Electronic device and method of manufacturing the same

Abstract

An electronic device (100) and a method for manufacturing the electronic device are provided. The electronic device comprises an array of electronic components (110) arranged along a first axis A, and comprises a carrier (120) arranged to support the array of electronic components, wherein the carrier comprises a first metal layer (130), a second metal layer (140) and an at least partially insulating layer (150) arranged between the first and second metal layers. The electronic device also comprises a partitioning portion (160) arranged between two adjacently arranged electronic components for partitioning the electronic device, wherein the second metal layer comprises a gap (180) intersecting the second axis, wherein the gap has a width (190) extending parallel to the first axis, so that at the second axis, the second metal layer is undercut relative to the first metal layer in a direction parallel to the first axis.

Description

Technical Field

[0001] The present invention relates generally to the field of electronic devices, such as printed circuit boards, and to methods of manufacturing such electronic devices. Background Art

[0002] The use of light emitting diodes (LEDs) for lighting purposes continues to gain attention. LEDs offer many advantages over incandescent bulbs, such as longer operating life and increased efficiency related to the ratio between light energy and heat energy. Since the color and output power of LEDs can be adjusted, LED lamps can be used for general lighting or even for more specific lighting.

[0003] Many prior art light emitting devices including LEDs also include a printed circuit board (PCB) on which the LEDs are arranged. The PCB may include an electrical insulating layer (e.g., a dielectric layer or a glass fiber-filled epoxy layer), and may include a metal layer provided below the insulating layer, the metal layer being arranged to conduct heat. It should be noted that a light emitting device including a plurality of electronic components (e.g., LEDs) may cause the temperature of the light emitting device to rise rapidly, and the effects of heat may be harmful to the electronic components.

[0004] Flexible PCBs (also referred to as FPCs), and in particular metal layer FPCs, have recently become popular in the lighting industry. The benefits of metal layer FPCs are numerous. First, it will be appreciated that metal layer FPCs are able to provide relatively high thermal performance, which can be more efficient than standard FPCs and can be comparable to the thermal performance of metal core PCBs (MCPCBs). Therefore, metal layer FPCs can thereby contribute to the thermal management of lighting devices. Secondly, metal layer FPCs are associated with relatively low material costs, for example, compared to MCPCBs. Thirdly, due to their flexibility, metal layer FPCs can be deformed so that they can be shaped in three dimensions (3D).

[0005] Due to the increasing demand from the lighting industry for size differentiation of devices including electronic components and PCBs, there is a need to further explore the configuration of such devices. This may be particularly interesting in the case of providing and / or adjusting arrays of such devices.

[0006] However, MCPCBs arranged in an array according to the prior art are generally not easily separable. Furthermore, the separated MCPCBs may suffer from problems related to creepage, i.e., current leakage between conductive layers in the PCB. In other words, after separating or cutting the MCPCB, there may be (too) small creepage distances between conductive layers in the PCB.

[0007] Therefore, an interesting alternative would be to be able to provide a PCB structure which is easily separable and which can furthermore overcome or at least mitigate the problem of too small creepage distances. Summary of the invention

[0008] It is an object of the present invention to alleviate the above mentioned problems and to provide a convenient, efficient and / or cost effective lighting device and method of manufacturing the lighting device.

[0009] This and other objects are achieved by providing a lighting device and a method of manufacturing a lighting device having the features of the independent claims. Preferred embodiments are defined in the dependent claims.

