lifting member 2800 to perform an extension movement and the lead screw is driven to rotate reversely to drive the lifting member 2800 to perform a contraction movement.

[0141] In actual application, in the initial state, the telescopic rod drives the lifting member 2800 to be in a retracted state, and the wire cutting unit 25 is driven to descend with the mounting frame 241 so that the cutting line formed by each cutting line segment in the wire cutting unit 25 performs square cutting on the silicon rod to be cut in the cutting area, until the cutting line segment passes through the silicon rod to be cut, completing a complete cutting of the silicon rod to be cut and forming the edge skin 10. At this time, the edge skin lifting mechanism 280 has followed the wire mounting frame 241 to descend to the bottom, and the cylinder drives the telescopic rod to extend to drive the lifting member 2800 to approach the edge skin 10 until the abutment plate in the lifting member 2800 contacts and abuts against the edge skin 10. Subsequently, the wire cutting unit 25 is The drive follows the mounting frame 241 to rise, and the edge skin lifting mechanism 280 follows the mounting frame 241 to rise, driving the edge skin 10 to rise relative to the silicon rod that has been cut once, so that the top of the edge skin 10 protrudes from the silicon rod to be cut. When the top of the edge skin 10 meets the set conditions compared to the protruding part of the silicon rod to be cut, the mounting frame 241 can be controlled to stop rising. In this way, the top of the edge skin can be used as a fulcrum for grasping, so that the edge skin is grasped and unloaded. Then, the cylinder drives the telescopic rod to contract to drive the lifting member 2800 to return to the initial state, while controlling the mounting frame 241 to drive the wire cutting unit 25 and the edge skin lifting mechanism 280 to continue to rise above the silicon rod to be cut in preparation for the next cutting operation.

[0142] In other embodiments, the edge skin lifting mechanism may include an adsorbing member and a telescopic component that drives the adsorbing member to perform telescopic movement, and the adsorbing member is controlled by the telescopic component to abut against the edge skin and adsorb the edge skin. The adsorbing member may further include a supporting plate and an adsorption element. The supporting plate may be, for example, an arc-shaped plate that matches the arc surface of the edge skin, and when the supporting plate abuts against the edge skin, it can fully contact the arc surface of the edge skin. The adsorption element may be, for example, a vacuum suction cup, and a plurality of vacuum suction cups may be arranged on the contact surface of the supporting plate that is to contact the edge skin. The telescopic component may be, for example, a cylinder with a telescopic rod or a servo motor with a lead screw. Taking the cylinder with a telescopic rod as an example, the telescopic rod can be connected to the supporting plate in the lifting member through a connecting structure, and the cylinder can drive the telescopic rod to contract to drive the supporting plate away from the edge skin, and the cylinder can drive the telescopic rod to extend to drive the supporting plate close to the edge skin and the supporting plate is adsorbed by the adsorption element after the supporting plate contacts the edge skin. Subsequently, the mounting frame is driven to rise, and the edge skin lifting mechanism and the wire cutting device rise along with the mounting frame. The edge skin lifting mechanism utilizes the adsorption force to drive the edge skin to rise relative to the silicon rod that has undergone a cutting operation, so that the top end of the edge skin protrudes from the silicon rod that has undergone a cutting operation.

[0143] It should be noted that, since the multi-station squaring equipment of the present application is provided with multiple cutting wheel groups to simultaneously cut multiple silicon rods to be cut, multiple edge skin lifting mechanisms are provided on the mounting frame corresponding to the multiple cutting wheel groups to simultaneously unload the edge skins of multiple silicon rods that have been cut. In the case where each cutting wheel group is provided with a pair of cutting wheels, a downward pressing cutting of the wire cutting device forms an edge skin, and a edge skin lifting mechanism is provided above a pair of cutting wheels corresponding to each cutting wheel group on the mounting frame to unload the edge skin formed during the cutting operation in a timely manner. In the case where each cutting wheel group is provided with two pairs of cutting wheels, a downward pressing cutting of the wire cutting device forms two edge skins, and a edge skin lifting mechanism is provided above each pair of cutting wheels corresponding to each cutting wheel group on the mounting frame to unload the edge skin formed during the cutting operation in a timely manner.

[0144] The edge skin unloading device 28 also includes a clamping and transferring unit 281, which is arranged above the silicon rod supporting platform 21 and is used to clamp the top of the edge skin and pull up the edge skin to separate from the squared silicon rod and transfer the edge skin to the edge skin unloading area.