[0010] Therefore, according to a first aspect of the present invention, an electronic device is provided. The electronic device comprises an array of electronic components and the layer stack, the array of electronic components being arranged on the layers of the layer stack and arranged along a first axis, the layer stack being formed as a carrier, and the carrier being arranged to support the array of electronic components. In a direction perpendicular to the first axis and perpendicular to the layer stack, the carrier comprises a first metal layer and a second metal layer, wherein an at least partially insulating layer is arranged between the first and second metal layers. The electronic device also comprises at least one segmentation portion arranged between two adjacently arranged electronic components, for segmenting the electronic device along a second axis of at least one segmentation portion, wherein the second axis extends perpendicular to the first axis. The second metal layer comprises a gap intersecting the second axis at at least one segmentation portion. Wherein at least one gap has a width extending parallel to the first axis, so that at the second axis, the second metal layer is undercut relative to the first metal layer in a direction parallel to the first axis.

[0011] According to a second aspect of the present invention, a method for manufacturing an electronic device is provided. The method includes the step of providing a layer stack as a carrier, the step including: arranging a first metal layer on an at least partially insulating layer, wherein the first metal layer and the at least partially insulating layer extend along a first axis. The method includes the step of providing a second metal layer, the second metal layer extends along the first axis and forms at least one void in the second metal layer, the at least one void having a width extending parallel to the first axis. The method also includes the steps of arranging a plurality of electronic components in an array on the carrier along the first axis. The method includes the steps of forming at least one segmentation portion between two adjacently arranged electronic components so as to segment the electronic device along a second axis B of at least one segmentation portion, which is perpendicular to the first axis, by means of the following arrangement: arranging the second metal layer below the at least partially insulating layer so that at least one void intersects the second axis, and so that at the second axis, the second metal layer is undercut relative to the first metal layer in a direction parallel to the first axis.

[0012] Therefore, the present invention is based on the following concept: an electronic device is provided, which has one or more segmented parts arranged between two adjacently arranged electronic components of the electronic device, wherein the second metal layer comprises at least one gap at the segmented part(s). Due to the gap(s) of the second metal layer, the second metal layer is undercut relative to the first metal layer. Therefore, the segmentation or cutting of the electronic device at the gap(s) between the two adjacently arranged electronic components results in a sufficiently large creepage distance between the first metal layer and the second metal layer to minimize the leakage current between the first metal layer and the second metal layer.

[0013] The advantage of the present invention is that the segmentation (cutting, separation) of the electronic device at the gaps (multiple) of the segmented parts conveniently provides a sufficiently large creepage distance between the first metal layer and the second metal layer. Therefore, the electronic device can overcome the problem that the creepage distance between the conductive first metal layer and the second metal layer is too small after the electronic device is segmented.

[0014] The present invention is also advantageous in that the provision of (multiple) voids in the second metal layer of the electronic device can result in an easy segmentation (cutting) operation of the second metal layer. In other words, the (multiple) voids (i.e., the absence of material) in the second metal layer ensures a more convenient and / or faster segmentation or separation of the electronic device at its (multiple) segmented portions.

[0015] The invention also has the advantage that the innovative configuration of the electronic device results in improved cost and / or time efficiency when manufacturing and / or segmenting (cutting) the electronic device. More specifically, due to the provision of (multiple) gaps in the second material layer of the electronic device, less material is used in the electronic device compared to devices in the prior art. Therefore, the electronic device becomes relatively cost-effective. In addition, since the provision of (multiple) gaps results in an electronic device that is easier and more convenient to segment, the wear of (multiple) tools used to segment (cut) the electronic device can be minimized.

[0016] The electronic device comprises an array of electronic components arranged along a first axis, and comprises a carrier arranged to support the array of electronic components. The term "carrier" here means a substrate, a printed circuit board, etc. In a direction perpendicular to the first axis, the carrier comprises a first metal layer and a second metal layer, wherein an at least partially insulating layer is arranged between the first metal layer and the second metal layer. Thus, the first metal layer, the at least partially insulating layer and the second metal layer are arranged on top of each other in a sandwich construction of the electronic device.

[0017] The electronic device further includes one or more dividing parts arranged between two adjacently arranged electronic components. The term "dividing part" herein means a part of the electronic device at which the electronic device is configured to be divided or cut.

[0018] At the at least one segmented portion, the second metal layer includes at least one void that intersects the second axis. The term "void" herein means a cut, hole, opening, etc., of the second metal layer. The at least one void has a width extending parallel to the first axis, so that at the second axis, the second metal layer is undercut relative to the first metal layer in a direction parallel to the first axis. Thus, relative to the second axis, the first metal layer protrudes above the second metal layer.

[0019] It will be appreciated that the electronic device of the present invention may include or constitute a flexible PCB (also indicated as FPC), in particular a metal layer FPC.

[0020] According to one embodiment of the present invention, the width of at least one gap may depend on the distance between adjacently arranged electronic components, in particular, the width of at least one gap is in the range of 0.5-1.1 times the distance (L) between adjacently arranged electronic components, for example in the range of 0.7-1.1 times or in the range of 0.9-1.1 times the distance (L). In other words, the width of the (multiple) gaps at the (multiple) segmented portions may depend on the distance between (two) adjacently arranged electronic components on either side of the (multiple) segmented portions. The advantage of this embodiment is that the position of the cut can be relatively accurately indicated by the gap, and unintentional cutting into the electronic component on either side of the gap is offset.

[0021] According to one embodiment of the present invention, the width of at least one gap may depend on the thickness of the at least partially insulating layer. Therefore, the width of one or more gaps parallel to the first axis may be provided according to the thickness of the at least partially insulating layer. In particular, the width of at least one gap is negatively correlated with the thickness of the at least partially insulating layer, that is, a higher value of the width is associated with a lower value of the thickness. An advantage of this embodiment is that the electronic device can be conveniently adapted to provide a desired creepage distance after segmenting the electronic device. For example, in the case where the at least partially insulating layer is relatively thin, the width of one or more gaps may be relatively large in order to produce a sufficiently large creepage distance. On the contrary, in the case where the at least partially insulating layer is relatively thick and thereby significantly contributes to the creepage distance of the electronic device, the width of one or more gaps may be relatively small.

[0022] According to one embodiment of the present invention, the sum of the thickness of the at least partially insulating layer and half of the width of the gap is 0.1mm-3mm, preferably 0.5mm-1.2mm, and most preferably 0.5mm-0.7mm. It will be understood that in the case where the electronic device is divided (cut) at its (multiple) divided parts, the creepage distance D of the electronic device between the first metal layer and the second metal layer can be defined as the sum of the thickness T of the at least partially insulating layer and half of the width W of the gap, that is, D=T+W / 2. The advantage of this embodiment is that in the case where the sum of the thickness of the at least partially insulating layer and half of the width of the gap is 0.1mm-3mm, the creepage distance can be sufficient to meet at least most of the isolation and non-isolated driver systems of the electronic device in the LED system. In addition, in the case where the sum of the thickness of the at least partially insulating layer and half of the width of the gap is 0.5mm-1.2mm (such as, 0.5mm-0.7mm), the creepage distance can meet the specific requirements of the isolated driver system.

[0023] According to an embodiment of the present invention, at least one gap may have a rectangular shape. This embodiment has the advantage that the creepage distance of the electronic device after its segmentation (cutting) can be conveniently defined.

[0024] According to one embodiment of the present invention, the second metal layer may include aluminum Al. The advantage of this embodiment is that the electronic device including aluminum is associated with a relatively low cost, has a relatively high thermal performance, and enables a 3D shape of the electronic device. In addition, the electronic device including aluminum is relatively easy to cut. In contrast, it should be noted that the MCPCB of the prior art is often difficult to cut because the metal used is usually relatively thick.

[0025] According to one embodiment of the present invention, the thickness of the second metal layer is 0.1 mm-1.6 mm, preferably 0.2 mm-0.5 mm, and most preferably 0.24 mm-0.36 mm. It will be appreciated that a second metal layer (e.g., Al) of an electronic device having a thickness in the range of 0.2 mm-0.5 mm may be conveniently cuttable, whereas thicker dimensions of the second metal layer may require auxiliary cutting processes and / or tools. In addition, and in particular, if Al is provided as the second metal layer, the thickness of the second metal layer may conveniently be about 0.3 mm.