[0145] See also Figure 3 As shown in the figure, the clamping and transporting unit 281 includes a moving mechanism 283 that provides movement in at least one direction and a skin clamping mechanism 284. The skin clamping mechanism 284 is connected to the moving mechanism 283 and is driven to move in at least one direction.

[0146] In one embodiment, a support plate 282 for supporting a clamping and transferring unit 281 is provided across the top ends of two opposing support columns 240 of the cutting frame 24. The clamping and transferring unit 281 is provided on the support plate 282 and corresponds to the top of the silicon rod supporting platform located in the cutting area.

[0147] In one embodiment, the edge skin clamping mechanism 284 may be provided in a plurality of units corresponding to the silicon rod support platforms located in the cutting area. In order to simplify the mechanism, reduce manufacturing costs and reduce working energy consumption, in the embodiment, two adjacent edge skin clamping mechanisms 284 share a moving mechanism 283 that provides at least one direction of movement.

[0148] In one embodiment, see Figure 3 and Fig. 20 , Fig. 20 Display as Figure 3The partial enlarged view of the A part in the middle, as shown in the figure, the moving mechanism 283 that moves in at least one direction is an X-direction moving mechanism, and the X-direction moving mechanism includes an X-direction guide rail 2830, an X-direction slider 2831 and an X-direction driving source 2832, wherein the X-direction guide rail 2830 is laid on the support plate 282, the X-direction slider 2831 is adapted to the X-direction guide rail 2830 and a mounting seat 2833 is arranged on the X-direction slider 2831, and two side skin clamping mechanisms 284 are respectively located on the left and right sides of the mounting seat 2833, and the X-direction driving source 2832 can be, for example, an X-direction telescopic cylinder assembly or an X-direction motor. In order to enable the side skin clamping mechanism 284 to move smoothly in the X-direction, a double guide rail design is adopted in this embodiment, that is, two X-direction guide rails 2830 are adopted, and the two X-direction guide rails 2830 are arranged in parallel along the X-direction. Thus, the mounting seat 2833 on the X-direction slider 2831 is driven by the X-direction driving source 2832 to carry the two edge skin clamping mechanisms 284 thereon to move in the X-direction along the X-direction guide rail 2830. In practical applications, the moving direction of the moving mechanism 283 is not limited thereto, and in other embodiments, the moving mechanism may also include a Y-direction moving mechanism and a Z-direction moving mechanism.

[0149] See also Fig.21 , Fig.21 Shown is a schematic diagram of the external structure of the edge skin clamping mechanism in one embodiment of the multi-station square opening device of the present application. As shown in the figure, the edge skin clamping mechanism 284 includes a lifting drive structure 2841 and a clamping assembly arranged at the bottom of the lifting drive structure. In an embodiment, the lifting drive structure 2841 is used to drive the clamping assembly to perform lifting motion. The lifting drive structure 2841 can be, for example, a lifting cylinder with a lifting rod, and the lifting rod is connected to the clamping assembly. The lifting cylinder can control the extension and retraction of the lifting rod to drive the clamping assembly to perform lifting motion, but it is not limited to this. For example, the lifting drive structure can also be a screw rod assembly driven by a motor, and the screw rod assembly is connected to the clamping assembly, and the motor is used to drive the screw rod assembly to lift and lower to drive the clamping assembly to perform lifting motion.

[0150] See also Fig. 22 , Fig. 22 The cross-sectional structure diagram of the clamping assembly in one embodiment of the multi-station square cutting device of the present application is shown. As shown in the figure, the clamping assembly includes a cover body 2842 and a retractable clamping member. The retractable clamping member is arranged inside the cover body 2842, and a clamping space 2843 for clamping the edge skin is formed between the clamping member and the cover body 2842. In the embodiment, the cover body 2842 is used to cover the edge skin, and the cover size of the cover body 2842 is slightly larger than the cross-sectional circle of the silicon rod to be cut. The cover body 2842 is set to be a closed or non-closed circular cover, but it is not limited to this.

[0151] The structure of the clamping assembly is not limited thereto. In other embodiments, the clamping assembly includes an arc-shaped plate and a retractable clamping member, and a clamping space for clamping the edge skin is formed between the clamping member and the arc-shaped plate.

[0152] like Fig. 22 As shown, the clamping member is a movable pressure block 2844 controlled by a cylinder 2845, and the movable pressure block 2844 is connected to the cylinder 2845 through a flip arm 2846. In the embodiment, the flip arm 2846 has a mounting portion and a first connection portion and a second connection portion respectively located on opposite sides of the mounting portion, wherein the first connection portion is connected to the piston rod 2848 of the cylinder 2845, and the second connection portion is connected to the movable pressure block 2844.