[0026] According to one embodiment of the present invention, at least one of the at least partially insulating layer and the first metal layer may include a notch at at least one segmentation portion. Thus, a notch may be provided in one or more of the at least partially insulating layer and the first metal layer at the segmentation portion(s) of the electronic device. An advantage of this embodiment is that the notch(es) of the at least partially insulating layer and / or the notch(es) of the first metal layer may facilitate segmentation (cutting) at the segmentation portion(s).

[0027] According to one embodiment of the present invention, at least one of the electronic components may include at least one light emitting diode LED.

[0028] According to one embodiment of the present invention, an electronic board comprising a plurality of electronic devices according to any of the aforementioned embodiments may be provided. The electronic devices may be arranged side by side in a first plane such that segmented portions of adjacently arranged electronic devices are arranged along a second axis in the first plane for segmenting the electronic board along the second axis. In other words, the electronic board may extend in 2D in the first plane and be segmented (cut) into smaller portions or segments along the second axis. An advantage of this embodiment is that the manufacture of an electronic board intended for subsequent segmentation may be even more cost and / or time efficient compared to the manufacture and / or segmentation of the electronic devices described previously.

[0029] According to an embodiment of the method of the present invention, at least one of the voids may have a rectangular shape. The advantage of this embodiment is that a rectangular void (hole) can be conveniently cut into the second metal layer of the electronic device.

[0030] According to an embodiment of the method of the present invention, the second metal layer may include aluminum Al.

[0031] According to one embodiment of the method of the present invention, the thickness of the second metal layer can be 0.1mm-1.6mm, preferably 0.2mm-0.5mm, and most preferably 0.24mm-0.36mm. It will be understood that the method of the present invention can conveniently cut through the second metal layer of the proposed thickness, usually without the need for auxiliary tools and / or specific cutting methods.

[0032] According to one embodiment of the method of the present invention, the method may further include: forming at least one notch in the at least partially insulating layer and the first metal layer at at least one segmentation portion. By forming the above-mentioned (multiple) notches in the at least partially insulating layer and / or the first metal layer at the (multiple) segmentation portions of the electronic device, segmentation (cutting) at the (multiple) segmentation portions can be facilitated.

[0033] Further objectives, features and advantages of the present invention will become apparent when studying the following detailed disclosure, the drawings and the appended claims.Those skilled in the art will realize that different features of the present invention can be combined to create embodiments other than those described in the following. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] This and other aspects of the present invention will now be described in more detail, with reference to the appended drawings showing embodiment(s) of the invention.

[0035] Figure 1a-1b is a schematic cross-sectional view of a metal core PCB (MCPCB) according to the prior art;

[0036] Figure 2a-2b is a schematic cross-sectional view of an electronic device according to an exemplary embodiment of the present invention;

[0037] Figure 3 is a schematic cross-sectional view of an electronic device according to an exemplary embodiment of the present invention;

[0038] Figure 4a-4b are respectively a schematic top view and a bottom view of an electronic device according to an exemplary embodiment of the present invention;

[0039] Figure 5a-Figure 5b are schematic top and bottom views, respectively, of an electronic board according to an exemplary embodiment of the present invention; and

[0040] Figure 6 is a schematic diagram of a method of manufacturing an electronic device according to an exemplary embodiment of the present invention. DETAILED DESCRIPTION

[0041] Figure 1a 1 is a schematic cross-sectional view of a metal core PCB (MCPCB) 10 according to the prior art. The MCPCB 10 includes a plurality of electronic components 11, which are illustrated as a first LED element 11a and a second LED element 11b. The electronic components 11 are arranged along a first axis A extending horizontally. The MCPCB 10 also includes a first metal layer 13 and a second metal layer 14, and includes a layer 15 arranged between the first metal layer 13 and the second metal layer 14.

[0042] The MCPCB 10 may be cut along a second axis B extending perpendicular to the first axis A. The segmentation or cutting of the MCPCB 10 is schematically indicated by a pair of scissors 20, which ultimately separates the first LED element 11a from the second LED element 11b of the MCPCB 10. Figure 1b It is schematically shown in Figure 1a15 . However, the distance CD between the first metal layer 13 and the second metal layer 14 along the layer 15 (which may also be expressed as a creepage distance CD) may therefore be relatively small. More specifically, the creepage distance CD between the conductive first metal layer 13 and the second metal layer 14 may be about the thickness of the layer 15, such as, for example, about 0.1 mm. This is generally too small a creepage distance and may result in leakage current between the conductive first metal layer 13 and the second metal layer 14.

[0043] Figure 2a 1 is a schematic cross-sectional view of an electronic device 100 according to an exemplary embodiment of the present invention. The electronic device 100 includes an array of electronic components 110 arranged along a horizontally extending first axis A. The electronic components 110 illustrated as two electronic components 110a, 110b spaced apart along the first axis A may include, for example, one or more LEDs.

[0044] The electronic device 100 includes a carrier 120 arranged to support an array of electronic components 110. In a direction perpendicular to the first axis A, the carrier 120 includes a first metal layer 130 and a second metal layer 140. The first metal layer 130 may, for example, include copper (Cu) or be made of copper (Cu). The thickness of the first metal layer 130 may, for example, be 35 μm-70 μm. The second metal layer 140 may, for example, include aluminum (Al) or be made of aluminum (Al). The thickness of the second metal layer 140 may, for example, be 0.1 mm-1.6 mm, such as 0.2 mm-0.5 mm, such as 0.24 mm-0.36 mm, or about 0.3 mm. The carrier 120 also includes an at least partially insulating layer 150 arranged between the first metal layer 130 and the second metal layer 140. The thickness of the at least partially insulating layer 150 may, for example, be 75 μm-150 μm.

[0045] The electronic device 100 further includes at least one dividing portion 160. The dividing portion 160 is arranged between two adjacently arranged electronic components 110a, 110b for dividing (cutting) the electronic device 100 along a second axis B of the at least one dividing portion 160, wherein the second axis B extends perpendicularly to the first axis A. The intended dividing (cutting) along the second axis B is schematically indicated by the scissors 20.

[0046] At the segmentation portion 160 of the electronic device 100, the second metal layer 140 includes at least one void 180 intersecting the second axis B. The at least one void 180 has a width 190 extending parallel to the first axis A, and thus, at the second axis B, the second metal layer 140 is undercut relative to the first metal layer 130 in a direction parallel to the first axis A. This configuration of the electronic device 100 results in a relatively large creepage distance between the first metal layer 130 and the second metal layer 140 after the electronic device 100 is cut at the segmentation portion 160 and along the second axis B as indicated in FIG. 2 . The width 190 of the at least one void 180 may depend on the distance L between the adjacently arranged electronic components 110a, 110b. For example, the width 190 of the at least one void 180 may be not less than L, or in the range of 0.9 times to 1.1 times the distance L between the (two) adjacently arranged electronic components 110a, 110b on both sides of the segmentation portion 160.