[0153] In one embodiment, a base 2847 for carrying the clamping member is disposed inside the cover body 2842, and the base 2847 carries the clamping member to probe into the recessed area between the cut silicon rod and the edge skin. The cylinder 2845 is fixed on the side wall of the base 2847 and has a piston rod 2848. The mounting portion of the flip arm 2846 is hinged to a support seat 2849 fixed to the bottom of the base 2847 so that the flip arm 2846 can rotate up and down with the mounting portion as the axis. The movable pressing block 2844 is connected to the second connection of the flip arm 2846. The first connection part of the flip arm 2846 is hinged with the piston rod 2848 of the cylinder, and the cylinder 2845 pushes the piston rod 2848 to extend and retract to drive the first connection part of the flip arm 2846 to descend or ascend with the support seat 2849 as the center point, so that the second connection part of the flip arm 2846 is ascended or descended with the support seat 2849 as the center point, so that the movable pressure block 2844 connected to the second connection part of the flip arm is moved away from or close to the cover body 2842, and the clamping space 2843 between it and the cover body 2842 is adjusted. Specifically, see Fig. 22 In the initial state, the second connection part of the flip arm 2846 is higher than the first connection part thereof, and the movable pressing block 2844 is away from the cover body 2842. When the edge skin needs to be clamped, the cylinder 2845 drives the piston rod 2848 to retract, thereby lifting the first connection part of the flip arm 2846 to rise with the support seat 2849 as the center point, and the second connection part of the flip arm 2846 descends with the support seat 2849 as the center point, driving the movable pressing block 2844 to approach the cover body 2842 (such as Fig. 22), the clamping space 2843 between the movable pressing block 2844 and the cover body 2842 is reduced to clamp the edge skin. When the edge skin needs to be released, the cylinder 2845 drives the piston rod 2848 to extend, thereby driving the first connection part of the flip arm 2846 to descend with the support seat 2849 as the center point, and the second connection part of the flip arm 2846 rises with the support seat 2849 as the center point to drive the movable pressing block 2844 away from the cover body 2842, that is, to return to the initial state, thereby increasing the clamping space 2843 between the movable pressing block 2844 and the cover body 2842 to facilitate the release of the edge skin. In order to prevent the movable pressing block 2844 from contacting the edge skin during long-term clamping, causing wear and damage to each other, in one embodiment, the movable pressing block 2844 is provided with a buffer pad for contacting the edge skin.

[0154] It should be noted that, as mentioned above, the wire cutting unit 24 includes a plurality of cutting wheel groups 251. In some embodiments, each cutting wheel group 251 includes a pair of cutting wheels. Four single-axis surface cutting steps are required to cut the silicon rod to be cut using the pair of cutting wheels. In this embodiment, the number of the clamping members is set to one. The first single-axis surface cutting is performed to form an edge skin, which is clamped by a clamping member and then transferred out through the lifting drive structure 2841 and the X-direction moving mechanism. The cutting surface of the silicon rod to be cut is adjusted (for example, rotated 90 degrees), and the second single-axis surface cutting is performed to form an edge skin again. The edge skin is clamped by a clamping member again and then transferred out through the lifting drive structure 2841 and the X-direction moving mechanism. The edge skins formed by the third and fourth single-axis surface cutting are transferred out in this way, which will not be described in detail here. In other embodiments, each cutting wheel group 251 includes two pairs of cutting wheels. The two pairs of cutting wheels are used to cut the silicon rod to be cut. It is necessary to perform two parallel axial cutting operations twice. In this embodiment, the clamping members are arranged to be two oppositely arranged. Perform the first cutting of the two parallel axial planes to form two side skins, use the two clamping members to clamp the two side skins formed at the corresponding positions and transfer the two side skins through the lifting drive structure 2841 and the X-direction moving mechanism, then adjust the cutting surface of the silicon rod to be cut (for example, rotate 90 degrees), perform the second cutting of the two parallel axial planes to form two side skins again, use the two clamping members to clamp the two side skins formed at the corresponding positions and transfer the two side skins through the lifting drive structure 2841 and the X-direction moving mechanism.

[0155] In one embodiment, the edge skin unloading device includes an edge skin conveying structure, which is arranged in the edge skin unloading area and is used to convey the edge skins that have been transported by the clamping and transferring unit. In one implementation, the edge skin conveying structure may be, for example, a conveyor belt. It is easy to understand that the edge skin unloading area is the area where the edge skins are unloaded in the multi-station squaring device. Specifically, the edge skin unloading area is the area corresponding to the bottom of the clamping and transferring unit after the edge skins are transported away from the cutting area. In actual operation, the clamping and transferring unit transfers the edge skins from the cutting area to the edge skin unloading area, and the clamping assembly in the clamping and transferring unit is loosened to release the edge skins onto the conveyor belt serving as the edge skin conveying structure, and the conveyor belt conveys the edge skins out.