[0047] After the electronic device 100 is divided or cut at the dividing portion 160 and along the second axis B, Figure 2a The right (or left) part of Figure 2b150 . Accordingly, the L-shaped distance CD (which may also be expressed as a creepage distance CD) between the first metal layer 130 and the second metal layer 140 along at least the layer 15 may be large enough to minimize or completely avoid leakage current between the conductive first metal layer 130 and the second metal layer 140. More specifically, since the second metal layer 140 is undercut relative to the first metal layer 130 in a direction parallel to the first axis A and at the second axis B, the L-shaped creepage distance CD between the conductive first metal layer 130 and the second metal layer 140 may be approximately the sum of the thickness of the at least partially insulating layer 150 and half of the width of the at least one void 180. In combination therewith, the width of the at least one void 180 may depend on the thickness of the at least partially insulating layer 150. For example, in the case where the at least partially insulating layer 150 is relatively thin, the width of one or more voids 180 may be relatively large. Therefore, as a result, the second metal layer 140 may be undercut to a relatively large extent relative to the first metal layer 130 to produce a sufficiently large creepage distance CD. In contrast, in the case where the at least partially insulating layer 150 is relatively thick, the width of the one or more gaps 180 may be relatively small. In other words, the second metal layer 140 may be undercut to a relatively small extent relative to the first metal layer 130, because the at least partially insulating layer 150 may contribute to a large extent to the creepage distance CD of the electronic device 100 due to its thickness. The creepage distance CD may be 0.1 mm-3 mm, such as 0.5 mm-1.2 mm, such as 0.5 mm-0.7 mm. The thickness of the second metal layer may be 0.1 mm-1.6 mm, such as 0.2 mm-0.5 mm, such as 0.24 mm-0.36 mm. In particular, if Al is provided as the second metal layer, the thickness of the second metal layer of Al may be about 0.3 mm.

[0048] Figure 3 is a schematic cross-sectional view of an electronic device 100 according to an exemplary embodiment of the present invention. The electronic device 100 shown has Figure 2a The electronic device 100 has many features in common with the electronic device 100, and in order to increase the understanding of the segmentation operation of the electronic device 100, reference is made here to Figure 2a Instructions. Figure 3 , the at least partially insulating layer 150 and the first metal layer 130 include corresponding notches 310, 320 at the segmentation portion 160 to facilitate segmentation (cutting) of the electronic device 100 at the segmentation portion 160. It should be noted that, alternatively, the electronic device 100 may include only one notch at the segmentation portion 160, i.e., the notch 310 of the insulating layer 150 or the notch 320 of the first metal layer 130. It should be noted that the features of the notches 310, 320 (such as the shape, arrangement, etc. of the notches) may be different from the disclosed schematically indicated ones.

[0049] Figure 4a is a schematic top view of an electronic device 100 according to an exemplary embodiment of the present invention. In this embodiment, the electronic device 100 includes six sub-segments 100a-100f arranged in series along an axis A, wherein each of the six sub-segments 100a-100f includes six electronic components 110a-110f. It will be understood that the number of sub-segments and the number of electronic components of the electronic device 100 are arbitrary, and the depicted electronic device 100 is shown only as an example. The electronic device 100 can be divided (cut) at one or more of the dividing portions 160a-160e, and the dividing portions 160a-160e are arranged between two adjacently arranged electronic components of two adjacently arranged sub-segments of the electronic device 100. The division or cutting at the dividing portions 160a-160e along the axis B is schematically indicated by the scissors 20a-20e. It will be understood that the configuration of the electronic device 100 at the dividing portions 160a-160e is the same as that at Figure 2a-2b Therefore, the electronic device 100 can be divided or cut at one or more of the divided portions 160a-160e so that the second metal layer is undercut relative to the first metal layer, thereby resulting in a sufficiently large creepage distance between the first and second metal layers as described previously.

[0050] It should be noted that Figure 4a The electronic device 100 in the embodiment may include a connector (not shown) at the segmented portions 160a-160e. In this way, the electronic device 100 may be segmented or cut so that one or more of the resulting sub-segments 100a-100f may constitute an electronic device. For example, an electronic device 100 of a first length (e.g., about 0.61 m, substantially corresponding to 2 feet) may be segmented into two (sub) electronic devices of half the first length (i.e., about 0.30 m, substantially corresponding to 1 foot).

[0051] Figure 4b is based on Figure 4a A schematic bottom view of an electronic device 100 of an exemplary embodiment of the present invention is shown in . Here, the electronic device 100 shows corresponding gaps 180a-180e at corresponding segmented portions 160a-160e, where the electronic device 100 can be segmented or cut.

[0052] Figure 5a 4 is a schematic top view of an electronic board 400 according to an exemplary embodiment of the present invention. The electronic board 400 includes a plurality of electronic devices 100 according to any of the aforementioned embodiments. 1-6 . Electronic device 1001-6 The split parts 160 of the adjacently arranged electronic devices are arranged side by side in the first plane. 1-6 The electronic board 400 is arranged along the second axis B in the first plane to divide the electronic board 400 along the second axis B. Therefore, the electronic board 400 extends in two dimensions in the first plane and can be divided (cut) into smaller parts or segments along the second axis B. 1-6 The division or cutting at is schematically indicated by scissors 20 .

[0053] Figure 5b is based on Figure 5a Schematic bottom view of an exemplary embodiment of an electronic board 400 of the electronic board 400. Here, the electronic board 400 shows the corresponding segmented part 160 1-6 The corresponding gap 180 1-6 , in the corresponding segmented portion 160 1-6 At this point, the electronic board 400 can be divided or cut along the axis B.

[0054] Figure 6 is a schematic diagram of a method 500 for manufacturing an electronic device according to an exemplary embodiment of the present invention. The method 500 includes the step of arranging 510 a first metal layer on an at least partially insulating layer, wherein the first metal layer and the at least partially insulating layer extend along a first axis. As an example, the step of arranging 510 the first metal layer may include a stacking of a (dielectric) foil and a Cu foil. The method also includes the step of providing 520 a second metal layer extending along the first axis, and forming at least one void in the second metal layer, the at least one void having a width extending parallel to the first axis. As an example, the step of providing 520 the second metal layer may include stamping of an Al substrate. As a further example, the method may include laminating the (dielectric) foil and the Cu foil onto the Al substrate, patterning the Cu layer, adding a solder mask, and patterning the solder mask. The method also includes the step of arranging 530 a plurality of electronic components in an array on a carrier along the first axis. As an example, the step of arranging 530 a plurality of electronic components may include applying solder paste and arranging the electronic components on the carrier by a pick and place method. The method further comprises the step of forming 540 at least one segmentation portion between two adjacently arranged electronic components so as to segment the electronic device along a second axis B of the at least one segmentation portion perpendicular to the first axis by means of the following arrangement: arranging the second metal layer below the at least partially insulating layer so that at least one gap intersects the second axis and so that at the second axis, the second metal layer is undercut relative to the first metal layer in a direction parallel to the first axis. It should be noted that the steps of the above method 500 may be performed in the order described, or alternatively, may be performed in a different order.

[0055] Those skilled in the art will appreciate that the present invention is by no means limited to the preferred embodiments described above. On the contrary, many modifications and variations are possible within the scope of the appended claims. For example, the first metal layer, the second metal layer, the at least partially insulating layer, (multiple) segmented portions, (multiple) gaps, etc. may have dimensions and / or sizes different from those depicted and / or described. For example, one or more of the layers may be thicker or thinner than illustrated in the figures.