[0156] In another embodiment, the edge skin unloading device includes an edge skin barrel, and the edge skin barrel is arranged in the edge skin unloading area. The barrel mouth of the edge skin barrel can be designed to be larger or trumpet-shaped, so that the edge skin can be placed in without obstacles, and the barrel arm of the edge skin barrel is also higher, which can ensure that the placed edge skin will not overturn. In this way, the clamping and transporting unit moves the edge skin from the cutting area to the edge skin barrel, and then the operator can take the edge skin out of the edge skin barrel.

[0157] Of course, the unloading of the edge skin formed after the silicon rod to be cut is not limited to this. For example, in other embodiments, the edge skin unloading device may include an edge skin barrel and an edge skin conveying structure at the same time, wherein the edge skin conveying structure may be, for example, a conveyor belt, and the edge skin barrel is adjacent to the starting end of the conveyor belt (for example, the edge skin barrel is located beside the starting end of the conveyor belt or directly above the starting end of the conveyor belt, etc.). The barrel mouth of the edge skin barrel may be designed to be larger or flared, so that the edge skin can be placed without obstacles, and the barrel arm of the edge skin barrel is also higher, which can ensure that the placed edge skin will not overturn. In actual applications, the edge skin barrel can be designed to be flippable, and by flipping the edge skin barrel, each edge skin in the edge skin barrel can be smoothly transferred to the conveyor belt. For example, a flipping drive mechanism is provided at the bottom of the edge skin barrel, and the flipping drive mechanism may include a flipping plate, a rotating shaft and a flipping drive source (for example, a flipping motor or a flipping cylinder, etc.). In this way, after the edge skin is transferred from the cutting area to the edge skin tube by the clamping and transferring unit, the edge skin tube is turned over to drive the edge skin in the tube to be transferred to the conveyor belt, and the conveyor belt transports the edge skin out.

[0158] The multi-station squaring equipment of the present application can simultaneously complete the squaring of multiple silicon rods, and make the cross-section of the silicon rods rectangular after squaring. The squared silicon rods are rectangular as a whole and have four side skins, which can improve the efficiency of the silicon rod squaring cutting operation, increase the cross-sectional area of ​​the squared silicon rods, and reduce the overall cost and risk of silicon rod squaring.

[0159] The present application further provides a multi-station cutting method, which is applied to the aforementioned multi-station squaring equipment, and the multi-station cutting method applied to the multi-station squaring equipment includes the following steps: placing a single crystal silicon rod vertically on a silicon rod supporting platform; driving a wire cutting device to descend, and using one or two cutting line segments in the wire cutting device to simultaneously perform side cutting in a first direction along the length direction of the single crystal silicon rod carried by the at least two silicon rod supporting platforms; driving the wire cutting device to ascend, and using a rotating mechanism to drive the silicon rod supporting platform to allow the single crystal silicon rod to convert the surface to be cut; driving the wire cutting device to descend, and using one or two cutting line segments to simultaneously perform side cutting in a second direction along the length direction of the single crystal silicon rod carried by the at least two silicon rod supporting platforms.

[0160] The following is an explanation of the cutting process in the embodiment of the multi-station square cutting device. In this embodiment, it is taken as an example that each cutting wheel group has two pairs of cutting wheels, that is, each cutting wheel group in the wire cutting device has two pairs of cutting wheels. Fig.23 , which is a flow chart of a multi-station cutting method in one embodiment of the present application. As shown in the figure, the multi-station cutting method includes the following steps:

[0161] In step S10, a single crystal silicon rod is placed vertically on a silicon rod supporting platform.

[0162] In this step, the single crystal silicon rod is transferred by the silicon rod loading and unloading device and placed on the silicon rod supporting platform. Specifically, the first clamp in the silicon rod loading and unloading device clamps the single crystal silicon rod to be cut located in the storage area, and then drives the reversing carrier to perform reversing movement so that the first clamp transfers the clamped single crystal silicon rod to be cut to the loading and unloading area, and then releases the first clamp so that the clamped single crystal silicon rod is placed on the silicon rod supporting platform in the loading and unloading area, and the workbench conversion mechanism of the silicon rod workbench transfers the single crystal silicon rod to be cut located on the silicon rod supporting platform in the loading and unloading area to the cutting area. For the silicon rod loading and unloading device, please refer to the description of Figures 5 to 7 For instructions on the silicon rod workbench, please refer to Figure 3 , Figure 4a and Figure 4b Description.

[0163] In one embodiment, the single crystal silicon rod can be placed upright on a workstation in the storage area by manual handling or mechanical grasping by a robot, and the first clamp adjusts the height of the rod in the upright state by driving the reversing carrier to rotate, and drives the corresponding first clamping members in the first clamp to move up and down on the reversing carrier to adjust the clamping distance formed by each first clamping member. Then, the first clamping arms in each first clamping member involved in clamping in the first clamp are driven to perform a clamping action, so that these first clamping members can clamp the single crystal silicon rod on the workstation in the storage area. For the silicon rod loading and unloading device, please refer to the Figures 5 to 7 Description.

[0164] In one embodiment, before driving the reversing carrier to perform reversing motion, preferably, the single crystal silicon rod clamped by the first clamp needs to be detached from the workstation in the storage area, and the detachment can be achieved by any one of the following methods or a combination thereof: First, while ensuring that the first clamp clamps the first-shaped workpiece, the first clamp is used to move upward along the reversing carrier to lift the single crystal silicon rod; second, the reversing carrier is driven to move upward relative to the mounting base to lift the single crystal silicon rod. Next, the reversing carrier is driven to rotate relative to the mounting base, so that the first carrier on the reversing carrier corresponds to the silicon rod carrier platform in the loading and unloading area through the reversing motion. For the silicon rod loading and unloading device, please refer to the Figures 5 to 7 Description.

[0165] In one embodiment, when the first clamp is released, the single crystal silicon rod needs to be placed on the silicon rod support platform in the loading and unloading area. The placement can be achieved by any of the following methods or a combination thereof: 1. While ensuring that the first clamp holds the single crystal silicon rod, the first clamp is used to move downward along the reversing carrier to drop the single crystal silicon rod; 2. The reversing carrier is driven to move downward relative to the installation base to drop the single crystal silicon rod. The silicon rod loading and unloading device is described in detail in the following. Figures 5 to 7 Description.

[0166] In step S11, the wire cutting device is driven to descend, and two cutting wire segments in the wire cutting device simultaneously cut the single crystal silicon rods carried by the at least two silicon rod carrying platforms on the side in a first direction along the length direction thereof.

[0167] In one embodiment, before the wire cutting device cuts the single crystal silicon rod in the first direction along the length direction, the silicon rod clamping device presses the single crystal silicon rod onto the silicon rod supporting platform. Specifically, the first driving mechanism drives the mounting frame in the cutting frame to carry the wire cutting unit and descend along the lifting guide rail, while the silicon rod clamping device is also attached to the mounting frame and descends. When the silicon rod clamping device is attached to the mounting frame and descends to a predetermined position, that is, a predetermined position at the top of the single crystal silicon rod carried by the silicon rod supporting platform in the cutting area, the cylinder in the pneumatic guide rail locking device drives the locking clamp to hold the lifting guide rail to position the silicon rod clamping device. Then the clamping unit of the silicon rod clamping device is driven to be pressed against the top of the corresponding single crystal silicon rod. The wire cutting unit continues to descend with the mounting frame, and the two cutting wire segments in each cutting wheel group cut the corresponding compressed single crystal silicon rod in the first direction along the length direction of the single crystal silicon rod to form two parallel axial sections. For the wire cutting device, please refer to the description for Figure 3 as well as Figures 10 to 12 For the silicon rod pressing device, please refer to Fig.17 Description.

[0168] In step S12, the wire cutting device is driven to rise, and the silicon rod supporting platform is driven by a rotating mechanism to change the surface to be cut of the single crystal silicon rod.

[0169] Since the wire cutting unit forms two parallel axial sections when cutting the single crystal silicon rod along its length direction, two edge skins will be generated at the same time, which hinders the rise of the cutting wire segment in the wire cutting device.

[0170] In one embodiment, before the driving wire cutting device is raised, the two edge skins formed by the cutting are removed from the silicon rod supporting platform by means of an edge skin unloading device. Specifically, the edge skin lifting mechanism in the edge skin unloading device first lifts the edge skin so that the top of the edge skin protrudes from the cut silicon rod. In one implementation, the edge skin lifting mechanism adopts a lifting member provided on the mounting frame. The lifting member is driven by a telescopic component to perform telescopic movement. After the lifting member is controlled to perform an extension movement, it supports the bottom of the edge skin to lift the edge skin so that the top of the edge skin protrudes from the cut silicon rod. Then, the clamping and transporting unit in the edge skin unloading device clamps the top of the edge skin, pulls the edge skin away from the cut silicon rod, and transports the edge skin to the edge skin unloading area. Please refer to the Figures 19 to 22 Description.