Claims

1. An electronic device (100), comprising: an array of electronic components (110) arranged on a layer of the layer stack (101) and arranged along a first axis A, and The layer stack is formed as a carrier (120) arranged to support the array of electronic components, wherein the carrier comprises a first metal layer (130) and a second metal layer (140) in a direction perpendicular to the first axis and perpendicular to the layer stack, wherein an at least partially insulating layer (150) is arranged between the first metal layer and the second metal layer, and at least one dividing portion (160) is arranged between two adjacently arranged electronic components so as to divide the electronic device along a second axis B of the at least one dividing portion, wherein the second axis extends perpendicularly to the first axis, wherein the second metal layer comprises at least one gap (180) intersecting the second axis at the at least one segment, wherein at the at least one segment, below the at least partially insulating layer, the second metal layer (140) is not present, and wherein, The at least one void has a width (190) extending parallel to the first axis such that at the second axis, the second metal layer is undercut relative to the first metal layer in a direction parallel to the first axis. 2 . The electronic device according to claim 1 , wherein a width of the at least one gap is in the range of 0.7 to 1.1 times a distance (L) between adjacently arranged electronic components. 3 . The electronic device according to claim 1 , wherein a width of the at least one void is inversely correlated to a thickness of the at least partially insulating layer. 4 . The electronic device according to claim 1 , wherein the sum of the thickness of the at least partially insulating layer and half the width of the at least one gap is 0.1 mm to 3 mm.

5. The electronic device according to any one of the preceding claims 1 to 2, wherein the at least one void has a rectangular shape. 6 . The electronic device according to claim 1 , wherein the second metal layer comprises aluminum (Al).

7. The electronic device according to any one of the preceding claims 1 to 2, wherein the thickness of the second metal layer is 0.1 mm-1.6 mm. 8 . The electronic device according to claim 1 , wherein at least one of the at least partially insulating layer and the first metal layer comprises a notch at the at least one segmented portion.

9. The electronic device according to any one of the preceding claims 1 to 2, wherein at least one of the electronic components comprises at least one light emitting diode (LED). 10 . The electronic device of claim 4 , wherein the sum of the thickness of the at least partially insulating layer and half of the width of the at least one gap is 0.5 mm to 1.2 mm. 11 . The electronic device of claim 4 , wherein the sum of the thickness of the at least partially insulating layer and half of the width of the at least one gap is 0.5 mm to 0.7 mm. 12 . The electronic device according to claim 7 , wherein the thickness of the second metal layer is 0.2 mm-0.5 mm. 13 . The electronic device according to claim 7 , wherein the thickness of the second metal layer is 0.24 mm-0.36 mm.

14. An electronic board (400), comprising: A plurality of electronic devices according to any one of the preceding claims 1 to 13, wherein the electronic devices are arranged side by side in a first plane so that divided portions of adjacently arranged electronic devices are arranged along the second axis in the first plane for dividing the electronic board along the second axis.

15. A method (500) for manufacturing an electronic device, comprising the following steps: The layer stack (101) is formed by the following operations: (510) arranging a first metal layer on the at least partially insulating layer, wherein the first metal layer and the at least partially insulating layer extend along a first axis, (520) providing a second metal layer, the second metal layer extending along the first axis, and forming at least one void in the second metal layer, and the at least one void having a width extending parallel to the first axis, (530) arranging a plurality of electronic components in an array on the first metal layer along the first axis, and (540) At least one dividing portion is formed between two adjacently arranged electronic components so as to divide the electronic device along a second axis B perpendicular to the first axis of the at least one dividing portion by means of the following arrangement: the second metal layer is arranged below the at least partially insulating layer so that the at least one gap intersects the second axis, and so that at the second axis, the second metal layer is undercut relative to the first metal layer in a direction parallel to the first axis, and so that at the at least one dividing portion, the second metal layer does not exist below the at least partially insulating layer. The method of claim 15 , wherein the at least one void has a rectangular shape. The method according to claim 15 , wherein the second metal layer comprises aluminum (Al).

18. The method according to any one of claims 15 to 16, wherein the thickness of the second metal layer is 0.1 mm to 1.6 mm.

19. The method according to any one of claims 15 to 16, further comprising: At least one notch is formed at the second axis in at least one of the at least partially insulating layer and the first metal layer at the at least one segmented portion.

20. The method according to claim 18, wherein the thickness of the second metal layer is 0.2 mm to 0.5 mm.

21. The method according to claim 18, wherein the thickness of the second metal layer is 0.24 mm to 0.36 mm.

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