[0171] In one embodiment, after the edge skin is unloaded, the wire cutting device is driven to rise, and the first driving mechanism drives the mounting frame in the cutting frame to carry the wire cutting unit and rise along the lifting guide rail until it is in contact with the silicon rod clamping device, and then the rotating mechanism at the bottom of the silicon rod carrier cooperates with the rotating shaft in the clamping unit to drive the silicon rod carrier to rotate 90° clockwise or counterclockwise to adjust the surface to be cut of the single crystal silicon rod after the single cut. Figure 2 , Figure 3 and Fig.17 Description.

[0172] In step S13, the wire cutting device is driven to descend, and the two cutting wire segments simultaneously cut the single crystal silicon rods carried by the at least two silicon rod carrying platforms on the side surfaces in the second direction along the length direction thereof.

[0173] In one embodiment, after the online cutting device cuts the side surface of the single crystal silicon rod that has been cut in the first direction along its length direction in the second direction, two edge skins will be formed. The two edge skins formed by the cutting in the second direction need to be removed from the silicon rod supporting platform by an edge skin unloading device. Specifically, the edge skin lifting mechanism in the edge skin unloading device first lifts the edge skin so that the top end of the edge skin protrudes from the cut silicon rod. In one implementation, the edge skin lifting mechanism uses a lifting member provided on the mounting frame. The lifting member is driven by a telescopic component to perform telescopic movement. After the lifting member is controlled to perform an extension movement, it supports the bottom of the edge skin to lift the edge skin so that the top end of the edge skin protrudes from the cut silicon rod. Then, the clamping and transporting unit in the edge skin unloading device clamps the top end of the edge skin, pulls the edge skin away from the cut silicon rod, and transports the edge skin to the edge skin unloading area. Please refer to the side skin unloading area for details. Figures 19 to 22 Description.

[0174] In one embodiment, after the edge skin formed by the side cutting in the second direction is removed, the single crystal silicon rod has completed its squaring operation and is in the shape of a rectangular parallelepiped as a whole. It is necessary to drive the wire cutting device and the silicon rod pressing device back to the initial position in preparation for the next squaring operation. Specifically, the first driving mechanism drives the mounting frame in the wire cutting device to carry the wire cutting unit and rise along the lifting guide rail until the mounting frame is in contact with the silicon rod pressing device. The pressing unit in the silicon rod pressing device is driven to release the pressure on the corresponding single crystal silicon rod that has completed the cutting operation. Then, the cylinder in the pneumatic guide rail locking device drives the locking clamp to relax the pressure on the lifting guide rail so that the silicon rod pressing device is attached to the mounting frame and continues to rise with the wire cutting device to return to the initial position. In one embodiment, after the cutting operation of the single crystal silicon rod is completed, the cut single crystal silicon rod needs to be transported away from the cutting area. Specifically, the workbench conversion mechanism of the silicon rod workbench first transfers the cut single crystal silicon rod on the silicon rod carrier in the cutting area to the loading and unloading area, and then the second clamp in the silicon rod loading and unloading device clamps the cut single crystal silicon rod in the loading and unloading area, and then drives the reversing carrier to perform reversing movement so that the second clamp transfers the clamped cut single crystal silicon rod to the storage area, and then releases the second clamp so that the clamped cut single crystal silicon rod is placed on the workstation in the storage area. The wire cutting device, please refer to the description for Figure 3 as well as Figures 10 to 12 For the silicon rod pressing device, please refer to Fig.17 Description.

[0175] In one embodiment, the second clamp is adjusted by driving the reversing carrier to rotate to realize the silicon rod support platform corresponding to the loading and unloading area. If necessary, according to the height of the cut single crystal silicon rod in the vertical placement state, the corresponding second clamping members in the second clamp are driven to move up and down on the reversing carrier to adjust the clamping spacing formed by each second clamping member. Then, the second clamping arms in each second clamping member involved in clamping in the second clamp are driven to perform a clamping action so that these second clamping members can clamp the cut single crystal silicon rod on the silicon rod support platform in the loading and unloading area. Please refer to Figures 5 to 7 Description.

[0176] In one embodiment, before driving the reversing carrier to perform reversing motion, it is preferred that the cut single crystal silicon rod clamped by the second clamp is separated from the silicon rod support platform in the loading and unloading area. The separation can be achieved by any of the following methods or a combination thereof: First, while ensuring that the second clamp clamps the cut single crystal silicon rod, the second clamp is used to move upward along the reversing carrier to lift the cut single crystal silicon rod; Second, the reversing carrier is driven to move upward relative to the mounting base to lift the cut single crystal silicon rod. Next, the reversing carrier is driven to rotate relative to the mounting base, so that the second carrier on the reversing carrier corresponds to the workstation in the storage area through the reversing motion. Please refer to Figures 5 to 7 Description.

[0177] In one embodiment, when the second clamp is released, the single crystal silicon rod needs to be placed on the silicon rod support platform in the loading and unloading area. The placement can be achieved by any of the following methods or a combination thereof: First, while ensuring that the second clamp holds the cut single crystal silicon rod, the second clamp is used to move downward along the reversing carrier to drop the cut single crystal silicon rod; Second, the reversing carrier is driven to move downward relative to the installation base to drop the cut single crystal silicon rod. Please refer to Figures 5 to 7 Description.

[0178] In general, in the above embodiment, since each cutting wheel group includes two pairs of cutting wheels, that is, one single crystal silicon rod to be cut is correspondingly configured with two cutting line segments, therefore, to complete the square operation of the four axial sections of the single crystal silicon rod to be cut, it is necessary to perform two cutting processes, namely, the cutting of the first direction side and the cutting of the second direction side. In contrast, if each cutting wheel group includes a pair of cutting wheels, that is, one single crystal silicon rod to be cut is correspondingly configured with one cutting line segment, then to complete the square operation of the four axial sections of the single crystal silicon rod to be cut, it is necessary to perform four single-axis section cutting processes, namely, two first direction side cuttings and two second direction side cuttings.

[0179] The above embodiments are merely illustrative of the principles and effects of the present application and are not intended to limit the present application. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed in the present application shall still be covered by the claims of the present application.

Claims

1. A multi-station squaring device for performing squaring operations on a single-crystalline silicon rod with a circular cross-section. Characterized in that, Comprising: At least two silicon rod bearing platforms for bearing the vertically placed single-crystalline silicon rods, each of the silicon rod bearing platforms having a rotating mechanism; the at least two silicon rod bearing platforms can be arranged on a silicon rod workbench, and a workbench conversion mechanism is provided on the silicon rod workbench for driving the silicon rod workbench to perform a conversion movement so that the silicon rod bearing platforms on the silicon rod workbench are converted between a loading and unloading area and a cutting area; And A wire cutting device is arranged above the at least two silicon rod bearing platforms, including a plurality of cutting wheels and a cutting wire wound around the plurality of cutting wheels to form a cutting line segment or two parallel cutting line segments; the cutting wheel includes a first wire groove and a second wire groove for winding the cutting wire, and the cutting wheel moves the cutting wire from the first wire groove to the second wire groove through an automatic groove-changing mechanism; The automatic groove-changing mechanism includes: a groove-changing cylinder, which is linked with the cutting wheel and is used to drive the cutting wheel to move axially to move the cutting wire from the first wire groove to the second wire groove, including a cylinder body, and a first guide rail and a second guide rail which are communicated with each other and are opened on the cylinder body, and the drop between the first guide rail and the second guide rail corresponds to the groove distance between the first wire groove and the second wire groove; a positioning member, which is slidably arranged in the first guide rail or the second guide rail and is used to slide in the first guide rail or the second guide rail to drive the groove-changing cylinder to rotate when the groove-changing cylinder moves axially, so as to force the cutting wire on the cutting wheel to be switched from the first wire groove to the second wire groove; Wherein, during the squaring operation, the wire cutting device is driven to descend, and the one cutting line segment or the two cutting line segments simultaneously cut the plurality of single-crystalline silicon rods borne by the plurality of silicon rod bearing platforms along the length direction of the first side surface; then, the rotating mechanism is used to drive the silicon rod bearing platform to convert the surface to be cut of the single-crystalline silicon rod, and the wire cutting device is driven to descend, and the one cutting line segment or the two cutting line segments simultaneously cut the plurality of single-crystalline silicon rods borne by the plurality of silicon rod bearing platforms along the length direction of the second side surface.

2. The multi-station squaring device according to claim 1, Characterized in that, During the squaring operation, the intersection point of the cutting wire when the wire cutting device cuts the first side surface of the single-crystalline silicon rod and the cutting wire when cutting the second side surface of the single-crystalline silicon rod is located within the cross-section of the single-crystalline silicon rod.

3. The multi-station squaring device according to claim 1, Characterized in that, The workbench conversion mechanism is a rotating mechanism, and the rotating mechanism includes: A rotating shaft, which is pivotally connected to the silicon rod workbench; and A rotation driving unit, whose power output shaft is pivotally connected to the rotating shaft and is used to drive the rotating shaft to rotate to drive the silicon rod workbench to rotate.

4. The multi-station squaring device according to claim 1, Characterized in that, The workbench conversion mechanism is a translation mechanism, and the translation mechanism includes: A translation guide rail, which is laid on a workpiece processing table; A slider, which is arranged at the bottom of the silicon rod workbench; and A translation drive unit for driving the silicon rod workbench to move along the translation guide rail.

5. The multi-station squaring device according to claim 1, characterized in that it further includes a silicon rod loading and unloading device adjacent to the silicon rod bearing table.

6. The multi-station squaring device according to claim 1, characterized in that a side skin supporting mechanism is provided around the silicon rod bearing table for supporting the side skin formed after cutting a single crystal silicon rod.

7. The multi-station squaring device according to claim 6, characterized in that the side skin supporting mechanism includes: a movable supporting member; and a locking control member for controlling the movable supporting member in a locked state when the movable supporting member abuts against the bottom of the single crystal silicon rod.

8. The multi-station squaring device according to claim 1, characterized in that it further includes a side skin discharging device for discharging the side skin formed after cutting by the wire cutting device.

9. The multi-station squaring device according to claim 8, characterized in that the side skin discharging device includes: a side skin lifting mechanism for lifting the side skin so that the top end of the side skin protrudes from the cut silicon rod.

10. The multi-station squaring device according to claim 9, characterized in that the side skin discharging device further includes: a clamping and transporting unit provided above the at least two silicon rod bearing tables for clamping the top end of the side skin and pulling up the side skin to separate it from the cut crystalline silicon rod and transporting the side skin to the side skin discharging area.

11. The multi-station squaring device according to claim 10, characterized in that the clamping and transporting unit includes: a clamping moving mechanism providing movement in at least one direction; and a liftable side skin clamping mechanism connected to the moving mechanism and driven to move in at least one direction.

12. The multi-station squaring device according to claim 11, characterized in that the side skin clamping mechanism includes: a lifting drive structure; and a clamping assembly provided at the bottom of the lifting drive structure for clamping or releasing the top end of the side skin.

13. The multi-station squaring device according to claim 12, characterized in that the clamping assembly includes: a cover body for covering the side skin; and a retractable clamping member provided inside the cover body; a clamping space for clamping the side skin is formed between the retractable clamping member and the main body of the cover body.

14. The multi-station squaring device according to claim 12, characterized in that the clamping assembly includes: an arc-shaped plate; and a retractable clamping member, a clamping space for clamping the side skin is formed between the retractable clamping member and the arc-shaped plate.

15. The multi-station squaring device according to claim 1, characterized in that in the wire cutting device, it includes at least two cutting wheel sets corresponding to the number of silicon rod bearing tables, each cutting wheel set includes a pair of cutting wheels or two pairs of cutting wheels, a cutting line segment is formed between the two cutting wheels in any pair of cutting wheels; a transition wheel is provided between adjacent two cutting wheel sets, and the wire groove of the transition wheel is in the same plane as the wire grooves of the cutting wheels in the cutting wheel set.

16. The multi-station squaring device according to claim 1, It is characterized in that it further includes a silicon rod pressing device, and the silicon rod pressing device and the wire cutting device share the same guide rail.

17. The multi-station squaring device according to claim 16, it is characterized in that the silicon rod pressing device is provided with a guide rail locking unit.

18. A multi-station cutting method applied to a multi-station squaring device, it is characterized in that it is applied to the multi-station squaring device according to any one of claims 1 to 17, and the multi-station cutting method includes the following steps: Vertically place a single crystal silicon rod on the silicon rod bearing table; Drive the wire cutting device to descend, and use one cutting line segment or two cutting line segments in the wire cutting device to simultaneously cut the single crystal silicon rod carried by the at least two silicon rod bearing tables along the length direction of the first direction side; Drive the wire cutting device to rise, and use the rotating mechanism to drive the silicon rod bearing table to convert the surface to be cut of the single crystal silicon rod; Drive the wire cutting device to descend, and use the one cutting line segment or two cutting line segments to simultaneously cut the single crystal silicon rod carried by the at least two silicon rod bearing tables along the length direction of the second direction side.

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